Heat dissipation device and communication equipment

Abstract

The invention discloses a heat dissipation device and communication equipment, and relates to the field of heat dissipation and communication. A heat dissipation device comprises a first heat dissipation assembly and a connecting pipeline. The first heat dissipation assembly comprises at least one first heat conduction piece, the first heat conduction piece is provided with a medium channel, and the connecting pipeline is communicated with the medium channel; the first heat conduction piece comprises a heat conduction face which is used for making contact with a device to be subjected to heat dissipation. The communication equipment comprises the heat dissipation device. The problem that the heat dissipation effect of a current heat dissipation mode is poor can be solved.

Description

Technical Field

[0001] The present application belongs to the field of heat dissipation and communication technology, and specifically relates to a heat dissipation device and communication equipment. Background Art

[0002] With the development of 5G, the domestic market has a great demand for 5G base station dedicated optical modules. The construction of big data centers will also drive the demand for optical modules. In data centers, optical modules are a key component, and their main function is photoelectric conversion, through which everything is connected. In order to ensure that network data can meet the requirements of faster speed and lower latency, optical modules, as the core components of optical communications, need to overcome the key problem of rapid heat dissipation.

[0003] In the related art, the double-layer optical module mainly relies on air cooling and heat conduction for heat dissipation. As the heat flux density of the optical module increases, the air cooling heat dissipation also reaches a bottleneck, which is prone to poor heat dissipation, thus affecting the operation of the optical module. In addition, excessively high temperatures will accelerate the life loss of the optical module components, thereby shortening the service life of the optical module and affecting the output rate of converting electrical signals into optical signals. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a heat dissipation device and a communication device, which can solve the problem of poor heat dissipation effect of the current heat dissipation method.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] The embodiment of the present application provides a heat dissipation device, comprising: a first heat dissipation component and a connecting pipeline;

[0007] The first heat dissipation component includes at least one first heat conducting member, the first heat conducting member is provided with a medium channel, and the connecting pipeline is connected to the medium channel;

[0008] The first heat-conducting member comprises a heat-conducting surface, and the heat-conducting surface is used for contacting the device to be cooled.

[0009] An embodiment of the present application also provides a communication device, including the above-mentioned heat dissipation device.

[0010] In the embodiment of the present application, a cooling medium can be introduced into at least one first heat-conducting member of the first heat dissipation assembly through a connecting pipeline, so that the cooling medium flows through the medium channel of the first heat-conducting member, and the heat-conducting surface of the first heat-conducting member is also in contact with the device to be dissipated. In this way, when the cooling medium flows in the medium channel, it will absorb the heat transferred from the device to be dissipated to the heat-conducting surface, so that the heat flows into the connecting pipeline or is discharged as the cooling medium flows out of the medium channel. Based on the above process, the heat dissipation effect of the device to be dissipated can be achieved to alleviate the problem of overheating caused by heat accumulation in the device to be dissipated, thereby reducing the loss of the life of the device to be dissipated due to excessive temperature, and to a certain extent, the service life of the device to be dissipated can be improved. In addition, the influence of excessive temperature on the working efficiency of the device to be dissipated can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 A schematic diagram of the structure of the heat dissipation device and the device to be cooled disclosed in the embodiment of the present application;

[0012] Figure 2 A first structural schematic diagram of a first heat dissipation assembly and a device to be dissipated disclosed in an embodiment of the present application;

[0013] Figure 3 A second structural schematic diagram of a first heat dissipation assembly and a device to be dissipated disclosed in an embodiment of the present application;

[0014] Figure 4 A schematic diagram of the structure of a heat dissipation device disclosed in an embodiment of the present application;

[0015] Figure 5 This is a schematic diagram of the structure of a squirrel cage disclosed in an embodiment of the present application;

[0016] Figure 6 It is a cross-sectional schematic diagram of the squirrel cage and two first heat conducting members disclosed in the embodiment of the present application;

[0017] Figure 7 This is a schematic diagram of the structure of the first water separator disclosed in the embodiment of the present application;

[0018] Figure 8 This is a schematic diagram of the structure of the first water collector disclosed in the embodiment of the present application;

[0019] Fig. 9 A schematic diagram of a heat dissipation process of a heat dissipation device disclosed in an embodiment of the present application;

[0020] Fig.10 A schematic diagram of the structure of another heat dissipation device and a device to be cooled disclosed in an embodiment of the present application;

[0021] Fig.11 This is a schematic diagram of the structure of the second water separator disclosed in the embodiment of the present application;

[0022] Fig.12 This is a schematic diagram of the structure of the second water collector disclosed in the embodiment of the present application;

[0023] Fig.13 A schematic diagram of the heat dissipation process of another heat dissipation device disclosed in an embodiment of the present application.

[0024] Description of reference numerals:

[0025] 100 - first heat dissipation component; 110 - first heat conducting member; 111 - medium channel; 112 - heat conducting surface; 113 - boss structure; 114 - supporting structure; 120 - first accommodation space;

[0026] 200-connecting pipeline; 210-input main road; 220-output main road; 230-first input branch; 240-first output branch; 250-second input branch; 260-second output branch;

[0027] 300 - second heat dissipation component; 310 - second heat conducting member;

[0028] 400- heat dissipation device; 410- cage; 411- first mounting portion; 412- second mounting portion; 413- connection portion; 414- second accommodation space; 415- avoidance hole; 416- spring structure; 420- optical module;

[0029] 500 - water distributor; 510 - first housing; 511 - first inlet; 512 - first outlet; 520 - first quick-connect connector;

[0030] 600 - water collector; 610 - second shell; 611 - second inlet; 612 - second outlet; 620 - second quick-connect connector. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0033] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0034] refer to Figures 1 to 13 The embodiment of the present application discloses a heat dissipation device for dissipating heat from a device to be dissipated 400, wherein the device to be dissipated 400 may be a photoelectric conversion device, and the photoelectric conversion device includes an optical module 420, etc. Of course, the device to be dissipated 400 may also be other types of devices, which are not specifically limited. The disclosed heat dissipation device includes a first heat dissipation component 100 and a connecting pipe 200.

[0035] The first heat dissipation component 100 plays a role in heat dissipation and is used to dissipate heat from the device to be dissipated 400; the connecting pipe 200 is used to transmit the cooling medium so that the cooling medium can be input into and output from the first heat dissipation component 100. For example, the first heat dissipation component 100 can be connected to the connecting pipe 200, and the high-temperature cooling medium can be input into the first heat dissipation component 100 through the connecting pipe 200, and the low-temperature cooling medium after heat exchange can be output from the first heat dissipation component 100, so as to take away the heat absorbed by the first heat dissipation component 100 from the device to be dissipated 400 through the cooling medium.

[0036] In the embodiment of the present application, the cooling medium can be a fluorinated liquid, deionized water, an alcohol-based solution, and of course other media with cooling function can also be used, which is not specifically limited here. In addition, the connecting pipe 200 can be a plastic hose, a rubber hose, a stainless steel bellows, etc., and of course other forms can also be used, which are not specifically limited here.

[0037] The first heat dissipation component 100 includes at least one first heat conductive member 110. When the number of devices 400 to be cooled is small or the heat generated is relatively small, the number of the first heat conductive member 110 can be one, and at this time, the heat dissipation requirements of the devices 400 to be cooled can be met by one first heat conductive member 110; when the number of devices 400 to be cooled is large or the heat generated is relatively large, the number of the first heat conductive member 110 can be two, three, four or more, so that the contact area between the first heat conductive member 110 and the devices 400 to be cooled can be increased, thereby improving the heat dissipation efficiency.

[0038] To achieve good contact between the first heat conductor 110 and the heat dissipation device 400 to ensure good heat transfer, the first heat conductor 110 may include a heat conductive surface 112 for contacting the heat dissipation device 400 to be cooled. Thus, the heat dissipated from the heat dissipation device 400 can be absorbed by the heat conductive surface 112.

[0039] In some embodiments, the first heat conductor 110 may include a heat conducting surface 112. In this case, one side of the device 400 to be cooled can be in contact with the heat conducting surface 112, so that the heat on the device 400 to be cooled is transferred to the first heat conductor 110 via the heat conducting surface 112. In addition, when the volume of the device 400 to be cooled is small, the area in contact with the heat conducting surface 112 is also small. In this case, multiple devices 400 to be cooled can be in contact with the same heat conducting surface 112, that is, multiple devices 400 to be cooled share one first heat conductor 110. In this way, a good heat dissipation effect can be ensured, and the number of first heat conductors 110 can be reduced, thereby reducing costs while ensuring the heat dissipation effect.

[0040] In other embodiments, the first heat-conducting member 110 may include multiple heat-conducting surfaces 112. The multiple heat-conducting surfaces 112 may be distributed according to actual working conditions, and specifically may include: a preset angle may be formed between two adjacent heat-conducting surfaces 112, and this distribution form may be applicable to multiple heat-dissipating devices 400 distributed at an angle; or, two of the multiple heat-conducting surfaces 112 may be arranged back to back, and this distribution form may be applicable to multiple heat-dissipating devices 400 arranged at intervals; of course, other distribution forms may also be possible, as long as they can be applicable to the distribution form of the heat-dissipating devices 400.

[0041] In order to enable the cooling medium to flow through the first heat conductive member 110, in the embodiment of the present application, the first heat conductive member 110 may be provided with a medium channel 111, which is connected to the connecting pipeline 200. In this way, the cooling medium transported by the connecting pipeline 200 can flow into the medium channel 111, absorb the heat transferred to the first heat conductive member 110 by the heat dissipation device 400, and allow the heat to flow back to the connecting pipeline 200 again as the cooling medium flows out of the medium channel 111, or is directly discharged to the outside, thereby achieving a heat dissipation effect on the heat dissipation device 400.

[0042] Exemplarily, the medium channel 111 can be located inside the first heat conductor 110, that is, when the first heat conductor 110 is manufactured, the medium channel 111 is formed at the same time. This method can improve the manufacturing efficiency of the first heat conductor 110 and ensure the sealing of the medium channel 111; alternatively, the first heat conductor 110 is manufactured first, and then the medium channel 111 is formed inside the first heat conductor 110 by machining; of course, it is also possible that after the first heat conductor 110 is manufactured, an additional medium channel 111 is provided on the outside of the first heat conductor 110.

[0043] In some embodiments, the first heat conducting member 110 may be a plate, such as a long strip plate, a square plate, a round plate, etc., and the specific shape may be set according to actual needs. The medium channel 111 may be provided at both ends of the plate, one end for inputting the cooling medium, and the other end for outputting the cooling medium; in addition, the medium channel 111 may also be distributed in the entire coverage area or a partial coverage area of ​​the plate, which may increase the contact area between the cooling medium and the plate, thereby improving the heat dissipation efficiency.

[0044] Optionally, the medium channel 111 can be a straight channel to facilitate the smooth flow of the cooling medium; the medium channel 111 can also be a serpentine channel, a spiral channel, etc., to increase the cooling area; of course, it can also be other shapes, and the specific shape can be set according to actual needs.

[0045] In the embodiment of the present application, a cooling medium can be introduced into at least one first heat-conducting component 110 of the first heat dissipation component 100 through the connecting pipeline 200, so that the cooling medium flows through the medium channel 111 of the first heat-conducting component 110, and the heat-conducting surface 112 of the first heat-conducting component 110 is also in contact with the device to be cooled 400. In this way, when the cooling medium flows in the medium channel 111, the heat of the device to be cooled 400 is transferred to the heat-conducting surface 112 for absorption, so that the heat flows into the connecting pipeline 200 or is discharged externally as the cooling medium flows out of the medium channel 111.

[0046] Based on the above process, the heat dissipation effect of the heat dissipation device 400 can be achieved to alleviate the problem of overheating caused by heat accumulation in the heat dissipation device 400, thereby reducing the loss of the life of the heat dissipation device 400 due to excessive temperature, and to a certain extent, the service life of the heat dissipation device 400 can be improved. In addition, the influence of excessive temperature on the working efficiency of the heat dissipation device 400 can also be reduced.

[0047] In some embodiments, the first heat dissipation assembly 100 may include multiple first heat conductive members 110, each of which may contact at least one device 400 to be cooled, thereby achieving simultaneous heat dissipation of multiple devices 400 to be cooled to improve heat dissipation efficiency.

[0048] A plurality of first heat conducting members 110 may be stacked. For example, the first heat conducting member 110 may be a plate, in which case, the plurality of first heat conducting members 110 may be stacked along their respective thickness directions.

[0049] A first accommodation space 120 is formed between two adjacent first heat conducting members 110, that is, two adjacent first heat conducting members 110 are spaced a certain distance apart from each other, so that the heat dissipation device 400 can be accommodated in the first accommodation space 120. It should be noted here that each heat dissipation device 400 can be located in the first accommodation space 120 as a whole, and of course, each heat dissipation device 400 can also be located partially in the first accommodation space 120.

[0050] Furthermore, the heat conducting surface 112 is arranged toward the first accommodating space 120, and is used to contact the heat dissipation device 400 in the first accommodating space 120. Based on the above arrangement, the heat generated by the heat dissipation device 400 in the first accommodating space 120 during operation can be transferred to the heat conducting surface 112 in contact therewith, and the heat is taken away by the cooling medium in the medium channel 111 of the first heat conducting member 110, thereby achieving a heat dissipation effect on the heat dissipation device 400.

[0051] In some embodiments, the heat dissipation device 400 may include a cage 410 and a plurality of optical modules 420, wherein the cage 410 may include a plurality of installation portions for installing the optical modules 420 and arranged at intervals, and a connecting portion 413 connecting the plurality of installation portions, two adjacent installation portions and the connecting portion 413 enclose a second accommodation space 414, and at least a portion of each optical module 420 extends into the interior of the corresponding installation portion. Through this arrangement, the plurality of optical modules 420 may be installed respectively through the plurality of installation portions to ensure the installation stability of each optical module 420.

[0052] Furthermore, since the first heat dissipation assembly 100 includes a plurality of stacked first heat conductive members 110 , each of the plurality of first heat conductive members 110 can pass through the corresponding second accommodation space 414 , and the optical module 420 is also in contact with the heat conductive surface 112 of the corresponding first heat conductive member 110 .

[0053] Based on the above configuration, the plurality of first heat-conducting members 110 can respectively conduct heat to the corresponding optical modules 420 , so as to achieve a heat dissipation effect for each optical module 420 .

[0054] Exemplarily, multiple mounting parts can be arranged in parallel, and the connecting part 413 is connected to the same end of the multiple connecting parts 413. In addition, the multiple mounting parts and the connecting part 413 can also be arranged in one piece to ensure the overall strength of the cage 410; of course, the multiple mounting parts and the connecting part 413 can also adopt a split structure and be connected by assembly and fixing.

[0055] To install the optical module 420 , each installation portion may be provided with a slot structure, and at least a portion of the optical module 420 extends into the slot structure and is snapped to ensure that the optical module 420 can be securely installed in the cage 410 .

[0056] In addition, the heat conducting surface 112 of the first heat conducting member 110 in each second accommodation space 414 may contact the optical module 420 on at least one side of the first heat conducting member 110 , so as to provide a better heat dissipation effect for the optical module 420 .

[0057] refer to Figure 2 and Figure 3 The first heat dissipation component 100 may include two first heat conductive members 110 stacked and spaced apart from each other, and a first accommodating space 120 is formed between the two first heat conductive members 110. The first accommodating space 120 may accommodate a first layer of devices 400 to be dissipated. The first layer of devices 400 to be dissipated may include at least one device 400 to be dissipated, and one side surface of the first layer of devices 400 to be dissipated is in contact with a heat conducting surface 112 of one of the first heat conductive members 110, so that the heat dissipation effect of the first layer of devices 400 to be dissipated can be achieved through one of the first heat conductive members 110.

[0058] Furthermore, the heat-conducting surface 112 of another first heat-conducting member 110 can face another first accommodating space 120 and away from the above-mentioned first accommodating space 120, and one side surface of the second-layer device 400 to be cooled is in contact with the heat-conducting surface 112 of another first heat-conducting member 110, so that the heat dissipation effect of the second-layer device 400 to be cooled can be achieved through another first heat-conducting member 110.

[0059] It should be noted here that the first heat dissipation component 100 can be arranged on a PCB board or a tray. In this case, another first heat conductive member 110 is also stacked and spaced apart with the PCB board or the tray to form a first accommodating space 120, and the second layer of heat dissipation device 400 is located in the first accommodating space 120 to dissipate heat through another first heat conductive member 110.

[0060] In other embodiments, the heat-conducting surfaces 112 of the two first heat-conducting members 110 can be arranged relative to each other, that is, the two heat-conducting surfaces 112 are arranged facing the same first accommodating space 120. In this case, the opposite sides of the first layer of heat-dissipating devices 400 can respectively contact the heat-conducting surfaces 112 of the two first heat-conducting members 110, so as to dissipate heat for the first layer of heat-dissipating devices 400 at the same time through the two first heat-conducting members 110.

[0061] In addition, the first heat conductive member 110 may further include two heat conductive surfaces 112 disposed opposite to each other. In this case, the two layers of components 400 to be cooled may be respectively located on opposite sides of the first heat conductive member 110 and respectively contact the two heat conductive surfaces 112, so that the two layers of components 400 to be cooled may be cooled by the same first heat conductive member 110.

[0062] In other embodiments, the heat-conducting surfaces 112 of the two first heat-conducting members 110 are arranged opposite to each other, that is, the two heat-conducting surfaces 112 are arranged facing the same first accommodating space 120. At this time, the first layer of devices to be cooled 400 and the second layer of devices to be cooled 400 are stacked in the same first accommodating space 120, and the first layer of devices to be cooled 400 are in contact with the heat-conducting surface 112 of one of the first heat-conducting members 110, and the second layer of devices to be cooled 400 are in contact with the heat-conducting surface 112 of the other first heat-conducting member 110, so that the two layers of devices to be cooled 400 are cooled by the two first heat-conducting members 110 respectively.

[0063] In addition to the above, the first heat dissipation component 100 may also include more first heat conducting members 110 stacked and spaced apart from each other, such as three, four, five, etc. Correspondingly, a first accommodating space 120 is formed between each two adjacent first heat conducting members 110. In addition, a first heat conducting member 110 located at the edge may be connected to a PCB board or a tray, and a first accommodating space 120 may also be formed, so as to accommodate at least one layer of devices 400 to be dissipated through each first accommodating space 120, and each layer of devices 400 to be dissipated may be in contact with the heat conducting surface 112 of the corresponding first heat conducting member 110. It should be noted here that the form of contact between the devices 400 to be dissipated and the heat conducting surface 112 of the first heat conducting member 110 may refer to the above-mentioned two first heat conducting members 110, and will not be repeated here.

[0064] In addition, when there is only one first heat-conducting member 110, it can include a heat-conducting surface 112, which can dissipate heat for a layer of devices 400 to be cooled; of course, the first heat-conducting member 110 can also include two heat-conducting surfaces 112 arranged back to back, which can dissipate heat for two layers of devices 400 to be cooled arranged at intervals at the same time.

[0065] In the embodiment of the present application, the heat dissipation device 400 may include a cage 410 and an optical module 420, such as Figure 4 and Figure 5 The cage 410 includes a first mounting portion 411 and a second mounting portion 412 for mounting the optical module 420, and a connecting portion 413. The first mounting portion 411 and the second mounting portion 412 are spaced apart and connected by the connecting portion 413. Thus, the first mounting portion 411, the second mounting portion 412 and the connecting portion 413 together enclose a second accommodating space 414.

[0066] For example, the first mounting portion 411 and the second mounting portion 412 can be arranged in parallel, and the connecting portion 413 is connected to one end of the first mounting portion 411 and the same end of the second mounting portion 412, so that the first mounting portion 411, the connecting portion 413 and the second mounting portion 412 can form a U-shaped structure, and the space enclosed inside the U-shaped structure is the second accommodation space 414. Of course, the cage 410 can also be in other shapes, which are not specifically limited here.

[0067] Among them, the first mounting portion 411, the second mounting portion 412 and the connecting portion 413 can also be an integrated structure to ensure the overall strength and stability of the cage 410; of course, the first mounting portion 411, the second mounting portion 412 and the connecting portion 413 can also be a separate structure, and the cage 410 is formed by assembly, fixing, etc.

[0068] The optical module 420 is correspondingly mounted to the first mounting portion 411 and the second mounting portion 412. Exemplarily, the first mounting portion 411 and the second mounting portion 412 may be respectively provided with a slot structure, and at least part of the optical module 420 is mounted to the slot structure to ensure the stability and firmness of the installation between the optical module 420 and the cage 410. The slot structure may be provided with a plurality of elastic strip structures, and the plurality of elastic strip structures may be elastically squeezed on the side wall of the optical module 420 to prevent the optical module 420 from escaping from the cage 410.

[0069] In addition, the first mounting portion 411 may include one or more slot structures, and the second mounting portion 412 may include one or more slot structures, so that the first mounting portion 411 and the second mounting portion 412 may respectively install at least one optical module 420 .

[0070] The first heat dissipation assembly 100 may include two stacked first heat conducting members 110 , wherein one of the first heat conducting members 110 is disposed through the second accommodation space 414 , so that the first mounting portion 411 and the second mounting portion 412 are respectively located on opposite sides of one of the first heat conducting members 110 .

[0071] In order to achieve the contact between the first heat-conducting member 110 and the corresponding optical module 420, at least part of the optical module 420 can extend into the interior of the cage 410, and the optical module 420 installed on the first mounting portion 411 is in contact with the heat-conducting surface 112 of one of the first heat-conducting members 110, while the optical module 420 installed on the second mounting portion 412 is in contact with the heat-conducting surface 112 of the other first heat-conducting member 110. Based on this arrangement, the optical modules 420 respectively installed on the first mounting portion 411 and the second mounting portion 412 can be cooled by the two first heat-conducting members 110.

[0072] In a more specific embodiment, two first heat-conducting members 110 can be arranged at intervals in the up-down direction to form an upper first accommodation space 120, and the lower first heat-conducting member 110 is connected to a PCB board or a tray to form a lower first accommodation space 120, the first mounting portion 411 and the optical module 420 mounted thereon are located in the upper first accommodation space 120, and the optical module 420 contacts the heat-conducting surface 112 (i.e., the lower surface) of the upper first heat-conducting member 110 for heat transfer; the second mounting portion 412 and the optical module 420 mounted thereon are located in the lower first accommodation space 120, and the optical module 420 contacts the heat-conducting surface 112 (i.e., the lower surface) of the lower first heat-conducting member 110 for heat transfer. This contact method allows the two first heat-conducting members 110 to contact the two layers of optical modules 420 respectively, so as to increase the heat transfer area and thus improve the heat dissipation efficiency.

[0073] In other embodiments, the first mounting portion 411 and the optical module 420 mounted thereon are located in the upper first accommodation space 120, and the optical module 420 contacts the heat-conducting surface 112 (i.e., the upper surface) of the lower first heat-conducting member 110 for heat transfer; the second mounting portion 412 and the optical module 420 mounted thereon are located in the lower first accommodation space 120, and the optical module 420 contacts the heat-conducting surface 112 (i.e., the lower surface) of the lower first heat-conducting member 110 for heat transfer, so that the heat-conducting surfaces 112 on opposite sides of the same first heat-conducting member 110 can contact the two layers of optical modules 420 respectively, so as to facilitate simultaneous heat transfer. This contact method can achieve simultaneous heat dissipation of more heat-dissipating devices 400.

[0074] In order to facilitate the first heat conducting member 110 to contact the corresponding heat dissipation device 400, the first heat conducting member 110 may be provided with a boss structure 113, such as Figure 6As shown, the boss structure 113 is located on the heat conducting surface 112 and protrudes from the heat conducting surface 112, and is used to contact the heat dissipation device 400. By providing the boss structure 113, the distance between the first heat conducting member 110 and the heat dissipation device 400 can be shortened, so that the first heat conducting member 110 and the heat dissipation device 400 can be more easily contacted and the contact quality can be improved.

[0075] Exemplarily, the heat-conducting surface 112 of each first heat-conducting member 110 can contact multiple heat-dissipating devices 400, so that the heat-conducting surface 112 of each first heat-conducting member 110 can be provided with multiple boss structures 113, and the multiple boss structures 113 are arranged on the heat-conducting surface 112 according to preset rules, such as a straight line form, a ring arrangement form, a polygonal array form, etc., to meet the contact requirements in various situations.

[0076] In some embodiments, the heat dissipation device 400 may include a matching cage 410 and an optical module 420, and the optical module 420 at least partially extends into the cage 410. For details, please refer to the above-mentioned content on the relationship between the cage 410 and the optical module 420, which will not be repeated here.

[0077] Considering that in some cases, the cage 410 blocks part of the optical film block, making it difficult for the heat-conducting surface 112 of the first heat-conducting member 110 to contact the optical module 420. Based on this situation, in the embodiment of the present application, the cage 410 can be provided with a position avoidance hole 415 on the side facing the heat-conducting surface 112, such as Figure 4 and Figure 5 As shown, the boss structure 113 extends from the avoidance hole 415 to the interior of the squirrel cage 410 and contacts the optical module 420. In this way, good contact between the first heat conductor 110 and the optical module 420 can be ensured, so that a good heat dissipation effect of the optical module 420 can be achieved through the first heat conductor 110; at the same time, through the cooperation between the boss structure 113 and the avoidance hole 415, a limiting effect can be played on the heat dissipation device 400 to be cooled, so as to prevent the heat dissipation device 400 from being separated from the first heat dissipation component 100.

[0078] In order to improve the contact between the boss structure 113 and the optical module 420, the cage 410 may be provided with a spring structure 416, such as Figure 6 As shown, the spring structure 416 is disposed on the side wall of the cage 410 opposite to the avoidance hole 415. Based on this, when the light module 420 is installed in the cage 410, the spring structure 416 can exert elastic force on the light module 420, so that the light module 420 has a movement tendency to move toward the boss structure 113, thereby ensuring that the light module 420 is in good contact with the boss structure 113, thereby ensuring a good heat dissipation effect.

[0079] In other embodiments, the spring structure 416 may be replaced by other elastic structures, and the specific form is not limited, as long as it can apply elastic force to the optical module 420 toward the boss structure 113 .

[0080] Considering that the heat conducting surface 112 of the first heat conducting member 110 needs to contact the heat dissipating device 400, in order to form a space for accommodating the heat dissipating device 400 on the side where the heat conducting surface 112 is located, in the embodiment of the present application, the first heat conducting member 110 may be provided with a supporting structure 114, such as Figure 6 As shown, the support structure 114 extends from the heat conducting surface 112 toward a direction away from the heat conducting surface 112 . With this arrangement, the support structure 114 and the heat conducting surface 112 can be used to enclose a space for accommodating the device 400 to be cooled.

[0081] Under actual working conditions, the first heat dissipation component 100 can be connected to a PCB board or a tray. At this time, the support structure 114 of the first heat conductor 110 located at the bottom is supported on the PCB board or the tray. In this way, the support structure 114, the heat conductive surface 112 and the surface of the PCB board or the tray together form a first accommodating space 120, and the heat dissipation device 400 can be placed in the first accommodating space 120 and contact the heat conductive surface 112.

[0082] When the first heat dissipation component 100 includes multiple first heat conductive members 110, two adjacent first heat conductive members 110 can also be supported by the support structure 114. Specifically, among the two adjacent first heat conductive members 110, the support structure 114 of one first heat conductive member 110 is supported on the surface of the other first heat conductive member 110 that is away from its own support structure 114, thereby effectively preventing the two adjacent first heat conductive members 110 from squeezing the device 400 to be cooled located therebetween, thereby ensuring that the device 400 to be cooled will not be damaged due to squeezing.

[0083] To ensure that two adjacent first heat-conducting members 110 do not move relative to each other, the two can be directly connected via a support structure 114. Specifically, the support structure 114 of one can be fixedly connected to the other, such as by welding, bonding, riveting, etc., to ensure the firmness and stability of the connection. Alternatively, the support structure 114 of one can be detachably connected to the other to facilitate disassembly and assembly, and to facilitate the placement of the heat dissipation device 400.

[0084] In other embodiments, additional fasteners may be provided, including fastening pins, fastening screws, fastening bolts, etc. In this case, two adjacent first heat conducting members 110 are supported by a supporting structure 114, and the two adjacent first heat conducting members 110 are fastened and connected by fasteners, thereby ensuring the firmness and stability between the two and preventing arbitrary movement.

[0085] Exemplarily, the areas of the heat-conducting surface 112 located at both ends of the first heat-conducting component 110 are respectively provided with support structures 114 to support the first heat-conducting component 110 at both ends; of course, the support structures 114 can also be distributed in other areas of the heat-conducting surface 112, as long as they can play a supporting role and do not hinder the accommodation of the heat-dissipating device 400.

[0086] In the embodiment of the present application, the support structure 114 may extend along the edge of the first heat conducting member 110 , and both ends of the support structure 114 in the extension direction may be aligned with the edge of the first heat conducting member 110 .

[0087] In addition, the support structure 114 and the first heat-conducting member 110 can be integrally arranged, that is, the support structure 114 is formed together during the process of manufacturing the first heat-conducting member 110. This method can improve the strength of the entire first heat-conducting member 110 and shorten the manufacturing cycle. Of course, the support structure 114 can also be connected to the first heat-conducting member 110, such as by welding, bonding, riveting, etc. This method can reduce the difficulty of manufacturing.

[0088] In some embodiments, the support structure 114 may be a solid structure, which mainly plays a supporting role; in other embodiments, the support structure 114 may also be a hollow structure, and the hollow inner cavity of the hollow structure may be used as a medium channel 111 to facilitate the transmission of cooling medium and achieve heat dissipation of the first heat conducting member 110. With this arrangement, the first heat conducting member 110 does not need to be additionally provided with a medium channel 111, thereby reducing the difficulty of manufacturing the first heat conducting member 110, and to a certain extent, the strength of the first heat conducting member 110 may also be improved.

[0089] In the embodiment of the present application, the device 400 to be cooled may include multiple parts, the first cooling component 100 may cool a part of the part, and the other parts may be cooled by the second cooling component 300. The device 400 to be cooled may include an optical module 420 to be cooled, and may also include a chip to be cooled. The first cooling component 100 may mainly cool the optical module 420, and in order to cool the chip, the cooling device may also include a second cooling component 300, such as Figure 1 shown.

[0090] The second heat dissipation component 300 is connected to the connecting pipe 200 so that a cooling medium is transported to the second heat dissipation component 300 through the connecting pipe 200 , thereby transferring the heat absorbed by the second heat dissipation component 300 away through the cooling medium to achieve a heat dissipation effect.

[0091] To ensure sufficient cooling capacity, the second heat dissipation component 300 and the first heat dissipation component 100 can be connected in parallel in the connecting pipe 200. In this way, the cooling medium of the same temperature can be transported to the first heat dissipation component 100 and the second heat dissipation component 300 respectively through the connecting pipe 200, thereby ensuring that the second heat dissipation component 300 can also have sufficient cooling capacity to achieve the heat dissipation effect on the chip.

[0092] In order to distribute the cooling medium in the connecting pipe 200 to the first heat dissipation component 100 and the second heat dissipation component 300, the heat dissipation device may further include a water separator 500, through which the cooling medium may be divided into a plurality of branch paths, such as two branch paths, so as to respectively transport the cooling medium to the first heat dissipation component 100 and the second heat dissipation component 300. It should be noted here that the working principle of the water separator 500 may refer to the relevant technology and will not be elaborated here.

[0093] The cooling medium after heat exchange between the first heat dissipation component 100 and the second heat dissipation component 300 can also be transported away through the connecting pipe 200. In this way, the heat dissipation device can also include a water collector 600. Figure 1 As shown, the cooling medium after heat exchange outputted by the first heat dissipation assembly 100 and the second heat dissipation assembly 300 can be collected together through the water collector 600, and returned to the connecting pipe 200 again, and transported away through the connecting pipe 200. It should be noted here that the working principle of the water collector 600 can refer to the relevant technology, which will not be elaborated here.

[0094] refer to Figure 1 The connecting pipeline 200 may include an input main line 210, an output main line 220, a first input branch 230, a first output branch 240, a second input branch 250 and a second output branch 260, wherein the input main line 210 is connected to the water divider 500, the first input branch 230 connects the water divider 500 and the first heat dissipation component 100, the first output branch 240 connects the first heat dissipation component 100 and the water collector 600, the second input branch 250 connects the water divider 500 and the second heat dissipation component 300, the second output branch 260 connects the second heat dissipation component 300 and the water collector 600, and the output main line 220 is connected to the water collector 600.

[0095] Based on the above configuration, the cooling medium flows into the water divider 500 via the input main path 210, and the water divider 500 divides the cooling medium into at least two streams, one of which flows into the first heat dissipation component 100 via the first input branch 230, performs heat exchange in the first heat dissipation component 100, flows into the first output branch 240 after heat exchange, and flows into the water collector 600 via the first output branch 240; the other cooling medium flows into the second heat dissipation component 300 via the second input branch 250, performs heat exchange in the second heat dissipation component 300, flows into the second output branch 260 after heat exchange, and flows into the water collector 600 via the second output branch 260; of course, other cooling medium can also flow into other structures that need heat dissipation. At least two cooling media after heat exchange are collected in the water collector 600, and finally flow into the output main path 220, and are transported away by the output main path 220.

[0096] The embodiment of the present application realizes the segmentation of the cooling medium, so that multiple structures that need heat dissipation can be cooled at the same time, and the cooling medium can also be collected for easy transmission.

[0097] Of course, in other embodiments, the cooling medium can be directly transmitted by connecting multiple branches directly to the main line, and the water distributor 500 and the water collector 600 can be omitted. This method can also simultaneously transmit the cooling medium to multiple structures that need heat dissipation to achieve synchronous heat dissipation.

[0098] The present application also provides another implementation method, such as Fig.10 As shown, the heat dissipation device includes a second heat dissipation component 300, which is connected to the connecting pipe 200, and the second heat dissipation component 300 is connected in parallel with a part of the first heat conductive member 110 of the first heat dissipation component 100, and in series with another part of the first heat conductive member 110.

[0099] It should be noted here that the first heat dissipation component 100 may include a plurality of first heat conductive members 110, wherein a portion of the first heat conductive members 110 is connected in parallel with the second heat dissipation component 300, and the parallel portion is connected in series with another portion of the first heat conductive members 110. Exemplarily, the first heat dissipation component 100 may include two stacked first heat conductive members 110, in which case one of the first heat conductive members 110 is connected in parallel with the second heat dissipation component, and the parallel portion is connected in series with the other first heat conductive member 110; of course, the first heat dissipation component 100 may also include other numbers of first heat conductive members 110, and the number of first heat conductive members 110 connected in series with the second heat dissipation component 300 may be allocated according to actual working conditions.

[0100] In this embodiment, the heat dissipation component may also include a water divider 500 and a water collector 600, and the connecting pipeline 200 includes an input main circuit 210, an output main circuit 220, a first input branch 230, a first output branch 240, a second input branch 250 and a second output branch 260, wherein the input main circuit 210 is respectively connected to the water divider 500 and another part of the first heat conductor 110, the first input branch 230 connects the water divider 500 and one part of the first heat conductor 110, the first output branch 240 connects one part of the first heat conductor 110 and the water collector 600, the second input branch 250 connects the water divider 500 and the second heat dissipation component 300, the second output branch 260 connects the second heat dissipation component 300 and the water collector 600, and the output branch is respectively connected to the water collector 600 and another part of the first heat conductor 110.

[0101] Based on the above configuration, the cooling medium flows into the water divider 500 and another part of the first heat conducting member 110 respectively via the input main path 210, so that one cooling medium directly flows into another part of the first heat conducting member 110, performs heat exchange in the other part of the first heat conducting member 110, flows into the output main path 220 after heat exchange, and is transported away via the output main path 220; another cooling medium flows into the water divider 500, and the water divider 500 divides the cooling medium into at least two streams, and the first cooling medium flows into one of the first input branches 230 via the first input branch 230. The first heat conducting member 110 is divided into two parts, and heat exchange is performed in one part of the first heat conducting member 110, and then flows into the first output branch 240 after heat exchange, and then flows into the manifold 600 through the first output branch 240; the second cooling medium flows into the second heat dissipation component 300 through the second input branch 250, and then heat exchange is performed in the second heat dissipation component 300, and then flows into the second output branch 260 after heat exchange, and then flows into the manifold 600 through the second output branch 260; of course, other cooling mediums can also flow into other structures that need heat dissipation. At least two cooling media after heat exchange are collected in the manifold 600, and finally flow into the output main path 220, and then are transported away by the output main path 220.

[0102] Exemplarily, the medium channel 111 of the other part of the first heat-conducting member 110 can be directly arranged on the input main path 210 and the output main path 220, and the end of the input main path 210 is connected to the water distributor 500, and the end of the output main path 220 is connected to the water collector 600. Through this arrangement, a part of the cooling medium can flow directly into the other part of the first heat-conducting member 110, so that it can be ensured that the cooling medium has a sufficiently large flow rate to ensure a better heat dissipation effect for the other part of the first heat-conducting member 110. It should be noted here that in some cases, the other part of the first heat-conducting member 110 absorbs relatively more heat, and directly connecting it to the input main path 210 and the output main path 220 can ensure that it has sufficient cooling capacity.

[0103] Considering that the heat dissipation device 400 may include more structures that need to dissipate heat, such as multiple optical modules 420 and multiple chips, the second heat dissipation assembly 300 in the embodiment of the present application may include multiple second heat conducting members 310, and the multiple second heat conducting members 310 are arranged in series and / or in parallel in the connecting pipeline 200, such as Figure 1 and Fig.10 shown.

[0104] Specifically, the second heat dissipation component 300 may include two heat dissipation paths respectively connected between the water divider 500 and the water collector 600, each heat dissipation path is provided with at least one second heat conductive member 310, and each second heat conductive member 310 may be in contact with a corresponding chip, so that multiple chips can be cooled at the same time.

[0105] Exemplarily, the second heat conducting member 310 may be a heat conducting seat, a heat conducting block or a heat conducting plate, etc., and the specific shape is not limited as long as it can maintain good contact with the chip.

[0106] For easy disassembly and assembly, the water separator 500 may include a first housing 510 and a first quick-connect connector 520. Figure 7 and Fig.11 As described above, the first shell 510 is provided with a first inlet 511 and a first outlet 512. The first inlet 511 is used to communicate with the input main path 210 to transport the cooling medium to the water distributor 500 through the input main path 210, and the first outlet 512 is used to communicate with the first input branch 230 or the second input branch 250 to output the cooling medium. Exemplarily, the first shell 510 may be provided with a plurality of first outlets 512 so as to be respectively connected with the first input branch 230 and the second input branch 250.

[0107] In order to connect the input main line 210 to the first inlet 511, in the embodiment of the present application, the first quick-connect connector 520 is connected to the first inlet 511, and the input main line 210 can be detachably connected to the first quick-connect connector 520, so that it is convenient to disassemble and assemble the water divider 500 and the input main line 210, which is convenient for replacement or maintenance. Similarly, the first quick-connect connector 520 can also be connected to the first outlet 512, and the first input branch 230 or the second input branch 250 can be detachably connected to the first quick-connect connector 520, so as to facilitate the disassembly and assembly of the water divider 500 and the first input branch 230 or the second input branch 250, which is convenient for replacement or maintenance. It should be noted here that the number of the first quick-connect connectors 520 is equal to the sum of the number of the first inlet 511 and the number of the first outlet 512, so as to ensure that each port can be detachably connected to the pipeline.

[0108] For easy disassembly and assembly, the water collector 600 may include a second housing 610 and a second quick-connect connector 620. Figure 8 and Fig.12 As shown, the second housing 610 is provided with a second inlet 611 and a second outlet 612. The second inlet 611 is used to communicate with the first output branch 240 or the second output branch 260 to receive the cooling medium, and the second outlet 612 is communicated with the output main path 220 to output the cooling medium. Exemplarily, the second housing 610 may be provided with a plurality of second inlets 611 so as to be respectively communicated with the first output branch 240 and the second output branch 260.

[0109] In order to connect the output main line 220 to the second outlet 612, in an embodiment of the present application, the second quick-connect connector 620 is connected to the second outlet 612, and the output main line 220 can be detachably connected to the second quick-connect connector 620, so that it is convenient to disassemble and assemble the water collector 600 and the output main line 220, which is convenient for replacement or maintenance. Similarly, the second quick-connect connector 620 can also be connected to the second inlet 611, and the first output branch 240 or the second output branch 260 can be detachably connected to the second quick-connect connector 620, so as to facilitate the disassembly and assembly of the water distributor 500 and the first output branch 240 or the second output branch 260, which is convenient for replacement or maintenance. It should be noted here that the number of second quick-connect connectors 620 is equal to the sum of the number of second inlets 611 and the number of second outlets 612, so as to ensure that each port can be detachably connected to the pipeline.

[0110] Exemplarily, the water distributor 500 can adopt a one-to-two form, a one-to-three form, a one-to-four form, etc., which can be selected according to actual working conditions; similarly, the water collector 600 can adopt a one-to-two form, a one-to-three form, a one-to-four form, etc. that are compatible with the water distributor 500, which can be selected according to actual working conditions.

[0111] In a first more specific embodiment, when the first heat dissipation component 100 includes a first heat conducting member 110 and the second heat dissipation component 300 includes a heat dissipation path, the water divider 500 and the water collector 600 can both be divided into two.

[0112] In a second more specific embodiment, when the first heat dissipation component 100 includes a first heat conductor 110 and the second heat dissipation component 300 includes N heat dissipation paths, the water divider 500 and the water collector 600 can both adopt a one-division (N+1) form.

[0113] In a third more specific embodiment, when the first heat dissipation component 100 includes M first heat conducting members 110 and the second heat dissipation component 300 includes N heat dissipation paths, the water divider 500 and the water collector 600 may both adopt a one-division (M+N) form.

[0114] In a fourth more specific embodiment, the first heat dissipation component 100 includes M first heat conductive parts 110, wherein A first heat conductive parts 110 are connected to the input main path 210 and the output main path 220, and the remaining (MA) first heat conductive parts 110 are respectively connected to the water divider 500 and the water collector 600; when the second heat dissipation component 300 includes one heat dissipation path, the water divider 500 and the water collector 600 can both adopt a one-point (M-A+1) form.

[0115] In a fifth more specific embodiment, the first heat dissipation component 100 includes M first heat conductive parts 110, wherein A first heat conductive parts 110 are connected to the input main path 210 and the output main path 220, and the remaining (MA) first heat conductive parts 110 are respectively connected to the water divider 500 and the water collector 600; when the second heat dissipation component 300 includes N heat dissipation paths, the water divider 500 and the water collector 600 can both adopt a (M-A+N) form.

[0116] Based on the above heat dissipation device, the embodiment of the present application further discloses a communication device, wherein the disclosed communication device includes the above heat dissipation device. The communication device may be a switch, etc., and of course, may also be other devices, which are not specifically limited here.

[0117] In summary, the present application effectively solves the liquid cooling problem of the optical module 420 and the switch main chip, and adopts a compact optical module 420 layout, which meets the heat dissipation requirements of the optical module 420 that cannot be met by air cooling. Moreover, the use of the above-mentioned liquid cooling form can increase the heat flux density of the optical module 420, thereby solving the bottleneck problem of air cooling; in addition, the use of liquid cooling can also improve the overall heat dissipation efficiency and achieve the effect of energy saving and emission reduction.

[0118] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A heat dissipation device, characterized in that: include: A first heat dissipation component (100) and a connecting pipeline (200); The first heat dissipation component (100) comprises at least one first heat conducting member (110), the first heat conducting member (110) being provided with a medium channel (111), and the connecting pipeline (200) being in communication with the medium channel (111); The first heat conducting member (110) comprises a heat conducting surface (112), and the heat conducting surface (112) is used for contacting the device (400) to be cooled.

2. The heat dissipation device according to claim 1, characterized in that: The first heat dissipation component (100) comprises a plurality of first heat conducting members (110) arranged in a stacked manner, and a first accommodation space (120) for accommodating the device to be dissipated (400) is formed between two adjacent first heat conducting members (110); The heat-conducting surface (112) is arranged toward the first accommodating space (120) and is used for contacting the device to be cooled (400) in the first accommodating space (120).

3. The heat dissipation device according to claim 2, characterized in that: The heat dissipation device (400) comprises a cage (410) and a plurality of optical modules (420), the cage (410) comprising a plurality of installation portions respectively used to install the optical modules (420) and arranged at intervals, and a connecting portion (413) connecting the plurality of installation portions, two adjacent installation portions and the connecting portion (413) enclosing a second accommodation space (414), and at least a portion of each optical module (420) extends into the interior of the corresponding installation portion; Each of the plurality of first heat-conducting members (110) passes through the corresponding second accommodation space (414), and the optical module (420) is in contact with the heat-conducting surface (112) of the corresponding first heat-conducting member (110).

4. The heat dissipation device according to claim 3, characterized in that: The plurality of mounting portions include a first mounting portion (411) and a second mounting portion (412), and the first mounting portion (411), the second mounting portion (412) and the connecting portion (413) enclose the second accommodation space (414); The first heat dissipation component (100) comprises two first heat conducting members (110) stacked together, wherein one of the first heat conducting members (110) passes through the second accommodation space (414); The first mounting portion (411) and the second mounting portion (412) are respectively located on opposite sides of one of the first heat-conducting components (110), and the optical module (420) mounted on the first mounting portion (411) contacts the heat-conducting surface (112) of one of the first heat-conducting components (110), while the optical module (420) mounted on the second mounting portion (412) contacts the heat-conducting surface (112) of another of the first heat-conducting components (110).

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The first heat conducting member (110) is provided with a boss structure (113) located on the heat conducting surface (112); the boss structure (113) protrudes from the heat conducting surface (112) and is used for contacting the device (400) to be cooled.

6. The heat dissipation device according to claim 5, characterized in that: The heat dissipation device (400) comprises a matched cage (410) and an optical module (420), wherein the optical module (420) at least partially extends into the interior of the cage (410); A side of the cage (410) facing the heat conducting surface (112) is provided with an avoidance hole (415), and the boss structure (113) extends from the avoidance hole (415) to the inside of the cage (410) and contacts the optical module (420).

7. The heat dissipation device according to claim 6, characterized in that: The squirrel cage (410) is provided with a spring sheet structure (416), and the spring sheet structure (416) is arranged on a side wall of the squirrel cage (410) opposite to the avoidance hole (415).

8. The heat dissipation device according to claim 1, characterized in that: The first heat conducting component (110) is provided with a supporting structure (114), and the supporting structure (114) extends from the heat conducting surface (112) in a direction away from the heat conducting surface (112).

9. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device also includes a second heat dissipation component (300); The second heat dissipation component (300) is in communication with the connection pipeline (200) and is connected in parallel with the first heat dissipation component (100).

10. The heat dissipation device according to claim 9, characterized in that: The heat dissipation device further comprises a water distributor (500) and a water collector (600); The connecting pipeline (200) comprises an input main path (210), an output main path (220), a first input branch (230), a first output branch (240), a second input branch (250) and a second output branch (260); the input main path (210) is connected to the water divider (500); the first input branch (230) is connected to the water divider (500) and the first heat dissipation component (100); the first output branch (240) is connected to the first heat dissipation component (100) and the water collector (600); the second input branch (250) is connected to the water divider (500) and the second heat dissipation component (300); the second output branch (260) is connected to the second heat dissipation component (300) and the water collector (600); and the output main path (220) is connected to the water collector (600).

11. The heat dissipation device according to claim 2, characterized in that: The heat dissipation device also includes a second heat dissipation component (300); The second heat dissipation component (300) is in communication with the connecting pipeline (200), and the second heat dissipation component (300) is connected in parallel with a portion of the first heat conducting component (110) of the first heat dissipation component (100), and is connected in series with another portion of the first heat conducting component (110).

12. The heat dissipation device according to claim 11, characterized in that: The heat dissipation device further comprises a water distributor (500) and a water collector (600); The connecting pipeline (200) comprises an input main path (210), an output main path (220), a first input branch (230), a first output branch (240), a second input branch (250) and a second output branch (260), The input main path (210) is connected to the water divider (500) and another part of the first heat-conducting member (110) respectively; the first input branch (230) is connected to the water divider (500) and one part of the first heat-conducting member (110); the first output branch (240) is connected to one part of the first heat-conducting member (110) and the water collector (600); the second input branch (250) is connected to the water divider (500) and the second heat dissipation component (300); the second output branch (260) is connected to the second heat dissipation component (300) and the water collector (600); and the output main path (220) is connected to the water collector (600) and another part of the first heat-conducting member (110) respectively.

13. The heat dissipation device according to any one of claims 9 to 12, characterized in that: The second heat dissipation component (300) comprises a plurality of second heat-conducting members (310), and the plurality of second heat-conducting members (310) are arranged in series and / or in parallel on the connecting pipeline (200).

14. The heat dissipation device according to claim 10 or 12, characterized in that: The water distributor (500) comprises a first shell (510) and a first quick-connect connector (520), wherein the first shell (510) is provided with a first inlet (511) and a first outlet (512), and the first quick-connect connector (520) is connected to the first inlet (511) or the first outlet (512); And / or, the water collector (600) includes a second shell (610) and a second quick-connect connector (620), the second shell (610) is provided with a second inlet (611) and a second outlet (612), and the second quick-connect connector (620) is connected to the second inlet (611) or the second outlet (612).

15. A communication device, characterized in that: A heat dissipation device comprising any one of claims 1 to 14.

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