Satellite-borne ultra-microcomputer heat dissipation plate

Abstract

The invention relates to a satellite-borne ultra-microcomputer heat dissipation plate which comprises a heat dissipation plate frame body, frame-shaped heat dissipation fins, connecting hole grooves, heat dissipation grooves, an attaching plate and a positioning seat, and the heat dissipation plate frame body is of a square-frame-shaped structure. The heat dissipation plate is light and handy in design and suitable for a satellite-borne ultra-microcomputer, and the problem that the internal space of a spacecraft is limited is effectively solved; through optimized metal materials and structural design, efficient and stable heat dissipation performance is achieved, the working stability of a computer is improved, and the service life of the computer is prolonged; due to the design of the insulating layer on the surface of the heat dissipation plate, the use safety is enhanced, and potential risks such as short circuit are prevented.

Description

Technical Field

[0001] The invention relates to the field of aerospace technology, in particular to a heat sink for a satellite-borne ultra-microcomputer. Background Art

[0002] With the rapid development of aerospace technology, onboard ultra-microcomputers are being used more and more widely in satellites and other spacecraft.

[0003] However, due to the limited space inside the spacecraft and the extremely harsh working environment, the heat dissipation problem of ultra-microcomputers has become a key factor restricting the stability and improvement of their performance.

[0004] At present, traditional heat dissipation methods can no longer meet the needs of efficient and stable heat dissipation. Therefore, a new type of heat sink is urgently needed to solve this problem. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] In order to solve the above technical problems, the present invention provides a heat sink for a satellite-borne ultra-microcomputer.

[0007] (II) Technical solution

[0008] Based on this, the present invention provides the following technical solutions: a satellite-borne ultra-microcomputer heat sink, comprising a heat sink frame, a frame-shaped heat sink, connecting holes and grooves, a heat dissipation groove, a bonding plate, and a positioning seat. The heat sink frame is in a square frame structure, and the interior of the heat sink frame is hollow. Connecting holes and grooves are provided at the connection between the two groups of frame-shaped heat sinks. Heat dissipation grooves are provided on the upper and lower sides of the heat sink frame. A bonding plate is provided in the middle of the frame-shaped heat sink located in the middle of the heat sink frame, and a positioning seat is provided at the front end of the bonding plate.

[0009] Preferably, the frame-shaped heat sinks are provided in multiple groups, and the heat sinks are arranged inside the heat sink frame.

[0010] Preferably, the interior of the frame-shaped heat sink is a cavity structure, and a plurality of groups of the frame-shaped heat sinks are mutually wrapped and stacked to increase the efficiency of heat transfer.

[0011] Preferably, the positioning seat is in a cross-shaped structure, which facilitates the heat sink to be accurately attached to the back of the computer motherboard.

[0012] Preferably, an insulating layer is provided on the surface of the laminated board to prevent short circuit and improve safety in use.

[0013] Preferably, the bonding plate is made of a metal plate with excellent thermal conductivity, such as copper or aluminum alloy, to ensure efficient heat transfer.

[0014] Preferably, the heat dissipation slots are provided in multiple groups and arranged in strips to facilitate the discharge of hot air.

[0015] (III) Beneficial effects

[0016] Compared with the prior art, the present invention provides a satellite-borne ultra-microcomputer heat sink, which has the following beneficial effects:

[0017] The heat sink of the present invention is lightweight in design and suitable for satellite-borne ultra-micro computers, effectively solving the problem of limited internal space in spacecraft; through optimized metal materials and structural design, efficient and stable heat dissipation performance is achieved, and the working stability and service life of the computer are improved; the insulating layer design on the surface of the heat sink enhances the safety of use and prevents potential risks such as circuit short circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 It is a schematic diagram of the three-dimensional structure of the laminated board of the present invention.

[0020] In the figure: heat sink frame -1, frame-shaped heat sink -2, connection hole slot -3, heat dissipation slot -4, bonding plate -5, positioning seat -6, insulation layer -51. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] See also Figure 1-Figure 2 The invention discloses a heat sink for a satellite-borne ultra-microcomputer, comprising a heat sink frame 1, a frame-shaped heat sink 2, a connecting hole groove 3, a heat dissipation groove 4, a bonding plate 5, and a positioning seat 6. The heat sink frame 1 is a square frame-shaped structure, and the interior of the heat sink frame 1 is hollow. A connecting hole groove 3 is provided at the connection between two groups of frame-shaped heat sinks 2. Heat dissipation grooves 4 are conveniently provided on the upper and lower sides of the heat sink frame 1. A bonding plate 5 is provided in the middle of the frame-shaped heat sink 2 located in the middle of the heat sink frame 1, and a positioning seat 6 is provided at the front end of the bonding plate 5.

[0023] In this embodiment, a plurality of groups of frame-shaped heat sinks 2 are provided, and the heat sinks 2 are arranged inside the heat sink frame 1. The interior of the frame-shaped heat sink 2 is a cavity structure, and a plurality of groups of frame-shaped heat sinks 2 are wrapped and overlapped with each other to increase the efficiency of heat transfer. The positioning seat 6 is a cross-shaped structure, which is convenient for accurately fitting the heat sink to the back of the computer motherboard. An insulating layer 51 is provided on the surface of the bonding plate 5 to prevent circuit short circuit and improve safety of use. The bonding plate 5 adopts a metal plate with excellent thermal conductivity, such as copper or aluminum alloy, to ensure efficient heat transfer. A plurality of groups of heat dissipation slots 4 are provided, which are arranged in strips to facilitate the discharge of hot air.

[0024] In the implementation process of the satellite-borne ultra-microcomputer heat sink provided by the present invention, the size and shape of the heat sink are first designed according to the size and shape of the computer motherboard, and then a suitable metal material is selected to make a bonding plate 5, and an insulating layer 51 and a positioning seat 6 are arranged on the surface of the bonding plate.

[0025] Finally, the bonding plate 5 is precisely bonded to the back of the computer motherboard through the positioning seat 6, so that the surface of the bonding plate 5 is covered by the bottom surface of the microprocessor and each chip through the back of the computer motherboard.

[0026] When the computer is working, the generated heat is quickly conducted through the bonding plate 5, and then the heat is conducted through the frame-shaped heat sink 2, and the heat energy is transferred to the heat sink frame 1, so as to achieve rapid heat dissipation;

[0027] After the implementation of the present invention, the heat dissipation problem of satellite-borne ultra-microcomputers has been effectively solved. Compared with traditional heat dissipation methods, the heat dissipation plate of the present invention has higher heat dissipation efficiency and stability, significantly improving the working performance and service life of the computer. At the same time, the heat dissipation plate of the present invention is also light and safe, and is very suitable for application scenarios such as spacecraft that have extremely high requirements on weight and safety.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat sink for a satellite-borne ultra-microcomputer, characterized in that: The invention comprises a heat dissipation plate frame (1), a frame-shaped heat dissipation fin (2), a connection hole groove (3), a heat dissipation groove (4), a bonding plate (5), and a positioning seat (6); the heat dissipation plate frame (1) is in a square frame structure, and the interior of the heat dissipation plate frame (1) is hollow; a connection hole groove (3) is provided at the connection between two groups of the frame-shaped heat dissipation fins (2); heat dissipation grooves (4) are conveniently provided on both the upper and lower sides of the heat dissipation plate frame (1); a bonding plate (5) is provided in the middle of the frame-shaped heat dissipation fin (2) located in the middle of the heat dissipation plate frame (1); and a positioning seat (6) is provided at the front end of the bonding plate (5).

2. The heat sink for a satellite-borne microcomputer according to claim 1, characterized in that: The frame-shaped heat sinks (2) are provided in multiple groups, and the heat sinks (2) are arranged inside the heat sink frame (1).

3. The heat sink for a satellite-borne microcomputer according to claim 1, characterized in that: The interior of the frame-shaped heat sink (2) is a hollow structure, and a plurality of groups of the frame-shaped heat sinks (2) are arranged to wrap around each other and overlap each other.

4. The heat sink for a satellite-borne microcomputer according to claim 1, characterized in that: The positioning seat (6) is in a cross-shaped structure.

5. The heat sink for a satellite-borne microcomputer according to claim 1, characterized in that: An insulating layer (51) is provided on the surface of the laminated board (5).

6. The heat sink for a satellite-borne microcomputer according to claim 1, characterized in that: The bonding plate (5) is a metal plate.

7. The heat sink for a satellite-borne microcomputer according to claim 1, characterized in that: The heat dissipation grooves (4) are provided in multiple groups and are arranged in a strip shape.

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