Traceless sheet taking tray and traceless sheet taking device

Abstract

The invention belongs to the field of semiconductor material conveying, and particularly provides a traceless wafer taking tray and a traceless wafer taking device.The traceless wafer taking tray comprises a connecting base and a tray body; the tray body is fixedly connected with the connecting seat; a plurality of traceless bearing tables are arranged on the tray body; the multiple traceless bearing tables are fixedly arranged on the tray body, and a bearing area is defined by the multiple traceless bearing tables. By planning the movement track of the traceless wafer taking tray, the bearing area of the traceless wafer taking tray is just located below the silicon wafer during material taking, the silicon wafer is taken out when the traceless wafer taking tray moves upwards, traceless wafer taking is achieved, pressure does not need to be applied to the silicon wafer, and the silicon wafer is prevented from being scratched.

Description

Technical Field

[0001] The invention relates to the field of semiconductor material transportation, and in particular to a traceless film taking tray and a traceless film taking device. Background Art

[0002] Silicon wafers are basic materials in the semiconductor industry and the solar photovoltaic industry, and are mainly used to manufacture electronic devices and solar cells.

[0003] Silicon wafers are generally transported by conveyor belts. The silicon wafers are placed on the conveyor belt and are transported by the friction of the conveyor belt. Belt conveyance marks are easily found on the lower end of the silicon wafers, causing scratches and contamination of the silicon wafers. Severe scratches may reduce the photoelectric conversion efficiency of the subsequently prepared battery cells, resulting in the scrapping or rework of the battery cells, increasing production costs, affecting the reliability and stability of the later operation of photovoltaic modules, and increasing the failure rate.

[0004] The above problems need to be solved urgently. Summary of the invention

[0005] The purpose of the present invention is to provide a traceless film taking tray and a traceless film taking device.

[0006] In order to solve the above technical problems, the present invention provides a traceless film-taking tray, comprising: Connecting seat and tray body; The tray body is fixedly connected to the connecting seat; The tray body is provided with a plurality of seamless supporting platforms; A plurality of the traceless supporting platforms are fixedly arranged on the tray body and enclose a supporting area.

[0007] Furthermore, the traceless support platform includes: a top surface, a bottom surface, a support surface and three side surfaces; The top surface is arranged opposite to the bottom surface; The three side surfaces and the supporting surface enclose and form a side wall of a seamless supporting platform; The supporting surface is arranged opposite to the side wall of the silicon wafer to be supported.

[0008] Furthermore, the supporting surface is arranged at an incline.

[0009] Furthermore, a flexible buffer layer is provided on the supporting surface.

[0010] Furthermore, the supporting surface includes a guide section and a supporting section; The inclination of the guide section is greater than the inclination of the supporting section.

[0011] Furthermore, the connecting seat is U-shaped; The tray body includes a first material picking plate and a second material picking plate; The first material taking plate and the second material taking plate are arranged in parallel, and are both fixedly connected to the two top surfaces of the connecting seat; The seamless support platform is divided into two groups, which are respectively fixed on the first material taking plate and the second material taking plate.

[0012] Furthermore, each group of the seamless support platforms includes two seamless support platforms that are arranged opposite to each other; The minimum distance between the two oppositely disposed traceless support platforms is less than the length of the silicon wafer to be supported; The maximum distance between the two oppositely arranged traceless supporting platforms is greater than the length of the silicon wafer to be supported.

[0013] Furthermore, at least one supporting platform is respectively provided on the first feeding plate and the second feeding plate; The support platform is arranged between two corresponding oppositely arranged traceless supporting platforms.

[0014] Furthermore, a rubber layer is provided on the top of the support platform.

[0015] The present invention also provides a traceless film taking device, comprising: A horizontal moving mechanism, a grabbing driving mechanism and a traceless film taking tray as described above; The grabbing driving mechanism is slidably arranged on the horizontal moving mechanism; The connecting seat is slidably arranged on the grabbing driving mechanism; The horizontal moving mechanism is suitable for driving the grabbing driving mechanism to move back and forth in the horizontal direction; The grabbing driving mechanism is suitable for driving the connecting seat to move back and forth in a vertical direction.

[0016] The beneficial effect of the present invention is that the present invention provides a traceless wafer taking tray and a traceless wafer taking device, wherein the traceless wafer taking tray comprises: a connecting seat and a tray body; the tray body is fixedly connected to the connecting seat; a plurality of traceless supporting platforms are arranged on the tray body; a plurality of traceless supporting platforms are fixedly arranged on the tray body and enclosed to form a supporting area. By planning the movement trajectory of the traceless wafer taking tray, when taking materials, the supporting area of ​​the traceless wafer taking tray is just below the silicon wafer, and the traceless wafer taking tray takes out the silicon wafer when moving upward, realizing traceless wafer taking, without applying pressure on the silicon wafer, and avoiding scratches on the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0018] Figure 1It is a schematic structural diagram of a traceless film removal tray provided in an embodiment of the present invention.

[0019] Figure 2 It is a side view of the seamless film extraction tray provided by an embodiment of the present invention.

[0020] Figure 3 It is a schematic diagram of the structure of the traceless film taking device provided in an embodiment of the present invention.

[0021] Figure 4 It is a side view of the traceless film taking device provided by an embodiment of the present invention.

[0022] In the figure: 100, connecting seat; 200, tray body; 210, seamless supporting platform; 211, top surface; 212, supporting surface; 2121, guide section; 2122, supporting section; 213, side surface; 214, bottom surface; 220, first material picking plate; 230, second material picking plate; 240, supporting platform; 300, silicon wafer; 400, horizontal moving mechanism; 500, grabbing drive mechanism; 510, sliding plate; 520, rotating motor; 530, eccentric wheel; 540, connecting plate; 550, sliding block. DETAILED DESCRIPTION

[0023] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0024] For examples, see Figure 1-Figure 2 The present embodiment provides a traceless wafer taking tray, comprising: a connecting seat 100 and a tray body 200; the tray body 200 is fixedly connected to the connecting seat 100; a plurality of traceless supporting platforms 210 are arranged on the tray body 200; the plurality of traceless supporting platforms 210 are fixedly arranged on the tray body 200 and enclose a supporting area. By planning the movement trajectory of the traceless wafer taking tray, when taking the material, the supporting area of ​​the traceless wafer taking tray is just below the silicon wafer 300, and the traceless wafer taking tray takes out the silicon wafer 300 when moving upward, realizing traceless wafer taking, without applying pressure on the silicon wafer 300, and avoiding scratches on the silicon wafer 300.

[0025] The structure of the markless supporting platform 210 is described below. In the present embodiment, the markless supporting platform 210 includes: a top surface 211, a bottom surface 214, a supporting surface 212 and three side surfaces 213; the top surface 211 and the bottom surface 214 are arranged opposite to each other; the three side surfaces 213 and the supporting surface 212 enclose the side wall of the markless supporting platform 210; the supporting surface 212 is arranged opposite to the side wall of the silicon wafer 300 to be supported.

[0026] When the wafer is removed, the side wall of the silicon wafer 300 overlaps with the supporting surface 212, which not only fixes the silicon wafer 300 but also reduces the probability of scratching the silicon wafer 300.

[0027] In order to facilitate the removal of the silicon wafer 300 , in this embodiment, the supporting surface 212 is tilted. When the silicon wafer 300 is removed, the supporting surface 212 is used to guide the silicon wafer 300 , thereby ensuring that the silicon wafer 300 falls into the supporting area.

[0028] At the same time, in order to prevent the silicon wafer 300 from being scratched when sliding up and down the supporting surface 212, in this embodiment, a flexible buffer layer is provided on the supporting surface 212. By providing the flexible buffer layer, the silicon wafer 300 is buffered and supported when sliding down, so as to prevent the silicon wafer 300 from being scratched when contacting the supporting surface 212.

[0029] In this embodiment, the supporting surface 212 includes a guide section 2121 and a supporting section 2122; the slope of the guide section 2121 is greater than the slope of the supporting section 2122. Since the slope of the guide section 2121 is greater than the slope of the supporting section 2122, when taking the wafer, the guide section 2121 can be used to quickly guide the silicon wafer 300, and when support is required, the slope is reduced, thereby reducing the impact force on the silicon wafer 300, thereby completing the seamless wafer taking.

[0030] In this embodiment, the connection seat 100 is U-shaped; the tray body 200 includes a first material picking plate 220 and a second material picking plate 230; the first material picking plate 220 and the second material picking plate 230 are arranged in parallel and are fixedly connected to the two top surfaces 211 of the connection seat 100; the seamless support platform 210 is divided into two groups, which are respectively fixed on the first material picking plate 220 and the second material picking plate 230. The connection seat 100 is designed to be U-shaped to avoid interference with material picking and placing.

[0031] In this embodiment, each group of the non-marking support platforms 210 includes two non-marking support platforms 210 arranged opposite to each other; the minimum distance between the two non-marking support platforms 210 arranged opposite to each other is less than the length of the silicon wafer 300 to be supported; the maximum distance between the two non-marking support platforms 210 arranged opposite to each other is greater than the length of the silicon wafer 300 to be supported. By controlling the distance between the two non-marking support platforms 210 arranged opposite to each other, the silicon wafer 300 can fall into the two non-marking support platforms 210 arranged opposite to each other, and at the same time, the support surface 212 is used to reduce the demand for material picking accuracy, and the support surface 212 can adaptively adjust the position of the silicon wafer 300, so that it can be fixed at a fixed position in the support area.

[0032] Since the silicon wafer 300 is relatively long, in order to prevent the silicon wafer 300 from bending, in this embodiment, at least one support platform 240 is respectively provided on the first pick-up plate 220 and the second pick-up plate 230; the support platform 240 is provided between the corresponding two oppositely arranged traceless support platforms 210. The support platform 240 supports the middle part of the silicon wafer 300, thereby reducing the bending degree of the silicon wafer 300 and avoiding damage to the silicon wafer 300.

[0033] At the same time, in order to prevent the silicon wafer 300 from being damaged by hard contact with the top surface 211 of the support platform 240 when the silicon wafer 300 falls into the supporting area, in this embodiment, a rubber layer is provided on the top of the support platform 240. The rubber layer cushions the silicon wafer 300 and reduces the probability of damage to the silicon wafer 300.

[0034] See also Figure 3-Figure 4 This embodiment also provides a traceless film taking device, including: a horizontal moving mechanism 400, a grabbing drive mechanism 500 and the traceless film taking tray as described above; the grabbing drive mechanism 500 is slidably arranged on the horizontal moving mechanism 400; the connecting seat 100 is slidably arranged on the grabbing drive mechanism 500; the horizontal moving mechanism 400 is suitable for driving the grabbing drive mechanism 500 to reciprocate in the horizontal direction; the grabbing drive mechanism 500 is suitable for driving the connecting seat 100 to reciprocate in the vertical direction.

[0035] The grab driving mechanism 500 includes a sliding plate 510, a rotating motor 520, an eccentric wheel 530, a connecting plate 540 and a sliding block 550; the sliding plate 510 is slidably arranged on the horizontal moving mechanism 400, and is suitable for reciprocating in the horizontal direction under the drive of the horizontal moving mechanism 400. The rotating motor 520 is fixedly arranged on the sliding plate 510, the eccentric wheel 530 is fixedly connected to the rotor of the rotating motor 520, the sliding block 550 is slidably arranged on the sliding plate 510, and slides in the vertical direction, one end of the connecting plate 540 is rotationally connected to the eccentric wheel 530, and the other end is rotationally connected to the sliding block 550, and when the rotating motor 520 rotates, it drives the sliding block 550 to reciprocate in the vertical direction at a variable speed.

[0036] Since the connecting seat 100 is fixed on the sliding block 550, when the horizontal moving mechanism 400 reciprocates horizontally at a constant speed and the sliding block 550 reciprocates vertically at a variable speed, the connecting seat 100 is driven to make an elliptical motion, thereby completing material picking and discharging.

[0037] In summary, the present invention provides a traceless film-taking tray and a traceless film-taking device, wherein the traceless film-taking tray comprises: a connecting seat 100 and a tray body 200; the tray body 200 is fixedly connected to the connecting seat 100; a plurality of traceless supporting platforms 210 are arranged on the tray body 200; a plurality of traceless supporting platforms 210 are fixedly arranged on the tray body 200, and enclose to form a supporting area. By planning the movement trajectory of the traceless film-taking tray, when taking the material, the supporting area of ​​the traceless film-taking tray is just located below the silicon wafer 300, and the traceless film-taking tray takes out the silicon wafer 300 when moving upward, realizing traceless film taking, without applying pressure on the silicon wafer 300, and avoiding scratches on the silicon wafer 300.

[0038] All devices (parts without specific structure) selected in this application are universal standard parts or parts known to those skilled in the art, and their structures and principles can be known by those skilled in the art through technical manuals or conventional experimental methods. In addition, the software programs involved in this application are all prior art, and this application does not involve any improvement to the software programs.

[0039] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0041] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0042] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0043] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0044] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A traceless film-taking tray, characterized in that: include: Connecting seat and tray body; The tray body is fixedly connected to the connecting seat; The tray body is provided with a plurality of seamless supporting platforms; A plurality of the traceless supporting platforms are fixedly arranged on the tray body and enclose a supporting area.

2. The traceless film removal tray according to claim 1, characterized in that: The traceless support platform comprises: a top surface, a bottom surface, a support surface and three side surfaces; The top surface is arranged opposite to the bottom surface; The three side surfaces and the supporting surface enclose and form a side wall of a seamless supporting platform; The supporting surface is arranged opposite to the side wall of the silicon wafer to be supported.

3. The traceless film removal tray according to claim 2, characterized in that: The supporting surface is arranged inclined.

4. The traceless film removal tray according to claim 3, characterized in that: A flexible buffer layer is arranged on the supporting surface.

5. The traceless film removal tray according to claim 3, characterized in that: The supporting surface includes a guide section and a supporting section; The inclination of the guide section is greater than the inclination of the supporting section.

6. The traceless film removal tray according to claim 1, characterized in that: The connecting seat is U-shaped; The tray body includes a first material picking plate and a second material picking plate; The first material taking plate and the second material taking plate are arranged in parallel, and are both fixedly connected to the two top surfaces of the connecting seat; The seamless support platform is divided into two groups, which are respectively fixed on the first material taking plate and the second material taking plate.

7. The traceless film removal tray according to claim 6, characterized in that: Each group of the seamless support platforms includes two seamless support platforms arranged opposite to each other; The minimum distance between the two oppositely disposed traceless support platforms is less than the length of the silicon wafer to be supported; The maximum distance between the two oppositely arranged traceless supporting platforms is greater than the length of the silicon wafer to be supported.

8. The traceless film removal tray according to claim 7, characterized in that: The first retrieving plate and the second retrieving plate are respectively provided with at least one supporting platform; The support platform is arranged between two corresponding oppositely arranged traceless supporting platforms.

9. The traceless film removal tray according to claim 8, characterized in that: A rubber layer is arranged on the top of the supporting platform.

10. A traceless film taking device, characterized in that: include: A horizontal moving mechanism, a grabbing driving mechanism, and a traceless film taking tray as claimed in any one of claims 1 to 9; The grabbing driving mechanism is slidably arranged on the horizontal moving mechanism; The connecting seat is slidably arranged on the grabbing driving mechanism; The horizontal moving mechanism is suitable for driving the grabbing driving mechanism to move back and forth in the horizontal direction; The grabbing driving mechanism is suitable for driving the connecting seat to move back and forth in a vertical direction.

Images