Display panel and display device

Abstract

The invention discloses a display panel and a display device. The display panel comprises a substrate; the anisotropic conductive adhesive layer is arranged on one side of the substrate; the light-emitting element is arranged on the side, away from the substrate, of the anisotropic conductive adhesive layer so as to be electrically connected with the substrate through the anisotropic conductive adhesive layer; wherein the anisotropic conductive adhesive layer comprises a first sub-layer and a second sub-layer, the orthographic projection of the first sub-layer on the substrate is covered by the orthographic projection of the light-emitting element on the substrate, the orthographic projection of the second sub-layer on the substrate is located outside the orthographic projection of the first sub-layer on the substrate, and the second sub-layer is provided with at least one notch. According to the display panel, the heat dissipation capability of the light-emitting element can be improved, the light-emitting effect is improved, and the service life of the light-emitting element is prolonged.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Light-emitting components are usually electrically connected by attaching the entire surface of the component to a substrate through an anisotropic conductive adhesive layer. If the heat of the light-emitting component is not dissipated in time, the defects in the light-emitting component will expand rapidly at high temperatures, causing the defects to invade the light-emitting layer of the light-emitting component and form a large number of non-radiative recombination centers, seriously affecting the luminous efficiency and life of the light-emitting component. Therefore, how to dissipate heat from the light-emitting component is an issue that needs to be urgently addressed in the industry. Summary of the invention

[0003] The present application provides a display panel and a display device, which can improve the heat dissipation capability of a light-emitting element, thereby improving the light-emitting effect and service life thereof.

[0004] A first aspect of an embodiment of the present application provides a display panel, comprising: a substrate; an anisotropic conductive adhesive layer, arranged on one side of the substrate; a light-emitting element, arranged on the side of the anisotropic conductive adhesive layer away from the substrate, so as to be electrically connected to the substrate through the anisotropic conductive adhesive layer; wherein the anisotropic conductive adhesive layer comprises a first sublayer and a second sublayer, the orthographic projection of the first sublayer on the substrate is covered by the orthographic projection of the light-emitting element on the substrate, the orthographic projection of the second sublayer on the substrate is located outside the orthographic projection of the first sublayer on the substrate, and the second sublayer is provided with at least one notch.

[0005] Wherein, the notch is a missing portion on the second sub-layer;

[0006] Preferably, the notch passes through the second sub-layer.

[0007] The gap is a gap formed relative to the first sub-layer after the thickness of the second sub-layer is reduced.

[0008] Wherein, the display panel further comprises:

[0009] A heat dissipation layer, at least arranged on a side of the light emitting element away from the substrate;

[0010] Preferably, the heat dissipation layer extends along the surface of the light emitting element away from the substrate to the side wall of the light emitting element, and the heat dissipation layer contacts the surface of the light emitting element away from the substrate and the side wall of the light emitting element;

[0011] Preferably, the material of the heat dissipation layer includes inorganic material;

[0012] Preferably, the heat dissipation layer has a thickness ranging from 30 to 100 nm.

[0013] Wherein, first heat-conducting particles are distributed in the heat dissipation layer;

[0014] Preferably, the first thermally conductive particles include porous silicon oxide.

[0015] Wherein, the display panel further comprises:

[0016] an encapsulation layer, located on a side of the anisotropic conductive adhesive layer away from the substrate, and an orthographic projection of the encapsulation layer on the substrate is distributed outside an orthographic projection of the light-emitting element on the substrate, and the encapsulation layer is in contact with a side wall of the light-emitting element, wherein second thermally conductive particles are distributed in the encapsulation layer;

[0017] Preferably, the second thermally conductive particles include at least one of chromium, titanium, silver, graphene and carbon black.

[0018] Wherein, the material of the encapsulation layer includes photoresist;

[0019] Preferably, the color of the encapsulation layer is black;

[0020] Preferably, the thickness of the encapsulation layer is in the range of 1 to 6 microns.

[0021] Wherein, the display panel further comprises:

[0022] A high-transmittance layer is disposed on a side of the light-emitting element away from the substrate;

[0023] Preferably, the thickness of the high-transmittance layer is in the range of 1 to 6 microns.

[0024] Wherein, the display panel further comprises:

[0025] The passivation layer is arranged between the substrate and the anisotropic conductive adhesive layer. The passivation layer is provided with via holes. The conductive particles in the anisotropic conductive adhesive layer are located in the via holes. Then, the light emitting element is electrically connected to the substrate through the conductive particles.

[0026] A second aspect of an embodiment of the present application provides a display device, comprising a display panel as described in any one of the above items.

[0027] The beneficial effects of the present application are as follows: the display panel of the present application includes a substrate, an anisotropic conductive adhesive layer and a light-emitting element, the anisotropic conductive adhesive layer is arranged on one side of the substrate packaging layer, the light-emitting element is arranged on the side of the anisotropic conductive adhesive layer away from the substrate packaging layer, the anisotropic conductive adhesive layer includes a first sublayer and a second sublayer, the projection of the first sublayer on the substrate packaging layer is covered by the projection of the light-emitting element on the substrate packaging layer, the projection of the second sublayer on the substrate packaging layer is located outside the projection of the first sublayer on the substrate packaging layer, and the second sublayer is provided with at least one notch, so that the light-emitting element dissipates heat to the notch through the anisotropic conductive adhesive layer around itself, and the heat can be discharged faster through the substrate, so that the heat dissipation effect of the light-emitting element is better, thereby improving its light-emitting effect and service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 This is a schematic structural diagram of an embodiment of a display panel of the present application;

[0030] Figure 2 This is a schematic structural diagram of another embodiment of the display panel of the present application;

[0031] Figure 3 This is a schematic structural diagram of another embodiment of the display panel of the present application;

[0032] Figure 4 It is a schematic structural diagram of an embodiment of a display device of the present application. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] See also Figure 1 In one embodiment, the display panel 100 includes a substrate 101, an anisotropic conductive adhesive layer 102, and a light emitting element 103. The anisotropic conductive adhesive layer 102 is disposed on one side of the substrate 101; the light emitting element 103 is disposed on the side of the anisotropic conductive adhesive layer 102 away from the substrate 101, so as to be electrically connected to the substrate 101 through the anisotropic conductive adhesive layer 102.

[0035] Among them, the anisotropic conductive adhesive layer 102 includes a first sublayer 1021 and a second sublayer 1022, the orthographic projection of the first sublayer 1021 on the substrate 101 is covered by the orthographic projection of the light-emitting element 103 on the substrate 101, and the orthographic projection of the second sublayer 1022 on the substrate 101 is located outside the orthographic projection of the first sublayer 1021 on the substrate 101, and the second sublayer 1022 is provided with at least one notch 10221.

[0036] Specifically, the material of the substrate 101 can be an insulating material such as polyimide, polystyrene, etc., and a driving circuit is provided in the substrate 101, and the driving circuit is used to drive the light-emitting element 103 to emit light. The anisotropic conductive adhesive layer 102 (Anisotropic Conductive Film, ACF) has the characteristics of vertical conduction and horizontal non-conduction, so that the light-emitting element 103 and the substrate 101 are electrically connected in the vertical direction and not electrically connected in other directions. The light-emitting element 103 can be any element that can emit light, such as Micro-LED (Microscopic Light-Emitting Diode), OLED (Organic Light Emitting Diode), etc. The number of light-emitting elements 103 can be one or more, and the present application does not impose any restrictions, wherein, Figure 1 and Figure 2 The schematic diagrams are all based on the assumption that the number of light emitting elements 103 is two.

[0037] The first sublayer 1021 is located between the light emitting element 103 and the substrate 101, and the second sublayer 1022 is exposed outside the light emitting element 103. The formation process of the notch 10221 can be, for example, laser drilling, cutting machine cutting, patterning, plasma thinning, etc. The notch 10221 can be of various shapes, and the number of notches 10221 can be one or more. The setting of the notch 10221 can allow the light emitting element 103 to dissipate heat to the notch 10221 through the anisotropic conductive adhesive layer 102 around itself, and the substrate 101 is generally provided with a heat dissipation channel, so that the heat generated by the light emitting element 103 can be more quickly conducted through the substrate 101 through the notch 10221, so that the heat dissipation effect of the light emitting element 103 is better, thereby improving its light emitting effect and service life.

[0038] It can be seen from the above content that the display panel 100 of the present application includes a substrate 101, an anisotropic conductive adhesive layer 102 and a light-emitting element 103. The anisotropic conductive adhesive layer 102 is arranged on one side of the substrate 101, and the light-emitting element 103 is arranged on the side of the anisotropic conductive adhesive layer 102 away from the substrate 101. The anisotropic conductive adhesive layer 102 includes a first sublayer 1021 and a second sublayer 1022. The orthographic projection of the first sublayer 1021 on the substrate 101 is covered by the orthographic projection of the light-emitting element 103 on the substrate 101, and the orthographic projection of the second sublayer 1022 on the substrate 101 is located outside the orthographic projection of the first sublayer 1021 on the substrate 101. The second sublayer 1022 is provided with at least one notch 10221. The light-emitting element 103 dissipates heat to the notch 10221 through the anisotropic conductive adhesive layer 102 around itself, and the heat can be discharged faster through the substrate 101, so that the heat dissipation effect of the light-emitting element 103 is better, thereby improving its light-emitting effect and service life.

[0039] In one embodiment, the notch 10221 is a missing portion on the second sub-layer 1022. In this case, during preparation, the anisotropic conductive adhesive layer 102 exposed outside the light-emitting element 103 is patterned to obtain the notch 10221. Specifically, the anisotropic conductive adhesive layer 102 exposed outside the light-emitting element 103 can be patterned by processes such as photolithography or dry etching to obtain the notch 10221.

[0040] Continue reading Figure 1 In one application scenario, the notch 10221 penetrates the second sublayer 1022, that is, the notch 10221 is a through groove that penetrates the second sublayer 1022, and the light-emitting element 103 dissipates heat to the notch 10221 through the anisotropic conductive adhesive layer 102 around itself, and the heat can be more quickly conducted through the substrate 101, so that the light-emitting element 103 has a better heat dissipation effect, thereby improving its light-emitting effect and service life. At this time, in order to better protect the performance of the light-emitting element 103, a certain distance can be set between the notch 10221 and the light-emitting element 103, and the distance can be set according to actual needs. The setting of the distance can improve the heat dissipation effect of the light-emitting element 103 while avoiding affecting the reliability of the light-emitting element 103.

[0041] In other embodiments, the notch 10221 may not penetrate the second sub-layer 1022 , but only penetrate a portion of the second sub-layer 1022 .

[0042] See also Figure 2In another embodiment, the notch 10221 is a notch 10221 formed by thinning the thickness of the second sub-layer 1022 relative to the first sub-layer 1021. In this case, during preparation, the anisotropic conductive adhesive layer 102 exposed outside the light-emitting element 103 is thinned to obtain the notch 10221. The thinning process can reduce the thickness of the anisotropic conductive adhesive layer 102, thereby increasing the heat dissipation capacity around the light-emitting element 103. The thinning process can be, for example, laser processing, chemical mechanical polishing, etc.

[0043] In one application scenario, the thinning process specifically includes plasma thinning process. In this case, during the thinning process, the plasma used may be, for example, O2 (oxygen), N2 (nitrogen), H2 (hydrogen), AR (argon), etc., and the energy of the thinning process is controlled at 100w to 500w, and during the thinning process, the thickness of the anisotropic conductive adhesive layer 102 may be thinned to 2 to 4 microns.

[0044] See also Figure 3 In another embodiment, the display panel 100 further includes a heat dissipation layer 104 ， The heat dissipation layer 104 is at least disposed on the side of the light emitting element 103 away from the substrate 101. The heat dissipation layer 104 can conduct the heat generated by the light emitting element 103, thereby improving the heat dissipation capability of the light emitting element 103.

[0045] In one application scenario, the heat dissipation layer 104 extends along the surface of the light emitting element 103 away from the substrate 101 to the side wall of the light emitting element 103 , and the heat dissipation layer 104 contacts the surface of the light emitting element 103 away from the substrate 101 and the side wall of the light emitting element 103 .

[0046] It is understandable that when the contact area between the heat dissipation layer 104 and the light emitting element 103 is larger, the heat dissipation capability is better, so the heat dissipation layer 104 is arranged to contact both the surface of the light emitting element 103 away from the substrate 101 and the side wall of the light emitting element 103. It should be noted that in other embodiments, the heat dissipation layer 104 may also be arranged only on the surface of the light emitting element 103 away from the substrate 101, or only on the side wall of the light emitting element 103. In one embodiment, the material of the heat dissipation layer 104 includes an inorganic material, for example, at least one of aluminum oxide, silicon nitride, and zirconium oxide.

[0047] In one embodiment, the heat dissipation layer 104 has a thickness ranging from 30 to 100 nm, for example, 30 nm, 60 nm or 100 nm. In one embodiment, the heat dissipation layer 104 has first thermally conductive particles distributed therein. 。Adding the first thermally conductive particles to the heat dissipation layer 104 can significantly improve the thermal conductivity of the heat dissipation layer 104, wherein the amount and size of the first thermally conductive particles can be adjusted and optimized according to specific application requirements and usage conditions. In one embodiment, the first thermally conductive particles include porous silicon oxide, which has the characteristics of a high specific surface area and can increase the heat dissipation capacity of the light-emitting element 103. In other embodiments, the first thermally conductive particles may also include porous aluminum oxide, etc.

[0048] Continue reading Figure 3 The display panel 100 further includes an encapsulation layer 105, which is located on the side of the anisotropic conductive adhesive layer 102 away from the substrate 101, and the orthographic projection of the encapsulation layer 105 on the substrate 101 is distributed outside the orthographic projection of the light-emitting element 103 on the substrate 101, and the encapsulation layer 105 is in contact with the side wall of the light-emitting element 103.

[0049] Specifically, the encapsulation layer 105 has good mechanical strength, water resistance and high temperature resistance, and can reinforce and protect the light-emitting element 103 to prevent external water and oxygen from corroding the light-emitting element 103. At the same time, the orthographic projection of the encapsulation layer 105 on the substrate 101 is arranged to be distributed outside the orthographic projection of the light-emitting element 103 on the substrate 101, that is, the encapsulation layer 105 does not exist on the light-emitting path of the light-emitting element 103, thereby preventing the encapsulation layer 105 from affecting the light emission of the light-emitting element 103 and ensuring the light-emitting efficiency of the light-emitting element 103. Of course, in other embodiments, on the premise that the transmittance of the encapsulation layer 105 meets the preset requirements, the encapsulation layer 105 can also be located on the light-emitting path of the light-emitting element 103, that is, the specific position of the encapsulation layer 105 is not limited in this application.

[0050] Continue reading Figure 3 ,from Figure 3 It can be seen that the encapsulation layer 105 is further disposed on the side of the heat dissipation layer 104 away from the substrate 101. However, it should be noted that in other embodiments, the heat dissipation layer 104 and the encapsulation layer 105 may not exist at the same time, that is, the display panel 100 may only include the heat dissipation layer 104 but not the encapsulation layer 105, or only include the encapsulation layer 105 but not the heat dissipation layer 104.

[0051] In order to improve the heat dissipation performance of the light emitting element, second heat conductive particles are distributed in the encapsulation layer 105. The second heat conductive particles are evenly dispersed in the encapsulation layer 105, which plays the role of flattening, reducing reflectivity and increasing the heat dissipation capacity of the light emitting element 103.

[0052] In one embodiment, the second thermally conductive particles include at least one of chromium (Cr), titanium (Ti), silver (Ag), graphene, and carbon black. In other words, the second thermally conductive particles can be one of the above materials or a combination of multiple materials.

[0053] In one embodiment, the material of the encapsulation layer 105 includes photoresist. Photoresist has good UV resistance, high adhesion strength, and is not easily decomposed at high temperatures, and can better protect the light-emitting element 103. In other embodiments, the material of the encapsulation layer 105 may also be, for example, epoxy resin. In short, the present application does not limit the material of the encapsulation layer 105.

[0054] In one embodiment, the color of the encapsulation layer 105 is black. Setting the color of the encapsulation layer 105 to black can avoid light crosstalk between adjacent light-emitting elements 103. Of course, in other embodiments, the color of the encapsulation layer 105 can also be other colors, for example, the encapsulation layer 105 is a transparent layer.

[0055] In one embodiment, the encapsulation layer 105 has a thickness ranging from 1 to 6 micrometers, for example, 1 micrometer, 3 micrometers, or 6 micrometers.

[0056] Continue reading Figure 3 The display panel 100 further includes a high-transmittance layer 106 , which is disposed on a side of the light-emitting element 103 away from the substrate 101 .

[0057] Specifically, the high-transmittance layer 106 can improve the light transmittance of the display panel 100, so that the display panel 100 has higher brightness and stronger color saturation. The high-transmittance layer 106 may include at least one of glass, plastic, and organic matter. The preparation process of the high-transmittance layer 106 may be, for example, IPJ (Inkjet Printing Technology, inkjet printing) and the like.

[0058] exist Figure 3 In the embodiment, the high-transmittance layer 106 is further disposed on the side of the encapsulation layer 105 away from the substrate 101. However, it should be noted that in other embodiments, the display panel 100 may include only one of the heat dissipation layer 104, the encapsulation layer 105 and the high-transmittance layer 106, or any two of them, or all three of them.

[0059] In one embodiment, the thickness of the high-transmittance layer 106 is in the range of 1 to 6 micrometers, for example, 1 micrometer, 3 micrometers or 6 micrometers. In other embodiments, the thickness of the high-transmittance layer 106 may also be in other ranges.

[0060] Continue reading Figure 3The display panel 100 further includes a passivation layer 107, which is arranged between the substrate 101 and the anisotropic conductive adhesive layer 102. The passivation layer 107 is provided with a via 1071, and the conductive particles 1072 in the anisotropic conductive adhesive layer 102 are located in the via 1071, and then the light-emitting element 103 is electrically connected to the substrate 101 through the conductive particles 102.

[0061] Specifically, the passivation layer 107 (PVL) is provided with vias 1071, and the conductive particles 1072 realize electrical connection between the light emitting element 103 and the substrate 101, while the passivation layer 107 can also prevent short circuits between adjacent light emitting elements 103. In addition, the passivation layer 107 has high hardness and wear resistance, which can protect the display panel 100 from being scratched.

[0062] It can be understood that electrode pins (not shown) are also provided on the substrate 101, and the electrode pins are used to realize signal transmission between the substrate 101 and other elements. In this embodiment, the light-emitting element 103 is electrically connected to the electrode pins on the substrate 101 through the conductive particles 1072, and finally the electrical connection between the substrate 101 and the light-emitting element 103 is realized.

[0063] Of course, in other implementations, the passivation layer 107 may not be provided.

[0064] See also Figure 4 In one embodiment, the display device 200 includes the display panel 100 as in any of the above embodiments. The display device 200 may be an electronic display device such as a mobile phone, a computer, or a television. Since the display device 200 includes the display panel 100 in any of the above embodiments, the display device 200 also has the beneficial effect of making the heat dissipation effect of the light-emitting element better, thereby improving its light-emitting effect and service life.

[0065] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, It is characterized in that include: substrate; An anisotropic conductive adhesive layer is arranged on one side of the substrate; A light emitting element is arranged on a side of the anisotropic conductive adhesive layer away from the substrate, so as to be electrically connected to the substrate through the anisotropic conductive adhesive layer; Among them, the anisotropic conductive adhesive layer includes a first sublayer and a second sublayer, the orthographic projection of the first sublayer on the substrate is covered by the orthographic projection of the light-emitting element on the substrate, the orthographic projection of the second sublayer on the substrate is located outside the orthographic projection of the first sublayer on the substrate, and the second sublayer is provided with at least one gap.

2. The display panel according to claim 1, It is characterized in that The notch is a missing portion on the second sub-layer; Preferably, the notch passes through the second sub-layer.

3. The display panel according to claim 1, It is characterized in that The gap is a gap formed relative to the first sub-layer after the thickness of the second sub-layer is reduced.

4. The display panel according to claim 1, It is characterized in that The display panel further comprises: A heat dissipation layer, at least arranged on a side of the light emitting element away from the substrate; Preferably, the heat dissipation layer extends along the surface of the light emitting element away from the substrate to the side wall of the light emitting element, and the heat dissipation layer contacts the surface of the light emitting element away from the substrate and the side wall of the light emitting element; Preferably, the material of the heat dissipation layer includes inorganic material; Preferably, the heat dissipation layer has a thickness ranging from 30 to 100 nm.

5. The display panel according to claim 4, It is characterized in that The heat dissipation layer has first heat-conducting particles distributed therein; Preferably, the first thermally conductive particles include porous silicon oxide.

6. The display panel according to claim 1, It is characterized in that The display panel further comprises: an encapsulation layer, located on a side of the anisotropic conductive adhesive layer away from the substrate, and an orthographic projection of the encapsulation layer on the substrate is distributed outside an orthographic projection of the light-emitting element on the substrate, and the encapsulation layer is in contact with a side wall of the light-emitting element, wherein second thermally conductive particles are distributed in the encapsulation layer; Preferably, the second thermally conductive particles include at least one of chromium, titanium, silver, graphene and carbon black.

7. The display panel according to claim 6, It is characterized in that The material of the encapsulation layer includes photoresist; Preferably, the color of the encapsulation layer is black; Preferably, the thickness of the encapsulation layer is in the range of 1 to 6 microns.

8. The display panel according to claim 1, It is characterized in that The display panel further comprises: A high-transmittance layer is disposed on a side of the light-emitting element away from the substrate; Preferably, the thickness of the high-transmittance layer is in the range of 1 to 6 microns.

9. The display panel according to claim 1, It is characterized in that The display panel further comprises: The passivation layer is arranged between the substrate and the anisotropic conductive adhesive layer. The passivation layer is provided with via holes. The conductive particles in the anisotropic conductive adhesive layer are located in the via holes. Then, the light emitting element is electrically connected to the substrate through the conductive particles.

10. A display device, It is characterized in that Comprising the display panel as claimed in any one of claims 1 to 9.

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