Chip packaging processing device and method

Abstract

The invention discloses a chip packaging processing device and method, and belongs to the field of chip packaging. A chip packaging processing device comprises a base and an annular frame, and further comprises a plurality of groups of chip fixing units arranged on the annular frame and used for fixing chips of different sizes during packaging, and the clamping force between the chip fixing units is the same as that between the chips; the driving unit is arranged between the base and the annular frame and can drive the chip fixing unit to intermittently rotate along the annular frame; the glue solution stabilizing unit is arranged on the annular frame, and the driving unit can drive the glue solution stabilizing unit to rotate; the problems that the chip packaging quality is poor, the packaging effect is poor and the efficiency is low due to the fact that the chip is prone to displacement or damage in the dispensing packaging process can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a chip packaging processing device and method. Background Art

[0002] The shell used to install semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting the chips and enhancing the electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit. Therefore, packaging plays an important role for CPUs and other LSI integrated circuits. When packaging the chip, it is usually necessary to use a dispensing machine to dispense glue on the chip to fix the chip and the connection position to ensure the stability of the chip operation, while increasing the sealing of the chip and protecting the chip from the influence of the external environment.

[0003] At present, it is difficult to achieve effective positioning for chips of different sizes during glue dispensing and packaging, which can easily cause the chip to shift or be damaged during glue dispensing, both of which will affect the chip packaging quality. In addition, during glue dispensing, the temperature, humidity and dust of the environment will affect the use of the glue and the packaging effect and efficiency of the chip. Summary of the invention

[0004] The purpose of the present invention is to solve the problem in the prior art that chips are easily displaced or damaged during dispensing packaging, resulting in poor chip packaging quality, poor packaging effect and low efficiency, and to propose a chip packaging processing device and method.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A chip packaging processing device includes a base and an annular frame, and also includes: a plurality of chip fixing units arranged on the annular frame, which are used to fix chips of different sizes during packaging and have the same clamping force between the chips; a driving unit arranged between the base and the annular frame, which can drive the chip fixing unit to rotate intermittently along the annular frame; and a glue stabilizing unit arranged on the annular frame, which can drive the glue stabilizing unit to rotate.

[0007] In order to facilitate the packaging of chips in batches and ensure the stability of their position during packaging, preferably, the chip fixing unit includes multiple groups of trays, the trays are provided with protrusions at both ends close to the annular frame, and the annular frame is provided with a limiting groove matching the protrusion, and the tray is symmetrically provided with a first mounting groove along the direction of the protrusion, and a two-way driving rod is fixedly connected to the center position of the first mounting groove, and driven telescopic rods are symmetrically fixedly connected to the two sides of the first mounting groove, and a mounting block is provided between the driven telescopic rod and the two-way driving rod, and a connecting rod is rotatably connected to the side of the mounting block away from the annular frame, and a clamping plate is rotatably connected to the end of the connecting rod on the same side away from the mounting block, wherein the tray is a hollow structure, the tray is located between the annular frames, and the two ends of the clamping plate are in contact with the inner side wall of the tray, and a pressure stabilizing mechanism connected to the two-way driving rod is provided inside the mounting block, and a positioning mechanism is provided on the side where the clamping plates are close to each other.

[0008] In order to facilitate the packaging of chips of different sizes and ensure the stability of the chip position, the voltage stabilizing mechanism further includes a positioning groove opened on the side of the mounting block close to the two-way driving rod, the positioning groove is fixedly connected to a first spring on the side away from the two-way driving rod, the first spring is fixedly connected to a connecting plate on the side close to the two-way driving rod, and the positioning groove is fixedly connected to a control switch on the side away from the first spring, wherein the connecting plate is in contact with the inner side wall of the positioning groove, the connecting plate is connected to the two-way driving rod, and the control switch is electrically connected to the two-way driving rod.

[0009] In order to improve the accuracy of the glue dispensing position during chip packaging, the positioning mechanism further includes a second mounting groove symmetrically opened on the side where the clamping plate is close to each other, a two-way driven rod is fixedly connected to the center position of the second mounting groove, both ends of the two-way driven rod are fixedly connected to a movable clamping plate, and a support plate is fixedly connected to the side where the clamping plate is close to each other, wherein the two-way driven rod is connected to the driven telescopic rod through a pipeline, a pressure relief valve is arranged on the driven telescopic rod, the movable clamping plate and the support plate are staggered, and the support plate is located below the center position of the clamping plate.

[0010] In order to facilitate the placement, removal and packaging of chips, the driving unit further includes a driving motor fixedly connected to the base, the output end of the driving motor is fixedly connected to an incomplete gear, and the annular frame is rotatably connected to a connecting gear ring connected to the protrusion of the tray, wherein a portion of the connecting gear ring is meshed with the incomplete gear, and when the incomplete gear rotates one circle, the rotation angle of the connecting gear ring is the same as the angle between two adjacent groups of trays, and an anti-rotation mechanism is arranged between the annular frame and the incomplete gear.

[0011] In order to ensure the stability of the chip during packaging, the anti-rotation mechanism further includes an arc-shaped plate fixedly connected to the incomplete gear, the outer side wall of the connecting gear ring is provided with multiple groups of slots, and the annular frame is slidably connected with a locking rod matching the slots, and a connecting cavity is provided on the side of the annular frame close to the locking rod, and a fixing plate is fixedly connected to the side of the locking rod close to the connecting cavity, and a second spring is fixedly connected between the fixing plate and the inner side wall of the connecting cavity, wherein part of the locking rod extends to the outside of the annular frame, the end of the locking rod is arranged in an arc shape, and both ends of the arc plate are arranged in an arc shape, and when the arc plate rotates to the side close to the annular frame, the distance between the arc plate and the annular frame is smaller than the size of the leaking part of the locking rod.

[0012] In order to prevent dust and humidity from affecting the chip packaging, and low temperature from causing the glue to solidify too quickly, the glue stabilization unit further includes a heating tube and a first fixed frame fixedly connected to the annular frame, the first fixed frame is rotatably connected to a first fan blade, the first fixed frame is rotatably connected to a wheel group connected to the first fan blade, the shaft end of the incomplete gear is fixedly connected to a driving wheel, and a first belt is sleeved between the driving wheel and the wheel group, wherein the size of the heating tube matches the size of the tray, the first fixed frame is located above the heating tube, and a cooling mechanism is provided on the annular frame.

[0013] In order to accelerate the solidification of the glue after the chip packaging is completed and facilitate the removal of the chip, the cooling mechanism further includes a second fixed frame fixedly connected to the annular frame, the second fixed frame is rotatably connected to a second fan blade, the second fixed frame is rotatably connected to a driven wheel connected to the second fan blade, and a second belt is sleeved between the wheel group and the driven wheel.

[0014] In order to ensure the stability of chip packaging, further, a glue dispensing device is provided on the side of the base close to the annular frame, and the glue dispensing device is located between the first fixing frame and the second fixing frame.

[0015] A processing method of a chip packaging processing device comprises the following steps:

[0016] Step 1: First, place the chip to be packaged on the tray. The chip can be fixed by the chip fixing unit. The chip can be fixed to the center of the tray by the positioning mechanism. The clamping force for chips of different sizes can be made the same by the voltage stabilizing mechanism.

[0017] Step 2: The driving unit can drive the tray to rotate intermittently in the ring frame. When the tray rotates, the chip is transported. When the tray stops, the chip can be taken out and placed.

[0018] Step 3: The anti-rotation mechanism can be used to limit and lock the tray when it stops rotating, so as to improve the position accuracy during chip packaging;

[0019] Step 4: The driving unit can drive the glue stabilization unit to rotate and blow air to the chip. At the same time, the surrounding air is heated by the heating tube. On the one hand, it can clean the surface dust and other impurities before chip packaging. On the other hand, it can prevent the glue from cooling too fast and affecting the chip packaging.

[0020] Step 5: At the same time, drive the cooling mechanism to rotate and blow cold air to the chip surface to accelerate the solidification of the glue to prevent the chip package from shifting when the chip is taken out;

[0021] Step 6: Take out the packaged chip and add the chip to be packaged.

[0022] Compared with the prior art, the present invention provides a chip packaging processing device and method, which has the following beneficial effects:

[0023] 1. The chip packaging and processing device can achieve the same clamping force for chips of different sizes when the chip fixing unit fixes the chip through the voltage stabilizing mechanism, thereby ensuring that the chip is firmly clamped and avoiding excessive clamping force to cause damage to the chip. In addition, the positioning mechanism can be used to improve the accuracy of the chip fixing position, thereby improving the chip packaging quality.

[0024] 2. The chip packaging processing device can drive the chip to rotate intermittently at equal angles in the ring frame through the driving unit, and ensure the accuracy of the position of the chip when it is not moving through the anti-rotation mechanism, which greatly improves the chip packaging effect and is also convenient for taking and placing the chip, and is suitable for batch packaging of chips.

[0025] 3. The chip encapsulation processing device can clean the dust on the chip surface, dry and heat the chip when the chip is rotating through the glue stabilization unit to prevent dust and humidity from affecting the use effect of the glue, while reducing the solidification speed of the glue during packaging. After the chip packaging is completed, the solidification speed of the glue is accelerated to prevent the packaging position from shifting when the chip is taken out, thereby improving the chip packaging efficiency.

[0026] The parts not involved in the device are the same as the existing technology or can be implemented by using the existing technology. The present invention can overcome the problem that the chip is easily shifted or damaged during dispensing packaging, resulting in poor chip packaging quality, poor packaging effect and low efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 The present invention is a schematic structural diagram of a chip packaging and processing device proposed by the present invention.

[0028] Figure 2 The present invention is a schematic top view of the structure of a chip packaging and processing device.

[0029] Figure 3 This is a partial structural schematic diagram of a chip packaging processing device proposed by the present invention.

[0030] Figure 4 The present invention provides a schematic cross-sectional structure diagram of a ring frame in a chip packaging and processing device.

[0031] Figure 5 The present invention provides a schematic structural diagram of a tray in a chip packaging processing device.

[0032] Figure 6 The present invention is a schematic diagram of the cross-sectional structure of a tray in a chip packaging processing device proposed by the present invention.

[0033] Figure 7 This is a schematic diagram of the structure of connecting a gear ring and an incomplete gear in a chip packaging processing device proposed by the present invention.

[0034] Figure 8 A chip packaging processing device proposed by the present invention Figure 4 Schematic diagram of the structure of part A in .

[0035] Fig. 9 A chip packaging processing device proposed by the present invention Figure 6 Schematic diagram of the structure of part B.

[0036] In the figure: 1. base; 2. dispensing equipment; 3. annular frame; 4. limiting groove; 5. tray; 6. first installation groove; 7. two-way driving rod; 8. driven telescopic rod; 9. mounting block; 10. positioning groove; 11. first spring; 12. connecting plate; 13. control switch; 14. connecting rod; 15. clamping plate; 16. second installation groove; 17. two-way driven rod; 18. movable splint; 19. support plate; 20. connecting gear ring; 21. slot; 22. engaging rod; 23. connecting cavity; 24. fixing plate; 25. second spring; 26. driving motor; 27. incomplete gear; 28. arc plate; 29. ​​driving wheel; 30. heating tube; 31. first fixing frame; 32. wheel set; 33. first fan blade; 34. second fixing frame; 35. driven wheel; 36. second fan blade; 37. first belt; 38. second belt. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0038] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0039] Embodiment 1:

[0040] Reference Figure 1-Figure 9 A chip packaging processing device includes a base 1 and an annular frame 3, and also includes a dispensing device 2 arranged on the side of the base 1 close to the annular frame 3, the dispensing device 2 is located between the first fixed frame 31 and the second fixed frame 34, and the specific structure of the dispensing device 2 can refer to the technical scheme in the prior art. Those skilled in the art can know it and will not be described in detail here. Among them, the dispensing head of the dispensing device 2 can move in the horizontal direction and the vertical direction to achieve precise dispensing operation, and also includes: a plurality of chip fixing units arranged on the annular frame 3, which are used to fix chips of different sizes during packaging, and have the same clamping force as the chips; a driving unit arranged between the base 1 and the annular frame 3, the driving unit can drive the chip fixing unit to rotate intermittently along the annular frame 3; a glue stabilizing unit arranged on the annular frame 3, the driving unit can drive the glue stabilizing unit to rotate.

[0041] Reference Figure 1 , Figure 2 , Figure 5 and Figure 6 The chip fixing unit includes multiple groups of trays 5, and protrusions are provided at both ends of the tray 5 near the annular frame 3. A limiting groove 4 matching the protrusion is opened on one side of the annular frame 3 near the tray 5. The tray 5 is symmetrically provided with a first mounting groove 6 along the direction of the protrusion. A two-way driving rod 7 is fixedly connected to the center position of the first mounting groove 6. Driven telescopic rods 8 are symmetrically fixedly connected to the two sides of the first mounting groove 6. A mounting block 9 is provided between the driven telescopic rod 8 and the two-way driving rod 7. A connecting rod 14 is rotatably connected to the side of the mounting block 9 away from the annular frame 3, and a clamping plate 15 is rotatably connected to the end of the connecting rod 14 on the same side away from the mounting block 9. The tray 5 is a hollow structure, the tray 5 is located between the annular frames 3, and the two ends of the clamping plate 15 are in contact with the inner side wall of the tray 5. A pressure stabilizing mechanism connected to the two-way driving rod 7 is provided inside the mounting block 9, and a positioning mechanism is provided on the side where the clamping plates 15 are close to each other.

[0042] The shape and size of the protrusion are not limited here, as long as the tray 5 can be rotated along the ring frame 3. The two-way drive rod 7 is electrically driven, which is a conventional method in the prior art, and both ends of the two-way drive rod 7 are extended or contracted synchronously. The distance between the clamping plates 15 on both sides can be adjusted by the connecting rod 14. In addition, the number of trays 5 is not limited, and the best is five to eight groups. The staff can adjust it according to actual conditions.

[0043] Reference Figure 6 and Fig. 9 The voltage stabilizing mechanism includes a positioning groove 10 opened on the side of the mounting block 9 close to the two-way driving rod 7, a first spring 11 is fixedly connected to the side of the positioning groove 10 away from the two-way driving rod 7, a connecting plate 12 is fixedly connected to the side of the first spring 11 close to the two-way driving rod 7, a control switch 13 is fixedly connected to the side of the positioning groove 10 away from the first spring 11, wherein the connecting plate 12 is in contact with the inner side wall of the positioning groove 10, the connecting plate 12 is connected to the two-way driving rod 7, and the control switch 13 is electrically connected to the two-way driving rod 7.

[0044] When the chip is fixed, the two ends of the two-way drive rod 7 will shrink synchronously. Initially, the two-way drive rod 7 is subject to small resistance, and the connecting plate 12 will not contact the control switch 13. When the clamping plate 15 contacts the chip, the resistance of the two-way drive rod 7 increases. When the resistance increases to a certain value, the connecting plate 12 will contact the control switch 13, thereby stopping the contraction of the two-way drive rod 7. At this time, the pressure between the clamping plate 15 and the chip is a constant value, and this pressure value remains unchanged for chips of different sizes, which not only ensures the fixing effect of the chip, but also prevents the chip from being damaged.

[0045] Reference Figure 5-Figure 6 The positioning mechanism includes a second mounting groove 16 which is symmetrically opened on the side where the clamping plate 15 is close to each other. A two-way driven rod 17 is fixedly connected to the center position of the second mounting groove 16. Both ends of the two-way driven rod 17 are fixedly connected to movable splints 18. A support plate 19 is fixedly connected to the side where the clamping plate 15 is close to each other. The two-way driven rod 17 is connected to the driven telescopic rod 8 through a pipeline. A pressure relief valve is provided on the driven telescopic rod 8. The movable splint 18 and the support plate 19 are staggered, and the support plate 19 is located below the center position of the clamping plate 15.

[0046] When the bidirectional driving rod 7 contracts, it will drive the driven telescopic rods 8 on both sides to extend outward, generating negative pressure inside the rods, sucking in the gas inside the bidirectional driven rods 17, adjusting the distance between the movable splints 18 on the same side, and moving the chip to the center position at the same time. When the movable splint 18 contacts the chip, the resistance increases, and the gas on the outside enters the driven telescopic rod 8 through the pressure relief valve, preventing the movable splint 18 from damaging the chip.

[0047] Reference Figure 1 , Figure 3 and Figure 7 The driving unit includes a driving motor 26 fixedly connected to the base 1, and an incomplete gear 27 is fixedly connected to the output end of the driving motor 26. A connecting gear ring 20 connected to the protrusion of the tray 5 is rotatably connected to the annular frame 3, wherein a part of the connecting gear ring 20 is meshed with the incomplete gear 27, and when the incomplete gear 27 rotates one circle, the rotation angle of the connecting gear ring 20 is the same as the angle between two adjacent groups of trays 5, and an anti-rotation mechanism is arranged between the annular frame 3 and the incomplete gear 27.

[0048] The connecting gear ring 20 is at least partially located inside the annular frame 3 and connected to the protrusions of each tray 5. The part located outside the annular frame 3 is provided with teeth. When the driving motor 26 drives the incomplete gear 27 to rotate one circle, the connecting gear ring 20 rotates at an angle equal to the angle between two adjacent groups of trays 5, and then stops rotating to facilitate the placement and packaging of chips. Compared with the intermittent rotation achieved by electronic control equipment in the prior art, it is not only less expensive, but also due to the simple structure of the driving motor 26, the maintenance frequency is low, and the maintenance cost is lower.

[0049] Reference Figure 1 , Figure 4 , Figure 7 and Figure 8 The anti-rotation mechanism includes an arc-shaped plate 28 fixedly connected to the incomplete gear 27, and multiple groups of slots 21 are provided on the outer wall of the connecting gear ring 20. A locking rod 22 matching the slots 21 is slidably connected to the annular frame 3. A connecting cavity 23 is provided on the side of the annular frame 3 close to the locking rod 22, and a fixing plate 24 is fixedly connected to the side of the locking rod 22 close to the connecting cavity 23. A second spring 25 is fixedly connected between the fixing plate 24 and the inner wall of the connecting cavity 23, wherein a portion of the locking rod 22 extends to the outside of the annular frame 3, and the end of the locking rod 22 is arranged in an arc shape. Both ends of the arc-shaped plate 28 are arranged in an arc shape, and when the arc-shaped plate 28 rotates to the side close to the annular frame 3, the distance between the arc-shaped plate 28 and the annular frame 3 is smaller than the size of the leaked portion of the locking rod 22.

[0050] When the teeth of the incomplete gear 27 are disengaged from the connecting gear ring 20, the arc plate 28 just contacts the locking rod 22 and drives the locking rod 22 to move toward the slot 21 to position the connecting gear ring 20 and prevent it from shifting when it is not rotating, thereby improving the accuracy of chip packaging and the packaging effect.

[0051] Reference Figure 1-Figure 2The glue stabilization unit includes a heating tube 30 and a first fixed frame 31 fixedly connected to the annular frame 3, a first fan blade 33 is rotatably connected to the first fixed frame 31, a wheel set 32 ​​connected to the first fan blade 33 is rotatably connected to the first fixed frame 31, a driving wheel 29 is fixedly connected to the shaft end of the incomplete gear 27, a first belt 37 is sleeved between the driving wheel 29 and the wheel set 32, wherein the size of the heating tube 30 matches the size of the tray 5, the first fixed frame 31 is located above the heating tube 30, a cooling mechanism is provided on the annular frame 3, the cooling mechanism includes a second fixed frame 34 fixedly connected to the annular frame 3, a second fan blade 36 is rotatably connected to the second fixed frame 34, a driven wheel 35 connected to the second fan blade 36 is rotatably connected to the second fixed frame 34, and a second belt 38 is sleeved between the wheel set 32 ​​and the driven wheel 35.

[0052] When the chip is transported to the bottom of the heating tube 30, the driving motor 26 drives the first fan blade 33 to rotate through the driving wheel 29 and the first belt 37, and blows the hot air heated by the heating tube 30 to the chip. On the one hand, it can remove dust and the like on the surface of the chip, and on the other hand, it can prevent the low surface temperature of the chip from affecting the use effect of the glue. After the packaging and dispensing is completed, when passing through the second fan blade 36, cold air can be blown to the chip to accelerate the solidification of the glue on its surface and prevent the dispensing position from shifting when the chip is taken out.

[0053] In the present invention, when encapsulating and dispensing the chip, the chip to be encapsulated is placed on the tray 5. Initially, the support plate 19 can support the chip. Then, the bidirectional driving rod 7 is driven to drive the mounting block 9 to move relatively, and the clamping plate 15 is driven to move relatively through the connecting rod 14 to clamp the chip. At the same time, the active clamping plate 18 is driven by the driven telescopic rod 8 and the bidirectional driven rod 17 to move the chip to the center position. When the pressure between the clamping plate 15 and the chip reaches a certain value, the control switch 13 is triggered to stop the contraction of the bidirectional driving rod 7. At this time, not only can the fixing effect of the chip be guaranteed, but also the clamping plate 15 can be prevented from causing damage to the chip, and it can be used for chips of different sizes.

[0054] Then, the driving motor 26 is started to drive the incomplete gear 27 to rotate, and the tray 5 is driven to rotate by connecting the gear ring 20. After rotating a certain angle, the tray 5 is limited under the action of the arc plate 28, the locking rod 22 and the slot 21 to realize the intermittent rotation of the tray 5, and before rotating to the bottom of the dispensing device 2, the hot air is blown to the chip through the heating tube 30 and the first fan blade 33. While cleaning the dust on the surface of the chip, the temperature of the chip surface can be appropriately increased, and the drying effect can also be improved to improve the quality of chip dispensing. When it rotates to the bottom of the dispensing device 2, the designated position of the chip can be dispensed. When it rotates to the bottom of the second fan blade 36, cold air can be blown to the chip after packaging to accelerate the solidification of the glue to prevent the glue or the dispensing position from shifting when the chip is taken out. In this way, the chip packaging operation can be completed, the operation is simple, the efficiency is higher, and the effect is better. It should be explained that the placement and removal of the chip can be achieved by manual or automated equipment, and the staff can adjust it according to the actual situation.

[0055] Embodiment 2:

[0056] A processing method of a chip packaging processing device comprises the following steps:

[0057] Step 1: First, place the chip to be packaged on the tray 5. The chip can be fixed by the chip fixing unit. The chip can be fixed to the center of the tray 5 by the positioning mechanism. The clamping force for chips of different sizes can be made the same by the voltage stabilizing mechanism.

[0058] The shape and size of the tray 5 can be adjusted according to the shape and size of the chip, and the size of the tray 5 can be larger than the size of the chip;

[0059] Step 2: The driving unit can drive the tray 5 to intermittently rotate in the ring frame 3. When the tray 5 rotates, the chip is transported. When the tray 5 stops, the chip can be taken out and placed.

[0060] Through the tray 5 at different positions, different operations can be performed on the chip, including placement, preparation before packaging, packaging, glue curing, removal, etc.;

[0061] Step 3: The anti-rotation mechanism can be used to limit and lock the tray 5 when it stops rotating, so as to improve the position accuracy during chip packaging;

[0062] This can effectively prevent the connecting gear ring 20 from continuing to rotate under the action of inertia, ensuring that the position of the tray 5 each time it rotates coincides with the position of the previous tray 5;

[0063] Step 4: The driving unit can drive the glue stabilization unit to rotate and blow air to the chip. At the same time, the surrounding air is heated by the heating tube 30. On the one hand, it can clean the surface of the chip before packaging, and on the other hand, it can prevent the glue from cooling too fast and affecting the chip packaging.

[0064] If the humidity on the chip surface is high, the chip can also be dried to ensure the use effect of the glue. The heating efficiency of the heating tube 30 can be adjusted according to the processing environment.

[0065] Step 5: At the same time, drive the cooling mechanism to rotate and blow cold air to the chip surface to accelerate the solidification of the glue to prevent the chip package from shifting when the chip is taken out;

[0066] Step 6: Take out the packaged chip and add the chip to be packaged.

[0067] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip packaging processing device, comprising a base (1) and a ring frame (3), characterized in that: Also includes: A plurality of groups of chip fixing units are arranged on the annular frame (3), and are used to fix chips of different sizes during packaging, and have the same clamping force with the chips; A driving unit is arranged between the base (1) and the annular frame (3), and the driving unit is capable of driving the chip fixing unit to intermittently rotate along the annular frame (3); A glue stabilizing unit is arranged on the annular frame (3), and the driving unit can drive the glue stabilizing unit to rotate.

2. A chip packaging processing device according to claim 1, characterized in that: The chip fixing unit comprises a plurality of groups of trays (5), wherein the trays (5) are provided with protrusions at both ends close to the annular frame (3), and a limiting groove (4) matching the protrusion is provided on one side of the annular frame (3) close to the trays (5), and the trays (5) are symmetrically provided with a first mounting groove (6) along the direction of the protrusion, and a bidirectional driving rod (7) is fixedly connected to the center position of the first mounting groove (6), and driven telescopic rods (8) are symmetrically fixedly connected to the two sides of the first mounting groove (6), and a mounting block (9) is provided between the driven telescopic rod (8) and the bidirectional driving rod (7), and a connecting rod (14) is rotatably connected to the side of the mounting block (9) away from the annular frame (3), and a clamping plate (15) is rotatably connected to the end of the connecting rod (14) on the same side away from the mounting block (9), The tray (5) is a hollow structure, the tray (5) is located between the annular frames (3), the two ends of the clamping plate (15) are in contact with the inner wall of the tray (5), a pressure stabilizing mechanism connected to the bidirectional driving rod (7) is arranged inside the mounting block (9), and a positioning mechanism is arranged on the side where the clamping plates (15) are close to each other.

3. A chip packaging processing device according to claim 2, characterized in that: The voltage stabilizing mechanism comprises a positioning groove (10) provided on a side of the mounting block (9) close to the bidirectional driving rod (7); a first spring (11) is fixedly connected to a side of the positioning groove (10) away from the bidirectional driving rod (7); a connecting plate (12) is fixedly connected to a side of the first spring (11) close to the bidirectional driving rod (7); a control switch (13) is fixedly connected to a side of the positioning groove (10) away from the first spring (11); The connecting plate (12) is fitted with the inner wall of the positioning groove (10), the connecting plate (12) is connected to the bidirectional driving rod (7), and the control switch (13) is electrically connected to the bidirectional driving rod (7).

4. The chip packaging processing device according to claim 3, characterized in that: The positioning mechanism comprises a second mounting groove (16) symmetrically arranged on a side of the clamping plate (15) close to each other, a bidirectional driven rod (17) is fixedly connected to the center position of the second mounting groove (16), both ends of the bidirectional driven rod (17) are fixedly connected to movable clamping plates (18), and a supporting plate (19) is fixedly connected to a side of the clamping plate (15) close to each other. The bidirectional driven rod (17) is connected to the driven telescopic rod (8) through a pipeline, a pressure relief valve is arranged on the driven telescopic rod (8), the movable clamping plate (18) and the supporting plate (19) are arranged in a staggered manner, and the supporting plate (19) is located below the center position of the clamping plate (15).

5. The chip packaging processing device according to claim 2, characterized in that: The driving unit comprises a driving motor (26) fixedly connected to the base (1), an output end of the driving motor (26) is fixedly connected to an incomplete gear (27), and a connecting gear ring (20) connected to a protrusion of the tray (5) is rotatably connected to the annular frame (3). Part of the connecting gear ring (20) is meshed with the incomplete gear (27), and when the incomplete gear (27) rotates one circle, the rotation angle of the connecting gear ring (20) is the same as the angle between two adjacent groups of trays (5), and an anti-rotation mechanism is provided between the annular frame (3) and the incomplete gear (27).

6. The chip packaging processing device according to claim 5, characterized in that: The anti-rotation mechanism comprises an arc-shaped plate (28) fixedly connected to the incomplete gear (27); the outer side wall of the connecting gear ring (20) is provided with a plurality of groups of slots (21); a locking rod (22) matching the slots (21) is slidably connected to the annular frame (3); a connecting cavity (23) is provided on a side of the annular frame (3) close to the locking rod (22); a fixing plate (24) is fixedly connected to a side of the locking rod (22) close to the connecting cavity (23); a second spring (25) is fixedly connected between the fixing plate (24) and the inner side wall of the connecting cavity (23); Part of the locking rod (22) extends to the outside of the annular frame (3), the end of the locking rod (22) is arranged in an arc shape, both ends of the arc plate (28) are arranged in an arc shape, and when the arc plate (28) rotates to a side close to the annular frame (3), the distance between the arc plate (28) and the annular frame (3) is smaller than the size of the leaking part of the locking rod (22).

7. The chip packaging processing device according to claim 5, characterized in that: The glue stabilizing unit comprises a heating tube (30) and a first fixed frame (31) fixedly connected to the annular frame (3); a first fan blade (33) is rotatably connected to the first fixed frame (31); a wheel set (32) connected to the first fan blade (33) is rotatably connected to the first fixed frame (31); a drive wheel (29) is fixedly connected to the shaft end of the incomplete gear (27); a first belt (37) is sleeved between the drive wheel (29) and the wheel set (32); The size of the heating tube (30) matches the size of the tray (5), the first fixing frame (31) is located above the heating tube (30), and a cooling mechanism is provided on the annular frame (3).

8. The chip packaging processing device according to claim 7, characterized in that: The cooling mechanism comprises a second fixed frame (34) fixedly connected to the annular frame (3), a second fan blade (36) being rotatably connected to the second fixed frame (34), a driven wheel (35) connected to the second fan blade (36) being rotatably connected to the second fixed frame (34), and a second belt (38) being sleeved between the wheel set (32) and the driven wheel (35).

9. The chip packaging processing device according to claim 8, characterized in that: It also includes a glue dispensing device (2) arranged on a side of the base (1) close to the annular frame (3), and the glue dispensing device (2) is located between the first fixed frame (31) and the second fixed frame (34).

10. A processing method comprising the chip packaging processing device according to any one of claims 1 to 9, characterized in that: The following steps are also included: Step 1: First, the chip to be packaged is placed on the tray (5), and the chip can be fixed by a chip fixing unit. The chip can be fixed to the center of the tray (5) by a positioning mechanism, and the clamping force for chips of different sizes can be made the same by a voltage stabilizing mechanism; Step 2: The driving unit can drive the tray (5) to rotate intermittently in the annular frame (3). When the tray (5) rotates, the chip can be transported. When the tray (5) stops, the chip can be taken out and placed. Step 3: The anti-rotation mechanism can be used to limit and lock the tray (5) when it stops rotating, so as to improve the position accuracy during chip packaging; Step 4: The driving unit can drive the glue stabilization unit to rotate and blow air to the chip. At the same time, the surrounding air is heated by the heating tube (30). On the one hand, impurities such as dust on the surface can be cleaned before chip packaging. On the other hand, it can prevent the glue from cooling too fast and affecting chip packaging. Step 5: At the same time, drive the cooling mechanism to rotate and blow cold air to the chip surface to accelerate the solidification of the glue to prevent the chip package from shifting when the chip is taken out; Step 6: Take out the packaged chip and add the chip to be packaged.

Images