Grinding method and grinding equipment

Abstract

The invention provides a grinding method and grinding equipment. The grinding method comprises the steps that first grinding treatment is conducted on a to-be-ground face, first tracks, second tracks to Nth tracks are formed on the to-be-ground face, N is a positive integer larger than or equal to 3, the first tracks, the second tracks to the Nth tracks are multiple first grinding tracks which are the same in shape and different in position, and the first grinding tracks are multiple first grinding tracks in the radial direction of the first grinding tracks, the parts of the two adjacent first grinding tracks are overlapped; and after the first grinding treatment, a first bulge is formed between two adjacent first grinding tracks. And second grinding treatment is conducted on the to-be-ground surface to remove part of the first protrusions, so that the first protrusions form second protrusions, and the height of the second protrusions is smaller than that of the first protrusions. According to the grinding method, operation is easy, the grinding parameter solving efficiency is high, the operation cost is low, the positioning difficulty of grinding equipment is lowered, the residual first protrusions are removed, so that the grinding precision is improved, and the phenomenon of excessive removal or insufficient removal is avoided.

Description

Technical Field

[0001] The present application belongs to the field of grinding technology, and specifically relates to a grinding method and a grinding device. Background Art

[0002] With the rapid popularization of consumer electronic products such as smart phones, digital cameras and virtual reality devices, the market demand for high-performance optical lenses continues to increase, such as spherical lenses and aspherical lenses. Aspherical lenses effectively reduce spherical aberration and other aberrations through complex surface shape design, significantly improving imaging quality, but their complex manufacturing process and high cost limit their large-scale application.

[0003] At present, the commonly used processing method for aspheric lenses is to use traditional CNC machine tools to rough-process them into the maximum fitting sphere, then use precision CNC machine tools to fine-process them into aspheric surfaces, and then use grinding and polishing equipment to grind and polish them. Among them, the surface irregularities and roughness are eliminated by grinding, and then polishing is performed to achieve a higher surface finish and gloss. The commonly used grinding method is usually to fix the optical components, calculate the processing parameters of the grinding head on concentric tracks, spiral lines, gratings and other tracks for grinding, but the grinding method of the related technology is complicated to operate, the grinding equipment has high requirements for positioning accuracy, and the efficiency of solving the grinding parameters is low, which is not conducive to controlling the surface accuracy of optical components and is prone to over-removal or under-removal. Summary of the invention

[0004] In view of this, the first aspect of the present application provides a grinding method, which is applied to an optical component having a surface to be ground, and the grinding method comprises:

[0005] Performing a first grinding process on the surface to be ground, forming a first track, a second track to an Nth track located on the surface to be ground, N ≥ 3 and N is a positive integer, the first track, the second track to the Nth track are a plurality of first grinding tracks with the same shape and different positions, and along the radial direction of the first grinding track, parts of two adjacent first grinding tracks overlap; after the first grinding process, a first protrusion is formed between two adjacent first grinding tracks;

[0006] The surface to be ground is subjected to a second grinding process to remove a portion of the first protrusions so that the first protrusions form second protrusions, and the height of the second protrusions is smaller than the height of the first protrusions.

[0007] wherein, in the first grinding process, each of the first grinding tracks has different discrete points;

[0008] The step of performing a second grinding process on the surface to be ground comprises:

[0009] forming a first sub-track to an N-1th sub-track located on the surface to be polished, wherein the first sub-track to the N-1th sub-track are a plurality of second polishing tracks with the same shape and different positions, and there is a gap between two adjacent second polishing tracks, and in the second polishing process, each of the second polishing tracks has different sub-discrete points;

[0010] The first grinding track and the second grinding track have the same shape and different positions, the first sub-discrete point of the first sub-track is located between the first discrete point of the first track and the second discrete point of the second track, and the N-1th sub-discrete point of the N-1th sub-track is located between the N-1th discrete point of the N-1th track and the Nth discrete point of the N track.

[0011] The first sub-discrete point is located at the middle point between the first discrete point and the second discrete point, and the N-1th sub-discrete point is located at the middle point between the N-1th discrete point and the Nth discrete point.

[0012] Wherein, the step of performing a first grinding process on the surface to be ground includes:

[0013] The first track, the second track to the Nth track respectively form a first groove, two adjacent first grooves partially overlap, and the width of the first groove gradually decreases along the arrangement direction from the opening of the first groove to the bottom of the first groove.

[0014] Among them, in any of the first grinding tracks, the center point of the bottom of the first groove formed by the Ath track corresponds to the Ath discrete point, and A is a positive integer.

[0015] Wherein, the step of performing a second grinding process on the surface to be ground includes:

[0016] The first sub-track to the N-1th sub-track respectively form a second groove, there is a gap between two adjacent second grooves, and the width of the second groove gradually decreases along the arrangement direction of the second groove openings to the bottoms of the second grooves.

[0017] Among them, in any of the second grinding tracks, the center point of the bottom of the second groove formed by the Bth sub-track corresponds to the Bth sub-discrete point, and B is a positive integer.

[0018] Wherein, the step of performing a second grinding process on the surface to be ground includes:

[0019] One first protrusion is formed into two second protrusions; wherein, in the first grinding process, the number of the first protrusions is N-1, and in the second grinding process, the number of the second protrusions is 2×(N-1).

[0020] Wherein, after the step of performing a second grinding process on the surface to be ground, the method further comprises:

[0021] The surface to be ground is subjected to a third grinding process to remove a portion of the second protrusions so that the second protrusions form third protrusions, and the height of the third protrusions is smaller than the height of the second protrusions.

[0022] The second aspect of the present application provides a grinding device, which includes a grinding device and a processor electrically connected to the grinding device, the grinding device is used to grind the surface to be ground of the optical component, and the processor is used to execute the grinding method provided in the first aspect of the present application.

[0023] The present application provides a grinding method and a grinding device. By using the grinding method provided by the present application, in the first grinding process, two adjacent first grinding tracks can be partially overlapped, which not only realizes grinding of the surface to be ground, removes some defects, ripples, etc., but also controls the degree of grinding to form a first protrusion to be processed, and provides a basis for the subsequent second grinding process to improve the grinding accuracy; in the second grinding process, at least part of the first protrusion located between the two first grinding tracks can be removed, thereby further improving the grinding accuracy. The grinding method provided by the present application is simple to operate, has high efficiency in solving grinding parameters, low operating costs, reduces the positioning difficulty of the grinding equipment, and improves the grinding accuracy by removing the residual first protrusion, which is conducive to controlling the surface accuracy of axisymmetric components and avoiding excessive removal or under-removal. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0025] Figure 1 A schematic diagram of a grinding method according to an embodiment of the present application.

[0026] Figure 2 A schematic diagram of a grinding track provided in one embodiment of the present application is a concentric track path.

[0027] Figure 3 A schematic diagram of a grinding track provided in one embodiment of the present application is a spiral path.

[0028] Figure 4 A schematic diagram of a path in which the grinding track provided in one embodiment of the present application is a grating path.

[0029] Figure 5 A schematic diagram of a grinding method according to an embodiment of the present invention Figure 1 .

[0030] Figure 6 A schematic diagram of a grinding method according to an embodiment of the present invention Figure 2 .

[0031] Figure 7 A schematic diagram of a grinding method according to an embodiment of the present invention Figure 3 .

[0032] Figure 8 A schematic diagram of a grinding method according to an embodiment of the present invention Figure 4 .

[0033] Explanation of reference numerals: surface to be ground 1a, target surface 1b, first grinding track 10, first groove 11, first protrusion 12, second grinding track 20, second groove 21, second protrusion 22. DETAILED DESCRIPTION

[0034] The following are preferred implementations of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

[0035] Unless otherwise specified or there is a contradiction, the terms and phrases used in this application have the following meanings:

[0036] In this application, "first", "second", etc. are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0037] In this application, "one or several" refers to any one, any two or more of the listed items. Among them, "several" refers to any two or more of the listed items.

[0038] In the present application, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] The following is a detailed introduction to the grinding methods in the related technology. In the related grinding method one, the grinding head grinds along a concentric circle trajectory, and the feed amount of the grinding path is controlled to optimize the overall surface shape of the optical component. The defect of grinding method one is that after the grinding head grinds and polishes along the trajectory, there will be ungrinded and polished areas at the intersection of the two paths of the optical component, and the residual height is not effectively removed. In the related grinding method two, the optical component is first fixed, and the grinding head is polished along the spiral motion trajectory. The polishing parameters of the grinding head are calculated by controlling the dwell time. The defect of grinding method two is that the grinding head moves in a spiral line, the number of axes required for equipment grinding and polishing increases, the influence of positioning errors is further increased, and the spiral trajectory solution is complex and costly.

[0040] Therefore, the grinding method of the related art is complicated to operate, the grinding equipment has high requirements on positioning accuracy, and the efficiency of solving the grinding parameters is low, which is not conducive to controlling the surface accuracy of optical components and is prone to over-removal or under-removal.

[0041] Please refer to Figure 1-Figure 8 The present application provides a grinding method, which is applied to an optical component having a surface 1a to be ground. The grinding method includes the following steps S100 and S200. Each step is described in detail below.

[0042] S100, performing a first grinding treatment on the surface to be ground 1a to form a first track, a second track to an N-th track located on the surface to be ground 1a, N≥3 and N is a positive integer, the first track, the second track to the N-th track are multiple first grinding tracks 10 with the same shape and different positions, and along the radial direction of the first grinding track 10, parts of two adjacent first grinding tracks 10 overlap; after the first grinding treatment, a first protrusion 12 is formed between two adjacent first grinding tracks 10.

[0043] The optical component can be a symmetrical optical component, also known as an axisymmetric component. The grinding track is introduced below. The grinding track is the moving track of the grinding head on the surface to be ground 1a. Figure 2-Figure 4 As shown, the shape of the grinding track can be the following paths, such as a concentric path, a spiral path, or a grating path, etc., and the present embodiment does not limit the shape of the grinding track. In the grinding method, the first grinding track 10 of the first grinding process has the same shape as the second grinding track 20 of the second grinding process, the second grinding track 20 of the second grinding process has the same shape as the third grinding track of the third grinding process, and so on. The following uses a concentric circle path for schematic illustration, but it does not mean that the shape of the grinding track can only use a concentric circle path.

[0044] like Figure 5 and Figure 6 As shown, when the shape of the grinding track is a concentric track path, the first track, the second track to the Nth track are all circular tracks with the center point of the surface to be ground 1a as the center. And the parts of the two adjacent first grinding tracks 10 overlap, that is, the parts of the two adjacent circular tracks overlap, for example, the first track overlaps with the second track, and the N-1th track overlaps with the Nth track. After the first grinding process, a first protrusion 12 is formed between the two adjacent circular tracks, for example, a first protrusion 12 is formed between the first track and the second track, and a first protrusion 12 is formed between the N-1th track and the Nth track.

[0045] Among them, the positions of the first track, the second track to the Nth track are different, and it can also be understood that the first track, the second track to the Nth track have different discrete points respectively, so that under the action of multiple first grinding tracks 10, the grinding surface 1a to be ground is achieved to remove some defects, ripples, etc., and the parts of two adjacent first grinding tracks 10 are overlapped, the degree of grinding is controlled, and the first protrusion 12 to be processed is formed, which provides a basis for the subsequent second grinding process to improve the grinding accuracy.

[0046] S200 , performing a second grinding process on the surface to be ground 1 a to remove a portion of the first protrusions 12 , so that the first protrusions 12 form second protrusions 22 , and the height of the second protrusions 22 is smaller than the height of the first protrusions 12 .

[0047] like Figure 7 and Figure 8 As shown, in the second grinding process, a portion of the first protrusion 12 is removed by grinding to reduce the height of the first protrusion 12, thereby forming a second protrusion 22.

[0048] The height of the second protrusion 22 is H1, the height of the second protrusion 22 is H2, H2 / H1<1, and specifically, H2 / H1<0.9, or H2 / H1<0.8, or H2 / H1<0.7, or H2 / H1<0.6, or H2 / H1<0.5, etc. It should be noted that by changing the material of the optical component and multiple parameters of the grinding process, such as contact pressure, feed rate, dwell time, etc., H2 / H1 can have different ratios.

[0049] In summary, the grinding method provided by the present application can make the two adjacent first grinding tracks 10 partially overlap in the first grinding process, so that the grinding of the surface to be ground 1a is realized, and the degree of grinding is controlled to form the first protrusion 12 to be processed, which provides a basis for the subsequent second grinding process to improve the grinding accuracy; in the second grinding process, at least part of the first protrusion 12 located between the two first grinding tracks 10 can be removed, thereby further improving the grinding accuracy. The grinding method provided by the present application is simple to operate, has high efficiency in solving grinding parameters, low operating costs, reduces the difficulty of positioning the grinding equipment, and improves the grinding accuracy by removing the remaining first protrusion 12, which is conducive to controlling the surface accuracy of optical components and avoiding excessive removal or under-removal.

[0050] Please refer to Figure 5-Figure 8 In one embodiment, in the first grinding process, each of the first grinding tracks 10 has different discrete points.

[0051] For example, the first trajectory has a first discrete point Y1, the second trajectory has a second discrete point Y2, and the N-1th trajectory has an N-1th discrete point Y N-1 , the Nth trajectory has the Nth discrete point Y N .

[0052] More specifically, when the shape of the grinding track is a concentric track path, the first track, the second track to the Nth track are all circular tracks with the center point of the surface to be ground 1a as the center, the first discrete point corresponds to the radius of the first track, the second discrete point corresponds to the radius of the second track, the N-1th discrete point corresponds to the radius of the N-1th track, and the Nth discrete point corresponds to the radius of the Nth track.

[0053] In step S200 of performing a second grinding process on the surface to be ground 1a, the following steps are included:

[0054] S210, forming the first sub-track to the N-1th sub-track located on the surface to be ground 1a, wherein the first sub-track to the N-1th sub-track are multiple second grinding tracks 20 with the same shape and different positions, and there is a gap between two adjacent second grinding tracks 20. In the second grinding process, each of the second grinding tracks 20 has different sub-discrete points.

[0055] Among them, the first grinding track 10 and the second grinding track 20 have the same shape and different positions, the first sub-discrete point of the first sub-track is located between the first discrete point of the first track and the second discrete point of the second track, and the N-1th sub-discrete point of the N-1th sub-track is located between the N-1th discrete point of the N-1th track and the Nth discrete point of the N track.

[0056] The first grinding track 10 and the second grinding track 20 have the same shape. Figure 7 and Figure 8 As shown, when the shape of the grinding track is a concentric track path, the first sub-track to the N-1th sub-track are all circular tracks with the center point of the surface to be ground 1a as the center. There is a gap between two adjacent second grinding tracks 20 to avoid mutual interference between adjacent second grinding tracks 20, which is not conducive to controlling the grinding accuracy. For example, there is a gap between the first sub-track and the second sub-track, and there is a gap between the N-2th sub-track and the N-1th sub-track.

[0057] The positions of the first sub-trajectory to the N-1th sub-trajectory are different, which can also be understood as the first sub-trajectory to the N-1th sub-trajectory have different sub-discrete points. For example, the first sub-trajectory has the first sub-discrete point X1, and the N-1th sub-trajectory has the N-1th sub-discrete point X2. N-1 More specifically, when the shape of the grinding track is a concentric track path, the first sub-track to the N-1th sub-track are all circular tracks with the center point of the surface to be ground 1a as the center, the first sub-discrete point corresponds to the radius of the first sub-track, and the N-1th sub-discrete point corresponds to the radius of the N-1th sub-track.

[0058] The first sub-discrete point of the first sub-track is located between the first discrete point of the first track and the second discrete point of the second track. In other words, the first sub-track is located between the first track and the second track, thereby removing part of the first protrusion 12 formed between the first track and the second track. The N-1th sub-discrete point of the N-1th sub-track is located between the N-1th discrete point of the N-1th track and the Nth discrete point of the N track. In other words, the N-1th sub-track is located between the N-1th track and the Nth track, thereby removing part of the first protrusion 12 formed between the N-1th track and the Nth track. Similarly, the second sub-discrete point of the second sub-track is located between the second discrete point of the second track and the third discrete point of the third track.

[0059] In summary, this embodiment uses a second grinding track 20 with the same shape as the first grinding track 10 to remove part of the first protrusion 12, which can further simplify the grinding method, reduce the difficulty of solving grinding parameters, further reduce operating costs, and further reduce the difficulty of positioning the grinding equipment.

[0060] In one implementation, the first sub-discrete point is located at a midpoint between the first discrete point and the second discrete point, and the N-1th sub-discrete point is located at a midpoint between the N-1th discrete point and the Nth discrete point.

[0061] It can also be understood that the first sub-discrete point is the midpoint between the first discrete point and the second discrete point, and the N-1th sub-discrete point is the midpoint between the N-1th discrete point and the Nth discrete point. The specific example is as follows: if the first sub-discrete point is X1, the first discrete point is Y1, and the second discrete point is Y2, then X1 = (Y1 + Y2) / 2; if the N-1th sub-discrete point is X N-1 , the N-1th discrete point is Y N-1 , the Nth discrete point is Y N , then X N-1 =(Y N-1 +Y N ) / 2.

[0062] In summary, this embodiment controls a second grinding track 20 to be located between two adjacent first grinding tracks 10 by limiting the relationship between sub-discrete points and discrete points, so that the second grinding process can remove more first protrusions 12. This not only simplifies the grinding method and reduces the difficulty of solving the grinding parameters, but also improves the grinding accuracy, which is beneficial to controlling the surface accuracy of optical components.

[0063] Please refer to Figure 5-Figure 6 In one embodiment, in the step S100 of performing a first grinding process on the surface to be ground 1a, the following steps are included:

[0064] S101, the first track, the second track to the Nth track respectively form a first groove 11, two adjacent first grooves 11 partially overlap, and the width of the first groove 11 gradually decreases along the arrangement direction of the opening of the first groove 11 pointing to the bottom of the first groove 11.

[0065] The groove sidewall of the first groove 11 formed by the first grinding track 10 is an inclined slope. Optionally, the opposite groove sidewalls of the first groove 11 are connected at one end away from the opening, in other words, the first groove 11 is tapered. Two adjacent first grooves 11 partially overlap, so that a first protrusion 12 is formed between the two adjacent first grooves 11. Optionally, along the arrangement direction from the opening of the first groove 11 to the bottom of the first groove 11, the width of the first protrusion 12 gradually increases, in other words, the shape of the first protrusion 12 is triangular.

[0066] In summary, this embodiment limits the width of the first groove 11 formed by the first grinding track 10, thereby limiting the shape of the first protrusion 12, so that the first protrusion 12 can be more easily removed later, thereby improving the grinding accuracy, which is beneficial to controlling the surface accuracy of the optical component and avoiding over-removal or under-removal.

[0067] Among them, in any of the first grinding tracks 10, the center point of the bottom of the first groove 11 formed by the Ath track corresponds to the Ath discrete point, and A is a positive integer.

[0068] For example, the center point of the bottom of the first groove 11 formed by the first track corresponds to the first discrete point, the center point of the bottom of the first groove 11 formed by the second track corresponds to the second discrete point, the center point of the bottom of the first groove 11 formed by the N-1 track corresponds to the N-1 discrete point, the center point of the bottom of the first groove 11 formed by the N track corresponds to the N discrete point, and so on.

[0069] Please refer to Figure 7-Figure 8 In one embodiment, in the step S200 of performing a second grinding process on the surface to be ground 1a, the following steps are included:

[0070] S201, a second groove 21 is formed respectively from the first sub-track to the N-1th sub-track, and there is a gap between two adjacent second grooves 21. The width of the second groove 21 gradually decreases along the arrangement direction of the second groove 21 opening pointing to the bottom of the second groove 21.

[0071] The groove sidewall of the second groove 21 formed by the second grinding track 20 is an inclined slope. Optionally, the groove sidewalls of the opposite second grooves 21 are connected at one end away from the opening. In other words, the second groove 21 is conical. There is a gap between two adjacent second grooves 21 to avoid interference between adjacent second grooves 21, which is not conducive to controlling the grinding accuracy. The second groove 21 is arranged on the first protrusion 12 to remove part of the first protrusion 12 so that one first protrusion 12 forms two second protrusions 22. Optionally, along the arrangement direction of the second groove 21 opening pointing to the groove bottom of the second groove 21, the width of the second protrusion 22 gradually increases. In other words, the shape of the second protrusion 22 is triangular. Optionally, the first groove 11 and the second groove 21 have the same shape. The opening width of the first groove 11 is greater than the opening width of the second groove 21.

[0072] In summary, this embodiment limits the width of the second groove 21 formed by the second grinding track 20, thereby limiting the shape of the second protrusion 22, so as to facilitate easier removal of the first protrusion 12 and subsequent easier removal of the second protrusion 22, thereby further improving the grinding accuracy, which is beneficial to further control the surface accuracy of the optical component and further avoid excessive or under-removal.

[0073] Among them, in any of the second grinding tracks 20, the center point of the bottom of the second groove 21 formed by the Bth sub-track corresponds to the Bth sub-discrete point, and B is a positive integer.

[0074] For example, the center point of the bottom of the second groove 21 formed by the first sub-track corresponds to the first sub-discrete point, the center point of the bottom of the second groove 21 formed by the N-1th sub-track corresponds to the N-1th sub-discrete point, and so on.

[0075] Please refer to Figure 5-Figure 8 In one embodiment, in the step S200 of performing a second grinding process on the surface to be ground 1a, the following steps are included:

[0076] S220, forming two second protrusions 22 from one first protrusion 12; wherein, in the first grinding process, the number of the first protrusions 12 is N-1, and in the second grinding process, the number of the second protrusions 22 is 2×(N-1).

[0077] In this embodiment, by forming two second protrusions 22 from one first protrusion 12, and the height of the second protrusion 22 is smaller than the first height of the first protrusion 12, it is not only possible to control the number and height of the protrusions formed subsequently, thereby further simplifying the grinding method, further improving the efficiency of solving the grinding parameters, further reducing the operating cost, and further improving the grinding accuracy, which is beneficial to further control the surface accuracy of optical components and further avoid excessive removal or under-removal.

[0078] In one embodiment, after the step S200 of performing a second grinding process on the surface to be ground 1a, the method further includes:

[0079] S300 , performing a third grinding process on the surface to be ground 1 a to remove a portion of the second protrusions 22 , so that the second protrusions 22 form third protrusions, and the height of the third protrusions is smaller than the height of the second protrusions 22 .

[0080] Optionally, the step of performing a third grinding treatment on the surface to be ground 1a includes: forming one second protrusion 22 into two third protrusions; wherein, in the second grinding treatment, the number of the second protrusions 22 is 2×(N-1), and in the third grinding treatment, the number of the third protrusions is 4×(N-1).

[0081] Optionally, the height of the second protrusion 22 is H2, the height of the third protrusion is H3, H3 / H2<1, and specifically, H3 / H2<0.9, or H3 / H2<0.8, or H3 / H2<0.7, or H3 / H2<0.6, or H3 / H2<0.5, etc. It should be noted that by changing the material of the optical component and multiple parameters of the grinding process, such as contact pressure, feed rate, dwell time, etc., H3 / H2 can have different ratios.

[0082] By analogy, the surface to be ground 1a is ground multiple times to continuously form protrusions with smaller heights, thereby further improving the grinding accuracy, which is beneficial to further control the surface accuracy of the optical component and further avoid over-removal or under-removal.

[0083] In order to make the purpose and advantages of the present application clearer, the effects of the grinding method of the present application are further described in detail below in conjunction with specific embodiments.

[0084] Provide optical components, which are axisymmetric components, so that the axisymmetric components rotate evenly around the center of the workpiece. The grinding head makes discrete feeds in the direction of one axis of the axisymmetric component, using concentric circle trajectories, such as Figure 2 Uniform removal is achieved by synchronously controlling the feed rate, contact pressure, and dwell time of the grinding head.

[0085] like Figure 5 As shown, the first grinding process is performed on the surface to be ground 1a, and the amount of grinding on the surface to be ground 1a is determined according to the initial surface shape of the axisymmetric component and the target surface 1b; the grinding head is determined at the first discrete point, the second discrete point to the Nth discrete point (Y1, Y2, ..., Y N ) of the first feed amount, the second feed amount to the Nth feed amount (Z1, Z2, ..., Z N-1 ). Control the grinding head to move to the first discrete point of the surface to be ground 1a, the grinding head contacts the surface to be ground 1a with a first pressure, and grinds with a first residence time. Control the grinding head to move to the second discrete point of the surface to be ground 1a with a first feed amount, the grinding head contacts the surface to be ground 1a with a second pressure, and grinds with a second residence time. Control the grinding head to move to the Nth discrete point of the surface to be ground 1a with an N-1th feed amount, the grinding head contacts the surface to be ground 1a with an Nth pressure, and grinds with an Nth residence time until the entire surface to be ground 1a is covered, and N-1 residual heights remain on the surface to be ground 1a, that is, N-1 first protrusions 12 are formed. The first grinding process is completed, and the residual height of the surface to be ground 1a after grinding is consistent with the surface shape as shown in FIG. Figure 6 As shown;

[0086] The second grinding process is performed on the surface to be ground 1a to re-determine the amount of grinding on the surface to be ground 1a of the axisymmetric component, such as Figure 7 As shown in the figure, a first sub-discrete point of the second grinding process is determined between the first discrete point and the second discrete point of the first grinding process. A second sub-discrete point of the second grinding process is determined between the second discrete point and the third discrete point of the first grinding process. An N-1th sub-discrete point of the second grinding process is determined between the N-1th and Nth discrete points of the first grinding process. According to the first sub-discrete point, the second sub-discrete point to the N-1th sub-discrete point (X1, X2, ..., X2) determined by the second grinding process N-1 ) determines the first sub-feed amount, the second sub-feed amount to the N-2 sub-feed amount (W1, W2, ..., W N-2). Control the grinding head to move to the first sub-discrete point of the surface to be ground 1a with a first sub-feed amount, the grinding head contacts the surface to be ground 1a with a first sub-pressure, and grinds with a first sub-residence time; control the grinding head to move to the second sub-discrete point of the surface to be ground 1a with a second sub-feed amount, the grinding head contacts the surface to be ground 1a with a second sub-pressure, and grinds with a second sub-residence time; control the grinding head to move to the N-1th sub-discrete point of the surface to be ground 1a with an N-1th sub-feed amount, the grinding head contacts the surface to be ground 1a with an N-1th sub-pressure, and grinds with an N-1th sub-residence time until the central area of ​​N-1 residual heights is removed, that is, part of the first protrusions 12 is removed, so that one first protrusion 12 forms two second protrusions 22. The residual height of the surface to be ground 1a is decomposed into 2×(N-1), that is, 2×(N-1) second protrusions 22 are formed. The second grinding process is completed, and the residual height of the surface to be ground 1a after grinding is similar to the surface shape as shown in FIG. Figure 8 As shown;

[0087] The surface to be ground 1a is subjected to a third grinding process, and the above steps are repeated to redetermine the amount to be ground on the surface to be ground 1a of the axisymmetric component, determine 2×(N-1) discrete points, and remove 2×(N-1) residual height centers, that is, remove part of the second protrusions 22 so that one second protrusion 22 forms two third protrusions. The residual height of the surface to be ground 1a is decomposed into 4×(N-1) residual heights, that is, 4×(N-1) third protrusions are formed. Until the residual height meets the accuracy requirements, that is, until the surface to be ground 1a meets the accuracy requirements, it can also be understood that the grinding method of the present application is adopted, and the above steps are repeated to grind the surface to be ground 1a into the target surface 1b.

[0088] In summary, the grinding method provided in this application is simple to operate, has high feasibility, high efficiency in solving grinding parameters, low operating cost, and is conducive to improving grinding accuracy and avoiding over-removal or under-removal.

[0089] The present application also provides a grinding device, which includes a grinding device and a processor electrically connected to the grinding device, wherein the grinding device is used to grind the surface to be ground of the optical component, and the processor is used to execute the grinding method provided above in the present application.

[0090] The grinding device provided in the present application grinds the surface to be ground by adopting the grinding method provided above. In the first grinding process, the two adjacent first grinding tracks can be partially overlapped, which not only realizes the grinding of the surface to be ground and removes some defects, ripples, etc., but also controls the degree of grinding to form a first protrusion to be processed, and provides a basis for the subsequent second grinding process to improve the grinding accuracy; in the second grinding process, at least part of the first protrusion located between the two first grinding tracks can be removed, thereby further improving the grinding accuracy, making the grinding parameter solution efficient, low in operating costs, reducing the positioning difficulty of the grinding equipment, and improving the grinding accuracy, which is beneficial to controlling the surface accuracy of optical components and avoiding excessive removal or under-removal.

[0091] The above is a detailed introduction to the contents provided in the implementation mode of the present application. This article explains and illustrates the principles and implementation modes of the present application. The above explanation is only used to help understand the method and core idea of ​​the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation mode and application scope. In summary, the contents of this specification should not be understood as limiting the present application.

Claims

1. A grinding method, characterized in that: Applied to an optical component having a surface to be ground, the grinding method comprises: Performing a first grinding process on the surface to be ground, forming a first track, a second track to an Nth track located on the surface to be ground, N ≥ 3 and N is a positive integer, the first track, the second track to the Nth track are a plurality of first grinding tracks with the same shape and different positions, and along the radial direction of the first grinding track, parts of two adjacent first grinding tracks overlap; after the first grinding process, a first protrusion is formed between two adjacent first grinding tracks; The surface to be ground is subjected to a second grinding process to remove a portion of the first protrusions so that the first protrusions form second protrusions, and the height of the second protrusions is smaller than the height of the first protrusions.

2. The grinding method according to claim 1, characterized in that In a first grinding process, each of the first grinding tracks has different discrete points; The step of performing a second grinding process on the surface to be ground comprises: forming a first sub-track to an N-1th sub-track located on the surface to be polished, wherein the first sub-track to the N-1th sub-track are a plurality of second polishing tracks with the same shape and different positions, and there is a gap between two adjacent second polishing tracks, and in the second polishing process, each of the second polishing tracks has different sub-discrete points; The first grinding track and the second grinding track have the same shape and different positions, the first sub-discrete point of the first sub-track is located between the first discrete point of the first track and the second discrete point of the second track, and the N-1th sub-discrete point of the N-1th sub-track is located between the N-1th discrete point of the N-1th track and the Nth discrete point of the N track.

3. The grinding method according to claim 2, characterized in that: The first sub-discrete point is located at a midpoint between the first discrete point and the second discrete point, and the N-1th sub-discrete point is located at a midpoint between the N-1th discrete point and the Nth discrete point.

4. The grinding method according to claim 2, characterized in that: The step of performing a first grinding process on the surface to be ground includes: The first track, the second track to the Nth track respectively form a first groove, two adjacent first grooves partially overlap, and the width of the first groove gradually decreases along the arrangement direction from the opening of the first groove to the bottom of the first groove.

5. The grinding method according to claim 4, characterized in that: In any of the first grinding tracks, the center point of the bottom of the first groove formed by the Ath track corresponds to the Ath discrete point, where A is a positive integer.

6. The grinding method according to claim 4, characterized in that: The step of performing a second grinding process on the surface to be ground comprises: The first sub-track to the N-1th sub-track respectively form a second groove, there is a gap between two adjacent second grooves, and the width of the second groove gradually decreases along the arrangement direction of the second groove openings to the bottoms of the second grooves.

7. The grinding method according to claim 6, characterized in that: In any of the second grinding tracks, the center point of the bottom of the second groove formed by the Bth sub-track corresponds to the Bth sub-discrete point, where B is a positive integer.

8. The grinding method according to claim 1, characterized in that: The step of performing a second grinding process on the surface to be ground comprises: One first protrusion is formed into two second protrusions; wherein, in the first grinding process, the number of the first protrusions is N-1, and in the second grinding process, the number of the second protrusions is 2×(N-1).

9. The grinding method according to claim 1, characterized in that: After the step of performing a second grinding process on the surface to be ground, the method further comprises: The surface to be ground is subjected to a third grinding process to remove a portion of the second protrusions so that the second protrusions form third protrusions, and the height of the third protrusions is smaller than the height of the second protrusions.

10. A grinding device, characterized in that: The grinding equipment includes a grinding device and a processor electrically connected to the grinding device, the grinding device is used to grind the surface to be ground of the optical component, and the processor is used to execute the grinding method according to any one of claims 1-9.

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