A radio frequency microwave chip multilayer ceramic capacitor

Abstract

The present invention relates to the technical field of capacitors, and discloses a radio frequency microwave chip type multilayer ceramic capacitor, comprising a capacitor body, a coating A, which is installed on the left side of the capacitor body, a coating B, which is installed on the right side of the capacitor body, and a buffer component, wherein the buffer component comprises an insulating plate, a metal plate, a first electric spring and an L-shaped metal plate, and four insulating plates are installed at both ends of the coating A and the coating B. In the present invention, when in use, the capacitor body and the coating A and the coating B on the left and right sides are placed in a metal clamping plate inside the insulating plate, and the capacitor body is clamped by the metal clamping plate, and then the threaded tube is rotated to move the threaded rod into the sleeve, and at the same time, the insulating plate on the left side is moved close to the insulating plate on the right side to clamp the capacitor body placed in the metal clamping plate, and when the capacitor body is hit, the first electric spring, the second electric spring, and the third electric spring are compressed to make the capacitor body slide in the insulating plate for buffering and shock absorption.

Description

Technical Field

[0001] The invention relates to the technical field of capacitors, and in particular to a radio frequency microwave chip-type multilayer ceramic capacitor. Background Art

[0002] RF microwave chip multilayer ceramic capacitor is an electronic component used in radio frequency (RF) and microwave applications. It is usually composed of multiple thin layers of ceramic sheets and metal electrodes, which are stacked and connected to achieve the required capacitance value and performance. This type of capacitor usually has high frequency response and low loss, and is suitable for wireless communication, radar, satellite communication and other RF microwave systems.

[0003] There are many types of multilayer ceramic capacitors on the market. Usually, metal brackets and external electrodes are set on both sides of the multilayer ceramic capacitors during installation and use, and they are fixed by high-temperature welding. However, the high temperature during the welding process may cause damage to the capacitor body. Moreover, RF microwave chip multilayer ceramic capacitors are usually installed in mobile phones, circuit boards, and RF front-end modules. When the mobile phone, circuit board, or RF front-end module falls and is impacted and vibrated, the multilayer ceramic capacitor on the RF circuit board may be damaged or loosened.

[0004] In view of the above problems, a radio frequency microwave chip type multilayer ceramic capacitor is proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a radio frequency microwave chip type multilayer ceramic capacitor, which solves the problem that there are many types of multilayer ceramic capacitors currently on the market in the background technology. Usually, when installed and used, metal brackets and external electrodes are set on both sides of the multilayer ceramic capacitor and are fixed by high-temperature welding. However, during the welding process, the high temperature may cause the capacitor body to be damaged. Moreover, radio frequency microwave chip type multilayer ceramic capacitors are usually installed in mobile phones, circuit boards, and radio frequency front-end modules. When the mobile phone, circuit board, or radio frequency front-end module falls and is impacted and vibrated, the multilayer ceramic capacitor on the radio frequency circuit board may be damaged or loosened.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a radio frequency microwave chip-type multilayer ceramic capacitor, comprising a capacitor body, a coating A, installed on the left side of the capacitor body, a coating B, installed on the right side of the capacitor body, and a buffer component, wherein the buffer component comprises an insulating plate, a metal plate, a first electric spring and an L-shaped metal plate, wherein four insulating plates are installed at both ends of the coating A and the coating B, a metal plate is installed on the left side of the inner upper part of one side of the insulating plate, a uniformly distributed first electric spring is installed on the side of the metal plate away from the capacitor body, an L-shaped metal plate is installed on the rear side of the inner upper part of the insulating plate, a uniformly distributed second electric spring is installed on the side of the L-shaped metal plate away from the insulating plate, a uniformly distributed third electric spring is installed on the top of the L-shaped metal plate, a metal card plate is provided on the inner upper part of the insulating plate, and the outer walls of the metal card plate are fixedly connected to the first electric spring, the second electric spring and the third electric spring;

[0007] An installation component includes a conductive foot, a glue injection port, a threaded hole and a lower pressure groove. The bottom left and right sides of the insulating plate are provided with glue injection ports, the bottom left and right front sides of the insulating plate are provided with threaded holes, a conductive foot is installed in the middle of the inner part of the insulating plate and the top of the conductive foot is fixedly connected to the L-shaped metal plate, a lower pressure groove is opened inside the bottom of the insulating plate, and a spring is installed on the top of the lower pressure groove, the end of the spring away from the lower pressure groove is fixedly connected to a metal resistance block and the top side of the metal resistance block is slidably connected to the conductive foot.

[0008] As a further description of the above technical solution: the installation component includes a limit groove, a fourth electric spring and a metal limit plate, the bottom of the conductive foot is opened inside, the top of the limit groove is installed with a fourth electric spring, the side of the fourth electric spring away from the limit groove is fixedly connected to the metal limit plate, the side of the metal limit plate away from the fourth electric spring is fixedly connected to the metal connecting plate, the side of the metal connecting plate away from the metal limit plate passes through the conductive foot and is fixedly connected to the metal contact block.

[0009] As a further description of the above technical solution: a sleeve is fixedly connected to the middle of one side of the insulating plate on the left side.

[0010] As a further description of the above technical solution: a side of the sleeve away from the insulating plate is rotatably connected with a threaded tube.

[0011] As a further description of the above technical solution: an anti-slip pad is installed on the outer wall of the threaded pipe.

[0012] As a further description of the above technical solution: a threaded rod is rotatably connected to the middle part of one side of the insulating plate on the right side, and the threaded rod cooperates with the sleeve and the threaded tube.

[0013] As a further description of the above technical solution: a heat conducting sheet is installed on one side of the insulating plate and the heat conducting sheet is in contact with the coating A and the coating B.

[0014] As a further description of the above technical solution: evenly distributed heat dissipation holes are opened on the front side of the heat conducting plate on one side.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention provides a radio frequency microwave chip-type multilayer ceramic capacitor. When in use, the capacitor body and the coating A and the coating B on the left and right sides are placed in a metal clamping plate inside an insulating plate, and the capacitor body is clamped by the metal clamping plate. Then, the threaded tube is rotated to move the threaded rod into the sleeve, and at the same time, the insulating plate on the left side is moved closer to the insulating plate on the right side to clamp the capacitor body placed in the metal clamping plate. When the capacitor body is hit, the first electric spring, the second electric spring, and the third electric spring are compressed to make the capacitor body slide in the insulating plate for buffering and shock absorption.

[0017] 2. A radio frequency microwave chip-type multilayer ceramic capacitor provided by the present invention is installed through a reserved threaded hole at the bottom of an insulating plate during installation. When there is no reserved threaded hole on the electric board, glue can be injected through a glue injection port for adhesion. After the threaded hole is passed through or the glue injection port is connected, the metal contact block will use the elastic force of the spring to keep the metal contact block in a pressed down state to stick to the connection point of the electric board to avoid poor contact. While the metal contact block is pressed down, the fourth electric spring drives the metal limit plate and the metal connecting plate to move downward to limit the metal contact block. The metal contact block is energized by the fourth electric spring, the metal limit plate, and the metal connecting plate. The above can avoid the situation where the capacitor body may be damaged due to high temperature during the welding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0019] Figure 2 It is the left schematic diagram of the present invention;

[0020] Figure 3 is a cross-sectional view of the present invention;

[0021] Figure 4 is a top cross-sectional view of an insulating board of the present invention;

[0022] Figure 5 It is a schematic diagram of the internal structure of the insulation board of the present invention;

[0023] Figure 6 It is a left side cross-sectional view of the insulating plate of the present invention;

[0024] Figure 7is a cross-sectional view of a conductive foot of the present invention;

[0025] Figure 8 It is a schematic diagram of the sleeve of the present invention.

[0026] In the figure: 1. capacitor body; 2. coating A; 3. coating B; 4. insulating plate; 401. metal plate; 402. first electric spring; 403. L-shaped metal plate; 404. second electric spring; 405. third electric spring; 406. metal clamping plate; 5. conductive foot; 501. injection port; 502. threaded hole; 503. pressing groove; 504. spring; 505. metal resistance block; 506. limiting groove; 507. fourth electric spring; 508. metal limiting plate; 509. metal connecting plate; 6. sleeve; 7. threaded pipe; 8. anti-slip pad; 9. threaded rod; 10. heat conducting sheet; 11. heat dissipation hole. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] In order to further understand the content of the present invention, the present invention is described in detail in conjunction with the accompanying drawings.

[0029] Example 1

[0030] Combination Figure 1 , Figure 3 , Figure 4 and Figure 5, including a capacitor body 1, a coating A2, installed on the left side of the capacitor body 1, a coating B3, installed on the right side of the capacitor body 1, and a buffer component, the buffer component including an insulating plate 4, a metal plate 401, a first electric spring 402 and an L-shaped metal plate 403, four insulating plates 4 are installed at both ends of the coating A2 and the coating B3, a metal plate 401 is installed on the left side of the upper inner part of one insulating plate 4, a first electric spring 402 is installed on the side of the metal plate 401 away from the capacitor body 1, an L-shaped metal plate 403 is installed on the rear side of the upper inner part of the insulating plate 4, a second electric spring 404 is installed on the side of the L-shaped metal plate 403 away from the insulating plate 4, and a third electric spring 404 is installed on the top of the L-shaped metal plate 403. 5. A metal clamping plate 406 is provided on the upper inner part of the insulating plate 4, and the outer walls of the metal clamping plate 406 are fixedly connected to the first electric spring 402, the second electric spring 404, and the third electric spring 405. The metal plate 401, the first electric spring 402, the L-shaped metal plate 403, the second electric spring 404, the third electric spring 405, and the metal clamping plate 406 are all electrically conductive. The capacitor body 1 and the coatings A2 and B3 on the left and right sides are placed in the metal clamping plate 406 inside the insulating plate 4, and the capacitor body 1 is clamped by the metal clamping plate 406. When the capacitor body 1 is hit, the first electric spring 402, the second electric spring 404, and the third electric spring 405 are compressed to make the capacitor body 1 slide in the insulating plate 4 for buffering and shock absorption.

[0031] Combination Figure 6 and Figure 7, installation components, the installation components include conductive feet 5, glue injection ports 501, threaded holes 502 and lower pressing grooves 503, the bottom left and right sides of the insulating plate 4 are provided with glue injection ports 501, when the device needs to be installed, it is installed through the threaded holes 502 at the bottom of the insulating plate 4, when there are no reserved threaded holes 502 on the electric board, glue can be injected through the glue injection ports 501 for adhesion, the bottom left and right sides of the insulating plate 4 are provided with threaded holes 502, the inner middle of the insulating plate 4 is provided with conductive feet 5 and the top of the conductive feet 5 The bottom of the insulating plate 4 is fixedly connected to the L-shaped metal plate 403, a downward pressing groove 503 is opened inside the bottom of the insulating plate 4, and a spring 504 is installed on the top of the downward pressing groove 503. The end of the spring 504 away from the downward pressing groove 503 is fixedly connected to a metal resistance block 505, and the top side of the metal resistance block 505 is slidably connected to the conductive foot 5. After the connection is completed through the threaded hole 502 or the glue injection port 501, the metal resistance block 505 will be kept in a downward pressing state by the elastic force of the spring 504 to connect the conductive plate The conductive foot 5 is provided with a limit groove 506, a fourth electric spring 507 and a metal limit plate 508. The bottom of the conductive foot 5 is provided with a limit groove 506, and the top of the limit groove 506 is provided with a fourth electric spring 507. The fourth electric spring 507 is fixedly connected to the metal limit plate 508 on the side away from the limit groove 506. The metal limit plate 508 is fixedly connected to the side away from the fourth electric spring 507. The metal connecting plate 509 is fixedly connected to the metal limit plate 509 on the side away from the fourth electric spring 507. The conductive foot 5 is passed through one side of the metal limiting plate 508 and is fixedly connected to the metal contact block 505. When the metal contact block 505 is pressed downward, the fourth electric spring 507 drives the metal limiting plate 508 and the metal connecting plate 509 to move downward so that the metal contact block 505 is limited. At the same time, the metal contact block 505 is energized by the fourth electric spring 507, the metal limiting plate 508, and the metal connecting plate 509, so as to avoid the situation where the capacitor body 1 may be damaged due to high temperature during the welding process.

[0032] Combination Figure 2 and Figure 8 A sleeve 6 is fixedly connected to the middle of one side of the left insulating plate 4, and a threaded tube 7 is rotatably connected to the side of the sleeve 6 away from the insulating plate 4. An anti-slip pad 8 is installed on the outer wall of the threaded tube 7. A threaded rod 9 is rotatably connected to the middle of one side of the right insulating plate 4, and the threaded rod 9 cooperates with the sleeve 6 and the threaded tube 7. The threaded tube 7 is rotated to move the threaded rod 9 into the sleeve 6 and at the same time, the insulating plate 4 on the left side is moved closer to the insulating plate 4 on the right side to clamp the capacitor body 1 placed in the metal clamping plate 406. A heat conducting sheet 10 is installed on one side of the insulating plate 4 on one side, and the heat conducting sheet 10 is in contact with the coating A2 and the coating B3. Evenly distributed heat dissipation holes 11 are opened on the front side of the heat conducting sheet 10 on one side. The heat of the capacitor body 1 is absorbed by the heat conducting sheet 10 and discharged through the heat dissipation holes 11.

[0033] Working principle: when in use, place the capacitor body 1 and the coatings A2 and B3 on the left and right sides in the metal clamping plate 406 inside the insulating plate 4, clamp the capacitor body 1 through the metal clamping plate 406, and then rotate the threaded tube 7 to move the threaded rod 9 into the sleeve 6, and at the same time make the insulating plate 4 on the left side close to the insulating plate 4 on the right side to clamp the capacitor body 1 placed in the metal clamping plate 406. When the capacitor body 1 is hit, the first electric spring 402, the second electric spring 404, and the third electric spring 405 are compressed to make the capacitor body 1 slide in the insulating plate 4 for buffering and shock absorption. When the device needs to be installed, it is installed through the threaded hole 502 at the bottom of the insulating plate 4. When there is no reserved threaded hole 502 on the electric plate, 2. Glue can be injected through the glue injection port 501 for adhesion. After the connection is completed through the threaded hole 502 or the glue injection port 501, the metal contact block 505 will keep the metal contact block 505 in a downward pressed state through the elastic force of the spring 504 to stick to the connection point of the electric board to avoid poor contact. While the metal contact block 505 is pressed down, the fourth electric spring 507 drives the metal limiting plate 508 and the metal connecting plate 509 to move downward to limit the metal contact block 505. At the same time, the metal contact block 505 is energized by the fourth electric spring 507, the metal limiting plate 508, and the metal connecting plate 509, which can avoid the situation that the capacitor body 1 may be damaged due to high temperature during the welding process.

[0034] Example 2

[0035] A spring 504 is installed on the top of the lower pressing groove 503, and one end of the spring 504 away from the lower pressing groove 503 is fixedly connected to a metal contact block 505, and the top side of the metal contact block 505 is slidably connected to the conductive foot 5. The spring 504 can be replaced by conductive glue, and a certain amount of conductive glue is applied between the lower pressing groove 503 and the metal contact block 505 to increase its conductivity. The conductive glue can be made of some resin or rubber particles, so that it has a certain buffering effect, which has a certain buffering effect while increasing its conductivity.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A radio frequency microwave chip multilayer ceramic capacitor, characterized in that: include Capacitor body (1); A coating A (2) is mounted on the left side of the capacitor body (1); A coating B (3) is installed on the right side of the capacitor body (1); A buffer component, the buffer component comprising an insulating plate (4), a metal plate (401), a first electric spring (402) and an L-shaped metal plate (403), wherein the four insulating plates (4) are mounted at both ends of a coating A (2) and a coating B (3), a metal plate (401) is mounted on the left side of the inner upper portion of one insulating plate (4), a side of the metal plate (401) away from the capacitor body (1) is mounted with uniformly distributed first electric springs (402), an L-shaped metal plate (403) is mounted on the rear side of the inner upper portion of the insulating plate (4), a side of the L-shaped metal plate (403) away from the insulating plate (4) is mounted with uniformly distributed second electric springs (404), a top of the L-shaped metal plate (403) is mounted with uniformly distributed third electric springs (405), a metal clip (406) is arranged on the inner upper portion of the insulating plate (4), and the outer wall of the metal clip (406) is fixedly connected to the first electric spring (402), the second electric spring (404), and the third electric spring (405); An installation component, the installation component comprising a conductive foot (5), a glue injection port (501), a threaded hole (502) and a lower pressing groove (503), the glue injection port (501) being provided on both left and right sides of the bottom of the insulating plate (4), the threaded hole (502) being provided on both left and right front sides of the bottom of the insulating plate (4), a conductive foot (5) being installed in the middle of the interior of the insulating plate (4), and the top of the conductive foot (5) being fixedly connected to the L-shaped metal plate (403), a lower pressing groove (503) being provided in the interior of the bottom of the insulating plate (4), a spring (504) being installed on the top of the lower pressing groove (503), the end of the spring (504) away from the lower pressing groove (503) being fixedly connected to a metal contact block (505), and the top side of the metal contact block (505) being slidably connected to the conductive foot (5); The mounting assembly comprises a limiting groove (506), a fourth electric spring (507) and a metal limiting plate (508); the limiting groove (506) is provided inside the bottom of the conductive foot (5); the fourth electric spring (507) is installed on the top of the limiting groove (506); the side of the fourth electric spring (507) away from the limiting groove (506) is fixedly connected to the metal limiting plate (508); the side of the metal limiting plate (508) away from the fourth electric spring (507) is fixedly connected to the metal connecting plate (509); the side of the metal connecting plate (509) away from the metal limiting plate (508) passes through the conductive foot (5) and is fixedly connected to the metal abutment block (505).

2. The radio frequency microwave chip type multilayer ceramic capacitor according to claim 1, characterized in that: A sleeve (6) is fixedly connected to the middle portion of one side of the left insulating plate (4).

3. The radio frequency microwave chip type multilayer ceramic capacitor according to claim 2, characterized in that: The side of the sleeve (6) away from the insulating plate (4) is rotatably connected to a threaded tube (7).

4. The radio frequency microwave chip type multilayer ceramic capacitor according to claim 3, characterized in that: An anti-slip pad (8) is installed on the outer wall of the threaded tube (7).

5. The radio frequency microwave chip type multilayer ceramic capacitor according to claim 1, characterized in that: A threaded rod (9) is rotatably connected to the middle of one side of the insulating plate (4) on the right side, and the threaded rod (9) cooperates with the sleeve (6) and the threaded tube (7).

6. The radio frequency microwave chip type multilayer ceramic capacitor according to claim 1, characterized in that: A heat conducting sheet (10) is installed on one side of the insulating plate (4), and the heat conducting sheet (10) is in contact with the coating A (2) and the coating B (3).

7. The radio frequency microwave chip type multilayer ceramic capacitor according to claim 6, characterized in that: The front side of the heat conducting sheet (10) on one side is provided with evenly distributed heat dissipation holes (11).

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