Chip testing device

Abstract

The invention provides a chip testing device, and the device comprises a circuit board which is provided with a metal layer, and is used for connecting with an external part; the fixing device is arranged on the surface of one side of the circuit board and corresponds to the metal layer on the circuit board, and a chip is placed in the fixing device; and the connecting plate is arranged corresponding to the chip and is electrically connected with the metal layer, so that the metal layer and the chip can be conducted when the chip is placed in the fixing device, and the external component can test the chip through the circuit board. Through the mode, the chips of the same family can be continuously tested, and the connecting plates can be flexibly replaced according to the chips of different families, so that the testing efficiency of the chips is effectively improved.

Description

Technical Field

[0001] The present application is applied to the technical field of chip testing, and in particular relates to a chip testing device. Background Art

[0002] At present, with the development of science and technology, chips are used in all aspects of life, such as vehicles, batteries, mobile phones, etc. During the chip development stage, a large number of engineering development boards with different testing schemes are needed to test and verify the chips.

[0003] However, currently, chips are mostly tested and verified after being packaged, and the chips can only be tested by welding adapter boards during testing. Moreover, only chips of the same family can be tested. Other adapter boards are required for testing chips of different families, that is, the test equipment needs to be replaced, which makes the chip testing efficiency low and greatly increases the chip development cost. Summary of the invention

[0004] The present application provides a chip testing device to solve the problem of low chip testing and verification efficiency.

[0005] In order to solve the above technical problems, the present application provides a chip testing device, including: a circuit board, a metal layer is arranged on the circuit board, and the circuit board is used to connect external components; a fixing device, the fixing device is arranged on one side surface of the circuit board and corresponds to the metal layer on the circuit board, and the chip is placed in the fixing device; a connecting board, the connecting board is arranged corresponding to the chip and is electrically connected to the metal layer to conduct the metal layer and the chip when the chip is placed in the fixing device, so that the external component can test the chip through the circuit board.

[0006] The connecting plate is a conductive sheet or a probe assembly, and the conductive sheet or the probe assembly is electrically connected to the metal layer so as to conduct electricity between the metal layer and the chip when a chip is placed in the fixing device.

[0007] The connecting plate is a conductive sheet, which is a flexible conductive film, and conductive particles or conductive wires are arranged in the conductive sheet to connect the pins of the chip.

[0008] Among them, an adapter plate is arranged between the connecting plate and the metal layer, and the adapter plate, the metal layer and the connecting plate are arranged correspondingly.

[0009] Among them, the fixing device includes: a positioning plate, which is arranged on one end surface of the circuit board and has a positioning channel adapted to the chip; a support member, which is arranged on one end surface of the positioning plate away from the circuit board and has a accommodating space.

[0010] Among them, the fixing device also includes: a cover plate, which is hinged to the support member; an elastic component, which is arranged on the side of the cover plate close to the support member; and a pressure block, which is arranged on the side of the elastic component away from the cover plate; wherein, when the cover plate rotates toward the circuit board, the pressure block abuts against the chip to fix the chip.

[0011] Among them, the fixing device also includes: a connector plate, which is arranged between the elastic component and the pressure block, and is provided with an interface at least partially exposed to the cover plate for connecting an external power supply; a conductive member, which is arranged on a side of the connector plate close to the pressure block, and the pressure block is provided with a conductive hole, and the conductive member is electrically connected to the chip via the conductive hole.

[0012] Wherein, a protrusion is arranged on a side of the pressing block away from the cover plate, and the protrusion is matched with the positioning channel.

[0013] The metal layer protrudes from the surface of the circuit board.

[0014] Wherein, a connecting piece is arranged on the circuit board, and the connecting piece is used to connect external components.

[0015] The beneficial effects of the present application are as follows: different from the prior art, the present application arranges a fixing device corresponding to the metal layer on the circuit board, so that the chip to be tested can be placed inside the fixing device, and a connecting plate is arranged on the metal layer, and the chip and the circuit board are connected through the connecting plate, so that external components can test the chip through the circuit board, chips of the same family can be tested continuously, and the connecting plate can be flexibly replaced according to chips of different families, thereby effectively improving the testing efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the first embodiment of the exploded view of the chip testing device of the present application;

[0017] Figure 2 This is a structural schematic diagram of an embodiment of the connection between the fixing device of the present application and the circuit board;

[0018] Figure 3 It is a structural schematic diagram of an embodiment of the fixing device of the present application;

[0019] Figure 4 This is a schematic structural diagram of an embodiment of the present application in which the conductive sheet is a conductive wire;

[0020] Figure 5 It is a schematic diagram of the structure of the connection between the circuit board and the metal layer of the present application;

[0021] Figure 6 It is a structural schematic diagram of the second embodiment of the exploded view of the chip testing device of the present application;

[0022] Figure 7It is a structural schematic diagram of another embodiment of the connection between the fixing device of the present application and the circuit board;

[0023] Figure 8 It is a structural schematic diagram of another embodiment of the fixing device of the present application;

[0024] Fig. 9 It is a structural schematic diagram of the third embodiment of the exploded view of the chip testing device of the present application;

[0025] Fig.10 It is a structural schematic diagram of the fourth embodiment of the exploded view of the chip testing device of the present application. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0027] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0028] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0029] See also Figure 1 , Figure 1 It is a structural schematic diagram of an embodiment of a chip testing device provided in the present application.

[0030] The present application provides a chip testing device, such as Figure 1As shown, a chip 14 testing device of this embodiment includes: a circuit board 11, a fixture 12 and a connecting board 13. A metal layer 111 is provided on the circuit board 11, and the circuit board 11 is used to connect an external component (not shown in the figure). The fixture 12 is provided on a side surface of the circuit board 11 and is provided corresponding to the metal layer 111 on the circuit board 11. The fixture 12 is used to place a chip 14. The connecting board 13 is provided corresponding to the chip 14 and is electrically connected to the metal layer 111, so that when the chip 14 is placed in the fixture 12, the metal layer 111 and the chip 14 are connected, so that the external component can test the chip 14 through the circuit board 11. Among them, the chip 14 is an unpackaged test chip 14, and the external device can be a tester, an ATE (Automatic Test Equipment) tester (automatic tester), which is not specifically limited in this application. A test circuit and an electronic device are provided on the circuit board 11 to form a specific test loop when the external component tests the chip 14.

[0031] In an optional embodiment, further see Figure 2 and Figure 5 , a metal layer 111 is provided on the circuit board 11, wherein the metal layer 111 is a metal conductor, a plurality of metal conductors are provided, adjacent metal conductors are not connected to each other, and the metal conductors are connected inside the circuit board 11, thereby forming a test loop, and the metal conductors can be connected specifically according to the chip 14 to be tested, so as to cope with testing different chips 14. The fixing device 12 is provided on the side of the circuit board 11 with the metal layer 111, and corresponds to the metal layer 111 on the circuit board 11. When testing the chip 14, the chip 14 is placed inside the fixing device 12, so that the chip 14 corresponds to the metal layer 111 on the circuit board 11, and the connecting plate 13 is provided corresponding to the chip 14, and can be specifically attached to the metal layer 111 of the circuit board 11, so that the connecting plate 13 is electrically connected to the metal layer 111, so that the chip 14 is connected to the metal layer 111 on the circuit board 11 through the connecting plate 13. When testing the chip 14, the chip 14 can be placed in the fixture 12. Under the action of the fixture 12, the connection board 13 conducts the chip 14 and the metal layer 111. At this time, the circuit board 11 can be connected to the external components. Since the chip 14 is connected to the metal layer 111 on the circuit board 11, the external components can form a test loop between the metal layer 111 and the connection board 13 to test the chip 14. The external components test the chip 14 through the circuit board 11, and verify the chip 14 through the external components.

[0032] In a specific application scenario, when testing the chip 14, the circuit board 11 is connected to an external component, the connecting plate 13 is attached to the metal layer 111 of the circuit board 11, and the fixing device 12 is fixed to the end face of the circuit board 11, so that the metal layer 111 of the circuit board 11 is provided with the connecting plate 13 and the fixing device 12. When testing, the chip 14 is placed in the fixing device 12, and the chip 14 is connected to the connecting plate 13 through the fixing device 12. Since the connecting plate 13 is connected to the metal layer 111 of the circuit board 11, the chip 14 is connected to the circuit board 11, thereby forming a test loop, and the chip 14 can be tested through external components. After testing a chip 14, the fixing device 12 can be opened to take out the chip 14 after the test, and then another chip 14 can be placed in the fixing device 12, so that the chip 14 can be tested again. Therefore, the chip 14 testing device can effectively improve the efficiency of testing the chip 14. In this embodiment, when it is necessary to test other different chips 14, since the pins of different chips 14 are different, the connecting board 13 can be replaced to cope with the pins of different chips 14, so that a test circuit is formed between the metal layer 111 of the circuit board 11 and the chip 14 to test different chips 14, that is, when testing different chips 14, the connecting board 13 can be replaced, thereby improving the efficiency of chip 14 testing.

[0033] In the above embodiment, by setting a fixing device 12 corresponding to the metal layer 111 on the circuit board 11, the chip 14 to be tested can be placed inside the fixing device 12, and a connecting board 13 is set on the metal layer 111. The chip 14 and the circuit board 11 are connected through the connecting board 13, so that the external component can test the chip 14 through the circuit board 11. The chips 14 of the same family can be tested continuously, and the connecting board 13 can be flexibly replaced according to the chips 14 of different families, which effectively improves the testing efficiency of the chip 14.

[0034] In an optional embodiment, if Figure 4As shown, when the connecting plate 13 is set as a conductive sheet 131, the conductive sheet 131 is a flexible conductive film, which is specifically formed by a fine flexible conductor. A number of conductive particles or conductive wires are arranged in the conductive sheet 131. Taking the arrangement of a number of conductive wires 1311 in the conductive sheet 131 as an example, when the chip 14 is tested, the conductive sheet 131 is embedded in the metal layer 111 of the circuit board 11, so that the chip 14 forms a test loop between the conductive sheet 131 and the circuit board 11, so that the external component can test the chip 14 through the circuit board 11. Among them, the conductive sheet 131 needs to be customized frequently according to the chip 14 to be tested. Specifically, it can be customized according to the spacing between the pins of the chip 14, so that when the chip 14 is tested, the conductive sheet 131 is electrically connected to the pins of the chip 14. Since the conductive sheet 131 is a flexible conductive film, when the chip 14 is tested, the flexible conductive film does not damage the chip 14, thereby preventing the conductive sheet 131 from damaging the chip 14 when the chip 14 is tested. When testing different chips 14, the conductive sheet 131 can be flexibly replaced to cope with different chips 14 being tested.

[0035] In this embodiment, a test circuit is established between the chip 14 and the circuit board 11 through the conductive sheet 131. At this time, the pins of the chip 14 and the power supply are arranged on the same side. When testing the chip 14, the chip 14 with the pins and the power supply close to the conductive sheet 131 is placed in the fixing device 12, so that the circuit board 11 can perform a power supply test on the chip 14 through the metal layer 111.

[0036] For further information, see Figure 1 and Figure 3 The fixing device 12 includes: a positioning plate 121 and a support member 122. The positioning plate 121 is arranged on the end surface of the circuit board 11, and the support member 122 is arranged on the end surface of the positioning plate 121 away from the circuit board 11. A positioning channel 1211 adapted to the chip 14 is provided in the positioning plate 121, and a receiving space 1221 is provided in the support member 122. When testing the chip 14, the chip 14 passes through the receiving space 1221 on the support member 122, and the chip 14 is positioned through the positioning channel 1211, so that the chip 14 is placed in the positioning plate 121, and the chip 14 is positioned through the positioning channel 1211, so as to prevent the chip 14 from being offset from the conductive sheet 131 when testing the chip 14, thereby preventing the chip 14 from forming a loop with the metal layer 111 of the circuit board 11. Among them, the support member 122 can be specifically made of ceramics to prevent leakage and the like when testing the chip 14. In other embodiments, the support member 122 can also be made of resin material, or other insulating materials with a certain structural strength. This application does not make specific limitations here.

[0037] In the present embodiment, since the conductive sheet 131 is attached to the metal layer 111 of the circuit board 11, that is, the conductive sheet 131 can be further clamped between the circuit board 11 and the support member 122, and the conductive sheet 131 is fixed by clamping the support member 122 and the circuit board 11, it is prevented that the conductive sheet 131 is offset when testing the chip 14, resulting in failure to form a test circuit between the chip 14 and the circuit board 11. The size of the positioning channel 1211 provided on the support member 122 can be adjusted so as to cope with chips 14 of different sizes when testing the chip 14. The metal layer 111 on the circuit board 11 protrudes from the surface of the circuit board 11, so as to facilitate the attachment of the conductive sheet 131 to the metal layer 111. Figure 2 As shown, a connector 15 is provided on the circuit board 11. When the chip 14 is tested, the external component can be connected to the circuit board 11 through the connector 15. The external component can be connected to the connector 15 through a flexible data bus, or other communication connections can be used, which is not specifically limited in this application.

[0038] In an optional embodiment, the fixing device 12 further includes a cover plate 123, an elastic component 124 and a pressing block 125, the cover plate 123 is hingedly arranged with the support member 122, the elastic component 124 is arranged on a side of the cover plate 123 close to the support member 122, and the pressing block 125 is arranged on a side of the elastic component 124 away from the cover plate 123. The cover plate 123 is hingedly arranged with the support member 122, specifically, one side end of the cover plate 123 is rotatably connected with one side of the support member 122, so that when the chip 14 is tested, the cover plate 123 can be rotated to put the chip 14 into the positioning plate 121. Among them, the elastic component 124 can be specifically fixed on an end face of one side close to the support member 122, and a plurality of springs are evenly arranged on the elastic member, one end of the spring is in contact with the end face of the cover plate 123, and a pressure block 125 is arranged at one end of the elastic component 124 away from the cover plate 123, that is, the other end of the spring is in contact with the pressure block 125. Specifically, the pressure block 125 and the elastic component 124 are movably arranged, that is, a sliding rod can be arranged on an end face of one side of the elastic member away from the cover plate 123, the pressure block 125 is sleeved on the sliding rod, and a limiting structure is arranged at one end of the sliding rod away from the elastic member, so as to limit the stroke of the pressure block 125, and the slider can also be movably fixed to the elastic component 124 by other fixing methods. The end of the cover plate 123 away from the hinged end of the support member 122 is detachably connected to the support member 122, for example, it can be connected in a snap-fit ​​manner, a snap-fit ​​member is provided on the cover plate 123, and a snap-connecting member is provided on the support member 122, so that when the cover plate 123 is rotated to snap onto the support member 122, the snap-fitting member is snapped onto the snap-connecting member, thereby fixing the cover plate 123, and when the cover plate 123 is separated from one end face of the support member 122, the snap-fitting member and the snap-connecting member are opened. In other embodiments, magnetic attraction can also be used for connection, and this application does not make specific limitations here.

[0039] In this embodiment, a protrusion 1251 adapted to the positioning channel 1211 is provided on the side of the pressing block 125 away from the cover plate 123. When the cover plate 123 is buckled on the support member 122, the protrusion 1251 can enter the positioning channel 1211, thereby abutting against the end face of the chip 14. Under the action of the elastic component 124, the pressing block 125 applies a constant force to the chip 14, thereby fixing the chip 14 to prevent poor contact between the chip 14 and the conductive sheet 131 from occurring when the chip 14 is tested and verified.

[0040] In a specific application scenario, when testing the chip 14, the cover 123 can be rotated so that the cover 123 rotates in a direction away from the support member 122, thereby opening the cover 123 and exposing the accommodating space 1221 on the support member 122, and then the chip 14 is placed into the positioning channel 1211 on the positioning plate 121 through the accommodating space 1221. Under the action of the positioning channel 1211, the chip 14 slides and abuts against the conductive sheet 131 provided on the metal layer 111, and the pins of the chip 14 are connected to the corresponding conductive wires 1311 on the power supply and the conductive sheet 131, so that the chip 14 and the circuit board 11 form a test loop. On this basis, the cover plate 123 is rotated so that the cover plate 123 rotates in the direction close to the circuit board 11, so that the cover plate 123 is buckled on the support member 122. At this time, under the action of the cover plate 123, the pressing block 125 passes through the positioning channel 1211 and abuts against the end face of the chip 14, and under the action of the elastic component 124, the pressing block 125 gives the chip 14 a constant force, thereby fixing the chip 14. After the chip 14 is fixed, the external components connected to the circuit board 11 are enabled to test and verify the chip 14. After testing a chip 14, the cover plate 123 is rotated to move in a direction away from the support member 122, so that one end of the cover plate 123 is separated from the support member 122, the tested chip 14 is removed, and other chips 14 to be tested are placed inside the positioning channel 1211 again, and the above operation is repeated to test the chip 14, which effectively improves the test and verification efficiency of the chip 14. When testing different chips 14, the fixing device 12 can also be removed and the conductive sheet 131 can be replaced, so that the test device is more flexible when testing the chip 14, thereby improving the test efficiency of the chip 14.

[0041] Please read further Figure 6-Figure 8, the pins of the chip 24 and the power supply are respectively arranged on the two side end surfaces of the chip 24, and the connecting plate 23 is arranged as a conductive sheet 231. When the chip 24 is tested, the pins of the chip 24 are connected to the conductive sheet 231. Since the chip 24 needs to be powered when the chip 24 is tested. Therefore, the fixing device 22 also includes a connector plate 226 and a conductive member 228. The connector plate 226 is arranged between the elastic component 224 and the pressing block 225. The connector plate 226 is provided with an interface 227 at least partially exposed to the cover plate 223 for connecting an external power supply (not shown). The conductive member 228 is arranged on one side of the connector plate 226 close to the pressing block 225. The pressing block 225 is provided with a conducting hole 2252. The conductive member 228 is electrically connected to the chip 24 via the conducting hole 2252. That is, a connector plate 226 is set between the elastic member and the pressure block 225, and a conductive member 228 is set on the connector plate 226. When testing the chip 24, the conductive member 228 on the connector plate 226 is connected to the power supply of the chip 24, and the interface 227 on the connector plate 226 is connected to the external power supply, so as to power the chip 24 to test the chip 24.

[0042] In this embodiment, when testing the chip 24, the conductive sheet 231 is attached to the metal layer 211 of the circuit board 21, and the fixing device 22 is fixed to the circuit board 21, so that the positioning plate 221 clamps and fixes the conductive sheet 231. Then, the end of the chip 24 with the pins is passed through the accommodating space 2221 of the support member 222 in the direction of the conductive sheet 231, and slides into the positioning channel 2211, so that the pins of the chip 24 are connected to the conductive wire 1311 on the conductive sheet 231. The cover plate 223 is rotated to move toward the support member 222, so that the cover plate 223 is buckled on the support member 222. Under the action of the elastic component 224, the pressing block 225 is abutted against the end surface of the chip 24, that is, the protrusion 2251 on the pressing block 225 is abutted against the end surface of the chip 24. At this time, the conductive member 228 passes through the through hole 2252 on the pressing block 225 and is connected to the power supply of the chip 24, and the interface 227 on the connecting member 25 is connected to the external power supply. Thus, the chip 24 is powered through the connector plate 226 and the conductive member 228. Figure 7 As shown, the connector 25 on the circuit board 21 is connected to external components, and the external components test the chip 24 through the circuit board 21 .

[0043] For further information, see Fig. 9, taking the case where the pins and power supply of chip 34 are arranged on both side end surfaces of chip 34 as an example, the connection board 33 is a conductive sheet 331, and a transfer board 36 is arranged between the conductive sheet 331 and the metal layer 311, and the transfer board 36 and the metal layer 311 are arranged correspondingly to the conductive sheet 331. Among them, the transfer board 36 can be an MLO (Multi-Layer Organic, multi-layer organic carrier) transfer board 36, which is made of organic materials and can realize the conversion of the pins of chip 34 from small to large through inter-layer conversion. Other transfer methods can also be used according to process requirements, and this application does not make specific limitations here. Since the center distance between the pins of some chips 34 is too small, a test loop cannot be formed directly between the conductive sheet 331 and the metal layer 311 of the circuit board 31. An adapter board 36 is set between the conductive sheet 331 and the metal layer 311 of the circuit board 31, and the pins of the chip 34 are connected to the metal particles or conductive wires on the conductive sheet 331. The pins of the chip 34 are converted from small to large through the adapter board 36, so that the pins of the chip 34 are connected to the metal layer 311 of the circuit board 31. When testing the chip 34, the chip 34 is placed in the fixing device 32, and the chip 34 forms a test loop with the circuit board 31 through the conductive sheet 331 and the adapter board 36. The connector board 326 is connected to an external power supply, and the chip 34 is powered by the connector board 326 and the conductive member 328.

[0044] In this embodiment, an adapter plate 36 is provided between the conductive sheet 331 and the metal layer 311. The adapter plate 36 is prepared by a lamination process. When the chip 34 is tested, the chip 34 is placed in the fixture 32, and the pins of the chip 34 can be enlarged to the end surface of the adapter plate 36 away from the chip 34, so that the adapter plate 36 is welded to the metal layer 311 on the circuit board 31, so that a test loop is formed between the adapter plate 36 and the chip 34 through the conductive sheet 331. Specifically, the test method of the chip 34 is the same as that of the above embodiment, and will not be repeated here.

[0045] In other embodiments, the pins of the chip 34 and the power supply are arranged on the same side end surface of the chip 34. In this case, the connector plate 326 and the conductive member 328 may not be arranged in the fixing device 32. When the chip 34 is tested, the chip 34 establishes a test circuit with the conductive sheet 331, the adapter plate 36 and the circuit board 31, and the chip 34 is powered directly through the metal layer 311.

[0046] In an optional embodiment, if Fig.10As shown, taking the pins of chip 44 and the power supply arranged on the two side end faces of chip 44 as an example, the connecting plate 43 is set as a probe assembly 432, and an adapter plate 46 is arranged between the probe assembly 432 and the metal layer 411, and the adapter plate 46 corresponds to the probe assembly 432 and the metal layer 411 of the circuit board 41. Since the pin layout of some chips 44 is too complicated, conductive sheets are still used, and the preparation cost of the chip testing device is increased. Therefore, the connecting plate 43 is set as the probe assembly 432 to cope with the chip 44 with a complex pin layout. Among them, the probe assembly 432 is composed of a pogo pin (precision connector, spring pin) and a pogo Block (spring pin module) of resin or ceramic material. When testing the chip 44, the chip 44 is connected to the adapter plate 46 through the probe assembly 432.

[0047] In this embodiment, an adapter plate 46 is provided between the probe assembly 432 and the metal layer 411. When testing the chip 44, the chip 44 is placed in the fixture 42. The chip 44 is connected to the metal layer 411 of the circuit board 41 through the probe assembly 432 and the adapter plate 46 to form a test loop. The connector plate 426 is connected to an external power source, and the chip 44 is powered through the connector plate 426 and the conductive member 428 to complete the test of the chip 44. Specifically, the test method of the chip 44 is the same as that of the above embodiment, and will not be described in detail here.

[0048] In other embodiments, the pins of the chip 44 and the power supply are arranged on the same side end surface of the chip 44. In this case, the connector plate 426 and the conductive member 428 may not be provided in the fixing device 42. When the chip 44 is tested, the chip 44 establishes a test circuit with the circuit board 41 through the probe assembly 432 and the adapter plate 46, and the chip 44 is directly powered through the metal layer 411.

[0049] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A chip testing device, characterized in that: The chip testing device comprises: A circuit board, on which a metal layer is provided, and the circuit board is used to connect external components; A fixing device, the fixing device is arranged on a side surface of the circuit board and is arranged corresponding to the metal layer on the circuit board, and the chip is placed in the fixing device; A connecting plate is arranged corresponding to the chip and is electrically connected to the metal layer so as to conduct electricity between the metal layer and the chip when the chip is placed in the fixing device, so that the external component can test the chip through the circuit board.

2. The chip testing device according to claim 1, characterized in that: The connecting plate is a conductive sheet or a probe assembly, and the conductive sheet or the probe assembly is electrically connected to the metal layer so as to conduct electricity between the metal layer and the chip when the chip is placed in the fixing device.

3. The chip testing device according to claim 2, characterized in that: The connecting plate is a conductive sheet, and the conductive sheet is a flexible conductive film. Conductive particles or conductive wires are arranged in the conductive sheet to connect the pins of the chip.

4. The chip testing device according to claim 1 or 2, characterized in that: An adapter plate is arranged between the connecting plate and the metal layer, and the adapter plate is arranged correspondingly to the metal layer and the connecting plate.

5. The chip testing device according to claim 1, characterized in that: The fixing device comprises: A positioning plate, the positioning plate is arranged on one end surface of the circuit board, and a positioning channel adapted to the chip is opened in the positioning plate; A support member is arranged on an end surface of the positioning plate away from the circuit board, and an accommodating space is opened in the support member.

6. The chip testing device according to claim 5, characterized in that: The fixing device also includes: A cover plate, the cover plate being hingedly connected to the support member; An elastic component, the elastic component is arranged on a side of the cover plate close to the support member; A pressing block, the pressing block is arranged on a side of the elastic component away from the cover plate; When the cover plate rotates toward the circuit board, the pressing block abuts against the chip to fix the chip.

7. The chip testing device according to claim 6, characterized in that: The fixing device further comprises: A connector plate, the connector plate is arranged between the elastic component and the pressing block, and the connector plate is provided with an interface at least partially exposed to the cover plate for connecting an external power source; A conductive member is arranged on a side of the connector plate close to the pressing block. A conducting hole is provided on the pressing block. The conductive member is electrically connected to the chip via the conducting hole.

8. The chip testing device according to claim 6, characterized in that: A protrusion is provided on one side of the pressing block away from the cover plate, and the protrusion is matched with the positioning channel.

9. The chip testing device according to claim 1, characterized in that: The metal layer protrudes from the surface of the circuit board.

10. The chip testing device according to claim 1, characterized in that: The circuit board is provided with a connector, and the connector is used to connect external components.

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