Colored UV viscosity-reducing adhesive tape for semiconductor manufacturing process and preparation method of colored UV viscosity-reducing adhesive tape

Abstract

The invention discloses a colored UV viscosity-reducing adhesive tape for a semiconductor manufacturing process and a preparation method of the colored UV viscosity-reducing adhesive tape. The viscosity-reducing adhesive tape comprises a transparent base film layer, a bottom coating, a UV viscosity-reducing adhesive layer and a release film layer, the bottom coating layer is prepared by coating and drying a water-based bottom coating agent; the UV viscosity-reducing glue layer is prepared by coating and drying UV viscosity-reducing glue; the preparation raw materials of the UV viscosity-reducing glue comprise the following components in parts by weight: 100 parts of acrylate pressure-sensitive adhesive, 70-80 parts of high-functionality acrylic acid modified polyurethane, 2-4 parts of liquid coloring agent, 0.5-2 parts of curing agent, 2-5 parts of photoinitiator and 20-80 parts of solvent. The UV visbreaking adhesive tape has large 180-degree stripping force before UV illumination and small 180-degree stripping force after UV illumination, the problem that the adhesive tape is difficult to identify by automatic equipment in the semiconductor manufacturing process can be solved, and the UV visbreaking adhesive tape is high in light transmittance and good in UV visbreaking effect.

Description

Technical Field

[0001] The invention relates to the technical field of adhesive tapes for semiconductor processes, and in particular to a colored UV adhesive tape for semiconductor processes and a preparation method thereof. Background Art

[0002] In the semiconductor component manufacturing process, such as wafer cutting and grinding, it is usually necessary to use tape or protective film to fix it to avoid damage caused by component movement during the cutting process. In addition, in the etching and washing process, when it is necessary to grind the partial surface of a component, in order to protect other parts that do not need to be processed from being affected, tape or protective film will be used to cover the parts that do not need to be processed first, and then peeled off after the processing is completed. This requires that in the semiconductor process, the bonding force before the wafer processing should be large enough, and the peeling force after processing should be small enough to facilitate peeling.

[0003] UV anti-adhesive tape refers to a tape that has high adhesion under normal conditions, but drops sharply after exposure to UV light, so it can be easily peeled off. This tape is often used as a protective tape in the processing of precision materials such as mobile phone screens, lithium batteries, magnetic heads, and semiconductor wafers. The existing UV anti-adhesive tape has a relatively small 180° peeling force before UV light exposure, which is not enough for the adhesion in the wafer process. The 180° peeling force after UV light exposure is not small enough, and residual adhesive is easily left when peeling. In addition, in the semiconductor process, the tape used is generally transparent, which is not conducive to machine recognition in the semiconductor process. Summary of the invention

[0004] In order to solve the above technical problems, the purpose of the present invention is to provide a colored UV anti-viscosity tape for semiconductor process and a preparation method thereof. The UV anti-viscosity tape of the present invention has a large 180° peeling force before UV irradiation, and a small 180° peeling force after UV irradiation, which is beneficial to fixation during wafer processing and solves the problems of difficult decrystalline and residual adhesive during peeling. Liquid colorant is added to the UV anti-viscosity adhesive layer to solve the problem that the tape is difficult to be recognized by automated equipment in the semiconductor process. The tape has high light transmittance and good UV anti-viscosity effect. At the same time, the adhesion between the UV anti-viscosity adhesive layer and the base film is relatively high.

[0005] In order to achieve the above technical objectives and the above technical effects, the present invention is implemented through the following technical solutions:

[0006] On one hand, the present invention provides a colored UV anti-viscosity tape for semiconductor process, comprising a transparent base film layer, a primer layer, a UV anti-viscosity adhesive layer and a release film layer; the primer layer is made by coating and drying a water-based primer; the UV anti-viscosity adhesive layer is made by coating and drying a UV anti-viscosity adhesive;

[0007] The raw materials for preparing the UV viscosity-reducing glue include the following components in parts by weight:

[0008]

[0009] Furthermore, the raw materials for preparing the water-based primer include the following components in parts by weight: 100 parts of water-based acrylic emulsion, 40-60 parts of water-based polyester resin emulsion, 1-3 parts of polyvinyl alcohol, and 30-50 parts of water.

[0010] Furthermore, the raw materials for preparing the acrylic pressure-sensitive adhesive include the following components in parts by weight: 120-150 parts of butyl acrylate, 40-80 parts of isooctyl acrylate, 10-20 parts of methyl methacrylate, 8-12 parts of hydroxypropyl acrylate, 5-10 parts of acrylic acid, 5-20 parts of terpene phenol resin, 0.5-1.5 parts of initiator, and 250-530 parts of solvent.

[0011] Furthermore, the synthesis method of the high-functionality acrylic modified polyurethane is as follows: hexamethylene diisocyanate trimer, polyol and pentaerythritol triacrylate are weighed respectively according to a molar ratio of isocyanate group, polyol hydroxyl group and acrylic alcohol hydroxyl group of 2.5:1:1.5; at a temperature of 65°C, the hexamethylene diisocyanate trimer and the polyol are reacted in the presence of a certain amount of metal carboxylate catalyst until the alcohol hydroxyl group is completely consumed; then pentaerythritol triacrylate, a certain amount of inhibitor and a certain amount of organic tin catalyst are respectively added, and the reaction is carried out until the isocyanate group is completely consumed; then a certain amount of solvent is added and kept warm at a temperature of 65°C for a certain time to obtain the high-functionality acrylic modified polyurethane.

[0012] Furthermore, the liquid colorant is a blue liquid colorant, and the liquid colorant is a mixture of two models POC-9375 and POC-9333.

[0013] Furthermore, the curing agent is a polyisocyanate curing agent.

[0014] Furthermore, the photoinitiator in the UV viscosity-reducing glue is a mixture of four types of photoinitiators, namely 184, TPO, BDK, and ITX1, in a ratio of 1:3:0.5:0.5.

[0015] Furthermore, the solvent in the UV viscosity-reducing glue is at least one of ethyl acetate, toluene, acetone and butanone.

[0016] Furthermore, the thickness of the transparent base film layer is 60-150 μm, the transparent base film layer is one of PE, PET, PO, PVC, and PI films, or a composite transparent film of two or more of PE, PET, PO, PVC, and PI materials; the transparent base film layer is one of PET, PO, PVC, and PI films; the thickness of the primer layer is 1 to 2 μm, the thickness of the UV viscosity-reducing adhesive layer is 15 to 25 μm, and the thickness of the release film layer is 25 to 50 μm.

[0017] Another aspect of the present invention provides a method for preparing a colored UV adhesive tape for semiconductor manufacturing, which comprises the following steps:

[0018] (1) Under yellow light, acrylate pressure-sensitive adhesive, high-functionality acrylic modified polyurethane, liquid colorant, curing agent, and photoinitiator are added to the solvent in proportion, and stirred for 20 to 30 minutes to mix evenly to obtain UV viscosity-reducing glue;

[0019] (2) coating a water-based primer on a transparent base film, drying and rolling up to obtain a pre-coated film;

[0020] (3) Under yellow light, the UV viscosity-reducing glue in step (1) is applied to the primer surface of the pre-coated film in step (2) by a scraper, and after drying, the glue surface is attached to the release surface of the release film;

[0021] (4) Reeling up and wrapping with a black wrapping film, and then aging at a temperature of 40-80° C. for 48 hours to obtain the blue UV anti-adhesive tape for semiconductor process.

[0022] The beneficial effects of the present invention are:

[0023] (1) The 180° peeling force of the adhesive tape of the present invention before UV irradiation is 15-25N / 25mm, and the 180° peeling force after UV irradiation is 0.01-0.05N / 25mm. The initial peeling force of the UV-reducing adhesive layer is relatively large, which is conducive to the fixation of the wafer, and solves the problems of flying crystals and chipping of the knife that may occur during cutting, and meets the use requirements. After UV irradiation, the peeling force decreases sharply, and it can be easily peeled off without other side effects, and solves the problems of difficult crystal removal and residual adhesive during peeling;

[0024] (2) In order to increase the adhesion between the UV anti-viscosity adhesive layer and the base film and prevent debonding during the process or peeling, the present invention adds a primer layer, and the water-based primer used in the primer layer has good film-forming properties and fast surface drying. It can react with the curing agent in the UV anti-viscosity adhesive layer to increase the bonding strength between the primer layer and the UV anti-viscosity adhesive layer, thereby improving the adhesion between the adhesive layer and the base film.

[0025] (3) Liquid colorant is added to the UV viscosity-reducing adhesive layer of the present invention, so that the adhesive layer has a colored effect, thereby solving the problem that the transparent adhesive tape is difficult to be recognized by automated equipment in the semiconductor process; and the present invention adds liquid colorant instead of the common color powder grinding paste, which can increase the permeability of the glue, and does not weaken the permeability of UV light while ensuring that the glue has a colored effect as a whole, thereby ensuring that the peeling force after UV light exposure can be fully reduced, and ensuring a good UV viscosity-reducing effect;

[0026] (4) The light transmittance of the adhesive tape of the present invention is 85-88%, and the haze is 3-5%, which enables UV light to pass through the colored UV anti-viscosity adhesive layer.

[0027] (5) The preparation method of the present invention has a simple process, does not require harsh production conditions and equipment, is particularly suitable for large-scale mass production, and has good economic benefits. DETAILED DESCRIPTION

[0028] The technical solutions in the present invention will be described clearly and completely below in conjunction with specific embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] The present invention provides a colored UV anti-viscosity tape for semiconductor process, comprising a transparent base film layer, a primer layer, a UV anti-viscosity adhesive layer and a release film layer; the primer layer is made by coating and drying a water-based primer; the UV anti-viscosity adhesive layer is made by coating and drying a UV anti-viscosity adhesive;

[0030] The raw materials for preparing the UV viscosity-reducing glue include the following components in parts by weight:

[0031]

[0032]

[0033] The raw materials for preparing the water-based primer include the following components in parts by weight: 100 parts of water-based acrylic emulsion, 40-60 parts of water-based polyester resin emulsion, 1-3 parts of polyvinyl alcohol, and 30-50 parts of water.

[0034] The raw materials for preparing the acrylic pressure-sensitive adhesive include the following components in parts by weight: 120-150 parts of butyl acrylate, 40-80 parts of isooctyl acrylate, 10-20 parts of methyl methacrylate, 8-12 parts of hydroxypropyl acrylate, 5-10 parts of acrylic acid, 5-20 parts of terpene phenol resin, 0.5-1.5 parts of initiator, and 250-530 parts of solvent. The initiator is azobisisobutyronitrile, the solvent can be ethyl acetate, and the solid content of the acrylic pressure-sensitive adhesive is 40%; the preparation method of the acrylic pressure-sensitive adhesive is: add the above raw materials to a reaction bottle in sequence, heat to 60-80°C, stir to react for 4-7h, cool and discharge, and obtain the acrylic pressure-sensitive adhesive.

[0035] A large amount of soft monomers, such as butyl acrylate, isooctyl acrylate, and hydroxypropyl acrylate with a low glass transition temperature, are added to the acrylic pressure-sensitive adhesive, so that the glass transition temperature of the acrylic pressure-sensitive adhesive formed by polymerization is low, thereby making the initial peeling force of the pressure-sensitive adhesive higher; in addition, the added terpene phenol resin can play a viscosity-increasing role and also improve the stickiness of the pressure-sensitive adhesive, thereby enhancing the peeling force of the mixed viscosity-reducing glue before UV light irradiation.

[0036] The synthesis method of the high-functionality acrylic modified polyurethane is as follows: hexamethylene diisocyanate trimer, polyol and pentaerythritol triacrylate are weighed respectively in a ratio of 2.5:1:1.5 of isocyanate group, polyol hydroxyl group and acrylic alcohol hydroxyl group; the polyol is preferably PPG-1000; at a temperature of 65°C, the hexamethylene diisocyanate trimer and the polyol are reacted in the presence of a certain amount of metal carboxylate catalyst until the alcohol hydroxyl group is completely consumed; then pentaerythritol triacrylate, a certain amount of inhibitor and a certain amount of organic tin catalyst are respectively added, and the reaction is carried out until the isocyanate group is completely consumed; then a certain amount of solvent is added and kept warm at 65°C for a certain time to obtain the high-functionality acrylic modified polyurethane. The solid content of the high-functionality acrylic modified polyurethane is 60%.

[0037] The present invention adopts HDI trimer and PETA to react, so that the acrylic acid functionality in the obtained acrylic acid modified polyurethane is higher, forming a three-dimensional network structure, so that the mixed viscosity-reducing glue is more fully cross-linked when UV light is irradiated, thereby reducing the peeling force of the glue after UV light irradiation.

[0038] The liquid colorant is a blue liquid colorant, and the liquid colorant is a mixture of two models POC-9375 and POC-9333, and the mixing ratio is 1:1. The liquid colorant used in the present invention is a new type of colored macromolecular polymer formed by introducing a chromophoric group into the main chain or side chain of a macromolecule through a certain chemical reaction. It has many characteristics such as high safety and will not be absorbed by the human body. It is a type of environmentally friendly product that saves energy, reduces emissions and reduces consumption. As a functional colored macromolecular compound, the liquid colorant not only has the light absorption performance of a small molecule colorant, but also has the stability of a polymer. This combination gives the product dual functions: that is, the molecular size of the macromolecule is large, high strength, easy film-forming, solvent resistance, migration resistance, heat resistance and processability, and the strong absorption and colorfulness of the organic colorant to light. The present invention uses a special blue macromolecular liquid colorant instead of the common blue color powder grinding paste, which can increase the permeability of the glue, and does not weaken the permeability of UV light while ensuring the overall blue effect of the glue, thereby ensuring that the peeling force after UV light can be fully reduced.

[0039] The curing agent is a polyisocyanate curing agent, such as N3390 and N3300 of Covestro. The use of a trifunctional isocyanate curing agent helps to improve the degree of crosslinking with the viscosity-reducing glue and the primer layer, and enhances the bonding strength of the primer layer and the UV viscosity-reducing glue layer.

[0040] The photoinitiator in the UV viscosity-reducing glue is a mixture of four types of photoinitiators: 184, TPO, BDK, and ITX1 in a ratio of 1:3:0.5:0.5. The mixture of the four types of photoinitiators helps to improve the penetration of the liquid colorant.

[0041] The solvent in the UV viscosity-reducing glue is at least one of ethyl acetate, toluene, acetone and butanone.

[0042] In the UV anti-viscosity tape, the thickness of the transparent base film layer is 60-150 μm, and the transparent base film layer is selected from one of PET, PO, PVC, and PI films, or is a composite transparent film of two or more of PE, PET, PO, PVC, and PI materials, and is further preferably a PO film; the thickness of the primer layer is 1-2 μm, the thickness of the UV anti-viscosity adhesive layer is 15-25 μm, and the thickness of the release film layer is 25-50 μm.

[0043] Another aspect of the present invention provides a method for preparing a colored UV adhesive tape for semiconductor manufacturing, which comprises the following steps:

[0044] (1) Under yellow light, acrylate pressure-sensitive adhesive, high-functionality acrylic modified polyurethane, liquid colorant, curing agent, and photoinitiator are added to the solvent in proportion, and stirred for 20 to 30 minutes to mix evenly to obtain UV viscosity-reducing glue;

[0045] (2) coating a water-based primer on a transparent base film, drying and rolling up to obtain a pre-coated film;

[0046] (3) Under yellow light, the UV viscosity-reducing glue in step (1) is applied to the primer surface of the pre-coated film in step (2) by a scraper, and after drying, the glue surface is attached to the release surface of the release film;

[0047] (4) Reeling up and wrapping with a black wrapping film, and then aging at a temperature of 40-80° C. for 48 hours to obtain the blue UV anti-adhesive tape for semiconductor process.

[0048] The present invention is further described below by means of specific examples.

[0049] The preparation methods of the acrylate pressure-sensitive adhesive and the high-functionality acrylic acid-modified polyurethane used in the following examples are as follows:

[0050] Acrylic pressure sensitive adhesive

[0051] The raw materials for preparing the acrylic pressure-sensitive adhesive include the following components in parts by weight: 120 parts of butyl acrylate, 50 parts of isooctyl acrylate, 10 parts of methyl methacrylate, 10 parts of hydroxypropyl acrylate, 10 parts of acrylic acid, 15 parts of terpene phenol resin, 1.5 parts of initiator, and 300 parts of solvent. The initiator is azobisisobutyronitrile, and the solvent is ethyl acetate; the preparation method of the acrylic pressure-sensitive adhesive is: add the above raw materials to a reaction bottle in sequence, heat to 80°C, stir to react for 5 hours, cool and discharge, and obtain the acrylic pressure-sensitive adhesive.

[0052] High functional acrylic modified polyurethane

[0053] Hexamethylene diisocyanate trimer, polyol PPG-1000 and pentaerythritol triacrylate are weighed respectively in a ratio of 2.5:1:1.5 among isocyanate group, polyol hydroxyl group and acrylic alcohol hydroxyl group; at a temperature of 65° C., hexamethylene diisocyanate trimer and polyol are reacted in the presence of a certain amount of metal carboxylate catalyst until the alcohol hydroxyl group is completely consumed; then pentaerythritol triacrylate, a certain amount of polymerization inhibitor and a certain amount of organic tin catalyst are added respectively, and the reaction is carried out until the isocyanate group is completely consumed; then a certain amount of solvent is added and the temperature is kept at 65° C. for a certain time to obtain the high-functionality acrylic modified polyurethane.

[0054] Example 1

[0055] A colored UV anti-viscosity tape for semiconductor process, comprising a transparent base film layer, a primer layer, a UV anti-viscosity adhesive layer and a release film layer; the primer layer is made by coating and drying a water-based primer; the UV anti-viscosity adhesive layer is made by coating and drying a UV anti-viscosity glue;

[0056] The raw materials for preparing the UV viscosity-reducing glue include the following components in parts by weight:

[0057]

[0058]

[0059] The raw materials for preparing the water-based primer include the following components in parts by weight: 100 parts of water-based acrylic emulsion, 45 parts of water-based polyester resin emulsion, 1 part of polyvinyl alcohol, and 30 parts of water.

[0060] Among them, the curing agent is a polyisocyanate curing agent, the photoinitiator is a mixture of four types of photoinitiators, namely 184, TPO, BDK, and ITX1, in a ratio of 1:3:0.5:0.5, and the liquid colorant is a mixture of two models, POC-9375 and POC-9333, in a mixing ratio of 1:1.

[0061] The thickness of the transparent base film layer is 85 μm, and the transparent base film layer is a PO film; the thickness of the primer layer is 1 μm, the thickness of the UV viscosity-reducing adhesive layer is 15 μm, and the thickness of the release film layer is 30 μm.

[0062] The method for preparing a colored UV adhesive tape for semiconductor manufacturing process comprises the following steps:

[0063] (1) Under yellow light, acrylate pressure-sensitive adhesive, high-functionality acrylic modified polyurethane, liquid colorant, curing agent, and photoinitiator are added to the solvent in proportion, and stirred for 30 minutes to mix evenly to obtain UV viscosity-reducing glue;

[0064] (2) coating a water-based primer on the PO base film, drying and rolling up to obtain a PO pre-coated film;

[0065] (3) Under yellow light, the UV viscosity-reducing glue in step (1) is applied to the primer surface of the PO pre-coated film in step (2) by a scraper, and after drying, the glue surface is attached to the release surface of the release film;

[0066] (4) Reeling up and wrapping with a black wrapping film, and then aging at 70° C. for 48 hours to obtain the blue UV anti-adhesive tape for semiconductor process.

[0067] Example 2

[0068] A colored UV anti-viscosity tape for semiconductor process, comprising a transparent base film layer, a primer layer, a UV anti-viscosity adhesive layer and a release film layer; the primer layer is made by coating and drying a water-based primer; the UV anti-viscosity adhesive layer is made by coating and drying a UV anti-viscosity glue;

[0069] The raw materials for preparing the UV viscosity-reducing glue include the following components in parts by weight:

[0070]

[0071] The raw materials for preparing the water-based primer include the following components in parts by weight: 100 parts of water-based acrylic emulsion, 50 parts of water-based polyester resin emulsion, 1.5 parts of polyvinyl alcohol, and 35 parts of water.

[0072] Among them, the curing agent is a polyisocyanate curing agent, the photoinitiator is a mixture of four types of photoinitiators, namely 184, TPO, BDK, and ITX1, in a ratio of 1:3:0.5:0.5, and the liquid colorant is a mixture of two models, POC-9375 and POC-9333, in a mixing ratio of 1:1.

[0073] The thickness of the transparent base film layer is 100 μm, and the transparent base film layer is a PO film; the thickness of the primer layer is 1.5 μm, the thickness of the UV viscosity-reducing adhesive layer is 20 μm, and the thickness of the release film layer is 40 μm.

[0074] The preparation method of Example 2 is the same as that of Example 1.

[0075] Example 3

[0076] A colored UV anti-viscosity tape for semiconductor process, comprising a transparent base film layer, a primer layer, a UV anti-viscosity adhesive layer and a release film layer; the primer layer is made by coating and drying a water-based primer; the UV anti-viscosity adhesive layer is made by coating and drying a UV anti-viscosity glue;

[0077] The raw materials for preparing the UV viscosity-reducing glue include the following components in parts by weight:

[0078]

[0079]

[0080] The raw materials for preparing the water-based primer include the following components in parts by weight: 100 parts of water-based acrylic emulsion, 60 parts of water-based polyester resin emulsion, 3 parts of polyvinyl alcohol, and 50 parts of water.

[0081] Among them, the curing agent is a polyisocyanate curing agent, the photoinitiator is a mixture of four types of photoinitiators, namely 184, TPO, BDK, and ITX1, in a ratio of 1:3:0.5:0.5, and the liquid colorant is a mixture of two models, POC-9375 and POC-9333, in a mixing ratio of 1:1.

[0082] The thickness of the transparent base film layer is 120 μm, and the transparent base film layer is a PO film; the thickness of the primer layer is 2 μm, the thickness of the UV viscosity-reducing adhesive layer is 15 μm, and the thickness of the release film layer is 25 μm.

[0083] The preparation method of Example 3 is the same as that of Example 1.

[0084] Comparative Example 1

[0085] A colored adhesive tape for semiconductor manufacturing process, comprising a transparent base film layer, a primer layer, an adhesive layer and a release film layer; the primer layer is made by coating and drying a water-based primer; the adhesive layer is made of acrylic pressure-sensitive adhesive;

[0086] The raw materials for preparing the UV viscosity-reducing glue include the following components in parts by weight:

[0087]

[0088] The acrylate pressure-sensitive adhesive is the acrylate pressure-sensitive adhesive used in Example 1, the curing agent is a polyisocyanate curing agent, and the liquid colorant is a mixture of two models POC-9375 and POC-9333, with a mixing ratio of 1:1.

[0089] The raw materials for preparing the water-based primer include the following components in parts by weight: 100 parts of water-based acrylic emulsion, 45 parts of water-based polyester resin emulsion, 1 part of polyvinyl alcohol, and 30 parts of water.

[0090] The thickness of the transparent base film layer is 85 μm, and the transparent base film layer is a PO film; the thickness of the primer layer is 1 μm, the thickness of the UV viscosity-reducing adhesive layer is 15 μm, the thickness of the release film layer is 30 μm, the release film is a silicone release film, and the release force is 0.01 to 0.03 N / 25 mm.

[0091] The method for preparing the colored tape for semiconductor process of Comparative Example 1 comprises the following steps:

[0092] (1) adding an acrylic pressure-sensitive adhesive, a liquid colorant, and a curing agent to a solvent in a certain proportion, stirring for 30 minutes to mix evenly, and obtaining a glue;

[0093] (2) coating a water-based primer on the PO base film, drying and rolling up to obtain a PO pre-coated film;

[0094] (3) applying the glue in step (1) onto the primer surface of the PO pre-coated film in step (2) by means of a scraper, and after drying, laminating the glue surface onto the release surface of the release film;

[0095] (4) Reeling up and wrapping with a black wrapping film, and then aging at 70° C. for 48 hours to obtain the blue tape for semiconductor process.

[0096] Comparative Example 2

[0097] A colored UV anti-viscosity tape for semiconductor manufacturing process, comprising a transparent base film layer, a UV anti-viscosity adhesive layer and a release film layer; the UV anti-viscosity adhesive layer is made by coating and drying UV anti-viscosity adhesive;

[0098] The raw materials for preparing the UV viscosity-reducing glue include the following components in parts by weight:

[0099]

[0100]

[0101] The high-functionality acrylic modified polyurethane is the acrylic pressure-sensitive adhesive used in Example 1, the curing agent is a polyisocyanate curing agent, and the liquid colorant is a mixture of two models POC-9375 and POC-9333, with a mixing ratio of 1:1.

[0102] The raw materials for preparing the acrylic pressure-sensitive adhesive include the following components in parts by weight: 120 parts of butyl acrylate, 50 parts of isooctyl acrylate, 10 parts of methyl methacrylate, 10 parts of hydroxypropyl acrylate, 10 parts of acrylic acid, 1.5 parts of initiator, and 300 parts of solvent. The initiator is azobisisobutyronitrile, and the solvent is ethyl acetate. The preparation method of the acrylic pressure-sensitive adhesive is: add the above raw materials to a reaction bottle in sequence, heat to 60-80°C, stir to react for 4-7h, cool and discharge, and obtain the acrylic pressure-sensitive adhesive.

[0103] The thickness of the transparent base film layer is 85 μm, and the transparent base film layer is a PO film; the thickness of the UV viscosity-reducing adhesive layer is 15 μm, and the thickness of the release film layer is 30 μm.

[0104] The method for preparing a colored UV adhesive tape for semiconductor manufacturing process comprises the following steps:

[0105] (1) Under yellow light, acrylate pressure-sensitive adhesive, high-functionality acrylic modified polyurethane, liquid colorant, curing agent, and photoinitiator are added to the solvent in proportion, and stirred for 30 minutes to mix evenly to obtain UV viscosity-reducing glue;

[0106] (2) Under yellow light, the UV viscosity-reducing glue in step (1) is applied to the PO film in step (2) by a scraper, and after drying, the glue surface is attached to the release surface of the release film;

[0107] (4) Reeling up and wrapping with a black wrapping film, and then aging at 70° C. for 48 hours to obtain the blue UV anti-adhesive tape for semiconductor process.

[0108] Comparative Example 3

[0109] A colored UV anti-viscosity tape for semiconductor process, comprising a transparent base film layer, a primer layer, a UV anti-viscosity adhesive layer and a release film layer; the primer layer is made by coating and drying a water-based primer; the UV anti-viscosity adhesive layer is made by coating and drying a UV anti-viscosity glue;

[0110] The raw materials for preparing the UV viscosity-reducing glue include the following components in parts by weight:

[0111]

[0112] The acrylic pressure-sensitive adhesive and the high-functionality acrylic modified polyurethane are the same as those used in Example 1, the curing agent is a polyisocyanate curing agent, and the photoinitiator is a mixture of four types of photoinitiators, namely, 184, TPO, BDK, and ITX1, in a ratio of 1:3:0.5:0.5.

[0113] The raw materials for preparing the water-based primer include the following components in parts by weight: 100 parts of water-based acrylic emulsion, 45 parts of water-based polyester resin emulsion, 1 part of polyvinyl alcohol, and 30 parts of water.

[0114] The thickness of the transparent base film layer is 85 μm, and the transparent base film layer is a PO film; the thickness of the primer layer is 1 μm, the thickness of the UV viscosity-reducing adhesive layer is 15 μm, and the thickness of the release film layer is 30 μm.

[0115] The preparation method of the colored UV anti-adhesive tape for semiconductor process is as described in Example 1.

[0116] The performance tests were performed on the adhesive tapes of the embodiments and comparative examples. The test results are shown in Table 1.

[0117] Table 1

[0118]

[0119]

[0120] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

[0121] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A colored UV adhesive tape for semiconductor process, characterized in that: It includes a transparent base film layer, a primer layer, a UV viscosity-reducing adhesive layer and a release film layer; the primer layer is made by coating and drying a water-based primer; the UV viscosity-reducing adhesive layer is made by coating and drying a UV viscosity-reducing glue; The raw materials for preparing the UV viscosity-reducing glue include the following components in parts by weight:

2. The colored UV adhesive tape for semiconductor process according to claim 1, characterized in that: The raw materials for preparing the water-based primer include the following components in parts by weight: 100 parts of water-based acrylic emulsion, 40-60 parts of water-based polyester resin emulsion, 1-3 parts of polyvinyl alcohol, and 30-50 parts of water.

3. The colored UV adhesive tape for semiconductor process according to claim 1, characterized in that: The raw materials for preparing the acrylic pressure-sensitive adhesive include the following components in parts by weight: 120-150 parts of butyl acrylate, 40-80 parts of isooctyl acrylate, 10-20 parts of methyl methacrylate, 8-12 parts of hydroxypropyl acrylate, 5-10 parts of acrylic acid, 5-20 parts of terpene phenol resin, 0.5-1.5 parts of initiator, and 250-530 parts of solvent.

4. The colored UV adhesive tape for semiconductor process according to claim 1, characterized in that: The synthesis method of the high-functionality acrylic modified polyurethane is as follows: hexamethylene diisocyanate trimer, polyol and pentaerythritol triacrylate are weighed respectively in a ratio of 2.5:1:1.5 among the molar ratio of isocyanate group, polyol hydroxyl group and acrylic alcohol hydroxyl group; at a temperature of 65°C, the hexamethylene diisocyanate trimer and polyol are reacted in the presence of a certain amount of metal carboxylate catalyst until the alcohol hydroxyl group is completely consumed; then pentaerythritol triacrylate, a certain amount of polymerization inhibitor and a certain amount of organic tin catalyst are respectively added, and the reaction is carried out until the isocyanate group is completely consumed; then a certain amount of solvent is added and the temperature is kept at 65°C for a certain time to obtain the high-functionality acrylic modified polyurethane.

5. The colored UV adhesive tape for semiconductor process according to claim 1, characterized in that: The liquid colorant is a blue liquid colorant, and the liquid colorant is a mixture of two models, POC-9375 and POC-9333.

6. The colored UV adhesive tape for semiconductor process according to claim 1, characterized in that: The curing agent is a polyisocyanate curing agent.

7. The colored UV adhesive tape for semiconductor process according to claim 1, characterized in that: The photoinitiator in the UV viscosity-reducing glue is a mixture of four types of photoinitiators: 184, TPO, BDK, and ITX1 in a ratio of 1:3:0.5:0.

5.

8. The colored UV adhesive tape for semiconductor process according to claim 1, characterized in that: The solvent in the UV viscosity-reducing glue is at least one of ethyl acetate, toluene, acetone and butanone.

9. The colored UV adhesive tape for semiconductor process according to claim 1, characterized in that: The thickness of the transparent base film layer is 60-150 μm, and the transparent base film layer is one of PE, PET, PO, PVC, and PI films or a composite transparent film of two or more of PE, PET, PO, PVC, and PI materials; the thickness of the primer layer is 1 to 2 μm, the thickness of the UV viscosity-reducing adhesive layer is 15 to 25 μm, and the thickness of the release film layer is 25 to 50 μm.

10. A method for preparing a colored UV adhesive tape for semiconductor manufacturing, characterized in that: The following steps are involved: (1) Under yellow light, acrylate pressure-sensitive adhesive, high-functionality acrylic modified polyurethane, liquid colorant, curing agent, and photoinitiator are added to the solvent in proportion, and stirred for 20 to 30 minutes to mix evenly to obtain UV viscosity-reducing glue; (2) coating a water-based primer on a transparent base film, drying and rolling up to obtain a pre-coated film; (3) Under yellow light, the UV viscosity-reducing glue in step (1) is applied to the primer surface of the pre-coated film in step (2) by a scraper, and after drying, the glue surface is attached to the release surface of the release film; (4) Reeling up and wrapping with a black wrapping film, and then aging at a temperature of 40-80° C. for 48 hours to obtain the blue UV anti-adhesive tape for semiconductor process.

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