Wafer cleaning equipment and wafer carrying and clamping device

Abstract

The present application discloses a wafer cleaning device and a wafer carrying and clamping device, which relates to the field of wafer and chip manufacturing equipment, and can solve the problem in the prior art that the chuck is difficult to be compatible with wafers of different sizes. The wafer carrying and clamping device includes a connecting base plate connected to the process chamber of the cleaning equipment, a chuck base plate connected to the connecting base plate, and a plurality of clamping assemblies connected to the side of the chuck base plate away from the connecting base plate, the clamping assembly includes a plurality of clamping parts uniformly connected to the chuck base plate along the circumferential direction of the chuck base plate and used to clamp the wafer, and the distance between the clamping part of the clamping assembly and the center of the chuck base plate is adapted to the radius of the wafer, so that the plurality of the clamping assemblies correspond one-to-one to wafers of various sizes.

Description

Technical Field

[0001] The present application relates to the field of wafer and chip manufacturing equipment, and specifically to a wafer cleaning equipment and a wafer carrying and clamping device. Background Art

[0002] The third-generation semiconductor SiC (silicon carbide) is in a period of rapid development. With its excellent performance in application scenarios such as high voltage, high frequency and high temperature, it has become an important material for the next generation of power semiconductor devices. At present, 8-inch SiC wafer manufacturing technology has made a breakthrough and entered the small-batch production stage. However, due to the high processing cost and relatively low yield of 8-inch SiC wafers, the mainstream wafer manufacturing size is still concentrated in 6 inches. However, with the iterative upgrading of technology, wafer manufacturers have gradually shown the need for the simultaneous production of 6-inch and 8-inch wafers to cope with changes in different market and product demands.

[0003] During the wafer manufacturing process, the single wafer cleaning machine ensures the quality of each process by performing high-precision cleaning on a single wafer. The cleaning process runs through the entire wafer manufacturing process, including cleaning before diffusion, cleaning after etching, cleaning after ion implantation, cleaning after degumming, cleaning before / after film formation, cleaning after mechanical polishing, etc. These processes are crucial for removing particles, chemical residues and pollutants generated during the processing process, ensuring the cleanliness of the wafer surface. Among them, for the single wafer cleaning machine, the chuck is a key component, and its main function is to fix and clamp the wafer to ensure that the wafer remains stable during the cleaning and drying process without displacement or vibration.

[0004] However, in the prior art, in order to meet the production needs of wafers of different sizes (such as 6-inch and 8-inch), the wafer carrier chuck is usually replaced to be compatible with wafers of different specifications. However, this method is cumbersome to operate, and frequent chuck replacement not only affects production efficiency, but may also introduce contaminants during the replacement process, destroying the cleanliness inside the equipment, affecting the product yield and the long-term stability of the equipment.

[0005] In addition, particles on the surface of SiC wafers have stronger adhesion than those on traditional single crystal silicon wafers. The main reason is that SiC material has high hardness and large surface energy, which makes particles adhere more firmly to its surface, especially tiny particles are more difficult to remove. This situation places higher demands on cleaning equipment. During the cleaning process, in order to effectively remove these attached particles, the scrubbing step needs to apply greater friction for cleaning. This also requires the wafer-carrying chuck to have a greater clamping force to prevent relative sliding between the wafer and the chuck during the scrubbing process. If the chuck cannot provide sufficient clamping force, the wafer may move or vibrate, affecting the cleaning effect. In addition, different thickness wafers require different clamping forces when cleaning. This is because thicker wafers are subject to greater friction and inertia during rotation or scrubbing, so a stronger fixing force is required to prevent them from shifting.

[0006] However, existing chuck designs usually provide a fixed, non-adjustable clamping force, which means that when processing wafers of different thicknesses or sizes, the chuck cannot flexibly adjust the clamping force according to specific needs, resulting in reduced cleaning efficiency and even possible damage to the wafer. Summary of the invention

[0007] To this end, the present application provides a wafer cleaning device and a wafer carrying and clamping device to solve the problem in the prior art that the chuck is difficult to be compatible with wafers of different sizes.

[0008] In order to achieve the above objectives, this application provides the following technical solutions:

[0009] A wafer carrying and clamping device comprises a connecting base plate connected to a process chamber of a cleaning device, a chuck base plate connected to the connecting base plate, and a plurality of clamping assemblies connected to a side of the chuck base plate away from the connecting base plate, wherein the clamping assemblies comprise a plurality of clamping portions uniformly connected to the chuck base plate along a circumferential direction of the chuck base plate and used for clamping wafers, wherein the distance between the clamping portions of the clamping assemblies and the center of the chuck base plate is adapted to the radius of the wafer, so that a plurality of the clamping assemblies correspond one-to-one to wafers of a plurality of different sizes.

[0010] Optionally, the clamping portion includes a dynamic clamping jaw connected to the chuck base plate and a plurality of static clamping jaws connected to the chuck base plate, the static clamping jaw includes a first support member connected to the chuck base plate and a first limit block connected to the first support member, a first support surface for supporting an edge of a wafer is formed on a side of the first support member away from the chuck base plate, and the first limit block is connected to the first support surface, a plurality of first limit blocks of the same clamping assembly form a limit circle, and a radius of the limit circle is greater than a radius of a wafer for clamping the clamping assembly;

[0011] The movable clamping jaw comprises a second supporting member rotatably connected to the chuck base plate and a second limiting block connected to the second supporting member, a second supporting surface is formed on a side of the second supporting member away from the chuck base plate, and the second limiting block is connected to the second supporting surface, the connecting base plate is connected to a driving assembly for driving the second supporting member to rotate around the rotating axis, the second limiting block is located on one side of the central axis of the rotating axis, and the driving assembly is used to drive the second limiting block to rotate around the rotating axis to abut against the side wall of the wafer;

[0012] The plurality of first supporting surfaces of the same clamping assembly are all coplanar, and the first limiting block and the second limiting block of one of the two adjacent clamping assemblies close to the center of the chuck bottom plate are lower than the first supporting surface of the other one.

[0013] Optionally, a line connecting the clamping parts in two adjacent clamping assemblies passes through the center of the chuck base plate, and the multiple clamping parts of the two clamping assemblies correspond one to one.

[0014] Optionally, the drive assembly includes a motor connected to the connecting base plate, a rotating drive wheel rotatably connected to the output shaft of the motor through a first bearing, a plurality of elastic parts connected between the rotating drive wheel and the chuck base plate and used to force the second limit block to press against the side wall of the wafer through elastic force, and a plurality of driving parts connected between the rotating drive wheel and the chuck base plate and used to cooperate with the motor to overcome the elastic force of the elastic parts to make the second limit block separate from the wafer. The chuck base plate is connected to the output shaft of the motor, the connecting base plate is connected to a sealing plate through a plurality of vertical rods, the sealing plate is provided with a makeshift through hole that cooperates with the output shaft of the motor, and the chuck base plate is integrally formed with a side plate mounted on the sealing plate, and the side plate, the chuck base plate and the sealing plate form a accommodating cavity for accommodating the rotating drive wheel.

[0015] Optionally, the first support member is connected with a connecting column, the chuck bottom plate is provided with a plurality of first through holes for penetrating the connecting column, one end of the connecting column away from the first support member penetrates into the accommodating cavity, and the penetrated end is threadedly connected with a limiting nut tightly pressed against the chuck bottom plate, the plurality of connecting columns correspond to the plurality of first through holes one by one, the chuck bottom plate is provided with a plurality of second through holes, and the plurality of second through holes correspond to the plurality of dynamic clamping jaws one by one;

[0016] The driving part includes two driving members, two first driving plates and a second driving plate, the two driving members are respectively connected to the movable jaws of two adjacent clamping assemblies, and the driving member is penetrated by the second through hole, the end of the driving member away from the driving member penetrates into the accommodating cavity, and the penetrated end is rotatably connected to one end of the first driving plate, the two driving members correspond to the two first driving plates one by one, the two ends of the second driving plate are respectively rotatably connected to the ends of the two first driving plates away from the driving members, the second driving plate is connected to a guide rod, and the end of the guide rod away from the second driving plate is connected to the first Second bearing, the rotating drive wheel is provided with a guide groove, the outer ring of the second bearing is against the groove wall of the guide groove, one end of the guide groove gradually extends from the center of the rotating drive wheel to the edge of the rotating drive wheel, a plurality of cylinders are connected to the side of the sealing plate away from the accommodating cavity, and the sealing plate is provided with an avoidance hole connected to the accommodating cavity and used for the output shaft of the cylinder to extend into the accommodating cavity, the rotating drive wheel is connected with a plurality of limiting parts matching the output shaft of the cylinder, the limiting part is provided with a limiting hole matching the output shaft of the cylinder, and the plurality of cylinders and the plurality of limiting parts correspond to each other one by one;

[0017] The elastic part includes an elastic member connected to the chuck base plate at one end and to the rotating drive wheel at the other end, and a limiting member connected to the rotating drive wheel and abutting against the chuck base plate, the limiting member abuts against the chuck base plate to keep the elastic member in a tensioned state, and the second limiting block abuts against the edge of the wafer.

[0018] Optionally, the rotating driving wheel is integrally formed with a plurality of auxiliary parts, one end of the auxiliary part extends to the edge of the rotating driving wheel, and the side panel is integrally formed with a plurality of third limit blocks, and the plurality of auxiliary parts and the plurality of third limit blocks correspond one to one, and the limit part is threadedly connected to the part of the auxiliary part extending out of the rotating driving wheel through a connecting rod, and the side of the limit part away from the connecting rod abuts against the third limit block.

[0019] Optionally, the elastic member is a spring, the auxiliary member is connected to a first magnetic member, and the chuck base plate is connected to a second magnetic member, so that a magnetic force that cooperates with the spring is generated between the second magnetic member and the first magnetic member.

[0020] Optionally, the first magnetic member and the second magnetic member are both annular permanent magnets, and the central axes of the first magnetic member and the second magnetic member are parallel. When the second limit block is pressed against the edge of the wafer, the central axis of the second magnetic member is located on the side of the central axis of the first magnetic member close to the spring.

[0021] Optionally, the driving member includes an axle seat connected to the first driving plate and a core shaft connected to the axle seat, the chuck base plate is connected to the second through hole with a limit sleeve matching the second through hole, the second support member is integrally formed with a first connecting member for passing through the limit sleeve and the second through hole on the side away from the second limit block, the second support member is integrally formed with a sleeve plate on the side away from the second limit block, an annular groove for clamping the limit sleeve is formed between the sleeve plate and the first connecting member, and the core shaft is connected to the first connecting member through a rotating shaft.

[0022] Optionally, the core shaft is provided with a threaded hole passing through it, and the first connecting member is provided with a first accommodating groove for embedding the end of the core shaft at one end away from the second supporting member, and the bottom of the first accommodating groove is provided with a threaded blind hole matching the threaded hole, and the rotating shaft is a screw that is sequentially passed through the threaded hole and the threaded blind hole.

[0023] Optionally, the shaft seat is provided with a second receiving groove for accommodating one end of the core shaft, and one side of the shaft seat is provided with a receiving hole connected to the second receiving groove and for accommodating a nut of the screw, the outer wall of one end of the core shaft is formed with a first limiting plane that matches the groove wall of the first receiving groove, and the outer wall of the other end of the core shaft is formed with a second limiting plane that matches the groove wall of the second receiving groove.

[0024] Optionally, the driving member further comprises a positioning sleeve sleeved on the core shaft, the positioning sleeve is connected to two wing plates connected to the chuck base plate via fasteners, and a plurality of third bearings are arranged between the inner wall of the positioning sleeve and the outer wall of the core shaft.

[0025] The present application also discloses a wafer cleaning device, comprising the wafer carrying and clamping device as described above.

[0026] Compared with the prior art, this application has at least the following beneficial effects:

[0027] The chuck base plate is connected to the process chamber of the cleaning equipment through a connecting base plate. The multiple clamping components on the chuck base plate are evenly distributed in the circumferential direction. The distance between the clamping part and the center of the chuck base plate is adapted to the radius of the wafer. It can flexibly and reliably clamp and fix wafers of different sizes (such as 6-inch and 8-inch wafers), achieving compatibility with wafers of different specifications, thereby overcoming the cumbersome operation of frequent replacement of wafer carrying chucks in the prior art. Since there is no need to replace the chuck, the risk of particle contamination inside the equipment is reduced, and the cleanliness of the equipment is maintained. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more intuitively illustrate the prior art and the present application, several exemplary drawings are given below. It should be understood that the specific shapes and structures shown in the drawings should not generally be regarded as limiting conditions for implementing the present application; for example, those skilled in the art are capable of easily making conventional adjustments or further optimizations to the addition / reduction / attribution division, specific shapes, positional relationships, connection methods, dimensional ratios, etc. of certain units (components) based on the technical concepts and exemplary drawings disclosed in the present application.

[0029] Figure 1 A schematic diagram of the structure of a wafer carrying and clamping device carrying a large-radius wafer provided in one embodiment of the present application;

[0030] Figure 2 A schematic structural diagram of a wafer carrying and clamping device carrying a small-radius wafer provided in one embodiment of the present application;

[0031] Figure 3 A schematic diagram of the overall structure of a wafer carrying and clamping device provided in one embodiment of the present application;

[0032] Figure 4 for Figure 3 Schematic diagram of some structures;

[0033] Figure 5 for Figure 4 A magnified image of point A;

[0034] Figure 6 for Figure 4 A top view of

[0035] Figure 7 for Figure 6 The enlarged view of point B;

[0036] Figure 8 for Figure 6 Enlarged view of point C;

[0037] Fig. 9 for Figure 4 Schematic diagram of some structures;

[0038] Fig.10 for Fig. 9 The enlarged view of point D;

[0039] Fig.11 for Fig. 9 The enlarged view of point E;

[0040] Fig.12 A schematic diagram of the motion state of a part of the structure of a driving part of a wafer carrying and clamping device provided by one embodiment of the present application;

[0041] Fig.13A schematic diagram of a rotating driving wheel of a wafer carrying and clamping device provided by one embodiment of the present application;

[0042] Fig.14 for Fig. 9 Schematic diagram of some structures;

[0043] Fig.15 for Fig.14 The enlarged view of point F;

[0044] Fig.16 for Figure 3 Partial structural cross-sectional view along the aa direction;

[0045] Fig.17 for Fig.16 The enlarged view of G;

[0046] Fig.18 for Figure 3 A cross-sectional view of a portion of the structure along the bb direction;

[0047] Fig.19 for Fig.18 Enlarged view of H;

[0048] Fig. 20 A schematic diagram of a chuck base plate of a wafer carrying and clamping device provided in one embodiment of the present application;

[0049] Fig.21 for Fig. 20 Another perspective of the picture;

[0050] Fig. 22 An exploded schematic diagram of a driving member, a positioning sleeve and a movable clamping jaw of a wafer carrying and clamping device provided in one embodiment of the present application;

[0051] Fig.23 A schematic diagram of a second supporting member of a wafer carrying and clamping device provided in one embodiment of the present application;

[0052] Fig.24 An exploded schematic diagram of a driving component of a wafer carrying and clamping device provided by one embodiment of the present application;

[0053] Fig.25 A diagram showing the relative position states of magnetic flux lines of a first magnetic attraction component and a second magnetic attraction component of a wafer carrying and clamping device provided in accordance with one embodiment of the present application.

[0054] Description of reference numerals:

[0055] 1. Connecting base plate; 11. Vertical rod; 12. Sealing plate; 2. Chuck base plate; 21. Side plate; 22. First through hole; 23. Second through hole; 231. Limit sleeve; 24. Third limit block; 3. Clamping assembly; 31. Clamping part; 311. Moving clamping jaw; 3111. Second support member; 3111a. Second support surface; 3112. Second limit block; 3113. First connecting member; 3113a. First receiving groove; 3113b. Threaded blind hole; 3114. Bushing plate; 3115. Ring groove; 3116. Limit ring; 312. Static clamping jaw; 3121. First support member; 3121a. First support surface; 3122. First limit block; 3123. Connecting column; 3 13. Positioning sleeve; 3131. Wing plate; 314. Rotating shaft; 4. Rotating driving wheel; 41. Guide groove; 42. Auxiliary part; 43. Limiting part; 5. Driving part; 51. Driving part; 511. Shaft seat; 5111. Second accommodating groove; 512. Mandrel; 5121. First limiting plane; 5122. Second limiting plane; 513. Third bearing; 52. First driving plate; 53. Second driving plate; 531. Guide rod; 532. Second bearing; 6. Elastic part; 61. Elastic part; 611. Support rod; 62. Limiting part; 621. Connecting rod; 63. First magnetic part; 64. Second magnetic part; 7. Motor; 71. First bearing; 8. Cylinder; 9. Wafer. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0057] In the description of this application: unless otherwise specified, "plurality" means two or more. The terms "first", "second", "third", etc. in this application are intended to distinguish the objects referred to, and do not have special meanings in terms of technical connotations (for example, they should not be understood as emphasizing the importance or order, etc.). Expressions such as "including", "comprising", "having", etc. also mean "not limited to" (certain units, components, materials, steps, etc.).

[0058] refer to Figure 1-3 The present application discloses a wafer carrying and clamping device, comprising a connecting base plate 1 connected to a process chamber of a cleaning device, a chuck base plate 2 connected to the connecting base plate 1, and a plurality of clamping assemblies 3 connected to a side of the chuck base plate 2 away from the connecting base plate 1, wherein the clamping assemblies 3 include a plurality of clamping portions 31 uniformly connected to the chuck base plate 2 along a circumferential direction of the chuck base plate 2 and used for clamping a wafer 9, and a distance between the clamping portion 31 of the clamping assembly 3 and the center of the chuck base plate 2 is adapted to a radius of the wafer 9, so that the plurality of clamping assemblies 3 correspond one-to-one to wafers 9 of various sizes.

[0059] The chuck base plate 2 is connected to the process chamber of the cleaning equipment (not shown in the figure) through the connecting base plate 1. The multiple clamping components 3 on the chuck base plate 2 are evenly distributed in the circumferential direction. The distance between the clamping part 31 and the center of the chuck base plate 2 is adapted to the radius of the wafer 9, and can flexibly and reliably clamp and fix wafers 9 of different sizes (such as 6-inch and 8-inch wafers 9), thereby achieving compatibility with wafers 9 of different specifications, thereby overcoming the cumbersome operation of frequently replacing the wafer 9 carrying chuck in the prior art. Since there is no need to replace the chuck, the risk of particle contamination inside the equipment is reduced, and the cleanliness of the equipment is maintained.

[0060] It should be noted that the wafer carrying and clamping device is applicable to various types of cleaning equipment in the semiconductor manufacturing process. The functions of these cleaning equipment include but are not limited to pre-diffusion cleaning, post-etching cleaning, post-ion implantation cleaning, degumming cleaning, pre-filming / post-filming cleaning, and post-mechanical polishing cleaning.

[0061] In some embodiments, the wafer carrying and clamping device is not only suitable for SiC wafers, but can also be used for cleaning processing of single crystal silicon wafers, sapphire, gallium nitride, gallium oxide and other material wafers as well as quartz plates.

[0062] The cleaning device is not shown in the figure, and the connection method between the cleaning device and the wafer carrying and clamping device (connecting base plate 1) is the same as the connection method between the cleaning device and the wafer carrying chuck in the prior art.

[0063] refer to Figure 3-7 The clamping portion 31 includes a dynamic clamping jaw 311 connected to the chuck base plate 2 and a plurality of static clamping jaws 312 connected to the chuck base plate 2, the static clamping jaw 312 includes a first support member 3121 connected to the chuck base plate 2 and a first limit block 3122 connected to the first support member 3121, a first support surface 3121a for supporting the edge of the wafer 9 is formed on the side of the first support member 3121 away from the chuck base plate 2, and the first limit block 3122 is connected to the first support surface 3121a, and the plurality of first limit blocks 3122 of the same clamping assembly 3 form a limit circle, and the radius of the limit circle is greater than the radius of the wafer 9 clamped by the clamping assembly 3;

[0064] refer to Fig. 22 and Fig.24The movable clamping jaw 311 includes a second supporting member 3111 rotatably connected to the chuck base plate 2 and a second limiting block 3112 connected to the second supporting member 3111. A second supporting surface 3111a is formed on the side of the second supporting member 3111 away from the chuck base plate 2, and the second limiting block 3112 is connected to the second supporting surface 3111a. The connecting base plate 1 is connected to a driving assembly for driving the second supporting member 3111 to rotate around the rotating shaft 314. The second limiting block 3112 is located on one side of the central axis of the rotating shaft 314. The driving assembly is used to drive the second limiting block 3112 to rotate around the rotating shaft 314 to abut against the side wall of the wafer 9.

[0065] The multiple first supporting surfaces 3121a of the same clamping assembly 3 are all coplanar, and the first limiting block 3122 and the second limiting block 3112 of one of the two adjacent clamping assemblies 3 close to the center of the chuck base plate 2 are lower than the first supporting surface 3121a of the other one.

[0066] When the clamping assembly 3 clamps the wafer 9, the mechanical claws clamp the wafer 9 and transfer it from the previous station to the cleaning chamber of the cleaning equipment, and place the wafer 9 on the corresponding clamping assembly 3 according to the radius of the wafer 9. Specifically, the edge of the wafer 9 is placed on the first supporting surface 3121a of the multiple static clamping jaws 312 of the same clamping assembly 3, and the multiple first limiting blocks 3122 of these static clamping jaws 312 form a limiting circle, and the radius of the limiting circle is greater than the radius of the wafer 9. In this way, the multiple first limiting blocks 3122 roughly position the wafer 9, that is, the wafer 9 is roughly positioned. The wafer 9 is limited within the range of the limit circle, which is convenient for the subsequent clamping of the dynamic clamping jaw 311 and the precise placement of the wafer by the mechanical claw; after the rough positioning is completed, the driving component drives the multiple second support members 3111 to rotate around the rotating shaft 314, so that the second limit block 3112 rotates and rests against the side wall of the wafer 9. Through the cooperation of the dynamic clamping jaw 311 and the static clamping jaw 312, the wafer 9 is clamped on the clamping assembly 3 to prevent relative sliding between the wafer 9 and the clamping part 31 during the cleaning process, especially in the high friction or high-speed rotation steps involved in the cleaning, the stability of the wafer 9 needs to be ensured.

[0067] The multiple first supporting surfaces 3121a of the same clamping component 3 are all coplanar, providing uniform supporting force for the wafer 9, dispersing the weight of the wafer 9, preventing stress concentration, and reducing the risk of breakage; in addition, the first limit block 3122 or the second limit block 3112 of one of the two adjacent clamping components 3 close to the center of the chuck base plate 2 is lower than the first supporting surface 3121a of the other, so as to avoid the inner clamping component 3 from interfering with the wafer 9 clamped by the outer clamping component 3 in space; the mechanical claw is a prior art, which clamps the wafer 9 and smoothly sends it into the clamping component 3 in the process chamber.

[0068] In some embodiments, the second support surface 3111a of the same clamping assembly 3 can be lower than the first support surface 3121a; the clamping portion 31 can include a dynamic clamping jaw 311 and two static clamping jaws 312, the two static clamping jaws 312 are located on both sides of the dynamic clamping jaw 311, the dynamic clamping jaw 311 and the two static clamping jaws 312 are arranged along the circumferential direction of the chuck base plate 2, and the same clamping assembly 3 includes four clamping portions 31, and the angle between adjacent clamping portions 31 is 90°.

[0069] In some embodiments, the number of dynamic jaws 311 and static jaws 312 and the arrangement angle between the dynamic jaws 311 and static jaws 312 can be determined according to the specific clamping conditions of the wafer.

[0070] The connecting line of the clamping parts 31 in two adjacent clamping assemblies 3 passes through the center of the chuck bottom plate 2, and the multiple clamping parts 31 of the two clamping assemblies 3 correspond to each other. In this way, the connecting lines of the clamping parts 31 at corresponding positions of the multiple clamping assemblies 3 are collinear and all pass through the center of the chuck bottom plate 2, and the clamping parts 31 of the clamping assemblies 3 are not staggered, so that a gap is formed between adjacent clamping parts 31 of the same clamping assembly 3, which is convenient for the mechanical claw to grasp the wafer 9.

[0071] refer to Figure 4-15 and Fig. 20 The driving assembly includes a motor 7 connected to the connecting base plate 1, a rotating driving wheel 4 rotatably connected to the output shaft of the motor 7 through a first bearing 71, a plurality of elastic parts 6 connected between the rotating driving wheel 4 and the chuck base plate 2 and used to make the second limit block 3112 press against the side wall of the wafer 9 through elastic force, and a plurality of driving parts 5 connected between the rotating driving wheel 4 and the chuck base plate 2 and used to cooperate with the motor 7 to overcome the elastic force of the elastic part 6 to make the second limit block 3112 separate from the wafer 9. The chuck base plate 2 is connected to the output shaft of the motor 7, the connecting base plate 1 is connected to a sealing plate 12 through a plurality of vertical rods 11, the sealing plate 12 is provided with a makeshift through hole for cooperating with the output shaft of the motor 7, the chuck base plate 2 is integrally formed with a side plate 21 sleeved on the sealing plate 12, and the side plate 21, the chuck base plate 2 and the sealing plate 12 form a accommodating cavity for accommodating the rotating driving wheel 4.

[0072] The elastic part 6 makes the multiple second limit blocks 3112 press against the side wall of the wafer 9, so that the clamping assembly 3 clamps the wafer 9. When the wafer 9 needs to be replaced or removed, the motor 7 drives the driving part 5, so that the second limit blocks 3112 overcome the elastic force of the elastic part 6 and break away from the wafer 9. In this way, the pressing state of the second limit blocks 3112 against the wafer 9 can be released; in addition, the sealing plate 12, the chuck base plate 2 and the side plate 21 form a accommodating cavity for accommodating the rotating driving wheel 4. The accommodating cavity is a sealed cavity, which can effectively prevent external particles, liquids or other contaminants from entering the cavity, thereby ensuring the long-term stable operation of the driving assembly and the rotating driving wheel 4.

[0073] The first support member 3121 is connected to a connecting column 3123, and the chuck bottom plate 2 is provided with a plurality of first through holes 22 for penetrating the connecting column 3123. One end of the connecting column 3123 away from the first support member 3121 penetrates into the accommodating cavity, and the penetrated end is threadedly connected with a limiting nut pressed against the chuck bottom plate 2. The plurality of connecting columns 3123 correspond to the plurality of first through holes 22 one by one, and the chuck bottom plate 2 is provided with a plurality of second through holes 23, and the plurality of second through holes 23 correspond to the plurality of movable jaws 311 one by one.

[0074] The driving part 5 includes two driving members 51, two first driving plates 52 and a second driving plate 53. The two driving members 51 are respectively connected to the movable clamping claws 311 of the two adjacent clamping assemblies 3, and the driving member 51 is penetrated in the second through hole 23. The end of the driving member 51 away from the driving member 51 penetrates into the accommodating cavity, and the penetrated end is rotatably connected to one end of the first driving plate 52. The two driving members 51 correspond to the two first driving plates 52 one by one. The two ends of the second driving plate 53 are respectively rotatably connected to the ends of the two first driving plates 52 away from the driving members 51. The second driving plate 53 is connected to a guide rod 531, and the guide rod 531 is away from the second driving plate 53. One end of the second bearing 532 is connected, the rotating driving wheel 4 is provided with a guide groove 41, the outer ring of the second bearing 532 abuts against the groove wall of the guide groove 41, and one end of the guide groove 41 gradually extends from the center of the rotating driving wheel 4 to the edge of the rotating driving wheel 4. The sealing plate 12 is connected to a plurality of cylinders 8 on the side away from the accommodating cavity, and the sealing plate 12 is provided with an avoidance hole connected to the accommodating cavity and used for the output shaft of the cylinder 8 to extend into the accommodating cavity. The rotating driving wheel 4 is connected to a plurality of limiting portions 43 that match the output shaft of the cylinder 8, and the limiting portion 43 is provided with a limiting hole that matches the output shaft of the cylinder 8, and the plurality of cylinders 8 and the plurality of limiting portions 43 correspond one to one;

[0075] The elastic part 6 includes an elastic member 61 connected to the chuck base plate 2 at one end and to the rotating driving wheel 4 at the other end, and a limiting member 62 connected to the rotating driving wheel 4 and abutting against the chuck base plate 2. The limiting member 62 abuts against the chuck base plate 2 to keep the elastic member 61 in a tensioned state, and the second limiting block 3112 abuts against the edge of the wafer 9.

[0076] When it is necessary to release the restrictions of multiple second limit blocks 3112 on the wafer 9, the control system controls the motor 7 to work, and the motor 7 drives the chuck base plate 2 to rotate. The two driving members 51 are respectively connected to the two movable clamping jaws 311, and the driving member 51 is penetrated into the second through hole 23. In this way, the rotation of the chuck base plate 2 will drive the two movable clamping jaws 311 to rotate together with the driving member 51. The two driving members 51 are respectively connected to the two first driving plates 52, and the second driving plate 53 is rotatably connected between the two first driving plates 52, so that the two first driving plates 52 and the second driving plates 53 form a connecting rod structure, wherein the second bearing 532 connected to the second driving plate 53 is embedded in the guide groove 41. Since the rotating driving wheel 4 is rotatably connected to the output shaft of the motor 7 through the first bearing 71, the rotating driving wheel 4 does not rotate with the drive of the motor 7, and then the output shaft of the cylinder 8 is controlled by the control system to extend and insert into the limiting hole of the limiting portion 43, thereby limiting The rotation of the rotating driving wheel 4 is controlled, so that the chuck base plate 2 can rotate relative to the rotating driving wheel 4, and one end of the guide groove 41 gradually extends from the center of the rotating driving wheel 4 to the edge of the rotating driving wheel 4. When the chuck base plate 2 rotates with the entire connecting rod structure, the second driving plate 53 rotates with the guide rod 531 and the second bearing 532. Due to the directional restriction of the guide groove 41 on the guide rod 531 and the second bearing 532, the second driving plate 53 rotates with the chuck base plate 2, and the second driving plate 53 gradually moves from the center of the rotating driving wheel 4 toward the edge of the rotating driving wheel 4. In this process, the motor 7 rotates to overcome the elastic force of the elastic part 6, so that the connecting rod structure is "deformed", that is, the second driving plate 53 pushes the two first driving plates 52 and the driving member 51 to rotate around the rotating shaft 314 (the central axis of the second through hole 23), so that the second limit block 3112 of the movable clamp 311 is separated from the wafer 9. Fig.12 The cc direction is the movement direction of the second driving plate 53, and the two first driving plates 52 swing to drive the two driving members 51 to rotate; when the motor 7 stops working, the elastic member 61 of the elastic part 6 makes the chuck base plate 2 rotate (previously, the motor 7 drives the elastic part 6 (spring) to be tensioned and stretched, that is, the driving part 5 overcomes the elastic force of the elastic member 61), returns to the initial position, and the second limit block 3112 rotates again to press against the wafer 9. At this time, a force balance state is formed between the elastic member 61 and the limit member 62, and the wafer 9 is in a clamped state.

[0077] It should be noted that the motor 7 only rotates in one direction, that is, the motor 7 releases the restriction of the multiple second limit blocks 3112 on the wafer 9 through the driving part 5. When the motor 7 stops working, the elastic part 6 returns to the initial position, and the multiple second limit blocks 3112 re-clamp the wafer 9; in addition, the control system can be a controller of the cleaning equipment, or it can be a controller independently set up for the wafer carrying and clamping device, and the control system can be remotely controlled.

[0078] refer to Figure 4 , Figure 6 , Figure 8 , Fig.16 , Fig.17 , Fig.18 , Fig.19 The rotating driving wheel 4 is integrally formed with a plurality of auxiliary parts 42, one end of the auxiliary part 42 extends to the edge of the rotating driving wheel 4, the side plate 21 is integrally formed with a plurality of third limit blocks 24, the plurality of auxiliary parts 42 and the plurality of third limit blocks 24 correspond one to one, the limit part 62 is threadedly connected to the portion of the auxiliary part 42 extending out of the rotating driving wheel 4 through a connecting rod 621, and the side of the limit part 62 away from the connecting rod 621 abuts against the third limit block 24.

[0079] One end of the limit member 62 is connected to the auxiliary member 42, and the other end rests on the third limit block 24, forming a force balance between the limit member 62 and the elastic member 61, and the limit member 62 is threadedly connected to the auxiliary member 42 through the connecting rod 621. In this way, by rotating the limit member 62, the distance between the limit member 62 and the auxiliary member 42 can be adjusted, and then the elastic force of the elastic member 61 and the relative position between the rotating drive wheel 4 and the chuck base plate 2 are adjusted, so that the connecting rod structure produces corresponding deformation, and then the degree to which the second limit block 3112 presses against the wafer 9 can be fine-tuned, especially for some thicker wafers 9, the degree to which the wafer 9 is pressed can be increased, and the clamping friction can be increased. The larger friction can ensure the stability of the wafer 9 during cleaning or processing, and avoid movement or damage of the wafer 9 due to relative sliding or vibration.

[0080] One end of the elastic member 61 is connected to the support rod 611 , and the other end is connected to the auxiliary member 42 . The support rod 611 is connected to the chuck base plate 2 . The elastic member 61 is not shown in some figures.

[0081] The elastic member 61 is a spring, the auxiliary member 42 is connected to a first magnetic member 63 , and the chuck base plate 2 is connected to a second magnetic member 64 , so that a magnetic attraction force cooperating with the spring is generated between the second magnetic member 64 and the first magnetic member 63 .

[0082] Due to the characteristics of the spring, the greater the degree of tension, the greater the elastic force, and it does not change linearly. This means that when the motor 7 overcomes the elastic force of the spring, the resistance of the motor 7 will become larger and larger. Therefore, the magnetic force generated between the second magnetic component 64 and the first magnetic component 63 is used as a supplement to the elastic force of the spring, that is, the magnetic force, the elastic force of the spring and the limit component 62 together form a force equilibrium state. The characteristic of the magnetic force is that when the second magnetic component 64 rotates out of the effective magnetic force range of the first magnetic component 63, the magnetic force decays rapidly, thereby reducing the load of the motor 7 to overcome the spring.

[0083] The first magnetic member 63 and the second magnetic member 64 are both annular permanent magnets, and their central axes are parallel. When the second limit block 3112 is pressed against the edge of the wafer 9, the central axis of the second magnetic member 64 is located on the side of the central axis of the first magnetic member 63 close to the spring.

[0084] When the elastic part is in a force-balanced state, the second magnetic member 64 and the first magnetic member 63 are not aligned, but are somewhat offset in position, such as Fig.25 As shown, the area where the magnetic field lines of the second magnetic attraction member 64 are densely packed and the area where the magnetic field lines of the first magnetic attraction member 63 are densely packed overlap each other, and the magnetic attraction force of this arrangement is the strongest.

[0085] In some embodiments, the first magnetic member 63 and the second magnetic member 64 may be electromagnets.

[0086] refer to Figure 20-24 The driving member 51 includes a shaft seat 511 connected to the first driving plate 52 and a core shaft 512 connected to the shaft seat 511. The chuck base plate 2 is connected to a limiting sleeve 231 matching the second through hole 23 at the second through hole 23. The second support member 3111 is integrally formed with a first connecting member 3113 for passing through the limiting sleeve 231 and the second through hole 23 on the side away from the second limiting block 3112. The second support member 3111 is integrally formed with a sleeve plate 3114 on the side away from the second limiting block 3112. An annular groove 3115 for clamping the limiting sleeve 231 is formed between the sleeve plate 3114 and the first connecting member 3113. The core shaft 512 is connected to the first connecting member 3113 through a rotating shaft 314. The second driving plate 53 pushes the first driving plate 52 to rotate, and the first driving plate 52 rotates with the shaft seat 511 and the core shaft 512, and the core shaft 512 then drives the second support member 3111 and the second limit block 3112 to rotate through the rotating shaft 314, wherein the limit sleeve 231 can limit the rotation of the core shaft 512, thereby avoiding inaccurate positioning due to unstable rotation or potential damage to the wafer 9.

[0087] The core shaft 512 is provided with a threaded hole passing through it, and the first connecting member 3113 is provided with a first accommodating groove 3113a at one end away from the second supporting member 3111 for embedding the end of the core shaft 512, and the bottom of the first accommodating groove 3113a is provided with a threaded blind hole 3113b matching the threaded hole, and the rotating shaft 314 is a screw that is sequentially penetrated through the threaded hole and the threaded blind hole 3113b.

[0088] The thread direction of the screw is opposite to the rotation direction of the chuck base plate 2 , so that the screw can be prevented from being loosened or even falling off due to the reaction force generated by the rotation during the rotation of the chuck base plate 2 .

[0089] The shaft seat 511 is provided with a second receiving groove 5111 for receiving one end of the mandrel 512, and a receiving hole communicating with the second receiving groove 5111 and for receiving a nut of a screw is provided on one side of the shaft seat 511. A first limiting plane 5121 matching the groove wall of the first receiving groove 3113a is formed on the outer wall of one end of the mandrel 512, and a second limiting plane 5122 matching the groove wall of the second receiving groove 5111 is formed on the outer wall of the other end of the mandrel 512. The first limiting plane 5121 and the second limiting plane 5122 are formed by a milling process, which can prevent the mandrel 512 from rotating relative to the shaft seat 511 and the first connecting member 3113.

[0090] The driving member 51 further includes a positioning sleeve 313 sleeved on the mandrel 512, the positioning sleeve 313 is connected to two wing plates 3131 connected to the chuck bottom plate 2 through fasteners, and a plurality of third bearings 513 are arranged between the inner wall of the positioning sleeve 313 and the outer wall of the mandrel 512. The third bearings 513 can limit the rotation of the mandrel 512 to avoid shaking, and improve the control accuracy of the second limit block 3112 pressing tightly.

[0091] In some embodiments, the first connecting member 3113 may also be connected to a limiting ring 3116 that abuts against the third bearing 513 , so as to prevent the plurality of third bearings 513 from moving in the circumferential direction.

[0092] The present application also discloses a wafer cleaning device, comprising the wafer carrying and clamping device as described above.

[0093] The technical features of the above embodiments may be arbitrarily combined (as long as there is no contradiction in the combination of these technical features). To make the description concise, not all possible combinations of the technical features in the above embodiments are described; these embodiments that are not explicitly written should also be considered to be within the scope of this specification.

[0094] The above is a relatively specific and detailed description of the present application through general description and specific embodiments. It should be understood that, based on the technical concept of the present application, several conventional adjustments or further innovations can be made to these specific embodiments; however, as long as they do not deviate from the technical concept of the present application, the technical solutions obtained by these conventional adjustments or further innovations also fall within the scope of protection of the claims of the present application.

Claims

1. A wafer carrying and clamping device, characterized in that: The invention comprises a connection base plate connected to a process chamber of a cleaning device, a chuck base plate connected to the connection base plate, and a plurality of clamping assemblies connected to a side of the chuck base plate away from the connection base plate, wherein the clamping assemblies comprise a plurality of clamping parts uniformly connected to the chuck base plate along a circumferential direction of the chuck base plate and used for clamping a wafer, and the distance between the clamping part of the clamping assembly and the center of the chuck base plate is adapted to the radius of the wafer, so that the plurality of clamping assemblies correspond one-to-one to wafers of various sizes; The clamping part includes a dynamic clamping jaw connected to the chuck base plate and a plurality of static clamping jaws connected to the chuck base plate, the static clamping jaw includes a first support member connected to the chuck base plate and a first limit block connected to the first support member, a first support surface for supporting the edge of the wafer is formed on a side of the first support member away from the chuck base plate, and the first limit block is connected to the first support surface, and a plurality of first limit blocks of the same clamping assembly form a limit circle, and the radius of the limit circle is greater than the radius of the wafer clamped by the clamping assembly; The movable clamping jaw comprises a second supporting member rotatably connected to the chuck base plate and a second limiting block connected to the second supporting member, a second supporting surface is formed on a side of the second supporting member away from the chuck base plate, and the second limiting block is connected to the second supporting surface, the connecting base plate is connected to a driving assembly for driving the second supporting member to rotate around the rotating axis, the second limiting block is located on one side of the central axis of the rotating axis, and the driving assembly is used to drive the second limiting block to rotate around the rotating axis to abut against the side wall of the wafer; The first supporting surfaces of the same clamping assembly are all coplanar, and the first limiting block and the second limiting block of one of the two adjacent clamping assemblies close to the center of the chuck bottom plate are lower than the first supporting surface of the other one; The drive assembly includes a motor connected to the connecting base plate, a rotating drive wheel rotatably connected to the output shaft of the motor through a first bearing, a plurality of elastic parts connected between the rotating drive wheel and the chuck base plate and used to press the second limit block against the side wall of the wafer through elastic force, and a plurality of driving parts connected between the rotating drive wheel and the chuck base plate and used to cooperate with the motor to overcome the elastic force of the elastic parts to make the second limit block separate from the wafer. The chuck base plate is connected to the output shaft of the motor, the connecting base plate is connected to a sealing plate through a plurality of vertical rods, the sealing plate is provided with a makeshift through hole that cooperates with the output shaft of the motor, and the chuck base plate is integrally formed with a side plate mounted on the sealing plate, and the side plate, the chuck base plate and the sealing plate form a accommodating cavity for accommodating the rotating drive wheel.

2. The wafer carrying and clamping device according to claim 1, characterized in that: A connecting line of the clamping parts in two adjacent clamping assemblies passes through the center of the chuck bottom plate, and the multiple clamping parts of the two clamping assemblies correspond to each other one by one.

3. The wafer carrying and clamping device according to claim 1, characterized in that: The first support member is connected with a connecting column, the chuck bottom plate is provided with a plurality of first through holes for penetrating the connecting column, one end of the connecting column away from the first support member penetrates into the accommodating cavity, and the penetrated end is threadedly connected with a limiting nut tightly pressed against the chuck bottom plate, the plurality of connecting columns correspond to the plurality of first through holes one by one, the chuck bottom plate is provided with a plurality of second through holes, and the plurality of second through holes correspond to the plurality of movable jaws one by one; The driving part includes two driving members, two first driving plates and a second driving plate, the two driving members are respectively connected to the movable jaws of two adjacent clamping assemblies, and the driving member is penetrated by the second through hole, the end of the driving member away from the driving member penetrates into the accommodating cavity, and the penetrated end is rotatably connected to one end of the first driving plate, the two driving members correspond to the two first driving plates one by one, the two ends of the second driving plate are respectively rotatably connected to the ends of the two first driving plates away from the driving members, the second driving plate is connected to a guide rod, and the end of the guide rod away from the second driving plate is connected to the first Second bearing, the rotating drive wheel is provided with a guide groove, the outer ring of the second bearing is against the groove wall of the guide groove, one end of the guide groove gradually extends from the center of the rotating drive wheel to the edge of the rotating drive wheel, a plurality of cylinders are connected to the side of the sealing plate away from the accommodating cavity, and the sealing plate is provided with an avoidance hole connected to the accommodating cavity and used for the output shaft of the cylinder to extend into the accommodating cavity, the rotating drive wheel is connected with a plurality of limiting parts matching the output shaft of the cylinder, the limiting part is provided with a limiting hole matching the output shaft of the cylinder, and the plurality of cylinders and the plurality of limiting parts correspond to each other one by one; The elastic part includes an elastic member connected to the chuck base plate at one end and to the rotating drive wheel at the other end, and a limiting member connected to the rotating drive wheel and abutting against the chuck base plate, the limiting member abuts against the chuck base plate to keep the elastic member in a tensioned state, and the second limiting block abuts against the edge of the wafer.

4. The wafer carrying and clamping device according to claim 3, characterized in that: The rotating driving wheel is integrally formed with a plurality of auxiliary parts, one end of the auxiliary part extends to the edge of the rotating driving wheel, the side panel is integrally formed with a plurality of third limit blocks, the plurality of auxiliary parts and the plurality of third limit blocks correspond one to one, the limit part is threadedly connected to the part of the auxiliary part extending out of the rotating driving wheel through a connecting rod, and the side of the limit part away from the connecting rod abuts against the third limit block.

5. The wafer carrying and clamping device according to claim 4, characterized in that: The elastic member is a spring, the auxiliary member is connected to a first magnetic member, and the chuck base plate is connected to a second magnetic member, so that a magnetic attraction force cooperating with the spring is generated between the second magnetic member and the first magnetic member.

6. The wafer carrying and clamping device according to claim 5, characterized in that: The first magnetic member and the second magnetic member are both annular permanent magnets, and their central axes are parallel. When the second limit block is pressed against the edge of the wafer, the central axis of the second magnetic member is located on the side of the central axis of the first magnetic member close to the spring.

7. The wafer carrying and clamping device according to claim 3, characterized in that: The driving member includes an axle seat connected to the first driving plate and a core shaft connected to the axle seat, the chuck base plate is connected to a limit sleeve matching the second through hole at the second through hole, the second support member is integrally formed with a first connecting member for passing through the limit sleeve and the second through hole on the side away from the second limit block, the second support member is integrally formed with a sleeve plate on the side away from the second limit block, an annular groove for clamping the limit sleeve is formed between the sleeve plate and the first connecting member, and the core shaft is connected to the first connecting member through a rotating shaft.

8. The wafer carrying and clamping device according to claim 7, characterized in that: The core shaft is provided with a threaded hole passing through it, and the first connecting member is provided with a first receiving groove for embedding the end of the core shaft at one end away from the second supporting member, and the bottom of the first receiving groove is provided with a threaded blind hole matching the threaded hole, and the rotating shaft is a screw that is sequentially passed through the threaded hole and the threaded blind hole.

9. The wafer carrying and clamping device according to claim 8, characterized in that: The shaft seat is provided with a second receiving groove for accommodating one end of the core shaft, and one side of the shaft seat is provided with a receiving hole connected to the second receiving groove and used to accommodate the nut of the screw, the outer wall of one end of the core shaft is formed with a first limiting plane that matches the groove wall of the first receiving groove, and the outer wall of the other end of the core shaft is formed with a second limiting plane that matches the groove wall of the second receiving groove.

10. The wafer carrying and clamping device according to claim 7, characterized in that: The driving member also includes a positioning sleeve sleeved on the core shaft, the positioning sleeve is connected to two wing plates connected to the chuck base plate through fasteners, and a plurality of third bearings are arranged between the inner wall of the positioning sleeve and the outer wall of the core shaft.

11. A wafer cleaning device, characterized in that: A wafer carrying and clamping device comprising any one of claims 1-10.

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