Heat dissipation module and electronic equipment

Abstract

The invention provides a heat dissipation module and electronic equipment. The heat dissipation module is used for dissipating heat of a target heat source, the heat dissipation module comprises a temperature equalization layer, the temperature equalization layer comprises a first shell, and the first shell is used for being connected with the target heat source and absorbing heat of the target heat source; the phase change layer and the temperature equalizing layer are arranged in a stacked mode, the phase change layer comprises a second shell and a phase change material, the second shell is connected to the first shell, and the second shell and the first shell jointly form a containing space; and the phase change material is arranged in the accommodating space and is used for absorbing heat from the first shell through phase change so as to dissipate heat. The heat dissipation module provided by the invention can improve the heat dissipation effect.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation module and electronic equipment. Background Art

[0002] With the gradual development of the 5G era, the power consumption of mobile phones and other terminal devices continues to increase, and their heat dissipation requirements are also increasing. In related technologies, phase change materials are used to dissipate heat from terminal devices. Because phase change materials release or absorb a large amount of heat when undergoing phase change, this heat can be directed to the phase change material based on this characteristic. When the temperature reaches the melting point of the phase change material, it melts and absorbs heat, thereby achieving a cooling effect. However, the phase change material heat dissipation solution used in related technologies has its heat dissipation effect limited. Summary of the Invention

[0003] The present application provides a heat dissipation module and an electronic device that can improve heat dissipation effect.

[0004] In a first aspect, the present application provides a heat dissipation module, which is used to dissipate heat from a target heat source. The heat dissipation module includes:

[0005] a temperature-uniform layer, the temperature-uniform layer comprising a first shell, the first shell being configured to connect to the target heat source and absorb heat from the target heat source; and

[0006] A phase change layer, wherein the phase change layer is stacked with the temperature-uniform layer, the phase change layer includes a second shell and a phase change material, the second shell is connected to the first shell and together with the first shell constitutes a receiving space, the phase change material is arranged in the receiving space and is used to absorb heat from the first shell through phase change for heat dissipation.

[0007] In a second aspect, the present application further provides an electronic device, which includes a target heat source and the above-mentioned heat dissipation module, and the heat dissipation module is used to dissipate heat from the target heat source.

[0008] In the present application, the first and second shells together form a containment space. Placing the phase change material within the containment space prevents leakage of the phase change material to the outside world. Furthermore, since the containment space is formed by the first and second shells, the phase change material can directly contact the first shell. In other words, heat from the first shell can be directly transferred to the phase change material. This avoids the indirect transfer of heat to the phase change material through a carrier medium with low thermal conductivity. Therefore, the phase change material can obtain heat more quickly, avoiding the problem of incomplete phase change in the phase change material, thereby providing timely heat dissipation to the target heat source. Furthermore, since no carrier medium is required, the phase change material can be filled throughout the containment space. This increases the total volume of the phase change material, raising the effective enthalpy of the entire phase change layer, allowing it to absorb more heat and achieve better heat dissipation. Furthermore, since the containment space is formed by the first and second shells together, rather than by either the first or second shell alone, the overall thickness of the heat dissipation module can be reduced, making it particularly suitable for electronic devices requiring thinness and lightweight design. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the implementation. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] Figure 1 A schematic diagram of an electronic device provided in accordance with an embodiment of the present application.

[0011] Figure 2 A schematic diagram of an electronic device provided according to another embodiment of the present application.

[0012] Figure 3 A schematic diagram of an electronic device provided in yet another embodiment of the present application.

[0013] Figure 4 This is an exploded view of the heat dissipation module provided in an embodiment of the present application.

[0014] Figure 5 for Figure 4 The combination diagram of the heat dissipation module is shown.

[0015] Figure 6 This is a temperature comparison chart of the target heat source when it is dissipated by the heat dissipation module and the temperature vapor chamber respectively.

[0016] Figure 7 This is a comparison diagram of the surface temperature of the second shell of the heat dissipation module and the surface temperature of the temperature vapor chamber when the heat dissipation module and the temperature vapor chamber respectively dissipate heat from the target heat source.

[0017] Figure 8 for Figure 4 A schematic diagram of the second shell in the heat dissipation module is shown.

[0018] Figure 9 A schematic diagram of a heat dissipation module provided in another embodiment of the present application.

[0019] Figure 10 A schematic diagram of a heat dissipation module provided in yet another embodiment of the present application.

[0020] Figure 11 A schematic diagram of a heat dissipation module provided in yet another embodiment of the present application.

[0021] Figure 12 for Figure 11 Schematic diagram of the first heat conducting member and the first heat insulating member.

[0022] Figure 13 A schematic diagram of a heat dissipation module provided in yet another embodiment of the present application.

[0023] Figure 14 for Figure 13 Schematic diagram of the first heat conducting member, the first heat insulating member, the second heat conducting member, and the second heat insulating member. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0025] References herein to "embodiments" or "implementations" mean that a particular feature, structure, or characteristic described in connection with the embodiments or implementations may be included in at least one embodiment of the present application. The appearance of such phrases in various places in the specification does not necessarily refer to the same embodiment, nor do they constitute independent or alternative embodiments that are mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0026] With the gradual development of the 5G era, the power consumption of mobile phones and other terminal devices continues to increase, and their heat dissipation requirements are also increasing. In related technologies, phase change materials are used to dissipate heat from terminal devices. Because phase change materials release or absorb a large amount of heat when undergoing phase change, this heat can be directed to the phase change material based on this characteristic. When the temperature reaches the melting point of the phase change material, it melts and absorbs heat, thereby achieving a cooling effect. However, the phase change material heat dissipation solution used in related technologies has its heat dissipation effect limited.

[0027] In related technologies, phase change material solutions mainly include microsphere solution, mixed hot pressing solution, and sheet infiltration solution.

[0028] The microsphere solution is a paraffin microcapsule solution. In this solution, paraffin, polymer, and polyurethane materials together form a phase change heat sink. The phase change material is paraffin, and the paraffin is wrapped in a polymer shell, which is wrapped in a polyurethane material. However, this solution has two disadvantages: 1. The thermal conductivity of the polyurethane material is low, which makes it difficult for heat to be transferred to the paraffin; 2. In this structural form, the polyurethane material occupies most of the volume, resulting in a smaller volume of paraffin and a poor heat storage effect. Overall, the phase change enthalpy value of the microsphere solution is about 140 J / g, and the thermal conductivity is extremely low, which makes it difficult for heat to be transferred to the paraffin during actual use, and thus the heat storage effect is limited.

[0029] To address the above defects, a hybrid hot pressing scheme and a sheet infiltration scheme were developed.

[0030] The mixed hot pressing scheme is a graphite / paraffin mixed hot pressing scheme. In this scheme, graphite and paraffin together form a phase change heat sink, and the phase change material is paraffin, and graphite and paraffin are mixed together. However, this scheme has two disadvantages: 1. Although the thermal conductivity of graphite alone is relatively high, graphite and paraffin are mixed together, that is, the graphite components are basically discrete, and the thermal conductivity of discrete graphite is greatly reduced. 2. In this structural form, graphite will occupy most of the volume, resulting in a smaller volume of paraffin and a poor heat storage effect. Overall, compared with the microsphere scheme, although the thermal conductivity of the mixed hot pressing scheme has been improved, it is only about 100W / mK, and the phase change enthalpy value is generally only about 100J / g, so the heat storage effect is limited.

[0031] The sheet infiltration solution, specifically the graphene sheet infiltration solution, uses graphene and paraffin wax to form a phase-change heat sink. The phase-change material is paraffin wax, and the graphene has a mesh structure, with the paraffin wax nestled within the pores formed by the graphene. This solution suffers from similar shortcomings as the hybrid hot-pressing solution. While the thermal conductivity of the sheet infiltration solution is improved compared to the microsphere solution, it is still only around 100 W / mK, and the phase change enthalpy is generally only around 100 J / g, resulting in limited heat storage.

[0032] In summary, the phase change heat sinks formed by various phase change material solutions all have roughly the same problems: 1. The thermal conductivity of the phase change heat sink is low, which makes it difficult for heat to be transferred to the phase change material, resulting in incomplete phase change of the phase change material. 2. The phase change material in the phase change heat sink is not large, resulting in a low phase change enthalpy value. In other words, the enthalpy value of the phase change material encapsulated in polyurethane, graphite, and graphene is not high.

[0033] Based on this, the present application hopes to provide a solution that can solve but is not limited to the above-mentioned technical problems, the details of which will be explained in the subsequent embodiments.

[0034] Please refer to Figures 1 to 3 The present application provides an electronic device 1, which may be, but is not limited to, a mobile phone, a tablet, a laptop computer, a desktop computer, a television, a charger, etc. The electronic device 1 includes a target heat source 20 and a heat dissipation module 10 as described in any of the following embodiments. The heat dissipation module 10 is used to dissipate heat from the target heat source 20.

[0035] The target heat source 20 refers to one or more devices that generate heat when the electronic device 1 is working, such as a central processing unit (CPU), a graphics processing unit (GPU), a battery, a display screen, a camera module, etc.

[0036] The heat dissipation module 10 is used to absorb the heat of the target heat source 20 in a timely manner to prevent the electronic device 1 from freezing, restarting, or even being damaged due to excessive temperature. It should be noted that the heat dissipation module 10 can be directly connected to the target heat source 20 or indirectly connected to the target heat source 20.

[0037] Please refer to Figure 2 In one embodiment, the electronic device 1 includes a back cover 30 and a display screen 40. The heat dissipation module 10 and the target heat source 20 are disposed between the back cover 30 and the display screen 40, with the heat dissipation module 10 directly attached to the surface of the target heat source 20. It will be appreciated that in a direct connection, the heat conduction path between the target heat source 20 and the heat dissipation module 10 is the shortest, and the thermal resistance is also minimized. Therefore, the heat dissipation module 10 can promptly remove heat from the target heat source 20.

[0038] Please refer to Figure 3In another embodiment, the electronic device 1 includes a back cover 30 and a display screen 40. The target heat source 20 is disposed between the back cover 30 and the display screen 40. The heat dissipation module 10 is disposed on the side of the back cover 30 facing away from the display screen 40 and is connected to the back cover 30. The heat generated by the target heat source 20 during operation is directly or indirectly transferred to the back cover 30, and the heat on the back cover 30 is ultimately transferred to the heat dissipation module 10, thereby indirectly removing the heat from the target heat source 20. It will be appreciated that in the indirect connection form, the heat dissipation module 10 does not occupy the internal space of the electronic device 1, thereby reducing the volume of the electronic device 1.

[0039] Of course, the connection between the heat dissipation module 10 and the target heat source 20 is not limited to the above two examples, which will not be described one by one here.

[0040] The heat dissipation module 10 in the electronic device 1 provided in the above embodiment will be described in detail below with reference to the accompanying drawings.

[0041] Please refer to Figure 4 and Figure 5 The present application also provides a heat dissipation module 10 for dissipating heat from a target heat source 20. The heat dissipation module 10 includes a temperature-uniform layer 110 and a phase-change layer 120. It should be noted that in the relevant drawings, the direction indicated by the dotted arrows is the direction of heat transfer.

[0042] The temperature-balancing layer 110 includes a first shell 111 , and the first shell 111 is used to connect to the target heat source 20 and absorb heat from the target heat source 20 .

[0043] The phase change layer 120 is stacked with the temperature-balancing layer 110. The phase change layer 120 includes a second housing 122 and a phase change material 121. The second housing 122 is connected to the first housing 111 and together with the first housing 111 form a receiving space X1. The phase change material 121 is disposed within the receiving space X1 and is configured to absorb heat from the first housing 111 through phase change to dissipate heat.

[0044] Specifically, the projected shape of the heat dissipation module 10 can be, but is not limited to, rectangular, circular, or elliptical, depending on specific needs. The thickness of the heat dissipation module 10 can be in the range of 0.4 mm to 10 mm, such as 0.4 mm, 0.5 mm, 0.6 mm, 0.8 mm, 1 mm, 1.5 mm, 1.8 mm, 2 mm, 2.3 mm, 2.5 mm, 3 mm, 3.6 mm, 4 mm, 4.6 mm, 5 mm, 5.2 mm, 6 mm, 6.6 mm, 7 mm, 7.5 mm, 8 mm, 8.6 mm, 9 mm, 9.5 mm, and 10 mm.

[0045] The temperature-averaging layer 110 absorbs heat from the heat source and then transfers it to other locations to achieve a uniform temperature across the entire device. The thickness of the temperature-averaging layer 110 can range from 0.2 mm to 5 mm, such as 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.8 mm, 1 mm, 1.6 mm, 2 mm, 2.3 mm, 2.5 mm, 2.9 mm, 3 mm, 3.2 mm, 3.6 mm, 4 mm, 4.5 mm, and 5 mm.

[0046] The phase change material 121 (PCM) can also be called a phase change heat storage material, a phase change energy storage material, etc., which refers to a substance that releases or absorbs a large amount of heat during phase change to achieve heating or cooling effects. The phase change material 121 can be paraffin (CnH2n+2), polyols, hydrated salts, or liquid metals. The thickness of the phase change layer 120 can be in the range of 0.2mm to 5mm, such as 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.8mm, 1mm, 1.6mm, 2mm, 2.3mm, 2.5mm, 2.9mm, 3mm, 3.2mm, 3.6mm, 4mm, 4.5mm, and 5mm.

[0047] The heat dissipation principle of the heat dissipation module 10 is as follows: when the target heat source 20 generates heat, the heat is transferred from the target heat source 20 to the first shell 111 of the temperature-balancing layer 110. The heat is then transferred through the first shell 111 to the phase-change material 121. Due to the heat accumulation, the temperature of the phase-change material 121 rises. When the temperature reaches the melting point of the phase-change material 121, the phase-change material 121 melts and absorbs heat, thereby dissipating heat from the target heat source 20. When the target heat source 20 stops working, the temperature of the phase-change material 121 drops below its melting point, slowly solidifying and releasing heat. The phase-change material 121 returns to its initial state, allowing the target heat source 20 to absorb heat normally when it resumes operation.

[0048] In this embodiment, the first shell 111 and the second shell 122 together form a receiving space X1. The phase change material 121 is arranged in the receiving space X1 to prevent the phase change material 121 from leaking to the outside. At the same time, since the receiving space X1 is composed of the first shell 111 and the second shell 122, this means that the phase change material 121 can directly contact the first shell 111. In other words, the heat on the first shell 111 can be directly transferred to the phase change material 121. This avoids the indirect transfer of heat to the phase change material 121 through a carrier medium with low thermal conductivity (such as the above-mentioned polyurethane, graphite, and graphene) in the related art. Therefore, the phase change material 121 can obtain heat more quickly, avoiding the problem of incomplete phase change of the phase change material 121, thereby timely achieving a heat dissipation effect on the target heat source 20. Furthermore, since the carrier medium is eliminated, the phase change material 121 can be filled within the entire receiving space X1. Consequently, the total volume of the phase change material 121 increases, and the effective enthalpy of the entire phase change layer 120 is increased, thereby absorbing more heat and achieving better heat dissipation. Furthermore, since the receiving space X1 is formed by the first shell 111 and the second shell 122, rather than by either the first shell 111 or the second shell 122 alone, the overall thickness of the heat dissipation module 10 can be reduced, making it particularly suitable for electronic devices 1 that require thinness and lightness.

[0049] Furthermore, the second shell 122 absorbs heat from the first shell 111 and transfers it to the phase change material 121. The second shell 122 can be made of a metal material such as copper alloy, aluminum alloy, stainless steel, or a stainless steel-copper composite. Metal materials have high thermal conductivity, which helps improve the heat transfer process from the target heat source 20 along the first shell 111, the second shell 122, and the phase change material 121. This allows the phase change material 121 to obtain heat from the second shell 122 more quickly and obtain more heat from the second shell 122.

[0050] In this embodiment, since the second shell 122 can transfer heat to the phase change material 121, it is equivalent to adding a path for the phase change material 121 to obtain heat, that is, there are two paths for the phase change material 121 to obtain heat: 1. Heat is transferred directly from the first shell 111 to the phase change material 121; 2. Heat is transferred from the first shell 111 to the second shell 122, and then from the second shell 122 to the phase change material 121.

[0051] It is understandable that for the phase change material 121, the farther away from the uniform temperature layer 110, the less heat it obtains, the slower the temperature rises, and the less likely it is to achieve the melting and heat absorption effect. In this embodiment, since the phase change material 121 is disposed within the receiving space X1, the second shell 122 can transfer heat to the position of the phase change material 121 away from the uniform temperature layer 110. This can ensure that sufficient heat is obtained at all positions of the phase change material 121 to a certain extent. In other words, more phase change material 121 can participate in heat absorption and achieve the melting and heat absorption effect, so that the target heat source 20 can be cooled more promptly.

[0052] The temperature-uniform layer 110 in the heat dissipation module 10 will be described below with reference to the accompanying drawings.

[0053] Please refer to Figure 4 and Figure 5 The first shell 111 has a liquid collection space X2 and a vapor chamber X3. The liquid collection space X2 is located at the end of the first shell 111 away from the phase change layer 120. The vapor chamber X3 is located at the end of the first shell 111 close to the phase change layer 120. The temperature-balancing layer 110 also includes a liquid and a liquid wick 112. The liquid wick 112 is disposed in the liquid collection space X2 and is configured to absorb the liquid. The liquid absorbs heat from the first shell 111 and evaporates to form vapor, which then enters the vapor chamber X3.

[0054] Specifically, the temperature-averaging layer 110 can also be referred to as a heat spreader, a heat spreader, a heat spreader, etc. The liquid is a working medium, which can be but is not limited to water. The temperature-averaging layer 110 is used to absorb the heat of the target heat source 20 and distribute the heat evenly. Specifically, the temperature-averaging layer 110 has a cold end and a hot end, wherein the hot end is used to connect the target heat source 20. When the first shell 111 at the hot end absorbs heat, the liquid at the hot end absorbs heat and evaporates to form vapor and enters the vapor chamber X3. Since the hot end is a high-pressure area and the cold end is a low-pressure area, the vapor carrying heat will autonomously diffuse from the hot end to the cold end. In this process, when the vapor contacts the first shell 111 with a lower temperature, it will condense into liquid and release a large amount of heat, which is transferred to the first shell 111. The liquid formed by cooling is absorbed by the liquid wick 112 and returns to the liquid collection space X2, eventually forming a two-phase circulation system in which liquid and gas coexist.

[0055] It is understood that during the flow of steam, heat can be transferred relatively evenly to the end of the first shell 111 near the phase change layer 120, thereby making the temperature of the first shell 111 in contact with the phase change material 121 relatively uniform. Therefore, in the direction perpendicular to the relative direction of the temperature-balancing layer 110 and the phase change layer 120, the phase change material 121 can obtain heat evenly, thereby ensuring that all phase change materials 121 participate in the heat absorption process, thereby achieving a timely heat dissipation effect on the target heat source 20.

[0056] From the overall point of view, the present application creatively combines the temperature-averaging layer 110 and the phase change layer 120 together, and first uses the temperature-averaging layer 110 to achieve temperature uniformity, and then uses the phase change material 121 to achieve heat storage, thereby effectively reducing the temperature of the target heat source 20 and the surface temperature of the second shell 122 (such as Figure 6 and Figure 7 ), improving the temperature rise experience in transient scenarios.

[0057] It should be noted that Figure 6 1 is a temperature comparison diagram of the target heat source 20 when the target heat source 20 uses the heat dissipation module 10 (temperature balancing layer 110 + phase change layer 120) and the temperature balancing plate (temperature balancing layer 110 + temperature balancing layer 110) to dissipate heat. Figure 7 The figure shows a comparison of the surface temperature of the second shell 122 of the heat dissipation module 10 and the surface temperature of the temperature equalizing plate when the heat dissipation module 10 (temperature equalizing layer 110 + phase change layer 120) and the temperature equalizing plate (temperature equalizing layer 110 + temperature equalizing layer 110) are respectively dissipating heat to the target heat source 20. Among them, for the heat dissipation module 10, the thickness of the temperature equalizing layer 110 is 0.25mm, the thickness of the phase change layer 120 is 0.25mm, and the superimposed thickness of the temperature equalizing layer 110 and the phase change layer 120 is 0.5mm. For the temperature equalizing plate, the thickness of the two temperature equalizing layers 110 is 0.25mm, and the total thickness of the two temperature equalizing layers 110 after superposition is 0.5mm. Figure 6 It can be seen that during the period from 50 seconds to 600 seconds, the temperature of the target heat source 20 dissipated by the heat dissipation module 10 is lower than that of the target heat source 20 dissipated by the vapor chamber. Figure 7 It can be seen that during the period from 50 seconds to 600 seconds, the surface temperature of the heat dissipation module 10 is lower than the surface temperature of the temperature vapor chamber.

[0058] Please refer to Figure 4 and Figure 5, the first shell 111 includes a heat-absorbing shell 1111 and a heat-transfer shell 1112 connected to each other. The heat-absorbing shell 1111 is used to absorb the heat of the target heat source 20. The heat-transfer shell 1112 and the heat-absorbing shell 1111 together constitute the liquid collection space X2 and the vapor chamber X3. The heat-transfer shell 1112 is connected to the second shell 122 to jointly enclose the receiving space X1. The heat-transfer shell 1112 is used to transfer heat from the heat-absorbing shell 1111 to the phase change material 121 in the receiving space X1. The material of the heat-absorbing shell 1111 and the heat-transfer shell 1112 can be the same as the material of the second shell 122.

[0059] In this embodiment, the heat dissipation module 10 comprises three layers of housing: a heat absorbing housing 1111, a heat conducting housing 1112, and a second housing 122. All three layers of housing can be made of metal. In terms of manufacturing, the three layers of metal housing can be directly formed by etching or stamping, and then brazed or laser welded together. Alternatively, the three layers of housing can be bonded together using an adhesive medium 130 such as glue or double-sided tape.

[0060] Please refer to Figure 4 , the first shell 111 further includes a support column 1113, and the support column 1113 is protruded on the side of the heat transfer shell 1112 away from the second shell 122. In one embodiment, the end of the support column 1113 away from the heat transfer shell 1112 can abut against the heat absorption shell 1111. In another embodiment, the end of the support column 1113 away from the heat transfer shell 1112 can also abut against the liquid absorbent core 112. It can be understood that the above two embodiments can increase the strength of the temperature balancing layer 110 as a whole. Moreover, by providing the support column 1113, the steam can transfer heat to the support column 1113, and the support column 1113 then transfers the heat to the heat transfer shell 1112, which is conducive to the steam transferring heat to the heat transfer shell 1112.

[0061] Please refer to Figure 8 The second shell 122 includes a first sub-shell 1221, a second sub-shell 1222, and a third sub-shell 1223 that are bent and connected in sequence. The first sub-shell 1221, the second sub-shell 1222, the third sub-shell 1223, and the first shell 111 are collectively enclosed to form the receiving space X1. The second sub-shell 1222 is opposite to and spaced from the first shell 111. The first sub-shell 1221 and the third sub-shell 1223 are opposite to and spaced from each other. The opposite ends of the first sub-shell 1221 and the third sub-shell 1223 are respectively connected to the second sub-shell 1222 and the first shell 111.

[0062] In this embodiment, there are four detailed heat transfer paths: 1. Heat is transferred from the first shell 111 to the phase change material 121; 2. Heat is transferred from the first shell 111 to the first sub-shell 1221, and then from the first sub-shell 1221 to the phase change material 121; 3. Heat is transferred from the first shell 111 to the third sub-shell 1223, and then from the third sub-shell 1223 to the phase change material 121; 4. Heat is transferred from the first sub-shell 1221 and the third sub-shell 1223 to the second sub-shell 1222, and then from the second sub-shell 1222 to the phase change material 121.

[0063] In this embodiment, from an overall perspective, the phase change material 121 can obtain heat in the circumferential direction, so that each position of the phase change material 121 can obtain sufficient heat. The phase change material 121 as a whole is more likely to achieve the effect of melting and absorbing heat, so that the heat dissipation effect on the target heat source 20 can be achieved more timely.

[0064] The following describes various forms of the heat dissipation module 10 including the first heat conducting member 140 and / or the second heat conducting member 150 in conjunction with the accompanying drawings. The first heat conducting member 140 and the second heat conducting member 150 are both made of a material with high thermal conductivity, and can be made of the same material as the first housing 111.

[0065] Please refer to Figure 9 In one embodiment, the heat dissipation module 10 further includes a first heat conductive member 140, which is inserted into the phase change material 121 and connected to the first shell 111 and the second shell 122. In this embodiment, the first heat conductive member 140 can play three roles: 1. The first heat conductive member 140 can guide the heat from the first shell 111 to the second shell 122, so that the second shell 122 obtains more heat, so that the second shell 122 can transfer more heat to the edge of the phase change material 121; 2. The first heat conductive member 140 is inserted into the phase change material 121, so that the interior of the phase change material 121 can also absorb more heat in a short time, avoiding the problem of incomplete phase change of the phase change material 121; 3. The first heat conductive member 140 is connected to the first shell 111 and the second shell 122 at the same time, which can increase the overall strength of the heat dissipation module 10.

[0066] Please refer to Figure 9In a first implementation of an embodiment, the opposite ends of the first heat conductor 140 are respectively connected to the first shell 111 and the second sub-shell 1222. It can be understood that, according to the heat transfer characteristics, the farther away from the temperature-averaging layer 110, the less heat is obtained in the same time, or the time to obtain the same amount of heat is longer. This is true for the phase change material 121 and the first shell 111. Since the second sub-shell 1222 is the farthest from the first sub-shell 1221 and the third sub-shell 1223, and the first sub-shell 1221 and the third sub-shell 1223 will also transfer part of the heat to the phase change material 121 in contact therewith, the heat obtained by the second sub-shell 1222 in the same time is certainly less than that of the first sub-shell 1221 and the third sub-shell 1223. In this embodiment, the second sub-shell 1222 is connected to the first shell 111 through the first heat conductor 140, so that the heat of the first shell 111 can be guided to the second sub-shell 1222 more quickly, so that the phase change material 121 in contact with the second sub-shell 1222 can obtain more heat earlier, faster, and thus achieve a more timely heat dissipation effect on the target heat source 20.

[0067] In a second implementation manner of an embodiment, opposite ends of the first heat conducting member 140 are connected to the first housing 111 and the first sub-housing 1221 respectively.

[0068] In a third implementation manner of an embodiment, two opposite ends of the first heat conducting member 140 are connected to the first housing 111 and the third sub-housing 1223 respectively.

[0069] Of course, based on an embodiment, there are also configuration forms other than the above three implementation modes, which are not described here one by one.

[0070] Please refer to Figure 10 In the second embodiment, the heat dissipation module 10 further includes a first heat conducting member 140, which is inserted into the phase change material 121 and connected to the second housing 122. In this embodiment, the first heat conducting member 140 can play the following role: the first heat conducting member 140 is inserted into the phase change material 121, so that the interior of the phase change material 121 can absorb more heat in a short period of time, thereby avoiding the problem of incomplete phase change of the phase change material 121.

[0071] Please refer to Figure 10In the first implementation of the second embodiment, the first heat conductor 140 is connected to the first sub-shell 1221 and / or the third sub-shell 1223. That is to say, the first heat conductor 140 can be connected only to the first sub-shell 1221, or the first heat conductor 140 can be connected only to the third sub-shell 1223, or the opposite ends of the first heat conductor 140 can be connected to the first sub-shell 1221 and the third sub-shell 1223 respectively. It can be understood that according to the heat transfer characteristics, since the first sub-shell 1221 and the third sub-shell 1223 are directly connected to the first shell 111, the first sub-shell 1221 and the third sub-shell 1223 can obtain heat faster than the second sub-shell 1222. By connecting the first heat conductor 140 to the first sub-shell 1221 and / or the second sub-shell 1222, heat can be quickly transferred to the phase change material 121 through the first heat conductor 140. In addition, if the opposite ends of the first heat conducting member 140 are respectively connected to the first sub-shell 1221 and the third sub-shell 1223 , the strength of the second housing 122 can be further increased.

[0072] In the second implementation of the second embodiment, the first heat conducting member 140 may also be connected to the second sub-shell 1222 .

[0073] Please refer to Figure 11 In the third embodiment, the heat dissipation module 10 further includes a first heat conductive member 140, which is inserted into the phase change material 121 and connected to the first shell 111. In this embodiment, the first heat conductive member 140 can play the following roles: 1. The first heat conductive member 140 is inserted into the phase change material 121, so that the interior of the phase change material 121 can also absorb more heat in a short time, thereby avoiding the problem of incomplete phase change of the phase change material 121. 2. Since the first shell 111 is the first part of the heat dissipation module 10 to obtain heat, connecting the first heat conductive member 140 to the first shell 111 can transfer more heat to the phase change material 121 faster through the first heat conductive member 140.

[0074] Please refer to Figure 11 and Figure 12 In the first implementation of the third embodiment, the first heat conducting member 140 includes a first connecting portion 141 and a first longitudinal heat transfer portion 142. The first connecting portion 141 has opposite ends connected to the first longitudinal heat transfer portion 142 and the first shell 111, respectively. The first longitudinal heat transfer portion 142 is inserted into the phase change material 121 and is spaced apart from the first shell 111 and the second shell 122. The first longitudinal heat transfer portion 142 is configured to transfer heat to the phase change material 121 in a first direction. The first direction is the relative direction between the first shell 111 and the second shell 122.

[0075] Specifically, the first connecting portion 141 and the first longitudinal heat transfer portion 142 of the first heat conductor 140 form a "T" shape. The dimension of the first longitudinal heat transfer portion 142 in the direction from the first sub-shell 1221 toward the third sub-shell 1223 is greater than the dimension of the first longitudinal heat transfer portion 142 in the direction from the first housing 111 toward the second housing 122 (i.e., the first direction). Therefore, the first longitudinal heat transfer portion 142 transfers the majority of heat in the first direction to the phase change material 121. Furthermore, the first longitudinal heat transfer portion 142 is disposed between the first housing 111 and the second sub-shell 1222, and is disposed opposite the second sub-shell 1222, and opposite the first housing 111.

[0076] It is understandable that, since the phase change material 121 is enclosed in the first shell 111 and the second shell 122, the edge of the phase change material 121 receives heat before the interior. In this embodiment, the first connecting portion 141 can guide the heat of the first shell 111 to the first longitudinal heat transfer portion 142, so that the first longitudinal heat transfer portion 142 can be regarded as a heat source inserted into the phase change material 121 to transfer heat to the phase change material 121, so that the interior of the phase change material 121 can also absorb heat in a timely manner. In addition, since the first longitudinal heat transfer portion 142 and the second shell 122 are spaced apart, there is no direct heat exchange between the first longitudinal heat transfer portion 142 and the second shell 122, thereby avoiding the second sub-shell 1222 from not being able to obtain heat in a timely manner, thereby ensuring that enough heat can be guided to the interior of the phase change material 121.

[0077] It should be noted that the number of the first connection portion 141 can be one. Of course, the number of the first connection portions 141 can also be multiple, and the multiple first connection portions 141 are arranged at intervals. It can be understood that the more the number of first connection portions 141, the more heat the first longitudinal heat transfer portion 142 obtains per unit time, and the temperature of the first longitudinal heat transfer portion 142 is more uniform, thereby achieving a more timely heat dissipation effect on the target heat source 20.

[0078] Please refer to further Figure 11 and Figure 12 , the first heat conductor 140 also includes a first transverse heat transfer portion 143. The first transverse heat transfer portion 143 is protruded on the first longitudinal heat transfer portion 142 along the first direction. The first transverse heat transfer portion 143 is used to transfer heat to the phase change material 121 in the second direction. The second direction is not parallel to the first direction. It should be noted that the first direction and the second direction can be perpendicular to each other (that is, the second direction is the relative direction of the first sub-shell 1221 and the third sub-shell 1223), or they can be relatively inclined (that is, not perpendicular). The following is only an exemplary explanation of the perpendicularity.

[0079] Specifically, the dimension of the first transverse heat transfer portion 143 in the first direction is greater than the dimension of the first transverse heat transfer portion 143 in the second direction. Therefore, the first transverse heat transfer portion 143 will transfer most of the heat to the phase change material 121 in the second direction. There can be multiple first transverse heat transfer portions 143, and the multiple first transverse heat transfer portions 143 are arranged at intervals. The multiple first transverse heat transfer portions 143 can also be staggered to ensure that heat can be obtained at multiple locations inside the phase change material 121, so that the heat is uniform. The first transverse heat transfer portion 143 can be protruded from the side of the first longitudinal heat transfer portion 142 close to the second sub-shell 1222, or it can be protruded from the side of the first longitudinal heat transfer portion 142 close to the first shell 111.

[0080] In this embodiment, due to the provision of the first transverse heat transfer portion 143, the first transverse heat transfer portion 143, the first sub-shell 1221, and the third sub-shell 1223 can collectively transfer heat to the phase change material 121 in the second direction. Simultaneously, the first longitudinal heat transfer portion 142, the first housing 111, and the second sub-shell 1222 can collectively transfer heat to the phase change material 121 in the first direction. This arrangement ensures that both the outer edges and the interior of the phase change material 121 receive heat promptly, thereby providing a more timely heat dissipation effect on the target heat source 20.

[0081] Please refer to Figure 11 and Figure 12 The heat dissipation module 10 further includes a first thermal insulation member 160, which covers the outer side of the first connecting portion 141. The first thermal insulation member 160 is used to prevent heat transfer between the first connecting portion 141 and the phase change material 121. Optionally, the thermal conductivity of the thermal insulation member is greater than the thermal conductivity of the phase change material 121.

[0082] Specifically, since the first connecting portion 141 is located within the phase-change material 121, if the first connecting portion 141 and the phase-change material 121 are not thermally insulated, the heat from the first connecting portion 141 will be prematurely transferred to the phase-change material 121 in contact with it, while the heat transferred to the first longitudinal heat transfer portion 142 and the first transverse heat transfer portion 143 will be reduced. Therefore, covering the outside of the first connecting portion 141 with the first thermal insulator 160 can prevent the first connecting portion 141 from transferring heat to the phase-change material 121, thereby enhancing the process of heat transfer from the first connecting portion 141 to the first longitudinal heat transfer portion 142.

[0083] Please refer to Figure 13 and Figure 14In the second implementation of the third embodiment, the heat dissipation module 10 further includes a second heat conducting member 150, which includes a second connecting portion 151 and a second longitudinal heat transfer portion 152. The opposite ends of the second connecting portion 151 are respectively connected to the second longitudinal heat transfer portion 152 and the second shell 122. The second longitudinal heat transfer portion 152 is disposed between the first longitudinal heat transfer portion 142 and the first shell 111. The second longitudinal heat transfer portion 152 is spaced apart from the first longitudinal heat transfer portion 142 and the first shell 111 and is inserted into the phase change material 121. The second longitudinal heat transfer portion 152 is used to transfer heat to the phase change material 121 in the first direction.

[0084] Specifically, the second heat conductor 150 has the same function as the first heat conductor 140, and is also used to guide the heat on the first shell 111 to the phase change material 121. The second heat conductor 150 includes a second connecting portion 151 and a second longitudinal heat transfer portion 152. The second connecting portion 151 is used to guide the heat on the first shell 111 to the second longitudinal heat transfer portion 152. The size of the second longitudinal heat transfer portion 152 in the direction from the first sub-shell 1221 to the third sub-shell 1223 is larger than the size of the second longitudinal heat transfer portion 152 in the direction from the first shell 111 to the second shell 122. Therefore, the second longitudinal heat transfer portion 152 can transfer most of the heat to the phase change material 121 along the first direction. It can be understood that after the second heat conductor 150 is provided, the first heat conductor 140 and the second heat conductor can guide the heat to the interior of the phase change material 121 more quickly, and this structural form is more suitable for the case where the phase change material 121 is thicker in the first direction. Of course, in other embodiments, a third heat conducting member, a fourth heat conducting member, etc. may also be provided, depending on the actual situation and is not limited here.

[0085] Please refer to Figure 14 Optionally, the heat dissipation module 10 may further include a second thermal insulation member 170 , which covers the outer side of the second connecting portion 151 , and is used to prevent heat transfer between the second connecting portion 151 and the phase change material 121 .

[0086] Please refer to Figure 14 Optionally, a through hole X4 is provided on the second longitudinal heat transfer portion 152, and the through hole X4 penetrates the second longitudinal heat transfer portion 152 in the first direction. The first thermal insulation member 160 is inserted into the through hole X4. The first thermal insulation member 160 is also used to prevent heat transfer between the second longitudinal heat transfer portion 152 and the first connecting portion 141. This ensures that heat exchange occurs between the first heat conductive member 140 and the second heat conductive member 150, thereby ensuring that heat is evenly distributed within the phase change material 121.

[0087] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A heat dissipation module, characterized in that: The heat dissipation module is used to dissipate heat from a target heat source, and the heat dissipation module includes: A temperature-averaging layer, the temperature-averaging layer comprising a first shell, the first shell being used to connect the target heat source and absorb heat from the target heat source; and A phase change layer, wherein the phase change layer is stacked with the temperature-averaging layer, the phase change layer comprises a second shell and a phase change material, the second shell is connected to the first shell and together with the first shell constitutes a receiving space, the phase change material is arranged in the receiving space and is used to absorb heat from the first shell through phase change to dissipate heat.

2. The heat dissipation module according to claim 1, characterized in that: The second shell absorbs heat from the first shell and transfers the heat to the phase change material.

3. The heat dissipation module according to claim 1, characterized in that: The second shell includes a first sub-shell, a second sub-shell, and a third sub-shell connected in sequence, and the first sub-shell, the second sub-shell, the third sub-shell, and the first shell are jointly arranged to form the accommodating space, wherein the second sub-shell is opposite to and spaced from the first shell, the first sub-shell and the third sub-shell are opposite to and spaced from each other, and the opposite ends of the first sub-shell and the third sub-shell are respectively connected to the second sub-shell and the first shell.

4. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module further includes a first heat conducting member, which is inserted into the phase change material and connected to the first shell and the second shell.

5. The heat dissipation module according to claim 4, characterized in that: The second shell includes a second subshell, the second subshell is opposite to the first shell and is spaced apart from the first shell, and opposite ends of the first heat conducting member are respectively connected to the first shell and the second subshell.

6. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module further includes a first heat conducting member, which is inserted into the phase change material and connected to the second shell.

7. The heat dissipation module according to claim 6, characterized in that: The second shell includes a first subshell and a third subshell, the first subshell and the third subshell are arranged opposite to each other and spaced apart, and both the first subshell and the third subshell are connected to the first shell, and the first heat conductor is connected to the first subshell and / or the third subshell.

8. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module further includes a first heat conducting member, which is inserted into the phase change material and connected to the first shell.

9. The heat dissipation module according to claim 8, characterized in that: The first heat-conducting member includes a first connecting portion and a first longitudinal heat transfer portion, the opposite ends of the first connecting portion are respectively connected to the first longitudinal heat transfer portion and the first shell, the first longitudinal heat transfer portion is inserted in the phase change material, and the first longitudinal heat transfer portion is spaced apart from the first shell and the second shell, and the first longitudinal heat transfer portion is used to transfer heat to the phase change material in a first direction, wherein the first direction is a relative direction of the first shell and the second shell.

10. The heat dissipation module according to claim 9, characterized in that: The first heat conducting member further comprises a first transverse heat transfer portion, which is protruding from the first longitudinal heat transfer portion along the first direction, and is used to transfer heat to the phase change material in a second direction, wherein the second direction is not parallel to the first direction.

11. The heat dissipation module according to claim 9, characterized in that: The heat dissipation module further includes a first heat insulating member, which covers the outer side of the first connecting portion and is used to prevent heat transfer between the first connecting portion and the phase change material.

12. The heat dissipation module according to claim 9, characterized in that: The heat dissipation module also includes a second heat conductive member, which includes a second connecting portion and a second longitudinal heat transfer portion, the opposite ends of the second connecting portion are respectively connected to the second longitudinal heat transfer portion and the second shell, the second longitudinal heat transfer portion is arranged between the first longitudinal heat transfer portion and the first shell, and the second longitudinal heat transfer portions are spaced apart from the first longitudinal heat transfer portion and the first shell, and are inserted in the phase change material, and the second longitudinal heat transfer portion is used to transfer heat to the phase change material in a first direction.

13. The heat dissipation module according to any one of claims 1 to 12, characterized in that: The first shell has a liquid collection space and a vapor chamber, wherein the liquid collection space is located at an end of the first shell away from the phase change layer, and the vapor chamber is located at an end of the first shell close to the phase change layer. The temperature equalizing layer also includes a liquid absorbent core, which is arranged in the liquid collection space. The liquid absorbent core is used to absorb liquid, and the liquid is used to absorb the heat of the first shell and evaporate to form vapor and then enter the vapor chamber.

14. The heat dissipation module according to any one of claims 1 to 12, characterized in that: The first shell includes a heat absorbing shell and a heat transfer shell connected to each other, the heat absorbing shell is used to absorb the heat of the target heat source, the heat transfer shell is connected to the second shell to jointly enclose the receiving space, and the heat transfer shell is used to transfer the heat from the heat absorbing shell to the phase change material in the receiving space.

15. An electronic device, characterized in that: The electronic device comprises a target heat source and a heat dissipation module as claimed in any one of claims 1 to 14, wherein the heat dissipation module is used to dissipate heat from the target heat source.

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