Wafer positioning method and wafer positioning device

Abstract

The invention discloses a wafer positioning method and a wafer positioning device. The wafer positioning method comprises the following steps: placing a to-be-transferred wafer on a wafer fork part of a transferring structure of the wafer positioning device, and pre-positioning the wafer and the wafer fork part; transferring the wafer to a suction cup of a wafer positioning device through the transferring structure, and limiting a wafer fork part of the transferring structure through the suction cup so as to finish initial positioning of the wafer on the suction cup; and the plurality of first detection pieces detect the position of the wafer on the surface of the suction cup, and the wafer fork part is moved according to a detection result to adjust the position of the wafer, so that the wafer is overlapped with the suction cup, and the repositioning of the wafer on the suction cup is completed. According to the wafer positioning method and the wafer positioning device, the wafer and the wafer suction cup can be automatically positioned, so that the positioning precision and efficiency are ensured.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and in particular, relates to a chip positioning method and a chip positioning device. Background Art

[0002] In the field of semiconductor technology, different equipment is required for the production of semiconductor chips. Optical defect detection equipment is required to detect the chips before they leave the factory to ensure the overall quality of the chips.

[0003] In the inspection equipment, a wafer is usually placed directly on the suction cup by a transmission device such as a wafer transfer robot for fixation. This method of transfer can only place the wafer in an approximate position and visually adjust the wafer position so that the wafer can be aligned with the suction cup. However, this method of transfer cannot accurately position the wafer and the suction cup, and the positioning accuracy and efficiency are low. Summary of the invention

[0004] The present application provides a wafer positioning method and a wafer positioning device, which can automatically position a wafer and a wafer suction cup to ensure positioning accuracy and efficiency.

[0005] The present application provides a wafer positioning method, which includes:

[0006] Placing the wafer to be transferred on the fork portion of the transfer structure of the wafer positioning device and pre-positioning the wafer on the fork portion;

[0007] The wafer is transferred to the suction cup of the wafer positioning device via the transfer structure, and the fork portion of the transfer structure is restricted by the suction cup to complete the initial positioning of the wafer on the suction cup;

[0008] The plurality of first detection members detect the position of the wafer on the surface of the suction cup, and the fork portion is moved according to the detection result to adjust the position of the wafer to complete the repositioning of the wafer on the suction cup.

[0009] The wafer positioning method as above, wherein the step of repositioning the wafer on the suction cup specifically includes: a plurality of first detection members simultaneously detecting the wafer, wherein the plurality of first detection members are spaced apart on the periphery of the suction cup; determining the setting positions and the number of the first detection members that detect the wafer among the plurality of first detection members; moving the fork portion according to the determination result to adjust the position of the wafer on the surface of the suction cup; determining that each of the first detection members cannot detect the wafer, and completing the repositioning of the wafer.

[0010] The wafer positioning method as above, wherein the step of moving the fork portion according to the judgment result to adjust the position of the wafer on the surface of the suction cup specifically includes: judging that the number of first detection members that detect the wafer among the three first detection members spaced apart at the periphery of the suction cup is two; and sequentially moving the fork portion in a straight line along the direction from each first detection member that detects the wafer to the center of the suction cup until all the first detection members cannot detect the wafer.

[0011] The wafer positioning method as above, wherein the step of moving the fork portion according to the judgment result to adjust the position of the wafer on the surface of the suction cup specifically includes: judging that the number of the first detection members that detect the wafer among the three first detection members spaced apart at the periphery of the suction cup is one; moving the fork portion linearly along the direction from the first detection member to the center of the suction cup until the first detection member cannot detect the wafer; judging whether other first detection members detect the wafer; if other first detection members cannot detect the wafer, completing the repositioning of the wafer; if any other first detection member detects the wafer, adjusting the position of the wafer accordingly according to the detection results of other first detection members to complete the repositioning of the wafer.

[0012] The chip positioning method as described above, wherein the step of adjusting the position of the chip accordingly according to the detection results of other first detection components, specifically includes: taking the first detection component that initially detects the chip as the axis, rotating the fork portion toward the center of the suction cup until all the first detection components cannot detect the chip.

[0013] The wafer positioning method as above, wherein the step of moving the fork portion according to the judgment result to adjust the position of the wafer on the surface of the suction cup specifically includes: making two first detection members orthogonally arranged at the periphery of the suction cup detect the wafer; making the fork portion move linearly along the direction from one of the first detection members to the center of the suction cup until the first detection member cannot detect the wafer; rotating the fork portion toward the center of the suction cup with the first detection member as the axis until the other first detection member cannot detect the wafer.

[0014] The wafer positioning method as above, wherein the step of placing the wafer to be transferred on the fork portion of the transfer structure and pre-positioning it with the fork portion, specifically includes: placing the wafer on the surface of the fork portion of the transfer structure, wherein the surface of the fork portion has an arc-shaped scribed line; aligning the edge of the wafer with the arc-shaped scribed line so that the edge of the wafer coincides with the arc-shaped scribed line; the fork portion sucks the wafer to complete the pre-positioning of the wafer, wherein the surface of the fork portion has a plurality of first suction holes.

[0015] In the wafer positioning method as described above, the step of initially positioning the wafer on the suction cup specifically includes: moving the fork portion of the transfer structure to the positioning portion of the suction cup; detecting the position of the fork portion by the positioning portion to confirm whether the fork portion is in place.

[0016] The wafer positioning method as above, wherein, after the wafer is repositioned on the suction cup, further comprises: the fork portion stops adsorbing the wafer and detaches from the suction cup so that the wafer is placed on the surface of the suction cup; and the suction cup adsorbs the wafer.

[0017] On the other hand, the present application also provides a chip positioning device, which is suitable for the above-mentioned chip positioning method, including a transfer structure and a suction cup, the transfer structure is used to transfer the chip to the suction cup, the suction cup is a circular structure with the same shape as the chip, the suction cup includes a plurality of first detection parts arranged at intervals along the circumferential direction and a plurality of second suction holes provided on the surface, and the plurality of second suction holes are used to adsorb the chip to the surface of the suction cup.

[0018] The wafer positioning device as above, wherein the suction cup includes at least three first detection members, the at least three first detection members are distributed on the circumference of the suction cup at intervals, and the coverage angle of the at least three first detection members on the circumference of the suction cup is greater than 180°; or, the suction cup includes two first detection members, and the coverage angle of the two first detection members in the circumferential direction of the suction cup is 90°.

[0019] The wafer positioning method of the present application includes pre-positioning between the wafer and the transfer structure of the wafer positioning device, initial positioning between the transfer structure of the wafer positioning device and the suction cup, and re-positioning between the wafer and the suction cup. The pre-positioning process is to place the wafer to be transferred on the surface of the fork portion of the transfer structure of the wafer positioning device so that the wafer and the transfer structure are positioned, and the transfer structure can accurately transfer the wafer to the suction cup; the initial positioning process is that when the transfer structure transfers the wafer to the suction cup, the fork portion of the transfer structure is first positioned with the suction cup, and the suction cup limits the fork portion to its positioning position, at which time the wafer can reach a relatively accurate position on the suction cup, completing the initial positioning of the wafer; the re-positioning process is that the multiple first detection parts of the suction cup detect the position of the wafer on the surface of the suction cup, and the fork portion is moved according to the detection result, and the wafer arranged on the fork portion moves together with the fork portion to achieve position adjustment until it is adjusted to the accurate position, completing the re-positioning of the wafer.

[0020] The wafer positioning method of the present application ensures the positional relationship between the wafer and the transfer structure through pre-positioning, ensures that the wafer has a relatively accurate position when it is initially placed on the suction cup through initial positioning, and finally realizes accurate detection and adjustment of the position of the wafer on the suction cup through repositioning. During the transfer and positioning of the wafer, the position is adjusted by the transfer structure, and the first detection component is used for position detection, thereby completing the automatic positioning operation between the wafer and the suction cup, and ensuring the accuracy and efficiency of positioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] Figure 1 A flowchart of a wafer positioning method according to an embodiment of the present application;

[0023] Figure 2 This is an overall flow chart of the wafer positioning method of the embodiment of the present application using multiple detection components to detect and position the wafer;

[0024] Figure 3 A schematic diagram of the structure of a wafer positioning device according to an embodiment of the present application

[0025] Figure 4 It is a schematic diagram of a wafer positioning device according to an embodiment of the present application performing wafer positioning.

[0026] Description of Figure Numbers:

[0027] 10. Transfer structure; 11. Fork portion; 12. First suction hole; 13. Arc-shaped engraved line; 14. Connecting portion; 20. Suction cup; 21. First detection member; 22. Second suction hole; 23. Positioning portion; 24. Second detection member;

[0028] 100. Wafer positioning device; 200. Wafer. DETAILED DESCRIPTION

[0029] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0030] like Figure 3 and Figure 4As shown, the chip positioning device 100 in the embodiment of the present application includes a transfer structure 10 and a suction cup 20. The transfer structure 10 has a plurality of fork portions 11, which can jointly carry the chip 200 and transfer the chip 200 to the surface of the suction cup 20. After completing the positioning between the chip 200 and the suction cup 20, the transfer structure 10 as a whole leaves the range of the suction cup 20, and the suction cup 20 adsorbs the chip 200. The adsorbed chip 200 can be inspected by a detection device. During the detection, the adsorption of the chip 200 by the suction cup 20 can ensure the stability of the setting of the chip 200 and prevent the chip 200 from falling off during the detection.

[0031] like Figures 1 to 4 As shown, an embodiment of the present application provides a wafer positioning method, which includes:

[0032] S110, placing the wafer 200 to be transferred on the fork portion 11 of the transfer structure 10 of the wafer positioning device 100 and pre-positioning the wafer 200 on the fork portion 11;

[0033] S120, transferring the wafer 200 to the suction cup 20 of the wafer positioning device 100 via the transfer structure 10, and restricting the fork portion 11 of the transfer structure 10 via the suction cup 20, so as to complete the initial positioning of the wafer 200 on the suction cup 20;

[0034] S130, multiple first detection components 21 detect the position of the chip 200 on the surface of the suction cup 20, and move the fork portion 11 according to the detection result to adjust the position of the chip 200 so that the chip 200 overlaps with the suction cup 20 to complete the repositioning of the chip 200 on the suction cup 20.

[0035] It should be noted that the position where the wafer 200 is finally positioned is set to the position where the wafer 200 overlaps with the suction cup 20, so that when the suction cup 20 adsorbs the wafer 200, the adsorption force of the suction cup 20 can be uniformly applied to the positions of various parts of the wafer 200, thereby preventing the wafer 200 from being partially deformed when subjected to uneven adsorption force, thereby affecting the overall quality of the wafer 200. In addition, the arrangement where the wafer 200 overlaps with the suction cup 20 also facilitates the first detection member 21 to determine the positioning position of the wafer 200. The first detection member 21 is arranged on the peripheral side of the suction cup 20 and will not affect the adsorption between the suction cup 20 and the wafer 200.

[0036] In specific implementation, the wafer positioning method of the embodiment of the present application includes pre-positioning between the wafer 200 and the transfer structure 10 of the wafer positioning device 100, initial positioning between the transfer structure 10 of the wafer positioning device 100 and the suction cup 20, and re-positioning between the wafer 200 and the suction cup 20. The pre-positioning process is to place the wafer 200 to be transferred on the surface of the fork portion 11 of the transfer structure 10 of the wafer positioning device 100 so that the wafer 200 and the transfer structure 10 are positioned, and the transfer structure 10 can accurately transfer the wafer to the suction cup 20; the initial positioning process is to transfer the wafer 200 to the suction cup 20 by the transfer structure 10. When the plate 20 is moved, the fork portion 11 of the transfer structure 10 is first positioned with the suction cup 20, and the suction cup 20 limits the fork portion 11 to its positioning position. At this time, the chip 200 can reach a relatively accurate position on the suction cup 20, and the initial positioning of the chip 200 is completed; the repositioning process is that the multiple first detection members 21 of the suction cup 20 detect the position of the chip 200 on the surface of the suction cup 20, and the fork portion 11 is moved according to the detection result. The chip 200 arranged on the fork portion 11 moves together with the fork portion 11 to achieve position adjustment until the chip 200 is adjusted to coincide with the suction cup 20, and the repositioning of the chip 200 is completed.

[0037] The chip positioning method of the present application ensures the positional relationship between the chip 200 and the transfer structure 10 through pre-positioning, ensures that the chip 200 has a relatively accurate position when it is initially placed on the suction cup 20 through initial positioning, and finally realizes the precise detection and adjustment of the position of the chip 200 on the suction cup 20 through repositioning. During the transfer and positioning of the chip 200, the position is adjusted by the transfer structure 10, and the first detection component 21 is used to perform position detection, thereby completing the automatic positioning operation between the chip 200 and the suction cup 20, and ensuring the accuracy and efficiency of positioning.

[0038] like Figure 2 As shown, the chip positioning method of the embodiment of the present application, wherein the step of repositioning the chip 200 on the suction cup 20 specifically includes: a plurality of first detection members 21 simultaneously detect the chip 200, wherein the plurality of first detection members 21 are arranged at intervals on the periphery of the suction cup 20; determining the setting positions and the number of the first detection members 21 that detect the chip 200 among the plurality of first detection members 21; moving the fork portion 11 according to the determination result to adjust the position of the chip 200 on the surface of the suction cup 20; determining that each of the first detection members 21 cannot detect the chip 200, and completing the repositioning of the chip 200.

[0039] In a specific implementation, when the chip 200 is repositioned, a plurality of first detection members 21 arranged at intervals around the periphery of the suction cup 20 simultaneously detect the edge of the chip 200 to detect whether the chip 200 is out of the range of the suction cup 20. According to the detection result of the first detection member 21, the fork portion 11 is moved, and the fork portion 11 drives the chip 200 to move on the suction cup 20. When each first detection member 21 cannot detect the chip 200, the surface chip 200 overlaps with the suction cup 20, and the repositioning of the chip 200 is completed, so that the chip 200 and the suction cup 20 are accurately positioned.

[0040] like Figure 2 As shown, the chip positioning method of the embodiment of the present application, wherein, in the step of moving the fork portion 11 according to the judgment result to adjust the position of the chip 200 on the surface of the suction cup 20, specifically includes: judging that the number of the first detection members 21 that detect the chip 200 among the three first detection members 21 spaced apart at the periphery of the suction cup 20 is two; and sequentially moving the fork portion 11 in a straight line along the direction from each first detection member 21 that detects the chip 200 to the center of the suction cup 20, until all the first detection members 21 cannot detect the chip 200.

[0041] Specifically, when the fork portion 11 moves the wafer 200 , the wafer 200 needs to be moved with a maximum step distance of 10 μm to prevent the wafer 200 from being moved too far, thereby causing deviation in other directions.

[0042] Since multiple first detection parts 21 are evenly and spaced apart along the circumference of the suction cup 20, when judging the position of the chip 200 and making adjustments based on the detection results of the first detection parts 21, it is necessary to first judge the number of first detection parts 21 that have detected the chip 200. When the chip 200 is placed on the surface of the suction cup 20, if an offset occurs, the chip 200 will definitely cover one first detection part 21 or several consecutive first detection parts 21. Therefore, by judging the number of first detection parts 21 that have detected the chip 200, the approximate direction and degree of offset of the chip 200 can be judged, and different chip adjustment methods can be selected according to this number to achieve rapid positioning of the chip 200 and ensure positioning accuracy and efficiency.

[0043] In a specific implementation, when it is determined that there are multiple first detection members 21 detecting the chip 200, it means that the overall offset of the chip 200 is large, and the fork portion 11 needs to be moved sequentially according to the setting positions of the first detection members 21 detecting the chip 200. Each time the fork portion 11 is moved, it is necessary to move the fork portion 11 in the direction from one of the first detection members 21 to the center of the suction cup 20. After multiple movements, all the first detection members 21 cannot detect the chip 200, thereby achieving repositioning between the chip 200 and the suction cup 20.

[0044] Moreover, since the plurality of first detection members 21 all detect the wafer 200, it also indicates that the wafer 200 is completely offset in one direction. After the fork portion 11 is sequentially moved along the direction from each first detection member 21 to the center of the suction cup 20, the wafer 200 can completely overlap with the suction cup 20 and will not be detected by other first detection members 21 other than the plurality of first detection members 21 that detect the wafer 200. Therefore, the wafer positioning method of the embodiment of the present application can ensure the positioning accuracy between the wafer 200 and the suction cup 20.

[0045] Optionally, after determining the number of first detection members 21, the specific position deviation between the chip 200 detected by these first detection members 21 and the suction cup 20 can also be specifically determined, so that the precise position of the chip 200 can be adjusted according to the specific position deviation, so that the chip 200 can be completely overlapped with the suction cup 20, thereby further improving the positioning accuracy of the chip 200.

[0046] like Figure 2 As shown, the chip positioning method of the embodiment of the present application, wherein, in the step of moving the fork portion 11 according to the judgment result to adjust the position of the chip 200 on the surface of the suction cup 20, specifically includes: judging that the number of the first detection components 21 that detect the chip 200 is one; moving the fork portion 11 linearly along the direction from the first detection component 21 to the center of the suction cup 20 until the first detection component 21 cannot detect the chip 200; judging whether other first detection components 21 detect the chip 200; if other first detection components 21 cannot detect the chip 200, completing the repositioning of the chip 200; if any other first detection component 21 detects the chip 200, adjusting the position of the chip 200 accordingly according to the detection results of the other first detection components 21 to complete the repositioning of the chip 200.

[0047] In specific implementation, when it is determined that the number of first detection members 21 that detect the wafer 200 is one, it means that the overall offset of the wafer 200 is small, but only one first detection member 21 detects the wafer 200, and the specific offset direction of the wafer 200 cannot be specifically determined. Therefore, it is necessary to first move the fork portion 11 according to the position deviation detected by the first detection member 21. After the fork portion 11 moves a corresponding distance in the direction from the first detection member 21 to the center of the suction cup 20, it is necessary to determine whether there are other first detection members 21 that detect the wafer 200, so as to determine the specific offset orientation of the wafer 200, and decide whether to complete the positioning or continue the adjustment based on the result of the judgment. The positioning method of the embodiment of the present application can accurately determine the specific offset direction of the wafer 200 when only one first detection member 21 detects the wafer, and perform subsequent adjustments, thereby ensuring the positioning accuracy between the wafer 200 and the suction cup 20.

[0048] like Figure 2As shown, the chip positioning method of the embodiment of the present application, wherein, in the step of adjusting the position of the chip 200 accordingly according to the detection results of other first detection parts 21, specifically includes: taking the first detection part 21 that initially detects the chip 200 as the axis, rotating the fork part 11 toward the center of the suction cup 20 until all the first detection parts 21 cannot detect the chip 200.

[0049] In a specific implementation, after the chip 200 is adjusted for the first time, the offset direction and position deviation of the chip 200 can be obtained based on the position offset displayed by the first detection member 21 that detects the offset of the chip 200 after adjustment and the position of the first detection member 21, and the offset angle can be calculated, and finally the chip 200 can be rotated according to the offset angle.

[0050] Since the position correction has been performed when the first detection part 21 initially detects that the chip 200 has a deviation, the chip 200 is in an accurate position after the first correction at the initial position of the first detection part 21. At this time, rotating toward the center of the suction cup 20 with this position as the axis can avoid further position deviations in other directions of the chip 200, thereby achieving accurate positioning of the chip 200 without the need for further adjustment, thereby improving the positioning efficiency of the chip 200.

[0051] A chip positioning method according to another embodiment of the present application, wherein the step of moving the fork portion 11 according to the judgment result to adjust the position of the chip 200 on the surface of the suction cup 20 specifically includes: making two first detection members 21 orthogonally arranged at the periphery of the suction cup 20 detect the chip 200; making the fork portion 11 move linearly along the direction from one of the first detection members 21 to the center of the suction cup 20 until the first detection member 21 cannot detect the chip 200; and rotating the fork portion 11 toward the center of the suction cup 20 with the first detection member 21 as the axis until the other first detection member 21 cannot detect the chip 200.

[0052] In specific implementation, the wafer positioning method in this embodiment is adopted to reduce the number of first detection members 21 to be set, and only two orthogonally arranged first detection members 21 need to be set. The coverage range of the two orthogonally arranged first detection members 21 is 90°. In the step of moving the fork portion 11 according to the judgment result to adjust the position of the wafer 200 on the surface of the suction cup 20, it is necessary to first enable the fork portion 11 to drive the wafer 200 to move on the surface of the suction cup 20, and finally achieve the effect that the two first detection members 21 orthogonally arranged on the periphery of the suction cup 20 both detect the wafer 200. This step ensures that the wafer 200 is fixedly oriented toward the coverage range of the two first detection members 21. The fork portion 11 is offset in order to make subsequent position adjustments; then the fork portion 11 performs a linear motion in the direction from one of the first detection pieces 21 to the center of the suction cup 20, and a position correction has been performed at the position of this first detection piece 21. After the first correction, the chip 200 is in an accurate position. At this time, with this position as the axis, the fork portion 11 is rotated toward the center of the suction cup 20 until the other first detection piece 21 cannot detect the chip 200, and finally the two first detection pieces 21 cannot detect the chip 200, and the position deviation of the chip 200 within the coverage range of the two first detection pieces 21 is eliminated, thereby completing the positioning of the chip 200 on the surface of the suction cup 20.

[0053] like Figure 2 As shown, the chip positioning method of the embodiment of the present application, wherein, in the step of placing the chip 200 to be transferred on the fork portion 11 of the transfer structure 10 and pre-positioning it with the fork portion 11, specifically includes: placing the chip 200 on the surface of the fork portion 11 of the transfer structure 10, wherein the surface of the fork portion 11 has an arc-shaped scribed line 13; aligning the edge of the chip 200 with the arc-shaped scribed line 13 so that the edge of the chip 200 coincides with the arc-shaped scribed line 13; the fork portion 11 sucks the chip 200 to complete the pre-positioning of the chip 200, wherein the surface of the fork portion 11 has a plurality of first suction holes 12.

[0054] In specific implementation, before the chip 200 is transferred by the transfer structure 10, it is necessary to first align the arc-shaped score line 13 on the surface of the fork portion 11. The arc-shaped score line 13 is the same shape as a portion of the edge of the chip 200, so alignment can be performed. After the partial edge of the chip 200 is overlapped with the arc-shaped score line 13, it means that the positioning between the chip 200 and the fork portion 11 is completed. Then, the first suction hole 12 of the fork portion 11 sucks the chip 200 to fix the chip 200 on the fork portion 11 to prevent the chip 200 from falling off the fork portion 11 during the transfer process of the transfer structure 10.

[0055] After the chip 200 and the transfer structure 10 are pre-positioned, no relative movement will occur between the two. The transfer structure 10 can accurately transfer the chip 200 to the suction cup 20 for positioning, so as to avoid the situation where the distance between the chip 200 and the suction cup 20 is too large after the transfer structure 10 is transferred, requiring more complicated positioning operations, which affects the positioning accuracy and efficiency.

[0056] The chip positioning method of the embodiment of the present application, wherein the step of initially positioning the chip 200 on the suction cup 20 specifically includes: moving the fork portion 11 of the transfer structure 10 to the positioning portion 23 of the suction cup 20; detecting the position of the fork portion 11 through the positioning portion 23 to confirm whether the fork portion 11 is in place.

[0057] In specific implementation, the step of initially positioning the wafer 200 on the suction cup 20 is the step of positioning between the fork portion 11 of the transfer structure 10 and the positioning portion 23 of the suction cup 20. The two devices are first positioned so that the fork portion 11 can accurately reach the position of the positioning portion 23. At this position, the wafer 200 and the suction cup 20 are basically overlapped, and no substantial adjustment is required subsequently. Therefore, the positioning of the fork portion 11 by the positioning portion 23 can improve the positioning accuracy and efficiency of the wafer 200 on the suction cup 20.

[0058] The chip positioning method of the embodiment of the present application, wherein, after the chip 200 is repositioned on the suction cup 20, further includes: the fork portion 11 stops adsorbing the chip 200 and detaches from the suction cup 20, so that the chip 200 is placed on the surface of the suction cup 20; the suction cup 20 adsorbs the chip 200.

[0059] During specific implementation, after the chip 200 is repositioned on the suction cup 20, the first suction hole 12 of the fork portion 11 needs to stop adsorbing the chip 200, and the fork portion 11 needs to be detached from the positioning portion 23 to avoid interfering with the suction cup 20 on the chip 200. In this way, the chip 200 can be tightly adsorbed on the suction cup 20, thereby completing subsequent inspections of the chip 200.

[0060] like Figure 3 and Figure 4 As shown, an embodiment of the present application further provides a wafer positioning device, which is suitable for the above-mentioned wafer positioning method, including a transfer structure 10 and a suction cup 20, the transfer structure 10 is used to transfer the wafer 200 to the suction cup 20, the suction cup 20 is a circular structure with the same shape as the wafer 200, the suction cup 20 includes a plurality of first detection parts 21 arranged at intervals along the circumferential direction and a plurality of second suction holes 22 provided on the surface, and the plurality of second suction holes 22 are used to adsorb the wafer 200 on the surface of the suction cup 20.

[0061] In a specific implementation, the chip positioning device 100 includes a transfer structure 10 and a suction cup 20. The suction cup 20 is a circular structure with the same shape as the chip 200. When the chip 200 and the suction cup 20 completely overlap, it means that the positioning of the chip 200 is completed. The suction cup 20 can adsorb the chip 200, and the chip 200 can be subjected to uniform adsorption force without deformation.

[0062] The first detection members 21 arranged at intervals along the circumference of the suction cup 20 can detect the wafer 200 to confirm whether the wafer 200 overlaps with the suction cup 20, thereby assisting in repositioning the wafer 200 so that the wafer 200 can be accurately positioned with the suction cup 20, thereby ensuring the positioning accuracy of the wafer 200. After the wafer 200 is positioned, the second suction holes 22 absorb the wafer 200, so that the detection operation of the wafer 200 is performed after absorption.

[0063] The wafer positioning device of the embodiment of the present application, wherein the suction cup 20 includes at least three first detection members 21, the at least three first detection members 21 are distributed at intervals on the circumference of the suction cup 20, and the coverage angle of the at least three first detection members 21 on the circumference of the suction cup 20 is greater than 180°.

[0064] In a specific implementation, the coverage angle of at least three first detection members 21 around the suction cup 20 is greater than 180°, which can detect the deviation of the wafer 200 in various directions, avoid missed detection, and enable the wafer 200 to be accurately moved subsequently.

[0065] like Figure 4 As shown, in the wafer positioning device of the embodiment of the present application, the suction cup 20 includes three first detection members 21 , the three first detection members 21 are evenly distributed on the circumference of the suction cup 20 , and the connecting lines between the three first detection members 21 form an equilateral triangle.

[0066] During specific implementation, three first detection members 21 are arranged in the shape of an equilateral triangle. When the chip 200 is rotated with one of the first detection members 21 as the center, the two first detection members 21 on both sides can detect the two rotation directions, so that the chip 200 will never exceed the range of the suction cup 20, thereby preventing deviation and ensuring the positioning accuracy of the chip 200.

[0067] A wafer positioning device in an optional embodiment of the present application, wherein the suction cup 20 includes two first detection members 21 arranged orthogonally on the circumferential side of the suction cup 20, and the two first detection members 21 have a circumferential coverage angle of 90° of the suction cup 20, that is, the angle between the two first detection members 21 and the center of the suction cup 20 is 90°.

[0068] When both first detection members 21 detect the suction cup 20, the wafer 200 is moved in the direction from one of the first detection members 21 to the center of the suction cup 20 until the first detection member 21 cannot detect the wafer 200, and the wafer 200 is rotated with the first detection member 21 as the center until the other first detection member 21 cannot detect the wafer 200, thus completing the alignment of the wafer 200. The two orthogonally distributed first detection members 21 enable the wafer 200 to be fully aligned with the suction cup 20 after the above adjustment.

[0069] like Figure 3 As shown, a chip positioning device of an embodiment of the present application, wherein the transfer structure 10 includes two fork portions 11 arranged at intervals, the two fork portions 11 are connected by a connecting portion 14, each fork portion 11 has an arc-shaped marking line 13 and a first suction hole 12, the first suction hole 12 is used to suck the chip 200, and the centers of the arc-shaped marking lines 13 of the two fork portions 11 are arranged to coincide with each other.

[0070] In specific implementation, the two fork parts 11 of the transfer structure 10 are connected by the connecting part 14, and the fork part 11 is used to carry the wafer 200 and position it with the positioning part 23. The fork part 11 is provided with an arcuate score line 13 and a first suction hole 12. Before the wafer 200 is carried on the two fork parts 11, it needs to be aligned with the arcuate score lines 13 of the two fork parts 11. The arrangement of the arcuate score lines 13 of the two fork parts 11 coinciding with each other allows the edge of the wafer 200 to coincide with the arcuate score lines 13 of the two fork parts 11 at the same time, thereby achieving pre-alignment between the wafer 200 and the transfer structure 10. After pre-alignment, the first suction hole 12 of the fork part 11 sucks the wafer 200, so that the wafer 200 can stably reach the suction cup 20 for positioning, further ensuring the positioning accuracy of the wafer 200.

[0071] Optionally, an arcuate mark 13 may be set on only one fork portion 11. The length of the arcuate mark 13 needs to be set longer to ensure that the overlapping portion between the edge of the chip 200 and the arcuate mark 13 is longer, avoiding the situation where the arcuate mark 13 is too short and tangent to the edge of the chip 200, thereby ensuring the accuracy of pre-positioning.

[0072] like Figure 3 As shown, the wafer positioning device of the embodiment of the present application, wherein the suction cup 20 also includes two positioning parts 23, the two positioning parts 23 are arranged corresponding to the two fork parts 11, and the positioning parts 23 are used to detect the position of the fork part 11 on the suction cup 20.

[0073] During specific implementation, the two positioning parts 23 can detect the positions of the two fork parts 11 to avoid the corresponding error between the fork parts 11 and the positioning parts 23, thereby ensuring the positioning accuracy of the initial positioning of the wafer 200.

[0074] Specifically, a plurality of second detection members 24 are correspondingly provided at the positioning portion 23 , and the second detection members 24 are used to detect the specific position of the fork portion 11 in the positioning portion 23 , so as to accurately position the fork portion 11 and the positioning portion 23 , thereby completing the initial positioning of the wafer 200 .

[0075] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0076] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. A wafer positioning method, characterized in that: include: Placing a wafer (200) to be transferred on a fork portion (11) of a transfer structure (10) of a wafer positioning device (100) and pre-positioning the wafer with the fork portion (11); The wafer (200) is transferred to the suction cup (20) of the wafer positioning device (100) via the transfer structure (10), and the fork portion (11) of the transfer structure (10) is restricted by the suction cup (20) to complete the initial positioning of the wafer (200) on the suction cup (20); A plurality of first detection members (21) detect the position of the wafer (200) on the surface of the suction cup (20), and move the fork portion (11) according to the detection result to adjust the position of the wafer (200) so as to complete the repositioning of the wafer (200) on the suction cup (20).

2. The wafer positioning method according to claim 1, characterized in that: The step of repositioning the wafer (200) on the suction cup (20) specifically includes: A plurality of the first detection members (21) detect the wafer (200) simultaneously, wherein the plurality of the first detection members (21) are arranged at intervals on the periphery of the suction cup (20); Determining the setting position and number of the first detection components (21) that detect the wafer (200) among the plurality of first detection components (21); Moving the fork portion (11) according to the judgment result to adjust the position of the wafer (200) on the surface of the suction cup (20); It is determined that each of the first detection components (21) is unable to detect the wafer (200), and the wafer (200) is repositioned.

3. The wafer positioning method according to claim 2, characterized in that: The step of moving the fork portion (11) according to the judgment result to adjust the position of the wafer (200) on the surface of the suction cup (20) specifically includes: It is determined that the number of the first detection members (21) that detect the wafer (200) among the three first detection members (21) arranged at intervals on the periphery of the suction cup (20) is two; The fork portion (11) is sequentially moved linearly in the direction from each of the first detection components (21) that detect the wafer (200) to the center of the suction cup (20) until all of the first detection components (21) are unable to detect the wafer (200).

4. The wafer positioning method according to claim 2, characterized in that: The step of moving the fork portion (11) according to the judgment result to adjust the position of the wafer (200) on the surface of the suction cup (20) specifically includes: Determining that the number of the first detection members (21) that detects the wafer (200) among the three first detection members (21) arranged at intervals on the periphery of the suction cup (20) is one; The wafer fork portion (11) is caused to perform linear movement along the direction from the first detection member (21) to the center of the suction cup (20) until the first detection member (21) cannot detect the wafer (200); determining whether the first detection component (21) detects the wafer (200); If the other first detection components (21) are unable to detect the chip (200), repositioning the chip (200) is completed; If any other of the first detection components (21) detects the chip (200), the position of the chip (200) is adjusted accordingly according to the detection result of the other first detection component (21) to complete the repositioning of the chip (200).

5. The wafer positioning method according to claim 4, characterized in that: The step of adjusting the position of the wafer (200) accordingly according to the detection result of the first detection member (21) specifically includes: With the first detection member (21) that initially detects the wafer (200) as the axis, the fork portion (11) is rotated toward the center of the suction cup (20) until all the first detection members (21) are unable to detect the wafer (200).

6. The wafer positioning method according to claim 2, characterized in that: The step of moving the fork portion (11) according to the judgment result to adjust the position of the wafer (200) on the surface of the suction cup (20) specifically includes: enabling the two first detection members (21) arranged orthogonally on the periphery of the suction cup (20) to both detect the wafer (200); The wafer fork portion (11) is caused to move linearly in a direction from one of the first detection components (21) to the center of the suction cup (20) until the first detection component (21) is unable to detect the wafer (200); With the first detection member (21) as the axis, the wafer fork portion (11) is rotated in the direction of the center of the suction cup (20) until the other first detection member (21) cannot detect the wafer (200).

7. The wafer positioning method according to claim 1, characterized in that: The step of placing a wafer (200) to be transferred on a fork portion (11) of a transfer structure (10) and pre-positioning the wafer with the fork portion (11) specifically includes: Placing the wafer (200) on the surface of the fork portion (11) of the transfer structure (10), wherein the surface of the fork portion (11) has an arc-shaped scribed line (13); Aligning the edge of the wafer (200) with the arc-shaped scribe line (13) so that the edge of the wafer (200) coincides with the arc-shaped scribe line (13); The fork portion (11) sucks the wafer (200) to complete the pre-positioning of the wafer (200), wherein the surface of the fork portion (11) has a plurality of first suction holes (12).

8. The wafer positioning method according to claim 1, characterized in that: The step of initially positioning the wafer (200) on the suction cup (20) specifically includes: Moving the fork portion (11) of the transfer structure (10) to the positioning portion (23) of the suction cup (20); The position of the blade fork portion (11) is detected by the positioning portion (23) to confirm whether the blade fork portion (11) is in place.

9. The wafer positioning method according to claim 1, characterized in that: After the wafer (200) is repositioned on the suction cup (20), the method further comprises: The fork portion (11) stops adsorbing the wafer (200) and detaches from the suction cup (20), so that the wafer (200) is placed on the surface of the suction cup (20); The suction cup (20) absorbs the wafer (200).

10. A wafer positioning device, characterized in that: A wafer positioning method suitable for use as claimed in any one of claims 1 to 9, comprising a transfer structure (10) and a suction cup (20), wherein the transfer structure (10) is used to transfer a wafer (200) to the suction cup (20), wherein the suction cup (20) is a circular disc structure, and the suction cup (20) has the same diameter as the wafer (200), and the suction cup (20) comprises a plurality of first detection members (21) arranged at intervals along the circumferential direction and a plurality of second suction holes (22) provided on the surface, wherein the plurality of second suction holes (22) are used to adsorb the wafer (200) to the surface of the suction cup (20).

11. The wafer positioning device according to claim 10, characterized in that: The suction cup (20) comprises at least three first detection members (21), and the coverage angle of the at least three first detection members (21) in the circumferential direction of the suction cup (20) is greater than 180°; Alternatively, the suction cup (20) comprises two first detection members (21), and the coverage angle of the two first detection members (21) in the circumferential direction of the suction cup (20) is 90°.

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