Airborne air-cooled closed case and compact light-weight unmanned aerial vehicle

By designing an air-cooled heat dissipation structure in an air-mounted enclosed chassis, and accelerating the airflow to remove heat by using the heat dissipation tank and air duct, the problem of poor heat dissipation effect of the existing air-mounted enclosed chassis is solved, and efficient heat dissipation, lightweight and versatile Take into account both.

CN119136478AInactive Publication Date: 2024-12-13CHINA SHIPBUILDING IND CORP NO 723 RESEARCH INSTITUTE
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Patent Information

Application Number
CN202411129790.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-08-16
Publication Date
2024-12-13
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing air-mounted enclosed chassis has poor heat dissipation effect, and additional heat pipe modules are required, and the versatility is poor, making it impossible to effectively dissipate heat.

Method used

An air-cooled air-closed enclosed chassis is designed, using a heat dissipation groove at the top and bottom of the box assembly, and a heat dissipation rack and air duct are installed inside. The fan accelerates the air through the air duct to take away the heat from the control board, the microwave assembly and heat dissipation groove are used. Contact to achieve heat dissipation, the box assembly is made of aluminum-magnesium alloy material, which is compact and removable.

Benefits of technology

It realizes efficient heat dissipation without additional heat pipe modules. The box is lightweight and has high strength, waterproof and dustproof functions, and has strong versatility and maintenance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to an airborne air-cooled closed case and a compact light unmanned aerial vehicle. The airborne air-cooled closed case comprises a case body assembly, a heat dissipation frame, two control panels, a plurality of printed boards and two microwave assemblies. Heat dissipation grooves are formed in the top and the bottom of the box body assembly, and the interior of the box body assembly is divided into two areas in the horizontal direction; the heat dissipation frame is horizontally erected in one area of the box body assembly, a plurality of air channels are horizontally arranged in the heat dissipation frame, a fan is arranged at one end of each air channel, an inlet of each fan is communicated with an air inlet in the box body assembly, and the other end of each air channel is communicated with an air outlet in the box body assembly; the two control panels are arranged at the top and the bottom of the heat dissipation frame; the plurality of printed boards are horizontally erected in the other area of the box body assembly; the microwave assemblies are arranged between the inner top and the inner bottom of the box body assembly and the corresponding control boards, and the microwave assemblies make contact with the corresponding heat dissipation grooves. According to the device, the heat dissipation effect of the airborne air-cooled closed case is improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of airborne chassis heat dissipation, and in particular to an airborne air-cooled closed chassis and a compact and lightweight unmanned aerial vehicle. Background Art

[0002] The chassis of drones needs to be dustproof and rainproof because it needs to work outdoors at high altitudes. Considering factors such as the rated load of the drone, interface size, and endurance, the chassis of drones needs to meet the requirements of miniaturization and lightness. In addition, the heat dissipation of the internal heat dissipation components of the drone chassis needs to consider the heat dissipation problem. Therefore, the chassis of drones needs to have good heat dissipation performance.

[0003] Regarding airborne chassis, the prior art proposes an airborne self-circulating closed liquid-cooled chassis, which is applied to airborne environments without liquid cooling sources to ensure that high heat flux density plug-in boards can work normally. The liquid-cooled chassis is made of precision machining after casting, which ensures the stability and insertion accuracy of the liquid-cooled plug-in in the chassis; there is also an airborne closed conduction-cooled chassis, which discloses that while ensuring the sealing of the electrical cavity, the heat can be quickly transferred to the cold plate through the heat pipe module due to the one-to-one correspondence between the heat pipe module and the electronic plug-in, and the heat is then discharged through the air cavity by the fan; and a modular closed conduction-cooled chassis, which is applied to the occasion of closed conduction-cooled chassis. For different airborne models, it is only necessary to confirm the number of plug-ins used in the chassis and select the corresponding number of conduction-cooled modules for assembly.

[0004] The above prior arts involve structures of airborne closed chassis of different structural forms, but all of them have the following problems: the chassis is only suitable for occasions where the internal modules are plug-ins. Due to the slow heat conduction between the electronic plug-in and the cold plate, an additional heat pipe module needs to be added. In addition, the versatility is poor, the contact surface between the plug-in and the cold plate is small, and the heat dissipation effect is poor.

[0005] Therefore, it is necessary to provide an airborne air-cooled sealed chassis and a compact and lightweight UAV to solve the above problems. Summary of the invention

[0006] The present invention provides an airborne air-cooled sealed chassis and a compact and lightweight UAV, so as to solve the problems that the existing chassis is only suitable for occasions where the internal modules are plug-ins, and an additional heat pipe module needs to be added due to slow heat conduction between the electronic plug-in and the cold plate; and the chassis has poor versatility, a small contact surface between the plug-in and the cold plate, and poor heat dissipation effect.

[0007] The present invention provides an airborne air-cooled sealed chassis and a compact lightweight UAV using the following technical solutions, including: The box assembly has heat dissipation slots on the top and bottom; the inside thereof is divided into two areas in the horizontal direction; The heat dissipation frame is horizontally erected in one of the areas of the box assembly, and a plurality of air ducts are horizontally arranged therein. A fan is arranged at one end of the air duct, and the inlet of the fan is connected to the air inlet on the box assembly, and the other end of the air duct is connected to the air outlet on the box assembly; A control panel is arranged on the top and bottom of the heat dissipation rack; A plurality of printed circuit boards are horizontally mounted in another area of ​​the box assembly; And a microwave component is arranged between the inner top and the inner bottom of the box component and the corresponding control board, and the microwave component is in contact with the corresponding heat dissipation slot.

[0008] Preferably, the box assembly includes: a hexagonal beam frame structure, the six faces of the hexagonal beam frame structure correspond to the fixed front panel, rear panel, left panel, right panel, upper panel and lower panel to form a box, a vertical middle beam frame is arranged between the upper beam frame and the lower beam frame, and the middle beam frame divides the box into two areas, wherein the upper panel and the lower panel are both provided with heat dissipation grooves, the air inlet is arranged on the front panel, and the air outlet is arranged on the rear panel.

[0009] Preferably, the hexagonal beam frame structure includes: an upper beam frame and a lower beam frame arranged in parallel from top to bottom; a left beam frame and a right beam frame arranged in parallel from left to right between the upper beam frame and the lower beam frame, and the upper beam frame, the lower beam frame, the left beam frame and the right beam frame form a hexagonal beam frame structure.

[0010] Preferably, the heat sink is installed in the area between the middle beam frame and the left beam frame.

[0011] Preferably, the printed circuit board is mounted in the area between the middle beam frame and the right beam frame through an adapter frame, and a power module is provided between the printed circuit board and the lower beam frame, and the power module is used to supply power to the fan, microwave components, control board and printed circuit board.

[0012] Preferably, the microwave assembly comprises: a lower microwave assembly and an upper microwave assembly, wherein the lower microwave assembly is arranged on the lower panel between the middle beam frame and the left beam frame; and the upper microwave assembly is arranged between the upper panel and the control panel.

[0013] Preferably, a plurality of heat dissipation bosses are arranged on the top and the bottom of the heat dissipation frame, wherein the control board is arranged on the free ends of the heat dissipation bosses.

[0014] Preferably, the upper beam frame, lower beam frame, left beam frame, right beam frame, front panel, rear panel, left panel, right panel, upper panel, lower panel and heat sink of the box assembly are all made of aluminum-magnesium alloy material.

[0015] Preferably, the inner sides of the front panel, the rear panel, the left panel, the right panel, the upper panel and the lower panel are all sealed by sealing gaskets.

[0016] A compact and lightweight unmanned aerial vehicle comprises an airborne air-cooled closed chassis disclosed in the present invention.

[0017] The beneficial effects of the present invention are: 1. In the present invention, during the flight of the UAV, the heat emitted by the microwave components in the airborne air-cooled closed case flows out from the heat dissipation slots of the case assembly, and the emitted heat is taken away by the airflow during the flight of the UAV, thereby achieving heat dissipation of the microwave components; the heat emitted by the processing chip on the control board is transferred to the air duct of the heat dissipation frame by the heat dissipation frame, and at the same time, the fan sucks air from the air inlet of the case assembly, accelerates the air flow and sends it into the air duct, and discharges the heat emitted by the chip on the control board in the air duct from the air outlet of the case assembly through the air duct outlet, that is, the internal module of the airborne air-cooled closed case of the present invention does not need to additionally add a heat pipe module, thereby improving the heat dissipation effect of the airborne air-cooled closed case.

[0018] 2. Secondly, the upper beam frame, lower beam frame, left beam frame, middle beam frame and right beam frame of the box assembly of the present invention are all formed by whole milling of aluminum-magnesium alloy plates with lower density, and are partially thinned by milling to leave ribs to form a frame structure, which is connected to the front panel, rear panel, left panel, right panel, upper panel and lower panel by screws. The remaining structural parts in the chassis are also aluminum-magnesium alloys that are thinned by whole plate milling to reduce weight. Therefore, the overall weight of the chassis is small and the strength is high. The panels on the six surfaces of the box assembly can be independently disassembled, and the maintainability is high. The power module and control board inside the box assembly can be air-cooled through a cold plate with a heat dissipation groove. It has a simple structure, strong versatility and high maintainability.

[0019] 3. The inner sides of the front panel, rear panel, left panel, right panel, upper panel and lower panel of the present invention are all sealed by sealing gaskets, so that the airborne air-cooled closed chassis has waterproof and dustproof functions. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a three-dimensional diagram of an airborne air-cooled sealed case of the present invention when viewed from above; Figure 2 It is a three-dimensional diagram of an airborne air-cooled sealed case of the present invention when viewed from above; Figure 3 It is a schematic diagram of the internal structure of an air-cooled airtight case of an airborne machine of the present invention; Figure 4 is a schematic diagram of a hexagonal beam frame structure of a box assembly of the present invention; Figure 5 is a schematic structural diagram of the heat dissipation rack of the present invention; Figure 6 It is a schematic structural diagram of a compact and lightweight UAV of the present invention.

[0022] In the figure: 1. UAV; 2. Mounting bracket; 3. Chassis; 3-1. Front panel; 3-2. Rear panel; 3-3. Left panel; 3-4. Right panel; 3-5. Upper panel; 3-6. Lower panel; 3-7. Lower beam frame; 3-8. Left beam frame; 3-9. Lower microwave assembly; 3-10. Lower control board; 3-11. Fan; 3-12. Heat sink; 3-13. Upper control board; 3-14. Upper microwave assembly; 3-15. Upper beam frame; 3-16. Middle beam frame; 3-17. Adapter frame; 3-18. Printed circuit board; 3-19. Corner piece; 3-20. Power module; 3-21. Right beam frame. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] An embodiment of an air-cooled airtight chassis of the present invention is as follows: Figure 1 and Figure 3 As shown, it includes: a box assembly, a heat sink 3-12, two control boards, multiple printed circuit boards 3-18 and two microwave assemblies; the top and bottom of the box assembly are provided with heat dissipation grooves, and the box assembly is divided into two areas along the horizontal direction; the heat sink 3-12 is horizontally mounted in one of the areas of the box assembly, and multiple air ducts are horizontally arranged in the heat sink 3-12, and a fan 3-11 is arranged at one end of the air duct, the inlet of the fan 3-11 is connected to the air inlet on the box assembly, and the other end of the air duct is connected to the air outlet on the box assembly; two control boards are arranged at the top and bottom of the heat sink 3-12; multiple printed circuit boards 3-18 are horizontally mounted in another area of ​​the box assembly; the microwave assembly is arranged between the inner top and inner bottom of the box assembly and the corresponding control board, and the microwave assembly is in contact with the corresponding heat dissipation groove.

[0025] Specifically, Figure 1 , Figure 2 and Figure 4As shown, the box assembly includes: a hexagonal beam frame structure, the six faces of the hexagonal beam frame structure correspond to fix the front panel 3-1, the rear panel 3-2, the left panel 3-3, the right panel 3-4, the upper panel 3-5 and the lower panel 3-6 to form a box, a vertical middle beam frame 3-16 is arranged between the upper beam frame 3-15 and the lower beam frame 3-7, the middle beam frame 3-16 divides the box into two areas, wherein the upper panel 3-5 and the lower panel 3-6 are both provided with heat dissipation grooves, the front panel 3-1 is provided with an air inlet, and the rear panel 3-2 is provided with an air outlet, and the inner sides of the front panel 3-1, the rear panel 3-2, the left panel 3-3, the right panel 3-4, the upper panel 3-5 and the lower panel 3-6 are all bonded with sealing gaskets for sealing.

[0026] The hexagonal beam frame structure includes: an upper beam frame 3-15 and a lower beam frame 3-7 arranged in parallel from top to bottom; a left beam frame 3-8 and a right beam frame 3-21 arranged in parallel from left to right between the upper beam frame 3-15 and the lower beam frame 3-7, and the upper beam frame 3-15, the lower beam frame 3-7, the left beam frame 3-8 and the right beam frame 3-21 form a hexagonal structure, such as Figure 3 As shown, the upper beam frame 3-15, the lower beam frame 3-7, the left beam frame 3-8, the middle beam frame 3-16 and the right beam frame 3-21 are connected to the four outer sides of the front panel 3-1, the rear panel 3-2, the left panel 3-3 and the right panel 3-4 by screws, and laser welding is performed at the connection positions, and the surface welds are smoothed after welding is completed.

[0027] Specifically, the heat dissipation frame 3-12 is installed in the area between the middle beam frame 3-16 and the left beam frame 3-8.

[0028] Specifically, the printed circuit board 3-18 is installed in the area between the middle beam frame 3-16 and the right beam frame 3-21 through the adapter frame 3-17, and a power module 3-20 is provided between the printed circuit board 3-18 and the lower beam frame 3-7. The power module 3-20 is used to supply power to the fan 3-11, the microwave component, the control board and the printed circuit board 3-18. Figure 3 As shown, the bottom of the power module 3-20 is installed on the lower panel 3-6, and the top of the power module 3-20 is clamped and fixed by two bent angle pieces 3-19.

[0029] Specifically, the microwave assembly includes: a lower microwave assembly 3-9 and an upper microwave assembly 3-14, wherein the lower microwave assembly 3-9 is arranged on the lower panel 3-6 between the middle beam frame 3-16 and the left beam frame 3-8; the upper microwave assembly 3-14 is arranged between the upper panel 3-5 and the control panel, such as Figure 5 As shown, a plurality of heat dissipation bosses are arranged at the top and bottom of the heat dissipation frame 3-12, wherein the control board is arranged on the free end of the heat dissipation boss; Figure 3As shown, the control panel is an upper control panel 3-13 and a lower control panel 3-10. The upper control panel 3-13 is arranged between the free end of the heat dissipation protrusion at the top of the heat dissipation rack 3-12 and the upper microwave assembly 3-14; the lower control panel 3-10 is arranged between the free end of the heat dissipation protrusion at the bottom of the heat dissipation rack 3-12 and the lower microwave assembly 3-9.

[0030] Specifically, the upper beam frame 3-15, the lower beam frame 3-7, the left beam frame 3-8, the right beam frame 3-21, the front panel 3-1, the rear panel 3-2, the left panel 3-3, the right panel 3-4, the upper panel 3-5, the lower panel 3-6 and the heat sink 3-12 of the box assembly are all made of aluminum-magnesium alloy material.

[0031] Specifically, the inner sides of the front panel 3-1, the rear panel 3-2, the left panel 3-3, the right panel 3-4, the upper panel 3-5, and the lower panel 3-6 are all sealed by sealing gaskets.

[0032] like Figure 6 As shown, a compact and lightweight UAV of this embodiment, the bottom of the UAV 1 is connected to the top of the airborne air-cooled closed chassis 3 disclosed in the present invention through four mounting brackets 2.

[0033] Heat dissipation principle When in use, the airborne air-cooled sealed chassis 3 is connected to the four mounting brackets 2 at the bottom of the UAV 1. During the flight of the UAV 1, the heat emitted by the upper microwave component 3-14 in the airborne air-cooled sealed chassis 3 flows out from the heat dissipation slot of the upper panel 3-5, and the heat emitted by the lower microwave component 3-9 flows out from the heat dissipation slot of the lower panel 3-6. The emitted heat is carried away by the airflow during the flight of the UAV 1, thereby achieving heat dissipation of the microwave component. At the same time, the heat emitted by the processing chip on the control board is transferred to the air duct of the heat dissipation frame 3-12 by the heat dissipation protrusion. At this time, the fan 3-11 is working, and the fan 3-11 sucks air from the air inlet of the front panel 3-1, accelerates the air flow and sends it into the air duct, and discharges the heat emitted by the processing chip on the control board in the air duct from the air outlet on the rear panel 3-2 after passing through the air duct outlet, thereby achieving heat dissipation of the airborne air-cooled sealed chassis 3.

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An air-cooled closed chassis, characterized in that: include: The box assembly has heat dissipation slots on the top and bottom; the inside thereof is divided into two areas in the horizontal direction; A heat dissipation frame (3-12) is horizontally erected in one of the regions of the box assembly, and has a plurality of air ducts arranged horizontally therein, a fan (3-11) being arranged at one end of the air duct, an inlet of the fan (3-11) being connected to an air inlet on the box assembly, and the other end of the air duct being connected to an air outlet on the box assembly; A control panel is arranged on the top and bottom of the heat dissipation frame (3-12); A plurality of printed circuit boards (3-18) are horizontally mounted in another area of ​​the box assembly; And a microwave component is arranged between the inner top and the inner bottom of the box component and the corresponding control board, and the microwave component is in contact with the corresponding heat dissipation slot.

2. The airborne air-cooled sealed chassis according to claim 1, characterized in that: The box assembly comprises: a hexagonal beam frame structure, wherein the six faces of the hexagonal beam frame structure are fixed with a front panel (3-1), a rear panel (3-2), a left panel (3-3), a right panel (3-4), an upper panel (3-5) and a lower panel (3-6) to form a box, a vertical middle beam frame (3-16) is arranged between the upper beam frame (3-15) and the lower beam frame (3-7), and the middle beam frame (3-16) divides the box into two areas, wherein the upper panel (3-5) and the lower panel (3-6) are both provided with heat dissipation grooves, an air inlet is arranged on the front panel (3-1), and an air outlet is arranged on the rear panel (3-2).

3. The air-cooled sealed chassis according to claim 2, characterized in that: The hexagonal beam frame structure comprises: an upper beam frame (3-15) and a lower beam frame (3-7) arranged in parallel from top to bottom; a left beam frame (3-8) and a right beam frame (3-21) arranged in parallel from left to right between the upper beam frame (3-15) and the lower beam frame (3-7); the upper beam frame (3-15), the lower beam frame (3-7), the left beam frame (3-8) and the right beam frame (3-21) form a hexagonal beam frame structure.

4. The air-cooled airtight chassis according to claim 3, characterized in that: The heat dissipation frame (3-12) is installed in the area between the middle beam frame (3-16) and the left beam frame (3-8).

5. The air-cooled airtight chassis according to claim 3, characterized in that: The printed circuit board (3-18) is mounted in the area between the middle beam frame (3-16) and the right beam frame (3-21) via an adapter frame (3-17), and a power module (3-20) is provided between the printed circuit board (3-18) and the lower beam frame (3-7). The power module (3-20) is used to supply power to the fan (3-11), two microwave components, a control board, and the printed circuit board (3-18).

6. The airborne air-cooled sealed chassis according to claim 3, characterized in that: The microwave assembly comprises: a lower microwave assembly (3-9) and an upper microwave assembly (3-14), wherein the lower microwave assembly (3-9) is arranged on a lower panel (3-6) between a middle beam frame (3-16) and a left beam frame (3-8); and the upper microwave assembly (3-14) is arranged between an upper panel (3-5) and a control panel.

7. The air-cooled airtight chassis according to claim 1, characterized in that: A plurality of heat dissipation bosses are arranged on the top and bottom of the heat dissipation frame (3-12), wherein the control board is arranged on the free ends of the heat dissipation bosses.

8. The air-cooled airtight chassis according to claim 1, characterized in that: The upper beam frame (3-15), the lower beam frame (3-7), the left beam frame (3-8), the right beam frame (3-21), the front panel (3-1), the rear panel (3-2), the left panel (3-3), the right panel (3-4), the upper panel (3-5), the lower panel (3-6) and the heat sink (3-12) of the box assembly are all made of aluminum-magnesium alloy material.

9. The air-cooled airtight chassis according to claim 1, characterized in that: The inner sides of the front panel (3-1), the rear panel (3-2), the left panel (3-3), the right panel (3-4), the upper panel (3-5), and the lower panel (3-6) are all sealed by sealing gaskets.

10. A compact and lightweight UAV, characterized in that: It comprises the airborne air-cooled closed chassis as described in any one of claims 1 to 9.

Citation Information

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