Microfluidic device

Abstract

A plurality of microfluidic chips in which main chips each having a fine space into which a liquid is introduced are held by a guide are prepared, the microfluidic chips are connected in a row, and the fine spaces provided in two adjacent main chips are connected by a tab chip. Each of the tab chips is held in half by a respective guide so as to straddle two adjacent main chips, and forms a part of a flow path including a fine space provided in the two main chips. The fine space of two adjacent main chips and the communication flow path built in the joint chip communicate with each other through the main communication hole of the main chip and the joint communication hole of the joint chip to form a flow path.

Description

Technical Field

[0001] The present disclosure relates to microfluidic devices. Background Art

[0002] Microfluidic devices are a general term for devices that use microfabrication technology to create microscopic spaces such as microchannels and reaction vessels on a plate-shaped microfluidic chip. Since microscopic spaces can be used to separate, stir, heat treat, and detect fluorescence in liquids such as culture media and reagents, microfluidic devices contribute to research in a wide range of fields, including biotechnology, life sciences, medicine, and chemical engineering.

[0003] In particular, microfluidic devices that process liquids in a microscopic space have attracted attention as a technology that can save the amount of expensive samples used. Multiple processes such as liquid separation, stirring, heat treatment, and fluorescence detection can also be performed in the same device, which also helps to shorten the reaction time.

[0004] Due to such various advantages, the field utilizing microfluidic devices currently supports a wide variety of research activities in a wide range.

[0005] On the other hand, since the processing content and combination of processing steps are different for each research, it is necessary to manufacture dedicated devices for each research. Microfluidic devices are made of materials such as acrylic, glass, and silicone rubber. Regardless of the material selected, its manufacture will take a lot of time and cost.

[0006] Therefore, as shown in Patent Documents 1 to 3, for example, methods of appropriately combining a plurality of microfluidic chips to produce a desired microfluidic device have been proposed.

[0007] Japanese Patent Application Laid-Open No. 2005-147940 (Patent Document 1) proposes a technique of preparing a plurality of microfluidic chips having different flow paths in advance and appropriately combining these microfluidic chips on a base member to produce a microfluidic device.

[0008] Japanese Patent Application Laid-Open No. 2015-123012 (Patent Document 2) discloses preparing a plurality of modules having different functions each provided with a microscopic flow path, and manufacturing a microfluidic device according to the application by appropriately combining these modules.

[0009] The proposal of International Publication No. 2019 / 092989 (Patent Document 3) is to stack a plurality of plates of microfluidic chips having different flow paths to manufacture a microfluidic device that meets the target application.

[0010] Prior art literature

[0011] Patent Literature

[0012] Patent Document 1: Japanese Patent Application Publication No. 2005-147940;

[0013] Patent Document 2: Japanese Patent Application Publication No. 2015-123012;

[0014] Patent document 3: International Publication No. 2019 / 092989. Summary of the invention

[0015] Problems to be solved by the invention

[0016] The microfluidic devices described in Japanese Patent Publication No. 2005-147940 (Patent Document 1) and Japanese Patent Publication No. 2015-123012 (Patent Document 2) are microfluidic devices by mounting a microfluidic chip or module on a bracket (a base member (2) of Patent Document 1 and a bracket (9) of Patent Document 2). Therefore, the scale of the microfluidic device depends on the size of the bracket, and a device that exceeds the size of the bracket cannot be realized. It is desired to improve the microfluidic device so that it can be expanded more flexibly.

[0017] In this regard, the microfluidic device described in International Publication No. 2019 / 092989 (Patent Document 3) can expand the microfluidic chip without increasing the size of the plate on the structure of the stacked microfluidic chip plate. On the other hand, since it is impossible to expose the microscopic spaces such as the flow path and pressure vessel of the microfluidic chip located in the lower layer to the outside, it is impossible to observe, detect, or apply the desired treatment to the liquid as a sample. It is not suitable for research that requires observation of samples, etc.

[0018] It is expected to realize a microfluidic device with high scalability by expanding a microfluidic chip in two dimensions.

[0019] Means used to solve problems

[0020] One form of a microfluidic device includes: a plate-shaped main chip having a microscopic space for introducing liquid inside; a plate-shaped connector chip having a connecting flow path inside, and a pair of connector connecting holes on both ends of the upper surface, the pair of connector connecting holes being used to connect the connecting flow path with the microscopic space; and a guide. The guide has: an upper holding area for holding the main chip; and a lower holding area for selectively holding one of the two ends of the connector chip when the connector chip is partially stacked on the main chip held by the upper holding area. The main chip has a pair of main connecting holes on both ends of the lower surface, and the pair of main connecting holes connect the connector connecting holes of the connector chip held in the lower holding area with the microscopic space when the main chip is held in the upper holding area.

[0021] Effects of the Invention

[0022] A microfluidic device with high expandability can be obtained by expanding a microfluidic chip two-dimensionally. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a perspective view showing an example of an implementation of a microfluidic device in which a plurality of microfluidic chips are connected.

[0024] Figure 2 is a schematic diagram showing the internal structure of a microfluidic device.

[0025] Figure 3 This is a perspective view of the main chip according to the first embodiment.

[0026] Figure 4 is a vertical cross-sectional view of the main chip according to the first embodiment.

[0027] Figure 5 It is a perspective view of a main chip according to the second embodiment.

[0028] Figure 6 is a vertical cross-sectional view of a main chip according to the second embodiment.

[0029] Figure 7 It is a perspective view of the connector chip according to the first embodiment.

[0030] Figure 8 It is a vertical cross-sectional view of the connector chip according to the first embodiment.

[0031] Fig. 9 It is a perspective view of the connector chip according to the second embodiment.

[0032] Fig.10 It is a vertical cross-sectional view of the connector chip of the second embodiment.

[0033] Fig.11 It is a three-dimensional diagram of the guide.

[0034] Fig.12 It is a perspective view of the microfluidic chip according to the first embodiment.

[0035] Fig.13 It is a perspective view of the microfluidic chip according to the second embodiment.

[0036] Fig.14 This is a schematic diagram showing the microfluidic chip according to the first embodiment without the guide.

[0037] Fig.15 This is a schematic diagram showing a microfluidic chip according to a second embodiment without the guide.

[0038] Fig.16 It is a perspective view of a connector chip showing another embodiment of the sealing structure.

[0039] Fig.17 This is a three-dimensional view in which the connector chip is made into a vertical cross section.

[0040] Fig.18 is a vertical cross-sectional view of the connector chip.

[0041] Fig.19 It is a three-dimensional image of a microfluidic chip. DETAILED DESCRIPTION

[0042] The embodiments will be described based on the drawings. The description will be made based on the following items.

[0043] 1. Structure

[0044] (1) Overall Overview

[0045] (2) Main chip

[0046] (First method)

[0047] (Second method)

[0048] (Common matters)

[0049] (3) Connector chip

[0050] (First method)

[0051] (Second method)

[0052] (Common matters)

[0053] (4) Guide

[0054] (5) Microfluidic Chip

[0055] (6) Another embodiment of the sealing structure

[0056] 2. Effect

[0057] (1) Function

[0058] (2) Effect

[0059] 3. Modifications

[0060] 1. Structure

[0061] (1) Overall Overview

[0062] like Figure 1 As shown in FIG. 1 , the microfluidic device 101 of the present embodiment is composed of a plurality of microfluidic chips 11 connected in a row. Each microfluidic chip 11 is mainly composed of a main chip 31 having a micro space MS such as a micro flow path and a reaction container inside, and has a structure in which the main chip 31 and the connector chip 51 are held together by a guide 71 (see FIG. 1 ). Figure 2 , Fig.12 ).

[0063] Figure 1 The X direction in the figure is the arrangement direction of the microfluidic chip 11 and defines the length direction of each element. When the microfluidic device 101, the microfluidic chip 11, the main chip 31, the connector chip 51 and the guide 71 are referred to as "both ends" or "ends", they refer to the two ends and ends in the X direction, respectively.

[0064] Figure 1 The Y direction in the figure is a direction orthogonal to the arrangement direction of the microfluidic chip 11, and defines the width direction of each element. When the microfluidic device 101, the microfluidic chip 11, the main chip 31, the connector chip 51, and the guide 71 are referred to as "both side ends" and "side portions", they refer to the two side ends and side portions in the Y direction, respectively.

[0065] Figure 1 The Z direction in dictates the vertical direction of the microfluidic device 101, the microfluidic chip 11, the main chip 31, the connector chip 51, and the guide member 71. Figure 1 In the figure, the upper surface appears above in the Z direction, and the lower surface appears below in the Z direction.

[0066] like Figure 2 As shown schematically, the main chip 31 has the same length as the guide 71 (length in the X direction) and is held by the guide 71 without protruding. Therefore, when the microfluidic chips 11 are arranged in a row and connected, the main chips 31 and the guides 71 included in two adjacent microfluidic chips 11 make their respective end faces contact each other. In this embodiment, the end faces of the two adjacent guides 71 that contact each other are referred to as the mounting surface 72 (refer to Fig.11 ).

[0067] The tab chip 51 is stacked and arranged on the two adjacent main chips 31 so as to straddle the two adjacent main chips 31 .

[0068] In the guide 71, the area holding the main chip 31 is the upper holding area 73, and the area holding the connector chip 51 is the lower holding area 74 (see Fig.11 When the master chip 31 is accurately held in the upper holding area 73 and the connector chip 51 is accurately held in the lower holding area 74, the master chip 31 and the connector chip 51 are positioned as shown in FIG. Figure 2 The stacked and contacted state is shown.

[0069] When the microfluidic chips 11 are connected in a row, a flow path FC including a microscopic space MS is formed. The elements forming the flow path FC are as follows.

[0070] · Micro space MS of main chip 31

[0071] A pair of supply holes 32 of the main chip 31

[0072] A pair of main communication holes 33 of the main chip 31

[0073] The connecting flow path 52 of the connector chip 51

[0074] A pair of joint communication holes 53 of the joint chip 51

[0075] When a plurality of microfluidic chips 11 are connected in a row to form the microfluidic device 101 , if a liquid serving as a sample is introduced from the supply hole 32 of the main chip 31 , the liquid flows through the flow path FC.

[0076] However, the supply holes 32 of the elements forming the flow path FC are necessary when viewed from the overall structure of the microfluidic device 101, but are not necessary for all microfluidic chips 11 when viewed from the units of each microfluidic chip 11. Therefore, the main chip 31 includes a type with a supply hole 32 and a type without a supply hole 32.

[0077] Figure 1 In the figure, the two main chips 31 at the front are of the type having supply holes 32, and the two main chips 31 at the back are of the type not having supply holes 32. When the desired main chips 31 are combined to assemble the microfluidic device 101, the main chips 31 having supply holes 32 and the main chips 31 not having supply holes 32 can be appropriately combined.

[0078] For the sake of convenience, the following description will take the main chip 31 provided with the supply hole 32 as an example, but not all main chips 31 are provided with the supply hole 32. Regarding the main chip 31 without the supply hole 32, it should be understood that the supply hole 32 is omitted from the main chip 31 described below.

[0079] (2) Main chip

[0080] (First method)

[0081] Figure 3 and Figure 4 The first embodiment of the master chip 31 is shown. The master chip 31 is a rectangular plate-shaped substrate, which is formed by stacking three light-transmitting acrylic plates. There are three plates, namely, a middle-layer master substrate 34, an upper-layer master substrate 35, and a lower-layer master substrate 36. The master chip 31 is manufactured by placing the upper-layer master substrate 35 on the upper surface of the middle-layer master substrate 34 and placing the lower-layer master substrate 36 on the lower surface of the middle-layer master substrate 34 by thermal compression bonding.

[0082] The three acrylic plates (34, 35, 36) forming the three layers all use acrylic plates of the same shape and size of 20 mm square. Regarding the thickness, the middle main substrate 34 is 0.5 mm, the upper main substrate 35 is 1.0 mm, and the lower main substrate 36 is 0.5 mm.

[0083] The middle-layer main substrate 34 is provided with an opening 37 that becomes a micro space MS. The shape of the micro space MS defined by the opening 37 can be appropriately determined according to the application of each microfluidic chip 11.

[0084] A pair of supply holes 32 communicating with the minute space MS are provided on both end sides of the upper main substrate 35 .

[0085] A pair of main communication holes 33 communicating with the minute space MS are provided on both end sides of the lower main substrate 36 .

[0086] like Figure 1 As shown, the master chip 31 completed by thermally pressing three laminated acrylic plates (34, 35, 36) is in a form in which the fine space MS can be visually recognized from the outside.

[0087] The main chip 31 of the type not having the supply hole 32 can be similarly manufactured by using a flat upper main substrate 35 not having the supply hole 32 .

[0088] (Second method)

[0089] Figure 5 and Figure 6 The second embodiment of the master chip 31 is shown. The master chip 31 is a rectangular plate-shaped substrate, which is formed by stacking two light-transmitting acrylic plates. These two plates are the master substrate 34A and the upper master substrate 35. The master chip 31 is manufactured by placing the upper master substrate 35 on the upper surface of the master substrate 34A and performing thermal compression bonding.

[0090] The two acrylic plates (34A, 35) forming the two layers are both 20 mm square acrylic plates of the same shape and size. The thickness of the main substrate 34A and the upper main substrate 35 is 1.0 mm.

[0091] The main substrate 34A is provided with a micro space MS and a pair of main communication holes 33. The shape of the micro space MS can be appropriately determined according to the purpose of each microfluidic chip 11. The pair of main communication holes 33 communicate with the lower surface of the main substrate 34A, and the main communication holes 33 are provided on both end sides.

[0092] A pair of supply holes 32 communicating with the minute space MS are provided on both end sides of the upper main substrate 35 .

[0093] like Figure 1As shown, the master chip 31 completed by thermocompression bonding of two laminated acrylic plates (34A, 35) is in a form in which the fine space MS can be visually recognized from the outside.

[0094] The main chip 31 of the type not having the supply hole 32 can be similarly manufactured by using a flat upper main substrate 35 not having the supply hole 32 .

[0095] (Common matters)

[0096] In practice, it is sufficient to prepare in advance a plurality of standardized master chips 31 having various micro spaces MS with typical shapes such as flow paths and reaction containers and to be able to select appropriately. Master chips 31 having supply holes 32 and master chips 31 not having supply holes 32 can also be standardized. In the case where a micro space MS that has not been prepared in advance is required, a master chip 31 (special part) having such a micro space MS is manufactured each time.

[0097] The middle main substrate 34 and the lower main substrate 36 of the first embodiment are conceptually equivalent to the main substrate 34A of the second embodiment. In the first embodiment, two acrylic plates (34, 36) are stacked and joined, and thus in the second embodiment, the main substrates 34A (middle main substrate 34, lower main substrate 36) are respectively generated from one acrylic plate (34A) alone. Therefore, it can be said that the difference between the first embodiment and the second embodiment lies in the manufacturing method of the main substrate 34A.

[0098] From a different aspect of such a manufacturing method, the main substrate 34A and the upper main substrate 35 can also be integrally formed. As an example, a 3D printer can be used to realize an integrally formed product of the main substrate 34A and the upper main substrate 35. In this case, a support is pre-set in the portion that becomes the fine space MS, the supply hole 32, and the pair of main connecting holes 33, and the molding is also performed including the support. After the molding is completed, by removing the support, a plate-shaped main chip 31 having a fine space MS inside, a supply hole 32 connected to the fine space MS on the upper surface, and a pair of main connecting holes 33 connected to the fine space MS on both ends of the lower surface is completed.

[0099] In this embodiment, an example of generating the main chip 31 by one or more acrylic plates (34 to 36, 34A and 35), that is, acrylic resin, is shown, but it is not limited to acrylic resin, and polydimethylsiloxane (PDMS), glass, polycarbonate (PC), polyethylene terephthalate (PET), cycloolefin polymer (COP) and the like can also be used as materials to manufacture the main chip 31. In addition, the main chip 31 can also be manufactured using various materials such as ABS resin and PLA resin, ASA resin (strong weather resistance), PP resin (strong heat resistance and chemical resistance), PC resin or nylon resin, acrylic resin, PETG, thermoplastic polyurethane, etc.

[0100] (3) Connector chip

[0101] (First method)

[0102] Figure 7 and Figure 8 The first embodiment of the connector chip 51 is shown. The connector chip 51 is a rectangular plate-shaped substrate, which is formed by stacking three light-transmitting acrylic plates. The three plates are a middle-layer connector substrate 54, an upper-layer connector substrate 55, and a lower-layer connector substrate 56. The connector chip 51 is manufactured by placing the upper-layer connector substrate 55 on the upper surface of the middle-layer connector substrate 54 and placing the lower-layer connector substrate 56 on the lower surface of the middle-layer connector substrate 54 by thermal compression.

[0103] The three acrylic plates (54, 55, 56) forming the three layers are all acrylic plates of the same shape and size of 10 mm square. The thickness is the same, the middle joint substrate 54 is 0.5 mm, the upper joint substrate 55 is 0.5 mm, and the lower joint substrate 56 is also 0.5 mm.

[0104] The middle-layer joint substrate 54 is provided with an opening 57 that serves as the communication flow path 52 .

[0105] A pair of joint communication holes 53 communicating with the communication flow path 52 are provided on both end sides of the upper joint substrate 55 .

[0106] The lower connector substrate 56 is a flat acrylic plate in which no holes, openings, etc. are formed.

[0107] In the connector chip 51 completed by thermally pressing three stacked acrylic plates (54, 55, 56), a rubber sheet 58 is bonded to the upper surface, that is, the surface of the upper connector substrate 55. The rubber sheet 58 is bonded to the surface of the upper connector substrate 55 by, for example, bonding. The rubber sheet 58 has the same size and shape as the three acrylic plates (54, 55, 56), and is bonded to these acrylic plates (54, 55, 56) without protruding or being misaligned.

[0108] A pair of through holes 58 a is provided in the rubber sheet 58 so as to be aligned with the joint communication holes 53 so as not to block the pair of joint communication holes 53 provided at both end sides of the upper-layer joint substrate 55 .

[0109] (Second method)

[0110] Fig. 9 and Fig.10 The second embodiment of the connector chip 51 is shown. The connector chip 51 is a rectangular plate-shaped substrate, which is formed by stacking two light-transmitting acrylic plates. These two plates are the connector substrate 54A and the upper connector substrate 55. The connector chip 51 is manufactured by placing the upper connector substrate 55 on the upper surface of the connector substrate 54A and performing thermal compression bonding.

[0111] The two acrylic plates (54A, 55) forming the two layers are both acrylic plates having the same shape and size of 10 mm square. The thickness of the joint substrate 54A is 1.0 mm, and the thickness of the upper joint substrate 55 is 0.5 mm.

[0112] The joint substrate 54A is provided with a communication flow path 52 .

[0113] A pair of joint communication holes 53 communicating with the communication flow path 52 are provided on both end sides of the upper joint substrate 55 .

[0114] In the connector chip 51 completed by thermocompression bonding of two stacked acrylic plates (54A, 55), a rubber sheet 58 is bonded to the upper surface, that is, the surface of the upper connector substrate 55. The rubber sheet 58 is bonded to the surface of the upper connector substrate 55 by, for example, bonding. The rubber sheet 58 has the same size and shape as the two acrylic plates (54A, 55) and is bonded to the acrylic plates (54A, 55) without protruding or being misaligned.

[0115] A pair of through holes 58 a is provided in the rubber sheet 58 so as to be aligned with the joint communication holes 53 so as not to block the pair of joint communication holes 53 provided at both end sides of the upper-layer joint substrate 55 .

[0116] (Common matters)

[0117] The middle-layer connector substrate 54 and the lower-layer connector substrate 56 of the first embodiment are conceptually equivalent to the connector substrate 54A of the second embodiment. In the first embodiment, two acrylic plates (54, 56) are stacked and joined, and thus in the second embodiment, connector substrates 54A (middle-layer connector substrate 54, lower-layer connector substrate 56) are respectively produced from a single acrylic plate (54A). Therefore, it can be said that the difference between the first embodiment and the second embodiment lies in the manufacturing method of the connector substrate 54A.

[0118] From the different aspects of such a manufacturing method, the connector substrate 54A and the upper connector substrate 55 can also be integrally formed. As an example, a 3D printer can be used to realize an integrally formed product of the connector substrate 54A and the upper connector substrate 55. In this case, a support is pre-set in the portion that becomes the connecting flow path 52 and the pair of connector connecting holes 53, and the modeling is also performed including the support. After the modeling is completed, by removing the support, a plate-shaped connector chip 51 having a connecting flow path 52 inside and a pair of connector connecting holes 53 on both ends of the upper surface for connecting the connecting flow path 52 with the micro space MS is completed.

[0119] In this embodiment, an example of generating the connector chip 51 from one or more acrylic plates (54 to 56, 54A and 55), i.e., acrylic resin, is shown, but it is not limited to acrylic resin, and polydimethylsiloxane (PDMS), glass, polycarbonate (PC), polyethylene terephthalate (PET), cycloolefin polymer (COP), etc. can also be used as materials to manufacture the connector chip 51. In addition, the connector chip 51 can also be manufactured using various materials such as ABS resin and PLA resin, ASA resin (strong weather resistance), PP resin (strong heat resistance and chemical resistance), PC resin or nylon resin, acrylic resin, PETG, thermoplastic polyurethane, etc.

[0120] (4) Guide

[0121] like Fig.11 As shown, the guide 71 is formed of, for example, a resin material, and includes an upper holding region 73 with an open upper surface, and includes a pair of lower holding regions 74 at both ends of the upper holding region 73 .

[0122] When viewed from the mounting surface 72 located at both ends of the guide 71, the upper portions of the two side walls of the upper holding area 73 are cantilevered in a manner facing each other, forming a pair of rails 75 for guiding the sliding movement of the main chip 31. The main chip 31 is inserted from the mounting surface 72 along these rails 75, and is accommodated and held in the upper holding area 73. The main chip 31 accommodated in the upper holding area 73 exposes the micro space MS to the outside from the space between the pair of rails 75, and can be visually recognized and handled from the outside.

[0123] The pair of lower holding areas 74 are connected to the mounting surface 72 in a form of descending from the bottom surface of the upper holding area 73. Therefore, the lower holding area 74 is open to the mounting surface 72 side when the main chip 31 is held in the upper holding area 73, and receives the installation of the connector chip 51 based on sliding movement. At this time, the depth of the lower holding area 74 is set to half the length of the connector chip 51.

[0124] As described above, the plurality of microfluidic chips 11 can be Figure 1 The microfluidic chips 11 are connected to each other in the X direction. The connection between the microfluidic chips 11 is realized by the connection part 76 provided on the mounting surface 72 of the guide 71. The connection part 76 is composed of a plurality of magnets 76a embedded in the mounting surface 72.

[0125] In this embodiment, the connection of each guide member 71 has directionality, for example, when one guide member 71 is connected to another guide member 71, the surfaces that face each other and engage with each other are predetermined. Fig.11 In the embodiment, the visible surface on the front side is set as the mounting surface 72A, and the invisible surface on the back side is set as the mounting surface 72B. Under this premise, when connecting two guides 71, the mounting surface 72A of one guide 71 is connected to the mounting surface 72B of the other guide 71, and the mounting surface 72B of one guide 71 is connected to the mounting surface 72A of the other guide 71.

[0126] Therefore, the polarities of the magnets 76a embedded in the mounting surface 72A and the magnets 76a embedded in the mounting surface 72B of the connection portion 76 are different. Thus, the magnets 76a are attracted to each other by magnetic force, and the two guides 71 can be connected in a fixed state.

[0127] The guide 71 also has a limiting portion 77. The limiting portion 77 has a structure that limits the displacement of the two guides 71 in the stacking direction of the main chip 31 and the connector chip 51 when the two guides 71 are connected to each other. Such a limiting portion 77 includes a convex step portion 77a provided on the mounting surface 72A and a concave step portion 77b provided on the mounting surface 72B. The convex step portion 77a extends from the mounting surface 72A to the longitudinal direction ( Figure 1 The recessed step portion 77b protrudes from the mounting surface 72B in the X direction, and the recessed step portion 77b is recessed from the mounting surface 72B in the length direction so that they fit into each other.

[0128] When the two guide members 71 are connected, the convex step portion 77a of one guide member 71 is engaged with the concave step portion 77b of the other guide member 71, or the concave step portion 77b of one guide member 71 is engaged with the convex step portion 77a of the other guide member 71, thereby limiting the misalignment of the two guide members 71 in the stacking direction of the main chip 31 and the connector chip 51.

[0129] (5) Microfluidic Chip

[0130] Fig.12 1 is a perspective view of the microfluidic chip 11 of the first embodiment using the main chip 31 and the connector chip 51 of the first embodiment. Fig.14 This is a schematic diagram showing the microfluidic chip 11 according to the first embodiment without the guide 71 . Fig.131 is a perspective view of the microfluidic chip 11 of the second embodiment using the main chip 31 and the connector chip 51 of the second embodiment. Fig.15 This is a schematic diagram showing the microfluidic chip 11 according to the second embodiment without the guide 71 .

[0131] like Fig.12 and Fig.13 As shown, when the main chip 31 is mounted in the upper holding area 73 of the guide 71 and the connector chip 51 is mounted in the lower holding area 74, the microfluidic chip 11 is assembled. At this time, the connector chip 51 is inserted into the lower holding area 74 with half of its length and is held, and the remaining half is in a state of protruding from the mounting surface 72. The protruding half of the connector chip 51 is inserted into the lower holding area 74 of the guide 71 provided on another microfluidic chip 11 and is held, and the other microfluidic chip 11 is connected to the microfluidic chip 11.

[0132] So, if Fig.14 and Fig.15 As shown, the main chip 31 and the connector chip 51 are stacked, and the microscopic spaces MS of the two microfluidic chips 11 are connected to the connector chip 51 to form a flow path FC.

[0133] In more detail, the joint communication hole 53 provided on the upper joint substrate 55 of the joint chip 51 is connected to the main communication hole 33 provided on the lower main substrate 36 of the main chip 31. Thus, the respective microscopic spaces MS of the two microfluidic chips 11 are connected via the main communication hole 33 of one microfluidic chip 11, the joint communication hole 53 on one end side of the joint chip 51 spanning the two microfluidic chips 11, the connecting flow path 52, the joint communication hole 53 on the opposite end side, and the main communication hole 33 of the other microfluidic chip 11.

[0134] When such a flow path FC is formed, a gap between the stacked main chip 31 and the tab chip 51 is sealed by a rubber sheet 58 provided on the upper surface of the tab chip 51 to prevent leakage of the liquid flowing in the flow path FC.

[0135] (6) Another embodiment of the sealing structure

[0136] The sealing structure for sealing the flow path FC between the main chip 31 and the tab chip 51 is not limited to the structure using the rubber sheet 58 , and can also be realized by a structure using an O-ring 61 .

[0137] like Figures 16 to 18As shown, the upper connector substrate 55 of the connector chip 51 is provided with an annular recess 62 in a manner surrounding a pair of connector connecting holes 53. The main chip 31 and the connector chip 51 are respectively held in the upper holding area 73 and the lower holding area 74 of the guide 71, and when the connector chip 51 overlaps with the main chip 31, the recess 62 forms a connecting space CS where the connector connecting holes 53 and the main connecting holes 33 are connected to each other.

[0138] The O-ring 61 is embedded in the inner wall 63 forming the recess 62, and slightly protrudes from the surface of the upper connector substrate 55, so as to contact the lower main substrate 36 (first embodiment) or the main substrate 34A (second embodiment) of the main chip 31. Thus, the O-ring 61 seals the communication space CS to prevent the liquid flowing in the flow path FC from leaking out at the connection portion between the main chip 31 and the connector chip 51.

[0139] like Fig.17 , Fig.18 As shown, the outer diameter of the O-ring 61 is larger than the inner diameter of the recess 62 , and the O-ring 61 fitted into the inner wall 63 of the recess 62 is elastically deformed and sunk into the recess 62 .

[0140] like Fig.19 As shown, when the main chip 31 is mounted in the upper holding area 73 of the guide 71 and the connector chip 51 is mounted in the lower holding area 74, the microfluidic chip 11 is assembled. At this time, the connector chip 51 is inserted into the lower holding area 74 with half of its length and is held, and the remaining half is in a state of protruding from the mounting surface 72. The protruding half of the connector chip 51 is inserted into and held in the lower holding area 74 of the guide 71 provided on another microfluidic chip 11, and the other microfluidic chip 11 is connected to the microfluidic chip 11. Therefore, the upper connector substrate 55 of the connector chip 51 protruding from the guide 71 exposes the O-ring 61 in order to connect to the other main chip 31 held by the guide 71 of the other microfluidic chip 11.

[0141] The sealing structure using the O-ring 61 can be applied to both the microfluidic chip 11 of the first embodiment and the microfluidic chip 11 of the second embodiment.

[0142] 2. Effect

[0143] (1) Function

[0144] When the microfluidic device 101 is needed, a combination of microfluidic chips 11 having micro spaces MS suitable for the application is planned, and these microfluidic chips 11 are connected in a row to assemble the microfluidic device 101. When the microfluidic device 101 is used, a tube, a syringe, etc. (not shown) are used to inject liquid such as a culture solution or a reagent into the supply hole 32 prepared on the upper surface of the main chip 31. Then, the liquid circulates in the flow path FC, and separation, stirring, heat treatment, fluorescence detection, etc. of the liquid corresponding to the selected micro space MS can be performed.

[0145] (2) Effect

[0146] The microfluidic device 101 of this embodiment has the following effects.

[0147] The main chips 31 having various fine spaces MS can be rearranged at will, and the flow path FC corresponding to the purpose can be easily assembled. In this case, if the flow path FC can be realized only by combining the standardized main chips 31 having fine spaces MS, there is no need to prepare special parts, and the flow path FC corresponding to the purpose can be produced on the spot.

[0148] If the master chips 31 are prepared by function, surface treatment and the like can be easily performed according to the purpose of research.

[0149] Since all the connected master chips 31 are arranged on the same plane, the states of the fine spaces MS included in all the master chips 31 can be visually observed, and processing such as fluorescence detection using an optical sensor can also be performed.

[0150] There is no limit to the number of microfluidic chips 11 that can be connected, and excellent expandability can be obtained. In addition, the microfluidic chip 11 can be expanded by simply inserting the main chip 31 and the connector chip 51 from the mounting surface 72 of the guide 71 and connecting the two guides 71, and the workability for expansion is good.

[0151] Since the parts constituting the flow path FC of both the main chip 31 and the connector chip 51 are in an open state, the insides can be easily cleaned.

[0152] Both the main chip 31 and the tab chip 51 can be easily manufactured simply by laminating and bonding acrylic plates ( 34 , 35 , 36 , 54 , 55 , 56 ).

[0153] Liquid leakage can be prevented by sealing the main chip 31 and the connector chip 51 with the rubber sheet 58. In addition, when the two guides 71 are connected, the limiting portion 77 limits the displacement of the main chip 31 and the connector chip 51 in the stacking direction, which can also prevent liquid leakage from the surface.

[0154] The two guides 71 can be easily connected by adsorption using the magnetic force of the magnet 76 a , and the microfluidic device 101 can be easily assembled.

[0155] 3. Modifications

[0156] Various modifications and changes can be made during implementation.

[0157] For example, in the microfluidic chip 11 of the first embodiment, specific values ​​of the size and thickness are listed for the three-layer acrylic plates (34, 35, 36, 54, 55, 56) constituting the main chip 31 and the connector chip 51, but this is merely an example. During implementation, acrylic plates (34, 35, 36, 54, 55, 56) of various sizes and thicknesses can be used to manufacture the main chip 31 and the connector chip 51.

[0158] This is also the case in the microfluidic chip 11 of the second embodiment. Regarding the two layers of acrylic plates (34A, 35, 54A, 55) that constitute the main chip 31 and the connector chip 51, the specific values ​​of the size and thickness are merely examples. During implementation, acrylic plates (34A, 35, 54A, 55) of various sizes and thicknesses can be used to manufacture the main chip 31 and the connector chip 51.

[0159] The main chip 31 and the connector chip 51 are not necessarily made of an acrylic plate, and may be made of other types of resin materials, glass, or the like.

[0160] The method of joining the acrylic plates is not limited to thermocompression bonding, and other methods such as bonding using an adhesive and vacuum compression bonding may be used.

[0161] The connection part 76 connecting the two guides 71 can be realized by not only the magnets 76a with different polarities adsorbing each other, but also by magnetic adsorption of the magnet 76a to the metal plate. Alternatively, it is not limited to the magnet 76a, and all connection structures such as screw fixing, clamp fixing, etc. can be applied to connect two parts.

[0162] In the above-mentioned embodiment, a structural example of combining the main chip 31 and the connector chip 51 of the first embodiment is introduced as the microfluidic chip 11 of the first embodiment, and a structural example of combining the main chip 31 and the connector chip 51 of the second embodiment is introduced as the microfluidic chip 11 of the second embodiment. The implementation is not limited to this, and the main chip 31 of the first embodiment and the connector chip 51 of the second embodiment, or the main chip 31 of the second embodiment and the connector chip 51 of the first embodiment can also be combined to form the microfluidic chip 11.

[0163] In addition, the microfluidic device 101 can be constructed by freely combining the main chip 31 and the connector chip 51 of the first embodiment, the main chip 31 and the connector chip 51 of the second embodiment, a sealing structure using a rubber sheet 58, a sealing structure using an O-ring 61, and their various deformations and changes.

[0164] All other variations and modifications are permitted.

[0165] Description of Reference Numerals

[0166] 11Microfluidic Chip

[0167] 31 Main chip

[0168] 32 supply holes

[0169] 33 Main connecting hole

[0170] 34A main substrate

[0171] 34 Middle layer main substrate

[0172] 35 Upper main substrate

[0173] 36 Lower main substrate

[0174] 37 Opening

[0175] 51 connector chip

[0176] 52-way universal flow path

[0177] 53 Connector connecting hole

[0178] 54A connector base plate

[0179] 54 middle layer connector substrate

[0180] 55 Upper connector substrate

[0181] 56 Lower connector substrate

[0182] 57 opening

[0183] 58 rubber sheet

[0184] 58a through hole

[0185] 61O-ring

[0186] 62 recess

[0187] 63 inner wall

[0188] 71 guides

[0189] 72, 72A, 72B mounting surface

[0190] 73 Upper holding area

[0191] 74 Lower holding area

[0192] 75 tracks

[0193] 76 connection

[0194] 76a Magnet

[0195] 77 Restriction Department

[0196] 77a Convex step

[0197] 77b Concave step

[0198] 101 Microfluidic Devices

[0199] CS Connected Space

[0200] FC flow path

[0201] MS micro space.

Claims

1. A microfluidic device comprising: The plate-shaped main chip has a tiny space inside for introducing liquid; a plate-shaped joint chip having a connecting flow path therein and a pair of joint communication holes at both ends of an upper surface thereof, the pair of joint communication holes being used to connect the connecting flow path with the minute space; and The guide comprises: an upper holding area for holding the main chip; and a lower holding area for selectively holding one of the two ends of the connector chip when the connector chip is partially stacked on the main chip held by the upper holding area. The main chip has a pair of main communication holes at both ends of the lower surface. The pair of main communication holes connect the tab communication holes of the tab chip held in the lower holding area with the minute space when the main chip is held in the upper holding area.

2. The microfluidic device according to claim 1, wherein The main chip has a supply hole for supplying liquid on an upper surface, and the supply hole communicates with the fine space.

3. The microfluidic device according to claim 1, wherein The main chip is bonded to an upper main substrate on the upper surface of the main substrate having the minute space and the pair of main communication holes.

4. The microfluidic device according to claim 1, wherein The master chip is bonded to an upper main substrate on an upper surface of a main substrate having the minute space and the pair of main communication holes, and the upper main substrate has the supply holes.

5. The microfluidic device according to claim 3, wherein The main substrate comprises: a middle main substrate having an opening portion serving as the minute space; and The lower main substrate has the pair of main communication holes communicating with the opening, and is bonded to the lower surface of the middle main substrate in a manner that closes the opening serving as the minute space.

6. The microfluidic device according to claim 3, wherein The main substrate integrally includes the minute space and the pair of main communication holes.

7. The microfluidic device according to claim 3, wherein The upper main substrate is light-transmissive. The guide holds the master chip in the upper holding area in a state where the upper main substrate is exposed.

8. The microfluidic device according to claim 7, wherein The main substrate and the upper main substrate are acrylic plates.

9. The microfluidic device according to claim 1, wherein The connector chip has an upper connector substrate bonded to an upper surface of the connector substrate having the communication flow path, and the upper connector substrate has the pair of connector communication holes.

10. The microfluidic device according to claim 9, wherein The connector substrate comprises: a middle-layer joint substrate having an opening serving as the communication flow path; and The lower-layer joint substrate is bonded to the lower surface of the middle-layer joint substrate so as to close the opening portion serving as the communication flow path.

11. The microfluidic device according to claim 9, wherein The connector substrate integrally includes the communication flow path.

12. The microfluidic device according to claim 9, wherein The joint substrate and the upper joint substrate are acrylic plates.

13. The microfluidic device according to claim 1, wherein The connector chip has a rubber sheet on the upper surface. The rubber sheet has a through hole at the position of the joint communication hole.

14. The microfluidic device according to claim 1, wherein The joint chip has an O-ring surrounding the joint communication hole on the upper surface. The O-ring seals a communication space where the joint communication hole and the main communication hole communicate with each other.

15. The microfluidic device according to claim 1, wherein The guide has a mounting surface on the end surface holding the connector chip, The main chip and the connector chip can be inserted from the mounting surface and mounted on the upper holding area and the lower holding area, respectively.

16. The microfluidic device according to claim 15, wherein The guide member holds the main chip in the upper holding area without extending the main chip. The guide has a connecting portion that detachably connects the mutually facing mounting surfaces of the guide holding one end of one of the connector chips and the other guide holding the opposite end.

17. The microfluidic device according to claim 16, wherein The connection portion connects the mounting surfaces of the two guide members to each other by magnetic force of magnets embedded in the mounting surfaces.

18. The microfluidic device according to claim 16, wherein The two guide members connected to each other have a restriction portion that restricts displacement of the two guide members in a stacking direction of the main chip and the connector chip.

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