Circuit board double-sided solder mask grinding device

Abstract

The invention relates to the technical field of circuit board production, in particular to a circuit board double-sided solder mask grinding device. The invention provides a circuit board double-sided resistance welding board grinding device which can grind the bottom surface of a circuit board while conveying the circuit board, saves manpower and improves the double-sided grinding efficiency of the circuit board. A circuit board double-sided solder mask grinding device comprises a grinding table, a grinding mechanism and the like, and the grinding mechanism capable of grinding a circuit board is arranged on the grinding table. A second air cylinder is started while a polishing roller rotates, a pressing disc is pushed to move downwards to make contact with the top face of a circuit board, the circuit board is relatively static on the polishing roller, the bottom face of the circuit board is polished through the polishing roller, the bottom face of the circuit board can be polished while the circuit board is conveyed, manpower is saved, and the production efficiency is improved. And the double-sided grinding efficiency of the circuit board is improved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, and in particular to a double-sided solder resist grinding device for a circuit board. Background Art

[0002] Circuit board is an indispensable part of electronic equipment. It provides a physical support platform for electronic components and realizes the electrical connection between electronic components through the conductive paths and traces printed on it. The circuit board solder mask grinding device is a device used in the manufacturing process of circuit boards (PCBs). It is mainly used to remove the solder mask on the surface of the circuit board to expose the pads or conductive paths during the soldering process.

[0003] In the existing circuit board solder mask grinding device, when grinding the circuit board, the circuit board is conveyed to the grinding table, and the grinding disc is moved down and rotated to grind the top surface of the circuit board. After the top surface of the circuit board is polished, the circuit board needs to be manually turned over to grind the bottom surface of the circuit board, which is time-consuming and labor-intensive, resulting in low circuit board grinding efficiency.

[0004] Therefore, a circuit board double-sided solder resist grinding plate device has been developed, which can grind the bottom surface of the circuit board while conveying the circuit board, save manpower, and improve the double-sided grinding efficiency of the circuit board. Summary of the invention

[0005] In order to overcome the disadvantage that after the top surface of the circuit board is polished, the circuit board needs to be manually turned over so that the bottom surface of the circuit board can be polished, which is time-consuming and labor-intensive and leads to low circuit board polishing efficiency, the present invention provides a circuit board double-sided solder resist grinding plate device which can polish the bottom surface of the circuit board while conveying the circuit board, saves manpower and improves the double-sided polishing efficiency of the circuit board.

[0006] A double-sided solder resist grinding device for a circuit board comprises a grinding table, a grinding mechanism and a pressing mechanism. The grinding table is provided with a grinding mechanism capable of grinding the circuit board, and the grinding table is also provided with a pressing mechanism capable of pressing the circuit board down for grinding.

[0007] Further explanation, the grinding mechanism includes a first servo motor, a grinding roller, a transmission assembly, a first support frame, a first cylinder, an adapter block, a second servo motor, a grinding disc and a placement table. The first servo motor is connected to the front side of the right part of the grinding table. A plurality of grinding rollers are rotatably connected to the right part of the grinding table. The output shaft of the first servo motor is connected to the rightmost grinding roller. A transmission assembly is provided between the grinding rollers. A first support frame is connected between the front and rear parts of the grinding table. The middle part of the first support frame is connected to the first cylinder. The adapter block is connected to the telescopic end of the first cylinder. The lower side of the adapter block is connected to the second servo motor. The grinding disc is connected to the output shaft of the second servo motor. The upper side of the middle part of the grinding table is connected to the placement table. The placement table is located below the grinding disc. The circuit board to be polished is placed on the grinding roller. Then the first servo motor is started to drive the grinding roller to rotate through the transmission assembly, so that the grinding roller transports the circuit board to the left.

[0008] To further explain, the transmission assembly includes a transmission wheel and a belt. The rear side of the grinding rollers are connected to the transmission wheels, and the front sides of the second and third grinding rollers from left to right are also connected to the transmission wheels. A belt is wrapped around the two front transmission wheels, a belt is wrapped around the transmission wheels on the rear sides of the first and second grinding rollers from left to right, and a belt is also wrapped around the transmission wheels on the rear sides of the third and fourth grinding rollers from left to right.

[0009] Further explanation, the pressing mechanism includes a two-way cylinder, a first connecting piece, a sliding rod, a first limiting plate, a second connecting piece, a guide plate, a second cylinder and a pressure plate. The lower side of the right part of the grinding table is connected with a two-way cylinder, the telescopic end of the two-way cylinder is connected with the first connecting piece, the upper part of the first connecting piece is connected with the sliding rod, the side where the sliding rods are close to each other is connected with the first limiting plate, the first limiting plate is located above the grinding roller, the first limiting plate is connected with the second connecting piece, the right part of the first support frame is connected with the guide plate, the second connecting piece is slidably connected to the guide plate, the middle part of the guide plate is connected with the second cylinder, and the telescopic end of the second cylinder is connected with the pressure plate. When the grinding roller rotates, the two-way cylinder is started to make the first connecting pieces approach each other, drive the sliding rods approach each other, and the second connecting piece slides on the guide plate until the first limiting plate contacts the circuit board, and the circuit board is centered and limited, and then the second cylinder is started to push the pressure plate to move downward and contact with the top surface of the circuit board, so that the circuit board is relatively stationary on the grinding roller, so that the grinding roller grinds the bottom surface of the circuit board.

[0010] Further description, it also includes a clamping mechanism, the clamping mechanism includes a first fixing part, a wedge block, a guide rod, a sliding plate, a spring and a clamping plate, the first fixing parts are connected to the front and rear sides of the adapter block, the first fixing parts are connected to the wedge blocks, the left and right guide rods are connected to the front and rear sides of the placement table, the sliding plates are slidably connected between the two adjacent guide rods, the clamping plates are slidably connected between the two adjacent guide rods, the clamping plates are located inside the sliding plates, and the sliding plates are connected to the adjacent clamping plates with left and right springs. When the placement table moves downward, it drives the first fixing part to move downward, so that the wedge block moves downward to squeeze the sliding plates to move closer to each other, and the clamping plates are brought closer to each other through the action of the springs to clamp the circuit board.

[0011] Further description, it also includes a dust suction mechanism, the dust suction mechanism includes a first dust suction head, a first hose, a dust cleaner, a second dust suction head and a second hose, the first dust suction head is connected to the middle part of the first limit plate, the first hose is connected between the first dust suction heads, the first hose passes through the guide plate, the upper sides of the front and rear parts of the first support frame are connected to the dust cleaner, the first hose is connected to the front dust cleaner, the front and rear parts of the grinding disc are connected to the second dust suction head, the second hose is connected between the second dust suction heads, and the second hose is connected to the rear dust cleaner. When the bottom surface of the circuit board is polished, the vacuum cleaner on the front side is started, so that the first dust suction head sucks the generated dust into the first hose, and then the dust enters the vacuum cleaner from the first hose for collection. When the top surface of the circuit board is polished, the vacuum cleaner on the rear side is started, so that the second dust suction head sucks the generated dust into the second hose, and then the dust enters the vacuum cleaner from the second hose for collection.

[0012] Further description: the vacuum cleaner is provided with a collection box.

[0013] Further description, it also includes a unloading mechanism, which includes a third servo motor, a sleeve, a telescopic plate, a third cylinder, a fourth cylinder and an electric suction cup. The third servo motor is connected to the upper left side of the grinding table, and the sleeve is connected to the output shaft of the third servo motor. The telescopic plate is slidably connected to the sleeve. The third cylinder is connected to the upper side of the sleeve, and the telescopic end of the third cylinder is connected to the telescopic plate. The right part of the telescopic plate is connected to the fourth cylinder, and the telescopic end of the fourth cylinder is connected to the electric suction cup. Start the third servo motor to drive the sleeve to rotate, and start the third cylinder to push the telescopic plate to move so that the electric suction cup is located above the circuit board. Then start the fourth cylinder to move the electric suction cup down and contact the top surface of the circuit board. Start the electric suction cup so that the electric suction cup adsorbs the circuit board.

[0014] Further description, it also includes a supporting mechanism, the supporting mechanism includes a second supporting frame, a second fixing member, a torsion spring and a second limiting plate, two front and rear second supporting frames are connected to the lower right side of the grinding table, the second supporting frames are each connected to a second fixing member, the second fixing members are each rotatably connected to a second limiting plate, and two left and right torsion springs are connected between the second limiting plates and the connected second fixing members, the unpolished circuit board is placed in the material frame, and then the material frame is placed between the second supporting frames, and the second limiting plate on the second fixing member is contacted with the material frame through the action of the torsion spring to limit the material frame.

[0015] To further illustrate, the second support frames are all L-shaped.

[0016] The beneficial effects of the present invention are as follows: 1. The present invention starts the second cylinder while the grinding roller rotates, pushing the pressure plate to move downward and contact the top surface of the circuit board, so that the circuit board is relatively stationary on the grinding roller, and the grinding roller grinds the bottom surface of the circuit board, thereby achieving the effect of being able to grind the bottom surface of the circuit board while conveying the circuit board, saving manpower and improving the efficiency of double-sided grinding of the circuit board.

[0017] 2. The present invention drives the first fixing member to move downward while the placement table moves downward, so that the wedge block moves downward to squeeze the sliding plates to move closer to each other, and the clamping plates are moved closer to each other through the action of the spring to clamp the circuit board, thereby achieving the effect of clamping the circuit board on the placement table and preventing the circuit board from shifting during the polishing process.

[0018] 3. When the top surface of the circuit board is polished, the vacuum cleaner on the rear side is started, so that the second vacuum head sucks the generated dust into the second hose, and then the dust enters the vacuum cleaner from the second hose for collection, thereby achieving the effect of being able to remove the dust generated when the circuit board is polished, and avoiding affecting the polishing accuracy of the circuit board.

[0019] 4. The present invention starts the fourth cylinder to move the electric suction cup downward to contact the top surface of the circuit board, starts the electric suction cup to adsorb the circuit board, then starts the third servo motor to rotate the sleeve, drives the telescopic plate to rotate, so that the circuit board is separated from the placement table, and then closes the electric suction cup to make the circuit board fall into the collection box for collection, thereby achieving the effect of automatically removing the circuit board from the placement table, saving manpower, and improving operational convenience.

[0020] 5. The present invention places the unpolished circuit board in a material frame, and then places the material frame between the second support frames. Through the action of the torsion spring, the second limiting plate on the second fixing member contacts the material frame to limit the material frame, thereby achieving the effect of supporting and placing the unpolished circuit board and facilitating loading. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0022] Figure 2 It is a partial three-dimensional structural schematic diagram of the present invention.

[0023] Figure 3 It is a schematic diagram of the three-dimensional structure of the grinding mechanism of the present invention.

[0024] Figure 4 It is a three-dimensional structural schematic diagram of the pressing mechanism of the utility model.

[0025] Figure 5 It is a schematic diagram of the three-dimensional structure of the clamping mechanism of the present invention.

[0026] Figure 6 It is a three-dimensional structural schematic diagram of the dust collection mechanism of the present invention.

[0027] Figure 7 It is a three-dimensional structural schematic diagram of the unloading mechanism of the present invention.

[0028] Figure 8 It is a schematic diagram of the three-dimensional structure of the support mechanism of the present invention.

[0029] Markings in the attached drawings: 1: grinding table, 2: grinding mechanism, 21: first servo motor, 22: grinding roller, 23: transmission assembly, 24: first support frame, 25: first cylinder, 26: adapter block, 27: second servo motor, 28: grinding disc, 29: placement table, 3: pressing mechanism, 31: bidirectional cylinder, 32: first connecting piece, 33: sliding rod, 34: first limiting plate, 35: second connecting piece, 36: guide plate, 37: second cylinder, 38: pressure plate, 4: clamping mechanism, 41: first fixed Part, 42: wedge block, 43: guide rod, 44: sliding plate, 45: spring, 46: clamping plate, 5: dust suction mechanism, 51: first dust suction head, 52: first hose, 53: vacuum cleaner, 54: second dust suction head, 55: second hose, 6: unloading mechanism, 61: third servo motor, 62: sleeve, 63: telescopic plate, 64: third cylinder, 65: fourth cylinder, 66: electric suction cup, 7: supporting mechanism, 71: second supporting frame, 72: second fixing member, 73: torsion spring, 74: second limiting plate. DETAILED DESCRIPTION

[0030] The present invention will be further described below in conjunction with specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention but are not intended to limit the present invention.

[0031] A double-sided solder mask grinding device for a circuit board, such as Figure 1 and Figure 2As shown, it includes a grinding table 1, a grinding mechanism 2 and a pressing mechanism 3. The grinding table 1 is provided with the grinding mechanism 2, and the grinding table 1 is also provided with the pressing mechanism 3.

[0032] like Figure 1 and Figure 3 As shown, the grinding mechanism 2 includes a first servo motor 21, a grinding roller 22, a transmission assembly 23, a first support frame 24, a first cylinder 25, a transfer block 26, a second servo motor 27, a grinding disc 28 and a placement table 29. The front side of the right part of the grinding table 1 is connected to the first servo motor 21, and the right part of the grinding table 1 is rotatably connected to four grinding rollers 22. The output shaft of the first servo motor 21 is connected to the grinding roller 22 on the far right. A transmission assembly 23 is arranged between the grinding rollers 22. The transmission assembly 23 includes a transmission wheel and a belt. The rear side of the grinding rollers 22 is connected to the transmission wheel, and the front sides of the second and third grinding rollers 22 from left to right are also connected to the transmission wheel. A belt is wound around the two driving wheels on the front side, a belt is wound around the driving wheels on the rear sides of the first and second grinding rollers 22 from left to right, and a belt is also wound around the driving wheels on the rear sides of the third and fourth grinding rollers 22 from left to right. A first support frame 24 is connected between the front and rear parts of the grinding table 1, a first cylinder 25 is connected to the middle part of the first support frame 24, a transfer block 26 is connected to the telescopic end of the first cylinder 25, a second servo motor 27 is connected to the lower side of the transfer block 26, a grinding disc 28 is connected to the output shaft of the second servo motor 27, and a placing table 29 is connected to the upper side of the middle part of the grinding table 1, and the placing table 29 is located below the grinding disc 28.

[0033] like Figure 1 and Figure 4 As shown, the pressing mechanism 3 includes a two-way cylinder 31, a first connecting member 32, a sliding rod 33, a first limiting plate 34, a second connecting member 35, a guide plate 36, a second cylinder 37 and a pressure plate 38. The two-way cylinder 31 is connected to the lower right side of the grinding table 1, the telescopic ends of the two-way cylinder 31 are connected to the first connecting members 32, the upper parts of the first connecting members 32 are connected to the sliding rods 33, the sides of the sliding rods 33 close to each other are connected to the first limiting plates 34, the first limiting plates 34 are located above the grinding roller 22, the first limiting plates 34 are connected to the second connecting members 35, the right part of the first support frame 24 is connected to the guide plate 36, the second connecting members 35 are slidably connected to the guide plate 36, the middle part of the guide plate 36 is connected to the second cylinder 37, and the telescopic end of the second cylinder 37 is connected to the pressure plate 38.

[0034] When using the present invention, firstly, the grinding table 1 is placed in the circuit board production area, and then the circuit board to be polished is placed on the grinding roller 22, and then the first servo motor 21 is started, and the driving wheel and the belt in the transmission assembly 23 are relatively moved to drive the grinding roller 22 to rotate, so that the grinding roller 22 conveys the circuit board to the left. While the grinding roller 22 rotates, the two-way cylinder 31 is started to make the first connecting member 32 approach each other, drive the sliding rod 33 to approach each other, and the second connecting member 35 slides on the guide plate 36 until the first limiting plate 34 contacts the circuit board, and the circuit board is centered. Then start the second cylinder 37 to push the pressure plate 38 downward to contact the top surface of the circuit board, so that the circuit board is relatively still on the grinding roller 22, so that the grinding roller 22 grinds the bottom surface of the circuit board. After the bottom surface of the circuit board is polished, the guide plate 36 and the pressure plate 38 are separated from the circuit board, and then the grinding roller 22 rotates to transport the circuit board to the placement table 29, and then the first cylinder 25 is started to push the adapter block 26 downward to contact the grinding disc 28 with the top surface of the circuit board, and then the second servo motor 27 is started to drive the grinding disc 28 to rotate, so that the grinding disc 28 grinds the top surface of the circuit board. In this way, the bottom surface of the circuit board can be polished while the circuit board is being transported, saving manpower and improving the efficiency of double-sided polishing of the circuit board.

[0035] like Figure 1 and Figure 5 As shown, a clamping mechanism 4 is also included, and the clamping mechanism 4 includes a first fixing member 41, a wedge block 42, a guide rod 43, a sliding plate 44, a spring 45 and a clamping plate 46. The first fixing member 41 is connected to the front and rear sides of the adapter block 26, and the wedge block 42 is connected to the first fixing member 41. The left and right guide rods 43 are connected to the front and rear sides of the placement table 29, and the sliding plate 44 is slidably connected between the two adjacent guide rods 43. The clamping plate 46 is slidably connected between the two adjacent guide rods 43, and the clamping plate 46 is located inside the sliding plate 44. The sliding plate 44 and the adjacent clamping plates 46 are connected with left and right springs 45.

[0036] By using the clamping mechanism 4 of the device, the circuit board can be clamped on the placement table 29. When the placement table 29 moves downward, the first fixing member 41 is driven to move downward, so that the wedge block 42 moves downward to squeeze the sliding plate 44 to move closer to each other. Through the action of the spring 45, the clamping plates 46 are moved closer to each other to clamp the circuit board, thereby clamping the circuit board on the placement table 29 and preventing the circuit board from shifting during the polishing process.

[0037] like Figure 1 and Figure 6As shown, a dust suction mechanism 5 is also included, and the dust suction mechanism 5 includes a first dust suction head 51, a first hose 52, a dust collector 53, a second dust suction head 54 and a second hose 55. The first dust suction head 51 is connected to the middle of the first limit plate 34, and the first hose 52 is connected between the first dust suction heads 51. The first hose 52 passes through the guide plate 36. The upper sides of the front and rear parts of the first support frame 24 are connected to the dust collector 53, and the dust collector 53 is provided with a collection box for collecting dust. The first hose 52 is connected to the front dust collector 53, and the front and rear parts of the grinding disc 28 are connected to the second dust suction head 54. The second hose 55 is connected between the second dust suction heads 54, and the second hose 55 is connected to the rear dust collector 53.

[0038] The dust suction mechanism 5 of the present device can be used to remove the dust generated when the circuit board is polished. When the bottom surface of the circuit board is polished, the front vacuum cleaner 53 is started, so that the first vacuum head 51 sucks the generated dust into the first hose 52, and then the dust enters the vacuum cleaner 53 from the first hose 52 for collection. When the top surface of the circuit board is polished, the rear vacuum cleaner 53 is started, so that the second vacuum head 54 sucks the generated dust into the second hose 55, and then the dust enters the vacuum cleaner 53 from the second hose 55 for collection. In this way, the dust generated when the circuit board is polished can be removed to avoid affecting the polishing accuracy of the circuit board.

[0039] like Figure 1 and Figure 7 As shown, it also includes a unloading mechanism 6, which includes a third servo motor 61, a sleeve 62, a telescopic plate 63, a third cylinder 64, a fourth cylinder 65 and an electric suction cup 66. The third servo motor 61 is connected to the upper left side of the grinding table 1, the sleeve 62 is connected to the output shaft of the third servo motor 61, the telescopic plate 63 is slidably connected to the sleeve 62, the third cylinder 64 is connected to the upper side of the sleeve 62, the telescopic end of the third cylinder 64 is connected to the telescopic plate 63, the right part of the telescopic plate 63 is connected to the fourth cylinder 65, and the telescopic end of the fourth cylinder 65 is connected to the electric suction cup 66.

[0040] The unloading mechanism 6 of the device can automatically remove the circuit board from the placement table 29. After the top surface of the circuit board is polished, the polishing disc 28 is reset, and then the third servo motor 61 is started to drive the sleeve 62 to rotate, and the third cylinder 64 is started to push the telescopic plate 63 to move so that the electric suction cup 66 is located above the circuit board, and then the fourth cylinder 65 is started to move the electric suction cup 66 downward to contact the top surface of the circuit board, and the electric suction cup 66 is started to make the electric suction cup 66 absorb the circuit board, and then the third servo motor 61 is started to rotate the sleeve 62 and drive the telescopic plate 63 to rotate so that the circuit board is separated from the placement table 29, and then the electric suction cup 66 is closed to make the circuit board fall into the collection box for collection, thereby automatically removing the circuit board from the placement table 29, saving manpower, and improving the convenience of operation.

[0041] like Figure 1 and Figure 8 As shown, it also includes a supporting mechanism 7, which includes a second supporting frame 71, a second fixing member 72, a torsion spring 73 and a second limiting plate 74. The lower right side of the grinding table 1 is connected to two front and rear second supporting frames 71, and the second supporting frames 71 are all L-shaped, which is convenient for placing the material frame. The second supporting frames 71 are all connected to the second fixing members 72, and the second fixing members 72 are all rotatably connected to the second limiting plates 74. The second limiting plates 74 are connected to the second fixing members 72 with two left and right torsion springs 73.

[0042] The support mechanism 7 of the device can be used to support the unpolished circuit board. The unpolished circuit board is placed in a material frame, and the material frame is then placed between the second support frames 71. Through the action of the torsion spring 73, the second limiting plate 74 on the second fixing member 72 is in contact with the material frame to limit the material frame, thereby supporting and placing the unpolished circuit board and facilitating loading.

[0043] It should be understood that the above description is only for exemplary purposes and is not meant to limit the present invention. Those skilled in the art will appreciate that variations of the present invention will be included within the scope of the claims herein.

Claims

1. A double-sided solder mask grinding device for a circuit board, characterized by: The invention comprises a grinding table (1), a grinding mechanism (2) and a pressing mechanism (3); the grinding table (1) is provided with a grinding mechanism (2) capable of grinding a circuit board; the grinding table (1) is also provided with a pressing mechanism (3) capable of pressing the circuit board downward for grinding.

2. A circuit board double-sided solder resist grinding device according to claim 1, characterized in that: The grinding mechanism (2) comprises a first servo motor (21), a grinding roller (22), a transmission assembly (23), a first support frame (24), a first cylinder (25), a transfer block (26), a second servo motor (27), a grinding disc (28) and a placement table (29). The front side of the right part of the grinding table (1) is connected to the first servo motor (21). The right part of the grinding table (1) is rotatably connected to a plurality of grinding rollers (22). The output shaft of the first servo motor (21) is connected to the grinding roller (22) on the far right. A transmission assembly (23) is arranged between the grinding rollers (22). The front and rear parts of the grinding table (1) are connected to the first support frame (24). ), a first cylinder (25) is connected to the middle of the first support frame (24), a transfer block (26) is connected to the telescopic end of the first cylinder (25), a second servo motor (27) is connected to the lower side of the transfer block (26), a grinding disc (28) is connected to the output shaft of the second servo motor (27), a placing table (29) is connected to the upper side of the middle of the grinding table (1), the placing table (29) is located below the grinding disc (28), a circuit board to be polished is placed on the grinding roller (22), and then the first servo motor (21) is started, and the grinding roller (22) is driven to rotate through the transmission component (23), so that the grinding roller (22) conveys the circuit board to the left.

3. A circuit board double-sided solder resist grinding device according to claim 2, characterized in that: The transmission assembly (23) comprises a transmission wheel and a belt. The rear side of each grinding roller (22) is connected to a transmission wheel. The front sides of the second and third grinding rollers (22) from left to right are also connected to transmission wheels. A belt is wound around the two front transmission wheels. A belt is wound around the transmission wheels on the rear sides of the first and second grinding rollers (22) from left to right. A belt is also wound around the transmission wheels on the rear sides of the third and fourth grinding rollers (22) from left to right.

4. A circuit board double-sided solder resist grinding device according to claim 2, characterized in that: The pressing mechanism (3) comprises a bidirectional cylinder (31), a first connecting member (32), a sliding rod (33), a first limiting plate (34), a second connecting member (35), a guide plate (36), a second cylinder (37) and a pressure plate (38). The lower right side of the grinding table (1) is connected with the bidirectional cylinder (31), the telescopic ends of the bidirectional cylinder (31) are connected with the first connecting member (32), the upper part of the first connecting member (32) is connected with the sliding rod (33), the side of the sliding rod (33) close to each other is connected with the first limiting plate (34), the first limiting plate (34) is located above the grinding roller (22), the first limiting plate (34) is connected with the second connecting member (35), the right part of the first support frame (24) is connected with the guide plate ( The first connecting member (36) and the second connecting member (35) are both slidably connected to the guide plate (36). The middle of the guide plate (36) is connected to a second cylinder (37). The telescopic end of the second cylinder (37) is connected to a pressure plate (38). When the grinding roller (22) rotates, the bidirectional cylinder (31) is started to make the first connecting members (32) approach each other, driving the sliding rods (33) to approach each other. The second connecting member (35) slides on the guide plate (36) until the first limiting plate (34) contacts the circuit board to limit the center of the circuit board. Then, the second cylinder (37) is started to push the pressure plate (38) downward to contact the top surface of the circuit board, so that the circuit board is relatively stationary on the grinding roller (22), so that the grinding roller (22) grinds the bottom surface of the circuit board.

5. A circuit board double-sided solder resist grinding device according to claim 4, characterized in that: The device also includes a clamping mechanism (4), which includes a first fixing member (41), a wedge block (42), a guide rod (43), a sliding plate (44), a spring (45) and a clamping plate (46). The first fixing member (41) is connected to both the front and rear sides of the transfer block (26), and the first fixing member (41) is connected to both the wedge block (42). The placement platform (29) is connected to both the front and rear sides of the placement platform (29), and the sliding plate (44) is slidably connected between two adjacent guide rods (43). A clamping plate (46) is slidably connected between two adjacent guide rods (43), and the clamping plate (46) is located inside the sliding plate (44). Two left and right springs (45) are connected between the sliding plate (44) and the adjacent clamping plates (46). When the placement table (29) moves downward, it drives the first fixing member (41) to move downward, so that the wedge block (42) moves downward to squeeze the sliding plates (44) to move closer to each other. Through the action force of the spring (45), the clamping plates (46) are moved closer to each other to clamp the circuit board.

6. A circuit board double-sided solder resist grinding device according to claim 5, characterized in that: The utility model also comprises a dust suction mechanism (5), the dust suction mechanism (5) comprises a first dust suction head (51), a first hose (52), a dust collector (53), a second dust suction head (54) and a second hose (55); the first dust suction head (51) is connected to the middle of the first limit plate (34); the first hose (52) is connected between the first dust suction heads (51); the first hose (52) passes through the guide plate (36); the upper sides of the front and rear parts of the first support frame (24) are connected to the dust collector (53); the first hose (52) is connected to the dust collector (53) on the front side; the front and rear parts of the grinding disc (28) are connected to the second dust suction head (54), a second hose (55) is connected between the second suction head (54), and the second hose (55) is connected to the vacuum cleaner (53) on the rear side. When the bottom surface of the circuit board is polished, the vacuum cleaner (53) on the front side is started, so that the first suction head (51) sucks the generated dust into the first hose (52), and then the dust enters the vacuum cleaner (53) from the first hose (52) for collection. When the top surface of the circuit board is polished, the vacuum cleaner (53) on the rear side is started, so that the second suction head (54) sucks the generated dust into the second hose (55), and then the dust enters the vacuum cleaner (53) from the second hose (55) for collection.

7. A circuit board double-sided solder resist grinding device according to claim 6, characterized in that: The dust collector (53) is provided with a collection box.

8. A circuit board double-sided solder resist grinding device according to claim 6, characterized in that: The grinding table (1) also includes a discharge mechanism (6), which includes a third servo motor (61), a sleeve (62), a telescopic plate (63), a third cylinder (64), a fourth cylinder (65) and an electric suction cup (66). The third servo motor (61) is connected to the upper left side of the grinding table (1), the sleeve (62) is connected to the output shaft of the third servo motor (61), the telescopic plate (63) is slidably connected to the sleeve (62), the upper side of the sleeve (62) is connected to the third cylinder (64), and the telescopic end of the third cylinder (64) is connected to the telescopic The telescopic plate (63) is connected with a fourth cylinder (65) on the right side, and an electric suction cup (66) is connected to the telescopic end of the fourth cylinder (65). The third servo motor (61) is started to drive the sleeve (62) to rotate, and the third cylinder (64) is started to push the telescopic plate (63) to move, so that the electric suction cup (66) is located above the circuit board, and then the fourth cylinder (65) is started to move the electric suction cup (66) downward to contact the top surface of the circuit board, and the electric suction cup (66) is started to adsorb the circuit board.

9. A circuit board double-sided solder resist grinding device according to claim 8, characterized in that: The polishing table (1) further comprises a supporting mechanism (7), which comprises a second supporting frame (71), a second fixing member (72), a torsion spring (73) and a second limiting plate (74). The lower right side of the polishing table (1) is connected to two front and rear second supporting frames (71), each of the second supporting frames (71) is connected to a second fixing member (72), each of the second fixing members (72) is rotatably connected to a second limiting plate (74), and two left and right torsion springs (73) are connected between the second limiting plates (74) and the second fixing members (72) connected thereto. An unpolished circuit board is placed in a material frame, and the material frame is then placed between the second supporting frames (71). Through the action of the torsion spring (73), the second limiting plate (74) on the second fixing member (72) contacts the material frame, thereby limiting the material frame.

10. A circuit board double-sided solder resist grinding device according to claim 9, characterized in that: The second support frames (71) are all L-shaped.

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