Purple light full-spectrum LED light-emitting device and preparation method thereof

Abstract

The invention discloses a purple light full-spectrum LED light-emitting device and a preparation method thereof, and the method comprises the steps: providing an LED support which comprises an LED substrate and a lamp bowl structure disposed on the LED substrate; respectively fixing a purple light chip and a light-emitting single crystal three-wavelength blue light chip on the LED substrate in the lamp bowl structure, and respectively electrically connecting the purple light chip and the blue light chip; mixing the cyan fluorescent powder with the first preset wavelength, the green fluorescent powder with the second preset wavelength and the red fluorescent powder with the third preset wavelength with a packaging adhesive to obtain a mixed packaging adhesive; and filling the mixed packaging adhesive into the lamp bowl structure of the LED bracket to cover the purple light chip and the blue light chip, thereby obtaining the purple light full-spectrum LED light-emitting device. According to the invention, a single-chip three-wavelength blue light chip is provided to replace the existing modulation fluorescent powder, so that the continuous spectrum can be realized, and the service life of the LED light-emitting device is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device production, and in particular to a purple full-spectrum LED light-emitting device and a preparation method thereof. Background Art

[0002] With the development of technology, the application fields of LED devices are becoming more and more extensive, and the requirements for light-emitting devices are also getting higher and higher. The concept of people-oriented light use has emerged, and full-spectrum products have come into being. Full-spectrum LEDs greatly enhance the continuity and integrity of the spectrum by supplementing the missing short-wave purple light, cyan light, short-wave green light, and long-wave red light. Short-wave "purple light" helps the human body synthesize vitamin D and promotes the body's absorption of calcium, while the 400-420nm wavelength of purple light also helps plants form anthocyanins and resist the elongation of branches and leaves.

[0003] In the prior art, continuous full-spectrum LED light-emitting devices are generally prepared by mixing purple light chips + phosphors, usually including 450-455nm blue phosphors, 490-495nm cyan phosphors, 520-525nm green phosphors and 650-660nm red phosphors. However, due to the unstable and immature technology, blue phosphors cannot withstand the high temperatures during the use of LEDs, resulting in a short service life of LED light-emitting devices.

[0004] Therefore, there is still a problem in the prior art that the purple light chip + phosphor mixture realizes continuous full-spectrum light emission, which shortens the service life of the LED light-emitting device. Summary of the invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a purple full-spectrum LED light-emitting device and a preparation method thereof, aiming to solve the problems in the prior art. The first aspect of the present invention is to provide a method for preparing a purple full-spectrum LED light-emitting device, the method comprising: Provide an LED bracket, the LED bracket comprising an LED substrate and a lamp bowl structure arranged on the LED substrate; A purple light chip and a three-wavelength blue light chip of a light-emitting single crystal are fixed on the LED substrate in the lamp bowl structure, and the purple light chip and the blue light chip are electrically connected respectively; Mixing cyan phosphor of a first preset wavelength, green phosphor of a second preset wavelength, and red phosphor of a third preset wavelength with a packaging adhesive to obtain a mixed packaging adhesive; The mixed packaging glue is filled into the lamp bowl structure of the LED bracket to cover the purple light chip and the blue light chip to obtain a purple full-spectrum LED light-emitting device.

[0006] According to one aspect of the above technical solution, the step of mixing the cyan phosphor of the first preset wavelength, the green phosphor of the second preset wavelength and the red phosphor of the third preset wavelength with the packaging glue to obtain the mixed packaging glue specifically includes: Mixing cyan phosphor of a first preset wavelength, green phosphor of a second preset wavelength, and red phosphor of a third preset wavelength to obtain a mixed phosphor; The mixed phosphor is mixed with a pre-provided packaging adhesive to obtain a mixed packaging adhesive.

[0007] According to one aspect of the above technical solution, the step of performing a second mixing of the mixed phosphor and the packaging adhesive to obtain the mixed packaging adhesive specifically includes: Adding the mixed phosphor into packaging glue, and placing the packaging glue with the mixed phosphor in a centrifugal device; The centrifugal device is used to centrifuge the packaging glue added with the mixed fluorescent powder for a preset time to obtain the mixed packaging glue.

[0008] According to one aspect of the above technical solution, the preset time is 25-30 minutes.

[0009] According to one aspect of the above technical solution, the first preset wavelength is 492 nm, the second preset wavelength is 522 nm, and the third wavelength is 660 nm.

[0010] According to one aspect of the above technical solution, the light emitting band of the purple light chip is 405nm-415nm.

[0011] According to one aspect of the above technical solution, the ratio of the cyan phosphor, the green phosphor and the red phosphor is (2-3): (4-6): (0.8-1.2), so as to obtain a mixed phosphor based on this ratio.

[0012] According to one aspect of the above technical solution, the ratio of the mixed phosphor to the packaging adhesive is 1:(0.6-0.9).

[0013] A second aspect of the present invention is to provide a purple full-spectrum LED light-emitting device, the purple full-spectrum LED light-emitting device comprising: An LED bracket, wherein the LED bracket is provided with a lamp bowl structure; A purple light chip, which is arranged at the bottom of the lamp bowl structure of the LED bracket, and the light emission wavelength of the purple light chip is 405nm-415nm; A three-wavelength blue light chip of a single-crystal light emitting device, wherein the light emission wavelengths of the blue light chip are 437nm, 447nm, and 465nm; The mixed packaging glue is obtained by mixing packaging glue with cyan phosphor, green phosphor and red phosphor in a preset ratio and curing. The mixed packaging glue is filled in the lamp bowl structure to cover the purple chip and the blue chip.

[0014] According to one aspect of the above technical solution, the purple chip and the blue chip are both connected to the electrode structure on the LED bracket through wires.

[0015] Compared with the prior art, the purple full-spectrum LED light-emitting device and the preparation method thereof shown in the present invention have the following beneficial effects: The preparation method shown in the present invention is adopted, by providing an LED bracket, and then fixing a purple light chip and a three-wavelength and three-peak blue light chip of a light-emitting single crystal on the LED bracket respectively, and electrically connecting the purple light chip and the blue light chip respectively, and then mixing a cyan phosphor of a first preset wavelength, a green phosphor of a second preset wavelength, and a red phosphor of a third preset wavelength with a liquid packaging glue to obtain a mixed packaging glue, and finally filling the mixed packaging glue into the lamp bowl structure of the LED bracket, and obtaining a purple light full-spectrum LED light-emitting device after curing. The preparation method is adopted, by providing a three-wavelength and three-peak blue light chip of a light-emitting single crystal to replace the existing implementation scheme of modulated phosphor, which can realize a purple light continuous spectrum and improve the service life of the LED light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 It is a schematic flow chart of a method for preparing a purple full-spectrum LED light-emitting device in one embodiment of the present invention; Figure 2 A wavelength diagram of a three-wavelength, three-peak blue light chip of a light-emitting single crystal in one embodiment of the present invention; Figure 3 Schematic diagram of the spectrum of a purple full-spectrum LED light-emitting device at different color temperatures in one embodiment of the present invention. DETAILED DESCRIPTION

[0017] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings. Several embodiments of the present invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0018] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0020] The first aspect of the present invention is to provide a method for preparing a purple full-spectrum LED light-emitting device, the method comprising: Provide an LED bracket, the LED bracket comprising an LED substrate and a lamp bowl structure arranged on the LED substrate; A purple light chip and a three-wavelength blue light chip of a light-emitting single crystal are fixed on the LED substrate in the lamp bowl structure, and the purple light chip and the blue light chip are electrically connected respectively; Mixing cyan phosphor of a first preset wavelength, green phosphor of a second preset wavelength, and red phosphor of a third preset wavelength with a packaging adhesive to obtain a mixed packaging adhesive; The mixed packaging glue is filled into the lamp bowl structure of the LED bracket to cover the purple light chip and the blue light chip to obtain a purple full-spectrum LED light-emitting device.

[0021] Further, the step of mixing the cyan phosphor of the first preset wavelength, the green phosphor of the second preset wavelength, and the red phosphor of the third preset wavelength with the packaging glue to obtain the mixed packaging glue specifically includes: Mixing cyan phosphor of a first preset wavelength, green phosphor of a second preset wavelength, and red phosphor of a third preset wavelength to obtain a mixed phosphor; The mixed phosphor is mixed with a pre-provided packaging adhesive to obtain a mixed packaging adhesive.

[0022] Furthermore, the mixed phosphor and the packaging adhesive are mixed for a second time to obtain a mixed packaging adhesive, which specifically includes: Adding the mixed phosphor into packaging glue, and placing the packaging glue with the mixed phosphor in a centrifugal device; The centrifugal device is used to centrifuge the packaging glue added with the mixed fluorescent powder for a preset time to obtain the mixed packaging glue.

[0023] Furthermore, the preset time is 25-30 minutes.

[0024] Furthermore, the first preset wavelength is 492 nm, the second preset wavelength is 522 nm, and the third wavelength is 660 nm.

[0025] Furthermore, the light emission band of the purple light chip is 405nm-415nm.

[0026] Furthermore, the ratio of the cyan phosphor, the green phosphor and the red phosphor is such that a mixed phosphor is obtained based on the ratio.

[0027] Furthermore, the ratio of the mixed phosphor to the packaging adhesive is:

[0028] A second aspect of the present invention is to provide a purple full-spectrum LED light-emitting device, the purple full-spectrum LED light-emitting device comprising: An LED bracket, wherein the LED bracket is provided with a lamp bowl structure; A purple light chip, which is arranged at the bottom of the lamp bowl structure of the LED bracket, and the light emission wavelength of the purple light chip is 405nm-415nm; A three-wavelength blue light chip of a single-crystal light emitting device, wherein the light emission wavelengths of the blue light chip are 437nm, 447nm, and 465nm; The mixed packaging glue is obtained by mixing packaging glue with cyan phosphor, green phosphor and red phosphor in a preset ratio and curing. The mixed packaging glue is filled in the lamp bowl structure to cover the purple chip and the blue chip.

[0029] Furthermore, the purple chip and the blue chip are both connected to the electrode structure on the LED bracket through wires.

[0030] Compared with the prior art, the purple full-spectrum LED light-emitting device and the preparation method thereof shown in the present invention have the following beneficial effects: The preparation method shown in the present invention is adopted, by providing an LED bracket, and then fixing a purple light chip and a three-wavelength and three-peak blue light chip of a light-emitting single crystal on the LED bracket respectively, and electrically connecting the purple light chip and the blue light chip respectively, and then mixing a cyan phosphor of a first preset wavelength, a green phosphor of a second preset wavelength, and a red phosphor of a third preset wavelength with a liquid packaging glue to obtain a mixed packaging glue, and finally filling the mixed packaging glue into the lamp bowl structure of the LED bracket, and obtaining a purple light full-spectrum LED light-emitting device after curing. The preparation method is adopted, by providing a three-wavelength and three-peak blue light chip of a light-emitting single crystal to replace the existing implementation scheme of modulated phosphor, which can realize a purple light continuous spectrum and improve the service life of the LED light-emitting device.

[0031] Embodiment 1 See also Figure 1-Figure 3 The first embodiment of the present invention provides a method for preparing a purple full-spectrum LED light-emitting device. The preparation method shown in this embodiment includes steps S10 to S40: Step S10, providing an LED bracket.

[0032] In this embodiment, the LED bracket includes an LED substrate and a lamp bowl structure arranged on the LED substrate. The LED substrate is used for crystal bonding, that is, for fixing the LED chip. Specifically, it is fixed on the LED substrate by crystal bonding glue. The crystal bonding glue is usually silver glue. The light-emitting surface of the LED chip faces the lamp bowl structure, and light is focused and guided through the lamp bowl structure.

[0033] Specifically, the LED bracket is made of PPA material, and is usually formed by injection molding of the PPA material.

[0034] Step S20, respectively fixing a purple light chip and a three-wavelength blue light chip of a light-emitting single crystal on the LED substrate in the lamp bowl structure, and electrically connecting the purple light chip and the blue light chip respectively.

[0035] In this embodiment, in order to meet the full-spectrum luminescence, the blue light chip shown in this embodiment is a single-crystal three-wavelength three-peak LED chip, and its luminous wavelengths are 437nm, 447nm and 465nm respectively. The blue light chip contains three bands to achieve full-spectrum luminescence.

[0036] Among them, the emission wavelength of the purple light chip is 405nm-415nm. It can significantly improve the reliability of LED light-emitting devices by replacing the addition of blue phosphor with wide half-peak blue light.

[0037] Specifically, the LED substrates of the LED bracket are fixed by bonding glue, and then the purple light chip and the blue light chip are bonded to the electrode structure respectively. For example, the positive electrode and the negative electrode of the purple light chip are respectively bonded to the corresponding purple light positive electrode and the purple light negative electrode by wire bonding, and the positive electrode and the negative electrode of the blue light chip are respectively bonded to the corresponding blue light positive electrode and the purple light negative electrode by wire bonding, or the blue light chip and the purple light chip are connected in series, and only the two poles of the series chip are connected to the positive electrode and the negative electrode by wire bonding.

[0038] It should be noted here that the purple chip and the blue chip are both die-bonded on the LED substrate. The purple chip and the blue chip are located at the bottom of the lamp bowl structure, and the light-emitting surface faces the inside of the lamp bowl structure to focus and guide light through the lamp bowl structure.

[0039] Step S30 , mixing the cyan phosphor of the first preset wavelength, the green phosphor of the second preset wavelength, and the red phosphor of the third preset wavelength with a packaging adhesive to obtain a mixed packaging adhesive.

[0040] In this embodiment, in order to enable the purple light chip and the three-wavelength three-peak blue light chip of the light-emitting single crystal to be combined to emit full-spectrum purple light, the purple light chip and the blue light chip are also covered with a specially modulated packaging glue in this embodiment to further modulate the luminous wavelength of the combined light.

[0041] Specifically, in this embodiment, cyan phosphor with a wavelength of 492 nm, green phosphor with a wavelength of 522 nm, and red phosphor with a wavelength of 660 nm are mixed with a pre-provided packaging adhesive to obtain a mixed packaging adhesive.

[0042] Furthermore, when mixing cyan phosphor, green phosphor, red phosphor and packaging glue, it is first necessary to mix cyan phosphor, green phosphor and red phosphor in a preset ratio to obtain a mixed phosphor, the ratio of cyan phosphor, green phosphor and red phosphor is (2-3): (4-6): (0.8-1.2), and then add the mixed phosphor to the pre-modulated liquid packaging glue, the ratio of the mixed phosphor to the packaging glue is 1: (0.6-0.9), and then centrifuge the mixed phosphor and packaging glue to make the mixed phosphor evenly distributed in the packaging glue, thereby obtaining a mixed packaging glue for packaging purple light chips and blue light chips.

[0043] Wherein, when the mixed phosphor and liquid encapsulation adhesive are centrifuged, the centrifugation time is 30 minutes.

[0044] As shown in Table 1, Table 1 is a schematic table of the ratio of phosphor to packaging adhesive.

[0045] Table 1

[0046] According to Table 1, for example, when the purple full-spectrum LED light-emitting device shown in this embodiment needs to achieve a color temperature of 2700K, the added weights of the cyan phosphor, the green phosphor and the red phosphor are 3.05g, 6.32g and 1.3g respectively; when it is necessary to achieve a color temperature of 4000K, the added weights of the cyan phosphor, the green phosphor and the red phosphor are 2.34g, 4.93g and 1.3g respectively; when it is necessary to achieve a color temperature of 5000K, the added weights of the cyan phosphor, the green phosphor and the red phosphor are 2.11g, 4.32g and 0.85g respectively; and under various ratio structures, the encapsulation glue is 12g, which is mixed with the mixed phosphor formed by mixing the cyan phosphor, the green phosphor and the red phosphor to obtain a mixed encapsulation glue.

[0047] It can be seen that when the color temperature required to be achieved is higher, less cyan phosphor, green phosphor and red phosphor are required. Conversely, when the color temperature required to be achieved is lower, more cyan phosphor, green phosphor and red phosphor are required.

[0048] Step S40, filling the mixed packaging glue into the lamp bowl structure of the LED bracket to cover the purple light chip and the blue light chip to obtain a purple full-spectrum LED light-emitting device.

[0049] In this embodiment, after the mixed phosphor and liquid packaging glue are centrifuged to obtain the mixed packaging glue, the mixed packaging glue needs to be filled into the lamp bowl structure of the LED bracket as soon as possible, so that the liquid mixed packaging glue covers the purple chip and the blue chip in the lamp bowl mechanism, and then the liquid mixed packaging glue is solidified in the lamp bowl structure, thereby completing the packaging and obtaining a purple full-spectrum LED light-emitting device.

[0050] After the liquid mixed encapsulation adhesive is obtained, in order to ensure parameter stability, curing needs to be completed within 60 minutes.

[0051] For example, after the mixed packaging glue is filled into the lamp bowl structure, it can be cured at high temperature by baking, thereby shortening the curing time of the mixed packaging glue and ensuring the stability of parameters.

[0052] In summary, this embodiment premixes three different colors of phosphors in different proportions and mixes them with liquid packaging glue to obtain a mixed packaging glue, and then packages the pre-fixed purple light chip and the three-wavelength and three-peak blue chip of the light-emitting single crystal. The packaged purple full-spectrum LED light-emitting device can achieve a color temperature of 2700K-5700K.

[0053] By adopting the preparation method shown in this embodiment, a purple full-spectrum LED light-emitting device is prepared, and the light-emitting device comprises: An LED bracket, wherein the LED bracket is provided with a lamp bowl structure; A purple light chip, which is arranged at the bottom of the lamp bowl structure of the LED bracket, and the light emission wavelength of the purple light chip is 405nm-415nm; A three-wavelength blue light chip of a single-crystal light emitting device, wherein the light emission wavelengths of the blue light chip are 437nm, 447nm, and 465nm; The mixed packaging glue is obtained by mixing packaging glue with cyan phosphor, green phosphor and red phosphor in a preset ratio and curing. The mixed packaging glue is filled in the lamp bowl structure to cover the purple chip and the blue chip.

[0054] Wherein, the purple light chip and the blue light chip are both connected to the electrode structure on the LED bracket through wires.

[0055] That is to say, the light-emitting device shown in this embodiment, its LED bracket includes an LED substrate and a lamp bowl structure, and a purple light chip with a light-emitting wavelength of 405nm-415nm and blue light chips with light-emitting wavelengths of 437nm, 447nm and 465nm are arranged on the LED substrate of the lamp bowl structure, and the purple light chip and the blue light chip are both connected to the electrode structure through wire bonding for conducting electricity through the electrode structure, and then, the lamp bowl structure is filled with a pre-prepared mixed packaging glue, so as to obtain a purple light full-spectrum LED light-emitting device with a color temperature of 2700K-5700K through the coordinated use of the purple light chip, the blue light chip and the mixed packaging glue.

[0056] In this embodiment, two aging methods are used to perform aging tests on the prepared purple full-spectrum LED light-emitting device, and aging tests of products of the solutions shown in the prior art are provided for comparison. The results are shown in Table 1: Table 1

[0057] Compared with the prior art, the purple full-spectrum LED light-emitting device and the preparation method thereof shown in this embodiment have the following beneficial effects: By adopting the preparation method shown in this embodiment, an LED bracket is provided, and then a purple light chip and a three-wavelength and three-peak blue light chip of a light-emitting single crystal are fixed on the LED bracket respectively, and the purple light chip and the blue light chip are electrically connected respectively, and then a cyan phosphor of a first preset wavelength, a green phosphor of a second preset wavelength and a red phosphor of a third preset wavelength are mixed with liquid packaging glue to obtain a mixed packaging glue, and finally the mixed packaging glue is filled in the lamp bowl structure of the LED bracket, and a purple light full-spectrum LED light-emitting device is obtained after curing. By adopting this preparation method, a three-wavelength and three-peak blue light chip of a light-emitting single crystal is provided to replace the existing implementation scheme of modulated phosphor, so that a purple light continuous spectrum can be achieved and the service life of the LED light-emitting device can be improved.

[0058] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0059] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for preparing a purple full-spectrum LED light-emitting device, characterized in that: The method comprises: Provide an LED bracket, the LED bracket comprising an LED substrate and a lamp bowl structure arranged on the LED substrate; A purple light chip and a three-wavelength blue light chip of a light-emitting single crystal are fixed on the LED substrate in the lamp bowl structure, and the purple light chip and the blue light chip are electrically connected respectively; Mixing cyan phosphor of a first preset wavelength, green phosphor of a second preset wavelength, and red phosphor of a third preset wavelength with a packaging adhesive to obtain a mixed packaging adhesive; The mixed packaging glue is filled into the lamp bowl structure of the LED bracket to cover the purple light chip and the blue light chip to obtain a purple full-spectrum LED light-emitting device.

2. The method for preparing the purple full-spectrum LED light-emitting device according to claim 1, characterized in that: The step of mixing cyan phosphor of a first preset wavelength, green phosphor of a second preset wavelength, and red phosphor of a third preset wavelength with a packaging adhesive to obtain a mixed packaging adhesive specifically includes: Mixing cyan phosphor of a first preset wavelength, green phosphor of a second preset wavelength, and red phosphor of a third preset wavelength to obtain a mixed phosphor; The mixed phosphor is mixed with a pre-provided packaging adhesive to obtain a mixed packaging adhesive.

3. The method for preparing the purple full-spectrum LED light-emitting device according to claim 2, characterized in that: The step of performing a second mixing of the mixed phosphor and the packaging adhesive to obtain a mixed packaging adhesive specifically comprises: Adding the mixed phosphor into packaging glue, and placing the packaging glue with the mixed phosphor in a centrifugal device; The centrifugal device is used to centrifuge the packaging glue added with the mixed fluorescent powder for a preset time to obtain the mixed packaging glue.

4. The method for preparing the purple full-spectrum LED light-emitting device according to claim 3, characterized in that: The preset time is 25-30 minutes.

5. The method for preparing a purple full-spectrum LED light-emitting device according to any one of claims 1 to 4, characterized in that: The first preset wavelength is 492 nm, the second preset wavelength is 522 nm, and the third wavelength is 660 nm.

6. The method for preparing the purple full-spectrum LED light-emitting device according to claim 5, characterized in that: The light emission band of the purple light chip is 405nm-415nm.

7. The method for preparing the purple full-spectrum LED light-emitting device according to claim 5, characterized in that: The ratio of the cyan phosphor, the green phosphor and the red phosphor is (2-3): (4-6): (0.8-1.2), so as to obtain a mixed phosphor based on the ratio.

8. The method for preparing a purple full-spectrum LED light-emitting device according to claim 7, characterized in that: The ratio of the mixed phosphor to the packaging adhesive is 1:(0.6-0.9).

9. A purple full-spectrum LED light-emitting device, characterized in that: The purple full-spectrum LED light emitting device comprises: An LED bracket, wherein the LED bracket is provided with a lamp bowl structure; A purple light chip, which is arranged at the bottom of the lamp bowl structure of the LED bracket, and the light emission wavelength of the purple light chip is 405nm-415nm; A three-wavelength blue light chip of a single-crystal light emitting device, wherein the light emission wavelengths of the blue light chip are 437nm, 447nm, and 465nm; The mixed packaging glue is obtained by mixing packaging glue with cyan phosphor, green phosphor and red phosphor in a preset ratio and curing. The mixed packaging glue is filled in the lamp bowl structure to cover the purple chip and the blue chip.

10. The purple full-spectrum LED light-emitting device according to claim 9, characterized in that: The purple chip and the blue chip are both connected to the electrode structure on the LED bracket through wires.

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