Package structure and manufacturing method thereof

Abstract

The embodiment of the invention provides a packaging structure and a manufacturing method thereof. The package structure includes: a substrate; the chip is arranged on one side of the substrate, and the surface, far away from the substrate, of the chip is provided with a photosensitive area; the convex structure is arranged on the surface, far away from the substrate, of the chip and surrounds the photosensitive area; the plastic package structure is arranged on one side of the substrate and surrounds the chip; the light-transmitting cover plate is arranged on one side, far away from the substrate, of the chip, a cavity is formed among the light-transmitting cover plate, the plastic package structure and the chip, and the photosensitive area is exposed out of the cavity.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the field of semiconductor technology, and more particularly to a packaging structure and a method for manufacturing the same. Background Art

[0002] With the rapid development of semiconductor packaging technology, the size of packaging structures is getting smaller and smaller, and the integration of packaging structures is getting higher and higher. At present, adhesives can be used to realize the packaging of transparent cover plates. On the one hand, the adhesive is easy to overflow upward to the surface of the transparent cover plate away from the photosensitive area of ​​the chip, affecting the light transmittance of the transparent cover plate; on the other hand, the adhesive is easy to flow downward to the surface of the photosensitive area of ​​the chip, affecting the performance of the chip.

[0003] Therefore, there is an urgent need to provide a packaging structure and a manufacturing method thereof. Summary of the invention

[0004] In view of this, an embodiment of the present disclosure provides a packaging structure and a manufacturing method thereof.

[0005] To achieve the above objectives, the technical solution of the present disclosure is implemented as follows:

[0006] In a first aspect, an embodiment of the present disclosure provides a packaging structure, comprising: a substrate; a chip disposed on one side of the substrate, wherein a surface of the chip away from the substrate has a photosensitive area; a raised structure disposed on the surface of the chip away from the substrate and surrounding the photosensitive area; a plastic sealing structure disposed on one side of the substrate and surrounding the chip; and a light-transmitting cover plate disposed on a side of the chip away from the substrate, a cavity being formed between the light-transmitting cover plate, the plastic sealing structure and the chip, and the cavity exposing the photosensitive area.

[0007] In some embodiments, the orthographic projection of the cavity on the substrate is located within the orthographic projection range of the light-transmitting cover on the substrate.

[0008] In some embodiments, the light-transmitting cover plate and the chip form two oppositely disposed surfaces of the cavity, and the plastic encapsulation structure forms a side wall of the cavity; the orthographic projection of the protruding structure on the substrate is within the orthographic projection range of the cavity on the substrate.

[0009] In some embodiments, a first distance exists between the surface of the protruding structure away from the chip and the transparent cover plate, and a second distance exists between the outer sidewall of the protruding structure and the plastic packaging structure.

[0010] In some embodiments, the packaging structure further includes: a colloid layer disposed between the light-transmitting cover plate and the plastic packaging structure.

[0011] In some embodiments, the surface of the light-transmitting cover plate away from the substrate is substantially flush with the surface of the molding structure away from the substrate; or, the surface of the light-transmitting cover plate away from the substrate protrudes from the surface of the molding structure away from the substrate.

[0012] In some embodiments, the light-transmitting cover plate and the chip form two oppositely disposed surfaces of the cavity, and the protruding structure forms a side wall of the cavity; an inner contour of an orthographic projection of the protruding structure on the substrate coincides with an outer contour of an orthographic projection of the cavity on the substrate.

[0013] In some embodiments, the surface of the protruding structure away from the chip is in contact with the light-transmitting cover plate, and the outer sidewall of the protruding structure is in contact with the plastic packaging structure.

[0014] In some embodiments, the surface of the light-transmitting cover plate away from the substrate is substantially flush with the surface of the molding structure away from the substrate; or, the surface of the light-transmitting cover plate away from the substrate is recessed from the surface of the molding structure away from the substrate.

[0015] In a second aspect, an embodiment of the present disclosure provides a method for manufacturing a packaging structure, the method comprising: providing a substrate; arranging a chip on one side of the substrate, the surface of the chip away from the substrate having a photosensitive area, and the surface of the chip away from the substrate is also provided with a raised structure surrounding the photosensitive area; forming a plastic encapsulation structure and a light-transmitting cover plate on one side of the substrate, the plastic encapsulation structure surrounding the chip, and forming a cavity between the light-transmitting cover plate, the plastic encapsulation structure and the chip, the cavity exposing the photosensitive area.

[0016] In some embodiments, the plastic encapsulation structure and the light-transmitting cover plate are formed on one side of the substrate, including: forming the plastic encapsulation structure on one side of the substrate, the plastic encapsulation structure being provided with a first groove and a second groove that are interconnected, the second groove being located between the first groove and the chip, the photosensitive area and the protruding structure being exposed at the bottom of the second groove, and the dimension of the first groove along a direction parallel to the substrate being larger than the dimension of the second groove along a direction parallel to the substrate; providing the light-transmitting cover plate, the connecting layer and the protective layer arranged in a stack, the connecting layer being used to connect the light-transmitting cover plate and the protective layer; arranging the light-transmitting cover plate in the first groove, the light-transmitting cover plate and the plastic encapsulation structure being fixedly connected by a colloid layer; the light-transmitting cover plate covers the second groove to form the cavity; removing the connecting layer and the protective layer to expose the light-transmitting cover plate.

[0017] In some embodiments, a thickness of the light-transmitting cover plate along a direction perpendicular to the substrate is greater than or equal to a depth of the first groove along a direction perpendicular to the substrate.

[0018] In some embodiments, the plastic encapsulation structure and the light-transmitting cover plate are formed on one side of the substrate, including: setting the light-transmitting cover plate on the side of the protruding structure away from the chip; forming a connecting layer and a protective layer on the side of the light-transmitting cover plate away from the protruding structure, the connecting layer being used to connect the light-transmitting cover plate and the protective layer; forming the plastic encapsulation structure on one side of the substrate, the plastic encapsulation structure surrounding the protruding structure and the light-transmitting cover plate; removing the connecting layer and the protective layer to expose the light-transmitting cover plate.

[0019] In some embodiments, the surface of the light-transmitting cover plate away from the substrate is substantially flush with the surface of the molding structure away from the substrate; or, the surface of the light-transmitting cover plate away from the substrate is recessed from the surface of the molding structure away from the substrate.

[0020] In some embodiments, the orthographic projection of the photosensitive area on the substrate is located within the orthographic projection range of the protective layer on the substrate.

[0021] The disclosed embodiment provides a packaging structure and a manufacturing method thereof. In the disclosed embodiment, the surface of the chip away from the substrate has a photosensitive area and the surface of the chip away from the substrate is provided with a raised structure surrounding the photosensitive area; on the one hand, in the process of using an adhesive to fix the transparent cover plate and the packaging structure, even if the adhesive flows downward, it will be isolated outside the chip photosensitive area by the raised structure, thereby avoiding contamination of the chip photosensitive area, thereby avoiding affecting the performance of the chip; on the other hand, the transparent cover plate can also be directly set on the side of the raised structure away from the substrate, and then the plastic sealing structure is used for plastic sealing, thereby avoiding the use of adhesive to fix the transparent cover plate and the plastic sealing structure, thereby avoiding the adhesive from contaminating the chip photosensitive area. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of a process for manufacturing a packaging structure provided by an embodiment of the present disclosure;

[0023] FIG. 2A to FIG. 2D A cross-sectional view of a packaging structure provided by an embodiment during the manufacturing process;

[0024] Figure 3A and Figure 3B is a cross-sectional view showing the relative positional relationship between the light-transmitting cover plate and the protective layer in one embodiment;

[0025] Figure 4 is a cross-sectional view showing the relative positional relationship between the light-transmitting cover plate and the plastic packaging structure in one embodiment;

[0026] FIG. 5A to FIG. 5F A cross-sectional view of a packaging structure provided by another embodiment during the manufacturing process;

[0027] Fig. 6A and Figure 6B is a cross-sectional view showing the relative positional relationship between the light-transmitting cover plate and the protective layer in another embodiment;

[0028] Figure 7 is a cross-sectional view showing the relative positional relationship between the light-transmitting cover plate and the plastic packaging structure in another embodiment;

[0029] The figure includes: 200, 200a, packaging structure; 202, substrate; 204, optical chip; 206, sensor chip; 208, photosensitive area; 210, protrusion structure; 212, plastic packaging structure; 214, first groove; 216, second groove; 218, 218a, light-transmitting cover plate; 220, 220a, 220b, connecting layer; 222, 222a, 222b, protective layer ; 224, cavity; 226, colloid layer; 300, 300a, packaging structure; 302, substrate; 304, optical chip; 306, sensor chip; 308, photosensitive area; 310, protruding structure; 312, 312a, plastic sealing structure; 318, transparent cover; 320, 320a, 320b, connecting layer; 322, 322a, 322b, protective layer; 324, cavity. DETAILED DESCRIPTION

[0030] The following will be combined with the embodiments of the present disclosure and the accompanying drawings to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0031] In the following description, a large number of specific details are given to provide a more thorough understanding of the present disclosure. However, it is obvious to those skilled in the art that the present disclosure can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present disclosure, some technical features known in the art are not described; that is, all features of actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0032] In the drawings, the sizes of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like reference numerals denote like elements throughout.

[0033] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present disclosure, the first element, component, region, layer or part discussed below can be represented as the second element, component, region, layer or part. And when the second element, component, region, layer or part is discussed, it does not indicate that the present disclosure necessarily has the first element, component, region, layer or part.

[0034] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used here for convenience of description to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, the spatial relationship terms are intended to also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, then the elements or features described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0035] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be a limitation of the present disclosure. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0036] In order to thoroughly understand the present disclosure, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present disclosure. The preferred embodiments of the present disclosure are described in detail below, but in addition to these detailed descriptions, the present disclosure may also have other implementations.

[0037] refer to Figure 1 , Figure 1 A schematic flow chart of a method for manufacturing a packaging structure provided in an embodiment of the present disclosure.

[0038] like Figure 1 As shown, an embodiment of the present disclosure provides a method for manufacturing a packaging structure, the method comprising:

[0039] Step S101: providing a substrate.

[0040] Step S102: a chip is arranged on one side of the substrate, wherein a surface of the chip away from the substrate has a photosensitive region, and a protruding structure surrounding the photosensitive region is also arranged on the surface of the chip away from the substrate.

[0041] Step S103: forming a plastic encapsulation structure and a light-transmitting cover plate on one side of the substrate, wherein the plastic encapsulation structure surrounds the chip, and a cavity is formed between the light-transmitting cover plate, the plastic encapsulation structure and the chip, wherein the cavity exposes the photosensitive area.

[0042] In the embodiments of the present disclosure, the formation of the plastic encapsulation structure and the light-transmitting cover plate on one side of the substrate may have different process sequences. In some embodiments, the plastic encapsulation structure may be formed first, and then the light-transmitting cover plate and the plastic encapsulation structure may be fixedly connected using an adhesive to obtain a packaging structure. In other embodiments, the light-transmitting cover plate may be placed on the protruding structure first, and then the plastic encapsulation structure may be formed, and the packaging structure may be obtained without using an adhesive to form a colloid layer.

[0043] refer to FIG. 2A to FIG. 2D , FIG. 2A to FIG. 2D This is a cross-sectional view of a packaging structure provided by an embodiment during the manufacturing process. FIG. 2A to FIG. 2D , a process of first forming a plastic sealing structure and then fixing and connecting the light-transmitting cover plate and the plastic sealing structure with an adhesive to obtain a packaging structure is described in detail.

[0044] like Figure 2A As shown, in step S101 , a substrate 202 is provided.

[0045] Here, the substrate 202 may be a metal substrate, a metal-based copper-clad plate made of a metal sheet, an insulating dielectric layer, and copper foil or aluminum foil, used to connect the upper chip and the lower circuit board to achieve the function of electrically connecting the chip and the external circuit. The substrate 202 has a first surface and a second surface that are arranged opposite to each other along its thickness direction, the first surface may also be called a top surface, and the second surface may also be called a bottom surface.

[0046] Before introducing the embodiments of the present disclosure, various directions that may be involved in the following are defined. An arbitrary direction in the plane where the substrate is located is defined as the X direction, and the thickness direction of the substrate is defined as the Z direction. In this way, the X direction is parallel to the substrate, and the Z direction is perpendicular to the substrate.

[0047] In the disclosed embodiment, in step S102, a chip is arranged on one side of the substrate, and a surface of the chip away from the substrate has a photosensitive area, and a surface of the chip away from the substrate is also provided with a protruding structure surrounding the photosensitive area.

[0048] like Figure 2A As shown, a chip is disposed on the top surface of the substrate 202 , and the chip and the substrate 202 are electrically connected.

[0049] In some embodiments, the chip may include an optical chip 204 and a sensor chip 206 that are stacked, and the optical chip 204 and the sensor chip 206 both include a bottom surface and a top surface that are arranged opposite to each other along the Z direction, wherein the bottom surfaces of the optical chip 204 and the sensor chip 206 are both close to the substrate 202, and the top surfaces of the optical chip 204 and the sensor chip 206 are both far away from the substrate 202, the optical chip 204 is arranged on the top surface of the substrate 202, and the sensor chip 206 is arranged on the top surface of the optical chip 204, that is, the optical chip 204 is located between the substrate 202 and the sensor chip 206. The optical chip 204 and the sensor chip 206 are both electrically connected to the substrate 202, and the optical chip 204 and the sensor chip 206 are electrically connected.

[0050] Still Figure 2A As shown, the surface of the sensor chip 206 away from the substrate 202 (ie, the top surface) has a photosensitive region 208 , and a protruding structure 210 surrounding the photosensitive region 208 is disposed on the top surface of the sensor chip 206 .

[0051] Here, the photosensitive area 208 is used to receive external light, and may also be referred to as a light receiving area. If the photosensitive area 208 is contaminated, the light signal received by the sensor chip 206 may be inaccurate, thereby affecting the performance of the sensor chip 206.

[0052] In some embodiments, the top surface of the sensor chip 206 may be directly processed to form the protruding structure 210. In other embodiments, an annular protruding structure 210 may be manufactured and fixedly connected to the top surface of the sensor chip 206. The present disclosure has no particular limitation on the manner in which the protruding structure 210 is disposed on the top surface of the sensor chip 206.

[0053] In some embodiments, after the protrusion structure 210 is disposed on the sensor chip 206, the sensor chip 206 provided with the protrusion structure 210 is disposed on the substrate 202. In other embodiments, after the sensor chip 206 is disposed on the substrate 202, the protrusion structure 210 is disposed on the sensor chip 206. The present disclosure has no particular limitation on the process sequence of disposing the sensor chip 206 on the substrate 202 and disposing the protrusion structure 210 on the sensor chip 206.

[0054] Here, the protruding structure 210 has a bottom surface close to the sensor chip 206 and a top surface far from the sensor chip 206, as well as an inner sidewall close to the photosensitive region 208 and an outer sidewall far from the photosensitive region 208; wherein the top surface and the bottom surface of the protruding structure 210 are arranged opposite to each other along the Z direction, and the inner sidewall and the outer sidewall of the protruding structure 210 are arranged opposite to each other along the X direction. The top surface of the protruding structure 210 protrudes from the top surface of the sensor chip 206, or the top surface of the protruding structure 210 is higher than the top surface of the sensor chip 206.

[0055] In some embodiments, the outer contour (or inner contour) of the orthographic projection (or vertical projection) of the protrusion structure 210 on the sensor chip 206 can be circular, elliptical, triangular, square or other shapes. The present disclosure has no special limitation on the shape of the outer contour (or inner contour) of the orthographic projection of the protrusion structure 210 on the sensor chip 206, as long as the protrusion structure 210 surrounds the photosensitive area 208.

[0056] In some embodiments, the orthographic projection shape of the protrusion structure 210 on the XZ plane can be a rectangle, a trapezoid or other shapes. The present disclosure has no special limitation on the orthographic projection shape of the protrusion structure 210 on the XZ plane, as long as the top surface of the protrusion structure 210 protrudes above the top surface of the sensor chip 206.

[0057] like Figure 2B As shown, in some embodiments, step S103 includes: forming a plastic package structure 212 on one side of the substrate 202 (i.e., on the top surface of the substrate 202), wherein the plastic package structure 212 is provided with a first groove 214 and a second groove 216 (such as Figure 2B The second groove 216 is located between the first groove 214 and the sensor chip 206, and the photosensitive area 208 and the protruding structure 210 are exposed at the bottom of the second groove 216. The dimension of the first groove 214 along a direction parallel to the substrate 202 (e.g., the X direction) is greater than the dimension of the second groove 216 along a direction parallel to the substrate 202 (e.g., the X direction).

[0058] Here, the shielding mold can be placed on the sensor chip 206. After the shielding mold covers the photosensitive area 208 and the protruding structure 210, the molding material covers the substrate 202 and the top surface of the sensor chip 206 not shielded by the shielding mold to form a molding structure 212.

[0059] Here, the plastic encapsulation structure 212 has a bottom surface close to the substrate 202 and a top surface away from the substrate 202. The top surface of the plastic encapsulation structure 212 is formed with a first groove 214 and a second groove 216 located between the first groove 214 and the sensor chip 206, facing the photosensitive area 208 and the protruding structure 210; wherein the first groove 214 and the second groove 216 are connected to each other, and the size of the first groove 214 along the X direction is greater than the size of the second groove 216 along the X direction. In this way, a step structure can be formed between the side wall of the first groove 214, the bottom edge of the first groove 214 and the side wall of the second groove 216.

[0060] Here, the size of the second groove 216 along the X direction is greater than the size of the protruding structure 210 along the X direction, and the size of the second groove 216 along the Z direction is greater than the size of the protruding structure 210 along the Z direction. The bottom of the second groove 216 exposes the photosensitive area 208 of the sensor chip 206 and the protruding structure 210 disposed on the top surface of the sensor chip 206.

[0061] In some embodiments, the molding material may be based on epoxy resin, with curing agent, coupling agent, etc. The present disclosure does not specifically limit the type of molding material, and the materials used for molding in the related technical solutions can be used to form the molding structure 212 in the embodiments of the present disclosure.

[0062] like Figure 2C As shown, in some embodiments, step S103 further includes: providing a stacked transparent cover plate 218 , a connecting layer 220 , and a protective layer 222 , wherein the connecting layer 220 is used to connect the transparent cover plate 218 and the protective layer 222 .

[0063] Here, the light-transmitting cover plate 218 may have a bottom surface and a top surface that are arranged opposite to each other in the Z direction, and a side wall that connects the bottom surface and the top surface. A protective layer 222 is formed on the top surface of the light-transmitting cover plate 218, and the top surface of the light-transmitting cover plate 218 and the protective layer 222 are fixedly connected by a connecting layer 220. The present disclosure does not specifically limit the connection method between the top surface of the light-transmitting cover plate 218 and the protective layer 222, for example, it can be connected by bonding or using an adhesive.

[0064] Here, the light-transmitting cover plate 218 may include a glass cover plate or other light-transmitting cover plates, which can provide mechanical protection for the light-sensing area 208 without affecting the light-sensing area 208 receiving external light. External light can be incident on the light-transmitting cover plate 218 and reach the light-sensing area 208 of the sensor chip 206 through the light-transmitting cover plate 218. Ensuring the light transmittance of the light-transmitting cover plate 218 can ensure the amount of light reaching the light-sensing area 208 of the sensor chip 206. If the top surface of the light-transmitting cover plate 218 is contaminated, the light signal received by the sensor chip 206 may be inaccurate, thereby affecting the performance of the sensor chip 206.

[0065] Still Figure 2C As shown, in some embodiments, step S103 also includes: coating the side wall and a portion of the bottom surface of the light-transmitting cover plate 218 with adhesive, disposing the light-transmitting cover plate 218 in the first groove 214, and fixing the side wall, a portion of the bottom surface and the plastic packaging structure 212 with a colloid layer 226 formed by the adhesive; the light-transmitting cover plate 218 covers the second groove 216 to form a cavity 224.

[0066] In the embodiment of the present disclosure, the adhesive used to form the colloid layer 226 can be applied to the sidewalls and part of the bottom surface of the transparent cover plate 218. On the one hand, the adhesive may flow downward along the sidewalls of the second groove 216 to the top surface of the sensor chip 206; since the top surface of the sensor chip 206 is provided with a protruding structure 210 surrounding the photosensitive area 208, even if the adhesive flows downward to the top surface of the sensor chip 206, it will be isolated outside the photosensitive area 208 by the protruding structure 210, thereby avoiding contamination of the photosensitive area 208, and further avoiding affecting the performance of the sensor chip 206. On the other hand, the adhesive may overflow upward; since the top surface of the transparent cover plate 218 is provided with a protective layer 222, even if the adhesive overflows upward, it will not pollute the top surface of the transparent cover plate 218, thereby avoiding affecting the transmittance of the transparent cover plate 218, and further avoiding affecting the performance of the sensor chip 206. In addition, the protection layer 222 covers at least a portion of the top surface of the transparent cover plate 218 , which can prevent the top surface of the transparent cover plate 218 from being contaminated during the process of manufacturing the packaging structure.

[0067] In some embodiments, the transparent cover plate 218 and the protective layer 222 have the same size along the X direction, that is, the protective layer 222 can completely cover the top surface of the transparent cover plate 218 . Figure 2C It is shown that the side wall of the light-transmissive cover plate 218 and the side wall of the protection layer 222 are aligned.

[0068] In some embodiments, the orthographic projection of the photosensitive region 208 on the substrate 202 is within the orthographic projection range of the protective layer 222 on the substrate 202, that is, the size of the photosensitive region 208 along the X direction is smaller than the size of the protective layer 222 along the X direction. Here, the protective layer 222 can at least protect the portion of the light-transmitting cover plate 218 facing the photosensitive region 208, so as to prevent the adhesive used to form the colloid layer 226 from contaminating the top surface of the light-transmitting cover plate 218, thereby preventing the light transmittance of the light-transmitting cover plate 218 from being affected.

[0069] like Figure 3A As shown, a connection layer 220a and a protective layer 222a are provided on the top surface of the transparent cover plate 218; wherein the dimension of the transparent cover plate 218 along the X direction is larger than the dimension of the protective layer 222a along the X direction, that is, the protective layer 222a cannot completely cover the top surface of the transparent cover plate 218.

[0070] like Figure 3B As shown, a connecting layer 220b and a protective layer 222b are provided on the top surface of the transparent cover plate 218; wherein the dimension of the transparent cover plate 218 along the X direction is smaller than the dimension of the protective layer 222b along the X direction, that is, the protective layer 222b can completely cover the top surface of the transparent cover plate 218.

[0071] Figure 2C , Figure 3A and Figure 3B The three relative position relationships between the light-transmitting cover plate and the protective layer are illustrated respectively. Figure 2C It is shown that the transparent cover plate 218 and the protective layer 222 have the same size along the X direction. Figure 3A It is shown that the dimension of the light-transmitting cover plate 218 along the X direction is greater than the dimension of the protective layer 222a along the X direction. Figure 3B It is shown that the dimension of the transparent cover plate 218 along the X direction is smaller than the dimension of the protective layer 222b along the X direction. Of course, no matter how the relative position relationship between the transparent cover plate and the protective layer changes, the dimension of the protective layer along the X direction is always larger than the dimension of the photosensitive area along the X direction.

[0072] Here, the dimension of the light-transmitting cover plate 218 along the X direction may be substantially the same as the dimension of the first groove 214 along the X direction, or slightly smaller than the dimension of the first groove 214 along the X direction. In this way, the light-transmitting cover plate 218 may be embedded in the first groove 214 .

[0073] like Figure 2D As shown, the protective layer 222 and the connecting layer 220 are removed to expose the top surface of the transparent cover plate 218. Here, if the transparent cover plate 218 and the protective layer 222 are connected by bonding, the protective layer 222 and the connecting layer 220 can be removed by debonding to expose the top surface of the transparent cover plate 218.

[0074] The transparent cover plate 218 and the plastic packaging structure can be connected by adhesive to form a colloid layer 226; the transparent cover plate 218 and the protective layer 222 can also be connected by adhesive to form a connecting layer 220. It should be noted that the adhesive forming the colloid layer 226 is different from the adhesive forming the connecting layer 220. The adhesive forming the connecting layer 220 is a material that is easy to remove, and after removing this part of the adhesive, the light transmittance of the transparent cover plate 218 will not be affected, and thus the performance of the sensor chip 206 will not be affected.

[0075] In some embodiments, the thickness of the light-transmissive cover plate 218 along the Z direction may be greater than or equal to the depth of the first groove 214 along the Z direction.

[0076] In some embodiments, the surface of the transparent cover plate 218 away from the substrate 202 (ie, the top surface of the transparent cover plate 218 ) and the surface of the molding structure 212 away from the substrate 202 (ie, the top surface of the molding structure 212 ) are substantially flush. Figure 2D It is shown that the top surface of the transparent cover plate 218 is substantially flush with the top surface of the molded structure 212. Substantially flush means that the top surface of the transparent cover plate 218 is flush with the top surface of the molded structure 212, or the height difference between the top surface of the transparent cover plate 218 and the top surface of the molded structure 212 meets the process error range requirement.

[0077] In some other embodiments, the surface of the transparent cover plate 218 away from the substrate 202 (ie, the top surface of the transparent cover plate 218 ) protrudes beyond the surface of the molding structure 212 away from the substrate 202 (ie, the top surface of the molding structure 212 ).

[0078] like Figure 4 As shown, in the packaging structure 200a, the top surface of the transparent cover plate 218a protrudes from the top surface of the plastic packaging structure 212, that is, the top surface of the transparent cover plate 218a is higher than the top surface of the plastic packaging structure 212. In this way, it is possible to further prevent the adhesive used to form the colloid layer 226 from overflowing upward and contaminating the top surface of the transparent cover plate 218, thereby preventing the light transmittance of the transparent cover plate 218a from being affected, and further preventing the performance of the sensor chip 206 from being affected.

[0079] like Figure 2DAs shown, an embodiment of the present disclosure provides a packaging structure 200, which includes: a substrate 202; a chip (for example, a sensor chip 206) disposed on one side of the substrate 202, wherein the surface of the sensor chip 206 away from the substrate 202 has a photosensitive area 208; a protruding structure 210 disposed on the surface of the sensor chip 206 away from the substrate 202 and surrounding the photosensitive area 208; a plastic encapsulation structure 212 disposed on one side of the substrate 202 and surrounding the sensor chip 206; a light-transmitting cover plate 218 disposed on the side of the sensor chip 206 away from the substrate 202, wherein a cavity 224 is formed between the light-transmitting cover plate 218, the plastic encapsulation structure 212 and the sensor chip 206, and the cavity 224 exposes the photosensitive area 208 and the protruding structure 210.

[0080] In some embodiments, the orthographic projection of the cavity 224 on the substrate 202 is within the orthographic projection range of the transparent cover plate 218 on the substrate 202. Here, the dimension of the cavity 224 along the X direction is smaller than the dimension of the transparent cover plate 218 along the X direction.

[0081] In some embodiments, the transparent cover plate 218 and the chip (e.g., the sensor chip 206) form two surfaces of the cavity 224 that are opposite to each other, and the plastic encapsulation structure 212 forms the sidewalls of the cavity 224; the orthographic projection of the protruding structure 210 on the substrate 202 is located within the orthographic projection range of the cavity 224 on the substrate 202. Here, the bottom surface of the transparent cover plate 218 can form the top surface of the cavity 224, the top surface of the sensor chip 206 can form the bottom surface of the cavity 224, the plastic encapsulation structure 212 can form the sidewalls of the cavity 224, and the transparent cover plate 218, the sensor chip 206 and the plastic encapsulation structure 212 can surround and form the cavity 224.

[0082] In some embodiments, a first distance exists between the surface of the protruding structure 210 away from the chip (eg, the sensor chip 206 ) and the transparent cover plate 218 , and a second distance exists between the outer wall of the protruding structure 210 and the molding structure 212 .

[0083] In some embodiments, the packaging structure 200 further includes: a colloid layer 226 disposed between the light-transmitting cover plate 218 and the plastic encapsulation structure 212. Here, the colloid layer 226 is disposed between the side wall of the light-transmitting cover plate 218 and the plastic encapsulation structure 212, and the colloid layer 226 is also disposed between a portion of the bottom surface of the light-transmitting cover plate 218 and the plastic encapsulation structure 212, so as to achieve a fixed connection between the light-transmitting cover plate 218 and the plastic encapsulation structure 212.

[0084] refer to FIG. 5A to FIG. 5F , FIG. 5A to FIG. 5F A cross-sectional view of a packaging structure provided in another embodiment during the manufacturing process. FIG. 5A to FIG. 5F, a process of first placing a transparent cover plate on the raised structure and then forming a plastic sealing structure is described in detail, and the packaging structure can be obtained without using an adhesive to form a colloid layer.

[0085] like Figure 5A As shown, in step S101 , a substrate 302 is provided.

[0086] In the disclosed embodiment, in step S102, a chip is arranged on one side of the substrate, and a surface of the chip away from the substrate has a photosensitive area, and a surface of the chip away from the substrate is also provided with a protruding structure surrounding the photosensitive area.

[0087] like Figure 5A As shown, an optical chip 304 and a sensor chip 306 are arranged on the top surface of the substrate 302, and the optical chip 304 is located between the substrate 302 and the sensor chip 306; wherein, the top surface of the sensor chip 306 has a photosensitive area 308, and a protruding structure 310 surrounding the photosensitive area 308 is also arranged on the top surface of the sensor chip 306.

[0088] Here, the description of the substrate 302, the optical chip 304, the sensor chip 306, the photosensitive area 308 and the protrusion structure 310 can be referred to. Figure 2A , I will not go into details here.

[0089] like Figure 5B As shown, in some embodiments, step S103 includes: disposing a light-transmitting cover plate 318 on a side of the protruding structure 310 away from the sensor chip 306 .

[0090] Here, the transparent cover plate 318 may have a bottom surface and a top surface that are arranged opposite to each other along the Z direction, and a side wall connecting the bottom surface and the top surface. The bottom surface of the transparent cover plate 318 contacts the top surface of the protruding structure 310, so that there is still a gap between the bottom surface of the transparent cover plate 318 and the top surface of the sensor chip 306 to form a cavity 324. More specifically, a cavity 324 is formed between the transparent cover plate 318, the protruding structure 310 and the top surface of the sensor chip 306, and the cavity 324 exposes the photosensitive area 308.

[0091] Here, the dimension of the transparent cover plate 318 along the X direction is greater than the dimension of the protrusion structure 310 along the X direction. The transparent cover plate 318 may include a glass cover plate or other transparent cover plates, which can provide mechanical protection for the photosensitive area 308 while not affecting the photosensitive area 308 receiving external light.

[0092] like Figure 5CAs shown, in some embodiments, step S103 further includes: forming a connection layer 320 and a protective layer 322 on the side of the transparent cover plate 318 away from the protruding structure 310, and the connection layer 320 is used to connect the transparent cover plate 318 and the protective layer 322. Here, the protective layer 322 is formed on the top surface of the transparent cover plate 318, and the top surface of the transparent cover plate 318 and the protective layer 322 are fixedly connected by the connection layer 320. The present disclosure has no special limitation on the connection method between the top surface of the transparent cover plate 318 and the protective layer 322, for example, it can be connected by bonding or using an adhesive.

[0093] like Figure 5D As shown, in some embodiments, step S103 further includes: forming a plastic encapsulation structure 312 on one side of the substrate 302 , wherein the plastic encapsulation structure 312 surrounds the protruding structure 310 and the transparent cover plate 318 .

[0094] Here, the molding material may cover the substrate 302 and the portion of the sensor chip 306 where the cavity 324 is not formed, to form a molding structure 312. The molding structure 312 surrounds the sensor chip 306, the protruding structure 310, and the transparent cover plate 318. In this way, the transparent cover plate 318 may be embedded in the molding structure 312.

[0095] In the embodiments of the present disclosure, on the one hand, there is no need to use adhesive to form a colloidal layer to fix the light-transmitting cover plate 318 and the plastic packaging structure 312, and the process of applying the adhesive is omitted, so that the pollution caused by the adhesive can be avoided, that is, the pollution of the top surface of the light-transmitting cover plate 318 and the photosensitive area 308 can be avoided at the same time. On the second hand, by providing a protective layer 322 on the top surface of the light-transmitting cover plate 318, the top surface of the light-transmitting cover plate 318 can be avoided from being polluted during the process of manufacturing the packaging structure, thereby avoiding affecting the transmittance of the light-transmitting cover plate 318, and further avoiding affecting the performance of the sensor chip 306. On the third hand, the light-transmitting cover plate 318 is embedded in the plastic packaging structure 312 to prevent the risk of the light-transmitting cover plate 318 falling off due to the pressure difference between the inside and outside.

[0096] In some embodiments, the dimension of the transparent cover plate 318 along the X direction is greater than the dimension of the protection layer 322 along the X direction, that is, the protection layer 322 cannot completely cover the top surface of the transparent cover plate 318 . Figure 5D It is illustrated that the dimension of the light-transmissive cover plate 318 along the X direction is greater than the dimension of the protection layer 322 along the X direction.

[0097] In some embodiments, the orthographic projection of the photosensitive region 308 on the substrate 302 is within the orthographic projection range of the protective layer 322 on the substrate 302, that is, the size of the photosensitive region 308 along the X direction is smaller than the size of the protective layer 322 along the X direction. Here, the protective layer 322 can at least protect the portion of the transparent cover plate 318 facing the photosensitive region 308 to avoid contaminating the top surface of the transparent cover plate 218, thereby avoiding affecting the transmittance of the transparent cover plate 218.

[0098] like Fig. 6A As shown, a connecting layer 320a and a protective layer 322a are provided on the top surface of the transparent cover plate 318; wherein the size of the transparent cover plate 318 along the X direction is the same as the size of the protective layer 322a along the X direction, that is, the protective layer 322a can just completely cover the top surface of the transparent cover plate 318.

[0099] like Figure 6B As shown, a connection layer 320b and a protective layer 322b are provided on the top surface of the transparent cover plate 318; wherein the size of the transparent cover plate 318 along the X direction is smaller than the size of the protective layer 322b along the X direction, that is, the protective layer 322b can completely cover the top surface of the transparent cover plate 318.

[0100] Figure 5D , Fig. 6A and Figure 6B The three relative position relationships between the light-transmitting cover plate and the protective layer are illustrated respectively. Figure 5D It is shown that the dimension of the light-transmitting cover plate 318 along the X direction is greater than the dimension of the protective layer 322 along the X direction. Fig. 6A It is shown that the transparent cover plate 318 and the protective layer 322a have the same size along the X direction. Figure 6B It is shown that the dimension of the transparent cover plate 318 along the X direction is smaller than the dimension of the protective layer 322b along the X direction. Of course, no matter how the relative position relationship between the transparent cover plate and the protective layer changes, the dimension of the protective layer along the X direction is always larger than the dimension of the photosensitive area along the X direction.

[0101] like Figure 5E As shown, the protective layer 322 is removed; Fig. 5F As shown, the connection layer 320 is removed to expose the top surface of the light-transmissive cover plate 318 .

[0102] Here, the description of the connection method between the transparent cover plate 318, the connecting layer 320 and the protective layer 322, the method of removing the protective layer 322 and the connecting layer 320, and the material selection of the connecting layer 320 can be referred to. Figure 2A , I will not go into details here.

[0103] In some embodiments, the surface of the transparent cover plate 318 away from the substrate 302 (ie, the top surface of the transparent cover plate 318 ) is recessed from the surface of the molding structure 312 away from the substrate 302 (ie, the top surface of the molding structure 312 ). Fig. 5F It is shown that the top surface of the light-transmitting cover plate 218 is recessed in the top surface of the plastic package structure 212 , that is, the top surface of the light-transmitting cover plate 218 is lower than the top surface of the plastic package structure 212 .

[0104] It should be noted that after removing the protective layer 322, the plastic encapsulation structure 312 may form a depression on the top surface of the transparent cover plate 318. The size of the depression along the X direction may be larger than the size of the transparent cover plate 318 along the X direction, or the size of the depression along the X direction may be smaller than the size of the transparent cover plate 318 along the X direction, or the size of the depression along the X direction may be the same as the size of the transparent cover plate 318 along the X direction.

[0105] In other embodiments, the surface of the transparent cover plate 318 away from the substrate 302 (ie, the top surface of the transparent cover plate 318 ) and the surface of the molding structure 312 away from the substrate 302 (ie, the top surface of the molding structure 312 ) are substantially flush.

[0106] like Figure 7 As shown, in the packaging structure 300a, the top surface of the transparent cover plate 318 is substantially flush with the top surface of the plastic encapsulation structure 312a. Substantially flush means that the top surface of the transparent cover plate 318 is flush with the top surface of the plastic encapsulation structure 312a, or the height difference between the top surface of the transparent cover plate 318 and the top surface of the plastic encapsulation structure 312a meets the process error range requirement.

[0107] like Fig. 5F As shown, an embodiment of the present disclosure provides a packaging structure 300, which includes: a substrate 302; a chip (for example, a sensor chip 306) disposed on one side of the substrate 302, wherein the surface of the sensor chip 306 away from the substrate 302 has a photosensitive area 308; a protruding structure 310 disposed on the surface of the sensor chip 306 away from the substrate 302 and surrounding the photosensitive area 308; a plastic packaging structure 312 disposed on one side of the substrate 302 and surrounding the sensor chip 306; a light-transmitting cover plate 318 disposed on the side of the sensor chip 306 away from the substrate 302, wherein a cavity 324 is formed between the light-transmitting cover plate 318, the plastic packaging structure 312 and the sensor chip 306, and the cavity 324 exposes the photosensitive area 308.

[0108] In some embodiments, the orthographic projection of the cavity 324 on the substrate 302 is within the orthographic projection of the light-transmitting cover plate 318 on the substrate 302. Here, the dimension of the cavity 324 along the X direction is smaller than the dimension of the light-transmitting cover plate 318 along the X direction.

[0109] In some embodiments, the transparent cover plate 318 and the chip (e.g., the sensor chip 306) form two surfaces of the cavity 324 that are opposite to each other, and the protruding structure 310 forms the sidewall of the cavity; the inner contour of the orthographic projection of the protruding structure 310 on the substrate 302 coincides with the outer contour of the orthographic projection of the cavity 324 on the substrate 302. Here, the bottom surface of the transparent cover plate 318 can form the top surface of the cavity 324, the top surface of the sensor chip 306 can form the bottom surface of the cavity 324, the protruding structure 310 can form the sidewall of the cavity 324, and the transparent cover plate 318, the sensor chip 306, and the protruding structure 310 can surround and form the cavity 324.

[0110] In some embodiments, the surface of the protruding structure 310 away from the chip (eg, the sensor chip 306 ) contacts the transparent cover plate 318 , and the outer sidewall of the protruding structure 310 contacts the plastic packaging structure 312 .

[0111] The disclosed embodiment provides a packaging structure and a manufacturing method thereof. In the disclosed embodiment, the surface of the chip away from the substrate has a photosensitive area and the surface of the chip away from the substrate is provided with a raised structure surrounding the photosensitive area; on the one hand, in the process of using an adhesive to fix the transparent cover plate and the packaging structure, even if the adhesive flows downward, it will be isolated outside the chip photosensitive area by the raised structure, thereby avoiding contamination of the chip photosensitive area, thereby avoiding affecting the performance of the chip; on the other hand, the transparent cover plate can also be directly set on the side of the raised structure away from the substrate, and then the plastic sealing structure is used for plastic sealing, thereby avoiding the use of adhesive to fix the transparent cover plate and the plastic sealing structure, thereby avoiding the adhesive from contaminating the chip photosensitive area.

[0112] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present disclosure. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in the various embodiments of the present disclosure, the size of the serial number of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present disclosure. The serial numbers of the embodiments of the present disclosure are for description only and do not represent the advantages and disadvantages of the embodiments.

[0113] The above description is only a preferred embodiment of the present disclosure, and does not limit the patent scope of the present disclosure. All equivalent structural changes made by using the contents of the present disclosure and the drawings under the inventive concept of the present disclosure, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present disclosure.

Claims

1. A packaging structure, characterized in that: The packaging structure comprises: substrate; A chip is arranged on one side of the substrate, wherein a surface of the chip away from the substrate has a photosensitive area; A protruding structure disposed on a surface of the chip away from the substrate and surrounding the photosensitive area; A plastic packaging structure disposed on one side of the substrate and surrounding the chip; A light-transmitting cover plate is arranged on a side of the chip away from the substrate, a cavity is formed between the light-transmitting cover plate, the plastic packaging structure and the chip, and the cavity exposes the photosensitive area.

2. The packaging structure according to claim 1, characterized in that: The orthographic projection of the cavity on the substrate is located within the orthographic projection range of the light-transmitting cover plate on the substrate.

3. The packaging structure according to claim 2, characterized in that: The light-transmitting cover plate and the chip form two surfaces of the cavity that are arranged opposite to each other, and the plastic packaging structure forms a side wall of the cavity; the orthographic projection of the protruding structure on the substrate is located within the orthographic projection range of the cavity on the substrate.

4. The packaging structure according to claim 3, characterized in that: There is a first distance between the surface of the protruding structure away from the chip and the transparent cover plate, and there is a second distance between the outer side wall of the protruding structure and the plastic packaging structure.

5. The packaging structure according to claim 3, characterized in that: The packaging structure further includes: A colloid layer is provided between the light-transmitting cover plate and the plastic packaging structure.

6. The packaging structure according to claim 3, characterized in that: The surface of the light-transmitting cover away from the substrate is substantially flush with the surface of the plastic packaging structure away from the substrate; or, The surface of the light-transmissive cover plate away from the substrate protrudes beyond the surface of the plastic packaging structure away from the substrate.

7. The packaging structure according to claim 2, characterized in that: The light-transmitting cover plate and the chip form two surfaces of the cavity that are arranged opposite to each other, and the protruding structure forms a side wall of the cavity; the inner contour of the orthographic projection of the protruding structure on the substrate coincides with the outer contour of the orthographic projection of the cavity on the substrate.

8. The packaging structure according to claim 7, characterized in that: The surface of the protruding structure away from the chip contacts the light-transmitting cover plate, and the outer sidewall of the protruding structure contacts the plastic packaging structure.

9. The packaging structure according to claim 7, characterized in that: The surface of the light-transmitting cover plate away from the substrate is substantially flush with the surface of the plastic packaging structure away from the substrate; or, The surface of the light-transmitting cover plate away from the substrate is recessed in the surface of the plastic packaging structure away from the substrate.

10. A method for manufacturing a packaging structure, characterized in that: The method comprises: providing a substrate; A chip is arranged on one side of the substrate, wherein a surface of the chip away from the substrate has a photosensitive area, and a surface of the chip away from the substrate is also provided with a protruding structure surrounding the photosensitive area; A plastic encapsulation structure and a light-transmitting cover plate are formed on one side of the substrate, the plastic encapsulation structure surrounds the chip, a cavity is formed between the light-transmitting cover plate, the plastic encapsulation structure and the chip, and the cavity exposes the photosensitive area.

11. The manufacturing method according to claim 10, characterized in that: The method of forming a plastic packaging structure and a light-transmitting cover plate on one side of the substrate comprises: The plastic packaging structure is formed on one side of the substrate, wherein a first groove and a second groove that are interconnected are provided in the plastic packaging structure, the second groove is located between the first groove and the chip, the photosensitive area and the protruding structure are exposed at the bottom of the second groove, and the dimension of the first groove along the direction parallel to the substrate is greater than the dimension of the second groove along the direction parallel to the substrate; Providing the light-transmitting cover plate, the connecting layer and the protective layer which are stacked, wherein the connecting layer is used to connect the light-transmitting cover plate and the protective layer; The light-transmitting cover plate is arranged in the first groove, and the light-transmitting cover plate and the plastic packaging structure are fixedly connected via a colloid layer; the light-transmitting cover plate covers the second groove to form the cavity; The connecting layer and the protective layer are removed to expose the light-transmitting cover plate.

12. The manufacturing method according to claim 11, characterized in that: The thickness of the light-transmitting cover plate along a direction perpendicular to the substrate is greater than or equal to the depth of the first groove along a direction perpendicular to the substrate.

13. The manufacturing method according to claim 10, characterized in that: The method of forming a plastic packaging structure and a light-transmitting cover plate on one side of the substrate comprises: The light-transmitting cover plate is arranged on a side of the protruding structure away from the chip; A connecting layer and a protective layer are formed on a side of the light-transmitting cover plate away from the protruding structure, wherein the connecting layer is used to connect the light-transmitting cover plate and the protective layer; The plastic packaging structure is formed on one side of the substrate, and the plastic packaging structure surrounds the protruding structure and the light-transmitting cover plate; The connecting layer and the protective layer are removed to expose the light-transmitting cover plate.

14. The manufacturing method according to claim 13, characterized in that: The surface of the light-transmitting cover plate away from the substrate is substantially flush with the surface of the plastic packaging structure away from the substrate; or, The surface of the light-transmitting cover plate away from the substrate is recessed in the surface of the plastic packaging structure away from the substrate.

15. The manufacturing method according to claim 11 or 13, characterized in that: The orthographic projection of the photosensitive area on the substrate is located within the orthographic projection range of the protective layer on the substrate.

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