A method for improving the accuracy of reflectivity thermal imaging testing and a computer device

Abstract

The present invention discloses a method for improving the accuracy of reflectivity thermal imaging test and a computer device, the method comprising: presetting the electrical signal loading conditions, test time, and test cycle number of the device to be tested; placing the device in an unloaded electrical signal state, and placing the temperature of the device in an initial state temperature; loading the device with electrical signals through an external power supply; when the pre-set test time is reached, collecting the light reflectivity of the device to be tested area, and calculating the temperature rise data; switching the device from the loaded electrical signal state to the unloaded electrical signal state, cooling the device through a liquid cooling system, and quickly cooling the device to be tested area through an external synchronous air cooling module; comparing the light reflectivity test of the area to be tested, judging that the device is reduced to the initial temperature, restarting the device to enter the next test, and averaging the temperature rise data of each test as the final temperature rise data. The present invention can improve the accuracy and efficiency of reflectivity thermal imaging test.

Description

Technical Field

[0001] The invention belongs to the field of thermal detection of microelectronic devices, and in particular relates to a method for improving the accuracy of reflectivity thermal imaging testing and a computer device. Background Art

[0002] When light hits the surface of a material, light reflection occurs, and the reflection ratio (hereinafter referred to as light reflectivity) is related to the temperature of the material at the time of irradiation, that is, when the temperature changes, the change in temperature and the change in the material's light reflectivity are in a certain proportional relationship. The thermal reflection calibration coefficient Cth is an important parameter that characterizes this proportional relationship. The relevant numerical relationship can be calculated using the following formula:

[0003] (1)

[0004] Where ΔT is the temperature change, ∆R is the light reflectivity change, R0 is the light reflectivity in the initial state, C th is the thermoreflectance calibration coefficient.

[0005] The existing reflectivity thermal imaging detection technology is based on the thermal reflection calibration coefficient C th The device surface temperature is tested by measuring the light reflectivity. Specifically, the device is switched from the unloaded electrical signal state to the loaded electrical signal state, the light reflectivity change ∆R is tested, and then the temperature rise ∆T of the tested area is calculated based on formula (1). To ensure the accuracy and precision of the test results, the system will repeatedly obtain the temperature rise ∆T for multiple times according to the number of cycles set by the tester to calculate the average value. During the test, when the device is switched from the loaded electrical signal state to the unloaded electrical signal state, the temperature control platform will cool the device through the liquid cooling system, and monitor the device temperature by placing a thermocouple on the surface of the device to be tested. When the actual temperature measured by the thermocouple drops to the initial temperature, the device is switched from the unloaded electrical signal state to the loaded electrical signal state for temperature rise test.

[0006] However, in the above-mentioned prior art, the method of placing a thermocouple on the surface of the device to be tested to determine whether the device temperature has dropped to the initial temperature is not accurate. In the actual temperature test process, the device area to be observed is often the main heat source area, and the temperature of the heat source area is significantly higher than other locations on the device surface. When the thermocouple shows that the temperature has dropped to the initial temperature, the temperature of the device heat source area has not actually dropped to the initial state. In this case, the device is loaded with an electrical signal state for testing again, which will lead to a large error in the subsequent temperature rise test results. This error will be more obvious in the test of micro-sized and high-power devices. Summary of the invention

[0007] The purpose of the present invention is to provide a method for improving the accuracy of reflectivity thermal imaging testing, a computer device, a computer-readable storage medium and a computer program product, which can solve the problem that the temperature of the heat source area has not been reduced to the initial state during the cyclic test, resulting in deviation in the temperature rise test results, and improve the accuracy and test efficiency of the reflectivity thermal imaging test.

[0008] In order to achieve the above object, one aspect of the present invention provides a method for improving the accuracy of reflectivity thermal imaging testing, comprising:

[0009] Step S1, presetting the electrical signal loading conditions, test time, and test cycle number of the device to be tested;

[0010] Step S2, making the device in a state where no electrical signal is loaded, and making the temperature of the device in an initial state temperature;

[0011] Step S3, according to the preset electrical signal loading conditions, the device is loaded with electrical signals through an external power supply, so that the device is in an electrical signal loading state;

[0012] Step S4, when the preset test time is reached, the light reflectivity of the device to be tested area is collected and the temperature rise data is calculated;

[0013] Step S5, switching the device from a state of loading an electrical signal to a state of not loading an electrical signal, cooling the device by a liquid cooling system, and quickly cooling the device to be tested area by an external synchronous air cooling module;

[0014] Step S6, collecting the light reflectivity of the device to be tested area to obtain the current light reflectivity, comparing the current light reflectivity with the light reflectivity of the initial state, when the absolute value deviation or absolute value ratio of the current light reflectivity to the light reflectivity of the initial state is less than or equal to the set threshold, it is determined that the device has been restored to the initial state temperature, and the liquid cooling system and the air cooling module stop cooling the device; when the absolute value deviation or absolute value ratio of the current light reflectivity to the light reflectivity of the initial state is greater than the set threshold, the liquid cooling system and the air cooling module continue to cool the device, and collect the current light reflectivity again, until the absolute value deviation or absolute value ratio of the current light reflectivity to the light reflectivity of the initial state is less than the set threshold, it is determined that the device has been restored to the initial state temperature, and the liquid cooling system and the air cooling module stop cooling the device;

[0015] Step S7, repeating steps S3 to S6 until the preset number of cycles of testing is completed, and the temperature rise data of each test is averaged to be the final temperature rise data.

[0016] Preferably, before step S1, the method further includes: placing the device in a state where no electrical signal is loaded, collecting the light reflectivity of the device area to be tested, obtaining the light reflectivity of the initial state, heating the device, obtaining the temperature change and the light reflectivity change, and calculating the thermal reflection calibration coefficient of the area to be tested.

[0017] Another aspect of the present invention provides a computer device, including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of the above method.

[0018] Another aspect of the present invention provides a computer-readable storage medium having a computer program stored thereon, which implements the steps of the above method when executed by a processor.

[0019] Another aspect of the present invention provides a computer program product, comprising a computer program, which implements the steps of the above method when executed by a processor.

[0020] According to the above-mentioned aspects of the present invention, the method for improving the accuracy of reflectivity thermal imaging tests, computer equipment, computer-readable storage media and computer program products, through comparison of light reflectivity tests in the area to be tested, it is determined that after the device has dropped to the initial temperature, the device is restarted to enter the next test, and an external synchronous air cooling module is used to achieve rapid cooling of the surface of the device to be tested, thereby reducing the cooling time of a single test process, thereby solving the problem of deviation in temperature rise test results caused by the temperature of the heat source area not being reduced to the initial state during the cyclic test, and improving the accuracy and test efficiency of the reflectivity thermal imaging test. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings used in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0022] Figure 1 is a flow chart of a method for improving the accuracy of reflectivity thermal imaging testing according to an embodiment of the present invention;

[0023] Figure 2 It is a structural diagram of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] Figure 1 FIG. 1 is a flow chart of a method for improving the accuracy of reflectivity thermal imaging testing according to an embodiment of the present invention. Figure 1 As shown, the method for improving the reflectivity thermal imaging test accuracy of the embodiment of the present invention includes steps S1 to S7.

[0026] Step S1: Start

[0027] In the start state, pre-set the device's electrical signal / power loading conditions, test time, test cycle number conditions, etc. Example: Get the temperature rise of the GaN HEMT device 10us after starting at 10W power, take the average of the temperature rise data obtained after 4 test cycles, and output it as the final result.

[0028] In one embodiment, before the start state of step S1, when the device is not loaded with an electrical signal, the light reflectivity of the device area to be tested is collected to obtain the light reflectivity R0 of the initial state, the device is heated by a temperature control platform, the temperature change and the light reflectivity change are tested, and then the thermal reflection calibration coefficient C of the area to be tested is calculated based on formula (1): th .

[0029] Step S2: Device initial state setting

[0030] The device is adjusted to a non-working state (no electrical signal loaded state) without any electrical signal loaded, and the temperature of the device is stabilized through the temperature control platform, so that the temperature of the device is at the initial state temperature (normal temperature 25°C).

[0031] Step S3: Loading electrical signal to the device

[0032] According to the preset electrical signal loading conditions, the device under test is loaded with electrical signals / power through an external power supply, so that the device is in the state of loading electrical signals, so as to obtain the temperature rise data of the device at a specific moment according to the temperature test requirements of the device. Example: Get the temperature rise of the GaN HEMT device at 10us after starting at 10W power.

[0033] Step S4: Light reflectance collection

[0034] After the device is started according to the specified electrical signal, the light reflectance collection system collects the light reflectance of the device to be tested area when the preset test time is reached, and records it as the light reflectance R1.

[0035] Step S5: Cooling process

[0036] The device is switched from a state of being loaded with electrical signals to a state of being unloaded with electrical signals. The temperature control platform cools the device through a liquid cooling system. To ensure that the temperature of the heat source area of ​​the device drops to the initial state as quickly as possible, an external synchronous air cooling module is used to quickly cool the surface of the device to be tested (the area to be tested), thereby reducing the cooling time of a single test process.

[0037] Step S6: Reflectivity comparison

[0038] The light reflectivity of the surface of the device to be tested is collected to obtain the current light reflectivity R, and the current light reflectivity R is compared with the light reflectivity R0 in the initial state. When the absolute value deviation or absolute value ratio of R to the light reflectivity R0 in the initial state is less than or equal to the set threshold, it is considered that the device has recovered to the initial state temperature, and the liquid cooling system and the air cooling module stop cooling the device; when the absolute value deviation or absolute value ratio of R to the light reflectivity R0 in the initial state is greater than the set threshold, it is considered that the requirement is not met, the liquid cooling system and the air cooling module continue to cool the device, and the current light reflectivity R is collected again until the absolute value deviation or absolute value ratio of R to the light reflectivity R0 in the initial state is less than or equal to the set threshold, it is considered that the device has recovered to the initial state temperature, and the liquid cooling system and the air cooling module stop cooling the device.

[0039] Step S7: Determine the number of cycles

[0040] Repeat steps S3 to S6 until the preset number of cycles is completed. Example: Set the test cycle to 4 times, and perform 4 cycles of testing to obtain the light reflectances R1, R2, R3, and R4.

[0041] Based on the light reflectivity obtained in the test, the temperature rise data in each cycle test is obtained in combination with formula (1), and the data is averaged to output the final temperature rise result. Example: Based on the reflectivity R1, R2, R3, and R4 obtained from 4 cycle tests, refer to formula (1) to obtain 4 groups of ΔT1, ΔT2, ΔT3, and ΔT4, and average the 4 groups of temperature rise data to obtain the final temperature rise data ΔT.

[0042] According to the method for improving the accuracy of reflectivity thermal imaging test in the above-mentioned embodiment of the present invention, through the light reflectivity test comparison of the area to be tested, it is determined that the device has dropped to the initial temperature, and then the device is restarted to enter the next test. The external synchronous air cooling module can achieve rapid cooling of the surface of the device to be tested, thereby reducing the cooling time of a single test process. This technical invention scheme successfully solves the problem that the temperature of the heat source area has not been reduced to the initial state during the cycle test, resulting in deviations in the temperature rise test results, and improves the accuracy and test efficiency of the reflectivity thermal imaging test. It can effectively help the reflectivity thermal imaging test technology to be further promoted to the industry and improve the commercial maturity of related products, and therefore has huge economic and social benefits.

[0043] An embodiment of the present invention further provides a computer device, which may be a server, and its internal structure diagram may be as shown in FIG. Figure 2 As shown. The computer device includes a processor, a memory and a network interface connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store operating parameter data of each framework. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, the steps of the method of the embodiment of the present invention are implemented.

[0044] Those skilled in the art will understand that Figure 2 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0045] An embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the method of the embodiment of the present invention are implemented.

[0046] An embodiment of the present invention further provides a computer program product, including a computer program, which implements the steps of the method of the embodiment of the present invention when executed by a processor.

[0047] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A method for improving the accuracy of reflectivity thermal imaging testing, characterized in that: include: Step S1, presetting the electrical signal loading conditions, test time, and test cycle number of the device to be tested; Step S2, making the device in a state where no electrical signal is loaded, and making the temperature of the device in an initial state temperature; Step S3, according to the preset electrical signal loading conditions, the device is loaded with electrical signals through an external power supply, so that the device is in an electrical signal loading state; Step S4, when the preset test time is reached, the light reflectivity of the device to be tested area is collected and the temperature rise data is calculated; Step S5, switching the device from a state of loading an electrical signal to a state of not loading an electrical signal, cooling the device by a liquid cooling system, and quickly cooling the device to be tested area by an external synchronous air cooling module; Step S6, collecting the light reflectivity of the device to be tested area to obtain the current light reflectivity, comparing the current light reflectivity with the light reflectivity of the initial state, when the absolute value deviation or absolute value ratio of the current light reflectivity to the light reflectivity of the initial state is less than or equal to the set threshold, it is determined that the device has been restored to the initial state temperature, and the liquid cooling system and the air cooling module stop cooling the device; when the absolute value deviation or absolute value ratio of the current light reflectivity to the light reflectivity of the initial state is greater than the set threshold, the liquid cooling system and the air cooling module continue to cool the device, and collect the current light reflectivity again, until the absolute value deviation or absolute value ratio of the current light reflectivity to the light reflectivity of the initial state is less than the set threshold, it is determined that the device has been restored to the initial state temperature, and the liquid cooling system and the air cooling module stop cooling the device; Step S7, repeating steps S3 to S6 until the preset number of cycles of testing is completed, and averaging the temperature rise data of each test as the final temperature rise data; Before step S1, the method also includes: placing the device in a state where no electrical signal is loaded, collecting the light reflectivity of the device area to be tested, obtaining the light reflectivity of the initial state, heating the device, obtaining the temperature change and the light reflectivity change, and calculating the thermal reflection calibration coefficient of the area to be tested.

2. A computer device comprising a memory, a processor and a computer program stored in the memory, characterized in that: The processor executes the computer program to implement the steps of the method of claim 1.

3. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to claim 1 are implemented.

4. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to claim 1 are implemented.

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