Packaging structure and electronic equipment
By designing the angle of conductive leads in the package structure to generate expansion and bending deformation, the problem of mismatch in the thermal expansion coefficient between the silicon-based chip and the package substrate is solved, reducing thermal stress, and improving the reliability and process of the package structure Yield rate.
Patent Information
- Application Number
- CN202411194991.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-28
- Publication Date
- 2024-12-10
AI Technical Summary
The thermal expansion coefficient of the material between the silicon-based chip and the packaging substrate does not match, resulting in the occurrence of residual stress on the interface, affecting the packaging reliability and process yield.
The first portion of the conductive lead is designed to form an angle between the packaging substrate and the electronics, greater than 0 degrees and less than 90 degrees or 90 degrees to 180 degrees to generate expansion and bending deformation during the packaging process, reducing thermal stress.
It effectively reduces the thermal stress caused by material CTE mismatch, reduces the risk of position shift of electronic devices, and improves the reliability of the packaging structure.
Smart Images
Figure CN119108365A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of packaging technology, and in particular to a packaging structure and an electronic device. Background Art
[0002] In packaging structures, such as silicon-based chip packaging structures, due to the mismatch of material properties between the silicon-based chip, the cavity filling material layer and the packaging substrate, especially the mismatch of the coefficients of thermal expansion (CTE) between the silicon-based chip and the packaging substrate, the interface residual stress is the main cause of packaging stress. The existing packaging structure has poor packaging reliability, resulting in low process yield. Summary of the invention
[0003] The present application discloses a packaging structure and an electronic device to solve the problem of chip deviation caused by excessive thermal stress due to temperature rise in the packaging process.
[0004] In a first aspect, the present application discloses a packaging structure, the packaging structure comprising:
[0005] A packaging substrate, an electronic device, and a conductive lead for connecting the electronic device and the packaging substrate;
[0006] The electronic device comprises a pad, one end of the conductive lead is connected to the pad, and the other end of the conductive lead is connected to the packaging substrate;
[0007] The conductive lead includes a first part, which is located between the first side of the electronic device and the second side of the packaging substrate. The angle between the extension direction of the first part and the first direction is greater than 0 degrees and less than 90 degrees, or greater than 90 degrees and less than 180 degrees. The first direction includes the direction of the pad close to the first side pointing to the second side.
[0008] In an exemplary embodiment, the conductive lead further includes a second portion, the second portion is located between the pad and the first side, one end of the second portion is connected to the pad, and the other end of the second portion is connected to one end of the first portion;
[0009] Preferably, the second side is parallel to the first side.
[0010] In an exemplary embodiment, an extending direction of the first portion is consistent with an extending direction of the second portion.
[0011] In an exemplary embodiment, an extension direction of the first portion intersects with an extension direction of the second portion.
[0012] In an exemplary embodiment, the conductive leads include a plurality of leads, and first portions of at least a portion of the conductive leads are parallel to each other;
[0013] Preferably, at least some number of the second portions of the conductive leads are parallel to each other;
[0014] Preferably, the first parts corresponding to the same first side are at least partially parallel to each other;
[0015] Preferably, the second parts corresponding to the same first side are at least partially parallel to each other.
[0016] In an exemplary embodiment, the shape of the electronic device includes a rectangle, and the extension direction of the first portion and / or the extension direction of the second portion is parallel to or crosses the direction of the diagonal line of the electronic device;
[0017] Preferably, the extension direction of part of the first part and / or the extension direction of the second part is parallel to the direction of the diagonal line of the electronic device, and the extension direction of another part of the first part and / or the extension direction of the second part crosses the direction of the diagonal line of the electronic device;
[0018] Preferably, the extension direction of part of the first part and / or the extension direction of the second part is parallel to the direction of the diagonal of the electronic device, and the extension direction of another part of the first part and / or the extension direction of the second part is perpendicular to the direction of the diagonal of the electronic device.
[0019] In an exemplary embodiment, an angle between an extension direction of the second portion and the first direction is greater than 0 degrees and less than 90 degrees, or greater than 90 degrees and less than 180 degrees.
[0020] In an exemplary embodiment, the package substrate includes an opening, and the electronic device is disposed in the opening of the package substrate.
[0021] In an exemplary embodiment, the electronic device includes a chip.
[0022] In a second aspect, the present application discloses an electronic device, wherein the electronic device comprises the packaging structure as described in the first aspect.
[0023] In the packaging structure and electronic device provided by the present application, the packaging structure includes: a packaging substrate, an electronic device and a conductive lead for connecting the electronic device and the packaging substrate; the electronic device includes a pad, one end of the conductive lead is connected to the pad, and the other end of the conductive lead is connected to the packaging substrate; the conductive lead includes a first part, the first part is located between the first side of the electronic device and the second side of the packaging substrate, the angle between the extension direction of the first part and the first direction is greater than 0 degrees and less than 90 degrees, or greater than 90 degrees and less than 180 degrees, and the first direction includes the direction in which the pad close to the first side points to the second side. In the packaging structure of the present application, the angle of the first part of the conductive lead is greater than 0 degrees and less than 90 degrees, or greater than 90 degrees and less than 180 degrees, so that the expansion and bending deformation of the first part of the conductive lead during the packaging process occur simultaneously, so as to reduce the thermal stress caused by the mismatch of the CTE (Coefficient of Thermal Expansion) of the material, thereby reducing the risk of position displacement of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.
[0025] Figure 1 A schematic diagram of a packaging structure provided for related technology.
[0026] Figure 2 for Figure 1 A is an enlarged view of the middle image.
[0027] Figure 3 for Figure 2 Enlarged view of B.
[0028] Figure 4 A schematic diagram of a packaging structure exemplarily shown in an embodiment of the present application.
[0029] Figure 5 The present invention is a partial schematic diagram of a conductive lead connecting an electronic device and a packaging substrate in a packaging structure exemplarily shown in an embodiment of the present application.
[0030] Figure 6 The present invention is a schematic diagram of the structure of a conductive lead in a packaging structure exemplarily shown in an embodiment of the present application.
[0031] Figure 7 The present invention is a schematic diagram of a structure in which a conductive lead in a packaging structure is subjected to thermal stress, exemplarily shown in an embodiment of the present application.
[0032] Figure 8The present invention is a schematic diagram of the structure of conductive leads in another packaging structure exemplarily shown in an embodiment of the present application.
[0033] Fig. 9 The present invention is a schematic diagram of the structure of conductive leads in another packaging structure exemplarily shown in an embodiment of the present application.
[0034] Fig.10 A schematic diagram of another packaging structure exemplarily shown in an embodiment of the present application.
[0035] Fig.11 The schematic diagram of the layout of conductive leads of another packaging structure exemplarily shows an embodiment of the present application.
[0036] Fig.12 The schematic diagram of the layout of conductive leads of another packaging structure exemplarily shows an embodiment of the present application.
[0037] Fig.13 The schematic diagram of the layout of conductive leads of another packaging structure exemplarily shows an embodiment of the present application.
[0038] Fig.14 A schematic diagram of a packaging structure exemplarily shown in an embodiment of the present application. DETAILED DESCRIPTION
[0039] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0040] In related technologies, such as Figure 1 and Figure 2As shown, the silicon-based chip 10 is arranged in the cavity of the packaging substrate 20, and a filling material 40 is filled between the side walls of the silicon-based chip 10 and the packaging substrate 20. The silicon-based chip 10 and the packaging substrate 20 are bridged by a rewiring layer RDL, and the rewiring layer RDL extends in a horizontal direction X from one side of the silicon-based chip 10 to one side of the packaging substrate 20. The extension direction of the rewiring layer RDL between the silicon-based chip 10 and the packaging substrate 20 is parallel to the horizontal direction X, that is, the angle between the extension direction of the rewiring layer RDL and the horizontal direction X is 0°. When the packaging process temperature increases, due to the difference in CTE (Coefficient thermal expansion) between the silicon-based chip 10, the filling material 40 and the packaging substrate 20, such as CTE of silicon = 3.9 ppm / K, CTE of the filling material 40 = 14 ppm / K, and CTE of the packaging substrate 20 = 14 ppm / K, the thermal stress caused will cause the deformation of the rewiring layer RDL, thereby causing the displacement of the silicon-based chip 10. Currently, a material with a low CTE may be selected as the filling material 40 to reduce the thermal stress on the redistribution layer RDL.
[0041] like Figure 3 As shown, according to Hooke's law, the deformation amount of the redistribution layer RDL caused by thermal stress is as follows:
[0042]
[0043] Among them, F0 is the tensile force applied to the rewiring layer RDL, E is the Young's modulus of the material of the rewiring layer RDL, t is the thickness of the rewiring layer RDL, and W is the width of the rewiring layer RDL. The deformation ΔL1 of the rewiring layer RDL is mainly caused by the CTE difference between the package carrier 20, the filling material 40 and the silicon-based chip 10. The use of a low CTE filling material 40 can reduce the thermal stress on the rewiring layer RDL to a certain extent, but the thermal stress caused by the thermal expansion of the package carrier 20 still affects the rewiring layer RDL, and the silicon-based chip 10 still faces the offset problem caused by the material CTE mismatch.
[0044] As an optional implementation of the content disclosed in this application, the embodiment of this application discloses a packaging structure, such as Figure 4 As shown, Figure 4 A packaging structure disclosed in an embodiment of the present application, such as Figure 5 As shown, Figure 4 This is a partial structural diagram of a packaging structure disclosed in an embodiment of the present application, the packaging structure includes:
[0045] The packaging substrate 100, in some embodiments, is provided with at least one opening 110, and the opening 110 is used to accommodate the electronic device 200 to be packaged. The packaging structure may include one or more electronic devices 200. Figure 4 As shown, an opening 110 in the packaging substrate 100 is exemplarily shown. The opening 110 can be a rectangular structure. The size of the opening 110 can be slightly larger than the outer size of the electronic device 200, so that the electronic device 200 can be placed in the opening 110. A filling material 400 is filled between the electronic device 200 and the packaging substrate 100 to fill the gap between the electronic device 200 and the packaging substrate 100. The electronic device 200 is, for example, a silicon-based chip, a MEMS sensor, a radio frequency passive device, a microfluidic, etc., which is not specifically limited here. It can be understood that in some embodiments, the opening 110 may not be provided in the packaging substrate 100, and the electronic device 200 may also be directly provided on the surface of the packaging substrate 100, which is not limited in the present application.
[0046] Combination Figure 4 and Figure 5 As shown, the package structure further includes a conductive lead 300, which is used to connect the electronic device 200 and the package substrate 100. The conductive lead 300 is, for example, a rewiring layer. Figure 5 As shown, at least one pad 120 is disposed on the surface of the electronic device 200 , one end of the conductive lead 300 is connected to the pad 120 , and the other end of the conductive lead 300 extends to the packaging substrate 100 to connect an electrical signal to the outside.
[0047] refer to Figure 6As shown, the conductive lead 300 may include a first portion 310. In some embodiments, the conductive lead 300 may further include a second portion 320, the second portion 320 is located between the pad 120 and the first side 210, one end of the second portion 320 is connected to the pad 120, and the other end of the second portion 320 is connected to one end of the first portion 310. The first portion 310 is, for example, a portion of the conductive lead 300 located between the first side 210 of the electronic device 200 and the second side 130 of the package substrate 100 (or the first portion 310 is located between the first side 210 of the electronic device 200 and the second side 130 of the package substrate 100), and the second portion 320 is, for example, a portion connected to the pad 120 and extending to the first side 210 of the electronic device 200 adjacent to the pad 120. Optionally, the second side is parallel to the first side. The first side 210 of the electronic device 200 is, for example, a side of the electronic device 200 adjacent to the pad 120, and the second side 130 of the package substrate 100 is, for example, a side parallel to the extension direction of the first side 210 and adjacent to the first side 210. For ease of expression, the direction from the pad 120 close to the first side 210 to the second side 130 is recorded as the first direction X1, and the direction from the pad 120 horizontally pointing to the first side 210 of the electronic device 200 is recorded as the second direction X2. The first portion 310 of the conductive lead 300 intersects with the first direction X1 to form a first angle θ, the value of which is greater than 0 degrees and less than 90 degrees, or greater than 90 degrees and less than 180 degrees (or the first portion 310 is neither parallel to the first direction X1 nor perpendicular to the first direction X1), so that the first portion 310 of the conductive lead 300 is tilted relative to the horizontal direction with respect to the first side 210 of the electronic device 200 and the second side 130 of the packaging substrate 100, so that the expansion and bending deformation of the first portion 310 of the conductive lead 300 during the packaging process occur simultaneously, so as to reduce the thermal stress caused by the CTE mismatch of the material, thereby reducing the risk of positional displacement of the electronic device 200. Similarly, in one embodiment, the second portion 320 can be similarly configured to the first portion 310, that is, the angle between the extension direction of the second portion 320 and the first direction X1 is greater than 0 degrees and less than 90 degrees, or greater than 90 degrees and less than 180 degrees. In this way, the expansion and bending deformation of the second portion 320 of the conductive lead 300 during the packaging process can occur simultaneously, so as to reduce the thermal stress caused by the CTE mismatch of the materials, thereby reducing the risk of positional displacement of the electronic device 200 .
[0048] Specifically, refer to Figure 6 and Figure 7 As shown, as the packaging process increases steadily, the conductive lead 300 and the packaging substrate 100 will expand due to the high temperature. Figure 7 The dotted line positions shown, exemplarily, the first dotted line D is the position of the conductive lead 300 after expansion, and the second dotted line F is the position of the package substrate 100 after expansion. The conductive lead 300 expands so that the distance L between the electronic device 200 and the package substrate 100 increases, and the horizontal pulling force (horizontal direction) F1 caused by this is decomposed into two forces, namely the first component force F2 and the second component force F3, and the angle between the first part 310 and the first direction X1 is recorded as θ.
[0049] refer to Figure 6 and Figure 7 , where the first force component F2 = F1*cosθ and the second force component F3 = F1*sinθ. Since the first force component F2 extends along the conductive lead 300, and the second force component F3 is perpendicular to the extension direction of the conductive lead 300, the second force component F3 causes the conductive lead 300 to bend. Therefore, the first deformation Δl of the conductive lead 300 along the extension direction can be expressed by the following formula:
[0050]
[0051] Wherein, E is the Young's modulus of the material of the conductive lead 300, t is the thickness of the conductive lead 300, W is the width of the conductive lead 300, and L is the distance between the electronic device 200 and the packaging substrate 100. Therefore, the second deformation ΔL2 of the conductive lead 300 in the first direction X1 (horizontal direction) can be expressed by the following formula:
[0052]
[0053] Then the sliding displacement δ generated by the second force component F3 can be expressed as follows:
[0054]
[0055] Where l+Δl≈l is approximated, and the additional extension length ΔL3 of the conductive lead 300 in the first direction X1 (horizontal direction) due to the expansion can be expressed as:
[0056]
[0057] Compared with related technologies, Figure 3 and Figure 6 , under the same parameters and when the expansion in the horizontal direction is consistent, that is, ΔL1=ΔL2+ΔL3, it can be expressed as:
[0058]
[0059] The above formula can be rearranged into make but If L=W=100μm,θ=45°, then
[0060] It can be seen that since the first part 310 of the conductive lead 300 in the present application forms an angle with the first direction X1, the thermal stress caused by the CTE mismatch of the material can be significantly reduced compared with the prior art. Since the thermal stress is reduced, the push or pull effect of the conductive lead on the electronic device is reduced, thereby reducing the risk of position displacement of the electronic device.
[0061] In actual application, the angle formed between the first portion 310 of the conductive lead 300 and the first direction X1 can be set according to actual conditions, that is, the first angle can be an obtuse angle or an acute angle.
[0062] like Figure 6 As shown, a pad 120 is provided on the surface of the electronic device 200, and a schematic diagram of the connection between the conductive lead 300 and the pad 120 is exemplarily shown, one end of the conductive lead 300 is connected to the pad 120, and the portion of the conductive lead 300 extending to the first side 210 in the connection direction between the conductive lead 300 and the pad 120, that is, the conductive lead 300 is the second portion 320, and the first portion 310 and the second portion 320 are connected to each other. Among them, the second portion 320 intersects with the second direction X2 to form a second angle θ1, which can make the second angle θ1 the same as the first angle θ, and the first portion 310 and the second portion 320 are connected to form a straight line. In this embodiment, the extension direction of the first part 310 is the same as the extension direction of the second part 320, so that the connection between the conductive lead 300 and the pad 120 can be extended to the second side 130 of the packaging substrate 100, so that the entire conductive lead 300 forms an angle with the first direction X1 to reduce the thermal stress caused by the CTE mismatch of the material, thereby reducing the risk of position displacement of the electronic device 200.
[0063] In other exemplary embodiments, Figure 8 As shown, the second portion 320 of the conductive lead 300 may also be arranged parallel to the second direction X2, that is, there is no angle between the second portion 320 of the conductive lead 300 and the second direction X2. In this embodiment, the extension direction of the first portion 310 and the extension direction of the second portion 320 are not in a straight line, which can shorten the length of the second portion 320. The first portion 310 of the conductive lead 300 can be used to form an angle with the first direction X1 to reduce the thermal stress caused by the CTE mismatch of the material, thereby reducing the risk of positional displacement of the electronic device 200.
[0064] In other exemplary embodiments, Figure 8 and Fig. 9As shown, the second portion 320 of the conductive lead 300 may also form a second angle θ1 with the second direction X2, which is different from the first angle θ. In this embodiment, the extension direction of the first portion 310 and the extension direction of the second portion 320 are arranged to intersect, and the first portion 310 of the conductive lead 300 may form an angle with the first direction X1 to reduce thermal stress caused by material CTE mismatch.
[0065] As an optional implementation of the content disclosed in this application, the embodiment of this application discloses a packaging structure, such as Fig.10 As shown, Fig.10 A packaging structure disclosed in an embodiment of the present application is a packaging structure, and the packaging structure in this embodiment is basically the same as the packaging structure in the above-mentioned embodiment, except that the conductive lead 300 in this packaging structure includes a plurality of leads, and each conductive lead 300 includes a first part 310 and a second part 320 connected to each other. Exemplarily, the first part 310 and the second part 320 are connected to form a straight line. Among them, a plurality of pads 120 are provided on the surface of the electronic device 200, and the plurality of pads 120 are connected to the plurality of conductive leads 300 in a one-to-one correspondence. In this embodiment, the first parts 310 of at least a portion of the conductive leads 300 can be made to have the same angle as the first direction X1 (or the first parts 310 of at least a portion of the conductive leads 300 are parallel to each other). Optionally, still referring to Fig.10 In some embodiments, at least a portion of the second portions of the conductive leads are parallel to each other.
[0066] refer to Fig.10 As shown, in this embodiment, a plurality of conductive leads 300 are arranged between the electronic device 200 and the packaging substrate 100, and each conductive lead 300 is connected to the pad 120 on the electronic device 200. Exemplarily, for example, the first angle θ formed by the first portion 310 of each electrical lead 300 and the first direction X1 is the same. Exemplarily, the first portions 310 of the plurality of conductive leads 300 on the first side 210 of the electronic device 200 extend in the same direction and form an angle with the first direction X1. Since the first portions 310 of the plurality of conductive leads 300 form the same angle with the first direction X1, the inclination direction of the orthographic projection of the plurality of conductive leads 300 in the direction perpendicular to the surface of the electronic device 200 remains consistent, so that the plurality of conductive leads 300 expand and deform in the same direction to reduce the thermal stress caused by the CTE mismatch of the material, thereby reducing the risk of positional displacement of the electronic device 200.
[0067] As an optional implementation of the content disclosed in this application, the embodiment of this application discloses a packaging structure, such as Fig.11 As shown, Fig.11A packaging structure is disclosed in an embodiment of the present application. In this embodiment, considering the overall force balance effect of the electronic device, the extension direction of the first part 310 of the multiple conductive leads 300 on the same side of the electronic device 200 can be designed according to the situation.
[0068] refer to Fig.11 As shown, the first portions 310 of the plurality of conductive leads 300 on the same side of the electronic device 200 all extend in the same direction (or in other words, the first portions corresponding to the same first side are at least partially parallel to each other). Fig.11 As shown, the multiple conductive leads 300 on each side of the electronic chip have the same inclination direction of the orthographic projection in the third direction perpendicular to the surface of the electronic device 200, so that the expansion and deformation of the multiple conductive leads 300 around the electronic device 200 between the electronic device 200 and the packaging substrate 100 remain consistent, thereby preventing the position of the electronic device 200 from shifting in multiple directions and keeping the position of the electronic device 200 unchanged. Fig.11 Optionally, in some embodiments, the second parts corresponding to the same first side are at least partially parallel to each other.
[0069] In other exemplary embodiments, the inclination directions of the orthographic projections of the plurality of conductive leads 300 in the third direction perpendicular to the surface of the electronic device may also be different. Fig.12 As shown, the first parts 310 of the plurality of conductive leads 300 on the same side of the electronic device 200 all extend in the same direction, the first parts 310 of the plurality of conductive leads 300 on two adjacent sides of the electronic device 200 all extend in different directions, the inclination direction of the orthographic projections of the first parts 310 of the plurality of conductive leads 300 on the same side of the electronic device 200 in the third direction perpendicular to the surface of the electronic device 200 is consistent, and the inclination direction of the orthographic projections of the first parts 310 of the plurality of conductive leads 300 on two adjacent sides of the electronic device 200 in the third direction perpendicular to the surface of the electronic device 200 is inconsistent. The inclination direction of the orthographic projections of the first parts 310 of the plurality of conductive leads 300 on two opposite sides of the electronic device 200 in the third direction perpendicular to the surface of the electronic device 200 may also be consistent or inconsistent.
[0070] In an alternative embodiment, referring to Fig.11 and Fig.12 The shape of the electronic device 200 includes a rectangle, and the extension direction of the first portion 310 and / or the extension direction of the second portion 320 is parallel to the diagonal line of the electronic device (such as Fig.11Such an arrangement allows the expansion and deformation of the plurality of conductive leads 300 around the electronic device 200 to remain consistent between the electronic device 200 and the packaging substrate 100, thereby preventing the position of the electronic device 200 from shifting in multiple directions and keeping the position of the electronic device 200 unchanged.
[0071] Optionally, in order to adapt to different packaging requirements, in one embodiment, part of the extension direction of the first part 310 and / or the extension direction of the second part 320 is parallel to the direction of the diagonal of the electronic device 200, and part of the extension direction of the first part 310 and / or the extension direction of the second part 320 crosses the direction of the diagonal of the electronic device 200; in this way, the packaging requirements in different scenarios are met while preventing the position of the electronic device 200 from shifting and keeping the position of the electronic device 200 unchanged.
[0072] In another embodiment, the extension direction of some of the first parts and / or the extension direction of the second parts is parallel to the direction of the diagonal of the electronic device, and the extension direction of other parts of the first parts and / or the extension direction of the second parts is perpendicular to the direction of the diagonal of the electronic device. Accordingly, in this embodiment, on the basis of preventing the position of the electronic device 200 from shifting and keeping the position of the electronic device 200 unchanged, the packaging requirements in different scenarios are met.
[0073] refer to Fig.13 As shown, the multiple conductive leads 300 on the same side of the electronic device 200 may also extend in different directions, that is, the angles formed by the intersection of a part of the conductive leads 300 on the same side with the first direction X1 are different, and the inclination direction of the positive projection of the multiple conductive leads 300 on the two opposite sides of the electronic device 200 on the same side of the electronic device in the third direction perpendicular to the surface of the electronic device 200 can be kept consistent.
[0074] As an optional implementation of the content disclosed in this application, the embodiment of this application discloses a packaging structure, such as Fig.14 As shown, Fig.14A packaging structure is disclosed in an embodiment of the present application. The packaging structure in this embodiment is basically the same as the packaging structure in the above embodiment, and the difference is that the conductive lead 300 in the packaging structure includes multiple leads, each conductive lead 300 includes a first part 310 and a second part 320 connected to each other, and the extension direction of the first part 310 and the extension direction of the second part 320 intersect, wherein the angle between the second part 320 of at least a part of the conductive leads 300 and the second direction is 0, and the first part 310 of at least a part of the conductive leads 300 intersects with the first direction X1 to form an angle.
[0075] refer to Fig.14 As shown, mainly due to the CTE mismatch between the electronic device 200, the filling material and the packaging substrate 100, the position of the electronic device 200 may be offset. Therefore, only the first part 310 of the conductive lead 300 between the electronic device 200 and the packaging substrate 100 can be formed at an angle with the first direction X1, so as to use the conductive lead 300 of this part to reduce the thermal stress caused by the CTE mismatch of the material. Therefore, in this embodiment, the second part 320 of the conductive lead 300 can be arranged parallel to the second direction X2 to shorten the length of the conductive lead 300, save material costs, and at the same time reduce the thermal stress caused by the CTE mismatch of the material and the risk of position offset of the electronic device 200.
[0076] As an optional implementation of the contents disclosed in the present application, an embodiment of the present application discloses a sealed electronic device, which includes a packaging structure provided by any of the above embodiments, wherein the first part of the conductive lead in the packaging structure intersects with the first direction to form an angle, so that the first part of the conductive lead and the first side of the electronic device and the second side of the packaging substrate are tilted in a relative horizontal direction, so that the expansion and bending deformation of the first part of the conductive lead during the packaging process occur simultaneously, so as to reduce the thermal stress caused by the CTE mismatch of the material, thereby reducing the risk of position displacement of the electronic device.
[0077] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0078] The above embodiments only express several implementation methods of this specification, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of this specification, which all belong to the protection scope of this specification. Therefore, the protection scope of the patent of this specification shall be based on the attached claims.
Claims
1. A packaging structure, characterized in that: The packaging structure comprises: A packaging substrate, an electronic device, and a conductive lead for connecting the electronic device and the packaging substrate; The electronic device comprises a pad, one end of the conductive lead is connected to the pad, and the other end of the conductive lead is connected to the packaging substrate; The conductive lead includes a first part, which is located between the first side of the electronic device and the second side of the packaging substrate. The angle between the extension direction of the first part and the first direction is greater than 0 degrees and less than 90 degrees, or greater than 90 degrees and less than 180 degrees. The first direction includes the direction of the pad close to the first side pointing to the second side.
2. The packaging structure according to claim 1, characterized in that: The conductive lead further includes a second portion, the second portion is located between the pad and the first side, one end of the second portion is connected to the pad, and the other end of the second portion is connected to one end of the first portion; Preferably, the second side is parallel to the first side.
3. The packaging structure according to claim 2, characterized in that: An extending direction of the first portion is consistent with an extending direction of the second portion.
4. The packaging structure according to claim 2, characterized in that: An extending direction of the first portion intersects with an extending direction of the second portion.
5. The packaging structure according to claim 2, characterized in that: The conductive leads include a plurality of leads, and first portions of at least a portion of the conductive leads are parallel to each other; Preferably, at least some number of the second portions of the conductive leads are parallel to each other; Preferably, the first parts corresponding to the same first side are at least partially parallel to each other; Preferably, the second parts corresponding to the same first side are at least partially parallel to each other.
6. The packaging structure according to claim 2, characterized in that: The shape of the electronic device includes a rectangle, and the extension direction of the first part and / or the extension direction of the second part is parallel to or crosses the direction of the diagonal line of the electronic device; Preferably, the extension direction of part of the first part and / or the extension direction of the second part is parallel to the direction of the diagonal line of the electronic device, and the extension direction of another part of the first part and / or the extension direction of the second part crosses the direction of the diagonal line of the electronic device; Preferably, the extension direction of part of the first part and / or the extension direction of the second part is parallel to the direction of the diagonal of the electronic device, and the extension direction of another part of the first part and / or the extension direction of the second part is perpendicular to the direction of the diagonal of the electronic device.
7. The packaging structure according to claim 2, characterized in that: An included angle between an extending direction of the second portion and the first direction is greater than 0 degrees and less than 90 degrees, or greater than 90 degrees and less than 180 degrees.
8. The packaging structure according to any one of claims 1 to 7, characterized in that: The packaging substrate includes an opening, and the electronic device is arranged in the opening of the packaging substrate.
9. The packaging structure according to any one of claims 1 to 7, characterized in that: The electronic device includes a chip.
10. An electronic device, characterized in that: The electronic device comprises the packaging structure according to any one of claims 1 to 9.