Drying device of wafer photoetching machine

Abstract

The invention relates to a drying device of a wafer photoetching machine, and relates to the technical field of wafer photoetching machine accessories, the drying device comprises a wafer photoetching machine main machine, a box body assembly is fixedly installed at the upper end of the wafer photoetching machine main machine, the box body assembly comprises a main frame and an auxiliary frame, and a water absorption assembly is clamped in the main frame; a gas circulation assembly is fixedly mounted at the upper end of the wafer photoetching machine main machine, an auxiliary assembly is fixedly mounted at the upper end of the main frame, through the box body assembly and the gas circulation assembly, air in the wafer photoetching machine main machine is circulated, intervention of external air is reduced, through the water absorption assembly, water in the circulating air is conveniently absorbed, and the water absorption efficiency is improved. Through the auxiliary assembly, the water absorption capacity of the water absorption sponge on the circulating air is improved, the water in the circulating air is further absorbed through the drying bag, through the heating bin and the heat exchange pipe in the auxiliary assembly, the air flowing back to the interior of the main machine of the wafer photoetching machine is conveniently heated, the interior of the main machine of the wafer photoetching machine is conveniently dried, and the drying effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip photolithography machine accessories, and in particular to a drying device for a chip photolithography machine. Background Art

[0002] Wafer lithography machine, also known as photolithography machine, mask alignment exposure machine, exposure system or photolithography system, is the core equipment for manufacturing semiconductor chips. The photolithography machine uses a technology similar to photo printing to print the fine patterns on the mask plate onto the silicon wafer through light exposure. Its working principle is mainly to transfer the designed circuit diagram to the semiconductor material through a series of photolithography processes. When in use, it is necessary to keep the inside of the wafer lithography machine dry. The current drying method often uses heated air drying.

[0003] For example, a drying device for a wafer lithography machine disclosed in the Chinese invention patent with the announcement number: CN115236948B includes: a lithography machine, a filter cartridge is provided on the lithography machine, a filter assembly for filtering air is installed in the filter cartridge, a circular hole is provided at the bottom of the filter cartridge, a water storage assembly extending into the circular hole is fixedly installed on the lithography machine, water generated by the filter assembly is stored by the water storage assembly, and circular holes distributed in a circumference are provided at one end of the filter cartridge, and a vacuum cylinder is fixedly installed at the other end of the filter cartridge. The invention is novel in design, the set air enters the filter cartridge, the first step of filtering the humid air is performed by the installed adsorption sponge, the adsorption sponge absorbs a large amount of water in the air, and then the air is filtered for the second time through the installed activated carbon layer, the outlet pipe blows the hot air into the drying tube, the hot air entering the drying tube dries the lithography machine, the humidity in the air is greatly reduced by the filter assembly in the filter cartridge, so that the drying effect of the drying device is improved.

[0004] However, when in use, it is easily affected by moisture in the external air, resulting in insufficient dryness of the air supplied to the inside of the lithography machine, resulting in poor drying effect inside the lithography machine, and when in use, the air is not effectively dehumidified, making it inconvenient to operate and use. Summary of the invention

[0005] In order to overcome the technical defects of the prior art, the present invention provides a drying device for a wafer lithography machine, which can circulate the gas inside the host of the wafer lithography machine, improve the drying effect, facilitate operation, and facilitate the dehumidification of the circulating air. The technical solution adopted by the present invention is: a drying device for a wafer lithography machine, comprising a wafer lithography machine mainframe, a box assembly is fixedly installed on the upper end of the wafer lithography machine mainframe, an air inlet end of the box assembly is communicated with the internal upper end of the wafer lithography machine mainframe, the box assembly comprises a main frame and a sub-frame, and a water absorption assembly is clamped inside the main frame, the sub-frame is fixedly installed on one side of the main frame, the upper end of the wafer lithography machine mainframe is located on one side of the box assembly and a gas circulation assembly is fixedly installed, the air inlet end of the gas circulation assembly is fixedly connected to one end of the sub-frame, and the air outlet end of the gas circulation assembly is communicated with the interior of the wafer lithography machine mainframe, an auxiliary assembly is fixedly installed on the upper end of the main frame, the cold end of the auxiliary assembly is located inside the main frame, and the auxiliary assembly The hot end of the auxiliary component is located inside the gas circulation component. When in use, by turning on the gas circulation component, negative pressure is generated inside the box component, thereby drawing the hot and humid airflow at the upper end of the interior of the wafer lithography machine mainframe into the box component. After entering the box component, the water absorption component is used to absorb the moisture in the hot and humid air, thereby improving the dryness of the air. During the absorption, the cold end of the auxiliary component allows the hot and humid air to contact a cold object, condensing the water vapor in the air into water droplets, which are absorbed by the water absorption component, thereby further improving the dryness of the air. After being heated by the gas circulation component, the dried hot air is returned to the interior of the wafer lithography machine mainframe to dry the interior of the wafer lithography machine mainframe, thereby improving the drying effect.

[0006] Preferably, the main frame and the sub-frame are square frame structures, an air inlet hopper is fixedly installed on one side of the main frame, and an air distributor plate with air holes is fixedly installed on one side of the interior of the air inlet hopper, and an air inlet pipe with a U-shaped structure is fixedly installed on the other end of the air inlet hopper, and the end of the air inlet pipe is connected to the inner upper end of the wafer photolithography machine main unit. When in use, the gas inside the wafer photolithography machine main unit enters into the interior of the main frame through the air inlet pipe and the air inlet hopper, and when entering the main frame, the gas is dispersed through the air distributor plate to improve the contact effect with the water absorption component, thereby facilitating the absorption of water vapor in the air.

[0007] Preferably, frame plates are fixedly installed at both ends of the interior of the main frame, the water absorption end of the water absorption assembly is located between the frame plates, and compression frames are fixedly installed at positions on both sides of the main frame located between the frame plates, the compression frame is connected to the main frame, a sealing strip is fixedly installed at a position on the outside of the compression frame away from the main frame, and a sealing cover with a handle is sleeved on the end of the compression frame, the inner side of the sealing cover is pressed tightly against the sealing strip, and the frame plates are used to reduce the airflow passing through the edge of the water absorption assembly when passing through the water absorption assembly, thereby improving the water absorption effect, and the compression frame is used to facilitate the compression of the water absorption sponge in the water absorption sponge so that water in the water absorption sponge is squeezed out, and the sealing cover and the sealing strip not only improve the sealing effect of the compression frame and facilitate the squeezing of the water absorption sponge, but also facilitate the replacement of the water absorption sponge after the sealing cover is removed, thereby facilitating the operation, and when replacing, the water absorption sponge on the compression side is replaced, thereby achieving the effect of shutdown replacement and maintenance.

[0008] Preferably, a water collecting frame is fixedly installed at the lower end of the compression frame, a drain pipe is fixedly installed between the water collecting frames on both sides, a drain valve is fixedly installed at one end of the drain pipe, a square hole is opened in the middle position of the lower end of the main frame, one end of the water absorption component passes through the square hole and extends to the outside of the main frame, and the water squeezed out of the water-absorbing sponge can be discharged conveniently through the water collecting frame and the drain pipe. When discharging, the water filtered from the air can be discharged and collected by opening the drain valve, and the water absorption component can be installed conveniently through the square hole.

[0009] Preferably, the water absorption component includes an electric slide rail, which is fixedly mounted at the lower end of the main frame, and the output end of the electric slide rail passes through the square hole and extends into the interior of the main frame, and a movable block is fixedly mounted on the output end of the electric slide rail, compression blocks are fixedly mounted on both sides of the movable block, and a water-absorbing sponge is adhesively connected to one side of the compression block, one end of the water-absorbing sponge is located inside the compression frame, and the movable block, the compression block and the water-absorbing sponge are all located between the frame plates. When in use, the movable block is driven by the electric slide rail to reciprocate inside the main frame, and when moving, the water-absorbing sponge on one side is pressed into the interior of the compression frame, and the water-absorbing sponge is continuously squeezed by the compression block, so that water inside the water-absorbing sponge is squeezed out, and when the water-absorbing sponge on one side is in a squeezed state, the water-absorbing sponge on the other side is in a natural state, which is convenient for continuing to absorb water from the passing air, convenient for alternating squeezing, improving the water absorption effect, and convenient for use.

[0010] Preferably, one side of the compression block and one side of the water-absorbing sponge are both fixedly installed with magic adhesive, and the water-absorbing sponge is installed on the compression block through the magic adhesive. A notch is opened in the middle of the movable block, the compression block and the water-absorbing sponge, and the cold end of the auxiliary component is located inside the notch. When in use, the magic adhesive makes it easy to replace the water-absorbing sponge and facilitate maintenance. When in use, the notch makes it easy to install the condenser in the auxiliary component, and avoids affecting the condenser when the movable block moves. When the water-absorbing sponge moves with the movable block and the compression block, it is convenient to wipe the water droplets condensed on the surface of the condenser, thereby improving the water absorption effect of the water-absorbing sponge on moisture in the air and facilitating dehumidification of the air.

[0011] Preferably, the main frame is connected to the sub-frame, and the first mesh plate and the second mesh plate are fixedly installed on both sides of the interior of the sub-frame respectively, a placement hole is provided at the upper end of the sub-frame between the first mesh plate and the second mesh plate, a drying bag made of water-absorbing resin is placed between the first mesh plate and the second mesh plate, and a cover plate for sealing the placement hole is clamped at the upper end of the sub-frame, and slots are provided on both sides of the sub-frame, and both sides of the cover plate are clamped with the slots, and an air outlet hopper is fixedly installed on one side of the sub-frame, and the air inlet end of the gas circulation component is connected to one end of the air outlet hopper, so as to facilitate The gas in the box assembly enters the interior of the gas circulation assembly. When in use, the desiccant bag is placed inside the sub-frame to further dry the air after water absorption, thereby improving the dryness of the air. When in use, the desiccant bag can be placed conveniently through the placement hole, and the placement hole can be sealed conveniently through the cover plate and the card slot to reduce the intervention of external air. The first mesh plate and the second mesh plate can not only facilitate the placement of the desiccant bag, but also facilitate the separation of the air inside the sub-frame, thereby improving the contact effect between the air and the desiccant bag.

[0012] Preferably, the gas circulation component includes a main air pump, the air inlet end of the main air pump is connected with the air outlet end of the box assembly, the air outlet end of the main air pump is fixedly installed with a heating chamber, the hot end of the auxiliary assembly is located inside the heating chamber, the air outlet end of the heating chamber is fixedly installed with a return pipe, the lower end of the return pipe is fixedly installed with a return pipe with a U-shaped structure, the return pipe is connected with the interior of the wafer lithography machine mainframe, when in use, the gas flows and circulates through the main air pump, and through the heating chamber, it is convenient to heat the returned air, so as to heat and dry the interior of the wafer lithography machine mainframe, and through the return pipe and the return pipe, the dry hot air can flow back to the interior of the wafer lithography machine mainframe.

[0013] Preferably, the interior of the heating chamber is a square structure, and heating wires are fixedly installed in a circular array inside the heating chamber. The heating wires facilitate heating of the air, so that the hot air enters the interior of the wafer lithography machine host for heating and drying.

[0014] Preferably, the auxiliary component includes an auxiliary air pump, which is fixedly mounted on the upper end of the main frame, a vortex tube is fixedly mounted on the output end of the auxiliary air pump, and a condenser is fixedly mounted on the cold end of the vortex tube, one end of the condenser is serpentinely distributed inside the main frame, and the air outlet end of the condenser passes through the main frame and extends to the outside of the main frame, a heat exchange tube is fixedly mounted on the hot end of the vortex tube, one end of the heat exchange tube extends in a spiral state to the inside of the heating bin in the gas circulation component, and the spiral heat exchange tube is located between the heating wires, and one end of the heat exchange tube The end passes through the heating chamber and extends to the outside of the heating chamber, and the auxiliary air pump is used to supply air to the vortex tube. The vortex tube separates the airflow into hot and cold, and the cold air enters the interior of the condenser tube, condenses water vapor from the air drawn from the inside of the wafer lithography machine main unit, and facilitates the water absorption treatment of the water absorption component, and the hot air assists in heating the air inside the heating chamber through the heat exchange tube, and the air flowing out of the condenser tube and the heat exchange tube is discharged to the outside and is not mixed with the circulating air, thereby avoiding the increase of humidity in the circulating air and facilitating auxiliary drying.

[0015] The beneficial effects of the present invention are as follows: 1. When in use, the air inside the wafer lithography machine host is circulated through the box assembly and the gas circulation assembly, reducing the intervention of external air and improving the stability during drying; 2. By adopting a water absorption component, and the movable block in the water absorption component reciprocatingly moves, the water absorption sponges on both sides are squeezed alternately, so that the moisture in the circulating air is absorbed and discharged. The water absorption sponge can be easily replaced through the magic sticky and sealing cover, which is easy to operate; 3. By using auxiliary components, when the water absorption component absorbs water, the water vapor condenses when the air contacts the low-temperature condenser through the condenser, which is convenient for increasing the water absorption capacity of the water absorption sponge for the circulating air, and further absorbs the moisture in the circulating air through the drying bag to improve the dryness of the air; 4. By using the heat exchange tubes in the heating chamber and the auxiliary components, it is convenient to heat the air returning to the interior of the wafer photolithography machine mainframe, so as to facilitate drying the interior of the wafer photolithography machine mainframe and improve the drying effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0017] Figure 2 This is a schematic diagram of the overall structure of the present invention from another angle.

[0018] Figure 3 This is a schematic diagram of the structure of the present invention after the wafer lithography machine host is removed and partially cut open.

[0019] Figure 4 It is a schematic diagram of the structure of the box assembly after explosion in the present invention.

[0020] Figure 5 It is a schematic diagram of the structure of the box assembly of the present invention after explosion from another angle.

[0021] Figure 6 It is a schematic diagram of the structure of a part of the box assembly in the present invention.

[0022] Figure 7 It is a schematic structural diagram of the water absorption component in the present invention.

[0023] Figure 8 It is a schematic structural diagram of the water absorption component in the present invention from another angle.

[0024] Fig. 9 It is a schematic structural diagram of the water-absorbing sponge in the present invention.

[0025] Fig.10 It is a schematic diagram of the structure of the gas circulation component in the present invention.

[0026] Fig.11 It is a schematic diagram of the structure of the heating chamber in the present invention after partial sectioning.

[0027] Fig.12 It is a schematic diagram of the structure of the auxiliary components in the present invention.

[0028] Fig.13 It is a schematic diagram of the structure of the drying bag in the present invention.

[0029] Explanation of reference numerals: In the figure: 1, wafer lithography machine host; 2, box assembly; 201, main frame; 202, sub-frame; 203, air inlet hopper; 204, air distributor plate; 205, air inlet pipe; 206, frame plate; 207, compression frame; 208, sealing strip; 209, sealing cover; 2010, water collection frame; 2011, drain pipe; 2012, drain valve; 2013, square hole; 2014, first mesh plate; 2015, second mesh plate; 2016, placement hole; 2017, cover plate ; 2018, card slot; 2019, air outlet bucket; 3, water absorption component; 301, electric slide rail; 302, movable block; 303, compression block; 304, water absorption sponge; 305, magic stick; 306, notch; 4, gas circulation component; 401, main air pump; 402, heating chamber; 403, return pipe; 404, return air pipe; 405, heating wire; 5, auxiliary component; 501, auxiliary air pump; 502, vortex tube; 503, condenser; 504, heat exchange tube; 6, drying bag. DETAILED DESCRIPTION

[0030] The present invention will be further described below in conjunction with the accompanying drawings: like Figure 1-Figure 13 As shown, the present embodiment provides a drying device for a wafer lithography machine, comprising a wafer lithography machine mainframe 1, a box assembly 2 is fixedly installed on the upper end of the wafer lithography machine mainframe 1, an air inlet end of the box assembly 2 is communicated with the internal upper end of the wafer lithography machine mainframe 1, the box assembly 2 comprises a main frame 201 and a sub-frame 202, and a water absorption assembly 3 is clamped inside the main frame 201, the sub-frame 202 is fixedly installed on one side of the main frame 201, the upper end of the wafer lithography machine mainframe 1 is located on one side of the box assembly 2, a gas circulation assembly 4 is fixedly installed, the air inlet end of the gas circulation assembly 4 is fixedly connected to one end of the sub-frame 202, and the air outlet end of the gas circulation assembly 4 is communicated with the interior of the wafer lithography machine mainframe 1, an auxiliary assembly 5 is fixedly installed on the upper end of the main frame 201, and the cold end of the auxiliary assembly 5 is located inside the main frame 201. The hot end of the auxiliary component 5 is located inside the gas circulation component 4. When in use, by turning on the gas circulation component 4, a negative pressure is generated inside the box component 2, and then the hot and humid airflow at the upper end of the wafer lithography machine mainframe 1 is drawn into the box component 2. After entering the box component 2, the moisture in the hot and humid air is absorbed through the water absorption component 3 to improve the dryness of the air. During the absorption, the cold end of the auxiliary component 5 allows the hot and humid air to contact a cold object, condense the water vapor in the air into water droplets, and absorb them through the water absorption component 3, further improving the dryness of the air. After being heated by the gas circulation component 4, the dried hot air is returned to the inside of the wafer lithography machine mainframe 1 to dry the inside of the wafer lithography machine mainframe 1 and improve the drying effect.

[0031] The main frame 201 and the sub-frame 202 are square frame structures. An air inlet hopper 203 is fixedly installed on one side of the main frame 201, and an air distribution plate 204 with air holes is fixedly installed on one side of the inner side of the air inlet hopper 203. A U-shaped air inlet pipe 205 is fixedly installed on the other end of the air inlet hopper 203. The end of the air inlet pipe 205 is connected to the inner upper end of the wafer photolithography machine host 1. When in use, the gas inside the wafer photolithography machine host 1 enters the interior of the main frame 201 through the air inlet pipe 205 and the air inlet hopper 203. When entering the main frame 201, the gas is dispersed through the air distribution plate 204 to improve the contact effect with the water absorption component 3, so as to facilitate the absorption of water vapor in the air. Frame plates 206 are fixedly installed at both ends of the inner side of the main frame 201. The water absorption end of the water absorption component 3 is located between the frame plates 206, and compression frames 207 are fixedly installed at the positions between the frame plates 206 on both sides of the main frame 201, and the compression frame 207 is connected with the main frame 201. A sealing strip 208 is fixedly installed at the position of the outer side of the compression frame 207 away from the main frame 201, and a sealing cover 209 with a handle is sleeved on the end of the compression frame 207. The inner side of the sealing cover 209 is pressed tightly against the sealing strip 208, and the airflow is reduced through the frame plates 206 when passing through the water absorption component 3, and passes through the edge of the water absorption component 3, thereby improving the water absorption effect. In addition, the compression frame 207 facilitates the compression of the water absorption sponge 304 in the water absorption component 3, so that the water in the water absorption sponge 304 is squeezed out, and the water absorption sponge 304 is squeezed out through the sealing cover 209 and the sealing cover 209. Strip 208 not only improves the sealing effect of the compression frame 207 and facilitates the squeezing of the water-absorbing sponge 304, but also facilitates the replacement of the water-absorbing sponge 304 after the sealing cover 209 is removed, which is convenient for operation. When replacing, the water-absorbing sponge 304 on the compression side is replaced, which can achieve the effect of stopping the machine for replacement and maintenance. A water collecting frame 2010 is fixedly installed at the lower end of the compression frame 207, and a drain pipe 2011 is fixedly installed between the water collecting frames 2010 on both sides. A drain valve 2012 is fixedly installed at one end of the drain pipe 2011. A square hole 2013 is opened in the middle position of the lower end of the main frame 201. One end of the water absorbing component 3 passes through the square hole 2013 and extends to the outside of the main frame 201. 11, it is convenient to discharge the water squeezed out of the water-absorbing sponge 304. When discharging, by opening the drain valve 2012, the water filtered from the air can be discharged and collected, and through the square hole 2013, it is convenient to install the water-absorbing component 3, and the main frame 201 is connected with the sub-frame 202, and the first mesh plate 2014 and the second mesh plate 2015 are fixedly installed on both sides of the interior of the sub-frame 202, and the upper end of the sub-frame 202 is located between the first mesh plate 2014 and the second mesh plate 2015 to open a placement hole 2016, a drying bag 6 made of water-absorbing resin is placed between the first mesh plate 2014 and the second mesh plate 2015, and the upper end of the sub-frame 202 is clamped with a cover plate 2017 for sealing the placement hole 2016,Both sides of the sub-frame 202 are provided with card slots 2018, and both sides of the cover plate 2017 are connected with the card slots 2018. A gas outlet hopper 2019 is fixedly installed on one side of the sub-frame 202. The air inlet end of the gas circulation component 4 is connected with one end of the gas outlet hopper 2019, which is convenient for the gas in the box component 2 to enter the interior of the gas circulation component 4. When in use, by placing the drying bag 6 inside the sub-frame 202, the air after the water absorption treatment is further dried to improve the dryness of the air. When in use, through the placement hole 2016, it is convenient to put the drying bag 6, and through the cover plate 2017 and the card slot 2018, it is convenient to seal the placement hole 2016 to reduce the intervention of external air. Through the first mesh plate 2014 and the second mesh plate 2015, it is not only convenient to place the drying bag 6, but also convenient to separate the air inside the sub-frame 202, so as to improve the contact effect between the air and the drying bag 6.

[0032] The water absorbing component 3 includes an electric slide rail 301, which is fixedly mounted at the lower end of the main frame 201, and the output end of the electric slide rail 301 passes through the square hole 2013 and extends to the inside of the main frame 201, and a movable block 302 is fixedly mounted on the output end of the electric slide rail 301, and compression blocks 303 are fixedly mounted on both sides of the movable block 302, and a water absorbing sponge 304 is glued and connected to one side of the compression block 303, and one end of the water absorbing sponge 304 is located inside the compression frame 207, and the movable block 302, The compression block 303 and the water-absorbing sponge 304 are both located between the frame plates 206. When in use, the movable block 302 is driven by the electric slide rail 301 to move back and forth inside the main frame 201. When moving, the water-absorbing sponge 304 on one side is pressed into the inside of the compression frame 207, and the compression block 303 continues to squeeze the water-absorbing sponge 304, so that the water inside the water-absorbing sponge 304 is squeezed out. When the water-absorbing sponge 304 on one side is in a squeezed state, the water-absorbing sponge 304 on the other side is squeezed out. In a natural state, it is convenient to continue to absorb water from the passing air, and it is convenient to squeeze alternately, improve the water absorption effect, and be easy to use. Magic stick 305 is fixedly installed on one side of the compression block 303 and one side of the water-absorbing sponge 304. The water-absorbing sponge 304 is installed on the compression block 303 through the magic stick 305. A notch 306 is opened in the middle of the movable block 302, the compression block 303 and the water-absorbing sponge 304, and the cold end of the auxiliary component 5 is located inside the notch 306. When in use, through the magic stick 305, It is convenient to replace the water-absorbing sponge 304 and to carry out maintenance. When in use, the condenser 503 in the auxiliary component 5 can be installed through the notch 306, and the condenser 503 can be prevented from being affected when the movable block 302 moves. When the water-absorbing sponge 304 moves with the movable block 302 and the compression block 303, it is convenient to wipe the water droplets condensed on the surface of the condenser 503, thereby improving the water absorption effect of the water-absorbing sponge 304 on moisture in the air and facilitating dehumidification of the air.

[0033] The gas circulation component 4 includes a main air pump 401, the air inlet end of the main air pump 401 is connected to the air outlet end of the box component 2, the air outlet end of the main air pump 401 is fixedly installed with a heating chamber 402, the hot end of the auxiliary component 5 is located inside the heating chamber 402, the air outlet end of the heating chamber 402 is fixedly installed with a return pipe 403, the lower end of the return pipe 403 is fixedly installed with a U-shaped return pipe 404, the return pipe 404 is connected to the inside of the wafer lithography machine host 1, and when in use, the main air pump 401 is used to make the gas flow The heat treatment of the refluxed air is facilitated by the circulation through the heating chamber 402, so as to facilitate heating and drying the interior of the wafer lithography machine mainframe 1, and the dry hot air is facilitated to reflux to the interior of the wafer lithography machine mainframe 1 through the reflux pipe 403 and the return air pipe 404. The interior of the heating chamber 402 is a square structure, and the interior of the heating chamber 402 is fixedly installed with heating wires 405 in a circular array. The heating wires 405 are used to heat the air, so that the hot air enters the interior of the wafer lithography machine mainframe 1 for heating and drying.

[0034] The auxiliary component 5 includes an auxiliary air pump 501, which is fixedly installed on the upper end of the main frame 201. A vortex tube 502 is fixedly installed on the output end of the auxiliary air pump 501, and a condenser 503 is fixedly installed on the cold end of the vortex tube 502. One end of the condenser 503 is distributed in a serpentine shape inside the main frame 201, and the gas outlet end of the condenser 503 passes through the main frame 201 and extends to the outside of the main frame 201. A heat exchange tube 504 is fixedly installed on the hot end of the vortex tube 502. One end of the heat exchange tube 504 extends in a spiral state to the inside of the heating chamber 402 in the gas circulation component 4, and the spiral heat exchange tube 504 is located between the heating wires 405. One end of the heat exchange tube 504 passes through the heating chamber 402 and extends to the outside of the heating chamber 402. The auxiliary air pump 501 supplies air to the vortex tube 502. The vortex tube 502 separates the airflow into hot and cold. The cold air enters the condenser 503 to condense water vapor from the air drawn from the inside of the wafer lithography machine main unit 1, which is convenient for the water absorption component 3 to absorb water. The hot air passes through the heat exchange tube 504 to assist in heating the air inside the heating chamber 402. The air flowing out of the condenser 503 and the heat exchange tube 504 is discharged to the outside and is not mixed with the circulating air, thereby avoiding the increase of humidity in the circulating air and facilitating auxiliary drying. The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for illustrating the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which shall fall within the scope of the present invention to be protected. The scope of protection of the present invention shall be defined by the attached claims and their equivalents.

Claims

1. A drying device for a wafer lithography machine, characterized in that: The invention comprises a wafer lithography machine mainframe (1), wherein a box assembly (2) is fixedly mounted on the upper end of the wafer lithography machine mainframe (1), an air inlet end of the box assembly (2) is connected to the inner upper end of the wafer lithography machine mainframe (1), the box assembly (2) comprises a main frame (201) and a sub-frame (202), and a water absorption assembly (3) is clamped inside the main frame (201), the sub-frame (202) is fixedly mounted on one side of the main frame (201), and the upper end of the wafer lithography machine mainframe (1) is located at the box assembly (2). A gas circulation component (4) is fixedly mounted on one side of the main body component (2); an air inlet end of the gas circulation component (4) is fixedly connected to one end of the auxiliary frame (202), and an air outlet end of the gas circulation component (4) is connected to the interior of the wafer lithography machine mainframe (1); an auxiliary component (5) is fixedly mounted on the upper end of the main frame (201); a cold end of the auxiliary component (5) is located inside the main frame (201), and a hot end of the auxiliary component (5) is located inside the gas circulation component (4).

2. The drying device of the wafer lithography machine according to claim 1, characterized in that: The main frame (201) and the sub-frame (202) are square frame structures, an air intake hopper (203) is fixedly mounted on one side of the main frame (201), and an air distribution plate (204) with air holes is fixedly mounted on one side of the interior of the air intake hopper (203), and a U-shaped air intake pipe (205) is fixedly mounted on the other end of the air intake hopper (203), and the end of the air intake pipe (205) is connected to the inner upper end of the wafer lithography machine host (1).

3. The drying device of the wafer lithography machine according to claim 1, characterized in that: Frame plates (206) are fixedly installed at both ends of the main frame (201), the water absorption end of the water absorption component (3) is located between the frame plates (206), and compression frames (207) are fixedly installed at positions between the frame plates (206) on both sides of the main frame (201), the compression frame (207) is connected to the main frame (201), a sealing strip (208) is fixedly installed at a position of the outer side of the compression frame (207) away from the main frame (201), and a sealing cover (209) with a handle is sleeved on the end of the compression frame (207), and the inner side of the sealing cover (209) is pressed tightly against the sealing strip (208).

4. The drying device of the wafer lithography machine according to claim 3, characterized in that: A water collecting frame (2010) is fixedly installed at the lower end of the compression frame (207), a drainage pipe (211) is fixedly installed between the water collecting frames (2010) on both sides, a drainage valve (212) is fixedly installed at one end of the drainage pipe (2011), a square hole (2013) is opened at the middle position of the lower end of the main frame (201), and one end of the water absorption component (3) passes through the square hole (2013) and extends to the outside of the main frame (201).

5. The drying device of the wafer lithography machine according to claim 4, characterized in that: The water absorption component (3) comprises an electric slide rail (301), the electric slide rail (301) being fixedly mounted at the lower end of the main frame (201), and the output end of the electric slide rail (301) passing through the square hole (2013) and extending into the interior of the main frame (201), a movable block (302) being fixedly mounted on the output end of the electric slide rail (301), compression blocks (303) being fixedly mounted on both sides of the movable block (302), and a water absorption sponge (304) being adhesively connected to one side of the compression block (303), one end of the water absorption sponge (304) being located inside the compression frame (207), and the movable block (302), the compression block (303) and the water absorption sponge (304) being located between the frame plate (206).

6. The drying device of the wafer lithography machine according to claim 5, characterized in that: One side of the compression block (303) and one side of the water-absorbing sponge (304) are both fixedly mounted with magic adhesive (305); the water-absorbing sponge (304) is mounted on the compression block (303) via the magic adhesive (305); a notch (306) is provided in the middle of the movable block (302), the compression block (303) and the water-absorbing sponge (304); and the cold end of the auxiliary component (5) is located inside the notch (306).

7. The drying device of the wafer lithography machine according to claim 1, characterized in that: The main frame (201) is connected to the sub-frame (202), and a first mesh plate (2014) and a second mesh plate (2015) are respectively fixedly installed on both sides of the interior of the sub-frame (202), and a placement hole (2016) is provided at the upper end of the sub-frame (202) between the first mesh plate (2014) and the second mesh plate (2015), and a drying material made of a water-absorbing resin is placed between the first mesh plate (2014) and the second mesh plate (2015). The sub-frame (202) is provided with a cover plate (2017) for sealing the placement hole (2016), and the upper end of the sub-frame (202) is clamped with a clamping groove (2018) on both sides of the sub-frame (202), and the two sides of the cover plate (2017) are clamped with the clamping groove (2018), and a gas outlet hopper (2019) is fixedly installed on one side of the sub-frame (202), and the gas inlet end of the gas circulation component (4) is connected to one end of the gas outlet hopper (2019).

8. The drying device of the wafer lithography machine according to claim 1, characterized in that: The gas circulation component (4) comprises a main air pump (401), the air inlet end of the main air pump (401) is connected to the air outlet end of the box component (2), the air outlet end of the main air pump (401) is fixedly mounted with a heating chamber (402), the hot end of the auxiliary component (5) is located inside the heating chamber (402), the air outlet end of the heating chamber (402) is fixedly mounted with a return pipe (403), the lower end of the return pipe (403) is fixedly mounted with a return pipe (404) with a U-shaped structure, and the return pipe (404) is connected to the inside of the wafer lithography machine host (1).

9. The drying device of the wafer lithography machine according to claim 8, characterized in that: The interior of the heating chamber (402) is a square structure, and heating wires (405) are fixedly installed in a circular array inside the heating chamber (402).

10. The drying device of the wafer lithography machine according to claim 9, characterized in that: The auxiliary component (5) comprises an auxiliary air pump (501), the auxiliary air pump (501) being fixedly mounted on the upper end of the main frame (201), a vortex tube (502) being fixedly mounted on the output end of the auxiliary air pump (501), and a condenser tube (503) being fixedly mounted on the cold end of the vortex tube (502), one end of the condenser tube (503) being distributed in a serpentine shape inside the main frame (201), and an air outlet end of the condenser tube (503) passing through the main frame (201), and extends to the outside of the main frame (201); a heat exchange tube (504) is fixedly installed at the hot end of the vortex tube (502); one end of the heat exchange tube (504) extends in a spiral state to the inside of the heating chamber (402) in the gas circulation component (4); and the spiral heat exchange tube (504) is located between the heating wires (405); one end of the heat exchange tube (504) passes through the heating chamber (402) and extends to the outside of the heating chamber (402).

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