Multi-chip stacking packaging structure

Abstract

The present invention belongs to the field of chip packaging technology, and discloses a multi-chip stacking packaging structure, and its technical key points are: it includes a substrate, a packaging shell is arranged on the surface of the substrate, and multiple groups of chips are arranged in the packaging shell, two groups of slides are opened on the surface of the substrate, and multiple groups of sliding blocks are slidably installed in the slides, and the bottom wall of the slide is provided with a positioning component that cooperates with the sliding blocks, and two groups of sliding blocks relatively distributed in the two groups of slides are commonly connected with a protective mechanism that cooperates with the packaging shell, and the protective mechanism includes a protective rod, a flip component and an adjustment component. The adjustment component includes a clamping part and a control part, and the position and angle of multiple groups of protective rods can be conveniently adjusted on the surface of the substrate by arranging the adjustment component composed of the clamping part and the control part to cooperate with the flip component, so that the position and angle of the multiple groups of protective rods can be conveniently adjusted on the surface of the substrate, and then the packaging shell can be supported and protected in all directions on the outside of the packaging shell, and the packaging shell and the internal chips can be effectively prevented from being squeezed and damaged.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, in particular to a multi-chip stacking packaging structure. Background Art

[0002] In order to significantly improve the performance and functionality of the chip and reduce the size and power consumption of the chip, the current chip packaging can adopt the chip stacking process, which is basically consistent with the current 3D packaging process. Its essence is to stack multiple chips in a vertical direction and then connect them through micro-arc welding or bonding technology to form an integrated structure.

[0003] When the packaging structure is in use, the packaging shell usually only seals and protects the internal stacked chip layers. However, the existing packaging structure lacks necessary protection measures. Since the chip is thin and the chip rigidity is low, when the packaging shell is under pressure, the stress concentration of the chip inside is easy to cause the chip to deform or even be damaged, affecting the quality of the chip. Summary of the invention

[0004] The object of the present invention is to provide a multi-chip stacking packaging structure to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A multi-chip stacking packaging structure includes a substrate, a packaging shell is arranged on the surface of the substrate, a plurality of groups of chips are arranged in the packaging shell, an assembly gasket that cooperates with the chips is arranged on the top wall of the packaging shell, and a pin extending to the outside of the packaging shell is arranged on the side wall of the assembly gasket, two groups of slides are opened on the surface of the substrate, the two groups of slides are relatively distributed on both sides of the packaging shell, a plurality of groups of sliding blocks are slidably installed in the slides, a positioning component that cooperates with the sliding block is arranged on the bottom wall of the slide, and the positioning component is used to fix the position of the sliding block in the slide, and the two groups of sliding blocks relatively distributed in the two groups of slides are commonly connected to a protective mechanism that cooperates with the packaging shell, and the protective mechanism includes a protective A guard rod, a flip assembly and an adjustment assembly, wherein the guard rod is an inverted U-shaped structure, the flip assembly is located in the sliding block and connected to the end of the guard rod, the flip assembly is used to adjust the position of the guard rod on the surface of the substrate, when the guard rod is located on both sides of the packaging shell, the flip assembly is used to control the guard rod to maintain a horizontal state inside the substrate, when the guard rod is sleeved on the top of the packaging shell, the flip assembly is used to control the guard rod to maintain a vertical state on the surface of the substrate, the adjustment assembly includes a clamping part and a control part, the clamping part is located in the sliding block and connected to the flip assembly, the control part is located on the surface of the sliding block and connected to the clamping part, and the control part adjusts the flip assembly by cooperating with the clamping part.

[0007] As a further solution of the present invention: the positioning assembly includes a plurality of groups of parallel vertical grooves opened downward from the bottom wall of the slide, the bottom wall of the vertical groove is fixedly installed with an extrusion spring, the telescopic end of the extrusion spring is fixedly installed with a positioning column, one end of the positioning column is provided with a hemispherical structure and extends to the outside of the vertical groove, and the bottom wall of the sliding block is provided with a positioning groove that cooperates with the positioning column.

[0008] As a further solution of the present invention: the flip assembly includes a cavity opened on the surface of the sliding block, a carrying plate is rotatably installed in the cavity, both ends of the protective rod extend into the cavity respectively and are fixedly connected to the annular side wall of the carrying plate, and a plurality of groups of transverse grooves cooperating with the protective rods are opened on the surface of the substrate, and the transverse grooves are connected to the slideway.

[0009] As a further solution of the present invention: the clamping portion includes a receiving groove opened on the side wall of the cavity, and the side wall of the supporting plate is provided with multiple groups of limiting holes distributed in a ring shape, and a limiting column cooperating with the limiting hole is slidably installed in the receiving groove, and a reset spring is fixedly installed in the receiving groove, and the telescopic end of the reset spring is connected to the limiting column.

[0010] As a further solution of the present invention: the control part includes a control cavity located outside the storage groove and opened downward from the top wall of the sliding block, a vertical rod is slidably installed in the control cavity along the vertical direction, a top plate is fixedly installed on the top of the vertical rod, a control spring is fixedly installed in the control cavity, the telescopic end of the control spring is connected to the top plate, a pulling rope is fixedly installed on one end of the limit column located in the storage groove, and the pulling rope extends into the control cavity at one end away from the limit column and is connected to the side wall of the vertical rod.

[0011] As a further solution of the present invention: the side wall of the slideway is provided with a guide groove, the side wall of the sliding block is fixedly provided with a guide block slidably connected to the guide groove, a guide rod is fixedly provided in the guide groove, and the guide rod is slidably connected to the guide block.

[0012] As a further solution of the present invention: a handle is fixedly installed in the middle of the protection rod.

[0013] Compared with the prior art, the beneficial effect of the present invention is that by setting the adjustment component composed of the clamping part and the control part to cooperate with the flip component, the position and angle of multiple groups of protection rods can be conveniently adjusted on the surface of the substrate, and then the package shell can be supported and protected in all directions on the outside, effectively preventing the package shell and the chip inside from being squeezed and damaged. The problem that the current package structure lacks necessary protective measures and the stress concentration of the chip inside the package shell when it is under pressure is easily caused to cause deformation or even damage of the chip, affecting the quality of chip use. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1It is a schematic diagram of the three-dimensional structure of a multi-chip stacking packaging structure provided in an embodiment of the present invention.

[0015] Figure 2 It is a schematic diagram of the front view of a multi-chip stacking packaging structure provided in an embodiment of the present invention.

[0016] Figure 3 It is a schematic diagram of a sliding block and its connection structure in a multi-chip stacking packaging structure provided in an embodiment of the present invention.

[0017] Figure 4 It is a schematic diagram of a carrier plate and its connection structure in a multi-chip stacking packaging structure provided in an embodiment of the present invention.

[0018] Figure 5 The figure is a schematic diagram of a protection bar and its connection structure in a multi-chip stacking packaging structure provided in an embodiment of the present invention.

[0019] Wherein: 1-substrate, 2-packaging shell, 21-chip, 22-assembly gasket, 23-pin, 3-slide, 4-sliding block, 5-positioning component, 51-vertical groove, 52-extrusion spring, 53-positioning column, 54-positioning groove, 6-protection mechanism, 61-protection rod, 62-flip assembly, 621-cavity, 622-carrying plate, 623-horizontal groove, 63-adjustment component, 631-clamping part, 6311-storage groove, 6312-reset spring, 6313-limiting column, 6314-limiting hole, 632-control part, 6321-control cavity, 6322-vertical rod, 6323-pulling rope, 6324-top plate, 6325-control spring, 7-guide groove, 8-guide block, 9-guide rod, 10-handle. DETAILED DESCRIPTION

[0020] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0021] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0022] like Figure 1 , Figure 2 , Figure 3As shown, it is a structural diagram of a multi-chip stacking packaging structure provided by an embodiment of the present invention, comprising a substrate 1, a packaging shell 2 is arranged on the surface of the substrate 1, a plurality of groups of chips 21 are arranged in the packaging shell 2, an assembly gasket 22 cooperating with the chip 21 is arranged on the top wall of the packaging shell 2, a pin 23 extending to the outside of the packaging shell 2 is arranged on the side wall of the assembly gasket 22, two groups of slideways 3 are opened on the surface of the substrate 1, the two groups of slideways 3 are relatively distributed on both sides of the packaging shell 2, a plurality of groups of sliding blocks 4 are slidably installed in the slideways 3, a positioning component 5 cooperating with the sliding block 4 is arranged on the bottom wall of the slideway 3, the positioning component 5 is used to fix the position of the sliding block 4 in the slideway 3, the two groups of sliding blocks 4 relatively distributed in the two groups of slideways 3 are commonly connected to a protective mechanism 6 cooperating with the packaging shell 2, the protective mechanism 6 includes a protective rod 61, The flip assembly 62 and the adjustment assembly 63, the protective rod 61 is an inverted U-shaped structure, the flip assembly 62 is located in the sliding block 4 and is connected to the end of the protective rod 61, the flip assembly 62 is used to adjust the position of the protective rod 61 on the surface of the substrate 1, when the protective rod 61 is located on both sides of the packaging shell 2, the flip assembly 62 is used to control the protective rod 61 to maintain a horizontal state inside the substrate 1, when the protective rod 61 is sleeved on the top of the packaging shell 2, the flip assembly 62 is used to control the protective rod 61 to maintain a vertical state on the surface of the substrate, the adjustment assembly 63 includes a clamping portion 631 and a control portion 632, the clamping portion 631 is located in the sliding block 4 and is connected to the flip assembly 62, the control portion 632 is located on the surface of the sliding block 4 and is connected to the clamping portion 631, and the control portion 632 adjusts the flip assembly 62 by cooperating with the clamping portion 631.

[0023] Initially, the clamping portion 631 and the flip assembly 62 cooperate with each other to position the multiple groups of protection rods 61, so that the multiple groups of protection rods 61 are in a horizontal state as a whole and are inside the substrate 1, which is convenient for batches of substrates 1 to be stacked and placed. When installed and used, multiple groups of chips 21 are stacked on the surface of the substrate 1, and the packaging shell 2 is put on the outside. After the packaging shell 2 is installed, the control portion 632, the clamping portion 631 and the flip assembly 62 cooperate with each other to control the multiple groups of protection rods 61 to rotate to a vertical state on the surface of the substrate 1. After the protection rods 61 rotate to a vertical state on the surface of the substrate 1, the sliding block 4 is pushed. When the protective rod 61 moves in the slide 3, the sliding blocks 4 on both sides cooperate with each other to push the protective rod 61 to move synchronously to the top of the packaging shell 2. After the sliding block 4 moves to the corresponding position in the slide 3, the positioning component 5 fixes the position of the sliding block 4 in the slide 3 and then synchronously positions the protective rod 61. At this time, multiple groups of protective rods 61 are sleeved on the outside of the packaging shell 2. The protective rods 61 can provide all-round protection for the packaging shell 2 and the chip 21 inside. When subjected to external extrusion, the multiple groups of protective rods 61 can support and resist the external extrusion force, effectively preventing the packaging shell 2 and the chip 21 from being squeezed.

[0024] like Figure 1 , Figure 3 As shown, as a preferred embodiment of the present invention, the positioning assembly 5 includes a plurality of groups of parallel vertical grooves 51 opened downwardly from the bottom wall of the slide 3, the bottom wall of the vertical groove 51 is fixedly installed with an extrusion spring 52, the telescopic end of the extrusion spring 52 is fixedly installed with a positioning column 53, one end of the positioning column 53 is provided with a hemispherical structure and extends to the outside of the vertical groove 51, and the bottom wall of the sliding block 4 is provided with a positioning groove 54 that cooperates with the positioning column 53.

[0025] Initially, the sliding block 4 is on both sides of the slide 3. At this time, the protective rod 61 is horizontally located inside the base plate 1. After the protective rod 61 rotates to a vertical state, the sliding block 4 is pushed to move in the slide 3. The sliding block 4 moves to squeeze the positioning column 53, and then squeezes the positioning column 53 into the vertical groove 51. After the sliding block 4 moves to the corresponding position, the extrusion spring 52 applies a thrust to the positioning column 53, and the positioning column 53 is inserted into the positioning groove 54 on the bottom wall of the sliding block 4. The positioning column 53 cooperates with the positioning groove 54, and the position of the sliding block 4 can be conveniently fixed in the slide 3, and then the position of the protective rod 61 can be synchronously positioned above the packaging shell 2.

[0026] like Figure 1 , Figure 3 , Figure 4 , Figure 5As shown, as a preferred embodiment of the present invention, the flip assembly 62 includes a cavity 621 opened on the surface of the sliding block 4, and a supporting plate 622 is rotatably installed in the cavity 621. The two ends of the protective rod 61 respectively extend into the cavity 621 and are fixedly connected to the annular side wall of the supporting plate 622. A plurality of transverse grooves 623 cooperating with the protective rod 61 are opened on the surface of the substrate 1, and the transverse grooves 623 are connected to the slide 3.

[0027] Initially, the protective rod 61 is in a horizontal state in the transverse groove 623. At this time, the clamping part 631 fixes the position of the carrier plate 622 in the cavity 621. When the packaging shell 2 needs to be protected, the clamping part 631 releases the restriction on the carrier plate 622 in the cavity 621, and the carrier plate 622 can rotate freely in the cavity 621, so that the protective rod 61 can be easily pulled out from the transverse groove 623. After the protective rod 61 rotates to a vertical state, the control part 632 cooperates with the clamping part 631 to fix the carrier plate 622 again in the cavity 621. The carrier plates 622 on both sides cooperate with each other, and the position of the protective rod 61 can be easily fixed above the packaging shell 2.

[0028] like Figure 1 , Figure 3 , Figure 4 , Figure 5 As shown, as a preferred embodiment of the present invention, the clamping portion 631 includes a receiving groove 6311 formed on the side wall of the cavity 621, and a plurality of groups of limiting holes 6314 distributed in an annular shape are formed on the side wall of the supporting plate 622, and a limiting column 6313 cooperating with the limiting hole 6314 is slidably installed in the receiving groove 6311, and a reset spring 6312 is fixedly installed in the receiving groove 6311, and the telescopic end of the reset spring 6312 is connected to the limiting column 6313.

[0029] Initially, the return spring 6312 applies a thrust to the limit column 6313, and the limit column 6313 is inserted into the limit hole 6314 on the surface of the carrying plate 622. At this time, the protective rod 61 remains in a horizontal state. When the position of the protective rod 61 needs to be adjusted, the control part 632 pulls the limit column 6313 to move toward the storage groove 6311. At this time, the limit column 6313 is separated from the limit hole 6314, and the carrying plate 622 can rotate freely in the cavity 621, thereby driving the protective rod 61 to rotate synchronously on the surface of the substrate 1. After the protective rod 61 rotates to a vertical state, the return spring 6312 applies a thrust to the limit column 6313, and the limit column 6313 is inserted into the limit hole 6314 at the corresponding position on the surface of the carrying plate 622 again, thereby fixing the position of the carrying plate 622 and the protective rod 61.

[0030] like Figure 1 , Figure 3 , Figure 5 As shown, as a preferred embodiment of the present invention, the control part 632 includes a control cavity 6321 which is opened downward from the top wall of the sliding block 4 and is located outside the receiving groove 6311, a vertical rod 6322 is slidably installed in the control cavity 6321 along the vertical direction, a top plate 6324 is fixedly installed on the top of the vertical rod 6322, a control spring 6325 is fixedly installed in the control cavity 6321, the telescopic end of the control spring 6325 is connected to the top plate 6324, a pulling rope 6323 is fixedly installed at one end of the limiting column 6313 located in the receiving groove 6311, and the pulling rope 6323 extends from one end of the limiting column 6313 to the control cavity 6321 and is connected to the side wall of the vertical rod 6322.

[0031] When the position of the protective rod 61 needs to be adjusted, the top plate 6324 is pressed downward on the surface of the sliding block 4, and the top plate 6324 pushes the vertical rod 6322 to move downward synchronously in the control cavity 6321. When the vertical rod 6322 moves downward, it cooperates with the pulling rope 6323 to pull the limiting column 6313 toward the storage groove 6311. At this time, the limiting column 6313 is separated from the limiting hole 6314, and the supporting plate 622 can rotate freely in the cavity 621, thereby driving the protective rod 61 to rotate synchronously on the surface of the substrate 1.

[0032] like Figure 1 , Figure 3 As shown, as a preferred embodiment of the present invention, the side wall of the slide 3 is provided with a guide groove 7, the side wall of the sliding block 4 is fixedly installed with a guide block 8 slidably connected to the guide groove 7, and a guide rod 9 is fixedly installed in the guide groove 7, and the guide rod 9 is slidably connected to the guide block 8.

[0033] like Figure 5 As shown, as a preferred embodiment of the present invention, a handle 10 is fixedly installed in the middle of the protection rod 61.

[0034] The working principle of the present invention is: initially, the sliding blocks 4 are located on both sides of the slideway 3, and the protective rods 61 are horizontally located inside the substrate 1, which is convenient for stacking and stacking of batches of substrates 1. When installed and used, multiple groups of chips 21 are stacked on the surface of the substrate 1, and the packaging shell 2 is put on the outside.

[0035] After the packaging shell 2 is installed, press the top plate 6324 downward on the surface of the sliding block 4, and the top plate 6324 pushes the vertical rod 6322 to move downward synchronously in the control cavity 6321. When moving downward, the vertical rod 6322 cooperates with the pulling rope 6323 to pull the limiting column 6313 to move toward the storage groove 6311. At this time, the limiting column 6313 is separated from the limiting hole 6314, and the carrying plate 622 can rotate freely in the cavity 621, pulling the protective rod 61 to rotate synchronously on the surface of the substrate 1. After the protective rod 61 rotates to a vertical state, the reset spring 6312 applies a thrust to the limiting column 6313. At this time, the limiting column 6313 is inserted into the limiting hole 6314 at the corresponding position on the surface of the carrying plate 622 again, thereby fixing the position of the carrying plate 622 and the protective rod 61.

[0036] The sliding block 4 is pushed to move in the slide 3. The sliding block 4 moves to squeeze the positioning column 53, and then squeezes the positioning column 53 into the vertical groove 51. After the sliding block 4 moves to the corresponding position, the extrusion spring 52 applies a thrust to the positioning column 53, and the positioning column 53 is inserted into the positioning groove 54 on the bottom wall of the sliding block 4. The positioning column 53 and the positioning groove 54 cooperate with each other, and the position of the sliding block 4 can be conveniently fixed in the slide 3. At this time, multiple groups of protective rods 61 are sleeved on the outside of the packaging shell 2. The protective rods 61 can provide all-round protection for the packaging shell 2 and the chip 21 inside. When subjected to external extrusion, the multiple groups of protective rods 61 can support and resist the external extrusion force, effectively preventing the packaging shell 2 and the chip 21 from being squeezed.

[0037] The preferred embodiments of the present invention are described in detail above, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in this field without departing from the purpose of the present invention.

Claims

1. A multi-chip stacking packaging structure, comprising a substrate, a packaging shell is arranged on the surface of the substrate, a plurality of chips are arranged in the packaging shell, an assembly gasket that cooperates with the chips is arranged on the top wall of the packaging shell, and a pin extending to the outside of the packaging shell is arranged on the side wall of the assembly gasket, characterized in that: The base plate is provided with two groups of slides, and the two groups of slides are relatively distributed on both sides of the packaging shell, and multiple groups of sliding blocks are slidably installed in the slides, and the bottom wall of the slide is provided with a positioning component that cooperates with the sliding block. The positioning component is used to fix the position of the sliding block in the slide, and the positioning component includes multiple groups of vertical grooves distributed in parallel downwardly from the bottom wall of the slide, and an extrusion spring is fixedly installed on the bottom wall of the vertical groove, and a positioning column is fixedly installed on the telescopic end of the extrusion spring, and one end of the positioning column is provided with a hemispherical structure and extends to the outside of the vertical groove, and the bottom wall of the sliding block is provided with a positioning groove that cooperates with the positioning column, and the two groups of sliding blocks relatively distributed in the two groups of slides are commonly connected with a protective mechanism that cooperates with the packaging shell, and the protective mechanism includes a protective rod, a flip assembly and an adjustment assembly, and the protective rod is an inverted U-shaped structure, and the flip assembly is located in the sliding block and The flip assembly is connected to the end of the protective rod, and is used to adjust the position of the protective rod on the surface of the substrate. The flip assembly includes a cavity opened on the surface of the sliding block, and a carrying plate is rotatably installed in the cavity. The two ends of the protective rod extend into the cavity respectively and are fixedly connected to the annular side wall of the carrying plate. The surface of the substrate is provided with multiple groups of transverse grooves that cooperate with the protective rod, and the transverse grooves are connected to the slide. When the protective rod is located on both sides of the packaging shell, the flip assembly is used to control the protective rod to maintain a horizontal state inside the substrate. When the protective rod is sleeved on the top of the packaging shell, the flip assembly is used to control the protective rod to maintain a vertical state on the surface of the substrate. The adjustment assembly includes a clamping part and a control part. The clamping part is located in the sliding block and connected to the flip assembly. The control part is located on the surface of the sliding block and connected to the clamping part. The control part adjusts the flip assembly by cooperating with the clamping part.

2. The multi-chip stacking package structure according to claim 1, characterized in that: The clamping part includes a receiving groove opened on the side wall of the cavity, and the side wall of the supporting plate is provided with multiple groups of limiting holes distributed in an annular shape. A limiting column cooperating with the limiting hole is slidably installed in the receiving groove, and a reset spring is fixedly installed in the receiving groove, and the telescopic end of the reset spring is connected to the limiting column.

3. The multi-chip stacking package structure according to claim 2, characterized in that: The control part includes a control cavity located outside the receiving groove and opened downward from the top wall of the sliding block, a vertical rod is slidably installed in the control cavity along the vertical direction, a top plate is fixedly installed on the top of the vertical rod, a control spring is fixedly installed in the control cavity, the telescopic end of the control spring is connected to the top plate, a pulling rope is fixedly installed on one end of the limit column located in the receiving groove, and the pulling rope extends into the control cavity at one end away from the limit column and is connected to the side wall of the vertical rod.

4. The multi-chip stacking package structure according to claim 3, characterized in that: The side wall of the slideway is provided with a guide groove, the side wall of the sliding block is fixedly provided with a guide block slidably connected with the guide groove, a guide rod is fixedly provided in the guide groove, and the guide rod is slidably connected with the guide block.

5. The multi-chip stacking package structure according to claim 1, characterized in that: A handle is fixedly installed in the middle of the protection rod.

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