Instrument surface quality detection system and method

Abstract

The invention discloses an instrument surface quality detection system and method, and relates to the technical field of instrument quality detection. The invention comprises: a profiler priori data acquisition module, a profiler detection parameter evaluation module, a profiler shooting parameter adjustment module, a profiler trajectory parameter determination module, an execution terminal and a database. The invention determines which surface areas of the profiler need to be detected based on the priori data of the profiler, performs targeted detection, ensures the detection accuracy of the profiler, reduces the error of the profiler during subsequent operation, shortens the detection time, and saves detection resources. The invention comprehensively screens the path of a shooting mechanism based on the length of the path, the convenience of light source switching and lens switching, avoids frequent switching of light sources and lenses when the shooting mechanism performs image detection, improves the efficiency of image detection, and simultaneously avoids light pollution and reduces the pollution of the lens by the environment, thereby ensuring the quality of the captured image.

Description

Technical Field

[0001] The present invention relates to the technical field of instrument quality detection, and in particular to an instrument surface quality detection system and method. Background Art

[0002] In modern industrial manufacturing, quality control is an important part of ensuring product reliability and consistency. The profilometer is a precision instrument used to measure the surface profile of an object. It is widely used in many fields such as mechanical processing, semiconductors, and optical components. The measurement results of the profilometer are directly related to the quality of the final product. For example, in the semiconductor industry, any tiny surface flaws may cause the chip performance to deteriorate or even be scrapped. Quality inspection of the profilometer surface can not only improve measurement accuracy, but also extend the service life of the equipment and reduce maintenance costs. Therefore, it is extremely necessary to perform quality inspection on the profilometer surface.

[0003] Prior art, such as the quality inspection system and method disclosed in the invention application patent with announcement number: CN114486902B, is used to detect the printing quality of colored contact lens molds, including: a camera, a mechanical transmission module, an electrical control module and a processing module, and the processing module is respectively communicated with the camera and the electrical control module. The mechanical transmission module includes a horizontal module and a rotating module arranged on the horizontal module, and the rotating module is placed on the mold to be inspected. The electrical control module includes a motor group and a controller for controlling the motor group, which is used to drive the translation of the horizontal module and the rotation of the rotating module. The processing module is used to set the controller and determine the printing quality information of the mold based on the image received from the camera. The present disclosure replaces manual labor with an automated quality inspection system, which can solve the problems of inconsistent inspection standards, inability to guarantee accuracy, and low inspection efficiency existing in manual subjective visual inspection methods.

[0004] In combination with the above scheme, it can be found that there are few tests on the surface quality of the profilometer in the prior art. On the one hand, the attention to the prior data of the profilometer is not high, and the prior data of the profilometer can indicate which surface areas of the profilometer are prone to quality defects, so as to carry out targeted detection. The neglect of this aspect in the prior art leads to inaccurate detection of the profilometer, increased errors, and prolonged detection time, wasting detection resources to a certain extent. On the other hand, most of the prior art selects the detection path in the shortest way, and the different areas to be detected of the profilometer also indicate that the required light sources and lenses are different. Therefore, it is necessary to consider the convenience of switching the light source and lens. The neglect of this aspect in the prior art is likely to lead to frequent switching of the light source and lens of the shooting mechanism during image detection, reducing the efficiency of image detection and increasing light pollution. The lens is also susceptible to pollution in the environment when switching frequently, thereby reducing the quality of the captured image. Summary of the invention

[0005] The purpose of the present invention is to provide an instrument surface quality detection system and method, which solves the problems existing in the background technology.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions: In a first aspect, the present invention provides an instrument surface quality detection system, including: a profiler prior data acquisition module, used to acquire the prior data of the profiler.

[0007] The profilometer detection parameter evaluation module is used to generate the profilometer parameters to be detected according to the prior data of the profilometer.

[0008] The profilometer shooting parameter adjustment module is used to obtain the cleaning data and environmental data of the profilometer, determine whether the profilometer needs to be cleaned, and if the profilometer needs to be cleaned, notify the cleaning personnel to clean the profilometer and determine the profilometer's parameters to be shot.

[0009] The profiler trajectory parameter determination module is used to determine the profiler's trajectory parameters to be detected based on the profiler's parameters to be detected and the profiler's parameters to be photographed.

[0010] The execution terminal is used to perform image detection on the profilometer according to the trajectory parameters to be detected of the profilometer.

[0011] A second aspect of the present invention provides a method for executing the instrument surface quality detection system of the present invention, comprising: S1. acquiring prior data of a profilometer.

[0012] S2. Generate the parameters to be detected of the profilometer according to the prior data of the profilometer.

[0013] S3. Obtain cleaning data and environmental data of the profilometer, determine whether the profilometer needs to be cleaned, and if the profilometer needs to be cleaned, notify the cleaning personnel to clean the profilometer and determine the parameters to be shot of the profilometer.

[0014] S4. Determine the trajectory parameters to be detected of the profilometer based on the parameters to be detected of the profilometer and the parameters to be photographed of the profilometer.

[0015] S5. Perform image detection on the profilometer according to the trajectory parameters to be detected of the profilometer.

[0016] The beneficial effects of the present invention are: (1) the present invention determines which surface areas of the profilometer need to be inspected based on the prior data of the profilometer, thereby performing targeted inspections, ensuring the inspection accuracy of the profilometer, reducing errors in subsequent operation of the profilometer, shortening the inspection time, and saving inspection resources to a certain extent.

[0017] The present invention comprehensively screens the path of the shooting mechanism based on the length of the path and the convenience of light source switching and lens switching, thereby making up for the deficiencies in the prior art, avoiding frequent switching of light sources and lenses when the shooting mechanism performs image detection, and improving the efficiency of image detection. At the same time, it avoids light pollution and reduces the contamination of the lens by the environment, thereby ensuring the quality of the captured image. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of the system structure connection of the present invention.

[0020] Figure 2 The present invention is a schematic flow chart of the steps for implementing the method. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Reference Figure 1 As shown, the first aspect of the present invention provides an instrument surface quality detection system, including: a profiler prior data acquisition module, a profiler detection parameter evaluation module, a profiler shooting parameter adjustment module, a profiler trajectory parameter determination module, and an execution terminal.

[0023] It should be noted that the present invention also includes a database for storing a standard three-dimensional model of a manufacturing mold of the profilometer, the allowable defect volume corresponding to each defect type, the standard stress value of the manufacturing material, the internal defect risk threshold, the safety interval of each monitoring data, the suitable usage time, the safe magnetic field strength, the allowable number of plugging and unplugging times and the allowable manufacturing dimensional deviation, the standard three-dimensional morphology image of the object to be tested in each prior inspection, the various quality-related hardware areas of the profilometer, the suitable cleaning interval duration of the profilometer, the various characteristic parameters of each light source and the various characteristic parameters of the required light source corresponding to each function of the profilometer.

[0024] It should also be noted that the profilometer prior data acquisition module is connected to the profilometer detection parameter evaluation module, the profilometer detection parameter evaluation module is connected to the profilometer shooting parameter adjustment module, the profilometer detection parameter evaluation module and the profilometer shooting parameter adjustment module are both connected to the profilometer trajectory parameter determination module, the profilometer trajectory parameter determination module is connected to the execution terminal, and the database is connected to the profilometer detection parameter evaluation module and the profilometer shooting parameter adjustment module.

[0025] The profilometer prior data acquisition module is used to acquire the profilometer prior data.

[0026] In a specific embodiment of the present invention, the prior data includes: prior manufacturing storage data: a three-dimensional model and internal defect parameters of the manufacturing mold, a stress distribution diagram of the manufacturing material, a handling video, and a storage video.

[0027] Prior function usage data: display usage data, interface usage data;

[0028] Priori detection output data: three-dimensional contour parameters of the object to be tested in each priori detection, where the three-dimensional contour parameters include three-dimensional morphology, concave volume, and convex volume.

[0029] It should be noted that the profilometer will generate some data during transportation, storage and use. The method of obtaining these data is relatively simple and can be achieved in the existing technology, so it will not be elaborated here.

[0030] The profilometer detection parameter evaluation module is used to generate the profilometer parameters to be detected according to the prior data of the profilometer.

[0031] In a specific embodiment of the present invention, the parameters to be detected of the profilometer are generated according to the prior data of the profilometer, and the specific method is: the profilometer is divided into hardware areas according to the function to obtain the hardware areas of the profilometer.

[0032] It should be noted that the hardware areas include a measuring platform base area, a column area, a probe area, and the like.

[0033] The priori manufacturing storage data is extracted from the priori data of the profiler, and each first to-be-detected area of ​​the profiler is screened.

[0034] Prior function usage data is extracted from the prior data of the contour meter to determine whether the display screen and interface of the contour meter need to be image detected. If the display screen or interface of the contour meter needs to be image detected, the display screen area of ​​the contour meter is recorded as the area to be detected, and the interface area is recorded as the area to be detected, so as to obtain the second areas to be detected of the contour meter.

[0035] The priori detection output data is extracted from the priori data of the profilometer, and each third area to be detected of the profilometer is screened.

[0036] According to each first to-be-detected area, each second to-be-detected area and each third to-be-detected area of ​​the profilometer, the to-be-detected parameters of the profilometer are summarized and obtained.

[0037] In a specific embodiment of the present invention, the first areas to be detected of the profilometer are screened by a specific screening method: gridding the hardware areas of the profilometer to obtain a plurality of sub-areas, and comparing the three-dimensional model of the manufacturing mold of the profilometer with the standard three-dimensional model of the manufacturing mold of the profilometer stored in the database to obtain the shape compliance value of the manufacturing mold of the profilometer, wherein the shape compliance value includes values ​​of 1 and -1. When the shape compliance value of the manufacturing mold of the profilometer is -1, it indicates that the shape of the manufacturing mold of the profilometer does not meet the standard, and each hardware area of ​​the profilometer is recorded as each first area to be detected. When it is 1, it indicates that the shape of the manufacturing mold of the profilometer meets the standard, and the following analysis is performed:

[0038] It should be noted that the shape compliance value of the manufacturing mold of the profiler is specifically analyzed by the following method: obtain the overlapping volume between the three-dimensional model of the manufacturing mold of the profiler and the standard three-dimensional model and the volume of the standard three-dimensional model, and divide the overlapping volume between the three-dimensional model of the manufacturing mold of the profiler and the standard three-dimensional model by the volume of the standard three-dimensional model to obtain the overlap rate of the manufacturing mold of the profiler; if the overlap rate of the manufacturing mold of the profiler is greater than or equal to the preset overlap rate threshold of the manufacturing mold of the profiler, the shape compliance value of the manufacturing mold of the profiler is recorded as 1; otherwise, it is recorded as -1.

[0039] Based on the internal defect parameters of the profilometer and the stress distribution diagram of the manufacturing material, the defect types and corresponding defect volumes of each sub-area of ​​each hardware area of ​​the profilometer are obtained. , stress value of manufacturing material , and import it into the internal defect risk assessment model In the output, the internal defect risk value of each sub-area of ​​each hardware area of ​​the profiler is , , They are respectively represented by the allowable defect volume corresponding to the p-th defect type stored in the database, the standard stress value of the manufacturing material, and the internal defect risk threshold. is the number of each hardware area, , is any integer greater than 2, is the number of each sub-region, , is any integer greater than 2, is the number of each defect type, , is any integer greater than 2.

[0040] When the internal defect risk value is 1, it indicates that there is a defect risk inside the sub-area. The internal defect sub-areas of each hardware area of ​​the profiler are screened and the surface areas of each internal defect sub-area of ​​each hardware area of ​​the profiler are obtained and recorded as the first areas to be detected of each hardware area of ​​the profiler.

[0041] Based on the handling video and storage video of the profilometer, the collision number, contact number, glossiness and color uniformity of the surface area of ​​each sub-area of ​​each hardware area of ​​the profilometer are obtained, and imported into the detection requirement evaluation model to output the detection requirement of the surface area of ​​each sub-area of ​​each hardware area of ​​the profilometer. , if the detection requirement is 1, it indicates that the surface area needs to be detected, and the first detection area of ​​each hardware area of ​​the profiler is obtained, where , is the jth monitoring data of the surface area of ​​the mth sub-area of ​​the i-th hardware area of ​​the profiler and its corresponding safety interval, j is the number of the monitoring data, , , They are represented as existential quantifier and universal quantifier respectively.

[0042] It should be understood that the monitoring data specifically include the number of collisions, the number of contacts, the glossiness and the color uniformity, and the safety interval of the monitoring data is stored in the database.

[0043] It should be noted that the number of collisions refers to the number of times the profiler collides with other objects during transportation, and the number of contacts refers to the number of times the profiler contacts with other objects during storage.

[0044] The first areas to be detected of the profilometer are obtained by summarizing.

[0045] In a specific embodiment of the present invention, the specific method for determining whether the display screen and interface of the profilometer need to be image detected is as follows: extracting the duration of each use from the display screen usage data of the profilometer and magnetic field strength , and import it into the display screen detection demand assessment model of the profiler In the output, the display screen detection requirement of the profiler is , They are the appropriate usage time and safe magnetic field strength stored in the database. , It represents the logical symbol or and. The display screen detection requirement includes the values ​​of 1 and -1. When the display screen requirement of the profiler is 1, it indicates that the display screen of the profiler needs to be image detected.

[0046] Extracting the plug-in and unplug counts of external devices from the profiler's interface usage data and manufacturing dimensional deviations , and import it into the interface detection demand assessment model of the profiler The interface detection requirements of the output profiler are as follows: , They respectively represent the allowed number of plugging and unplugging times and the allowed manufacturing size deviation stored in the database. The interface detection requirement includes values ​​of 1 and -1. When the display screen requirement of the profiler is 1, it indicates that the interface of the profiler requires image detection.

[0047] It should be noted that if the interface of the profiler is frequently plugged and unplugged with external devices, it is easy to cause interface wear. If the interface size deviation of the profiler is large, it is easy to cause the interface to loosen, thus affecting the normal use of the profiler. Therefore, it is necessary to analyze the number of plug-in and unplugging times of the interface of the profiler with external devices and the manufacturing size deviation.

[0048] In a specific embodiment of the present invention, the specific screening method for screening each third area to be detected of the profilometer is: comparing the three-dimensional morphology image of the object to be tested obtained by each prior detection of the profilometer with the standard three-dimensional morphology image of the object to be tested obtained by each prior detection stored in a database to obtain the detection accuracy of each prior detection of the profilometer, and extracting the concave volume and convex volume from the standard three-dimensional morphology image of the object to be tested obtained by each prior detection of the profilometer, and recording them as the standard concave volume and the standard convex volume.

[0049] It should be noted that the analysis method of the overlap rate of the manufacturing mold of the same profiler is consistent with that of the profiler, and the detection accuracy of each prior detection of the profiler is obtained by analysis.

[0050] The detection accuracy of each prior detection of the profilometer , Depression volume , convex volume , standard depression volume and standard convex volume Importing the inspection quality assessment model into the profilometer In the output, the detection quality evaluation coefficient of the profilometer is is the number of each prior test, , is any integer greater than 2.

[0051] The detection quality assessment coefficient of the profilometer is compared with the preset detection quality assessment coefficient threshold. If the detection quality assessment coefficient of the profilometer is less than the detection quality assessment coefficient threshold, the quality-associated hardware areas of the profilometer are obtained from the database and recorded as the third areas to be detected of the profilometer.

[0052] It should be noted that the quality-related hardware areas of the profiler are specifically: if the profiler's probe, sensor area and other areas with a high degree of correlation with detection are prone to defects, the detection quality of the profiler will be inaccurate, so it is necessary to inspect the profiler's probe, sensor area, etc.

[0053] The profilometer shooting parameter adjustment module is used to obtain the cleaning data and environmental data of the profilometer, determine whether the profilometer needs to be cleaned, and if the profilometer needs to be cleaned, notify the cleaning personnel to clean the profilometer and determine the profilometer's parameters to be shot.

[0054] It should be noted that the profilometer will generate some data during cleaning. The acquisition method of this data and environmental data is relatively simple and can be achieved in the existing technology, so it will not be elaborated here.

[0055] In a specific embodiment of the present invention, the specific method for judging whether the profilometer needs cleaning is as follows: extract the time point of the last cleaning from the cleaning data of the profilometer, combine it with the current time point, obtain the cleaning idle time of the profilometer, and compare it with the suitable cleaning interval time of the profilometer stored in the database; if the cleaning idle time of the profilometer is greater than the suitable cleaning interval time, it is judged that the profilometer needs cleaning.

[0056] The characteristic values ​​of each environmental data are extracted from the environmental data of the profilometer, and imported into the environmental suitability assessment model of the profilometer, and the environmental suitability value of the profilometer is output. If the environmental suitability value of the profilometer is -1, it is judged that the profilometer needs to be cleaned.

[0057] It should be noted that the analysis method of the environmental suitability value of the profiler is consistent with the analysis principle of the detection demand of the surface area of ​​each sub-area of ​​each hardware area of ​​the profiler, and will not be elaborated here.

[0058] It should also be noted that the characteristic values ​​of the environmental data include temperature difference, humidity difference, maximum temperature, minimum humidity, etc.

[0059] In a specific embodiment of the present invention, the parameters to be photographed of the profiler are determined by a specific method: obtaining the functions of the first, second and third areas to be detected of the profiler, and then summarizing the functions of the areas to be photographed of the profiler, combining the characteristic parameters of the light sources stored in the database and the characteristic parameters of the required light sources corresponding to the functions of the profiler, screening the characteristic parameters of the required light sources for the areas to be photographed of the profiler, if the characteristic parameters of the required light sources for a certain area to be photographed of the profiler are successfully matched with the corresponding characteristic parameters of a certain light source, then the light source is recorded as the shooting light source of the area to be photographed, and the shooting light sources of the areas to be photographed of the profiler are obtained.

[0060] It should be noted that the characteristic parameters of the light source include brightness, shape, contrast and the like.

[0061] Similarly, the shooting lenses of each area to be shot by the profilometer are analyzed and obtained.

[0062] According to the shooting light source and the shooting lens of each to-be-shot area of ​​the profilometer, the to-be-shot parameters of the profilometer are summarized and obtained.

[0063] The profiler trajectory parameter determination module is used to determine the profiler trajectory parameters to be detected based on the profiler parameters to be detected and the profiler parameters to be photographed.

[0064] In a specific embodiment of the present invention, the parameters of the trajectory to be detected of the profiler are determined by: automatically generating each guide rail trajectory to be detected of the profiler based on the parameters to be detected of the profiler, and obtaining the number of light source switching times of each guide rail trajectory to be detected of the profiler based on the parameters to be photographed of the profiler and camera switching times , evaluate the shooting convenience index of each track to be detected by the profilometer , is the number of each track to be detected, , is any integer greater than 2.

[0065] The shooting convenience indexes of each to-be-detected trajectory of the profiler are compared with each other. If the shooting convenience index of a trajectory to be detected is the largest, then the trajectory to be detected is recorded as the shooting execution path. If there are two or more trajectories to be detected whose shooting convenience indexes are the same and the largest, then the trajectory to be detected with the smallest path is selected as the shooting execution path to obtain the shooting execution path of the profiler.

[0066] According to the shooting execution path of the profilometer, each area to be shot on the shooting execution path of the profilometer is obtained, and a three-dimensional coordinate system is established with the center point of the base of the profilometer as the origin to obtain the coordinates of the starting shooting points of each area to be shot on the shooting execution path of the profilometer, and based on the built-in locator of the shooting mechanism and combined with the coordinate conversion technology, the coordinates of each shooting point of the shooting mechanism are obtained, and the shooting light source and shooting lens of each area to be shot on the shooting execution path of the profilometer are used as the switching light source and switching lens of each shooting point of the shooting mechanism.

[0067] It should be noted that the coordinates of the starting shooting point of the area to be shot are specifically: the first point of the area to be shot in the direction of the shooting execution path.

[0068] It should be noted that the shooting mechanism includes a shooting rail, a shooting camera and a supporting slide, etc., wherein the shooting camera includes an integrated light source, a lens switching mechanism and a camera module, and the light source can be closely attached to the camera. In this way, when the camera moves on the rail, the light source will also move with it to ensure that the light is irradiated on the surface to be tested, and the lens switching mechanism can automatically switch different lenses as needed.

[0069] The switching light source and the switching lens of each shooting point of the shooting mechanism are mapped to the shooting execution path of the profilometer to obtain the trajectory parameters to be detected of the profilometer.

[0070] The execution terminal is used to perform image detection on the profilometer according to the trajectory parameters to be detected of the profilometer.

[0071] Reference Figure 2 As shown, the second aspect of the present invention provides a method for executing the instrument surface quality detection system of the present invention, comprising: S1. acquiring prior data of the profilometer.

[0072] S2. Generate the parameters to be detected of the profilometer according to the prior data of the profilometer.

[0073] S3. Obtain cleaning data and environmental data of the profilometer, determine whether the profilometer needs to be cleaned, and if the profilometer needs to be cleaned, notify the cleaning personnel to clean the profilometer and determine the parameters to be shot of the profilometer.

[0074] S4. Determine the trajectory parameters to be detected of the profilometer based on the parameters to be detected of the profilometer and the parameters to be photographed of the profilometer.

[0075] S5. Perform image detection on the profilometer according to the trajectory parameters to be detected of the profilometer.

[0076] The above contents are merely examples and explanations of the concept of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention or exceed the scope defined by the present invention, they shall all fall within the protection scope of the present invention.

Claims

1. An instrument surface quality detection system, characterized in that: include: A profiler prior data acquisition module, used to acquire the profiler prior data; The prior data includes: Prior manufacturing storage data: 3D model and internal defect parameters of the manufacturing mold, stress distribution diagram of the manufacturing material, handling video, storage video; Prior function usage data: display usage data, interface usage data; Priori detection output data: three-dimensional profile parameters of the object to be tested in each priori detection, where the three-dimensional profile parameters include three-dimensional morphology, concave volume, and convex volume; A profiler detection parameter evaluation module is used to generate the profiler's detection parameters according to the profiler's prior data; The specific method of generating the parameters to be detected of the profilometer according to the prior data of the profilometer is as follows: Divide the profiler into various hardware areas according to the functions, and obtain various hardware areas of the profiler; Extracting a priori manufacturing storage data from the priori data of the profilometer to screen each first to-be-detected area of ​​the profilometer; Extracting prior function usage data from the prior data of the profilometer, determining whether the display screen and the interface of the profilometer need to be image detected, if the display screen or the interface of the profilometer needs to be image detected, recording the display screen area of ​​the profilometer as the area to be detected, and recording the interface area as the area to be detected, to obtain each second area to be detected of the profilometer; Extracting prior detection output data from the prior data of the profilometer to screen each third to-be-detected area of ​​the profilometer; According to each first to-be-detected area, each second to-be-detected area and each third to-be-detected area of ​​the profilometer, a parameter to be detected of the profilometer is obtained by summarizing; The specific screening method of the first to-be-detected areas of the screening profilometer is as follows: Divide each hardware area of ​​the profiler into a grid to obtain several sub-areas, and compare the three-dimensional model of the manufacturing mold of the profiler with the standard three-dimensional model of the manufacturing mold of the profiler stored in the database to obtain the shape compliance value of the manufacturing mold of the profiler, where the shape compliance value includes the values ​​of 1 and -1. When the shape compliance value of the manufacturing mold of the profiler is -1, it indicates that the shape of the manufacturing mold of the profiler does not meet the standard, and each hardware area of ​​the profiler is recorded as each first area to be detected. When it is 1, it indicates that the shape of the manufacturing mold of the profiler meets the standard, and the following analysis is performed: Based on the internal defect parameters of the profilometer and the stress distribution diagram of the manufacturing material, the defect types and corresponding defect volumes of each sub-area of ​​each hardware area of ​​the profilometer are obtained. , stress value of manufacturing material , and import it into the internal defect risk assessment model In the output, the internal defect risk value of each sub-area of ​​each hardware area of ​​the profiler is , , They are respectively represented by the allowable defect volume corresponding to the p-th defect type stored in the database, the standard stress value of the manufacturing material, and the internal defect risk threshold. is the number of each hardware area, , is any integer greater than 2, is the number of each sub-region, , is any integer greater than 2, is the number of each defect type, , is any integer greater than 2; When the internal defect risk value is 1, it indicates that there is a defect risk inside the sub-region, and each internal defect sub-region of each hardware region of the profilometer is screened and obtained, and the surface area of ​​each internal defect sub-region of each hardware region of the profilometer is obtained, and recorded as each first to-be-detected area of ​​each hardware region of the profilometer; Based on the handling video and storage video of the profilometer, the collision number, contact number, glossiness and color uniformity of the surface area of ​​each sub-area of ​​each hardware area of ​​the profilometer are obtained, and imported into the detection requirement evaluation model to output the detection requirement of the surface area of ​​each sub-area of ​​each hardware area of ​​the profilometer. , if the detection requirement is 1, it indicates that the surface area needs to be detected, and the first detection area of ​​each hardware area of ​​the profiler is obtained, where , is the jth monitoring data of the surface area of ​​the mth sub-area of ​​the i-th hardware area of ​​the profiler and its corresponding safety interval, j is the number of the monitoring data, , , They are expressed as existential quantifier and universal quantifier respectively; Summarize and obtain the first areas to be detected of the profilometer; The specific method for judging whether the display screen and the interface of the profilometer need to perform image detection is as follows: Extracting the duration of each session from the profiler display usage data and magnetic field strength , and import it into the display screen detection demand assessment model of the profiler In the output, the display screen detection requirement of the profiler is , They are the appropriate usage time and safe magnetic field strength stored in the database. , It represents the logical symbol or and. The display screen detection requirement includes the values ​​of 1 and -1. When the display screen requirement of the profiler is 1, it indicates that the display screen of the profiler needs to be image detected. Extract the plug-in and unplug times and manufacturing dimension deviation of external devices from the interface usage data of the profiler, import them into the interface detection requirement evaluation model of the profiler, and output the interface detection requirement of the profiler, where the interface detection requirement includes values ​​of 1 and -1. When the display requirement of the profiler is 1, it indicates that the interface of the profiler needs image detection. The specific screening method of the third to-be-detected areas of the screening profilometer is as follows: Compare the three-dimensional topography images of the object to be tested obtained by each prior detection of the profilometer with the standard three-dimensional topography images of the object to be tested obtained by each prior detection stored in the database to obtain the detection accuracy of each prior detection of the profilometer, and extract the concave volume and the convex volume from the standard three-dimensional topography images of the object to be tested obtained by each prior detection of the profilometer, and record them as the standard concave volume and the standard convex volume; The detection accuracy of each prior detection of the profilometer , Depression volume , convex volume , standard depression volume and standard convex volume Importing the inspection quality assessment model into the profilometer In the output, the detection quality evaluation coefficient of the profilometer is is the number of each prior test, , is any integer greater than 2; Compare the detection quality assessment coefficient of the profiler with a preset detection quality assessment coefficient threshold. If the detection quality assessment coefficient of the profiler is less than the detection quality assessment coefficient threshold, obtain each quality-related hardware area of ​​the profiler from the database and record it as each third to-be-detected area of ​​the profiler; A profilometer shooting parameter adjustment module is used to obtain the cleaning data and environmental data of the profilometer, determine whether the profilometer needs to be cleaned, and if the profilometer needs to be cleaned, notify the cleaning personnel to clean the profilometer and determine the profilometer's parameters to be shot; A profiler trajectory parameter determination module, used to determine the profiler trajectory parameters to be detected based on the profiler parameters to be detected and the profiler parameters to be photographed; The execution terminal is used to perform image detection on the profilometer according to the trajectory parameters to be detected of the profilometer.

2. The instrument surface quality detection system according to claim 1, characterized in that: The specific method for judging whether the profilometer needs to be cleaned is as follows: Extract the last cleaning time point from the cleaning data of the profiler, combine it with the current time point, obtain the cleaning idle time of the profiler, and compare it with the suitable cleaning interval time of the profiler stored in the database. If the cleaning idle time of the profiler is greater than the suitable cleaning interval time, it is determined that the profiler needs to be cleaned; The characteristic values ​​of each environmental data are extracted from the environmental data of the profilometer, and imported into the environmental suitability assessment model of the profilometer, and the environmental suitability value of the profilometer is output. If the environmental suitability value of the profilometer is -1, it is judged that the profilometer needs to be cleaned.

3. The instrument surface quality detection system according to claim 1, characterized in that: The specific method for determining the parameters to be photographed of the profilometer is as follows: The functions of the first to-be-detected areas, the second to-be-detected areas, and the third to-be-detected areas of the profilometer are obtained, and then the functions of the to-be-shot areas of the profilometer are summarized, and the characteristic parameters of the light sources stored in the database and the characteristic parameters of the required light sources corresponding to the functions of the profilometer are combined to screen the characteristic parameters of the required light sources of the to-be-shot areas of the profilometer. If the characteristic parameters of the required light sources of a certain to-be-shot area of ​​the profilometer are successfully matched with the corresponding characteristic parameters of a certain light source, the light source is recorded as the shooting light source of the to-be-shot area, and the shooting light sources of the to-be-shot areas of the profilometer are obtained; Similarly, the shooting shots of each area to be shot by the profilometer are obtained by analysis; According to the shooting light source and the shooting lens of each to-be-shot area of ​​the profilometer, the to-be-shot parameters of the profilometer are summarized and obtained.

4. The instrument surface quality detection system according to claim 1, characterized in that: The method for determining the parameters of the trajectory to be detected by the profilometer is as follows: Based on the parameters to be detected of the profiler, each guide rail track to be detected of the profiler is automatically generated, and based on the parameters to be photographed of the profiler, the number of light source switching times of each guide rail track to be detected of the profiler is obtained and camera switching times , evaluate the shooting convenience index of each track to be detected by the profilometer , is the number of each track to be detected, , is any integer greater than 2; The shooting convenience indexes of the to-be-detected trajectories of the profiler are compared with each other. If the shooting convenience index of a to-be-detected trajectory is the largest, the to-be-detected trajectory is recorded as the shooting execution path. If there are two or more to-be-detected trajectories with the same and largest shooting convenience indexes, the to-be-detected trajectory with the smallest path is selected as the shooting execution path to obtain the shooting execution path of the profiler; According to the shooting execution path of the profilometer, each area to be shot in the shooting execution path of the profilometer is obtained, and a three-dimensional coordinate system is established with the center point of the base of the profilometer as the origin, and the coordinates of the starting shooting points of each area to be shot in the shooting execution path of the profilometer are obtained, and based on the built-in positioner of the shooting mechanism, the coordinates of each shooting point of the shooting mechanism are obtained in combination with the coordinate conversion technology, and the shooting light source and shooting lens of each area to be shot in the shooting execution path of the profilometer are used as the switching light source and switching lens of each shooting point of the shooting mechanism; The switching light source and the switching lens of each shooting point of the shooting mechanism are mapped to the shooting execution path of the profilometer to obtain the trajectory parameters to be detected of the profilometer.

5. A method for executing the instrument surface quality detection system according to any one of claims 1 to 4, characterized in that: include: S1. Obtaining prior data of the profilometer; S2. Generate the parameters to be detected of the profilometer according to the prior data of the profilometer; S3. Obtain the cleaning data and environmental data of the profilometer, determine whether the profilometer needs to be cleaned, and if the profilometer needs to be cleaned, notify the cleaning staff to clean the profilometer and determine the parameters to be shot of the profilometer; S4. The parameters to be detected by the profilometer and the parameters to be photographed by the profilometer are determined to determine the trajectory parameters to be detected by the profilometer; S5. Perform image detection on the profilometer according to the trajectory parameters to be detected of the profilometer.

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