Resistor

Abstract

The resistor includes: a frame including a resistor body and a resin layer; a protective film; and a first electrode and a second electrode, in which the resistor body includes a surface and is buried in the resin layer in such a manner that the surface is exposed, in which the protective film is provided on a central portion of the surface in a first direction, and in which the first electrode is provided on one end portion of the surface in the first direction and extends onto the protective film, the second electrode is disposed on the other end portion of the surface in the first direction and extends onto the protective film, and wherein a width of the resistor in a second direction perpendicular to the first direction is wider than a width of the resistor in the first direction.

Description

Technical Field

[0001] The present disclosure relates to a resistor. Background Art

[0002] In International Publication No. 2020 / 162266 (Patent Document 1), a resistor is described. The resistor described in Patent Document 1 includes an insulating plate, a resistor body, a protective film, a first electrode, and a second electrode. The resistor body includes a surface. The resistor body is buried in the insulating plate in a manner in which its surface is exposed.

[0003] The protective film is provided on the central part of the surface of the resistor in the first direction. The first electrode and the second electrode are respectively provided on one end and the other end of the surface of the resistor in the first direction. Each of the first electrode and the second electrode extends to reach the protective film. In the resistor described in Patent Document 1, the width in the second direction is narrower than the width in the first direction. The second direction is a direction perpendicular to the first direction.

[0004] [Prior art literature]

[0005] [Patent Document]

[0006] Patent Document 1: International Publication No. 2020 / 162266 Summary of the invention

[0007] [Problems to be Solved by the Present Disclosure]

[0008] As described above, in the resistor described in Patent Document 1, the width of the resistor in the second direction is narrower than the width of the resistor in the first direction. Therefore, the connection area between the resistor described in Patent Document 1 and the substrate is small, and there is room for improvement in heat dissipation to the substrate. The present disclosure is made in view of the problems of the prior art. More specifically, an embodiment of the present disclosure provides a resistor capable of improving heat dissipation to the substrate.

[0009] [Methods of solving the problem]

[0010] According to one embodiment of the present disclosure, a resistor includes: a frame including a resistor body and a resin layer, a protective film, a first electrode, and a second electrode. The resistor body includes a surface and is buried in the resin layer in a manner that the surface is exposed. The protective film is arranged on a central portion of the surface of the resistor body in a first direction. The first electrode is arranged on one end of the surface of the resistor body in the first direction and extends to the protective film. The second electrode is arranged on the other end of the surface of the resistor body in the first direction and extends to the protective film. The width of the resistor in a second direction perpendicular to the first direction is wider than the width of the resistor in the first direction.

[0011] [Effects of the present disclosure]

[0012] According to the present disclosure, in some embodiments, heat dissipation to the substrate can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure.

[0014] Figure 1 It is the bottom view of the resistor.

[0015] Figure 2 is along Figure 1 A cross-sectional view taken along line II-II in FIG.

[0016] Figure 3 is a plan view / top view of a resistor.

[0017] Figure 4 is a flowchart showing a method for manufacturing a resistor.

[0018] Figure 5 It is a bottom view for explaining the preparation step S1.

[0019] Figure 6 It is a bottom view for explaining the first base layer forming step S2.

[0020] Figure 7 It is a bottom view for explaining the protective film forming step S3.

[0021] Figure 8 It is a bottom view for explaining the second base layer forming step S4.

[0022] Fig. 9 is a cross-sectional view for explaining the first cutting step S5.

[0023] Fig.10 It is a bottom view for explaining the second cutting step S6.

[0024] Fig.11 It is a cross-sectional view for explaining the plating step S7.

[0025] Fig.12 It is the bottom view of the resistor.

[0026] Fig.13 It is the bottom view of the resistor.

[0027] Fig.14 is along Fig.13 A cross-sectional view taken along line XIV-XIV in FIG.

[0028] Fig.15 It is a bottom view of a resistor according to a modified example.

[0029] Fig.16It is a bottom view for explaining the second base layer forming step S4 in the manufacturing method of the resistor.

[0030] Fig.17 It is a bottom view for explaining the plating step S7 in the manufacturing method of the resistor.

[0031] Fig.18 It is the bottom view of the resistor.

[0032] Fig.19 is along Fig.18 A cross-sectional view taken along line XIX-XIX in FIG.

[0033] Fig. 20 is a plan view of a resistor.

[0034] Fig.21 is a bottom view of a resistor according to a first modification example.

[0035] Fig. 22 is a cross-sectional view of a resistor according to a second modification example.

[0036] Fig.23 is a flowchart showing a method for manufacturing a resistor.

[0037] Fig.24 It is a bottom view for explaining the preparation step S8.

[0038] Fig.25 It is a bottom view for explaining the protective film forming step S9.

[0039] Fig.26 It is a bottom view for explaining the first plating step S10. DETAILED DESCRIPTION

[0040] Reference will now be made in detail to various embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a comprehensive understanding of the present disclosure. However, it will be apparent to one of ordinary skill in the art that the present disclosure may be implemented without these specific details. In other cases, well-known methods, procedures, systems, and components are not described in detail in order to avoid unnecessarily obscuring aspects of the various embodiments.

[0041] The details of the embodiments of the present disclosure will be described with reference to the accompanying drawings. Throughout the following drawings, the same or corresponding parts are represented by the same reference numerals, and repeated explanation thereof will not be repeated.

[0042] (First embodiment)

[0043] A resistor according to a first embodiment will be described. The resistor according to the first embodiment is referred to as a resistor 100 .

[0044] <Configuration of Resistor 100>

[0045] The configuration of the resistor 100 will be described below.

[0046] Figure 1 is a bottom view of the resistor 100 . Figure 2 is along Figure 1 A cross-sectional view taken along line II-II in FIG. Figure 3 is a plan view of the resistor 100. Figures 1 to 3 As shown, the resistor 100 includes a frame 10 , a protective film 20 , an electrode 30 , and an electrode 40 .

[0047] The frame 10 includes a resin layer 11 and a resistor 12. The constituent material of the resin layer 11 is a resin material. The constituent material of the resin layer 11 is, for example, glass epoxy resin. The constituent material of the resistor 12 is a metal material. The constituent material of the resistor 12 is, for example, a manganese-copper alloy, a copper-nickel alloy, a nickel-chromium alloy, etc. The resistor 12 includes a surface 12a. The resistor 12 is buried in the resin layer 11 in a manner that the surface 12a is exposed. The frame 10 has a rectangular shape in a plan view. The short side and the long side of the rectangle are respectively along a first direction DR1 and a second direction DR2. The second direction DR2 is a direction perpendicular to the first direction DR1.

[0048] Although not shown, the resistor 12 may be formed with a first slit and a second slit in order to adjust the resistance of the resistor 12. The first slit and the second slit penetrate the resistor 12 in the thickness direction. The first slit is formed at one end of the resistor 12 in the second direction DR2 and extends along the second direction DR2. The second slit is formed at the other end of the resistor 12 in the second direction DR2 and extends along the second direction DR2.

[0049] The constituent material of the protective film 20 is an electrical insulating material. The constituent material of the protective film 20 is, for example, epoxy resin. The protective film 20 may contain a filler. The constituent material of the filler is, for example, a ceramic material such as aluminum oxide or boron nitride. The protective film 20 is disposed on the central portion of the surface 12a in the first direction DR1. The protective film 20 is not disposed on both ends of the surface 12a in the first direction DR1.

[0050] The electrode 30 includes a base layer 31, a base layer 32, and a plating layer 33. The constituent material of the base layer 31 is, for example, a conductive resin material. The conductive resin material includes a resin material and metal particles. The resin material is, for example, an epoxy resin. The constituent material of the metal particles is, for example, silver. The base layer 31 is disposed on one end of the surface 12a in the first direction DR1. One end of the base layer 31 in the first direction DR1 is spaced apart from one end of the surface 12a in the first direction DR1. One end of the protective film 20 in the first direction DR1 is located on the other end of the base layer 31 in the first direction DR1.

[0051] The constituent material of the base layer 32 is, for example, a conductive resin material. The conductive resin material includes a resin material and metal particles. The resin material is, for example, epoxy resin. The constituent material of the metal particles is, for example, silver. The base layer 32 is disposed on the base layer 31. The base layer 32 extends to reach the protective film 20. That is, the other end of the base layer 32 in the first direction DR1 is located on the protective film 20.

[0052] The plating layer 33 is a layer formed by plating. The plating layer 33 includes, for example, a copper layer, a nickel layer provided on the copper layer, and a tin layer provided on the nickel layer. The plating layer 33 is provided on the base layer 31 or the base layer 32. However, a portion of the plating layer 33 is provided on the surface 12a. The other end of the plating layer 33 in the first direction DR1 may be provided on the protective film 20. The plating layer 33 may also be provided on the side surface of the frame 10 located at one end in the first direction DR1.

[0053] The electrode 40 includes a base layer 41, a base layer 42, and a plating layer 43. The constituent material of the base layer 41 is, for example, a conductive resin material. The conductive resin material includes a resin material and metal particles. The resin material is, for example, an epoxy resin. The constituent material of the metal particles is, for example, silver. The base layer 41 is disposed on the other end of the surface 12a in the first direction DR1. The other end of the base layer 41 in the first direction DR1 is spaced apart from the other end of the surface 12a in the first direction DR1. The other end of the protective film 20 in the first direction DR1 is located on one end of the base layer 41 in the first direction DR1.

[0054] The constituent material of the base layer 42 is, for example, a conductive resin material. The conductive resin material includes a resin material and metal particles. The resin material is, for example, epoxy resin. The constituent material of the metal particles is, for example, silver. The base layer 42 is disposed on the base layer 41. The base layer 42 extends to reach the protective film 20. That is, one end of the base layer 42 in the first direction DR1 is located on the protective film 20.

[0055] The plating layer 43 is a layer formed by plating. The plating layer 43 includes, for example, a copper layer, a nickel layer provided on the copper layer, and a tin layer provided on the nickel layer. The plating layer 43 is provided on the base layer 41 or the base layer 42. However, a portion of the plating layer 43 is provided on the surface 12a. One end portion of the plating layer 43 in the first direction DR1 may be provided on the protective film 20. The plating layer 43 may also be provided on the side surface of the frame 10 located at the other end in the first direction DR1.

[0056] The width of the resistor 100 in the first direction DR1 is defined as width W1. The width of the resistor 100 in the second direction DR2 is defined as width W2. The width W2 is wider than the width W1. That is, the longitudinal direction of the resistor 100 is along the second direction DR2. The width W2 is preferably 3.2 mm or less.

[0057] <Method of Manufacturing Resistor 100>

[0058] A method of manufacturing the resistor 100 will be described below.

[0059] Figure 4 1 is a flow chart showing a method for manufacturing the resistor 100. Figure 4 As shown, the manufacturing method of the resistor 100 includes a preparation step S1, a first base layer forming step S2, a protection film forming step S3, a second base layer forming step S4, a first cutting step S5, a second cutting step S6 and a plating step S7.

[0060] Figure 5 is a bottom view for explaining the preparation step S1. Figure 5 As shown, in the preparation step S1, a frame 50 is prepared. The frame 50 includes a plurality of frames 10. Figure 5 , each of the plurality of frames 10 included in the frame 50 is divided by a dotted line. After the preparation step S1, the first base layer forming step S2 is performed.

[0061] Figure 6 1 is a bottom view for explaining the first base layer forming step S2. Figure 6 As shown, in the first base layer forming step S2, a base layer 60 is formed. In the first base layer forming step S2, first, a paste containing an uncured resin material and metal particles is applied. Next, by heating the applied paste, the resin material is cured to form the base layer 60. Note that an opening 60a is formed in each base layer 60. The surface 12a is exposed through the opening 60a. After the first base layer forming step S2, a protective film forming step S3 is performed.

[0062] Figure 7 1 is a bottom view for explaining the protective film forming step S3. Figure 7 As shown, in the protective film forming step S3, the protective film 20 is formed. In the protective film forming step S3, first, the constituent material (uncured resin material) of the protective film 20 is applied. Next, the applied uncured resin material is heated and cured to form the protective film 20. After the protective film forming step S3, the second base layer forming step S4 is performed.

[0063] Figure 8 2 is a bottom view for explaining the second base layer forming step S4. Figure 8 As shown, in the second base layer forming step S4, base layer 32 and base layer 42 are formed. In the second base layer forming step S4, first, a paste containing uncured resin material and metal particles is applied. Next, by heating the applied paste, the resin material is cured to form base layer 32 and base layer 42. After the second base layer forming step S4, the first cutting step S5 is performed.

[0064] Fig. 9 is a cross-sectional view for explaining the first cutting step S5. Fig. 9 As shown, in the first cutting step S5, the frame 50 is cut along the cutting line CL1. The cutting line CL1 is along the second direction DR2. As the frame 50 is cut, the base layer 60 is also separated to form the base layer 31 and the base layer 41. After the first cutting step S5, the second cutting step S6 is performed.

[0065] Fig.10 2 is a bottom view for explaining the second cutting step S6. Fig.10 As shown, in the second cutting step S6, the frame 50 is cut along the cutting line CL2. The cutting line CL2 is along the first direction DR1. As a result, the frame 50 is divided into a plurality of frames 10. After the second cutting step S6, the plating step S7 is performed.

[0066] Fig.11 2 is a cross-sectional view for explaining the plating step S7. Fig.11 As shown, in the plating step S7, electrolytic barrel plating is performed to form a copper layer, a nickel layer and a tin layer in sequence. Figures 1 to 3 The structure of the resistor 100 is shown.

[0067] <Effect of the resistor 100>

[0068] The effect of the resistor 100 will be described below in comparison with a resistor according to a comparative example. The resistor according to the comparative example is referred to as a resistor 100A.

[0069] Fig.12 is a bottom view of resistor 100A. Fig.12 As shown, in the resistor 100A, the width W2 is narrower than the width W1. Except for this point, the configuration of the resistor 100A is the same as that of the resistor 100.

[0070] The resistor 100 and the resistor 100A are soldered to the substrate at the electrodes 30 and 40. In the resistor 100, because the width W2 is wider than the width W1, the contact area with the substrate is larger than the contact area of ​​the resistor 100A when compared with the same size. Therefore, in the resistor 100, the heat generated in the resistor body 12 is more easily dissipated from the electrodes 30 and 40 to the substrate via the soldering portion, compared with the resistor 100A, thereby improving the heat dissipation of the substrate.

[0071] In order to reduce the width W2 of the resistor 100 and the resistor 100A, in the frame 50, it is necessary to reduce the width of the resistor body 12 in the second direction DR2. However, when the width of the resistor body 12 in the second direction DR2 is reduced, the rigidity of the frame 50 is reduced, and the operability of the frame 50 is reduced. This becomes obvious when the width W2 becomes less than 3.2 mm. In this regard, in the resistor 100, because the width W2 is wider than the width W1, the width W1 can be reduced without reducing the width W2 to achieve miniaturization. Therefore, according to the resistor 100, the operability of the frame 50 during manufacturing can be improved.

[0072] (Second embodiment)

[0073] A resistor according to a second embodiment will be described. The resistor according to the second embodiment is referred to as a resistor 200. Here, points different from the resistor 100 will be mainly described, and repeated explanation thereof will not be repeated.

[0074] <Configuration of Resistor 200>

[0075] The configuration of the resistor 200 will be described below.

[0076] Fig.13 is a bottom view of the resistor 200 . Fig.14 It is along Fig.13 A cross-sectional view taken along line XIV-XIV in FIG. Fig.13 and 14 As shown, the resistor 200 includes a frame 10, a protective film 20, and electrodes 30 and 40. In this regard, the configuration of the resistor 200 is the same as that of the resistor 100.

[0077] In the resistor 200, a recess 30a is formed at one end of the electrode 30 close to the electrode 40 (one end of the electrode 30 in the first direction DR1), and a recess 40a is formed at one end of the electrode 40 close to the electrode 30 (the other end of the electrode 40 in the first direction DR1). The protective film 20 is exposed from the recesses 30a and 40a. In this regard, the configuration of the resistor 200 is different from that of the resistor 100.

[0078] The portion of the electrode 30 adjacent to the recess 30a in the second direction DR2 is referred to as a first portion 30b, and the portion of the electrode 30 adjacent to the recess 30a from the side opposite to the first portion 30b in the second direction DR2 is referred to as a second portion 30c. In addition, the portion of the electrode 40 adjacent to the recess 40a in the second direction DR2 is referred to as a first portion 40b, and the portion of the electrode 40 adjacent to the recess 40a from the side opposite to the first portion 40b in the second direction DR2 is referred to as a second portion 40c.

[0079] The width of the first portion 30b in the second direction DR2 is wider than, for example, the width of the second portion 30c in the second direction DR2. The width of the first portion 40b in the second direction DR2 is wider than, for example, the width of the second portion 40c in the second direction DR2. In this case, the resistor 200 is used as, for example, a shunt resistor. That is, in this case, in a state where current flows between the first portion 30b and the first portion 40b, the resistor 200 detects a voltage between the second portion 30c and the second portion 40c, thereby being able to detect a current flowing between the first portion 30b and the first portion 40b.

[0080] <Modification>

[0081] Hereinabove, the example in which the width W2 is wider than the width W1 has been described. Fig.15 FIG. 2 is a bottom view of a resistor 200 according to a modified example. Fig.15 As shown, in the resistor 200 , the width W2 may be narrower than the width W1 .

[0082] <Method of Manufacturing Resistor 200>

[0083] A method of manufacturing the resistor 200 will be described below.

[0084] The manufacturing method of the resistor 200 includes a preparation step S1, a first base layer forming step S2, a protective film forming step S3, a second base layer forming step S4, a first cutting step S5, a second cutting step S6 and a plating step S7. In this regard, the manufacturing method of the resistor 200 is the same as the manufacturing method of the resistor 100.

[0085] Fig.16 2 is a bottom view for explaining the second base layer forming step S4 in the manufacturing method of the resistor 200. Fig.16 As shown, in the second base layer forming step S4 in the manufacturing method of the resistor 200 , the base layer 32 and the base layer 42 are formed at intervals in the second direction DR2 . Fig.172 is a bottom view for explaining the plating step S7 in the manufacturing method of the resistor 200. The plating layer 33 cannot be grown on the protective film 20 exposed between the adjacent base layers 32, and the plating layer 44 cannot be grown on the protective film 20 exposed between the adjacent base layers 42. Therefore, in the manufacturing method of the resistor 200, by performing the plating step S7, the recessed portion 30a is formed at the electrode 30, and the recessed portion 40a is formed at the electrode 40, as shown in FIG. Fig.17 In this regard, the manufacturing method of the resistor 200 is different from the manufacturing method of the resistor 100 .

[0086] <Effect of Resistor 200>

[0087] The effect of the resistor 200 will be described below.

[0088] In the resistor 200, when the second base layer forming step S4 is performed, the base layers 32 and 42 are formed at intervals along the second direction DR2, and the recesses 30a and 40a are respectively formed at the electrodes 30 and 40. In this way, the resistor 200 can be made into four terminals without adding any new steps, and can be used as a shunt resistor, for example.

[0089] (Third Embodiment)

[0090] A resistor according to a third embodiment will be described. The resistor according to the third embodiment is referred to as a resistor 300. Herein, points different from the resistor 200 will be mainly described, and repeated explanation thereof will not be repeated.

[0091] <Configuration of Resistor 300>

[0092] The configuration of the resistor 300 will be described below.

[0093] Fig.18 is a bottom view of the resistor 300 . Fig.19 It is along Fig.18 A cross-sectional view taken along line XIX-XIX in FIG. Fig. 20 is a plan view of the resistor 300. Figures 18 to 20 As shown, the resistor 300 includes a frame 10, a protective film 20, an electrode 30, and an electrode 40. In this regard, the configuration of the resistor 300 is the same as that of the resistor 200.

[0094] In the resistor 300, the frame 10 includes a resistor body 12. A surface of the resistor body 12 on a side opposite to the surface 12a is referred to as a surface 12b.

[0095] In the resistor 300, the electrode 30 includes a plating layer 34, a plating layer 35, and a plating layer 36. The constituent materials of the plating layer 34, the constituent materials of the plating layer 35, and the constituent materials of the plating layer 36 are, for example, copper, nickel, and tin, respectively. The plating layer 34 is provided on one end of the surface 12a in the first direction DR1. The plating layer 34 is also provided on one end of the surface 12b in the first direction DR1. The plating layer 35 is provided on the plating layer 34. The plating layer 35 is also provided on the side surface of the resistor body 12 at one end in the first direction DR1. The plating layer 36 is provided on the plating layer 35.

[0096] In the resistor 300, the electrode 40 includes a plating layer 44, a plating layer 45, and a plating layer 46. The constituent materials of the plating layer 44, the constituent materials of the plating layer 45, and the constituent materials of the plating layer 46 are, for example, copper, nickel, and tin, respectively. The plating layer 44 is provided on the other end of the surface 12a in the first direction DR1. The plating layer 44 is also provided on the other end of the surface 12b in the first direction DR1. The plating layer 45 is provided on the plating layer 44. The plating layer 45 is also provided on the side surface of the resistor body 12 located at the other end in the first direction DR1. The plating layer 46 is provided on the plating layer 45.

[0097] In the resistor 300, the recess 30a reaches one end of the resistor body 12 in the first direction DR1, and the recess 40a reaches the other end of the resistor body 12 in the first direction DR1. In the resistor 300, the protective film 20 is provided on the surface 12a exposed from the electrode 30 and the electrode 40. More specifically, the protective film 20 is provided on the surface 12a between the electrode 30 and the electrode 40 and on the surface 12a exposed from the recess 30a and the recess 40a in the first direction DR1.

[0098] The resistor 300 further includes a protective film 21. The constituent material of the protective film 21 is the same as that of the protective film 20, for example. The protective film 21 is provided on the surface 12b exposed from the electrode 30 and the electrode 40. In this regard, the configuration of the resistor 300 is the same as that of the resistor 200.

[0099] <First Modification>

[0100] Hereinabove, the example in which the width W2 is wider than the width W1 has been described. Fig.21 FIG. 3 is a bottom view of a resistor 300 according to a first variation. Fig.21 As shown, in the resistor 300 , the width W2 may be narrower than the width W1 .

[0101] <Second Modification>

[0102] Fig. 22 is a cross-sectional view of a resistor 300 according to a second modification. Fig. 22As shown, in the resistor 300, the electrode 30 may not include the plating layer 35, and the electrode 40 may not include the plating layer 45. In this case, the plating layer 34 is also provided on the side surface of the resistor body 12 located at one end in the first direction DR1, and the plating layer 44 is also provided on the side surface of the resistor body 12 located at the other end in the first direction DR1. In addition, in this case, the plating layer 36 and the plating layer 46 are provided on the plating layer 34 and the plating layer 44, respectively. In addition, in the resistor 300, the plating layer 34 may not be provided on one end of the surface 12b in the first direction DR1, and the plating layer 44 may not be provided on the other end of the surface 12b in the first direction DR1. In this case, the protective film 21 is provided on the entire surface 12b.

[0103] <Method of Manufacturing Resistor 300>

[0104] A method of manufacturing the resistor 300 will be described below.

[0105] Fig.23 3 is a flow chart showing a method for manufacturing the resistor 300. Fig.23 As shown, the manufacturing method of the resistor 300 includes a preparation step S8, a protection film forming step S9, a first plating step S10, a cutting step S11, and a second plating step S12.

[0106] Fig.24 is a bottom view for explaining the preparation step S8. Fig.24 As shown, in the preparation step S8, a frame 50 is prepared. The frame 50 includes a plurality of frames 10 (resistors 12). The plurality of resistors 12 included in the frame 50 are Fig.24 After the preparation step S8, a protection film forming step S9 is performed.

[0107] Fig.25 1 is a bottom view for explaining the protective film forming step S9. Fig.25As shown, in the protective film forming step S9, the protective film 20 is formed. The protective film 20 includes a plurality of first straight line portions and a plurality of second straight line portions. Each of the plurality of first straight line portions extends along the first direction DR1. The plurality of first straight line portions are arranged in a row with intervals in the second direction DR2. Each of the plurality of second straight line portions extends along the second direction DR2. The plurality of second straight line portions are arranged in a row with intervals in the first direction DR1. There is an intersection of the first straight line portion and the second straight line portion on the surface 12a of each of the plurality of resistors 12 included in the frame 50. The protective film 20 is formed by coating the constituent material (uncured resin material) of the protective film 20 and heating and curing the coated uncured resin material. Note that in the protective film forming step S9, although not shown, the protective film 21 is also formed by the same method. After the protective film forming step S9, the first plating step S10 is performed.

[0108] Fig.26 1 is a bottom view for explaining the first plating step S10. Fig.26 As shown, in the first plating step S10, for example, by performing rack plating, a plating layer 61 is formed on the surface 12a exposed from the protective film 20. After the first plating step S10, a cutting step S11 is performed. In the cutting step S11, the frame 50 is divided into a plurality of resistor bodies 12. As the frame 50 is cut, the plating layer 61 is separated into the plating layer 34 and the plating layer 44. After the cutting step S11, a second plating step S12 is performed.

[0109] In the second plating step S12, for example, by performing barrel plating, the plated layer 35 and the plated layer 36 are sequentially formed, and the plated layer 45 and the plated layer 46 are sequentially formed. The plated layer 35 and the plated layer 36 grow only on the plated layer 34, and not on the protective film 20. Similarly, the plated layer 45 and the plated layer 46 grow only on the plated layer 44, and not on the protective film 20. In this way, the recessed portion 30a and the recessed portion 40a are formed at the electrode 30 and the electrode 40, respectively. Through the above steps, a substrate having Figures 18 to 20 A resistor 300 of the structure shown.

[0110] <Effect of Resistor 300>

[0111] The effect of the resistor 300 will be described below.

[0112] In the resistor 300, when the protective film forming step S9 is performed, by forming the protective film 20 in a manner including a plurality of first straight line portions and a plurality of second straight line portions, the recessed portion 30a and the recessed portion 40a are respectively formed at the electrode 30 and the electrode 40. In this way, the resistor 300 can be made into four terminals without adding any new steps, and can be used as a shunt resistor, for example.

[0113] (Note)

[0114] The above-mentioned embodiment includes the following configurations.

[0115] <Additional Note 1>

[0116] A resistor, comprising:

[0117] A frame including a resistor body and a resin layer;

[0118] Protective film; and

[0119] a first electrode and a second electrode,

[0120] wherein the resistor includes a surface and is buried in the resin layer in a manner such that the surface is exposed;

[0121] wherein the protective film is disposed on a central portion of the surface in a first direction,

[0122] wherein the first electrode is disposed on one end of the surface in the first direction and extends to reach the protective film,

[0123] wherein the second electrode is disposed on the other end of the surface in the first direction and extends to reach the protective film, and

[0124] The width of the resistor in a second direction perpendicular to the first direction is wider than the width of the resistor in the first direction.

[0125] <Note 2>

[0126] The resistor according to Supplementary Note 1, wherein the width of the resistor in the second direction is 3.2 mm or less.

[0127] <Addendum 3>

[0128] A resistor, comprising:

[0129] A frame including a resistor body;

[0130] a first electrode and a second electrode; and

[0131] Protective film,

[0132] Wherein, the resistor body includes a surface,

[0133] wherein the first electrode is disposed on an end portion of the surface in a first direction,

[0134] wherein the second electrode is disposed on the other end of the surface in the first direction,

[0135] A first concave portion and a second concave portion are respectively formed at one end of the first electrode (which is the end close to the second electrode) and one end of the second electrode (which is the end close to the first electrode), and

[0136] The protective film is provided on the surface exposed from at least the first electrode and the second electrode.

[0137] <Note 4>

[0138] The resistor according to Supplementary Note 3, wherein a width of the resistor in a second direction perpendicular to the first direction is wider than a width of the resistor in the first direction.

[0139] <Addendum 5>

[0140] The resistor according to Supplementary Note 3, wherein a width of the resistor in the first direction is wider than a width of the resistor in a second direction perpendicular to the first direction.

[0141] <Addendum 6>

[0142] The resistor according to any one of Supplementary Notes 3 to 5, wherein the frame further comprises a resin layer,

[0143] wherein the resistor is buried in the resin layer in a manner such that the surface is exposed;

[0144] wherein the protective film is provided on a central portion of the surface in the first direction, and

[0145] Wherein, each of the first electrode and the second electrode extends to reach the protection film.

[0146] <Addendum 7>

[0147] The resistor according to any one of Notes 3 to 5, wherein the frame only includes the resistor,

[0148] wherein the first recess reaches one end of the resistor in the first direction, and

[0149] The second recess reaches the other end of the resistor in the first direction.

[0150] Although the embodiments of the present disclosure have been described above, the above embodiments may be modified in various ways. In addition, the scope of the present disclosure is not limited to the above embodiments. The scope of the present disclosure is indicated by the claims, and is intended to include all changes within the meaning and scope equivalent to the claims.

[0151] According to the present disclosure, in some embodiments, heat dissipation to the substrate can be improved.

[0152] Although certain embodiments have been described, these embodiments are presented only by way of example and are not intended to limit the scope of the present disclosure. In fact, the embodiments described herein may be implemented in a variety of other forms. In addition, various omissions, substitutions, and changes may be made to the forms of the embodiments described herein without departing from the spirit of the present disclosure. The attached claims and their equivalents are intended to cover forms or modifications that will fall within the scope and spirit of the present disclosure.

[0153] 10: Framework,

[0154] 11: Resin layer,

[0155] 12: resistor body,

[0156] 12a, 12b: surface,

[0157] 20, 21: protective film,

[0158] 30: Electrode,

[0159] 30a: concave part,

[0160] 30b: Part I,

[0161] 30c: Part II,

[0162] 31, 32: basal layer,

[0163] 33, 34, 35, 36: coating layer,

[0164] 40: Electrode,

[0165] 40a: concave part,

[0166] 40b: Part I,

[0167] 40c: Part II,

[0168] 41, 42: basal layer,

[0169] 43, 44, 45, 46: coating layer,

[0170] 50: frame,

[0171] 60: basal layer,

[0172] 60a: opening,

[0173] 61: coating layer,

[0174] 100, 100A, 200, 300: resistors,

[0175] CL1, CL2: cutting line,

[0176] DR1: First direction,

[0177] DR2: Second direction,

[0178] S1: Preparation step,

[0179] S2: first base layer forming step,

[0180] S3: protective film forming step,

[0181] S4: second base layer forming step,

[0182] S5: first cutting step,

[0183] S6: Second cutting step,

[0184] S7: Plating step,

[0185] S8: Preparatory step,

[0186] S9: protective film forming step,

[0187] S10: first plating step,

[0188] S11: Cutting step,

[0189] S12: second plating step,

[0190] W1, W2: width.

Claims

1. A resistor, include: A frame including a resistor body and a resin layer; Protective film; and a first electrode and a second electrode, wherein the resistor includes a surface and is buried in the resin layer in a manner such that the surface is exposed; wherein the protective film is disposed on a central portion of the surface in a first direction, wherein the first electrode is disposed on one end of the surface in the first direction and extends to reach the protective film, wherein the second electrode is disposed on the other end of the surface in the first direction and extends to reach the protective film, and The width of the resistor in a second direction perpendicular to the first direction is wider than the width of the resistor in the first direction.

2. The resistor according to claim 1, in, The width of the resistor in the second direction is 3.2 mm or less.

3. A resistor, include: A frame including a resistor body; a first electrode and a second electrode; and Protective film, Wherein, the resistor body includes a surface, wherein the first electrode is disposed on an end portion of the surface in a first direction, wherein the second electrode is disposed on the other end of the surface in the first direction, A first concave portion and a second concave portion are respectively formed at one end of the first electrode which is one end close to the second electrode and at one end of the second electrode which is one end close to the first electrode, and The protective film is provided on the surface exposed from at least the first electrode and the second electrode.

4. The resistor according to claim 3, in, The width of the resistor in a second direction perpendicular to the first direction is wider than the width of the resistor in the first direction.

5. The resistor according to claim 3, in, The width of the resistor in the first direction is wider than the width of the resistor in a second direction perpendicular to the first direction.

6. The resistor according to any one of claims 3 to 5, in, The frame further comprises a resin layer, wherein the resistor is buried in the resin layer in a manner such that the surface is exposed; wherein the protective film is provided on a central portion of the surface in the first direction, and Wherein, each of the first electrode and the second electrode extends to reach the protection film.

7. The resistor according to any one of claims 3 to 5, in, The frame comprises only the resistor, wherein the first recess reaches one end of the resistor in the first direction, and The second recess reaches the other end of the resistor in the first direction.

Images