Double-sided water-cooling power module made of mixed material

Abstract

The invention relates to a double-sided water-cooling power module made of a mixed material. The double-sided water-cooling power module comprises a mounting shell and a pre-assembled power module mounted on the mounting shell, the pre-assembled power module comprises a first heat dissipation piece and a second heat dissipation piece which are arranged in parallel, and the first heat dissipation piece is mounted on the mounting shell and assembled together with the second heat dissipation piece through a clamp; a plurality of power chips are arranged between the first heat dissipation piece and the second heat dissipation piece at intervals; each of the first heat dissipation piece and the second heat dissipation piece comprises a bottom plate directly facing the power chip, a cover plate arranged on one surface, deviating from the power chip, of the bottom plate, and heat dissipation fins arranged between the bottom plate and the cover plate; the bottom plates, the cover plates and the heat dissipation fins of the first heat dissipation piece and the second heat dissipation piece are all independently selected from one of copper, aluminum or stainless steel, and the bottom plates of the first heat dissipation piece and the second heat dissipation piece are made of different materials. Compared with the prior art, the heat dissipation requirement of the high-power-density IGBT module can be met, and the balance between mechanical performance and manufacturing cost can be considered.

Description

Technical Field

[0001] The invention relates to the technical field of motor controllers, and in particular to a double-sided water-cooled power module of a mixed material. Background Art

[0002] The controller is one of the key electric drive components of new energy vehicles such as electric and hybrid vehicles. According to the vehicle torque and speed requirements, the various working modes between the battery, motor and engine are coordinated to achieve the best vehicle performance. The thermal design of the motor controller is an important measure of the normal operation of the controller. The heat dissipation methods of the controller are usually air cooling and liquid cooling. For the key components of the controller, liquid cooling is often used to directly cool the heat-generating components through the flow of coolant.

[0003] IGBT (insulated gate bipolar transistor) power module is the core component of the motor controller. When the power module is working, it will inevitably cause loss, resulting in an increase in chip temperature. IGBT power modules often have a complex water cooling structure inside, and most heat sinks use materials with high thermal conductivity such as copper. However, high thermal conductivity often means a higher price, and in practical applications, it often fails to achieve the ideal heat dissipation effect due to mechanical performance limitations.

[0004] Therefore, in order to meet the heat dissipation requirements of high power density IGBT modules and to balance mechanical properties, heat dissipation effects and manufacturing costs, it is urgent to develop a new type of hybrid material double-sided water-cooled power module. Summary of the invention

[0005] The purpose of the present invention is to provide a double-sided water-cooled power module of a hybrid material to meet the heat dissipation requirements of a high power density IGBT module while taking into account the balance of mechanical properties, heat dissipation effect and manufacturing cost.

[0006] The purpose of the present invention can be achieved by the following technical solutions:

[0007] A double-sided water-cooled power module of a mixed material, comprising a mounting shell and a preassembled power module mounted on the mounting shell;

[0008] The preassembled power module comprises a first heat sink and a second heat sink arranged in parallel, wherein the first heat sink is mounted on the mounting housing and assembled with the second heat sink by a clamp; a plurality of power chips are arranged between the first heat sink and the second heat sink;

[0009] The first heat sink and the second heat sink both include a base plate facing the power chip, a cover plate arranged on the side of the base plate facing away from the power chip, and heat dissipation fins arranged between the base plate and the cover plate; the materials of the base plate, cover plate and heat dissipation fins of the first heat sink and the second heat sink are independently selected from one of copper, aluminum or stainless steel, and the base plates of the first heat sink and the second heat sink are made of different materials.

[0010] Furthermore, the base plates of the first heat sink and the second heat sink are respectively provided with inlet holes and outlet holes at both ends of the base plates, the inlet holes and outlet holes of the two base plates correspond to each other, and first sealing rings are installed at the inlet holes and outlet holes.

[0011] Furthermore, the installation shell is provided with flow holes corresponding to the inlet holes and the outlet holes on the bottom plate of the first heat sink, and a second sealing ring is provided between the flow holes and the installation shell.

[0012] Furthermore, thermal conductive silicone grease is filled between the power chip and the base plate.

[0013] Furthermore, the clamp includes a plurality of clamping claws capable of buckling the first heat sink and the second heat sink together.

[0014] Furthermore, the first heat sink includes a first bottom plate, a second cover plate, and first heat dissipation fins disposed between the first bottom plate and the second cover plate.

[0015] Furthermore, the first base plate is directly opposite to the power chip, and the second cover plate is installed on a side of the first base plate facing away from the power chip.

[0016] Furthermore, the first bottom plate is provided with a plurality of mounting ear plates, the mounting shell is provided with mounting posts corresponding to the mounting ear plates one by one, and the mounting posts and the corresponding mounting ear plates are connected by fasteners.

[0017] Furthermore, the first bottom plate is provided with a plurality of positioning ear plates, and the mounting shell is provided with positioning posts corresponding to the positioning ear plates one by one.

[0018] Furthermore, the second heat sink includes a second bottom plate, a second cover plate, and second heat dissipation fins disposed between the second bottom plate and the second cover plate.

[0019] Furthermore, the second base plate is directly opposite to the power chip, and the second cover plate is installed on a side of the second base plate facing away from the power chip.

[0020] Furthermore, the card clip cover is arranged on the second cover plate.

[0021] Furthermore, in the same heat sink, the materials of the bottom plate, the cover plate and the heat sink fins are not completely the same, that is, the materials of the same heat sink may be partially different or completely different.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] (1) The base plates of the heat sinks on both sides of the power chip of the present invention can meet the heat dissipation requirements of the high power density IGBT module while taking into account the balance between mechanical performance and manufacturing cost by selecting different materials.

[0024] (2) The copper plate of the heat sink of the present invention has good weldability. However, in the double-sided water-cooling welding technology of aluminum, the surface of the aluminum needs to be sprayed with copper or copper-clad. At this time, the increased price has reached the price of the entire copper plate. Therefore, the present application can improve the overall weldability by directly selecting heat sinks of different materials.

[0025] (3) The present invention avoids the low heat dissipation effect of double-sided aluminum thermal grease or (double-sided aluminum copper welding) and the high price of double-sided copper plates, and can achieve excellent heat dissipation effect at a lower economic cost.

[0026] (4) The present invention can ensure the secure connection between the first heat sink and the second heat sink through the provision of the clip, and can also be easily disassembled, thereby avoiding the complicated operation of installation through ear plates and fasteners.

[0027] (5) In the first heat sink or the second heat sink of the present invention, the materials of the base plate, the cover plate and the heat sink fins can also be independently selected according to needs, and can be partially different or all three different. This can take into account the mechanical properties, welding performance and production costs, and can achieve better heat dissipation performance at a lower cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of the double-sided water-cooled power module of the present invention.

[0029] Figure 2 It is a schematic diagram of an explosion of the double-sided water-cooled power module of the present invention.

[0030] Figure 3 It is a schematic diagram of the structure of the preassembled power module of the present invention after assembly.

[0031] Figure 4 It is a schematic diagram of an explosion of the preassembled power module of the present invention.

[0032] Figure 5 It is a structural schematic diagram of the installation shell of the present invention.

[0033] Figure 6 It is a schematic structural diagram of the first heat dissipation element of the present invention.

[0034] Figure 7 It is a schematic structural diagram of the second heat dissipation element of the present invention.

[0035] Figure 8 This is a comparison chart of the heat dissipation effect between the double-sided water-cooled power module of Example 3 of the present invention and the double-sided aluminum power module.

[0036] Fig. 9 This is a comparison chart of the heat dissipation effect of the double-sided water-cooled power module of Example 3 of the present invention and the double-sided copper power module.

[0037] Description of the markings in the figure:

[0038] 1-mounting housing, 11-flow hole, 12-mounting column, 13-positioning column;

[0039] 2-first heat sink, 21-first base plate, 22-second cover plate, 23-first heat sink fin, 24-mounting ear plate, 25-positioning ear plate;

[0040] 3-second heat sink, 31-second base plate, 32-second cover plate, 33-second heat sink fins;

[0041] 4-clip, 41-claw;

[0042] 5- Power chip;

[0043] 6- first sealing ring;

[0044] 7- Second sealing ring. DETAILED DESCRIPTION

[0045] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0046] In the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention; the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance; in addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0048] Embodiment 1:

[0049] A double-sided water-cooled power module of mixed materials comprises a mounting shell 1 and a preassembled power module mounted on the mounting shell 1.

[0050] like Figure 1-4 As shown, the preassembled power module includes a first heat sink 2 and a second heat sink 3 arranged in parallel, the first heat sink 2 is mounted on the mounting housing 1 and assembled with the second heat sink 3 by means of a clamp 4. A plurality of power chips 5 are arranged between the first heat sink 2 and the second heat sink 3. The first heat sink 2 and the second heat sink 3 each include a bottom plate facing the power chip 5, a cover plate arranged on a side of the bottom plate away from the power chip 5, and heat dissipation fins arranged between the bottom plate and the cover plate.

[0051] In this embodiment, the materials of the bottom plate, cover plate and heat dissipation fins of the first heat sink 2 and the second heat sink 3 are independently selected from one of copper, aluminum or stainless steel, and the bottom plates of the first heat sink 2 and the second heat sink 3 are made of different materials. The double-sided heat sink bottom plate of this embodiment can meet the heat dissipation requirements of the high power density IGBT module and also take into account the balance of mechanical performance, heat dissipation effect and manufacturing cost by selecting different materials.

[0052] Embodiment 2:

[0053] A double-sided water-cooled power module of a mixed material comprises a mounting shell 1 and a preassembled power module mounted on the mounting shell 1. The preassembled power module comprises a first heat sink 2 and a second heat sink 3 arranged in parallel, the first heat sink 2 is mounted on the mounting shell 1 and assembled with the second heat sink 3 by a clip 4. The clip 4 comprises a plurality of clamps 41 capable of buckling the first heat sink 2 and the second heat sink 3 together. The clamps of the clip 4 have a certain elasticity, which can ensure the stable buckling of the first heat sink 2 and the second heat sink 3, and can also be easily disassembled, avoiding the complicated operation of installation through ear plates and fasteners.

[0054] A plurality of power chips 5 are arranged between the first heat sink 2 and the second heat sink 3. The first heat sink 2 and the second heat sink 3 each include a base plate facing the power chip 5, a cover plate arranged on the side of the base plate away from the power chip 5, and a heat dissipation fin arranged between the base plate and the cover plate. The power chip 5 is an IGBT chip, and thermal grease is filled between the power chip 5 and the base plate to increase the heat conduction effect. Inlet holes and outlet holes are respectively arranged at both ends of the base plate, and the heat dissipation fins are arranged between the inlet holes and the outlet holes. The inlet holes and outlet holes of the two base plates correspond to each other, and a first sealing ring 6 is installed at the inlet holes and the outlet holes. Since a sealed cavity is formed between the base plate and the cover plate, the inlet holes and outlet holes on the base plate are respectively connected to the sealed cavity for passing the coolant, and the setting of the first sealing ring 6 can avoid the influence of the coolant leakage on the power chip 5.

[0055] Specifically, Figure 5-7 As shown, the first heat sink 2 includes a first base plate 21, a second cover plate 22, and a first heat dissipation fin 23 arranged between the first base plate 21 and the second cover plate 22. The first base plate 21 is directly opposite to the power chip 5, and the second cover plate 22 is installed on the side of the first base plate 21 away from the power chip 5. The mounting shell 1 is provided with flow holes 11 corresponding to the inlet holes and the outlet holes on the first base plate 21, respectively, and a second sealing ring 7 is provided between the flow holes 11 and the mounting shell 1. The first base plate 21 is provided with a plurality of mounting ear plates 24, and the mounting shell 1 is provided with mounting columns 12 corresponding to the mounting ear plates 24 one by one. The mounting columns 12 are provided with internal threads, and the mounting columns 12 and the corresponding mounting ear plates 24 are connected by bolts. The first base plate 21 is provided with a plurality of positioning ear plates 25, and the mounting shell 1 is provided with positioning columns 13 corresponding to the positioning ear plates 25 one by one.

[0056] Correspondingly, the second heat sink 3 includes a second base plate 31, a second cover plate 32, and second heat dissipation fins 33 disposed between the second base plate 31 and the second cover plate 32. The second base plate 31 is directly opposite to the power chip 5, the second cover plate 32 is installed on a side of the second base plate 31 away from the power chip 5, and the clamp 4 is covered on the second cover plate 32.

[0057] The assembly process of this embodiment is as follows:

[0058] First, assemble the first heat sink 2 and the second heat sink 3 respectively, place the power chip 5 between the two heat sinks, and fill the thermal conductive silicone grease between the power chip 5 and the bottom plates of the two heat sinks. The inlet and outlet holes on the bottom plates of the two heat sinks correspond to each other, and the first sealing ring 6 is installed at the inlet and outlet holes. Assemble the first heat sink 2 and the second heat sink 3 together through the clamp 4, and install the entire pre-assembled power module on the mounting housing 1 through the positioning ear plate 25 and the mounting ear plate 24 on the first bottom plate 21. Pass the coolant into the sealed cavity between the bottom plate and the cover plate to achieve the cooling and heat dissipation effect.

[0059] Embodiment 3:

[0060] A double-sided water-cooled power module of mixed materials comprises a mounting shell 1 and a preassembled power module mounted on the mounting shell 1. The preassembled power module comprises a first heat sink 2 and a second heat sink 3 arranged in parallel, the first heat sink 2 is mounted on the mounting shell 1 and assembled with the second heat sink 3 by a clamp 4. The difference from Example 2 is that the material of the first bottom plate 21 of this embodiment is copper; the material of the second bottom plate 31 is aluminum, which has excellent mechanical properties and a low price.

[0061] In the double-sided water-cooled welding technology of aluminum, the surface of aluminum needs to be sprayed with copper or covered with copper, and the increased price has reached the price of a whole copper. In this embodiment, the material of the first bottom plate 21 is directly replaced with copper, and the material of the second bottom plate 31 is still aluminum. In comparison, the price is almost the same, but the heat dissipation performance is much better than double-sided aluminum (copper-clad) welding. Figure 8 As shown, the thermal resistance of the two heat sinks of double-sided aluminum (copper clad) at different power chips 5 is about 0.13K / W, while the thermal resistance of the double-sided water-cooled power module with one copper base plate and one aluminum base plate in this embodiment at different power chips 5 is about 0.07K / W. Compared with double-sided aluminum (copper clad), the thermal resistance is significantly reduced and the heat dissipation effect is significantly increased.

[0062] Compared with the double-sided water-cooled power module whose double-sided bottom plate material is copper, the price of this embodiment is nearly 1 / 3 cheaper. Fig. 9 As shown, when thermal grease is filled between the bottom surface and the power chip 5, the thermal resistance of the one-sided copper and one-sided aluminum configuration and the double-sided copper configuration in this embodiment is almost the same, with no obvious difference, indicating that the double-sided water-cooled power module designed with mixed materials in this embodiment takes into account both good thermal conductivity and low economic cost.

[0063] Embodiment 4:

[0064] A double-sided water-cooled power module of a mixed material comprises a mounting shell 1 and a preassembled power module mounted on the mounting shell 1. The preassembled power module comprises a first heat sink 2 and a second heat sink 3 arranged in parallel, wherein the first heat sink 2 is mounted on the mounting shell 1 and assembled with the second heat sink 3 by a clamp 4.

[0065] The difference from the second embodiment is that the first bottom plate 21 and the second bottom plate 31 of the present embodiment are made of copper and stainless steel respectively. Stainless steel also has excellent mechanical properties and a low price, and can achieve the same excellent heat dissipation effect when combined with copper on both sides.

[0066] Embodiment 5:

[0067] A double-sided water-cooled power module of a mixed material comprises a mounting shell 1 and a preassembled power module mounted on the mounting shell 1. The preassembled power module comprises a first heat sink 2 and a second heat sink 3 arranged in parallel, wherein the first heat sink 2 is mounted on the mounting shell 1 and assembled with the second heat sink 3 by a clamp 4.

[0068] The difference from Example 2 is that the materials of the base plate, cover plate and heat dissipation fins of the first heat sink 2 and the second heat sink 3 in this embodiment are independently selected from one of copper, aluminum or stainless steel. Taking the second heat sink 3 as an example, since the second base plate 31 has a greater impact on the heat dissipation effect, the material of the second base plate 31 can be selected from copper; while the second cover plate 32 has a smaller impact on the heat dissipation effect, the material of the second cover plate 32 can be selected from stainless steel, which is cheap but has poor thermal conductivity; and the material of the heat dissipation fins located between the two can be selected from aluminum or copper according to the cost and heat dissipation needs. Through the mixed material design of different components in the same heat sink in this embodiment, mechanical properties, welding properties and production costs can be taken into account, and better heat dissipation performance can be obtained at a lower cost.

[0069] The above description of the embodiments is to facilitate the understanding and use of the invention by those skilled in the art. It is obvious that those skilled in the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative work. Therefore, the present invention is not limited to the above embodiments, and improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the present invention should be within the scope of protection of the present invention.

Claims

1. A double-sided water-cooled power module with mixed materials, It is characterized in that It comprises a mounting housing (1) and a pre-assembled power module mounted on the mounting housing (1); The preassembled power module comprises a first heat sink (2) and a second heat sink (3) arranged in parallel, the first heat sink (2) being mounted on the mounting housing (1) and assembled with the second heat sink (3) via a clamp (4); a plurality of power chips (5) are arranged at intervals between the first heat sink (2) and the second heat sink (3); The first heat sink (2) and the second heat sink (3) both comprise a base plate facing the power chip (5), a cover plate arranged on a side of the base plate facing away from the power chip (5), and heat dissipation fins arranged between the base plate and the cover plate; the base plate, the cover plate and the heat dissipation fins of the first heat sink (2) and the second heat sink (3) are independently made of one of copper, aluminum or stainless steel, and the base plates of the first heat sink (2) and the second heat sink (3) are made of different materials.

2. A double-sided water-cooled power module of a hybrid material according to claim 1, It is characterized in that The bottom plates of the first heat sink (2) and the second heat sink (3) are respectively provided with an inlet hole and an outlet hole at both ends of the bottom plates, the inlet holes and the outlet holes of the two bottom plates correspond to each other, and first sealing rings (6) are installed at the inlet holes and the outlet holes.

3. A double-sided water-cooled power module of a hybrid material according to claim 2, It is characterized in that The installation shell (1) is provided with flow holes (11) respectively corresponding to the inlet holes and outlet holes on the bottom plate of the first heat sink (2), and a second sealing ring (7) is provided between the flow hole (11) and the installation shell (1).

4. A double-sided water-cooled power module of a hybrid material according to claim 1, It is characterized in that Thermal conductive silicone grease is filled between the power chip (5) and the base plate.

5. A double-sided water-cooled power module of a hybrid material according to claim 1, It is characterized in that The clamp (4) comprises a plurality of clamping claws (41) capable of buckling the first heat sink (2) and the second heat sink (3) together.

6. A double-sided water-cooled power module of a hybrid material according to claim 1, It is characterized in that The first heat sink (2) comprises a first bottom plate (21), a second cover plate (22), and first heat sink fins (23) arranged between the first bottom plate (21) and the second cover plate (22); The first base plate (21) is directly opposite to the power chip (5), and the second cover plate (22) is installed on a side of the first base plate (21) facing away from the power chip (5).

7. A double-sided water-cooled power module of a hybrid material according to claim 6, It is characterized in that The first base plate (21) is provided with a plurality of mounting ear plates (24), the mounting shell (1) is provided with mounting columns (12) corresponding one to one with the mounting ear plates (24), and the mounting columns (12) and the corresponding mounting ear plates (24) are connected via fasteners.

8. A double-sided water-cooled power module of a hybrid material according to claim 6, It is characterized in that The first bottom plate (21) is provided with a plurality of positioning ear plates (25), and the mounting housing (1) is provided with positioning posts (13) corresponding one-to-one to the positioning ear plates (25).

9. The double-sided water-cooled power module of a hybrid material according to claim 1, It is characterized in that The second heat sink (3) comprises a second bottom plate (31), a second cover plate (32), and second heat sink fins (33) arranged between the second bottom plate (31) and the second cover plate (32); The second base plate (31) is directly opposite to the power chip (5), and the second cover plate (32) is installed on a side of the second base plate (31) facing away from the power chip (5); The clip (4) is covered on the second cover plate (32).

10. The double-sided water-cooled power module of a hybrid material according to claim 1, It is characterized in that In the same heat sink, the materials of the base plate, cover plate and heat sink fins are not completely the same.

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