Power amplifier modules and communication equipment

Abstract

The embodiment of the present application relates to the field of communication technology, and provides a power amplifier module and communication equipment, which can achieve the goal of improving efficiency and reducing heat consumption as much as possible while meeting the linear requirements of power amplification. The power amplifier module includes: an envelope extraction module, an envelope voltage module, a power amplifier module and a delay module; the envelope extraction module is used to: obtain a radio frequency signal, extract the envelope of the radio frequency signal, determine a voltage control signal according to the envelope, and transmit the voltage control signal to the envelope voltage module; the envelope voltage module is used to: output a voltage signal to the power amplifier module under the control of the voltage control signal; the delay module is used to: delay the time for the radio frequency signal to be transmitted to the power amplifier module, so that the radio frequency signal and the voltage signal are transmitted to the power amplifier module at the same time; the power amplifier module is used to: amplify the power of the radio frequency signal under the control of the voltage signal.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of communication technology, and in particular to a power amplifier module and a communication device. Background Art

[0002] With the continuous advancement of communication technology, communication standards continue to develop towards larger bandwidth, higher modulation mode and higher RF carrier. As an essential component for amplifying RF signals in the transmission link, the power amplifier (PA) also needs to support higher frequencies, larger bandwidths and higher modulation modes. This requires the linearity and efficiency of the power amplifier to meet higher requirements; however, the linearity and efficiency of the power amplifier are a pair of contradictory parameters. When the linearity requirements are met, the efficiency will decrease; the decrease in efficiency means more heat consumption, which leads to more waste of electricity. However, under the requirements of large bandwidth and high modulation, the power amplifier needs to meet better linearity. Therefore, how to solve the problem of how to improve efficiency and reduce heat consumption as much as possible while meeting the linearity requirements of the power amplifier is urgent. Summary of the invention

[0003] The embodiments of the present application provide a power amplifier module and a communication device, which can improve efficiency and reduce heat consumption as much as possible while meeting the linear requirements of power amplification.

[0004] On the one hand, an embodiment of the present application provides a power amplifier module for power amplifying a radio frequency signal output by a baseband module, wherein the power amplifier module comprises: an envelope extraction module, an envelope voltage module, a power amplifier module and a delay module;

[0005] Wherein, the delay module is electrically connected to the power amplification module; the input end of the envelope extraction module is coupled to the input end of the delay module, the output end of the envelope extraction module is electrically connected to the control end of the envelope voltage module, and the output end of the envelope voltage module is electrically connected to the voltage end of the power amplification module;

[0006] The envelope extraction module is used to: obtain the radio frequency signal, extract the envelope of the radio frequency signal, determine the voltage control signal according to the envelope, and transmit the voltage control signal to the envelope voltage module;

[0007] The envelope voltage module is used to: under the control of the voltage control signal, output a voltage signal to the power amplifier module, wherein the voltage value change trend of the voltage signal is the same as the amplitude change trend of the envelope;

[0008] The delay module is used to: receive the radio frequency signal, and delay the time for the radio frequency signal to be transmitted to the power amplification module, so that the radio frequency signal and the voltage signal are transmitted to the power amplification module at the same time;

[0009] The power amplification module is used to: perform power amplification on the radio frequency signal under the control of the voltage signal.

[0010] According to some embodiments of the present application, the envelope extraction module includes: a down-conversion submodule, an envelope submodule and a digital-to-analog conversion submodule electrically connected in sequence;

[0011] The input end of the down-conversion submodule is coupled to the input end of the delay module, and the output end of the digital-to-analog conversion submodule is electrically connected to the control end of the envelope voltage module;

[0012] The down-conversion submodule is used to: acquire the radio frequency signal, and down-convert the radio frequency signal to obtain the envelope;

[0013] The envelope submodule is used to: calculate the voltage amplitude of the envelope; determine the voltage control signal to be output according to the envelope lookup table;

[0014] The digital-to-analog conversion submodule is used to convert the voltage control signal from a digital signal form into an analog signal form.

[0015] According to some embodiments of the present application, the down-conversion submodule includes: an analog down-conversion unit, an intermediate frequency analog-to-digital conversion unit, and a first digital down-conversion unit electrically connected in sequence; an input end of the analog down-conversion unit is coupled to an input end of the delay module, and an output end of the first digital down-conversion unit is electrically connected to the envelope submodule;

[0016] The analog down-conversion unit is used to: obtain the radio frequency signal, and down-convert the radio frequency signal to obtain an intermediate frequency analog signal;

[0017] The intermediate frequency analog-to-digital conversion unit is used to: convert the intermediate frequency analog signal into an intermediate frequency digital signal;

[0018] The first digital down-conversion unit is used to down-convert the intermediate frequency digital signal to obtain the envelope.

[0019] According to some embodiments of the present application, the analog down-conversion unit includes a mixer, the intermediate frequency analog-to-digital conversion unit includes an intermediate frequency analog-to-digital converter, and the first digital down-conversion unit includes a digital down-converter.

[0020] According to some embodiments of the present application, the down-conversion submodule includes: a radio frequency analog-to-digital conversion unit and a second digital down-conversion unit electrically connected in sequence;

[0021] The radio frequency analog-to-digital conversion unit is used to: obtain the radio frequency signal and convert the radio frequency signal into a first digital signal;

[0022] The second digital down-conversion unit is used to down-convert the first digital signal to obtain the envelope.

[0023] According to some embodiments of the present application, the radio frequency analog-to-digital conversion unit includes a radio frequency analog-to-digital converter, and the second digital down-conversion unit includes a digital down-converter.

[0024] According to some embodiments of the present application, the power amplification module further includes a microstrip line;

[0025] The input end of the envelope extraction module is coupled to the input end of the delay module through the microstrip line.

[0026] According to some embodiments of the present application, the envelope extraction module includes an envelope extraction chip, the envelope voltage module includes an envelope voltage chip, and the power amplification module includes a power amplifier chip;

[0027] The envelope extraction chip, the envelope voltage chip and the power amplifier chip are integrated on the same circuit board.

[0028] According to some embodiments of the present application, another aspect of the embodiments of the present application provides a communication device, comprising: an electrically connected baseband module and the above-mentioned power amplifier module; the power amplifier module is used to power amplify the radio frequency signal output by the baseband module.

[0029] According to some embodiments of the present application, the baseband module includes a baseband chip; the envelope extraction module of the power amplifier module includes a first control interface; the envelope voltage module of the power amplifier module includes a second control interface;

[0030] The envelope extraction module of the power amplifier module is electrically connected to the baseband chip through the first control interface, and the envelope voltage module of the power amplifier module is electrically connected to the baseband chip through the second control interface.

[0031] The embodiment of the present application provides a power amplifier module and a communication device. In the power amplifier module, on the one hand, through the mutual cooperation of the envelope extraction module, the envelope voltage module, the power amplifier module and the delay module, the power supply voltage of the power amplifier module can be changed with the change of the output signal of the power amplifier module, thereby greatly reducing the heat generated by the power amplifier module and improving the efficiency of the power amplifier module while meeting the linear requirements of power amplification. On the other hand, the input end of the envelope extraction module is coupled with the input end of the delay module, that is, the envelope extraction module obtains the radio frequency signal from the input side of the power amplifier module and extracts the envelope of the radio frequency signal, and there is no need to obtain the envelope of the radio frequency signal from the baseband module, so it is no longer limited to the baseband module, and the application scope is greatly expanded. On the other hand, the envelope extraction module is arranged on the input side of the power amplifier module, and the distance between the envelope extraction module and the power amplifier module is short, which can ensure the synchronization of the envelope of the radio frequency signal extracted by the envelope extraction module and the output of the power amplifier module as much as possible, thereby further improving the efficiency of the power amplifier module. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplified descriptions do not constitute a limitation on the embodiments. Unless otherwise specified, the pictures in the drawings do not constitute a scale limitation. In order to more clearly illustrate the embodiments of the present application or the technical solutions in the traditional technology, the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 A schematic diagram of the structure of a PA provided for related technology;

[0034] Figure 2 for Figure 1 The corresponding heat map;

[0035] Figure 3 A schematic diagram of the structure of a power amplifier module provided in an embodiment of the present application;

[0036] Figure 4 for Figure 3 The corresponding heat map;

[0037] Figure 5 A schematic diagram of the structure of another power amplifier module provided in an embodiment of the present application;

[0038] Figure 6 A schematic diagram of the structure of another power amplifier module provided in an embodiment of the present application;

[0039] Figure 7A schematic diagram of the structure of another power amplifier module provided in an embodiment of the present application;

[0040] Figure 8 A schematic diagram of the structure of a communication device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0042] In the description of the embodiments of the present application, "at least one" means one or more, "multiple" means two or more, and "multiple times" means two or more, unless otherwise clearly and specifically defined.

[0043] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.

[0044] In the description of the embodiments of the present application, the character “ / ” generally indicates that the previously associated objects are in an “or” relationship.

[0045] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0046] In the description of the embodiments of the present application, when a certain component “includes” another component, unless otherwise stated, other components are not excluded and other components may be further included.

[0047] refer to Figure 1 As shown, in the related art, the RF signal (such as Figure 2 The signal S0 shown in FIG. 1 is transmitted to the PA, and the PA is supplied with the signal S0 through the DC / DC converter. Figure 2The fixed voltage U0 shown in the figure; when the input signal of the PA (i.e., the RF signal S0) changes, the voltage value of the fixed voltage U0 remains unchanged. Due to the need to meet the linear requirements of high-power signals, the power supply voltage value of the PA is relatively high. For relatively small power signals, the excess voltage will be wasted in the form of heat, thereby reducing the energy efficiency of the PA. Figure 2 As shown, the red area E0 between the fixed voltage U0 and the RF signal S0 represents heat. Figure 2 It can be seen that PA has low efficiency and high heat consumption, which has adverse effects on both equipment and the environment. For example, in the 5G MIMO (Multiple-in Multiple-out) system, the power consumption of base station equipment has been difficult to reduce.

[0048] Based on this, the embodiment of the present application provides a power amplifier module for amplifying the power of the RF signal output by the baseband module, referring to Figure 3 As shown, the power amplifier module 1 includes: an envelope extraction module 11, an envelope voltage module 12, a power amplifier module 13 and a delay module 14. The delay module 14 is electrically connected to the power amplifier module 13; the input end of the envelope extraction module 12 is coupled to the input end of the delay module 14, the output end of the envelope extraction module 11 is electrically connected to the control end of the envelope voltage module 12, and the output end of the envelope voltage module 12 is electrically connected to the voltage end of the power amplifier module 13. Figure 3 In the example, the input end of the delay module 14 is used to be electrically connected to the output end of the baseband module 2.

[0049] The envelope extraction module is used to: obtain the RF signal, extract the envelope of the RF signal, determine the voltage control signal according to the envelope, and transmit the voltage control signal to the envelope voltage module.

[0050] The envelope voltage module is used to: under the control of the voltage control signal, output a voltage signal to the power amplifier module, wherein the voltage value change trend of the voltage signal is the same as the amplitude change trend of the envelope.

[0051] The delay module is used to receive the radio frequency signal and delay the time for the radio frequency signal to be transmitted to the power amplifier module, so that the radio frequency signal and the voltage signal are transmitted to the power amplifier module at the same time.

[0052] The power amplifier module is used to amplify the power of the radio frequency signal under the control of the voltage signal.

[0053] In the power amplifier module, the specific structure of each module of the envelope extraction module, the envelope voltage module, the power amplifier module and the delay module is not limited, as long as the corresponding functions can be realized. For example, the envelope extraction module may include an envelope extraction chip, the envelope voltage module may include an envelope voltage chip, the delay module includes a delay line, and the power amplifier module includes a power amplifier chip.

[0054] It should be noted that coupling refers to the connection between two or more circuits or devices in a specific way to achieve energy or signal transfer. The types of coupling include: direct coupling, transformer coupling or capacitive coupling, etc. The specific type of coupling between the input end of the above-mentioned envelope extraction module and the input end of the delay module is not limited. For example, the coupling can be carried out through a microstrip line, and of course other couplers can also be used for coupling, thereby realizing the transmission of the input end signal of the delay module (i.e., the RF signal output by the baseband module) to the input end of the envelope extraction module.

[0055] The working principle of improving the efficiency of the power amplifier module is described below.

[0056] First, the meaning of the envelope of the signal is explained. By connecting the peak points of the signal within a period of time, we can get an upper line and a lower line. These two lines are called the envelope of the signal. The envelope can reflect the change in signal amplitude. ET (Envelop Tracking) technology is a dynamic power supply technology. The power amplifier module provided in the embodiment of the present application is based on ET technology to achieve that the power supply voltage of the power amplifier module changes with the change of the output signal of the power amplifier module, that is, when the power amplifier module outputs a low voltage signal, the envelope voltage module provides a low supply voltage; when the power amplifier module outputs a high voltage signal, the envelope voltage module provides a high supply voltage, thereby maximizing the efficiency of the power amplifier module and reducing heat consumption. The change of the output signal of the power amplifier module is determined by the envelope of the RF signal output by the baseband module. Therefore, the envelope of the RF signal is extracted by the envelope extraction module, and the voltage control signal is determined according to the envelope; the envelope voltage module outputs a voltage signal to the power amplifier module according to the voltage control signal; wherein the voltage value change trend of the voltage signal is the same as the amplitude change trend of the envelope; thereby realizing that the power supply voltage of the power amplifier module changes with the change of the output signal of the power amplifier module. Figure 4 As shown, the voltage output to the power amplifier module is U1, and the voltage value change trend of the voltage signal is similar to that of the RF signal S1 ( Figure 4 The yellow signal line in the figure) is the envelope B ( Figure 4 The black outlines on both sides of the yellow signal line have the same amplitude change trend, indicating that the red area E1 of the heat Figure 2 The red area E0 in the figure has been greatly reduced, indicating that the heat consumption has been greatly reduced and the efficiency of the power amplifier module has been greatly improved.

[0057] In the power amplifier module provided by the embodiment of the present application, on the one hand, through the mutual cooperation of the envelope extraction module, the envelope voltage module, the power amplifier module and the delay module, the power supply voltage of the power amplifier module can be changed with the change of the output signal of the power amplifier module, thereby greatly reducing the heat generated by the power amplifier module while meeting the linear requirements of power amplification, and improving the efficiency of the power amplifier module. On the other hand, the input end of the envelope extraction module is coupled with the input end of the delay module, that is, the envelope extraction module obtains the RF signal from the input side of the power amplifier module and extracts the envelope of the RF signal, and there is no need to obtain the envelope of the RF signal from the baseband module, so it is no longer limited to the baseband module, which greatly expands the scope of application. On the other hand, the envelope extraction module is arranged on the input side of the power amplifier module, and the distance between the envelope extraction module and the power amplifier module is short, which can ensure the synchronization of the envelope of the RF signal extracted by the envelope extraction module and the output of the power amplifier module as much as possible, thereby further improving the efficiency of the power amplifier module.

[0058] In one or more embodiments, reference Figure 5 As shown, the envelope extraction module 11 includes: a down-conversion submodule 111, an envelope submodule 112 and a digital-to-analog conversion submodule 113 which are electrically connected in sequence; the input end of the down-conversion submodule 111 is coupled to the input end of the delay module 14, and the output end of the digital-to-analog conversion submodule 113 is electrically connected to the control end of the envelope voltage module 12.

[0059] The down-conversion submodule is used to obtain the RF signal and down-convert the RF signal to obtain the envelope; the envelope submodule is used to calculate the voltage amplitude of the envelope; according to the envelope lookup table, determine the voltage control signal to be output; the digital-to-analog conversion submodule is used to convert the voltage control signal from a digital signal form to an analog signal form.

[0060] The above-mentioned RF signal is formed by modulating the baseband signal on the carrier signal. The RF signal has a high frequency and is generally in the form of an analog signal. The envelope of the RF signal is equivalent to the baseband signal of zero frequency. Therefore, in order to obtain the envelope of the RF signal, the RF signal needs to be down-converted to zero frequency. The purpose of down-conversion is to remove the carrier frequency to obtain the baseband signal.

[0061] In the above-mentioned envelope submodule, an envelope lookup table can be pre-set, which includes the correspondence between the voltage amplitude of the envelope and the power supply voltage required by the power amplifier module, wherein the correspondence between the voltage amplitude of the envelope and the power supply voltage required by the power amplifier module can be determined based on parameters such as power amplifier gain.

[0062] The voltage control signal output by the envelope submodule is a digital signal, which needs to be converted into an analog signal by a digital-to-analog conversion submodule and then transmitted to the envelope voltage module. The digital-to-analog conversion submodule may include a digital-to-analog converter (DAC).

[0063] It should be noted that, as the temperature of the analog link changes, the gain will also change, which will cause the size of the input signal of the power amplifier module to change. Since the envelope extraction module is arranged on the input side of the power amplifier module and is relatively close, the power amplifier module provided in the embodiment of the present application does not need to perform gain compensation on the analog link.

[0064] The following is a structure of a down-conversion submodule. Figure 6 As shown, the down-conversion submodule 111 includes: an analog down-conversion unit 1111, an intermediate frequency analog-to-digital conversion unit 1112 and a first digital down-conversion unit 1113 which are electrically connected in sequence; the input end of the analog down-conversion unit 1111 is coupled to the input end of the delay module 14, and the output end of the first digital down-conversion unit 1113 is electrically connected to the envelope submodule 112.

[0065] The analog down-conversion unit is used to obtain the radio frequency signal and down-convert the radio frequency signal to obtain an intermediate frequency analog signal; the intermediate frequency analog-to-digital conversion unit is used to convert the intermediate frequency analog signal into an intermediate frequency digital signal; and the first digital down-conversion unit is used to down-convert the intermediate frequency digital signal to obtain an envelope.

[0066] It should be noted that the frequency of the intermediate frequency analog signal is lower than the frequency of the radio frequency signal and greater than the frequency of the baseband signal. In the above-mentioned frequency conversion submodule, a down-conversion is performed in the analog domain by an analog down-conversion unit, and a down-conversion is performed again in the digital domain by a first digital down-conversion unit, so as to remove the carrier frequency and obtain the envelope. Here, two frequency conversions are used as an example for explanation. Of course, in practice, it is also possible to perform multiple down-conversions in the analog domain and multiple down-conversions in the digital domain, which is not limited here. Through this down-conversion submodule, the envelope can be accurately obtained from the radio frequency signal.

[0067] The specific structures of the above-mentioned analog down-conversion unit, intermediate frequency analog-to-digital conversion unit and first digital down-conversion unit are not limited. For example, the analog down-conversion unit includes a mixer, the intermediate frequency analog-to-digital conversion unit includes an intermediate frequency analog-to-digital converter (intermediate frequency Analog to Digital Converter, intermediate frequency ADC), and the first digital down-conversion unit includes a digital down converter (Digital Down Converter, DDC).

[0068] The following provides another structure of the down-conversion submodule, refer to Figure 7 As shown, the down-conversion submodule 111 includes: a radio frequency analog-to-digital conversion unit 1114 and a second digital down-conversion unit 1115 electrically connected in sequence. The radio frequency analog-to-digital conversion unit is used to obtain a radio frequency signal and convert the radio frequency signal into a first digital signal; the second digital down-conversion unit is used to down-convert the first digital signal to obtain an envelope. In the down-conversion submodule, down-conversion is not performed in the analog domain, and the envelope is directly down-converted in the digital domain to obtain the envelope.

[0069] The specific structures of the RF analog-to-digital conversion unit and the second digital down-conversion unit are not limited. For example, the RF analog-to-digital conversion unit includes a RF analog-to-digital converter (RF Analog to Digital Converter, RF ADC), and the second digital down-conversion unit includes a digital down-converter (DDC).

[0070] To obtain the RF signal more accurately, refer to Figure 3 As shown, the power amplifier module 1 further includes a microstrip line 15; the input end of the envelope extraction module 11 is coupled to the input end of the delay module 14 through the microstrip line 15. The specific structure of the microstrip line is not limited here, as long as the coupling between the envelope extraction module and the delay module can be achieved.

[0071] In one or more embodiments, the envelope extraction module includes an envelope extraction chip, the envelope voltage module includes an envelope voltage chip, and the power amplifier module includes a power amplifier chip; the envelope extraction chip, the envelope voltage chip and the power amplifier chip are integrated on the same circuit board; in this way, the envelope extraction chip can be as close to the envelope voltage chip and the power amplifier chip as possible, thereby minimizing the envelope signal distortion problem caused by routing and further ensuring the efficiency of the power amplifier module.

[0072] There is no limitation on the chip types of the envelope extraction chip, envelope voltage chip and power amplifier chip. For example, the chip type may be an MCU (Microcontroller Unit) chip, an FPGA (Field Programmable Gate Array) chip, a DSP (Digital Signal Processor) chip or an ARM (Advanced RISC Machines) chip. Of course, other types of chips may also be used.

[0073] The present application also provides a communication device, referring to Figure 8 As shown, it includes: an electrically connected baseband module 2 and any one of the above-mentioned power amplifier modules 1; the power amplifier module 1 is used to amplify the power of the radio frequency signal output by the baseband module 2.

[0074] The type and application scenario of the communication device are not limited. The communication device can be components and products used in fields such as smart housing, transportation, smart home, consumer electronics, monitoring, industrial automation, cabin detection and health care. Theoretically, as long as there is a scenario for the use of the power amplifier, it is possible to consider improving the efficiency of the PA through the power amplifier module provided in this application. For example, the communication device can be applied to consumer electronics fields such as 4G or 5G mobile phones, tablets, personal computers, etc.; or, it can also be applied to base stations, drones and other fields; or, it can also be applied to intelligent transportation equipment such as automobiles, bicycles, motorcycles, ships, subways or trains; or, it can also be applied to smart home devices such as sweeping robots, televisions, air conditioners or smart lights; or, it can also be applied to automotive cabin detection, indoor personnel monitoring, smart medical equipment and other fields.

[0075] In the communication device, on the one hand, the power amplifier module can realize that the power supply voltage of the power amplifier module changes with the change of the output signal of the power amplifier module, thereby greatly reducing the heat generated by the power amplifier module and improving the efficiency of the power amplifier module while meeting the linear requirements of power amplification; on the other hand, the input end of the envelope extraction module is coupled with the input end of the delay module, that is, the envelope extraction module obtains the RF signal from the input side of the power amplifier module and extracts the envelope of the RF signal, without obtaining the envelope of the RF signal from the baseband module, so it is no longer limited to the baseband module, greatly expanding the scope of application; on the other hand, the envelope extraction module is set at the input side of the power amplifier module, and the distance between the envelope extraction module and the power amplifier module is short, which can ensure the synchronization of the envelope of the RF signal extracted by the envelope extraction module and the output of the power amplifier module as much as possible, thereby further improving the efficiency of the power amplifier module. The overall power consumption of the communication device is small and the application range is wide.

[0076] In one or more embodiments, reference Figure 8 As shown, the baseband module 2 includes a baseband chip 21; the envelope extraction module 11 of the power amplifier module 1 includes a first control interface; the envelope voltage module 12 of the power amplifier module 1 includes a second control interface; the envelope extraction module 11 of the power amplifier module 1 is electrically connected to the baseband chip 21 through the first control interface, and the envelope voltage module 12 of the power amplifier module 1 is electrically connected to the baseband chip 21 through the second control interface.

[0077] There is no limitation on the types of the first control interface and the second control interface. For example, the first control interface and the second control interface may be general interfaces such as SPI (Serial Peripheral Interface) or MIPI (Mobile Industry Processor Interface), and may also be other types of interfaces.

[0078] The baseband chip can control the envelope extraction module through the first control interface, and can also control the envelope voltage module through the second control interface. The baseband chip's control of the envelope extraction module and the envelope voltage module includes register configuration, synchronization control, down-conversion frequency configuration, etc.

[0079] refer to Figure 8 As shown, the baseband module 2 may also include an AD / DA conversion module 22, so as to convert the digital signal output by the baseband chip into an analog signal, or convert the analog signal into a digital signal and transmit it to the baseband chip. Of course, the baseband module may also include other structures, which can be obtained by referring to the relevant technology and will not be described here.

[0080] The division of various components above is only for clear description. When implemented, they can be combined into one component or some components can be split and decomposed into multiple components. As long as they include the same logical relationship, they are all within the protection scope of this application.

[0081] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present application, and in practical applications, various changes may be made to the embodiments in form and detail without departing from the spirit and scope of the present application. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application, and therefore the scope of protection of the present application shall be subject to the scope defined in the claims.

Claims

1. A power amplifier module, characterized in that: Used to power amplify the radio frequency signal output by the baseband module, the power amplification module includes: an envelope extraction module, an envelope voltage module, a power amplification module and a delay module; Wherein, the delay module is electrically connected to the power amplification module; the input end of the envelope extraction module is coupled to the input end of the delay module, the output end of the envelope extraction module is electrically connected to the control end of the envelope voltage module, and the output end of the envelope voltage module is electrically connected to the voltage end of the power amplification module; The envelope extraction module is used to: obtain the radio frequency signal, extract the envelope of the radio frequency signal, determine the voltage control signal according to the envelope, and transmit the voltage control signal to the envelope voltage module; The envelope voltage module is used to: under the control of the voltage control signal, output a voltage signal to the power amplifier module, wherein the voltage value change trend of the voltage signal is the same as the amplitude change trend of the envelope; The delay module is used to: receive the radio frequency signal, and delay the time for the radio frequency signal to be transmitted to the power amplification module, so that the radio frequency signal and the voltage signal are transmitted to the power amplification module at the same time; The power amplification module is used to: perform power amplification on the radio frequency signal under the control of the voltage signal.

2. The power amplifier module according to claim 1, characterized in that: The envelope extraction module comprises: a down-conversion submodule, an envelope submodule and a digital-to-analog conversion submodule which are electrically connected in sequence; The input end of the down-conversion submodule is coupled to the input end of the delay module, and the output end of the digital-to-analog conversion submodule is electrically connected to the control end of the envelope voltage module; The down-conversion submodule is used to: acquire the radio frequency signal, and down-convert the radio frequency signal to obtain the envelope; The envelope submodule is used to: calculate the voltage amplitude of the envelope; determine the voltage control signal to be output according to the envelope lookup table; The digital-to-analog conversion submodule is used to convert the voltage control signal from a digital signal form into an analog signal form.

3. The power amplifier module according to claim 2, characterized in that: The down-conversion submodule comprises: an analog down-conversion unit, an intermediate frequency analog-to-digital conversion unit and a first digital down-conversion unit electrically connected in sequence; an input end of the analog down-conversion unit is coupled to an input end of the delay module, and an output end of the first digital down-conversion unit is electrically connected to the envelope submodule; The analog down-conversion unit is used to: obtain the radio frequency signal, and down-convert the radio frequency signal to obtain an intermediate frequency analog signal; The intermediate frequency analog-to-digital conversion unit is used to: convert the intermediate frequency analog signal into an intermediate frequency digital signal; The first digital down-conversion unit is used to down-convert the intermediate frequency digital signal to obtain the envelope.

4. The power amplifier module according to claim 3, characterized in that: The analog down-conversion unit includes a mixer, the intermediate frequency analog-to-digital conversion unit includes an intermediate frequency analog-to-digital converter, and the first digital down-conversion unit includes a digital down-converter.

5. The power amplifier module according to claim 2, characterized in that: The down-conversion submodule comprises: a radio frequency analog-to-digital conversion unit and a second digital down-conversion unit electrically connected in sequence; The radio frequency analog-to-digital conversion unit is used to: obtain the radio frequency signal and convert the radio frequency signal into a first digital signal; The second digital down-conversion unit is used to down-convert the first digital signal to obtain the envelope.

6. The power amplifier module according to claim 5, characterized in that: The radio frequency analog-to-digital conversion unit includes a radio frequency analog-to-digital converter, and the second digital down-conversion unit includes a digital down-converter.

7. The power amplifier module according to claim 2, characterized in that: The power amplifier module also includes a microstrip line; The input end of the envelope extraction module is coupled to the input end of the delay module through the microstrip line.

8. The power amplifier module according to claim 1, characterized in that: The envelope extraction module includes an envelope extraction chip, the envelope voltage module includes an envelope voltage chip, and the power amplification module includes a power amplifier chip; The envelope extraction chip, the envelope voltage chip and the power amplifier chip are integrated on the same circuit board.

9. A communication device, characterized in that: include: An electrically connected baseband module and a power amplifier module as described in any one of claims 1-8; the power amplifier module is used to power amplify the radio frequency signal output by the baseband module.

10. The communication device according to claim 9, characterized in that The baseband module includes a baseband chip; the envelope extraction module of the power amplifier module includes a first control interface; the envelope voltage module of the power amplifier module includes a second control interface; The envelope extraction module of the power amplifier module is electrically connected to the baseband chip through the first control interface, and the envelope voltage module of the power amplifier module is electrically connected to the baseband chip through the second control interface.

Images