Testing device and testing equipment
Through the electrical connection between the conductive elastic sheet and the elastic metal parts, the problem of lower test yield caused by direct contact between the standard components and the probe is solved, welding errors are avoided, testing speed and stability are improved, and good electrical contact is achieved and simplified maintenance process.
Patent Information
- Application Number
- CN202410731305.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-05-31
- Filing Date
- 2024-06-06
- Publication Date
- 2024-12-10
AI Technical Summary
During the testing of stacked packaging, direct contact between standard components and probes can easily lead to damage to the hot ball, causing a decrease in the test yield, and there may be tiny bubbles or cracks when soldered to the intermediary printed circuit board, resulting in poor test and difficult Inspection and repair.
The conductive elastic sheet and the elastic metal part are electrically connected to avoid direct contact between the standard elements and the probe, and the standard elements are directly arranged on the conductive elastic sheet, and the elastic metal part is electrically connected to the object to be tested to avoid welding. Caused bubbles or crack problems and improve test speed and stability through thinner design.
Good electrical contact between standard components and probes is achieved, wear problems are avoided, welding errors are reduced, testing speed and stability are improved, and maintenance process is simplified.
Smart Images
Figure CN119104753A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to semiconductor testing technology, and more particularly to a testing device and testing equipment. Background Art
[0002] When performing packaging testing on a package on package (PoP) DUT, the DUT is usually placed between a test head (top socket) and a test socket (bottom socket) having multiple probes arranged vertically. After each probe is electrically connected to the DUT, a test signal is transmitted to the DUT through each probe to achieve the purpose of testing.
[0003] Generally speaking, a test head usually needs to have standard components such as DDR particles, and the object to be tested and the standard components are electrically connected through probes. However, the standard components have the problem of solder ball breakage due to long-term testing, which will lead to the problem of poor contact between the standard components and the object to be tested, resulting in a decrease in test yield. In this regard, the current solution is to directly solder the standard components and other components required for testing onto an interposer printed circuit board (Interposer PCB) to avoid direct contact between the probe and the standard components.
[0004] However, when standard components are soldered on the Interposer PCB, there may be tiny bubbles or cracks that are difficult to detect. This makes it difficult to find the cause of a test failure after use, and the only way to repair it is to remount the standard components to eliminate the problem. In addition, when using standard components soldered on the Interposer PCB, if you want to increase the test speed of the standard components, you must thin the design of the Interposer PCB, which will face the problem of the reaction force of the probe causing the deformation of the Interposer PCB and affecting the stability of the soldering point.
[0005] In view of the above problems, how to provide a testing device, especially how to improve the electrical contact between the standard element and the probe, has become a goal that people in the art are eager to pursue. Summary of the invention
[0006] To solve the above problems of the prior art, the present invention discloses a testing device, comprising: a base, including a plurality of elastic metal parts, and suitable for electrically connecting a test object; and a conductive elastic sheet, disposed on the base, and suitable for electrically connecting each of the elastic metal parts and a standard element (Golden sample) disposed on the conductive elastic sheet.
[0007] In one embodiment, the conductive elastic sheet has a first surface and a second surface opposite to each other, and the standard element is disposed on the first surface, so that the object to be tested is electrically connected to the standard element via the second surface.
[0008] In a specific embodiment, the conductive elastic sheet includes a plurality of conductive elastic regions and a plurality of conductive particles distributed in each of the conductive elastic regions, so that each of the elastic metal pieces is electrically connected to each of the conductors of the standard element through the corresponding conductive elastic regions.
[0009] In another embodiment, the testing device further comprises another conductive elastic sheet located outside the base and contacting each of the elastic metal pieces, wherein the another conductive elastic sheet is suitable for providing electrical connection between each of the elastic metal pieces and the object to be tested.
[0010] In another embodiment, the object under test is a semiconductor package.
[0011] In another embodiment, the standard component is a memory, and the object to be tested is a logic chip or a functional chip.
[0012] In another embodiment, the thickness of the conductive elastic sheet is less than or equal to 2 mm and greater than or equal to 0.15 mm.
[0013] In another embodiment, the thickness of the conductive elastic sheet is less than or equal to 0.4 mm and greater than or equal to 0.15 mm.
[0014] In another embodiment, each of the elastic metal members includes a first contact end facing the conductive elastic sheet, and the first contact end has a protrusion suitable for being immersed in the conductive elastic sheet.
[0015] In another embodiment, the number of the protrusions is multiple and they are pointed.
[0016] In another embodiment, the seat is a metal seat to form a coaxial structure with the elastic metal member.
[0017] In another embodiment, the testing device of the present invention further includes a cover and a gasket located between the cover and the standard element, wherein the gasket is suitable for pressing the standard element.
[0018] The present invention further discloses a testing device, comprising: the aforementioned testing device; and a testing seat, located below the testing device and suitable for carrying the object to be tested.
[0019] In one embodiment, the test seat includes a base and a plurality of base elastic metal parts disposed in the base.
[0020] In another embodiment, the test seat is disposed on a substrate, so that the substrate is tested on the object to be tested through the test seat and the test device.
[0021] As can be seen from the above, the test device of the present invention provides electrical connection by positioning the conductive elastic sheet between the standard component and each of the elastic metal parts, thereby achieving the purpose of avoiding the wear problem caused by direct contact between the standard component and each of the elastic metal parts; furthermore, the standard component can be directly set on the conductive elastic part without welding, thereby avoiding the problem of bubbles or cracks caused by welding; in addition, the test equipment of the present invention can perform packaging testing with the object to be tested through the aforementioned test device, thereby achieving the purpose of testing whether the function of the object to be tested is normal or not. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 It is a cross-sectional schematic diagram of the testing device of the present invention.
[0023] Figure 2 It is a schematic diagram of the structure of the testing device of the present invention using a gasket.
[0024] Figure 3 It is a schematic structural diagram of the conductive elastic sheet of the present invention.
[0025] Figure 4 It is a schematic diagram of the structure of the elastic metal part in the testing device of the present invention.
[0026] Figure 5 FIG. 4 is a cross-sectional schematic diagram of another embodiment of the testing device of the present invention.
[0027] Figure 6 It is a schematic diagram of the structure of the testing equipment of the present invention.
[0028] Main component symbols
[0029] 1 Test setup
[0030] 11 base
[0031] 111 Elastic Metal Parts
[0032] 1111 First contact end
[0033] 1112 Bump
[0034] 112 Piercing
[0035] 113 Storage Space
[0036] 12 Conductive elastic sheet
[0037] 121 First Surface
[0038] 122 Second Surface
[0039] 123 Conductive elastic region
[0040] 124 Conductive particles
[0041] 13 Cover
[0042] 131 Groove
[0043] 14 adhesive strips
[0044] 15 Lower conductive elastic sheet
[0045] 16 Gasket
[0046] 17 Maintenance parts
[0047] 2 Test socket
[0048] 21 Base
[0049] 22 Base elastic metal parts
[0050] 7 substrate
[0051] 8 Objects to be tested
[0052] 9 Standard components
[0053] 91 Electrical conductor. DETAILED DESCRIPTION
[0054] The technical content of the present invention is described below by using specific embodiments, and those skilled in the art can easily understand the advantages and effects of the present invention from the contents disclosed in this specification. However, the present invention can also be implemented or applied by other different specific embodiments.
[0055] Figure 1 As shown in the figure, the test device 1 of the present invention comprises a base 11 and a conductive elastic sheet 12 disposed on the base 11. The description of the test device 1 of the present invention is as follows.
[0056] The base 11 includes a plurality of elastic metal pieces 111 and is suitable for electrically connecting to a DUT 8. Specifically, a plurality of through holes 112 are provided in the base 11, and each of the elastic metal pieces 111 is disposed in a corresponding one of the through holes 112. Accordingly, the base 11 can be electrically connected to the DUT 8 through each of the elastic metal pieces 111. In one embodiment, the elastic metal piece 111 can be a spring probe, and the DUT 8 can be a semiconductor package, or a logic chip or a functional chip.
[0057] The conductive elastic sheet 12 is disposed on the base 11 and is provided for the standard element (Golden sample) 9 to be disposed thereon, and is adapted to electrically connect each of the elastic metal pieces 111 with the standard element 9, wherein the standard element 9 is a known good and normally working chip or element, which can be used as a benchmark for the test system, and thus the standard element 9 ensures the accuracy and reliability of the test system. In one embodiment, the standard element 9 can be a memory, such as a DDR chip.
[0058] According to the above, the test device 1 can be located above the object to be tested 8, and each of the elastic metal pieces 111 is in contact with the top side of the object to be tested 8, so that the standard component 9 is electrically connected to the object to be tested 8 through its multiple conductors 91 (such as solder balls or electrical contact pads) through the conductive elastic sheet 12 and each of the elastic metal pieces 111, thereby avoiding the wear problem of the standard component 9 directly contacting each of the elastic metal pieces 111. Furthermore, the conductive elastic sheet 12 of the present invention is thinner than the traditional interposer PCB, and thus has a thinning effect, which can not only improve the test speed of the standard component, but also ensure the stability of the test.
[0059] In one embodiment, the base 11 may further include a receiving space 113 for receiving the conductive elastic sheet 12 and the standard element 9, and the receiving space 113 is connected to each of the through holes 112, so that each of the elastic metal parts 111 may extend from the through holes 112 to the receiving space 113 to contact the conductive elastic sheet 12. Furthermore, the testing device 1 of the present invention may further include a cover 13 covering the receiving space 113 and having a groove 131 recessed on the lower surface, and a rubber strip 14 disposed in the groove 131 and located between the cover 13 and the standard element 9. When the cover 13 covers the receiving space 113, the rubber strip 14 will be forced to press against the standard element 9, so that the standard element 9 can be firmly combined with the conductive elastic sheet 12. In addition, the rubber strip 14 can also compensate for the thickness tolerance of the cover body 13 during manufacturing by exposing the lower surface of the cover body 13. For example, if the cover body 13 has a thickness tolerance during manufacturing, so that there is a gap of about 0.2 mm between the cover body 13 and the standard element 9, the bottom of the rubber strip 14 is exposed by about 0.2 mm from the lower surface of the cover body 13, thereby compensating for the thickness tolerance of the cover body 13.
[0060] In other embodiments, Figure 2, which is a schematic diagram of the structure of an embodiment of the test device of the present invention using a shim. In this embodiment, instead of setting a component in the groove 131 of the cover 13, a shim 16 located between the cover 13 and the standard element 9 is used instead. In a specific embodiment, the thickness of the shim 16 can be, for example, 0.05 mm. Accordingly, if the tolerance of the cover 13 in manufacturing is 0.05 mm, the test device 1 of the present invention can be compensated by the thickness of the shim 16.
[0061] In addition, the testing device 1 of the present invention can also stack multiple gaskets 16 for compensation according to the tolerance value. That is, if the tolerance of the cover 13 during manufacturing is 0.2 mm, four gaskets 16 with a thickness of 0.05 mm can be stacked for compensation. Figure 1 Strip 14 or Figure 2 The gasket 16 can provide the effect of compensating the manufacturing tolerance. In particular, the gasket 16 with a thinner thickness is selected to compensate for the aforementioned manufacturing tolerance, which can have a better degree of freedom.
[0062] Also, please return to Figure 1 The base body 11 may further include a retainer 17 located in the accommodating space 113 and used to provide a stable support for each elastic metal member 111 .
[0063] In one embodiment, the base body 11 may be a metal base body, so that when the elastic metal member 111 is disposed in the through hole 112 , a coaxial structure is formed, and thus it is applicable to a high frequency testing environment.
[0064] Figure 3 The schematic diagram of the structure of the conductive elastic sheet of the present invention is shown in the figure, and the Figure 1The conductive elastic sheet 12 has a first surface 121 and a second surface 122 opposite to each other, so that the standard element 9 can be arranged on the first surface 121, and the second surface 122 contacts each of the elastic metal parts 111, so that the object to be tested 8 is electrically connected to the standard element 9 via the second surface 122. Furthermore, in a specific embodiment, the conductive elastic sheet 12 further includes a plurality of conductive elastic regions 123 and a plurality of conductive particles 124 distributed in each of the conductive elastic regions 123, wherein each of the conductive elastic regions 123 is pressed from the first surface 121 and the second surface 122, so that the plurality of conductive particles 124 in the conductive elastic region 123 contact each other, so that the first surface 121 and the second surface 122 of the conductive elastic region 123 are connected to each other through the plurality of conductive particles 124 contacting each other. Accordingly, the testing device 1 of the present invention only needs to place the standard component 9 on the conductive elastic sheet 12 with each conductor 91 corresponding to each conductive elastic area 123, and the standard component 9 and each elastic metal piece 111 can be pressed against each conductive elastic area 123, so that the corresponding conductive elastic areas 123 can be electrically connected. Therefore, there is no need to connect the standard component 9 and the conductive elastic sheet 12 by welding, so there will be no problem of bubbles or cracks caused by welding. Moreover, when the conductive elastic sheet 12 needs to be inspected or replaced, there is no need to first desolder the standard component 9, and the conductive elastic sheet 12 can be directly removed for inspection or replacement.
[0065] In one embodiment, the thickness of the conductive elastic sheet 12 may be less than or equal to 2 mm and greater than or equal to 0.15 mm. Preferably, the thickness of the conductive elastic sheet 12 is less than or equal to 0.4 mm and greater than or equal to 0.15 mm. Accordingly, when the conductive elastic region 123 of the conductive elastic sheet 12 is electrically conductive, the standard element 9 and the elastic metal member 111 have a low resistance due to the thin thickness, and thus have a better electrical transmission effect.
[0066] Figure 4 This is a schematic diagram of the structure of the elastic metal member in the test device of the present invention. Figure 3, each of the elastic metal parts 111 includes a first contact end 1111 facing the conductive elastic sheet 12 and having a protrusion 1112 suitable for being immersed in the conductive elastic sheet 12. In one embodiment, the plurality of elastic metal parts 111 may have a plurality of protrusions 1112, each of which may be pointed and have a length less than the thickness of the conductive elastic sheet 12, so that each of the protrusions 1112 may pierce the surface of the conductive elastic sheet 12 without passing through the conductive elastic sheet 12, thereby being embedded in the conductive elastic sheet 12, so that each of the protrusions 1112 directly contacts the conductive particles 124 in the conductive elastic sheet 12, thereby having the effect of low contact resistance; in addition, in the process of each of the protrusions 1112 contacting the conductive particles 124, the conductive particles 124 will rub the surface of each of the protrusions 1112 to clean the surface, thereby having the effect of maintaining low contact resistance.
[0067] Figure 5 This is a cross-sectional schematic diagram of another embodiment of the testing device of the present invention. Please refer to Figure 4 . As shown in the figure, the test device 1 of the present invention may also include a lower conductive elastic sheet 15 located outside the base 11 and contacting each of the elastic metal parts 111, wherein the lower conductive elastic sheet 15 is suitable for providing electrical connection between each of the elastic metal parts 111 and the object to be tested 8, that is, the object to be tested 8 is electrically connected to the standard component 9 in sequence through the lower conductive elastic sheet 15, the elastic metal part 111 and the conductive elastic sheet 12, thereby achieving the purpose of reducing the contact resistance between each of the elastic metal parts 111 and the object to be tested 8. In addition to increasing the contact to stabilize the test process, the problem of mutual wear can be avoided. In another embodiment, the elastic metal part 111 can be placed upside down, that is, the elastic metal part 111 is placed in a manner that the protrusion 1112 faces the lower conductive elastic sheet 15.
[0068] Figure 6 As shown in the figure, the test equipment of the present invention comprises a test device 1 and a test socket 2, wherein the structure of the test device 1 has been described above and will not be described again, and the structure of the test socket 2 is described in detail as follows.
[0069] The test socket 2 is located below the test device 1 and is suitable for carrying the object under test 8. In this embodiment, the test socket 2 and the test device 1 constitute a PoP stacking test device. When testing the object under test 8, the test device 1 is moved toward the test socket 2 to press against the object under test 8 located on the test socket 2, so that the top side and the bottom side of the object under test 8 are electrically connected to the test device 1 and the test socket 2 respectively, so that when the test socket 2 receives a test signal, the object under test 8 is packaged and tested.
[0070] In a specific embodiment, the test seat 2 includes a base 21 and a plurality of base elastic metal parts 22 arranged in the base 21, and the test seat 2 can be arranged on a substrate 7, and the substrate 7 can provide the test signal when performing the packaging test, thereby allowing the substrate 7 to test the object under test 8 through the test seat 2 and the test device 1, thereby achieving the purpose of packaging the object under test 8.
[0071] The above embodiments are only illustrative and are not intended to limit the present invention. Those skilled in the art may modify and change the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is defined by the claims attached to the present invention, and as long as it does not affect the effect and implementation purpose of the present invention, it should be included in this disclosed technical content.
Claims
1. A testing device, comprising: A base body, comprising a plurality of elastic metal parts, and adapted to be electrically connected to an object to be tested; as well as A conductive elastic sheet is arranged on the base and is suitable for electrically connecting each of the elastic metal pieces and a standard element arranged on the conductive elastic sheet.
2. The testing device according to claim 1, wherein: The conductive elastic sheet has a first surface and a second surface which are opposite to each other, and the standard element is arranged on the first surface so that the object to be tested is electrically connected to the standard element via the second surface.
3. The testing device according to claim 1, wherein: The conductive elastic sheet comprises a plurality of conductive elastic regions and a plurality of conductive particles distributed in each of the conductive elastic regions, so that each of the elastic metal pieces is electrically connected to each of the conductors of the standard element through the corresponding conductive elastic regions.
4. The testing device according to claim 1, wherein: The testing device further comprises another conductive elastic sheet located outside the base body and contacting each of the elastic metal pieces, wherein the other conductive elastic sheet is suitable for providing electrical connection between each of the elastic metal pieces and the object to be tested.
5. The testing device according to claim 1, wherein: The object to be tested is a semiconductor package.
6. The testing device according to claim 1, wherein: The standard element is a memory, and the object to be tested is a logic chip or a functional chip.
7. The testing device according to claim 1, wherein: The thickness of the conductive elastic sheet is less than or equal to 2 mm and greater than or equal to 0.15 mm.
8. The testing device according to claim 1, wherein: The thickness of the conductive elastic sheet is less than or equal to 0.4 mm and greater than or equal to 0.15 mm.
9. The testing device according to claim 1, wherein: Each of the elastic metal pieces comprises a first contact end facing the conductive elastic sheet, and the first contact end has a protrusion suitable for being immersed in the conductive elastic sheet.
10. The testing device according to claim 9, wherein: The protrusions are multiple and pointed.
11. The testing device according to claim 1, wherein: The seat body is a metal seat body, so as to form a coaxial structure with the elastic metal piece.
12. The testing device according to claim 1, wherein: The testing device also includes a cover body and a gasket located between the cover body and the standard element, and the gasket is suitable for pressing the standard element.
13. A testing device comprising: A test device as claimed in any one of claims 1 to 12; as well as The test seat is located below the test device and is suitable for carrying the object to be tested.
14. The test device of claim 13, wherein: The test seat comprises a base and a plurality of base elastic metal pieces arranged in the base.
15. The testing device of claim 13, wherein: The test seat is arranged on a substrate, so that the substrate can test the object to be tested through the test seat and the test device.