Substrate bearing device and substrate processing equipment

Abstract

The invention discloses a substrate bearing device and substrate processing equipment. The substrate bearing device comprises a bearing disc assembly, a clamping assembly and an ejector pin assembly. The clamping assembly and the ejector pin assembly are in linkage with the bearing disc assembly so as to clamp or release the base plate. In the lifting state, the bearing disc assembly drives the ejector pin assembly to ascend, while the ejector pin assembly jacks up the base plate, the bearing disc assembly drives the clamping assembly to release the base plate, and the ejector pin assembly continuously lifts the base plate to a first preset height. In the clamping state, the bearing disc assembly drives the ejector pin assembly to descend, and when the base plate descends to the second preset height along with the ejector pin assembly, the bearing disc assembly drives the clamping mechanism to clamp the base plate. Through the linkage design of the clamping assembly, the ejector pin assembly and the bearing disc assembly, the base plate bearing device has the base plate clamping and lifting effects.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and further to a substrate carrying device and substrate processing equipment. Background Art

[0002] In the process of chip manufacturing, it is inevitable to introduce some impurity particles, organic matter, metal ions and oxides, etc., which are potential risks that affect the chip yield and reliability. Therefore, cleaning is a very important process in the chip manufacturing process. Single-chip substrate cleaning machines have the advantages of easy control of cleaning quality and improving the cleaning uniformity of different positions of single-chip substrates, and are increasingly being used.

[0003] During the operation of the single-chip substrate cleaning machine, the substrate carrier device rises above the protective cover, and the substrate to be cleaned is placed on the substrate carrier device and fixed by a robot; the substrate to be cleaned is lowered into the protective cover along with the substrate carrier device, and then the cleaning liquid is sprayed by the nozzle to clean the substrate; after the cleaning is completed, the substrate carrier device lifts the substrate to the top of the protective cover, and then the robot removes it and replaces it with another substrate to be cleaned. In the above process, two basic operations need to be performed on the substrate: clamping and lifting.

[0004] In the prior art, the substrate clamping methods include centrifugal clamping and mechanical clamping, and the substrate lifting methods include central rod lifting. Centrifugal clamping has the advantages of simple structure and low cost, but it is easy to slip when starting and stopping, and lacks a lifting mechanism; mechanical clamping has the advantages of uniform clamping force and less prone to slip, but it has a complex structure and is difficult to add a lifting mechanism; the central rod lifting mechanism has a simple structure, but because the top rod occupies the position of the back nozzle, the back nozzle cannot be used.

[0005] Chinese patent application No. 201410280327.9 discloses a substrate holding device and a substrate cleaning device. The substrate holding device comprises: a chuck for holding the peripheral portion of the substrate; a supporting component arranged below the substrate; and a driving device. The driving device moves the chuck to contact the peripheral portion of the substrate while causing the supporting component to rise and contact the lower surface of the substrate. In addition, the driving device moves the chuck in a direction away from the peripheral portion of the substrate while causing the supporting component to descend and leave the lower surface of the substrate. In the above technical solution, while the chuck clamps the substrate, the substrate is supported by the supporting component to reduce the deflection of the substrate. Although the patent uses the supporting component to reduce the deflection during substrate processing, the supporting component can only assist in supporting the substrate when the chuck clamps the substrate, and does not have the function of lifting the substrate, and cannot lift the substrate above the protective cover.

[0006] Therefore, how to design a substrate supporting device that has both substrate clamping and lifting functions has become a key technical problem that needs to be solved in this field. Summary of the invention

[0007] In view of the above technical problems, the purpose of the present invention is to design a substrate carrying device with both substrate clamping and lifting functions.

[0008] In order to achieve the above-mentioned purpose, the present invention provides a substrate carrying device, comprising: a carrying plate assembly; a clamping assembly, which is installed on the peripheral side of the carrying plate assembly and is linked to the carrying plate assembly to clamp or release the substrate; a pin assembly, which is installed on the carrying plate assembly and is linked to the carrying plate assembly to lift and lower the substrate; wherein, in a lifting state, the carrying plate assembly drives the pin assembly to rise, and while the pin assembly lifts the substrate, the carrying plate assembly drives the clamping assembly to release the substrate, and the pin assembly continuously lifts the substrate to a first preset height; in a clamping state, the carrying plate assembly drives the pin assembly to descend, and when the substrate descends to a second preset height along with the pin assembly, the carrying plate assembly drives the clamping mechanism to clamp the substrate, and the pin assembly continues to descend to a third preset height, and the first preset height is higher than the second preset height, and the second preset height is higher than the third preset height.

[0009] In some embodiments, the supporting plate assembly includes a fixed plate and a lifting plate, the lifting plate can be raised and lowered and is arranged on one side of the fixed plate in the vertical direction, the ejector assembly is fixed to the upper end surface of the lifting plate, and the fixed plate and the lifting plate drive the clamping assembly for relative translation; in the lifting state, the ejector assembly rises with the lifting plate to lift the substrate from the second preset height to the first preset height, and the clamping assembly releases the substrate when the substrate starts to rise from the second preset height; in the clamping state, the ejector assembly descends with the lifting plate to descend the substrate from the first preset height to the second preset height, and the clamping assembly clamps the substrate when the substrate reaches the second preset height.

[0010] In some embodiments, the lifting plate is located above the fixed plate; the clamping assembly includes a plurality of clamping members, each of which constitutes a lever structure having a power arm and a resistance arm and a fulcrum located on the peripheral side of the fixed plate; the lifting plate can act on the power arm of the clamping member to drive the resistance arm of each clamping member to rotate toward the lifting plate to clamp the substrate.

[0011] In some embodiments, the clamping member includes a power part serving as the power arm, a fulcrum part and a resistance part serving as the resistance arm, and the power part and the resistance part are fixedly connected to the fulcrum part respectively; wherein the fulcrum part is resiliently hingedly connected to the fixed disk, and the direction of the hinge axis is consistent with the tangent direction of the fixed disk at that point; the resistance part is arranged on the upper side of the fixed disk and is located on the side of the fulcrum part away from the center of the fixed disk, and the side of the resistance part facing the lifting disk has a substrate clamping position, which is used to rotate inward from the outer peripheral side of the lifting disk to clamp the substrate; the power part is arranged on the upper side of the fixed disk and is located on the side of the fulcrum part close to the center of the fixed disk, and the power part has a force-bearing surface corresponding to the lower end surface of the lifting disk, which is used to apply torque to the fulcrum part during the descent of the lifting disk, thereby driving the resistance part to rotate toward the lifting disk.

[0012] In some embodiments, a notch matched with the resistance portion is provided on the circumferential side of the lifting plate, and in the clamping state, the resistance portion is embedded in the notch along the radial direction of the lifting plate to clamp the substrate.

[0013] In some embodiments, the lifting plate is located above the fixed plate; the clamping assembly includes a plurality of clamping members, each of which constitutes a lever structure having a power arm and a resistance arm and a fulcrum located on the periphery of the lifting plate, and the fixed plate can act on the power arm of the clamping member to drive the resistance arm of each clamping member to rotate inward to clamp the substrate.

[0014] In some embodiments, the clamping member includes a power part serving as the power arm, a fulcrum part and a resistance part serving as the resistance arm, and the power part and the resistance part are fixedly connected to the fulcrum part respectively; wherein the fulcrum part is resiliently hingedly connected to the lifting plate, and the direction of the hinge axis is consistent with the tangent direction of the lifting plate at that point; the resistance part is arranged on the upper side of the lifting plate, and has a substrate clamping position on the side close to the lifting plate, and the substrate clamping position is adapted to the edge of the substrate and can be rotated inward from the outer peripheral side of the lifting plate to clamp the substrate; the power part is arranged on the lower side of the lifting plate and abuts against the outer peripheral side of the fixed plate, and the power part has a force-bearing surface corresponding to the outer peripheral side of the fixed plate, which is used to apply torque to the fulcrum part during the descent of the lifting plate, thereby driving the resistance part to rotate toward the lifting plate.

[0015] In some embodiments, the lifting plate is located below the fixed plate, and a plurality of first through holes for passing the ejector assembly are opened on the surface of the fixed plate; the clamping assembly includes a plurality of clamping members, each of which constitutes a lever structure having a power arm and a resistance arm and a fulcrum located on the peripheral side of the fixed plate, and the lifting plate can act on the power arm of the clamping member to drive the resistance arm of each clamping member to rotate toward the fixed plate to clamp the substrate.

[0016] In some embodiments, the clamping member includes a power part serving as the power arm, a fulcrum part and a resistance part serving as the resistance arm, and the power part and the resistance part are fixedly connected to the fulcrum part respectively; wherein the fulcrum part is resiliently hingedly connected to the fixed disk, and the direction of the hinge axis is consistent with the tangent direction of the fixed disk at that point; the resistance part is arranged on the upper side of the fixed disk, and has a substrate clamping position on the side close to the center of the fixed disk, and the substrate clamping position is adapted to the edge of the substrate and can be rotated inward from the outer peripheral side of the fixed disk to clamp the substrate; the power part is arranged on the lower side of the fixed disk, and has a force-bearing surface corresponding to the upper end surface of the lifting disk, which is used to apply torque to the fulcrum part during the rising process of the lifting disk, thereby driving the resistance part to rotate away from the lifting disk.

[0017] In some embodiments, the fulcrum portion and the fixed plate are resiliently hingedly connected; the power portion is located between the fixed plate and the lifting plate, and the force-bearing surface is located on the side of the power portion facing the lifting plate; when the lifting plate is rising, the lifting plate presses the force-bearing portion upward through the force-bearing surface to drive the resistance portion to rotate toward the outside of the fixed plate; when the lifting plate is rising, the force-bearing portion is reset under the action of the elastic force, and the resistance portion rotates toward the inside of the fixed plate.

[0018] In some embodiments, a strip hole is opened on the side of the power part; a sliding shaft adapted to the strip hole is installed on the circumferential side of the lifting plate, and the axial directions of the strip hole and the sliding shaft are respectively consistent with the directions of the hinge axis; the force-bearing surface is located on the inner side surface of the strip hole, so that during the lifting process of the lifting plate, the sliding shaft acts on the inner side surface of the strip hole to drive the clamping member to rotate.

[0019] In some embodiments, the strip-shaped hole includes a rotating section and a retaining section along its length direction, a preset angle is formed between the rotating section and the retaining section, and the retaining section remains in a vertical state in the lifting state; wherein,

[0020] During the descent of the lifting plate, the sliding shaft slides from the holding section to the rotating section, and when the substrate is between the first preset height and the second preset height, the sliding shaft is located in the holding section and the clamp remains in an open state; when the substrate descends to the second preset height, the sliding shaft enters the rotating section to slide, and the clamp rotates toward the inner side of the fixed plate to clamp the substrate; during the ascending process of the lifting plate, the sliding shaft slides from the rotating section to the holding section, and when the substrate starts to rise from the second preset height, the sliding shaft slides in the rotating section, and the clamp rotates toward the outer side of the fixed plate to release the substrate; when the substrate rises to between the first preset height and the second preset height, the sliding shaft slides in the rotating section, and the clamp remains in an open state.

[0021] In some embodiments, the lifting plate is located below the fixed plate, and a plurality of first through holes for passing the ejector assembly are opened on the surface of the fixed plate; the clamping assembly includes a plurality of clamping members, each of which constitutes a lever structure having a power arm and a resistance arm and a fulcrum located on the peripheral side of the lifting plate, and the fixed plate can act on the power arm of the clamping member to drive the resistance arm of each clamping member to rotate away from the fixed plate to release the substrate.

[0022] In some embodiments, the clamping member includes a power part, a fulcrum part and a resistance part, and the fulcrum part, the power part and the resistance part are fixedly connected in sequence; wherein the fulcrum part is resiliently hingedly connected to the lifting plate, and the direction of the hinge axis is consistent with the tangent direction of the lifting plate at that point; the resistance part is arranged on the upper side of the lifting plate and extends to the upper side of the fixed plate, and the resistance part has a substrate clamping position on the side facing the center of the fixed plate, and the substrate clamping position is adapted to the edge of the substrate, and is used to rotate the substrate inward from the outer peripheral side of the lifting plate to clamp it; the power part is arranged on the upper side of the lifting plate and is located between the fixed plate and the lifting plate, and the power part has a force-bearing surface corresponding to the outer peripheral side of the fixed plate, which is used for the lifting plate to apply torque to the fulcrum part during the rising process, thereby driving the resistance part to rotate away from the lifting plate.

[0023] In some embodiments, the substrate supporting device further includes a base, located below the supporting plate assembly; a plurality of fixed push rods and a linear drive member; wherein the bottom ends of the fixed push rods and the linear drive member are fixed to the surface of the base at intervals, and the top ends of the fixed push rods are fixed to the lower end surface of the fixed plate; a plurality of second through holes are opened on the surface of the fixed plate, and the top end of the linear drive member can slide through the second through holes and be fixed to the lower end surface of the lifting plate.

[0024] In some embodiments, the substrate supporting device further includes a base, located below the supporting plate assembly; a plurality of fixed push rods and a linear drive member; wherein the bottom ends of the fixed push rods and the linear drive member are fixed to the surface of the base at intervals, and the top end of the linear drive member is fixed to the lower end surface of the lifting plate; a plurality of third through holes are opened on the surface of the lifting plate, and the top end of the fixed push rod can slide through the third through holes and be fixed to the lower end surface of the fixed plate.

[0025] In some embodiments, the resistance portion is provided with a liquid discharge port along its rotation direction.

[0026] The present invention also provides a substrate processing device, comprising any of the above-mentioned substrate carrying devices.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] 1. The following actions on the substrate can be achieved by driving the clamping assembly and the ejector assembly at the same time through the carrier plate assembly: the ejector assembly lifts the substrate while the clamping assembly releases the substrate; when the substrate drops to a preset height along with the ejector assembly, the clamping assembly automatically clamps the substrate. The lifting and clamping actions of the substrate are smoothly connected.

[0029] 2. The lifting and clamping of the substrate can share a set of driving mechanisms, which simplifies the structure in the prior art, saves a set of driving mechanisms, and makes the structure more compact and reasonable.

[0030] 3. The size of the clamping assembly can be adjusted to clamp substrates of different sizes; the lifting height of the substrate can also be changed by adjusting the size of the ejector assembly. This greatly improves the adaptability of the substrate carrying device to substrates, nozzles and protective covers of different specifications.

[0031] 4. In the embodiment where the lifting plate is located below the fixed plate, a plurality of first through holes are opened on the surface of the fixed plate, and the lifting plate drives the ejector assembly to pass through the first through holes to support the substrate, thereby solving the technical problem that the lifting plate is below the fixed plate and the lifting substrate is blocked by the fixed plate.

[0032] 5. In the embodiment where the lifting plate is located above the fixed plate, a plurality of second through holes are opened on the surface of the fixed plate, and the linear drive member drives the lifting plate to rise and fall through the second through holes, thereby solving the technical problem that the lifting plate is above the fixed plate and the driving is blocked by the fixed plate.

[0033] 6. In the embodiment where the lifting plate is located below the fixed plate, a plurality of third through holes are opened on the surface of the lifting plate, and the fixed push rod supports the fixed plate through the third through holes, thereby solving the technical problem that the lifting plate is located below the fixed plate and the fixed plate is blocked by the lifting plate.

[0034] 7. The clamping member can rebound and be hinged to the side of the fixed plate or the supporting plate. Under the action of the elastic member, the clamping member can automatically reset after the lifting plate moves away from the fixed plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The preferred implementation modes will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present invention.

[0036] Figure 1 This is the first embodiment of the substrate carrying device of the present invention in a lifted state;

[0037] Figure 2 yes Figure 1 Schematic diagram in clamped state;

[0038] Figure 3 yes Figure 1 A cross-sectional view of

[0039] Figure 4 yes Figure 2 A cross-sectional view of

[0040] Figure 5 yes Figure 1 A top view of

[0041] Figure 6 yes Figure 1 A schematic diagram of the structure of the middle clamping member;

[0042] Figure 7 This is the second embodiment of the substrate carrying device of the present invention in the lifted state;

[0043] Figure 8 yes Figure 7 Schematic diagram in clamped state;

[0044] Fig. 9 It is the third embodiment of the substrate carrying device of the present invention in the lifting state;

[0045] Fig.10 yes Fig. 9 Schematic diagram in clamped state;

[0046] Fig.11 yes Fig. 9 A cross-sectional view of

[0047] Fig.12 yes Fig.10 A cross-sectional view of

[0048] Fig.13 yes Fig. 9 A schematic diagram of the structure of the middle clamping member;

[0049] Fig.14It is the third embodiment of the substrate carrying device of the present invention in the lifting state;

[0050] Fig.15 yes Fig.14 Schematic diagram in clamped state;

[0051] Fig.16 This is the fourth embodiment of the substrate carrying device of the present invention in the lifted state;

[0052] Fig.17 yes Fig.16 Schematic diagram in clamped state;

[0053] Fig.18 yes Fig.16 A cross-sectional view of

[0054] Fig.19 yes Fig.17 sectional view of . DETAILED DESCRIPTION

[0055] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0056] In order to simplify the drawings, only the parts related to the invention are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0057] In this document, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] like Figures 1 to 19 As shown, a substrate carrying device 200 according to an embodiment of the present invention is disclosed. The device 200 includes a carrying plate assembly 220 , a clamping assembly 230 and a ejector pin assembly 240 .

[0059] Specifically, the clamping assembly 230 is installed on the peripheral side of the carrier plate assembly 220, and the ejector assembly 240 includes a plurality of ejectors 241, each of which is parallel to the axial direction of the carrier plate assembly 220. The carrier plate assembly 220 can simultaneously drive the clamping assembly 230 and the ejector assembly 240 to move in coordination, wherein the carrier plate assembly 220 drives the clamping assembly 230 to clamp or release the substrate 100, and the carrier plate assembly 220 drives the ejector assembly 240 to lift the substrate 100. The carrier plate assembly 220 can realize the driving of the clamping assembly 230 and the ejector assembly 240 through the relative translation of the fixed plate 221 and the lifting plate 222. However, without departing from the present design concept, other implementations that replace the fixed plate 221 and the lifting plate 222 with a similar driving method to realize the coordinated movement of the clamping assembly 230 and the ejector assembly 240 all fall within the protection scope of the present application.

[0060] In practical applications, the substrate carrier device 200 has a lifting state when the substrate 100 is taken and placed, and a clamping state when the substrate 100 is cleaned. In the lifting state, the carrier plate assembly 220 will drive the ejector assembly 240 to rise, and the ejector assembly 240 will drive the clamping assembly 230 to release the substrate 100 while lifting the substrate 100, until the carrier plate assembly 220 drives the ejector assembly 240 to continuously lift the substrate 100 to the first preset height. In the clamping state, the carrier plate assembly 220 will drive the ejector assembly 240 to descend, and when the substrate 100 is lowered to the second preset height along with the ejector assembly 240, the carrier plate assembly 220 drives the clamping assembly 230 to clamp the substrate 100, and the carrier plate assembly 220 continues to drive the ejector assembly 240 to descend to the third preset height. The third preset height is not higher than the second preset height, and the second preset height is lower than the first preset height.

[0061] It should be noted that the above preset heights represent the preset horizontal heights of the top of the substrate 100 or the ejector assembly 240. The first preset height refers to the preset height of the substrate 100 in the lifting state, that is, the horizontal height of the substrate 100 when the preset manipulator takes or places the substrate 100 from the substrate carrier 200; the second preset height refers to the preset height of the substrate 100 in the clamping state, that is, the horizontal height of the substrate 100 when the substrate 100 is cleaned; the third preset height refers to the height of the top of the ejector assembly 240 in the clamping state, that is, the horizontal height of the top of the ejector assembly 240 when the substrate 100 is cleaned.

[0062] Different from the prior art, the embodiment of the present invention simultaneously links the clamping assembly 230 and the ejector assembly 240 through the carrier plate assembly 220, so that the device 200 can complete the two actions of lifting and clamping the substrate 100 with only one set of driving devices, and the substrate 100 is released while rising, and is clamped when the substrate 100 is lowered into place. The substrate 100 moves smoothly during the whole process, which can reduce the damage to the substrate 100. In addition, the ejector assembly 240 can also support the substrate 100 in the clamping state, increase the force points of the substrate 100 in the clamping state, and reduce the deflection of the substrate 100 caused by the clamping of the substrate 100 by the clamping assembly 230. The ejector assembly 240 can not only reduce the deflection of the substrate 100 in the clamping state, but also lift the substrate 100 to a preset height in the lifting state, solving the technical problem that the cleaning chamber protective cover blocks the placement of the substrate 100, and facilitates the robot to place the substrate 100.

[0063] In each embodiment disclosed in the present invention, the carrier plate assembly 220 includes a fixed plate 221 and a lifting plate 222 . The lifting plate 222 is liftably disposed on one side of the fixed plate 221 in the vertical direction, such as above or below.

[0064] In addition, the ejector assembly 240 is fixed to the upper end surface of the lifting plate 222 and rises and falls with the lifting plate 222. The clamping assembly 230 can be hinged to the side of the lifting plate 222 and driven to rotate by the fixed plate 221, or it can be hinged to the side of the fixed plate 221 and driven to rotate by the lifting plate 222. Therefore, the working principle of the substrate supporting device 200 in the lifting state and the clamping state is as follows:

[0065] In the lifting state, the ejector assembly 240 will rise with the lifting plate 222, and at the same time, the ejector assembly 240 will lift the substrate 100 from the second preset height to the first preset height. When the substrate 100 reaches the second preset height and starts to continue to rise from the second preset height, the fixing plate 221 or the lifting plate 222 will drive the clamping assembly 230 to release the substrate 100 until the lifting plate 222 drives the ejector assembly 240 to lift the substrate 100 to the first preset height.

[0066] In the clamping state, the ejector assembly 240 will descend with the lifting plate 222. At the same time, the ejector assembly 240 will lower the substrate 100 from the first preset height to the second preset height. When the substrate 100 reaches the second preset height, the clamping assembly 230 completely clamps the substrate 100. At this time, the ejector assembly 240 can continue to descend with the lifting plate 222 or remain at the second preset height.

[0067] In the above working principle, the substrate carrier 200 carries the substrate 100 in both states. In the lifting state, the robot replaces the substrate lifted to the first preset height, and in the clamping state, the cleaning nozzle performs a cleaning operation on the substrate to be cleaned. In actual applications, the substrate carrier 200 can also operate according to the above working principle in the empty state, and the robot loads the substrate when the substrate carrier 200 is in the lifting state.

[0068] According to the relative position of the lifting plate 222 and the fixed plate 221 (the lifting plate 222 is located above the fixed plate 221 or the lifting plate 222 is located below the fixed plate 221), and the installation position of the clamping assembly 230 (the clamping assembly 230 is installed on the fixed plate 221 or the lifting plate 222), the substrate supporting device 200 has at least the following four implementation modes:

[0069] 1. The lifting plate 222 is located above the fixed plate 221, and the clamping assembly 230 is installed on the fixed plate 221;

[0070] 2. The lifting plate 222 is located above the fixed plate 221, and the clamping assembly 230 is installed on the lifting plate 222;

[0071] 3. The lifting plate 222 is located below the fixed plate 221, and the clamping assembly 230 is installed on the fixed plate 221;

[0072] 4. The lifting plate 222 is located below the fixed plate 221 , and the clamping assembly 230 is installed on the lifting plate 222 .

[0073] Furthermore, by improving the specific structure of the clamping assembly 230, the following fifth embodiment or other embodiments can also be derived from the third embodiment. The specific embodiments are as follows:

[0074] [Example 1]

[0075] like Figures 1 to 6 As shown in FIG. 1 , a preferred embodiment of the substrate carrying device 200 of the present application is shown. In this embodiment, the lifting plate 222 is located above the fixed plate 221, and the clamping assembly 230 is installed on the fixed plate 221. The substrate carrying device 200 also includes a base 210, a plurality of fixed top rods 223 and a linear drive member 224. Among them, the base 210 is located below the carrying plate assembly 220, the fixed top rods 223 are used to support the fixed plate 221 so that it is kept at a fixed height relative to the base 210, and the linear drive member 224 is used to drive the lifting plate 222 to rise and fall.

[0076] like Figure 1 and Figure 5 As shown, the clamping assembly 230 includes a plurality of clamping members 231, each of which is hinged to the peripheral side of the fixing plate 221. Figure 6As shown, the clamping member 231 includes a power portion 231a, a fulcrum portion 231b and a resistance portion 231c. The fulcrum portion 231b is provided with a hinge hole 231g. The power portion 231a and the resistance portion 231c are respectively fixedly connected to the fulcrum portion 231b to form an L-shaped structure.

[0077] Specifically, Figures 1 to 4 As shown, the fixing plate 221 is provided with fixing seats 227 having the same number as the clamping members 231, and each fixing seat 227 is provided with an opening adapted to the hinge hole 231g of the clamping member 231. The clamping member 231 is hingedly connected to the fixing seat 227 by installing a hinge shaft 221b, and a return torsion spring (not shown in the figure) is installed on the hinge shaft 221b. During the transition of the substrate carrying device 200 from the lifting state to the clamping state, the clamping member 231 is rotated inwardly by the pressure of the lifting plate 222 to clamp the substrate 100; during the transition of the substrate carrying device 200 from the clamping state to the lifting state, the clamping member 231 is rotated outwardly by the elastic force of the return torsion spring to release the substrate 100.

[0078] like Figure 3 , Figure 4 and Figure 6 As shown, the resistance portion 231c has a substrate clamping position 231d on the side facing the lifting plate 222, which is used to rotate inward from the outer peripheral side of the lifting plate 222 to clamp the substrate 100, and the resistance portion 231c is provided with a drain port 231f along its rotation direction, which is used to reduce the obstruction of the clamping member 231 to the cleaning liquid and prevent the cleaning liquid from being retained on the surface of the substrate 100.

[0079] The power part 231a is located on the side of the fulcrum part 231b close to the center of the fixed plate 221. The inner side surface of the power part 231a has a force surface 231e corresponding to the lower end surface of the lifting plate 222. When the lifting plate 222 descends, its lower end surface and the force surface 231e generate sliding friction and apply torque to the fulcrum part 231b to drive the resistance part 231c to rotate toward the lifting plate 222.

[0080] It should be noted that, since the structure of the clamping member 231 is similar to that of a lever structure, the different parts of the clamping member 231 can be named according to their actual functions by analogy with the components of the lever structure (fulcrum, power arm and resistance arm). Among them, the hinge between the clamping member 231 and the fixed plate 221 is equivalent to the fulcrum of the lever structure, so it is named as the fulcrum part 231b; the part of the clamping member 231 that is directly acted upon and driven to rotate by the lifting plate 222 is equivalent to the power arm of the lever structure, so it is named as the power part 231a; the part of the clamping member 231 that is used to clamp the substrate and is subjected to the reaction force of the substrate is equivalent to the resistance arm of the lever structure, so it is named as the resistance part 231c. The above naming method does not limit the specific structure of the clamping member 231, and according to actual needs, the power part 231a, the fulcrum part 231b and the resistance part 231c can be designed as an integrated structure or a detachable structure.

[0081] In addition, if Figure 1 and Figure 2 As shown, a notch 222 a matching with the resistance portion 231 c is provided on the circumference of the lifting plate 222 . In the clamping state, the resistance portion 231 c will be embedded in the notch 222 a along the radial direction of the lifting plate 222 to clamp the substrate 100 .

[0082] In practical applications, the bottom ends of the fixed top rod 223 and the linear drive member 224 are fixed to the surface of the base 210 at intervals, and the top end of the fixed top rod 223 is fixed to the lower end surface of the fixed plate 221. The fixed plate 221 is provided with one or more second through holes 221d, and the top end of the linear drive member 224 can slide through the second through holes 221d and be fixed to the lower end surface of the lifting plate 222. The linear drive member 224 can be a linear drive member such as a cylinder, an electric cylinder, an electromagnetic rod or a hydraulic cylinder, and a linear bearing can be installed in the second through hole 221d to prevent the linear drive member 224 from affecting the stability of the fixed plate 221.

[0083] Overall, if Figure 1 and Figure 3 , which is a schematic diagram of the substrate carrying device 200 of this embodiment in a lifting state, in which the fixed plate 221 is supported by the fixed ejector 223 and maintains a predetermined height, the linear drive member 224 lifts the lifting plate 222 vertically upward, and the ejector pin 241 installed on the surface of the lifting plate 222 rises with the lifting plate 222, and lifts the substrate 100 to a first preset height, so that the substrate 100 can be replaced by the robot. In the process of the substrate 100 rising to the first preset height, the clamping member 231 is completely separated from the edge of the substrate 100 under the action of the return spring.

[0084] like Figure 2 and Figure 4, is a schematic diagram of the substrate carrying device 200 of this embodiment in a clamping state. In this state, the fixed plate 221 is supported by the fixed ejector 223 and still maintains a predetermined height, and the linear drive member 224 drives the lifting plate 222 to move vertically downward, and the ejector pins 241 installed on the surface of the lifting plate 222 descend with the lifting plate 222, and the substrate 100 is lowered to a second preset height. During the descent of the lifting plate 222, the lower end surface of the lifting plate 222 simultaneously presses downward the force-bearing surface 231e of each clamping member 231, forcing the clamping member 231 to overcome the force of the reset spring and rotate, and when the substrate 100 descends to the second preset height, each clamping member 231 simultaneously clamps the edge of the substrate 100, so as to clean the substrate. At this time, if the ejector pin 241 has not separated from the substrate 100, the third preset height is equal to the second preset height, and the substrate 100 will be clamped by the clamping member 231 and supported by the ejector pin 241 at the same time; if the lifting plate 222 continues to descend, the substrate 100 will be separated from the support of the ejector pin 241 and only clamped by the clamping member 231, and the third preset height will be lower than the second preset height.

[0085] [Example 2]

[0086] like Figure 7 and Figure 8 , which is a preferred embodiment of the substrate carrying device 200 of the present application. In this embodiment, the lifting plate 222 is located above the fixed plate 221 , and the clamping assembly 230 is installed on the lifting plate 222 .

[0087] The clamping assembly 230 includes a plurality of clamping members 231, each of which is hinged to the side of the lifting plate 222. The specific structure of the clamping member 231 is similar to that of the first embodiment and will not be described in detail here. Different from the first embodiment, the resistance portion 231c of each clamping member 231 is located on the upper side of the lifting plate 222, the power portion 231a is located on the lower side of the lifting plate 222, and the fulcrum portion 231b is hinged in a fixed groove on the side of the lifting plate 222, and the hinge axis direction is consistent with the tangent direction of the lifting plate 222 at that location.

[0088] The power part 231a is against the outer peripheral side of the fixed plate 221, and the power part 231a has a force surface 231e corresponding to the edge of the fixed plate 221. During the descending process of the lifting plate 222, the edge of the fixed plate 221 and the force surface 231e have sliding friction and apply torque to the fulcrum part 231b to drive the resistance part 231c to rotate toward the lifting plate 222.

[0089] In practical applications, the substrate carrying device 200 further includes a plurality of fixed push rods 223 and linear drive members 224 . The fixed push rods 223 are used to fix the fixed plate 221 , and the linear drive members 224 are used to drive the lifting plate 222 to move up and down.

[0090] The bottom ends of the fixed top rod 223 and the linear drive member 224 are fixed to the surface of the base 210 at intervals, and the top end of the fixed top rod 223 is fixed to the lower end surface of the fixed plate 221. The fixed plate 221 is provided with one or more second through holes 221d, and the top end of the linear drive member 224 can slide through the second through holes 221d and be fixed to the lower end surface of the lifting plate 222. The linear drive member 224 can be a linear drive member such as a cylinder, an electric cylinder, an electromagnetic rod or a hydraulic cylinder, and a linear bearing can be installed in the second through hole 221d to prevent the linear drive member 224 from affecting the stability of the fixed plate 221.

[0091] Overall, if Figure 7 , which is a schematic diagram of the substrate carrying device 200 of this embodiment in a lifting state, in which the fixed plate 221 is supported by the fixed ejector 223 and maintains a predetermined height, the linear drive member 224 lifts the lifting plate 222 vertically upward, and the ejector pin 241 installed on the surface of the lifting plate 222 rises with the lifting plate 222 and lifts the substrate 100 to a first preset height. In the process of the substrate 100 rising to the first preset height, the clamping member 231 is completely separated from the edge of the substrate 100 under the action of the return spring.

[0092] like Figure 8 , is a schematic diagram of the substrate carrying device 200 of this embodiment in a clamping state. In this state, the fixed plate 221 is supported by the fixed ejector 223 to maintain a predetermined height, and the linear drive member 224 drives the lifting plate 222 to move vertically downward, and the ejector pins 241 installed on the surface of the lifting plate 222 descend with the lifting plate 222, and the substrate 100 is lowered to a second preset height. During the descent of the lifting plate 222, each clamping member 231 installed on the side of the lifting plate 222 also descends with the lifting plate 222, and the power part 231a of the clamping member 231 is supported by the upward support force of the edge of the fixed plate 221, forcing the clamping member 231 to rotate by overcoming the force of the reset spring, and when the substrate 10 descends to the second preset height, each clamping member 231 simultaneously clamps the edge of the substrate 100, so as to clean the substrate. In this embodiment, since the ejector pin 241 and the clamping member 231 are both installed on the lifting plate 222, the third preset height is always equal to the second preset height in the clamping state, that is, the ejector pin 241 will not separate from the substrate 100, and the substrate 100 will be clamped by the clamping member 231 and supported by the ejector pin 241 at the same time.

[0093] [Example 3]

[0094] like Figures 9 to 13 , which is a preferred embodiment of the substrate carrying device 200 of the present application, the lifting plate 222 is located below the fixed plate 221 , and the clamping assembly 230 is installed on the fixed plate 221 .

[0095] Different from the first and second embodiments, in this embodiment, since the lifting plate 222 is located below the fixed plate 221 and the substrate 100 needs to be clamped above the fixed plate 221, the ejector assembly 240 will be obstructed by the fixed plate 221. For this reason, in this embodiment, a plurality of first through holes 221c for passing the ejector assembly 240 are opened on the surface of the fixed plate 221.

[0096] The clamping assembly 230 includes a plurality of clamping members 231 , and each clamping member 231 is hinged to the edge of the fixing plate 221 . The specific structure of the clamping member 231 is similar to that of the first embodiment and will not be described again.

[0097] Specifically, Fig. 9 and Fig.10 As shown, the fixing plate 221 is provided with fixing seats 227 having the same number as the clamping members 231, each fixing seat 227 is provided with an opening adapted to the hinge hole 231g of the clamping member 231, and the clamping member 231 and the fixing seat 227 are hingedly connected by installing a hinge shaft 221b, and a return torsion spring (not shown in the figure) is installed on the hinge shaft 221b. Fig.12 As shown, during the transition of the substrate carrying device 200 from the lifting state to the clamping state, the clamping member 231 is rotated inwardly by the elastic force of the return torsion spring to clamp the substrate; Fig.11 As shown, during the transition of the substrate supporting device 200 from the clamping state to the lifting state, the clamping member 231 is rotated outwards by the pressure of the lifting plate 222 to release the substrate.

[0098] Among them, the power part 231a of the clamping member 231 is located between the fixed plate 221 and the lifting plate 222. The power part 231a has a force surface 231e corresponding to the upper end surface of the lifting plate 222. During the rising process of the lifting plate 222, the upper end surface of the lifting plate 222 has sliding friction with the force surface 231e and applies torque to the fulcrum part 231b, driving the resistance part 231c to rotate away from the lifting plate 222.

[0099] like Fig.11 and Fig.12 As shown, a fixing groove 221a matching the fulcrum portion 231b is provided on the circumference of the fixing plate 221, and a hinge shaft 221b tangentially aligned with the fixing plate 221 is installed in the fixing groove 221a for hingedly connecting the fulcrum portion 231b. The hinge shaft 221b is installed with a torsion spring 232 for turning the resistance portion 231c toward the outside of the fixing plate 221. Fig.13 As shown, the main difference between the clamping member 231 of this embodiment and the embodiment 1 lies in the position of the force-bearing surface 231e. The force-bearing surface 231e of the embodiment 1 is located on the inner side of the end of the power part 231a, while the force-bearing surface 231e of the embodiment 2 is located on the outer side of the end of the power part 231a.

[0100] Overall, if Fig. 9 and Fig.11 , which is a schematic diagram of the substrate carrying device 200 of this embodiment in a lifting state, in which the fixed plate 221 is supported by the fixed ejector 223 and maintains a predetermined height, the linear drive member 224 lifts the lifting plate 222 vertically upward, and the ejector pin 241 installed on the surface of the lifting plate 222 passes through the first through hole 221c and rises with the lifting plate 222, and lifts the substrate 100 to a first preset height. In the process of the substrate 100 rising to the first preset height, the power part 231a of each clamping member 231 installed on the peripheral side of the fixed plate 221 will be supported by the upper end surface of the lifting plate 222, forcing the clamping member 231 to overcome the force of the torsion spring 232 and rotate in a direction away from the substrate 100, and finally completely detach from the edge of the substrate 100.

[0101] like Fig.10 and Fig.12 , which is a schematic diagram of the substrate carrying device 200 of this embodiment in a clamping state. In this state, the fixed plate 221 is supported by the fixed ejector 223 and still maintains a predetermined height, while the linear drive member 224 drives the lifting plate 222 to move vertically downward, and the ejector pins 241 installed on the surface of the lifting plate 222 descend with the lifting plate 222, and lower the substrate 100 to a second preset height. During this period, the lifting plate 222 gradually reduces the supporting force of the power part 231a of each clamping member 231, and finally each clamping member 231 will clamp the edge of the substrate 100 under the action of the torsion spring 232, so as to clean the substrate. At this time, if the ejector pin 241 has not separated from the substrate 100, the third preset height is equal to the second preset height, and the substrate 100 will be clamped by the clamping member 231 and supported by the ejector pin 241 at the same time; if the lifting plate 222 continues to descend, the substrate 100 will be separated from the support of the ejector pin 241 and only clamped by the clamping member 231, and the third preset height will be lower than the second preset height.

[0102] [Example 4]

[0103] like Fig.14 and Fig.15 As shown, it is a preferred embodiment of the substrate carrying device 200 of the present application, the lifting plate 222 is located below the fixed plate 221, and the clamping assembly 230 is hinged to the lifting plate 222.

[0104] Similar to the third embodiment, the surface of the fixing plate 221 is provided with a plurality of first through holes 221c for passing the ejector assembly 240, and the clamping assembly 230 includes a plurality of clamping members 231. The difference from the third embodiment is that each clamping member 231 in this embodiment is hinged to the edge of the lifting plate 222 respectively.

[0105] Specifically, the fulcrum portion 231b of each clamping member 231 is hinged to the edge of the lifting plate 222, the hinge axis direction is consistent with the tangent direction of the lifting plate 222, the hinge axis is equipped with a reset spring (not shown in the figure), and the resistance portion 231c and the power portion 231a are both located above the lifting plate 222. The power portion 231a has a force-bearing surface 231e corresponding to the edge of the fixed plate 221 on the inner side, which is used for applying torque to the fulcrum portion 231b during the lifting process of the lifting plate 222, so as to drive the resistance portion 231c to rotate away from the lifting plate 222.

[0106] Overall, if Fig.14 , which is a schematic diagram of the substrate carrying device 200 of this embodiment in a lifting state, in which the fixed plate 221 is supported by the fixed ejector 223 and maintains a predetermined height, the linear drive member 224 lifts the lifting plate 222 vertically upward, and the ejector pin 241 installed on the surface of the lifting plate 222 passes through the first through hole 221c and rises with the lifting plate 222, and lifts the substrate 100 to a first preset height. In the process of the substrate 100 rising to the first preset height, the power part 231a of each clamping member 231 installed on the side of the lifting plate 222 is subjected to the pressure of the edge of the fixed plate 221, forcing the clamping member 231 to overcome the force of the torsion spring 232 and rotate in a direction away from the substrate 100, and finally completely detach from the edge of the substrate 100.

[0107] like Fig.15 , is a schematic diagram of the substrate carrying device 200 of this embodiment in a clamping state. In this state, the fixed plate 221 is supported by the fixed ejector 223 and still maintains a predetermined height, while the linear drive member 224 drives the lifting plate 222 to move vertically downward, and the ejector pins 241 installed on the surface of the lifting plate 222 descend along with the lifting plate 222, and the substrate 100 is lowered to the second preset height. During this period, the fixed plate 221 gradually reduces the pressure on the power part 231a of each clamping member 231, and finally each clamping member 231 clamps the edge of the substrate 100 under the action of the torsion spring 232, so as to clean the substrate. Similar to the second embodiment, in this embodiment, since the ejector pins 241 and the clamping member 231 are both installed on the lifting plate 222, the third preset height is always equal to the second preset height in the clamping state, that is, the ejector pins 241 will not be separated from the substrate 100, and the substrate 100 will be clamped by the clamping member 231 and supported by the ejector pins 241 at the same time.

[0108] [Example 5]

[0109] like Figures 16 to 19 , which is a preferred embodiment of the substrate carrying device 200 of the present application. This embodiment is similar to the third embodiment, in which the lifting plate 222 is located below the fixed plate 221, and the clamping assembly 230 is installed on the fixed plate 221. The difference lies in the specific structure and driving method of the clamping member 231.

[0110] In this embodiment, the clamping member 231 includes a power part 231a, a fulcrum part 231b and a resistance part 231c, and the power part 231a and the resistance part 231c are fixedly connected to the fulcrum part 231b respectively. The clamping member 231 is hinged to the peripheral side of the fixed plate 221 through the fulcrum part 231b, and the direction of the hinge axis is consistent with the tangent direction of the fixed plate 221 at that location. The resistance part 231c is located on the upper side of the lifting plate 222, and the power part 231a is located on the lower side of the lifting plate 222.

[0111] Specifically, the resistance portion 231c has a substrate clamping position 231d on one side close to the center of the fixed disk 221, and the substrate clamping position 231d is adapted to the edge of the substrate 100. The resistance portion 231c can rotate inward from the outer peripheral side of the fixed disk 221 to clamp the substrate 100 through the substrate clamping position 231d.

[0112] like Fig.18 and Fig.19 As shown, a strip hole 233 is provided on the side of the power part 231a. The strip hole 233 is bent inward as a whole and includes a rotating section 233b and a retaining section 233a along its length direction. There is a preset angle between the rotating section 233b and the retaining section 233a. A sliding shaft 234 adapted to the strip hole 233 is installed on the circumference of the lifting plate 222. The inner side of the strip hole 233 can be regarded as a force-bearing surface. During the lifting process of the lifting plate 222, the sliding shaft 234 can act on the inner side of the strip hole 233 to drive the clamping member 231 to rotate.

[0113] Different from other embodiments, in this embodiment, the interaction between the sliding shaft 234 and the strip hole 233 can make the clamping member 231 rotate toward the substrate or away from the substrate, so the clamping member 231 is no longer reset by a torsion spring.

[0114] Overall, if Fig.16 and Fig.18 , is a schematic diagram of the substrate carrying device 200 of this embodiment in a lifting state, in which the fixed plate 221 is supported by the fixed ejector 223 and maintains a predetermined height, the linear drive member 224 lifts the lifting plate 222 vertically upward, and the ejector pin 241 installed on the surface of the lifting plate 222 rises with the lifting plate 222, and lifts the substrate 100 to a first preset height. During this period, the relative position of the sliding shaft 234 in the strip hole 233 slides from the holding section 233a to the rotating section 233b, driving each clamping member 231 to rotate in a direction away from the substrate 100, and finally completely detaches from the edge of the substrate 100.

[0115] like Fig.17 and Fig.19, is a schematic diagram of the substrate carrying device 200 of this embodiment in a clamping state. In this state, the fixed plate 221 is supported by the fixed ejector 223 and still maintains a predetermined height, and the linear drive member 224 drives the lifting plate 222 to move vertically downward, and the ejector pin 241 installed on the surface of the lifting plate 222 descends with the lifting plate 222, and lowers the substrate 100 to a second preset height. During this period, the relative position of the sliding shaft 234 in the strip hole 233 slides from the rotating section 233b to the holding section 233a, driving each clamping member 231 to rotate toward the substrate 100 and clamp the edge of the substrate 100, so as to clean the substrate. At this time, if the ejector pin 241 has not separated from the substrate 100, the third preset height is equal to the second preset height, and the substrate 100 will be clamped by the clamping member 231 and supported by the ejector pin 241 at the same time; if the lifting plate 222 continues to descend and the clamping member 231 remains clamped, the substrate 100 will be separated from the support of the ejector pin 241 and only clamped by the clamping member 231, and the third preset height will be lower than the second preset height.

[0116] It should be noted that, if the substrate 100 is to be completely separated from the ejector pin 241 in the clamping state and only clamped by the clamping member 231, it is necessary to keep the angle of the clamping member 231 unchanged as the lifting plate 222 continues to descend. The premise for achieving the above state is that the sliding shaft 234 has slid to the retaining section 233a of the strip hole 233 in the clamping state, and the retaining section 233a is in a vertical state. At this time, when the sliding shaft 234 moves in the retaining section 233a, the clamping member 231 will not rotate.

[0117] [Example 6]

[0118] The present application also proposes a substrate processing device, which can be equipped with the substrate carrying device 200 described in any of the above embodiments, and the specific structure of the substrate carrying device 200 is not repeated here. In addition, the substrate processing device can be constructed as a substrate cleaning device or a substrate electroplating device according to actual use.

[0119] If the substrate processing device is configured as a substrate cleaning device, it should at least include a nozzle, a manipulator, and other devices for substrate cleaning known to those skilled in the art. The nozzle is used for the substrate carrier 200 to spray a cleaning liquid on the surface of the substrate 100 when the substrate carrier 200 is in a clamped state. The manipulator is used for the substrate carrier 200 to pick up and place the substrate 100 when the substrate carrier 200 is in a lifted state. In addition, the shape, size, and distribution position of the clamp 231 and the ejector pin 241 can also be adjusted according to the shape and size of the nozzle and the manipulator.

[0120] It should be noted that the above embodiments can be freely combined as needed. The above are only preferred embodiments of the present invention. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A substrate carrying device, It is characterized in that include: a carrier plate assembly; A clamping assembly, mounted on the peripheral side of the carrier plate assembly, and linked to the carrier plate assembly to clamp or release the substrate; The ejector assembly is mounted on the carrier plate assembly, and the ejector assembly is linked to the carrier plate assembly to lift the substrate; wherein, In the lifting state, the carrier plate assembly drives the ejector assembly to rise, and while the ejector assembly lifts the substrate, the carrier plate assembly drives the clamping assembly to release the substrate, and the ejector assembly continuously lifts the substrate to a first preset height; In the clamping state, the carrier plate assembly drives the ejector assembly to descend, and when the substrate descends to the second preset height along with the ejector assembly, the carrier plate assembly drives the clamping mechanism to clamp the substrate, and the ejector assembly descends to the third preset height; The first preset height is higher than the second preset height, and the second preset height is not lower than the third preset height.

2. The substrate carrying device according to claim 1, It is characterized in that The carrier plate assembly includes a fixed plate and a lifting plate, the lifting plate is arranged on one side of the fixed plate in a vertical direction and can be raised and lowered, the ejector assembly is fixed to the upper end surface of the lifting plate, and the fixed plate and the lifting plate are relatively translated to drive the clamping assembly; In the lifting state, the ejector assembly rises with the lifting plate to lift the substrate from the second preset height to the first preset height, and the clamping assembly releases the substrate when the substrate starts to rise from the second preset height; In the clamping state, the ejector assembly descends along with the lifting plate to lower the substrate from the first preset height to the second preset height, and the clamping assembly clamps the substrate when the substrate reaches the second preset height.

3. The substrate carrying device according to claim 2, It is characterized in that The lifting plate is located above the fixed plate; The clamping assembly includes a plurality of clamping members, each of which constitutes a lever structure having a power arm and a resistance arm and a fulcrum located at the peripheral side of the fixed plate; The lifting plate can act on the power arm of the clamping member to drive the resistance arm of each clamping member to rotate toward the lifting plate to clamp the substrate.

4. The substrate carrying device according to claim 3, It is characterized in that The clamping member includes a power part as the power arm, a fulcrum part and a resistance part as the resistance arm, and the power part and the resistance part are fixedly connected to the fulcrum part respectively; wherein, The fulcrum is connected to the fixed disk in a resilient hinged manner, and the hinge axis direction is consistent with the tangent direction of the fixed disk at that location; The resistance part is arranged on the upper side of the fixed plate and is located on the side of the fulcrum part away from the center of the fixed plate. The side of the resistance part facing the lifting plate has a substrate clamping position for rotating inward from the outer peripheral side of the lifting plate to clamp the substrate; The power part is arranged on the upper side of the fixed plate and is located on the side of the fulcrum part close to the center of the fixed plate. The power part has a force-bearing surface corresponding to the lower end surface of the lifting plate, which is used to apply torque to the fulcrum part during the descent of the lifting plate, thereby driving the resistance part to rotate toward the lifting plate.

5. The substrate carrying device according to claim 4, It is characterized in that A notch matched with the resistance part is provided on the circumferential side of the lifting plate. In the clamping state, the resistance part is embedded in the notch along the radial direction of the lifting plate to clamp the substrate.

6. The substrate carrying device according to claim 2, It is characterized in that The lifting plate is located above the fixed plate; The clamping assembly includes a plurality of clamping members, each of which constitutes a lever structure having a power arm and a resistance arm and a fulcrum located at the peripheral side of the lifting plate. The fixing plate can act on the power arm of the clamping member to drive the resistance arm of each clamping member to rotate inwardly to clamp the substrate.

7. The substrate carrying device according to claim 6, It is characterized in that The clamping member includes a power part as the power arm, a fulcrum part and a resistance part as the resistance arm, and the power part and the resistance part are fixedly connected to the fulcrum part respectively; wherein, The fulcrum is connected to the lifting plate in a resilient hinged manner, and the hinge axis direction is consistent with the tangent direction of the lifting plate at that location; The resistance part is arranged on the upper side of the lifting plate, and has a substrate clamping position on a side close to the lifting plate, the substrate clamping position is adapted to the edge of the substrate, and can be rotated inward from the outer peripheral side of the lifting plate to clamp the substrate; The power part is arranged on the lower side of the lifting plate and abuts against the outer peripheral side of the fixed plate. The power part has a force-bearing surface corresponding to the outer peripheral side of the fixed plate, and is used to apply torque to the fulcrum part during the descent of the lifting plate, thereby driving the resistance part to rotate toward the lifting plate.

8. The substrate carrying device according to claim 2, It is characterized in that The lifting plate is located below the fixed plate, and a plurality of first through holes for passing the ejector assembly are opened on the surface of the fixed plate; The clamping assembly includes a plurality of clamping members, each of which is a lever structure having a power arm and a resistance arm and a fulcrum located at a peripheral side of the fixed plate. The lifting plate can act on the power arm of the clamping member to drive the resistance arm of each clamping member to rotate toward the fixed plate to clamp the substrate.

9. The substrate carrying device according to claim 8, It is characterized in that The clamping member includes a power part as the power arm, a fulcrum part and a resistance part as the resistance arm, and the power part and the resistance part are fixedly connected to the fulcrum part respectively; wherein, The fulcrum is connected to the fixed disk in a resilient hinged manner, and the hinge axis direction is consistent with the tangent direction of the fixed disk at that location; The resistance part is arranged on the upper side of the fixed disk, and has a substrate clamping position on one side close to the center of the fixed disk, the substrate clamping position is adapted to the edge of the substrate, and can be rotated inward from the outer peripheral side of the fixed disk to clamp the substrate; The power part is arranged at the lower side of the fixed plate and has a force-bearing surface corresponding to the upper end surface of the lifting plate, and is used to apply torque to the fulcrum part when the lifting plate is rising, so as to drive the resistance part to rotate away from the lifting plate.

10. The substrate carrying device according to claim 9, It is characterized in that The fulcrum portion is hingedly connected to the fixed plate in a resilient manner; The power part is located between the fixed plate and the lifting plate, and the force-bearing surface is located on the side of the power part facing the lifting plate; When the lifting plate is in the process of ascending, the lifting plate presses the force-bearing part upward through the force-bearing surface to drive the resistance part to rotate toward the outside of the fixed plate; When the lifting plate is in the process of ascending downward, the force-bearing part is reset under the action of elastic force, and the resistance part rotates toward the inner side of the fixed plate.

11. The substrate carrying device according to claim 9, It is characterized in that A strip-shaped hole is provided on the side of the power unit; A sliding shaft adapted to the strip-shaped hole is installed on the circumference of the lifting plate, and the axial direction of the strip-shaped hole and the axial direction of the sliding shaft are respectively consistent with the direction of the hinge axis; The force-bearing surface is located on the inner side surface of the strip hole, so that during the lifting process of the lifting plate, the sliding shaft acts on the inner side surface of the strip hole to drive the clamping member to rotate.

12. The substrate carrying device according to claim 11, It is characterized in that The strip-shaped hole includes a rotating section and a retaining section along its length direction, and there is a preset angle between the rotating section and the retaining section, and the retaining section remains in a vertical state in the lifting state; wherein, During the descending process of the lifting plate, the sliding shaft slides from the rotating section to the holding section. When the substrate is located between the first preset height and the second preset height, the sliding shaft is located in the rotating section, and the clamping member rotates toward the inner side of the fixed plate to clamp the substrate. When the substrate descends to the second preset height, the sliding shaft enters the holding section to slide, and the clamping member maintains the clamping state. During the lifting plate's rising process, the sliding shaft slides from the retaining section to the rotating section. When the substrate starts to rise from the second preset height, the sliding shaft slides in the rotating section, and the clamping member rotates toward the outside of the fixed plate to release the substrate.

13. The substrate carrying device according to claim 2, It is characterized in that The lifting plate is located below the fixed plate, and a plurality of first through holes for passing the ejector assembly are opened on the surface of the fixed plate; The clamping assembly includes a plurality of clamping members, each of which constitutes a lever structure having a power arm and a resistance arm and a fulcrum located at the peripheral side of the lifting plate. The fixing plate can act on the power arms of the clamping members to drive the resistance arms of the clamping members to rotate away from the fixing plate to release the substrate.

14. The substrate carrying device according to claim 13, It is characterized in that The clamping member includes a power part, a fulcrum part and a resistance part, and the fulcrum part, the power part and the resistance part are fixedly connected in sequence; wherein, The fulcrum is connected to the lifting plate in a resilient hinged manner, and the hinge axis direction is consistent with the tangent direction of the lifting plate at that location; The resistance part is arranged on the upper side of the lifting plate and extends to the upper side of the fixed plate. The resistance part has a substrate clamping position on one side facing the center of the fixed plate. The substrate clamping position is adapted to the edge of the substrate and is used to rotate inward from the outer peripheral side of the lifting plate to clamp the substrate. The power part is arranged on the upper side of the lifting plate and is located between the fixed plate and the lifting plate. The power part has a force-bearing surface corresponding to the outer peripheral side of the fixed plate, which is used for applying torque to the fulcrum part during the lifting plate's ascent, thereby driving the resistance part to rotate away from the lifting plate.

15. A substrate carrying device according to any one of claims 3 to 7, It is characterized in that Also includes: A base, located below the carrier plate assembly; Several fixed push rods and linear drive parts; wherein, The bottom ends of the fixed mandrel and the linear drive member are fixed to the surface of the base at intervals, and the top end of the fixed mandrel is fixed to the lower end surface of the fixed plate; A plurality of second through holes are provided on the surface of the fixed plate, and the top end of the linear drive member can slide through the second through holes and be fixed to the lower end surface of the lifting plate.

16. A substrate carrying device according to any one of claims 8 to 14, It is characterized in that Also includes: A base, located below the carrier plate assembly; Several fixed push rods and linear drive parts; wherein, The bottom ends of the fixed push rod and the linear drive member are fixed to the surface of the base at intervals, and the top end of the linear drive member is fixed to the lower end surface of the lifting plate; A plurality of third through holes are provided on the surface of the lifting plate, and the top end of the fixed push rod can slide through the third through holes and be fixed to the lower end surface of the fixed plate.

17. The substrate carrying device according to any one of claims 3 to 14, It is characterized in that The resistance part is provided with a liquid discharge port along the rotation direction thereof.

18. A substrate processing device, It is characterized in that It comprises the substrate carrying device described in any one of claims 1-17.

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