Wafer pre-etching pretreatment equipment

Abstract

The invention discloses a wafer pre-etching pretreatment device, comprising a box body, a control system is installed on one side of the box body, the control system controls the movement of a lifting cylinder, a cleaning system for wafer cleaning is installed on the lifting cylinder, the cleaning system comprises a shell seat controlled by the control system, a disk seat is fixed at the lower end of the shell seat, a column block is installed at the center of the lower end of the disk seat, a guide channel is arranged at the center of the column block, a supply mechanism connected with the upper end of the guide channel is installed on the shell seat, a cleaning mechanism located at the outer side of the column block is installed at the lower end of the disk seat, an outer shell cover is sleeved on the outer side of the upper end of the disk seat, a collecting mechanism is installed at the lower end of the outer shell cover, a cleaning liquid is supplied through the supply mechanism so that the cleaning mechanism cleans the wafer, and a drying gas can also be supplied through the supply mechanism so that the cleaned wafer can be dried in time.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, in particular to a wafer pre-etching pretreatment device. Background Art

[0002] With the continuous development of integrated circuit technology, the requirements for wafer surface cleanliness are also increasing. In the semiconductor integrated circuit manufacturing process, wet cleaning is one of the key processes to obtain high-quality products, and its importance is self-evident. The traditional batch cleaning method has gradually failed to meet the high-precision requirements of modern semiconductor manufacturing because it is difficult to ensure the cleaning quality of each wafer. Therefore, the cleaning equipment has gradually changed from batch cleaning to single-wafer cleaning to improve the cleaning quality and thus improve the product yield. At present, in the existing pre-treatment device for wafer etching, during the cleaning process of a single wafer, since the cleaning liquid directly acts on the surface of the wafer, the general cleaning liquid will be thrown out and dispersed to the surface of various regions of the wafer, and it is not collected and processed in time, so that the cleaning liquid after the action on the wafer surface is prone to repeatedly being on the surface of the wafer, which is not only easy to cause damage to the surface of the wafer when cleaning, but also reduces the cleaning quality of the wafer surface, and also causes the surface of the wafer to be cleaned to be contaminated again, thereby affecting the subsequent etching and manufacturing process.

[0003] Therefore, it is necessary to provide a wafer pre-etching pretreatment device to solve the problems raised in the above background technology. Summary of the invention

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wafer pre-etching pretreatment device comprises a box body, a rotating table is installed on the upper end of the box body, a retaining plate is installed on the rotating table, a retaining groove for wafer retaining is provided on the retaining plate, a control system is installed on one side of the box body, the control system comprises an X guide rail fixed on the box body and a Y guide rail installed on the X guide rail, a lifting cylinder is installed on the Y guide rail, a cleaning system for wafer cleaning is installed on the lifting cylinder, the cleaning system comprises a shell seat controlled by the control system, a disk seat is fixed at the lower end of the shell seat, a column block is installed at the center of the lower end of the disk seat, a guide channel is provided at the center of the column block, a supply mechanism connected with the upper end of the guide channel is installed on the shell seat, a cleaning mechanism located on the outer side of the column block is installed at the lower end of the disk seat, an outer shell cover is sleeved on the outer side of the upper end of the disk seat, and a collecting mechanism is installed at the lower end of the outer shell cover.

[0005] Preferably, the cleaning mechanism comprises a surrounding ring rotatably connected to the disc seat, a cover disc 1 is fixed at the lower end of the surrounding ring, a cover disc 2 is fixed at the lower end of the cover disc, a drainage disc is fixed at the lower end of the cover disc 2, a motor 1 is also installed on the cover disc 1, a gear 1 is installed at the output end of the motor 1, the gear 1 is meshed with a gear ring 1 fixed on the surrounding ring, a center hole 1 connected to the lower end of the guide channel is provided at the center of the cover disc 2, a flow expansion branch hole distributed circumferentially and connected to the center hole 1 is provided on the cover disc 2, and a flow expansion branch hole connected to the flow expansion branch hole is provided on the cover disc 2. A connected focusing hole, a center hole 2 is provided in the center of the drainage plate, a through hole corresponding to the expansion branch hole is also provided on the drainage plate, and a circumferentially distributed drainage strips are arranged on the lower plate surface of the drainage plate. A cleaning column corresponding to the focusing hole is rotatably installed on the cover plate 1, the upper half of the cleaning column is located in the focusing hole, and the lower half of the cleaning column is located below the through hole. A gear 2 is also fixed to the upper end of the cleaning column, and a gear ring 2 meshing with the gear 2 is rotatably installed on the outer side of the column block. A motor 2 for controlling the rotation of the gear 2 is also installed on the cover plate 1.

[0006] Preferably, a filter ring is fixed on the through hole and is sleeved on the outside of the middle part of the cleaning column.

[0007] Preferably, a cleaning cotton sleeve is provided on the lower end surface of the drainage spacer.

[0008] Preferably, the supply mechanism includes a guide box connected to the upper end of the guide channel, and the guide box is respectively connected to the output ends of a plurality of control pumps, and the input end of the control pump is connected to a liquid inlet pipe.

[0009] Preferably, a power supply is installed outside the flow guide box, and the power supply is connected to a heating resistor arranged inside the flow guide box.

[0010] Preferably, the guide box is also connected to the output end of the control pump 2, and the input end of the control pump 2 is connected to the air filter cartridge.

[0011] Preferably, the collecting mechanism comprises a collecting casing fixed to the lower end of the outer shell, and the collecting casing comprises a conical annular surface close to the drainage spacer and a collecting annular groove located outside the conical annular surface.

[0012] Preferably, the outer shell cover is also provided with a control pump three, the output end of the control pump three is connected to a discharge pipe, and the input end of the control pump three is connected to a suction pipe extending into the bottom of the collection ring groove.

[0013] Preferably, a moisture-absorbing cotton ring is provided on the lower end surface of the collecting shell.

[0014] Compared with the prior art, the present invention provides a wafer pre-etching pretreatment device, which has the following beneficial effects:

[0015] The present invention adopts the structural design of the cleaning system, controls the rotation of all the cleaning columns by motor 2, performs pre-treatment cleaning on the wafer, and controls the circumferential rotation of all the cleaning columns by motor 1, thereby improving the cleaning effect. The solution formed after the cleaning reaction with the wafer surface is mixed with particles that fall off when the wafer surface is cleaned, and because the cleaning liquid between the drainage partitions has a centrifugal effect of flowing outward, the cleaning liquid between the drainage partitions can continuously and unidirectionally diffuse outward, so that the cleaned particles can be discharged in time, and the particles are prevented from repeatedly staying in the vicinity of the cleaning columns, causing repeated friction between the particles and the wafer surface and damaging the wafer. At the same time, it is also beneficial to further improve the cleaning efficiency and cleaning quality of the wafer. The drainage strips can make the cleaning liquid fully and evenly fill the area below the drainage plate, so that the cleaning liquid can fully contact the surface of the wafer, and the particles that have detached from the surface of the wafer can be discharged in time. The chamber between the upper half of the cleaning column and the focusing hole has sufficient cleaning liquid with greater kinetic energy, and the liquid rushes downward, which can clean the cleaning column and keep the cleaning column tidy in real time. The drainage effect of the drainage strips can make the finally gathered cleaning liquid discharged into the collection mechanism, thereby avoiding the cleaning liquid from being sprayed on the surface of the wafer in large quantities, saving the amount of cleaning liquid used, and making the particles that have detached from the surface of the wafer be collected and processed in time, so that the processing effect of the cleaning and drying pretreatment process of the wafer is effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The structure of the wafer pre-etching pretreatment equipment of the present invention is shown in FIG. Figure 1 ;

[0017] Figure 2 The structure of the wafer pre-etching pretreatment equipment of the present invention is shown in FIG. Figure 2 ;

[0018] Figure 3 It is a schematic diagram of the local structure of the cleaning system of the present invention;

[0019] Figure 4 It is a partial cross-sectional structural schematic diagram of the cleaning system of the present invention;

[0020] Figure 5 It is a schematic diagram of the cleaning mechanism structure of the present invention;

[0021] Figure 6 It is a schematic diagram of the bottom structure of the cleaning system of the present invention;

[0022] In the figure: 1, box; 2, control mechanism; 3, cleaning system; 11, rotating table; 12, retaining plate; 121, retaining groove; 21, X guide rail; 22, Y guide rail; 23, lifting cylinder; 31, shell seat; 32, shell cover; 33, plate seat; 34, column block; 35, supply mechanism; 36, cleaning mechanism; 37, collecting mechanism; 38, moisture-absorbing cotton ring; 39, cleaning cotton sleeve; 341, diversion channel; 351, diversion box; 352, control pump 1; 353, liquid inlet pipe; 354, heating resistor; 355, power supply; 356, control pump 2; 357, air filter cartridge; 361, surrounding ring ; 362, cover plate one; 363, cover plate two; 364, drainage plate; 365, motor one; 366, gear one; 367, filter ring; 3611, gear ring one; 3621, motor two; 3622, cleaning column; 3623, gear two; 3624, gear ring two; 3631, center hole one; 3632, expansion branch hole; 3633, flow focusing hole; 3641, center hole two; 3642, through hole; 3643, drainage spacer; 371, collection shell; 372, suction pipe; 373, control pump three; 374, drain pipe; 3711, conical annulus; 3712, collection ring groove. DETAILED DESCRIPTION

[0023] Reference Figure 1-Figure 6 The present invention provides a technical solution: a wafer pre-etching pretreatment device, comprising a box body 1, a rotating table 11 is installed on the upper end of the box body 1, a retaining plate 12 is installed on the rotating table 11, and a retaining groove 121 for wafer retention is opened on the retaining plate 12, a control system 2 is installed on one side of the box body 1, the control system 2 comprises an X guide rail 21 fixed on the box body 1 and a Y guide rail 22 installed on the X guide rail 21, a lifting cylinder 23 is installed on the Y guide rail 22, a cleaning system 3 for wafer cleaning is installed on the lifting cylinder 23, the cleaning system 3 comprises a shell seat 31 controlled by the control system 2, a disk seat 33 is fixed at the lower end of the shell seat 31, the A column block 34 is installed at the center of the lower end of the disk base 33, and a guide channel 341 is provided at the center of the column block 34. A supply mechanism 35 connected with the upper end of the guide channel 341 is installed on the shell base 31. A cleaning mechanism 36 located on the outside of the column block 34 is installed at the lower end of the disk base 33, and an outer shell cover 32 is sleeved on the outer side of the upper end of the disk base 33, and a collecting mechanism 37 is installed at the lower end of the outer shell cover 32, wherein the X guide rail 21 points to the center of the rotating table 11, therefore, through the coordinated control of the X guide rail 21 and the Y guide rail 22, the lifting cylinder 23 can be driven to move in a plane, and the cleaning system 3 is controlled by the lifting cylinder 23 to approach the wafer, so that the cleaning pretreatment process before the wafer etching can be performed.

[0024] In this embodiment, the cleaning mechanism 36 includes a surrounding ring 361 rotatably connected to the disc seat 33, a cover disc 1 362 is fixed to the lower end of the surrounding ring 361, a cover disc 2 363 is fixed to the lower end of the cover disc 1 362, and a drainage disc 364 is fixed to the lower end of the cover disc 2 363.

[0025] The cover plate 1 362 is also equipped with a motor 1 365, and a gear 1 366 is installed at the output end of the motor 1 365. The gear 1 366 meshes with a gear ring 1 3611 fixed on the surrounding ring 361. The center of the cover plate 2 363 is provided with a center hole 1 3631 connected to the lower end of the guide channel 341. The cover plate 2 363 is also provided with a circumferentially distributed expansion branch hole 3632 connected to the center hole 1 3631. The cover plate 2 363 is also provided with a focusing hole 3633 connected to the expansion branch hole 3632. The center of the drainage plate 364 is provided with a center hole 2 3641. The drainage plate 364 is also provided with a through hole 3642 corresponding to the expansion branch hole 3632. The lower plate surface of the drainage plate 364 is provided with a circumferentially distributed drainage partition The cleaning column 3622 corresponding to the focusing hole 3633 is rotatably mounted on the cover plate 1 362, the upper half of the cleaning column 3622 is located in the focusing hole 3633, and the lower half of the cleaning column 3622 is located below the through hole 3642. A second gear 3623 is also fixed to the upper end of the cleaning column 3622, and a second gear ring 3624 meshing with the second gear 3623 is rotatably mounted on the outer side of the column block 34. A second motor 3621 for controlling the rotation of one of the second gears 3623 is also mounted on the cover plate 1 362; specifically, the second gear 3623 is driven to rotate by the second motor 3621, and one of the second gears 3623 drives the second gear ring 3624, and the second gear ring 3624 drives the remaining second gears 362 3 rotates, so that all the cleaning columns 3622 rotate, and the wafer is pre-treated and cleaned. The motor 365 controls the gear 366 to rotate and drive the gear ring 3611 to rotate, which can eventually drive all the cleaning columns 3622 to rotate in the circumferential direction, thereby improving the cleaning effect. Among them, when the cleaning liquid reacts with the surface of the wafer in the cooperation of the cleaning columns 3622, the solution formed after the cleaning reaction will be mixed with particles that fall off when the surface of the wafer is cleaned. Therefore, the rotation of the drainage plate 364 will cause the cleaning liquid between the drainage partitions 3643 to have a centrifugal effect of flowing outward, so that the cleaning liquid between the drainage partitions 3643 can diffuse outward continuously and unidirectionally, so that the cleaned particles can be discharged in time, avoiding the particle back The particles are retained in the vicinity of the cleaning column 3622, causing repeated friction between the particles and the wafer surface, damaging the wafer. At the same time, it is also beneficial to further improve the cleaning efficiency and cleaning quality of the wafer. Among them, the drainage spacers 3643 distributed in a radial shape can make the cleaning liquid flowing out through the second center hole 3641 fully and evenly fill the area below the drainage plate 364, so that the cleaning liquid is in full contact with the wafer surface. The drainage spacers 3643 can also make the particles separated from the wafer surface be discharged from the cleaning column 3622 and the area where the drainage spacers 3643 are located in time under the effect of the circumferential blocking and radial drainage of the drainage spacers 3643.The cleaning liquid is also introduced into the expansion branch hole 3632 through the center hole 1 3631 and enters the focusing hole 3633. At this time, the chamber between the upper half of the cleaning column 3622 and the focusing hole 3633 has sufficient cleaning liquid with greater kinetic energy, and flows downward, which can clean the cleaning column 3622, keep the cleaning column 3622 tidy in real time, and through the drainage effect of the drainage spacer 3643, the finally gathered cleaning liquid is discharged into the collection mechanism 37. ;

[0026] In this embodiment, a filter ring 367 is fixed on the through hole 3642 and is sleeved on the outer side of the middle part of the cleaning column 3622. On the one hand, the filter ring 367 can effectively prevent particulate matter in the cleaning liquid below it from mixing into the chamber between the upper half of the cleaning column 3622 and the focusing hole 3633. On the other hand, the filter ring 367 also has the effect of pressurizing the cleaning liquid in the chamber between the upper half of the cleaning column 3622 and the focusing hole 3633, which is beneficial to improving the unidirectional flowability of the cleaning liquid from the chamber between the upper half of the cleaning column 3622 and the focusing hole 3633 into the chamber between the lower half of the cleaning column 3622 and the bottom of the through hole 3642.

[0027] In this embodiment, a cleaning cotton sleeve 39 is provided on the lower end surface of the drainage partition 3643, which further improves the flow isolation effect of the drainage partition 3643 and also improves the pre-treatment cleaning effect on the wafer.

[0028] In this embodiment, the supply mechanism 35 includes a guide box 351 connected to the upper end of the guide channel 341, and the guide box 351 is respectively connected to the output ends of multiple control pumps 352, and the input end of the control pump 352 is connected to the liquid inlet pipe 353.

[0029] In this embodiment, a power supply 355 is installed on the outside of the guide box 351, and the power supply 355 is connected to a heating resistor 354 arranged inside the guide box 351; when the cleaning liquid flows in the guide box 351, the temperature of the cleaning liquid is controlled to improve the reaction rate between the cleaning liquid and the wafer surface, the cleaning rate and the cleaning quality.

[0030] In this embodiment, the guide box 351 is also connected to the output end of the control pump 356, and the input end of the control pump 356 is connected to the air filter cartridge 357, so that after cleaning is completed, the filtered air can be introduced and combined with the cooperation of the heating resistor 354, so that the cleaned wafers can be dried in time, thereby improving the drying efficiency.

[0031] In this embodiment, the collecting mechanism 37 includes a collecting shell 371 fixed at the lower end of the outer shell cover 32, and the collecting shell 371 includes a conical annular surface 3711 close to the drainage spacer 3643 and a collecting annular groove 3712 located on the outside of the conical annular surface 3711; specifically, when the finally gathered cleaning liquid is discharged to one side of the collecting shell 371, the used cleaning liquid is introduced into the collecting annular groove 3712 through the conical annular surface 3711, that is, when the cleaning liquid is discharged after being acted upon by the cleaning mechanism 36, it can be collected in time by the collecting mechanism 37, thereby avoiding a large amount of cleaning liquid spraying on the surface of the wafer, saving the amount of cleaning liquid used, and enabling the particles separated from the surface of the wafer to be collected and processed in time, thereby avoiding the particles separated from the surface of the wafer from being retained on the surface of the wafer for multiple times, causing damage to the surface of the wafer after acting on the cleaning column, and also effectively improving the processing effect of the cleaning and drying pretreatment process of the wafer.

[0032] In this embodiment, a control pump 373 is further provided on the outer shell cover 32 , the output end of the control pump 373 is connected to a discharge pipe 374 , and the input end of the control pump 373 is connected to a suction pipe 372 extending into the bottom of the collection ring groove 3712 .

[0033] In this embodiment, a moisture-absorbing cotton ring 38 is provided on the lower end surface of the collecting shell 371 to prevent the cleaning liquid discharged after the cleaning mechanism 36 from flowing again to the surface of the wafer outside the cleaning system 3, affecting the cleaning of the wafer by the cleaning column 3622 and avoiding contamination of the surface of the cleaned wafer.

[0034] In specific implementation, it includes the following steps:

[0035] Step 1: connect the drain pipe 374 to an external collection tank, and connect the liquid inlet pipe 353 to an external liquid supply tank.

[0036] Step 2: The wafer on the retaining groove 121 in the retaining plate 12 is adjusted by the rotating table 11 to be located directly below the X-guide rail 21 .

[0037] Step 3: Under the action of the X rail 21, the Y rail 22 and the lifting cylinder 23, the moisture absorbing cotton ring 38 and the cleaning cotton sleeve 39 are controlled to contact with the wafer surface and move along the wafer surface, and the cleaning system 3 is started to clean and dry the wafer surface;

[0038] Step 4: After cleaning and drying, proceed to step 1.

[0039] The above description is only a preferred specific implementation manner of the invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer pre-etching pretreatment device, comprising a box (1), a rotating table (11) is installed at the upper end of the box (1), a fixing plate (12) is installed on the rotating table (11), and a fixing groove (121) for fixing the wafer is opened on the fixing plate (12), a control system (2) is installed on one side of the box (1), the control system (2) comprises an X guide rail (21) fixed on the box (1) and a Y guide rail (22) installed on the X guide rail (21), a lifting cylinder (23) is installed on the Y guide rail (22), and a cleaning system (3) for cleaning the wafer is installed on the lifting cylinder (23), characterized in that: The cleaning system (3) comprises a housing (31) controlled by a control system (2); a disc seat (33) is fixed at the lower end of the housing seat (31); a column block (34) is installed at the center of the lower end of the disc seat (33); a flow guide channel (341) is provided at the center of the column block (34); a supply mechanism (35) connected to the upper end of the flow guide channel (341) is installed on the housing seat (31); a cleaning mechanism (36) located outside the column block (34) is installed at the lower end of the disc seat (33); an outer shell cover (32) is sleeved on the outer side of the upper end of the disc seat (33); a collecting mechanism (37) is installed at the lower end of the outer shell cover (32); The cleaning mechanism (36) comprises a surrounding ring (361) rotatably connected to the disc seat (33); a cover disc 1 (362) is fixed at the lower end of the surrounding ring (361); a cover disc 2 (363) is fixed at the lower end of the cover disc 1 (362); a drainage disc (364) is fixed at the lower end of the cover disc 2 (363); a motor 1 (365) is also mounted on the cover disc 1 (362); a gear 1 (366) is mounted at the output end of the motor 1 (365); and the gear 1 (366) is mounted on the output end of the motor 1 (365). The first cover plate (366) is meshed with a toothed ring (3611) fixed on the surrounding ring (361), and the center of the second cover plate (363) is provided with a center hole (3631) connected to the lower end of the guide channel (341), and the second cover plate (363) is also provided with a circumferentially distributed expansion branch hole (3632) connected to the center hole (3631), and the second cover plate (363) is also provided with a flow gathering hole (3632) connected to the expansion branch hole (3632). The drainage plate (364) has a central hole (3641) at its center, and the drainage plate (364) is also provided with a through hole (3642) corresponding to the expansion branch hole (3632). The lower plate surface of the drainage plate (364) is provided with drainage spacers (3643) distributed circumferentially. A cleaning column (3622) corresponding to the flow focusing hole (3633) is rotatably mounted on the cover plate (362). The first half is located in the focusing hole (3633), the lower half of the cleaning column (3622) is located below the through hole (3642), a second gear (3623) is fixed to the upper end of the cleaning column (3622), a second gear ring (3624) meshing with the second gear (3623) is rotatably installed on the outer side of the column block (34), and a second motor (3621) for controlling the rotation of the second gear (3623) is also installed on the cover plate (362).

2. The wafer pre-etching pretreatment equipment according to claim 1, characterized in that: A filter ring (367) is fixed on the through hole (3642) and is sleeved on the outer side of the middle part of the cleaning column (3622).

3. The wafer pre-etching pretreatment equipment according to claim 1, characterized in that: The lower end surface of the drainage spacer (3643) is provided with a cleaning cotton sleeve (39).

4. The wafer pre-etching pretreatment equipment according to claim 1, characterized in that: The supply mechanism (35) comprises a flow guide box (351) connected to the upper end of the flow guide channel (341); the flow guide box (351) is respectively connected to the output ends of a plurality of control pumps (352); and the input end of the control pump (352) is connected to a liquid inlet pipe (353).

5. The wafer pre-etching pretreatment equipment according to claim 4, characterized in that: A power source (355) is installed outside the flow guide box (351), and the power source (355) is connected to a heating resistor (354) arranged inside the flow guide box (351).

6. The wafer pre-etching pretreatment equipment according to claim 4, characterized in that: The flow guide box (351) is also connected to the output end of the second control pump (356), and the input end of the second control pump (356) is connected to the air filter cartridge (357).

7. The wafer pre-etching pretreatment equipment according to claim 1, characterized in that: The collecting mechanism (37) comprises a collecting casing (371) fixed to the lower end of the outer shell (32); the collecting casing (371) comprises a conical annular surface (3711) close to the drainage spacer (3643) and a collecting annular groove (3712) located outside the conical annular surface (3711).

8. The wafer pre-etching pretreatment equipment according to claim 7, characterized in that: The outer shell cover (32) is also provided with a control pump three (373), the output end of the control pump three (373) is connected to a liquid discharge pipe (374), and the input end of the control pump three (373) is connected to a suction pipe (372) extending into the bottom of the collection ring groove (3712).

9. The wafer pre-etching pretreatment equipment according to claim 8, characterized in that: The lower end surface of the collecting enclosure (371) is provided with a moisture-absorbing cotton ring (38).

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