Printed circuit board solder mask manufacturing monitoring method and device for automobile fatigue driving camera, computer equipment and storage medium

Abstract

The invention provides a printed circuit board solder mask manufacturing monitoring method and device for an automobile fatigue driving camera, computer equipment and a storage medium. The method comprises the following steps: acquiring solder mask manufacturing state parameters of the printed circuit board; performing resistance welding adjustment operation on the resistance welding manufacturing state parameter and a preset manufacturing state parameter to obtain a plate resistance adjustment quantity; and according to the board resistance adjustment amount, sending a resistance welding color board passing and forbidding signal to a board-making resistance welding central controller. After the resistance welding manufacturing state parameters are collected, the manufacturing condition of the current resistance welding production process of the printed circuit board is determined, and then the resistance welding manufacturing state parameters are compared with standard resistance welding manufacturing parameters. According to the method, the difference between the manufacturing condition of the current resistance welding production process of the printed circuit board and the manufacturing condition of the standard resistance welding production process is conveniently determined, finally, the board selection mode of the board manufacturing resistance welding central controller is optimized and adjusted according to the difference value, and the resistance welding color consistency of the printed circuit board in the manufacturing process is effectively improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of printed circuit boards, and in particular to a method, device, computer equipment and storage medium for monitoring the solder mask production of a printed circuit board for a vehicle fatigue driving camera. Background Art

[0002] Driving fatigue refers to the driver's decreased reaction ability due to lack of sleep or long-term continuous driving. This decrease is manifested in the driver's sleepiness, dozing off, driving errors or complete loss of driving ability. It is these behaviors that directly lead to accidents. Driver fatigue driving has become a major hidden danger of traffic accidents, just like drunk driving. The difference is that drunk driving is easy to detect, while driving fatigue is quite hidden. Therefore, it is of great practical significance to develop a real-time, all-weather, non-contact driving fatigue monitoring device. Among them, the automobile fatigue driving camera PCB board is the basic circuit board in the driving fatigue monitoring device. Its online production batches are large and the production cycle is long.

[0003] However, new energy vehicle board products have strict requirements on the appearance of finished products, and the most intuitive one is the color of solder mask ink. This is because the production conditions cannot be guaranteed to be exactly the same every time, so there will be color differences in solder mask ink on the products, and there is a risk of complaints from customers when products produced at different times are delivered to the client. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and to provide a method, device, computer equipment and storage medium for monitoring the solder mask production of a printed circuit board for an automobile fatigue driving camera that effectively improves the color consistency of the solder mask of the circuit board.

[0005] The purpose of this disclosure is achieved through the following technical solutions:

[0006] A method for producing a monitoring method of a printed circuit board solder mask for a vehicle fatigue driving camera, the method comprising:

[0007] Obtain solder mask manufacturing status parameters of printed circuit boards;

[0008] Performing a solder resistance adjustment operation on the solder resistance manufacturing state parameters and the preset manufacturing state parameters to obtain a board resistance adjustment amount;

[0009] A solder resist color plate enable / disable signal is sent to the board solder resist central controller according to the board resistance leveling difference, so as to select a printed circuit board with a consistent solder resist ink color.

[0010] In one embodiment, the obtaining of the solder mask manufacturing state parameters of the printed circuit board includes: obtaining the dosage of solder mask opening oil water of the printed circuit board.

[0011] In one embodiment, the solder resist production state parameters are subjected to solder resist adjustment operation with preset production state parameters to obtain board resistance adjustment difference, including: calculating the difference between the solder resist oil and water dosage and the preset dosage to obtain the solder resist oil and water dosage adjustment.

[0012] In one of the embodiments, sending a solder resist color plate pass / ban signal to the board making solder resist central controller according to the board resistance level difference to select a printed circuit board with a consistent solder resist ink color, includes: detecting whether the solder resist oil and water usage level difference is greater than or equal to a preset oil and water usage level difference; when the solder resist oil and water usage level difference is greater than or equal to the preset oil and water usage level difference, sending a color plate non-conforming signal to the board making solder resist central controller.

[0013] In one of the embodiments, the step of obtaining the solder resist manufacturing state parameters of the printed circuit board includes: obtaining the solder resist pre-baking time of the printed circuit board.

[0014] In one embodiment, the solder resist production state parameters are subjected to a solder resist adjustment operation with preset production state parameters to obtain a board resistance adjustment amount, including: obtaining a difference between the solder resist pre-bake time and a preset pre-bake time to obtain a solder resist pre-bake time adjustment.

[0015] In one of the embodiments, sending a solder resist color plate pass / ban signal to the board making solder resist central controller according to the board resist adjustment amount to select a printed circuit board with a consistent solder resist ink color, includes: detecting whether the solder resist pre-bake time adjustment is less than a preset pre-bake time adjustment; when the solder resist pre-bake time adjustment is less than the preset pre-bake time adjustment, sending a color plate consistent signal to the board making solder resist central controller.

[0016] A printed circuit board solder mask production monitoring device for an automobile fatigue driving camera comprises: a solder mask sampling module, a solder mask adjustment processing module and a board selection module; the solder mask sampling module is used to obtain the solder mask production state parameters of the printed circuit board; the solder mask adjustment processing module is used to perform solder mask adjustment operation on the solder mask production state parameters and preset production state parameters to obtain board resistance adjustment difference; the board selection module is used to send a solder mask color plate pass / ban signal to a board resistance solder mask central controller according to the board resistance adjustment difference to select a printed circuit board with a consistent solder mask ink color.

[0017] A computer device comprises a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0018] Obtain solder mask manufacturing status parameters of printed circuit boards;

[0019] Performing a solder resistance adjustment operation on the solder resistance manufacturing state parameters and the preset manufacturing state parameters to obtain a board resistance adjustment amount;

[0020] A solder resist color plate enable / disable signal is sent to the board solder resist central controller according to the board resistance leveling difference, so as to select a printed circuit board with a consistent solder resist ink color.

[0021] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the following steps:

[0022] Obtain solder mask manufacturing status parameters of printed circuit boards;

[0023] Performing a solder resistance adjustment operation on the solder resistance manufacturing state parameters and the preset manufacturing state parameters to obtain a board resistance adjustment amount;

[0024] A solder resist color plate enable / disable signal is sent to the board solder resist central controller according to the board resistance leveling difference, so as to select a printed circuit board with a consistent solder resist ink color.

[0025] Compared with the prior art, the present invention has at least the following advantages:

[0026] After collecting the solder mask manufacturing status parameters, the current solder mask production process of the printed circuit board is determined, and then the solder mask manufacturing status parameters are compared with the standard solder mask manufacturing parameters to facilitate determining the difference between the current solder mask production process of the printed circuit board and the standard solder mask production process. Finally, based on the above difference value, the board selection mode of the board solder mask central controller is optimized and adjusted to facilitate the selection of printed circuit boards with consistent solder mask ink color, effectively improving the solder mask color consistency of printed circuit boards during the manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 It is a flow chart of a method for monitoring the solder mask production of a printed circuit board for a vehicle fatigue driving camera in one embodiment;

[0029] Figure 2 1 is a diagram of the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0033] The present disclosure relates to a method for monitoring the solder mask production of a printed circuit board for a car fatigue driving camera. In one embodiment, the method for monitoring the solder mask production of a printed circuit board for a car fatigue driving camera includes obtaining the solder mask production state parameters of the printed circuit board; performing a solder mask adjustment operation on the solder mask production state parameters and the preset production state parameters to obtain the board resistance adjustment difference; sending a solder mask color plate pass / ban signal to the board resistance solder mask central controller according to the board resistance adjustment difference to select a printed circuit board with a consistent solder mask ink color. After collecting the solder mask manufacturing state parameters, the current solder mask production process of the printed circuit board is determined, and then the solder mask manufacturing state parameters are compared with the standard solder mask manufacturing parameters to facilitate determining the difference between the current solder mask production process of the printed circuit board and the standard solder mask production process. Finally, according to the above difference value, the board selection mode of the board resistance solder mask central controller is optimized and adjusted to facilitate the selection of a printed circuit board with a consistent solder mask ink color, effectively improving the solder mask color consistency of the printed circuit board during the manufacturing process.

[0034] See also Figure 1 , which is a flow chart of a method for monitoring the solder mask production of a printed circuit board for a vehicle fatigue driving camera according to an embodiment of the present disclosure. The method for monitoring the solder mask production of a printed circuit board for a vehicle fatigue driving camera includes part or all of the following steps.

[0035] S100: Obtain solder mask manufacturing status parameters of the printed circuit board.

[0036] In this embodiment, the solder resist production state parameter is the current solder resist production process of the printed circuit board, that is, the solder resist production state parameter is the production process data of the printed circuit board in the process of solder resist ink production, that is, the solder resist production state parameter corresponds to the solder resist process of the printed circuit board. By collecting the solder resist production state parameter, it is convenient to determine the corresponding board making parameters in the current solder resist production process of the printed circuit board.

[0037] S200: performing a solder resist adjustment operation on the solder resist manufacturing state parameters and preset manufacturing state parameters to obtain a board resist adjustment amount.

[0038] In this embodiment, the solder resist production state parameter is the current solder resist production process of the printed circuit board, that is, the solder resist production state parameter is the production process data of the printed circuit board in the process of solder resist ink production, that is, the solder resist production state parameter corresponds to the solder resist process manufacturing process of the printed circuit board. By collecting the solder resist production state parameter, it is convenient to determine the corresponding board making parameters in the current solder resist production process of the printed circuit board. The preset production state parameter is the reference solder resist production process of the printed circuit board, that is, the preset production state parameter is the standard production process data of the printed circuit board in the process of solder resist ink production, that is, the preset production state parameter corresponds to the specified solder resist process manufacturing process of the printed circuit board. By performing the solder resist adjustment operation on the solder resist production state parameter and the preset production state parameter, it is convenient to determine the degree of difference in the board making process parameters of the printed circuit board in the current solder resist production process.

[0039] S300: Sending a solder mask color plate enable / disable signal to a board solder mask central controller according to the board resistance leveling difference, so as to select a printed circuit board with a consistent solder mask ink color.

[0040] In this embodiment, the board resistance leveling difference is obtained based on the solder resistance production state parameter and the preset production state parameter, and the solder resistance production state parameter is the current solder resistance production process of the printed circuit board, that is, the solder resistance production state parameter is the production process data of the printed circuit board in the process of solder resistance ink production, that is, the solder resistance production state parameter corresponds to the solder resistance process manufacturing process of the printed circuit board. By collecting the solder resistance production state parameter, it is convenient to determine the corresponding board making parameters in the current solder resistance production process of the printed circuit board. The preset production state parameter is the reference solder resistance production process of the printed circuit board, that is, the preset production state parameter is the standard production process data of the printed circuit board in the process of solder resistance ink production, that is, the preset production state parameter corresponds to the specified solder resistance process manufacturing process of the printed circuit board. By performing the solder resistance leveling operation on the solder resistance production state parameter and the preset production state parameter, it is convenient to determine the degree of difference in the board making process parameters of the printed circuit board in the current solder resistance production process. After determining the differences in the printed circuit boards in the current solder mask production process, by sending a solder mask color plate pass / ban signal to the board solder mask central controller, it is convenient to distinguish the color differences caused by the solder mask ink production of the printed circuit boards, so that the printed circuit boards with the specified solder mask ink color can be passed, thereby making the solder mask ink color of the selected printed circuit boards consistent.

[0041] In the above embodiment, after the solder resist manufacturing status parameters are collected, the current solder resist production process manufacturing status of the printed circuit board is determined, and then the solder resist manufacturing status parameters are compared with the standard solder resist manufacturing parameters to facilitate determination of the difference between the current solder resist production process manufacturing status of the printed circuit board and the standard solder resist production process manufacturing status. Finally, based on the above difference value, the board selection mode of the board solder resist central controller is optimized and adjusted to facilitate the selection of printed circuit boards with consistent solder resist ink color, thereby effectively improving the solder resist color consistency of the printed circuit boards during the manufacturing process.

[0042] In one embodiment, the obtaining of the solder resist manufacturing state parameters of the printed circuit board includes: obtaining the amount of solder resist oil-opening water of the printed circuit board. In this embodiment, the solder resist manufacturing state parameters are the current solder resist production process of the printed circuit board, that is, the solder resist manufacturing state parameters are the production process data of the printed circuit board in the process of solder resist ink manufacturing, that is, the solder resist manufacturing state parameters correspond to the solder resist manufacturing process of the printed circuit board. By collecting the solder resist manufacturing state parameters, it is convenient to determine the corresponding board making parameters in the current solder resist production process of the printed circuit board. The solder resist manufacturing state parameters include the amount of solder resist oil-opening water of the printed circuit board, and the amount of solder resist oil-opening water is the amount of oil-opening water used by the printed circuit board in the solder resist manufacturing process. By collecting the amount of solder resist oil-opening water, it is convenient to determine the correct use of the amount of oil-opening water by the printed circuit board in the solder resist manufacturing process.

[0043] Further, the solder resistance production state parameter and the preset production state parameter are subjected to solder resistance adjustment operation to obtain the board resistance adjustment difference, including: obtaining the difference between the solder resistance oil water dosage and the preset dosage to obtain the solder resistance oil water dosage adjustment. In this embodiment, the solder resistance production state parameter is the current solder resistance production process of the printed circuit board, that is, the solder resistance production state parameter is the production process data of the printed circuit board in the process of solder resistance ink production, that is, the solder resistance production state parameter corresponds to the solder resistance process manufacturing process of the printed circuit board. By collecting the solder resistance production state parameter, it is convenient to determine the corresponding board making parameters in the current solder resistance production process of the printed circuit board. The preset production state parameter is the reference solder resistance production process of the printed circuit board, that is, the preset production state parameter is the standard production process data of the printed circuit board in the process of solder resistance ink production, that is, the preset production state parameter corresponds to the specified solder resistance process manufacturing process of the printed circuit board. By performing solder resistance adjustment operation on the solder resistance production state parameters and the preset production state parameters, it is convenient to determine the degree of difference in the board making process parameters of the printed circuit board in the current solder resistance production process. The solder resistance production state parameters include the solder resistance oil-opening water dosage of the printed circuit board, and the solder resistance oil-opening water dosage is the amount of oil-opening water used by the printed circuit board in the solder resistance manufacturing process. By collecting the solder resistance oil-opening water dosage, it is convenient to determine the correct use of the amount of oil-opening water by the printed circuit board in the solder resistance manufacturing process. By calculating the difference between the solder resistance oil-opening water dosage and the preset dosage, it is convenient to determine the degree of difference in the use of oil-opening water by the printed circuit board in the solder resistance manufacturing process.

[0044] Furthermore, the solder mask color plate pass / fail signal is sent to the solder mask central controller of the board making according to the board resistance leveling difference to select a printed circuit board with the same solder mask ink color, including: detecting whether the solder mask opening oil and water usage difference is greater than or equal to the preset opening oil and water usage difference; when the solder mask opening oil and water usage difference is greater than or equal to the preset opening oil and water usage difference, a color plate non-conforming signal is sent to the solder mask central controller of the board making. In this embodiment, the board resistance leveling difference is obtained based on the solder mask production state parameter and the preset production state parameter, and the solder mask production state parameter is the current solder mask production process of the printed circuit board, that is, the solder mask production state parameter is the production process data of the printed circuit board in the process of solder mask ink production, that is, the solder mask production state parameter corresponds to the solder mask process manufacturing process of the printed circuit board. By collecting the solder mask production state parameters, it is convenient to determine the corresponding board making parameters in the current solder mask production process of the printed circuit board. The preset production state parameters are the reference solder mask production process production conditions of the printed circuit board, that is, the preset production state parameters are the standard production process data of the printed circuit board in the solder mask ink production process, that is, the preset production state parameters correspond to the specified solder mask process manufacturing process of the printed circuit board. By performing solder mask adjustment operation on the solder mask production state parameters and the preset production state parameters, it is convenient to determine the degree of difference in the board making process parameters of the printed circuit board in the current solder mask production process. After determining the difference in the current solder mask production process of the printed circuit board, by sending a solder mask color plate pass / ban signal to the board making solder mask central controller, it is convenient to distinguish the color difference formed by the solder mask ink production of the printed circuit board, so that the printed circuit board with the specified solder mask ink color can pass, thereby making the solder mask ink color of the selected printed circuit board consistent. The solder resist manufacturing state parameters include the solder resist oil-opening water dosage of the printed circuit board, and the solder resist oil-opening water dosage is the amount of oil-opening water used by the printed circuit board in the solder resist manufacturing process. By collecting the solder resist oil-opening water dosage, it is convenient to determine the correct amount of oil-opening water used by the printed circuit board in the solder resist manufacturing process. By calculating the difference between the solder resist oil-opening water dosage and the preset dosage, it is convenient to determine the degree of difference in the use of oil-opening water by the printed circuit board in the solder resist manufacturing process. The solder resist oil-opening water dosage leveling is greater than or equal to the preset oil-opening water dosage leveling, indicating that the dosage of oil-opening water used by the printed circuit board in the solder resist manufacturing process is too large. At this time, a color plate non-causing signal is sent to the board solder resist central controller to determine that the solder resist ink color of the printed circuit board has a large color difference and is inconsistent with the specified solder resist ink color.

[0045] In another embodiment, when the solder resist oil-opening water dosage difference is less than the preset oil-opening water dosage difference, a color plate consistency signal is sent to the board solder resist central controller. At this time, the dosage of the oil-opening water used in the solder resist manufacturing process of the printed circuit board is within the specified dosage range, and the color of the solder resist ink formed on the printed circuit board can be kept consistent with the specified solder resist ink color.

[0046] In one embodiment, the obtaining of the solder resist manufacturing state parameters of the printed circuit board includes: obtaining the solder resist pre-baking time of the printed circuit board. In this embodiment, the solder resist manufacturing state parameters are the current solder resist production process manufacturing conditions of the printed circuit board, that is, the solder resist manufacturing state parameters are the production process data of the printed circuit board in the solder resist ink manufacturing process, that is, the solder resist manufacturing state parameters correspond to the solder resist manufacturing process of the printed circuit board. By collecting the solder resist manufacturing state parameters, it is convenient to determine the corresponding board making parameters in the current solder resist production process of the printed circuit board. The solder resist manufacturing state parameters include the solder resist pre-baking time of the printed circuit board, and the solder resist pre-baking time is the baking time of the printed circuit board before exposure and development in the solder resist manufacturing process. By collecting the solder resist pre-baking time, it is convenient to determine the correct preset baking time of the printed circuit board in the solder resist manufacturing process.

[0047] Further, the solder resistance production state parameter and the preset production state parameter are subjected to a solder resistance adjustment operation to obtain a board resistance adjustment amount, including: obtaining the difference between the solder resistance pre-baking time and the preset pre-baking time to obtain the solder resistance pre-baking time adjustment. In this embodiment, the solder resistance production state parameter is the current solder resistance production process of the printed circuit board, that is, the solder resistance production state parameter is the production process data of the printed circuit board in the process of solder resistance ink production, that is, the solder resistance production state parameter corresponds to the solder resistance process manufacturing process of the printed circuit board. By collecting the solder resistance production state parameter, it is convenient to determine the corresponding board making parameters in the current solder resistance production process of the printed circuit board. The preset production state parameter is the reference solder resistance production process of the printed circuit board, that is, the preset production state parameter is the standard production process data of the printed circuit board in the process of solder resistance ink production, that is, the preset production state parameter corresponds to the specified solder resistance process manufacturing process of the printed circuit board. By performing solder resistance adjustment operation on the solder resistance production state parameters and the preset production state parameters, it is convenient to determine the degree of difference in the board manufacturing process parameters of the printed circuit board in the current solder resistance production process. The solder resistance production state parameters include the solder resistance pre-baking time of the printed circuit board, and the solder resistance pre-baking time is the baking time of the printed circuit board before exposure and development in the solder resistance manufacturing process. By collecting the solder resistance pre-baking time, it is convenient to determine the correct preset baking time of the printed circuit board in the solder resistance manufacturing process. By calculating the difference between the solder resistance pre-baking time and the preset pre-baking time, it is convenient to determine the degree of difference in the pre-baking time of the printed circuit board in the solder resistance manufacturing process.

[0048] Furthermore, the solder mask color plate pass / ban signal is sent to the solder mask central controller of the board making according to the board resistance leveling difference to select a printed circuit board with the same solder mask ink color, including: detecting whether the solder mask pre-baking time difference is less than the preset pre-baking time difference; when the solder mask pre-baking time difference is less than the preset pre-baking time difference, a color plate consistent signal is sent to the solder mask central controller of the board making. In this embodiment, the board resistance leveling difference is obtained based on the solder mask production state parameter and the preset production state parameter, and the solder mask production state parameter is the current solder mask production process of the printed circuit board, that is, the solder mask production state parameter is the production process data of the printed circuit board in the process of solder mask ink production, that is, the solder mask production state parameter corresponds to the solder mask process manufacturing process of the printed circuit board. By collecting the solder mask production state parameters, it is convenient to determine the corresponding board making parameters in the current solder mask production process of the printed circuit board. The preset production state parameters are the reference solder mask production process production conditions of the printed circuit board, that is, the preset production state parameters are the standard production process data of the printed circuit board in the solder mask ink production process, that is, the preset production state parameters correspond to the specified solder mask process manufacturing process of the printed circuit board. By performing solder mask adjustment operation on the solder mask production state parameters and the preset production state parameters, it is convenient to determine the degree of difference in the board making process parameters of the printed circuit board in the current solder mask production process. After determining the difference in the current solder mask production process of the printed circuit board, by sending a solder mask color plate pass / ban signal to the board making solder mask central controller, it is convenient to distinguish the color difference formed by the solder mask ink production of the printed circuit board, so that the printed circuit board with the specified solder mask ink color can pass, thereby making the solder mask ink color of the selected printed circuit board consistent. The solder resist manufacturing state parameters include the solder resist pre-baking time of the printed circuit board. The solder resist pre-baking time is the baking time of the printed circuit board before exposure and development during the solder resist manufacturing process. By collecting the solder resist pre-baking time, it is convenient to determine the correct preset baking time of the printed circuit board during the solder resist manufacturing process. By calculating the difference between the solder resist pre-baking time and the preset pre-baking time, it is convenient to determine the degree of difference in the pre-baking time of the printed circuit board during the solder resist manufacturing process. The solder resist pre-baking time adjustment is less than the preset pre-baking time adjustment. At this time, the pre-baking time of the printed circuit board during the solder resist manufacturing process is within the specified baking time range, and the color of the solder resist ink formed on the printed circuit board can be kept consistent with the specified solder resist ink color.

[0049] In another embodiment, when the solder resist pre-baking time difference is greater than or equal to the preset pre-baking time difference, a color plate non-consistent signal is sent to the board solder resist central controller. This indicates that the pre-baking time of the printed circuit board is too long during the solder resist manufacturing process. At this time, a color plate non-consistent signal is sent to the board solder resist central controller to determine that the solder resist ink color of the printed circuit board has a large color difference and is inconsistent with the specified solder resist ink color.

[0050] In the actual solder mask manufacturing process of the printed circuit board for the automobile fatigue driving camera, the solder mask ink needs to be exposed and developed to perform a graphic operation on the solder mask layer in order to form a solder mask layer with a specified pattern. However, before exposure and development, the solder mask ink needs to be applied through a screen. The choice of the screen directly determines the amount of solder mask ink used, which is likely to affect the subsequent residue after the solder mask ink is developed, thereby affecting the molding color of the solder mask ink.

[0051] In order to solve the above problem, the method further includes sending a solder mask color plate pass / fail signal to the board solder mask central controller according to the board resistance leveling difference to select a printed circuit board with the same solder mask ink color:

[0052] Obtaining the number of solder mask exposure grids of the printed circuit board;

[0053] Detecting whether the number of solder mask exposure grids is less than or equal to a preset number of grids;

[0054] When the number of solder mask exposure grids is less than or equal to the preset number of grids, a film reduction and increase signal is sent to the board solder mask central controller.

[0055] In this embodiment, the solder resist exposure grid number is the solder resist ink exposure grid number of the printed circuit board in the process of making the solder resist layer, that is, the solder resist exposure grid number is the exposure amount of the solder resist ink of the printed circuit board in the process of making the solder resist layer, and the preset grid number is the solder resist ink exposure grid number of the solder resist ink of the specified color in the process of making the solder resist layer of the printed circuit board. The solder resist exposure grid number is less than or equal to the preset grid number, indicating that the solder resist ink exposure grid number of the printed circuit board in the process of making the solder resist layer is too low, that is, the solder resist exposure amount of the printed circuit board is too little. At this time, by sending a film reduction and increase signal to the board solder resist central controller, the number of screens before exposure is increased, and the thickness of the wet film is reduced, so that the amount of solder resist ink used is increased, and the thickness of the protective wet film thereon is reduced. At low exposure, the amount of solder resist ink on the printed circuit board is avoided from being too much, thereby ensuring the color stability of the solder resist ink.

[0056] Further, the detecting whether the number of solder mask exposure grids is less than or equal to a preset number of grids further includes:

[0057] When the solder resist exposure grid number is greater than the preset grid number, obtaining the solder resist development time of the printed circuit board;

[0058] Detecting whether the solder resist developing time is greater than or equal to a preset developing time;

[0059] When the solder resist developing time is greater than or equal to the preset developing time, a film increasing and reducing signal is sent to the board solder resist central controller.

[0060] In this embodiment, the number of solder mask exposure grids is greater than the preset number of grids, indicating that the exposure amount of the solder mask ink is sufficient. At this time, the solder mask development time of the printed circuit board is collected to determine the development time of the solder mask ink on the printed circuit board after exposure. The preset development time is the specified time that the solder mask ink on the printed circuit board is immersed in the developer, and the preset development time corresponds to the specified ink color. The solder mask development time is greater than or equal to the preset development time, indicating that the development time of the solder mask ink on the printed circuit board after exposure is too long. In order to prevent the solder mask ink from being affected by excessive development, a film increase and mesh reduction signal is sent to the board solder mask central controller to reduce the number of screens before exposure to reduce the amount of solder mask ink used, and the wet film thickness is also thickened to separate the solder mask ink from the developer in the solder mask pattern area to reduce contact with the solder mask ink.

[0061] In another embodiment, when the solder resist developing time is less than the preset developing time, step S300 is performed.

[0062] The above-mentioned various preset variables are all set in the database for timely retrieval, and different preset variables are placed in different storage units, that is, in different storage stacks. Moreover, the number of solder mask exposure grids and the solder mask development time can be collected through corresponding detectors, for example, through the light meter and development timer in the solder mask sampling module.

[0063] In one of the embodiments, the present disclosure also relates to a printed circuit board solder mask production monitoring device for a car fatigue driving camera, comprising: a solder mask sampling module, a solder mask adjustment processing module and a board selection module; the solder mask sampling module is used to obtain the solder mask production state parameters of the printed circuit board; the solder mask adjustment processing module is used to perform a solder mask adjustment operation on the solder mask production state parameters and preset production state parameters to obtain a board resistance adjustment amount; the board selection module is used to send a solder mask color plate pass / ban signal to a board solder mask production central controller according to the board resistance adjustment amount to select a printed circuit board with a consistent solder mask ink color.

[0064] In this embodiment, after the solder resist sampling module collects the solder resist manufacturing status parameters, the current solder resist production process of the printed circuit board is determined, and then the solder resist adjustment processing module compares the solder resist manufacturing status parameters with the standard solder resist manufacturing parameters to facilitate determining the difference between the current solder resist production process of the printed circuit board and the standard solder resist production process. Finally, the board selection module optimizes and adjusts the board selection mode of the board solder resist central controller according to the above difference value, so as to facilitate the selection of printed circuit boards with consistent solder resist ink color, thereby effectively improving the solder resist color consistency of the printed circuit boards during the manufacturing process.

[0065] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Figure 2 As shown. The computer device includes a processor, a memory and a network interface connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store data such as solder mask production state parameters, board resistance leveling differences, and solder mask color plate pass / fail signals. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a printed circuit board solder mask production monitoring method for a car fatigue driving camera is implemented.

[0066] Those skilled in the art will understand that Figure 2 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0067] In one of the embodiments, the present application further provides a computer device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above-mentioned method embodiments when executing the computer program.

[0068] In one of the embodiments, the present application further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0069] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0070] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be subject to the attached claims.

Claims

1. A method for making a printed circuit board solder mask for a car fatigue driving camera monitoring system, characterized in that: include: Obtain solder mask manufacturing status parameters of printed circuit boards; Performing a solder resistance adjustment operation on the solder resistance manufacturing state parameters and the preset manufacturing state parameters to obtain a board resistance adjustment amount; A solder resist color plate enable / disable signal is sent to the board solder resist central controller according to the board resistance leveling difference, so as to select a printed circuit board with a consistent solder resist ink color.

2. The method for making a monitoring method of a printed circuit board solder mask for a vehicle fatigue driving camera according to claim 1, characterized in that: The step of obtaining the solder mask manufacturing state parameters of the printed circuit board includes: Obtain the dosage of solder mask opening oil water of the printed circuit board.

3. The method for making and monitoring a printed circuit board solder mask for a vehicle fatigue driving camera according to claim 2, characterized in that: The step of performing a solder resistance adjustment operation on the solder resistance manufacturing state parameter and the preset manufacturing state parameter to obtain a board resistance adjustment amount includes: The difference between the solder resist oil-opening water dosage and the preset dosage is calculated to obtain the solder resist oil-opening water dosage balance.

4. The method for producing and monitoring a printed circuit board solder mask for a vehicle fatigue driving camera according to claim 3, characterized in that: The method of sending a solder mask color plate pass / fail signal to a board solder mask central controller according to the board resistance leveling difference to select a printed circuit board with a consistent solder mask ink color includes: Detect whether the soldering oil and water usage difference is greater than or equal to the preset soldering oil and water usage difference; When the soldering resistance opening oil and water usage difference is greater than or equal to the preset opening oil and water usage difference, a color plate non-conforming signal is sent to the board soldering resistance central controller.

5. The method for making a monitoring method of a printed circuit board solder mask for a vehicle fatigue driving camera according to claim 1, characterized in that: The step of obtaining the solder mask manufacturing state parameters of the printed circuit board includes: Obtain the solder resist pre-baking time of the printed circuit board.

6. The method for making and monitoring a printed circuit board solder mask for a vehicle fatigue driving camera according to claim 5, characterized in that: The step of performing a solder resistance adjustment operation on the solder resistance manufacturing state parameter and the preset manufacturing state parameter to obtain a board resistance adjustment amount includes: The difference between the solder resist pre-bake time and the preset pre-bake time is calculated to obtain the solder resist pre-bake time difference.

7. The method for making and monitoring a printed circuit board solder mask for a vehicle fatigue driving camera according to claim 6, characterized in that: The method of sending a solder mask color plate pass / fail signal to a board solder mask central controller according to the board resistance leveling difference to select a printed circuit board with a consistent solder mask ink color includes: Detecting whether the solder resist pre-baking time deviation is less than a preset pre-baking time deviation; When the solder resist pre-baking time difference is less than the preset pre-baking time difference, a color plate consistent signal is sent to the board solder resist central controller.

8. A monitoring device for automobile fatigue driving camera using printed circuit board solder mask, characterized in that: include: A solder resist sampling module, the solder resist sampling module is used to obtain solder resist manufacturing state parameters of a printed circuit board; A solder resistance adjustment processing module, the solder resistance adjustment processing module is used to perform a solder resistance adjustment operation on the solder resistance manufacturing state parameters and the preset manufacturing state parameters to obtain a board resistance adjustment amount; The board selection module is used to send a solder mask color plate enable / disable signal to the board solder mask central controller according to the board resistance leveling difference, so as to select a printed circuit board with a consistent solder mask ink color.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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