Manufacturing method of display panel, display panel and display device

Abstract

The embodiment of the invention provides a manufacturing method of a display panel, the display panel and a display device, relates to the technical field of display, and aims to optimize the performance of the display panel. The manufacturing method of the display panel comprises the following steps: forming a light-emitting device layer on one side of a substrate, wherein the light-emitting device layer comprises a plurality of light-emitting elements; forming a first light control layer on one side, far away from the substrate, of the light emitting device layer, wherein the first light control layer comprises a plurality of openings which are mutually spaced; a second light control layer is formed, at least part of the second light control layer is located in the opening, the second light control layer comprises resin and dye, light curing treatment and heat curing treatment are carried out in the process of forming the second light control layer, and the light curing treatment is earlier than the heat curing treatment.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a method for manufacturing a display panel, a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display panels are widely used in various display products due to their excellent properties such as self-luminescence, fast response and high efficiency.

[0003] In order to reduce reflection, such display panels are usually provided with a filter structure for filtering ambient light. However, the performance of existing filter structures is poor, resulting in the anti-reflection capability of the display panel needing to be further improved. Summary of the invention

[0004] Embodiments of the present invention provide a method for manufacturing a display panel, a display panel, and a display device, so as to optimize the performance of the display panel.

[0005] In a first aspect, an embodiment of the present invention provides a method for manufacturing a display panel, comprising:

[0006] forming a light-emitting device layer on one side of the substrate, wherein the light-emitting device layer includes a plurality of light-emitting elements;

[0007] forming a first light control layer on a side of the light emitting device layer away from the substrate, wherein the first light control layer comprises a plurality of openings spaced apart from each other;

[0008] A second light control layer is formed, at least a portion of which is located within the opening, and the second light control layer includes a resin and a dye, wherein photocuring and thermal curing are performed during the formation of the second light control layer, and the photocuring is performed earlier than the thermal curing.

[0009] In a second aspect, based on the same inventive concept, an embodiment of the present invention further provides a display panel, including:

[0010] substrate;

[0011] A light-emitting device layer located on one side of the substrate, the light-emitting device layer comprising a plurality of light-emitting elements;

[0012] A first light control layer located on a side of the light emitting device layer away from the substrate, the first light control layer comprising a plurality of openings spaced apart from each other;

[0013] A second light control layer, at least a portion of the second light control layer is located in the opening, wherein the second light control layer comprises a resin and a dye.

[0014] In a third aspect, based on the same inventive concept, an embodiment of the present invention further provides a display device, comprising the above-mentioned display panel.

[0015] The above technical solution provided by the embodiment of the present invention has the following beneficial effects:

[0016] In the process of forming the second light control layer, before the film layer to be treated is subjected to heat curing treatment, a process of photocuring treatment of the film layer to be treated is added. The specific process of forming the second light control layer can be: first, some resin composition materials are arranged on one side of the first light control layer to form the film layer to be treated. In addition to the dye and the base resin, the resin composition material can also include a photoinitiator and a thermal initiator. Then, the film layer to be treated is subjected to light curing treatment. In this process, under the action of the photoinitiator, the double bonds of the free monomers in the resin composition material will open, and then react with the unsaturated bonds of the base resin to achieve cross-linking and curing, so that the monomers and the resin molecules are connected together. After the light curing is completed, the film layer to be treated is subjected to heat curing treatment. In this process, under the action of the thermal initiator, the double bonds of the monomers that are not opened during the light curing process will open, so that the monomers and the resin molecules are connected more closely, the degree of cross-linking is further increased, and the network structure is more dense.

[0017] Through the two curing processes of light curing and heat curing, the curing degree of the second light control layer can be significantly improved, and the density of the second light control layer material can be significantly improved. In this way, the pores of the second light control layer material are denser, which can effectively intercept the movement of the dye, making it more difficult for the dye to diffuse and not easily migrate to other film layers. The filtering performance of the second light control layer is more stable, and the anti-reflection performance of the display panel will also be better.

[0018] In addition, photocuring treatment is used to improve the overall curing rate of the second light control layer. The curing degree of the second light control layer is relatively high and uniform, whether it is the upper part far away from the substrate or the lower part close to the substrate. This can intercept the movement of the dye at various positions and the movement of the dye in various directions, and the improvement effect on the migration of the dye will be better. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] Figure 1 A schematic diagram of the structure of a display panel provided by an embodiment of the present invention;

[0021] Figure 2 A flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0022] Figure 3 A structural flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0023] Figure 4 Another structural flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0024] Figure 5 A schematic diagram of a cross-linking reaction provided by an embodiment of the present invention;

[0025] Figure 6 Another schematic diagram of a cross-linking reaction provided by an embodiment of the present invention;

[0026] Figure 7 A further structural flow chart of a method for manufacturing a display panel provided in an embodiment of the present invention;

[0027] Figure 8 Another structural flow chart of the method for manufacturing a display panel provided by an embodiment of the present invention;

[0028] Fig. 9 Another schematic diagram of the structure of a display panel provided by an embodiment of the present invention;

[0029] Fig.10 Another structural flow chart of the method for manufacturing a display panel provided by an embodiment of the present invention;

[0030] Fig.11 A schematic diagram of the structure of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0031] In order to better understand the technical solution of the present invention, the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0032] It should be clear that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0034] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0035] An embodiment of the present invention provides a method for manufacturing a display panel, such as Figure 1 to Figure 3 As shown, Figure 1 A schematic diagram of the structure of a display panel provided by an embodiment of the present invention is shown in FIG. Figure 2 A flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention, Figure 3 A structural flow chart of a method for manufacturing a display panel provided in an embodiment of the present invention, the manufacturing method comprising:

[0036] Step S1 : forming a light-emitting device layer 2 on one side of a substrate 1 , wherein the light-emitting device layer 2 includes a plurality of light-emitting elements 3 .

[0037] More specifically, the light emitting device layer 2 further includes a pixel definition layer 4, and the pixel definition layer 4 includes a plurality of pixel openings 5. The light emitting element 3 includes an anode 6, a light emitting layer 7 and a cathode 8, wherein the light emitting layer 7 is located in the pixel opening 5.

[0038] Step S2: forming a first light control layer 9 on a side of the light emitting device layer 2 away from the substrate 1 , wherein the first light control layer 9 includes a plurality of openings 10 spaced apart from each other.

[0039] The first light control layer 9 may include a black light-shielding or light-absorbing material. In a direction perpendicular to the plane where the substrate 1 is located, the plurality of openings 10 overlap with the plurality of light-emitting elements 3 respectively, and the size of the openings 10 may be larger than the size of the corresponding pixel openings 5, that is, in a direction perpendicular to the plane where the substrate 1 is located, the pixel openings 5 ​​are located within the corresponding openings 10, and the edges of the openings 10 overlap with the pixel definition layer 4, so that some large-angle light emitted by the light-emitting element 3 can be emitted through the openings 10, thereby increasing the light output angle.

[0040] Step S3: forming a second light control layer 11, wherein at least a portion of the second light control layer 11 is located in the opening 10, and the second light control layer 11 comprises resin and dye. In the process of forming the second light control layer 11, a photocuring treatment and a thermal curing treatment are performed, and the photocuring treatment is performed earlier than the thermal curing treatment.

[0041] The resin may include at least one of acrylic resin, epoxy resin and polyurethane resin.

[0042] The dye is used to absorb light within a certain wavelength range, and the wavelength range of the light absorbed by the dye deviates from the emission wavelength range of the light emitting element 3. For example, the plurality of light emitting elements 3 include a red light emitting element 3-1, a green light emitting element 3-2, and a blue light emitting element 3-3, and the wavelength range of the light absorbed by the dye deviates from the wavelength range of the red light emitted by the red light emitting element 3-1, the wavelength range of the green light emitted by the green light emitting element 3-2, and the wavelength range of the blue light emitted by the blue light emitting element 3-3. In one embodiment, the dye can absorb light within the wavelength range of 480nm to 500nm and / or absorb light within the wavelength range of 585nm to 605nm.

[0043] In an embodiment of the present invention, the second light control layer 11 may include a dye, or may include a dye and a pigment. For example, the second light control layer 11 may include a tetraazaporphyrin (TAP)-based compound, a porphyrin-based compound, a metal porphyrin-based compound, an oxazine-based compound, a squarylium-based compound, a triarylmethane-based compound, a polymethine-based compound, a tetraquinone-based compound, a phthalocyanine-based compound, an azo-based compound, a perylene-based compound, a xanthene-based compound, a diimmonium-based compound, a dipyrromethene-based compound, a cyanine-based compound, and a combination thereof.

[0044] In the formed panel structure, the first light control layer 9 and the second light control layer 11 constitute a filter structure. The first light control layer 9 acts as a black matrix, which is used to limit the light emission range of the light-emitting element 3. The second light control layer 11 can replace the traditional color film. Because the wavelength range of the light absorbed by the dye in the second light control layer 11 deviates from the emission wavelength range of the light-emitting element 3, the light emitted by the light-emitting element 3 can normally pass through the opening 10 and be emitted through the second light control layer 11. At the same time, after the external ambient light enters the display panel and reaches the second light control layer 11, part of the ambient light will be absorbed by the dye and cannot be further transmitted inward, thereby effectively reducing the amount of ambient light entering the interior of the display panel and reducing panel reflection.

[0045] At present, in the relevant process of functional film layer, firstly, a film layer to be processed is formed in the area where the functional film layer is required to be formed, and then the film layer to be processed is heat-cured to make the film layer to be processed strong, thereby forming the final functional film layer.

[0046] However, the inventors have found that if the second light control layer 11 is still formed by the conventional process, there will be some undesirable problems:

[0047] The second light control layer 11 includes dyes, which may include mobile cationic dyes, dispersed cationic dyes, electronegative dyes, etc. However, the dyes have small molecular weight, large migration rate, and low affinity with the resin. Fig. 9 When an optical adhesive layer 30 is disposed above the second light control layer 11, if the electronegativity of the material of the optical adhesive layer 30 is relatively large, the dye in the second light control layer 11 can easily diffuse into the optical adhesive layer 30 and combine with it, resulting in a decrease in the filtering effect of the second light control layer 11, and even failure in severe cases.

[0048] If the second light control layer 11 is still formed by the conventional process, during its formation, first, some resin composition materials are arranged on one side of the first light control layer 9 to form a film layer to be treated, wherein the resin composition material is a material for forming the second light control layer 11, which includes a base resin and a dye. It is understandable that, because the film layer to be treated needs to be heat-cured, the resin composition material can also include a thermal initiator. Then, the film layer to be treated is heat-cured to form the final second light control layer 11.

[0049] However, there will be a large amount of unreacted monomers inside the material of the second light control layer 11 formed in this way. Even if some of the monomers cross-link with the resin macromolecules during the thermal curing process, the degree of cross-linking is very small, which leads to poor density of the material of the second light control layer 11 and loose and porous material. Since the density of the material of the second light control layer 11 is poor, the movement of the dye in the material will be almost unrestricted, which undoubtedly facilitates the movement of the dye and makes it easier for it to migrate to the optical adhesive layer 30.

[0050] To this end, the embodiment of the present invention proposes that in the process of forming the second light control layer 11, before the film layer to be treated is subjected to heat curing treatment, a process of photocuring the film layer to be treated is added. The specific process of forming the second light control layer 11 can be: first, some resin composition materials are arranged on one side of the first light control layer 9 to form the film layer to be treated, and the resin composition materials may include a photoinitiator and a thermal initiator in addition to a dye and a base resin. Then, the film layer to be treated is subjected to light curing treatment. In this process, under the action of the photoinitiator, the double bonds of the free monomers in the resin composition material will open, and then react with the unsaturated bonds of the base resin to achieve cross-linking and curing, so that the monomers and the resin molecules are connected together. After the light curing is completed, the film layer to be treated is subjected to heat curing treatment. In this process, under the action of the thermal initiator, the double bonds of the monomers that are not opened during the light curing process will open, so that the monomers and the resin molecules are connected more closely, the degree of cross-linking is further increased, and the network structure is more compact.

[0051] Through the two curing processes of light curing and heat curing, the curing degree of the second light control layer 11 can be significantly improved, and the density of the material of the second light control layer 11 can be significantly improved. In this way, the pores of the material of the second light control layer 11 are denser, which can effectively intercept the movement of the dye, making it more difficult for the dye to diffuse and not easily migrate to other film layers. The filtering performance of the second light control layer 11 is more stable, and the anti-reflection performance of the display panel will also be better.

[0052] In addition, the inventors have also studied some other technical solutions that can improve dye migration. For example, the second light control layer 11 can be cured by a plasma dry etching process, and the plasma hardens the surface of the second light control layer 11 during the plasma dry etching process to form a first part and a second part with different curing rates. Among them, the first part is located on the side of the second part away from the first light control layer 9, that is, the upper half of the second light control layer 11, and the curing rate of the first part is greater than the curing rate of the second part.

[0053] However, this method can only use the first part with a higher curing rate to intercept the upward migration of the dye, but cannot effectively intercept the downward migration of the dye. In some panel structures, an optical adhesive layer may also be provided below the first light control layer 9, so that the second light control layer 11 contacts the optical adhesive layer below through the opening 10, and this structure cannot effectively improve the dye migration by applying the above solution.

[0054] In the technical solution provided in the embodiment of the present invention, the overall curing rate of the second light control layer 11 is improved by photocuring treatment. The curing degree of the second light control layer 11 is relatively high and uniform regardless of the upper part away from the substrate 1 or the lower part close to the substrate 1. This can intercept the movement of the dye at various positions and the movement of the dye in various directions, which has a better effect on improving the migration of the dye.

[0055] Furthermore, it should be noted that in the embodiment of the present invention, the resin composition material used to form the second light control layer 11 may include some other additives in addition to the dye, base resin, photoinitiator and thermal initiator, and the present invention does not specifically limit this.

[0056] In a possible implementation, Figure 4 As shown, Figure 4 Another structural flow chart of the method for manufacturing a display panel provided by an embodiment of the present invention, step S3 may specifically include:

[0057] Step S31 : coating a resin composition material including a base resin, a dye and a photoinitiator on a side of the first light control layer 9 away from the substrate 1 to form a first film layer 12 to be processed.

[0058] The base resin may be a resin prepolymer containing unsaturated double bonds or a polymer matrix with a small molecular weight, such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc., which is not specifically limited in the embodiment of the present invention. In addition, the resin composition material may also include a monomer, which contains an unsaturated double bond, such as an acrylic monomer, a styrene monomer, an epoxy monomer, etc., and the specific type is not limited.

[0059] Step S32 : performing an exposure process (Exp) and a development process (Dev) on the first film layer to be processed 12 to form a second film layer to be processed 13 .

[0060] Specifically, see Figure 4 When performing the exposure process Exp, the mask plate mask is placed above the first film layer to be processed 12, and ultraviolet light is used to irradiate the first film layer to be processed 12. When performing the development process Dev, the panel to be processed is placed in a developer, and the developer removes part of the first film layer to be processed 12 to form a second film layer to be processed 13.

[0061] Step S33 : performing a photocuring treatment (Pho) on the second film layer to be processed 13 to form a third film layer to be processed 40 .

[0062] Step S34 : performing a thermal curing treatment (Oven) on the third film layer to be processed 40 to form a second light control layer 11 .

[0063] In the above process, the second film layer 13 to be processed is formed by exposure and development, so that the second film layer 13 to be processed is only located in the area where the second light control layer 11 is required to be set. Figure 4 When the second light control layer 11 only needs to cover the display area AA, in step S32, the first film layer 12 to be processed in the frame area NA can be removed by using an exposure and development process, so that the second film layer 13 to be processed is only located in the display area AA. Alternatively, when the second light control layer 11 is a non-whole layer design with a specific pattern, in step S32, the second film layer 13 to be processed can also be provided with a specific pattern by using an exposure and development process.

[0064] During the exposure process, ultraviolet light is also required for irradiation. The aforementioned photocuring process is an additional process added after the exposure process. During the photocuring process, by changing the process conditions such as the wavelength of ultraviolet light and the exposure time, the resin composition material can undergo a greater degree of cross-linking reaction than during the exposure process.

[0065] For example, the focus of the exposure process is to ensure that the film layer in the exposure area becomes easy to dissolve or difficult to dissolve, so that the film layer in the exposure area or the non-exposure area can be removed in the subsequent development process. Currently, the exposure process does not require too high a degree of curing of the film layer. Figure 5 , Figure 5 A schematic diagram of a cross-linking reaction provided by an embodiment of the present invention, during the exposure treatment Exp, the photoinitiator 14 in the resin composition material may not absorb the ultraviolet light used for exposure to a great extent, and the cross-linking degree of the monomer 15 and the base resin 16 in the resin composition material is relatively small. Even in the subsequent thermal curing treatment, although the cross-linking degree is improved to a certain extent, there are still a large number of free unreacted monomers in the material.

[0066] Combined with Figure 6 , Figure 6 Another schematic diagram of a cross-linking reaction provided in an embodiment of the present invention is that if a photocuring treatment Pho is added between the etching treatment Exp and the photocuring treatment Oven, the curing rate of the film layer can be specifically improved by using the treatment process. For example, according to the photoinitiator 14 included in the material, ultraviolet light with a greater absorption degree of the photoinitiator 14 can be specifically selected for irradiation, so that the photoinitiator 14 can promote the cross-linking reaction between the monomer 15 and the base resin 16 to a greater extent, thereby greatly improving the curing degree of the film layer.

[0067] From another perspective, the above-mentioned production method does not need to change the original exposure and development process conditions and process parameters. It only needs to add a photocuring process after exposure and development, and further improve the curing degree of the second light control layer 11 by adjusting the process conditions of the photocuring process.

[0068] In a feasible implementation, ultraviolet light is used for irradiation during the exposure treatment and the photocuring treatment, respectively, wherein the wavelength of the ultraviolet light used in the photocuring treatment is greater than the wavelength of the ultraviolet light used in the exposure treatment.

[0069] Long-wave ultraviolet rays can penetrate materials more deeply. Therefore, using ultraviolet light with a longer wavelength for photocuring can allow more photoinitiators to react under the light and increase the degree of cross-linking between monomers and resin macromolecules.

[0070] In a feasible implementation manner, ultraviolet light i-rays are used for irradiation during the photocuring process, wherein the ultraviolet light i-rays refer to ultraviolet light with a wavelength of about 365 nm.

[0071] The photoinitiators that are currently used more often have a better absorption degree of ultraviolet light i-rays, so the use of ultraviolet light i-rays for irradiation during the photocuring process is more helpful to increase the degree of crosslinking. In the embodiment of the present invention, the photoinitiator in the resin composition may include isopropylthioxanthone, 9,10-phenanthrenequinone, benzophenone, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide (also known as 819 photoinitiator), etc. These photoinitiators have good absorption capacity for ultraviolet light around 365nm.

[0072] Furthermore, the exposure energy during the photocuring process is less than 600 mj. This can prevent some adverse problems caused by excessive exposure energy during the photocuring process. For example, overcuring can be avoided, preventing the second light control layer 11 from being too hard and prone to cracking, and preventing the photocuring process from generating too much heat and causing damage to the underlying film layer or the underlying device.

[0073] In a feasible implementation manner, the curing rate of the second light control layer 11 is greater than or equal to 90%.

[0074] When the second light control layer 11 is formed by the conventional process, the curing rate of the formed second light control layer 11 can usually only reach 60% to 80%. However, after adding light curing during the formation of the second light control layer 11, the curing rate of the second light control layer 11 can reach 90% or more, so that the material of the second light control layer 11 has a higher density and lower porosity, which has a significant improvement effect on dye migration.

[0075] The curing rate of the second light control layer 11 can be measured by a Fourier transform infrared spectrometer.

[0076] In one possible embodiment, the base resin includes a negative photosensitive resin.

[0077] When the resin composition includes a negative photosensitive resin, the resin composition can be regarded as a negative photoresist. Figure 4 When it is exposed and developed, the film layer in the non-exposed area will dissolve in the developer and be removed, while the film layer in the exposed area will be retained. That means that the film layer that is finally retained will go through two curing processes, exposure treatment and subsequent light curing treatment, so the degree of cross-linking inside will be greater and the material will be denser.

[0078] In a feasible implementation manner, after the first film layer 12 to be processed is formed by coating and before the first film layer 12 to be processed is exposed, the first film layer 12 to be processed may be subjected to a vacuum drying (Vacuum Dryer Cabinet, VCD) treatment.

[0079] When the resin composition material is applied to form the first film layer 12 to be processed, the resin composition material usually contains a solvent, such as some organic solvent. The solvent can be used as a diluent to reduce the viscosity of the material, improve the fluidity, and enable it to be more evenly distributed to form a smoother film layer.

[0080] In an embodiment of the present invention, the solvent used may include: propylene carbonate, butoxyethanol, butoxyethyl acetate, toluene, xylene, butyl carbitol acetate, cyclohexanone, propylene glycol monomethyl ether, dipropylene glycol diethyl ether and methyl carbitol acetate. Before exposing the first film layer 12 to be processed, the first film layer 12 to be processed is subjected to vacuum drying treatment, so that the solvent in the resin composition material can be volatilized and the composition and properties of the resin composition material can be kept stable. In a vacuum drying method, the air in the box can be evacuated by a vacuum pump to form a vacuum environment, reduce the boiling point of the solvent, and then enable the solvent in the resin composition to evaporate quickly at a lower temperature to achieve the purpose of drying.

[0081] In a feasible embodiment, after the first film layer 12 to be processed is vacuum dried, the first film layer 12 to be processed can also be soft-baked (SBK) to further remove the solvent in the resin composition material, increase the viscosity and adhesion of the resin composition material, and prevent the resin composition material from generating bubbles or water marks during the subsequent exposure process.

[0082] In a possible implementation, Figure 7 As shown, Figure 7 This is another structural flow chart of the method for manufacturing a display panel provided by an embodiment of the present invention, wherein step S3 may further include:

[0083] Step S31 ′: using inkjet printing, a nozzle 17 is used to spray a resin composition material including a resin, a dye and a photoinitiator on a side of the first light control layer 9 away from the substrate 1 to form a first film layer 12 ′ to be processed.

[0084] Step S32 ′: performing a photocuring process Pho on the first film layer 12 ′ to be processed to form a second film layer 13 ′ to be processed.

[0085] Step S33 ′: performing a thermal curing process Oven on the second film layer to be processed 13 ′ to form a second light control layer 11 .

[0086] In the above process, the second light control layer 11 is formed by inkjet printing process, and the inkjet printing process does not require etching and development. Since water or solvent is an auxiliary agent for dye migration, if the development process is omitted, the panel to be processed does not need to be placed in a developer, and there is no developer as a migration auxiliary agent to help dye migration during the process, thereby effectively preventing dye migration during the formation of the first film layer 12' to be processed. Coupled with the subsequent light curing treatment and heat curing treatment, the whole process has a more significant improvement effect on dye migration. In addition, the overall process of the inkjet printing process is also simpler.

[0087] In one possible embodiment, the resin composition material is solvent-free.

[0088] As mentioned above, when the second light control layer 11 is formed by exposure, the entire layer of the resin composition material needs to be coated first, and then the resin composition material in a partial area needs to be removed by exposure and development. In order to make the coated film layer smoother, this entire layer coating process has higher requirements on the fluidity of the material, so when the resin composition material is prepared, a solvent is usually added to the resin composition material to reduce the viscosity of the material.

[0089] The inkjet printing process is different from the above-mentioned process. When the second light control layer 11 is formed by inkjet printing, it is only necessary to spray the resin composition material in the printing area to directly form the first film layer 12' to be processed in the specific area, and there is no need to first apply the entire layer of the resin composition material. Therefore, when the second light control layer 11 is formed by the inkjet printing process, the accuracy is high and the fluidity requirements of the material can be reduced. In this regard, in an embodiment of the present invention, the resin composition material used in inkjet printing can also be made solvent-free, that is, when mixing the base resin, monomer, dye and photoinitiator to formulate the resin composition material, no solvent is added, thereby greatly reducing the solvent in the prepared second light control layer 11, and can avoid the migration of the dye to other film layers to a greater extent.

[0090] Furthermore, when the resin composition material is solvent-free, the viscosity of the resin composition material is greater than or equal to 20 cps, and further may be less than or equal to 25 cps.

[0091] As mentioned above, the resin composition material in the coating process contains a solvent, so the viscosity of the resin composition material involved in this method will be relatively small, usually less than 5cps, for example, 2cps to 3cps. When the resin composition material in the inkjet printing process is solvent-free, the viscosity of the resin composition material involved in this method will be larger than the viscosity of the resin composition material involved in the photolithography process.

[0092] However, it should be noted that since the inkjet printing process utilizes a nozzle to directly spray the resin composition material in the printing area, the material fluidity requirement is relatively low. Therefore, even if the viscosity of the resin composition material is relatively high, it will not affect the flatness of the film layer.

[0093] In a possible implementation, Figure 8 As shown, Figure 8 Another structural flow chart of the method for manufacturing a display panel provided in an embodiment of the present invention, before forming the first light control layer 9, the manufacturing method also includes step S10: forming a first insulating layer 18, wherein the first light control layer 9 is in contact with the first insulating layer 18, that is, in step S2, the first light control layer 9 is formed directly above the first insulating layer 18.

[0094] The first insulating layer 18 is a film layer below and in contact with the first light control layer 9. In one structure, Fig. 9 As shown, Fig. 9 Another structural schematic diagram of a display panel provided by an embodiment of the present invention, the display panel includes an encapsulation layer 19 and a touch layer 20 located on a side of the encapsulation layer 19 away from the substrate 1, and the touch layer 20 includes at least one electrode layer 21 and a protective layer 22 located on a side of the electrode layer 21 away from the substrate 1. The first insulating layer 18 can be the protective layer 22.

[0095] Of course, which film layer the first insulating layer 18 is specifically is related to the film layer structure design of the display panel. For example, when the encapsulation layer contacts the first light control layer 9, the first insulating layer 18 may also be an inorganic encapsulation layer in the encapsulation layer, and the embodiment of the present invention does not specifically limit it.

[0096] The surface energy difference between the first light control layer 9 and the resin composition material is greater than the threshold difference, and before spraying the resin composition material, the manufacturing method further includes roughening the upper surface of the first light control layer 9 away from the substrate 1. And / or, the surface energy difference between the first insulating layer 18 and the resin composition material is greater than the threshold difference, and before spraying the resin composition material, the manufacturing method further includes roughening the upper surface of the first insulating layer 18 away from the substrate 1.

[0097] In the embodiment of the present invention, the upper surfaces of the first insulating layer 18 and the first light control layer 9 may be roughened respectively. Figure 8 Step S10 includes roughening the first insulating layer 18 after forming the first insulating layer 18 , and step S2 includes roughening the first light control layer 9 after forming the first light control layer 9 .

[0098] Alternatively, after forming the first light control layer 9, the first insulating layer 18 and the upper surface of the first light control layer 9 may be roughened simultaneously. In this case, only the portion of the first insulating layer 18 exposed by the opening 10 of the first light control layer 9 will present a rough surface.

[0099] In the embodiment of the present invention, the roughening process may be performed by plasma treatment, laser etching, etc. The threshold difference may be between 10 dyne / cm and 15 dyne / cm, for example, the threshold difference is 10 dyne / cm.

[0100] The resin composition material needs to be sprayed on the first light control layer 9 and the first insulating layer 18. When the surface energy of the first light control layer 9 and / or the first insulating layer 18 differs too much from the surface energy of the resin composition material, the resin composition material is not easy to form a film. By roughening the upper surface of the first light control layer 9 and / or the first insulating layer 18, on the one hand, the rough surface can provide more anchor points, making it easier for the sprayed resin composition material to spread and adhere evenly, making it easier for the resin composition material to form a film. On the other hand, the rough surface has a microscopic concave-convex structure, which can increase the contact area between the resin composition material and the underlying film layer, which helps to improve the mechanical bonding force between the second light control layer 11 and the underlying film layer, enhance the bonding strength, and make the film layer more stable. On the other hand, the rough surface can also disperse the stress that may be generated between the contacting film layers, reducing the risk of peeling of the film layer due to stress concentration.

[0101] In a feasible implementation, the wavelength of the ultraviolet light used in the photocuring process is in the range of 190 nm to 450 nm.

[0102] When the second light control layer 11 is formed by the inkjet printing process, the process itself can use the characteristics of no development and no solvent to reduce the dye migration problem. Therefore, during the photocuring process, the wavelength selection range of the ultraviolet light used can be relaxed, thereby relaxing the process condition restrictions on the photocuring process. Of course, when the second light control layer 11 is formed by the inkjet printing process, ultraviolet light can also be used during the photocuring process to achieve a higher curing rate for the second light control layer 11.

[0103] In addition, see Figure 7 In step S31', after spraying the resin composition material, the resin composition material may be subjected to a leveling treatment Lev so that the first film layer 12' to be processed has a smoother surface.

[0104] In a possible implementation, Fig.10 As shown, Fig.10This is another structural flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention. The process of forming the second light control layer 11 may also include:

[0105] Step K1: using inkjet printing, a nozzle 17 is used to spray a resin composition material containing a base resin, a dye and a photoinitiator on the side of the first light control layer 9 away from the substrate 1 to form a first film layer 12 to be treated.

[0106] Furthermore, in step K1, after spraying the resin composition material, the resin composition material may be subjected to a leveling treatment Lev, so that the first film layer to be treated 12" has a smoother surface.

[0107] Step K2: performing a thermal curing process Oven on the first film layer to be processed 12 ″ to form a second light control layer 11 .

[0108] In this process, the second light control layer 11 is formed by inkjet printing process. If the development process can be omitted, the panel to be processed does not need to be placed in the developer. There is no developer as a migration aid to help the dye migration in the process, so that the dye migration can be effectively prevented in the process of forming the first film layer to be processed 12". Combined with the subsequent thermal curing treatment, the improvement effect of the whole process on dye migration is more significant. Although the process does not perform light curing treatment, a certain curing rate can be achieved.

[0109] Furthermore, the resin composition material is solvent-free. In this case, there is no developer as a migration aid, and no solvent as a migration aid in the process, which can prevent the dye from migrating to other film layers to a greater extent.

[0110] In one possible implementation, see again Fig. 9 The distance between the surface of the second light control layer 11 away from the substrate 1 and the substrate 1 is a first distance d1, and the difference between the first distances d1 at different positions is less than or equal to 80nm. Further, the difference between the first distances d1 at different positions is less than or equal to 40nm.

[0111] The upper surface of the second light control layer 11 formed in this way is flatter. Firstly, the film flatness is better, and secondly, the dye distributed in the second light control layer 11 can be more evenly distributed, thereby improving the reflection uniformity of the display panel.

[0112] Exemplarily, when the second light control layer 11 is formed by exposure, since the applied resin composition material has a solvent, the solvent can be used to evenly apply the resin composition material so that the upper surface of the second light control layer 11 formed finally is a flat surface. When the second light control layer 11 is formed by inkjet printing, after spraying the resin composition material, a leveling treatment is performed on it so that the upper surface of the second light control layer 11 formed finally is a flat surface.

[0113] In a feasible implementation manner, ultraviolet light is used for irradiation during the photocuring process, and / or the curing rate of the second light control layer 11 is greater than or equal to 90%.

[0114] For example, when the second light control layer 11 is formed by exposure, the second film layer to be processed 13 is photocured by ultraviolet light in step S33. Alternatively, when the second light control layer 11 is formed by inkjet printing, the first film layer to be processed 12 is photocured by ultraviolet light in step S32'.

[0115] And / or, when the second light control layer 11 is formed by a photolithography process, exposure superimposed with light curing treatment and heat curing treatment can make the curing rate of the second light control layer 11 reach 90% or more. Alternatively, when the second light control layer 11 is formed by an inkjet printing process, no development, no solvent superimposed with light curing treatment and heat curing treatment can make the curing rate of the second light control layer 11 reach 90% or more.

[0116] By adopting the above manner, the second light control layer 11 has a higher curing rate, and the pores of the second light control layer 11 are denser, which can intercept the movement of the dye to a greater extent.

[0117] Based on the same inventive concept, an embodiment of the present invention further provides a display panel, which is manufactured by the above manufacturing method.

[0118] Combination Figure 1 to Figure 3 The display panel includes a substrate 1, a light-emitting device layer 2, a first light control layer 9, and a second light control layer 11. The light-emitting device layer 2 is located on one side of the substrate 1, and the light-emitting device layer 2 includes a plurality of light-emitting elements 3. The first light control layer 9 is located on a side of the light-emitting device layer 2 away from the substrate 1, and the first light control layer 9 includes a plurality of openings 10 spaced apart from each other. At least a portion of the second light control layer 11 is located in the opening 10, and the second light control layer 11 includes a resin and a dye. The above structures have been described in detail in the aforementioned embodiments, and will not be repeated here.

[0119] Combined with the above analysis, it can be known that because the second light control layer 11 in the display panel has added photocuring treatment during its formation process, the second light control layer 11 has a higher degree of curing, and the pores of the second light control layer 11 material are denser, which can intercept the movement of the dye, making it more difficult for the dye to diffuse and not easy to migrate to other film layers. The filtering performance of the second light control layer 11 is more stable, and the anti-reflection performance of the display panel is also better.

[0120] In a feasible implementation manner, the second light control layer 11 is formed by an inkjet printing process.

[0121] In one embodiment, in combination Figure 7 The formation process may include: first, using a nozzle 17 to spray a resin composition material containing a base resin, a dye and a photoinitiator on the side of the first light control layer 9 away from the substrate 1 to form a first film layer 12' to be treated; then, the first film layer 12' to be treated is subjected to a photocuring treatment Pho to form a second film layer 13' to be treated; and then, the second film layer 13' to be treated is subjected to a thermal curing treatment Oven to form a second light control layer 11.

[0122] The second light control layer 11 formed in this process has undergone two curing processes: light curing and heat curing.

[0123] The second light control layer 11 does not need to be developed during its formation, so there is no developer solution as a migration aid to help the dye migrate, which can effectively reduce the risk of dye migration. In addition, the subsequent light curing and heat curing treatments will make the material of the second light control layer 11 very dense, making it more difficult for the dye to migrate to other film layers.

[0124] In another embodiment, in combination Fig.10 The formation process may also include: first, using a nozzle 17 to spray a resin composition material containing a base resin, a dye and a photoinitiator on the side of the first light control layer 9 away from the substrate 1 to form a first film layer 12'' to be treated, and then, thermally curing the first film layer 12'' to form a second light control layer 11.

[0125] The second light control layer 11 formed in this process is not photocured but only thermally cured.

[0126] This second light control layer 11 can significantly improve the dye migration problem based on the process feature of no development. Although the process does not involve light curing, a certain curing rate can be achieved.

[0127] Furthermore, the resin composition material sprayed during the formation process is solvent-free, that is, when the base resin, monomer, dye and photoinitiator are mixed to formulate the resin composition material, no solvent is added, which can avoid the migration of the dye to other film layers to a greater extent.

[0128] Furthermore, whether in the inkjet printing process or the coating process, combined with the photocuring treatment and the thermal curing treatment, the curing rate of the second light control layer 11 can reach greater than or equal to 90%. At this time, the curing degree of the second light control layer 11 is higher, the film material is denser, and the movement of the dye can be intercepted to a greater extent.

[0129] Furthermore, the second light control layer 11 is obtained by light curing and heat curing, and the light curing is performed earlier than the heat curing. Combined with the above analysis, the second light control layer 11 can be formed by a coating process or an inkjet printing process.

[0130] The use of photocuring treatment can improve the overall curing rate of the second light control layer 11. The curing degree of the second light control layer 11 is relatively high and uniform, whether it is the upper part far away from the substrate 1 or the lower part close to the substrate 1. Therefore, the movement of the dye at various positions can be intercepted, and the movement of the dye in various directions can be intercepted, which will have a better effect on improving the migration of the dye.

[0131] In a possible implementation, combining Figure 8 and Fig. 9 , the surface energy difference between the first light control layer 9 and the second light control layer 11 is greater than the threshold difference, and the upper surface of the first light control layer 9 away from the substrate 1 is a rough surface.

[0132] And / or, the display panel further includes a first insulating layer 18, which is located between the light-emitting device layer 2 and the first light control layer 9 and contacts the first light control layer 9. The surface energy difference between the first insulating layer 18 and the second light control layer 11 is greater than the threshold difference, and the upper surface of the first insulating layer 18 away from the substrate 1 is a rough surface.

[0133] As mentioned above, the first insulating layer 18 is a film layer below the first light control layer 9 and in contact with the first light control layer 9 , and specifically may be the protective layer 22 in the touch control layer 20 .

[0134] When the second light control layer 11 is formed by inkjet printing, the resin composition material needs to be sprayed on the first light control layer 9 and the first insulating layer 18. When the surface energy of the first light control layer 9 and / or the first insulating layer 18 differs too much from the surface energy of the resin composition material, the resin composition material is not easy to form a film. By roughening the upper surface of the first light control layer 9 and / or the first insulating layer 18, on the one hand, the rough surface can provide more anchor points, making it easier for the sprayed resin composition material to spread and adhere evenly, making it easier for the resin composition material to form a film. On the other hand, the rough surface has a microscopic concave-convex structure, which can increase the contact area between the resin composition material and the underlying film layer, which helps to improve the mechanical bonding force between the second light control layer 11 and the underlying film layer, enhance the bonding strength, and make the film layer more stable. On the other hand, the rough surface can also disperse the stress that may be generated between the contacting film layers, reducing the risk of peeling of the film layer due to stress concentration.

[0135] In one possible implementation, see Fig. 9 The distance between the surface of the second light control layer 11 away from the substrate 1 and the substrate 1 is a first distance d1, and the difference between the first distances d1 at different positions is less than or equal to 80nm. Further, the difference between the first distances d1 at different positions is less than or equal to 40nm.

[0136] At this time, the upper surface of the second light control layer 11 is flatter. Firstly, the film flatness is better, and secondly, the dye distributed in the second light control layer 11 can be more evenly distributed, thereby improving the reflection uniformity of the display panel.

[0137] Based on the same inventive concept, an embodiment of the present invention further provides a display device, such as Fig.11 As shown, Fig.11 1 is a schematic diagram of a structure of a display device provided by an embodiment of the present invention, and the display device includes the above-mentioned display panel 100. Of course, Fig.11 The display device shown is for illustration only, and the display device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a laptop computer, an e-reader or a television.

[0138] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

[0139] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a display panel, characterized in that: include: forming a light-emitting device layer on one side of the substrate, wherein the light-emitting device layer includes a plurality of light-emitting elements; forming a first light control layer on a side of the light emitting device layer away from the substrate, wherein the first light control layer comprises a plurality of openings spaced apart from each other; A second light control layer is formed, at least a portion of which is located within the opening, and the second light control layer includes a resin and a dye, wherein photocuring and thermal curing are performed during the formation of the second light control layer, and the photocuring is performed earlier than the thermal curing.

2. The method for manufacturing a display panel according to claim 1, characterized in that: The process of forming the second light control layer includes: coating a resin composition material comprising a base resin, the dye and a photoinitiator on a side of the first light control layer away from the substrate to form a first film layer to be treated; performing exposure processing and development processing on the first film layer to be processed to form a second film layer to be processed; performing photocuring treatment on the second film layer to be processed to form a third film layer to be processed; The third film layer to be processed is subjected to thermal curing treatment to form the second light control layer.

3. The method for manufacturing a display panel according to claim 2, characterized in that: Ultraviolet light is used for irradiation during the exposure treatment and the photocuring treatment, respectively. The wavelength of the ultraviolet light used in the photocuring treatment is greater than the wavelength of the ultraviolet light used in the exposure treatment.

4. The method for manufacturing a display panel according to claim 2, wherein: Ultraviolet light is used for irradiation during the light curing process.

5. The method for manufacturing a display panel according to claim 4, characterized in that: The exposure energy during the photocuring process is less than 600mj.

6. The method for manufacturing a display panel according to claim 2, wherein: The curing rate of the second light control layer is greater than or equal to 90%.

7. The method for manufacturing a display panel according to claim 2, wherein: The base resin includes a negative photosensitive resin.

8. The method for manufacturing a display panel according to claim 1, characterized in that: The process of forming the second light control layer includes: By inkjet printing, a resin composition material including a base resin, the dye and a photoinitiator is sprayed on a side of the first light control layer away from the substrate to form a first film layer to be processed; Performing photocuring treatment on the first film layer to be processed to form a second film layer to be processed; The second film layer to be processed is subjected to thermal curing treatment to form the second light control layer.

9. The method for manufacturing a display panel according to claim 8, characterized in that: The resin composition material is solvent-free.

10. The method for manufacturing a display panel according to claim 9, characterized in that: The viscosity of the resin composition material is greater than or equal to 20 cps.

11. The method for manufacturing a display panel according to claim 8, characterized in that: Before forming the first light control layer, the manufacturing method further includes forming a first insulating layer; wherein the first light control layer is in contact with the first insulating layer; The surface energy difference between the first light control layer and the resin composition material is greater than a threshold difference, and before spraying the resin composition material, the upper surface of the first light control layer away from the substrate is roughened; And / or, the surface energy difference between the first insulating layer and the resin composition material is greater than the threshold difference, and before spraying the resin composition material, the upper surface of the first insulating layer away from the substrate is roughened.

12. The method for manufacturing a display panel according to claim 8, characterized in that: The wavelength of the ultraviolet light used in the photocuring process is in the range of 190nm to 450nm.

13. The method for manufacturing a display panel according to claim 1, characterized in that: A distance between a surface of the second light-control layer away from the substrate and the substrate is a first distance, and a difference between the first distances at different positions is less than or equal to 80 nm.

14. The method for manufacturing a display panel according to claim 1, characterized in that: During the photocuring process, ultraviolet light is used for irradiation, and / or the curing rate of the second light control layer is greater than or equal to 90%.

15. A display panel, characterized in that: include: substrate; A light-emitting device layer located on one side of the substrate, the light-emitting device layer comprising a plurality of light-emitting elements; A first light control layer located on a side of the light emitting device layer away from the substrate, the first light control layer comprising a plurality of openings spaced apart from each other; A second light control layer, at least a portion of the second light control layer is located in the opening, wherein the second light control layer comprises a resin and a dye.

16. The display panel according to claim 15, characterized in that: The second light control layer is formed by an inkjet printing process, and / or the curing rate of the second light control layer is greater than or equal to 90%.

17. The display panel according to claim 16, characterized in that: The second light control layer is obtained by photocuring and thermal curing, wherein the photocuring is performed earlier than the thermal curing.

18. The display panel according to claim 15, characterized in that: The surface energy difference between the first light control layer and the second light control layer is greater than a threshold difference, and the upper surface of the first light control layer away from the substrate is a rough surface; And / or, the display panel further includes a first insulating layer, wherein the first insulating layer is located between the light emitting device layer and the first light control layer and contacts the first light control layer; The surface energy difference between the first insulating layer and the second light control layer is greater than the threshold difference, and the upper surface of the first insulating layer away from the substrate is a rough surface.

19. The display panel according to claim 15, characterized in that: A distance between a surface of the second light-control layer away from the substrate and the substrate is a first distance, and a difference between the first distances at different positions is less than or equal to 80 nm.

20. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 15 to 19.

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