Spin coating device and method for glass coating

Abstract

The invention relates to the field of glass coating production equipment, in particular to a spin coating device and method for glass coating, which comprises a control base, a machine cover is fixed above the control base, one side of the machine cover is provided with a vacuumizing pipe for vacuumizing the interior of the machine cover and an exhaust pipe for vacuumizing the interior of the machine cover, and the other side of the machine cover is provided with a vacuum pump for vacuumizing the interior of the machine cover. Through cooperation of the IR film coating mechanism, the AR film coating mechanism and the lnk spin coating mechanism, IR film coating is conducted on a wafer firstly, then AR face bottoming film coating is conducted, the light transmittance and imaging quality of a final product are further optimized, IR film coating is conducted on the wafer firstly, then AR face bottoming film coating is conducted, then lnk spin coating is conducted, and finally AR film coating is conducted. The optical performance can be improved, the film coating adhesive force can be enhanced, the technological process can be optimized, the product performance can be improved, the production efficiency can be improved, the cost can be reduced, the product reliability can be enhanced, and the probability of chromatic dispersion and high-temperature-resistant phenomena in the baking process can be reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of glass coating production equipment, and in particular relates to a spin coating device and method for glass coating. Background Art

[0002] When processing glass wafers, in order to improve the mechanical properties of the glass wafers, the surface of the glass wafers needs to be coated. Currently, glass wafer coating on the market is usually applied on the glass wafer by spin coating, and then cured at high temperature to form a layer of anti-reflection and anti-reflection film on the glass surface.

[0003] For example, the patent application number is 201610153175.5, which discloses a method for coating glass wafers, which mainly includes the following steps: 1] glass wafer cleaning; 2] glass wafer drying; 3] glass wafer coating; the dried glass wafer is sent into the coating chamber and fixed on the coating plate of the spin coater, and volatile steam is introduced into the coating chamber. When the volatile steam in the entire coating chamber reaches saturation, the spin coater speed is adjusted to 500rpm, and the coating liquid is dripped into the center of the coating plate, and then the spin coater speed is gradually increased to 2000-5000rpm. The coating liquid is evenly spread on the glass wafer to complete the preliminary coating; wherein, the solvent of the coating liquid is the same as the volatile steam; 4] low temperature curing; 5] high temperature curing. The invention can effectively solve the problem of uneven coating caused by the volatilization of organic volatile components in the coating liquid before the coating is completed. At the same time, the coating process is simple, easy to operate, and low in cost, which can effectively reduce the coating cost.

[0004] However, when coating the glass wafer as mentioned above, due to the matching problems between the film materials and between the film materials and the substrate, the thermal stability of the coating material at high temperature is insufficient, and dispersion and high temperature resistance may occur during the baking process, thereby affecting the coating quality of the glass wafer. Therefore, we need to propose a spin coating device and method for glass coating to solve the above-mentioned problems, so that it can effectively improve the high temperature resistance of the coating material. Summary of the invention

[0005] In view of the above problems, the present invention provides a spin coating device for glass coating, comprising a control base, a hood is fixed above the control base, a vacuum pipe for evacuating the hood and an exhaust pipe for exhausting the hood are arranged on one side of the hood, a sealing door is installed on the other side of the hood, a loading assembly for loading wafers is installed inside the hood, wafers are movably placed inside the loading assembly, rotatable clamping assemblies are installed at both ends of the loading assembly, an IR coating mechanism for IR coating the wafers and an AR coating mechanism for AR coating the wafers are installed below the loading assembly, and an lnk spin coating mechanism for lnk spin coating the wafers is installed above the loading assembly; the IR coating mechanism heats the IR coating material to the evaporation temperature by electron beam heating or resistance heating, and the evaporated IR coating material is transferred to the wafer surface in a high vacuum environment and uniformly deposited to form a thin film;

[0006] The AR coating mechanism bombards the target material with high-energy argon ions, sputtering the target material atoms to the wafer surface for deposition to form an AR base layer; the lnk spin coating mechanism coats the lnk material on the wafer surface, and then bakes and solidifies it to form a stable film.

[0007] Furthermore, the loading assembly includes two grid seats arranged in a semicircle, the two grid seats can be combined into a hollow barrel structure, and the openings of the grid seats are inclined. A first electric push rod is installed on the arcuate surface of the grid seat, and the seat body of the first electric push rod is inclinedly installed with the inner wall of the machine cover through a triangular block, and the opposite sides of the grid seat are provided with clearance holes for the clamping assembly to clamp the wafer.

[0008] Furthermore, the clamping assembly includes two second electric push rods symmetrically fixed on the inner wall of the hood, and the piston rod end of the second electric push rod is equipped with a connecting seat, one end of one of the connecting seats is rotatably connected to an insert block, and a rotary motor is installed inside the other connecting seat, the output shaft of the rotary motor passes through one side of the connecting seat and is rotatably connected to the connecting seat, and an insert block is also installed on the output shaft of the rotary motor, and a rubber gasket for contacting the wafer is fixed at one end of the insert block.

[0009] Furthermore, the IR coating mechanism includes a first paint box that uses electron beam heating or resistance heating, the upper end of the first paint box is connected to a connecting pipe, one end of the connecting pipe is equipped with an atomizing nozzle, the connecting pipe is installed on the upper end of the first paint box through an angle adjustment mechanism, the other side of the first paint box is connected to a feed pipe, and the feed pipe is located directly below the loading assembly.

[0010] Furthermore, the AR coating mechanism includes a second paint box for storing bombardment targets, a spray tube with an adjustable spray angle is installed at the upper end of the second paint box, a spray head is installed at one end of the spray tube, and two second support blocks are fixed to the upper end of the second paint box, and both sides of the spray tube are rotatably connected to the second support blocks through round rods, and one of the round rods is installed with a second motor.

[0011] Furthermore, the lnk spin-coating mechanism includes a U-shaped seat and a liquid adding mechanism installed on the U-shaped seat, the upper end of the U-shaped seat is fixed to the inner top of the hood through a third electric push rod, and the U-shaped seats on both sides of the third electric push rod are connected to the inner top of the hood through telescopic rods, a roller is rotatably installed inside the U-shaped seat, a plurality of coating rollers with sponge material surfaces are equidistantly arranged around the roller, mounting grooves for mounting a plurality of coating rollers are arranged around the roller, the coating rollers are detachably mounted inside the mounting grooves through a connecting mechanism, and one end of the roller is driven by a stepping motor.

[0012] Furthermore, the connecting mechanism includes a rotating block rotatably installed at both ends of the mounting groove, a T-shaped square rod is slidably inserted inside the rotating block, a mounting seat is fixed at one end of the T-shaped square rod, and rectangular rods are fixed at both ends of the coating roller. The mounting seat is provided with mounting holes for movably inserting the rectangular rods, and a reset spring is sleeved on the T-shaped square rod located between the mounting seat and the rotating block.

[0013] Furthermore, a rotating shaft is fixed at both ends of the drum, one end of the rotating shaft is rotatably connected to the U-shaped seat, and one end of one of the rotating shafts passes through one side of the U-shaped seat and is connected to the output shaft of the stepper motor.

[0014] Furthermore, the liquid adding mechanism includes a main pipe, which is connected to a plurality of drippers, and the plurality of drippers are equidistantly fixed on the top of the U-shaped seat, and the liquid outlet end of the dripper is in conflict with the coating roller close to the dripper. The U-shaped seat is provided with a limiting groove for installing the main pipe, and one end of the main pipe is connected to a storage barrel storing lnk material through a pump.

[0015] Based on the above-described spin coating device for glass coating, the present invention also provides a spin coating method for glass coating, comprising the following steps:

[0016] S1, placing the wafer to be spin-coated on the loading assembly, and fixing the wafer inside the machine cover through the loading assembly;

[0017] S2, close the sealing door, evacuate the inside of the machine cover to make it in a vacuum state, start the IR coating mechanism, and perform IR coating on the wafer;

[0018] S3, after the IR coating of the wafer is completed, the wafer is cooled to room temperature, and then the wafer is clamped by a clamping assembly and driven to rotate;

[0019] S3, start the AR coating mechanism, bombard the target material with high-energy argon ions, and sputter the target atoms onto the wafer surface to form an AR base layer;

[0020] S4, after the AR base layer is prepared and the wafer cools to room temperature, the lnk coating mechanism is started to perform spin coating to solidify the lnk material to form a stable film;

[0021] S5. When the stabilization film treatment is completed and the wafer cools to room temperature, the AR coating mechanism is started to perform AR coating on the wafer again. After the coating is completed, the wafer is cooled to room temperature and then taken out.

[0022] The beneficial effects of the present invention are:

[0023] 1. The present invention cooperates with an IR coating mechanism, an AR coating mechanism and an lnk spin coating mechanism to first perform IR coating on the wafer and then perform AR surface primer coating, which helps to further optimize the light transmittance and imaging quality of the final product. The process of first performing IR coating on the wafer, then performing AR surface primer coating, then performing lnk spin coating, and finally performing AR coating can not only improve the optical performance, enhance the coating adhesion, optimize the process flow, and improve the product performance, but also improve the production efficiency and reduce the cost, enhance the product reliability, and reduce the probability of dispersion and high temperature resistance during baking.

[0024] 2. The present invention can perform lnk spin coating on the wafer by setting up the lnk spin coating mechanism, and at the same time, the coating roller opposite to the coating roller is added with liquid by the liquid adding mechanism, so that the coating operation can be carried out continuously, thereby improving the operation efficiency.

[0025] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of the structure of an embodiment of the present invention is shown;

[0028] Figure 2 A schematic cross-sectional structure diagram according to an embodiment of the present invention is shown;

[0029] Figure 3 A schematic diagram of a side cross-sectional structure according to an embodiment of the present invention is shown;

[0030] Figure 4 A schematic structural diagram of a feeding assembly according to an embodiment of the present invention is shown;

[0031] Figure 5 It shows a schematic structural diagram of an IR coating mechanism according to an embodiment of the present invention;

[0032] Figure 6 It shows a schematic structural diagram of an AR coating mechanism according to an embodiment of the present invention;

[0033] Figure 7 A schematic diagram of the structure of an lnk spin coating mechanism according to an embodiment of the present invention is shown;

[0034] Figure 8 A schematic structural diagram of a connecting mechanism according to an embodiment of the present invention is shown.

[0035] In the figure: 1, machine cover; 2, vacuum tube; 3, exhaust pipe; 4, control base; 5, touch screen; 6, control switch panel; 7, sealing door; 8, feeding assembly; 81, grid seat; 82, first electric push rod; 83, clearance hole; 84, triangular block; 9, clamping assembly; 91, second electric push rod; 92, connecting seat; 93, plug block; 10, IR coating mechanism; 101, first paint box; 102, feeding pipe; 103, first support block; 104, first motor; 105, connecting pipe; 106, atomizing nozzle; 11, AR coating mechanism; 111, first Second paint box; 112, second support block; 113, spray pipe; 114, spray head; 115, plug cover; 12, lnk spin coating mechanism; 121, U-shaped seat; 122, third electric push rod; 123, telescopic rod; 124, drum; 125, coating roller; 126, connecting mechanism; 1261, rotating block; 1262, return spring; 1263, T-shaped square rod; 1264, mounting seat; 1265, mounting hole; 1266, rectangular rod; 127, rotating shaft; 128, stepping motor; 129, main pipe; 1210, dripper; 1211, mounting groove. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] The embodiment of the present invention provides a spin coating device for glass coating, such as Figure 1-8 As shown, it includes a control base 4, a hood 1 is fixed above the control base 4, a vacuum pipe 2 for evacuating the hood 1 and an exhaust pipe 3 for exhausting the hood 1 are arranged on one side of the hood 1, a sealing door 7 is installed on the other side of the hood 1, a loading assembly 8 for loading wafers is installed inside the hood 1, wafers are movably placed inside the loading assembly 8, rotatable clamping assemblies 9 are installed at both ends of the loading assembly 8, an IR coating mechanism 10 for IR coating the wafers and an AR coating mechanism 11 for AR coating the wafers are installed below the loading assembly 8, and an lnk spin coating mechanism 12 for lnk spin coating the wafers is installed above the loading assembly 8; the IR coating mechanism 10 heats the IR coating material to the evaporation temperature by electron beam heating or resistance heating, and the evaporated IR coating material is transferred to the wafer surface in a high vacuum environment and uniformly deposited to form a thin film;

[0038] A touch screen 5 is installed on one side of the control base 4, and a control switch panel 6 is installed on one side of the touch screen 5. A plurality of control switches are installed on the control switch panel 6, so as to operate the wafer to perform different coating operations through the plurality of control switches.

[0039] The AR coating mechanism 11 bombards the target material with high-energy argon ions, sputtering the target atoms to the wafer surface for deposition to form an AR base layer; the lnk spin coating mechanism 12 coats the lnk material on the wafer surface, and then bakes and solidifies it to form a stable film.

[0040] The loading assembly 8 includes two semicircular grid seats 81, which can be combined into a hollow barrel structure, and the opening of the grid seat 81 is inclined. The arc surface of the grid seat 81 is installed with a first electric push rod 82, and the seat body of the first electric push rod 82 is inclinedly installed with the inner wall of the hood 1 through a triangular block 84. The opposite sides of the grid seat 81 are provided with a clearance hole 83 for the clamping assembly 9 to clamp the wafer. The grid seat 81 is driven by the first electric push rod 82 to move relatively to clamp and fix the wafer. This grid seat 81 can be arranged horizontally or vertically according to the wafer placement requirements, such as Figure 2 The grid seat 81 is shown as being arranged horizontally and is used to clamp the end face of the wafer. When the side face of the wafer needs to be clamped, the grid seat 81 needs to be designed vertically.

[0041] The clamping assembly 9 includes two second electric push rods 91 symmetrically fixed on the inner wall of the hood 1, and a connecting seat 92 is installed at the piston rod end of the second electric push rod 91, one end of one of the connecting seats 92 is rotatably connected to an insert block 93, and a rotary motor is installed inside the other connecting seat 92, and the output shaft of the rotary motor passes through one side of the connecting seat 92 and is rotatably connected to the connecting seat 92, and an insert block 93 is also installed on the output shaft of the rotary motor, and a rubber gasket for contacting with the wafer is fixed at one end of the insert block 93, so that the rotary motor drives the connecting seat 92 and the wafer to rotate, and the two insert blocks 93 are driven to move relative to each other by the second electric push rod 91, and the wafer is clamped and fixed by the relative clamping force of the two insert blocks 93.

[0042] The IR coating mechanism 10 includes a first coating box 101 that uses electron beam heating or resistance heating. The upper end of the first coating box 101 is connected to a connecting pipe 105, one end of the connecting pipe 105 is installed with an atomizing nozzle 106, and the connecting pipe 105 is installed at the upper end of the first coating box 101 through an angle adjustment mechanism. The other side of the first coating box 101 is connected to a feeding pipe 102, and the feeding pipe 102 is located directly below the loading component 8. The IR plating solution to be sprayed is added to the interior of the first coating box 101 through the feeding pipe 102, and then the IR plating solution in the first coating box 101 is heated and evaporated by electron beam heating or resistance heating. The evaporated coating is sprayed from the atomizing nozzle 106 through the connecting pipe 105 and contacts the surface of the wafer to perform IR coating on the wafer.

[0043] The angle adjustment mechanism includes two first support blocks 103, and both sides of the connecting pipe 105 are rotatably connected to the first support blocks 103 through a connecting shaft, and a first motor 104 is installed at one end of the connecting shaft. The other end of the connecting pipe 105 is connected to the first paint box 101 through a hose. The connecting shaft is driven to rotate by the first motor 104, so that the connecting pipe 105 can rotate around the connecting shaft as the axis, thereby adjusting the spray position of the atomizing nozzle 106.

[0044] The AR coating mechanism 11 includes a second coating box 111 for storing bombardment targets, a spray pipe 113 with an adjustable spray angle is installed at the upper end of the second coating box 111, a spray head 114 is installed at one end of the spray pipe 113, and two second support blocks 112 are fixed to the upper end of the second coating box 111. Both sides of the spray pipe 113 are rotatably connected to the second support blocks 112 through round rods, one of the round rods is installed with a second motor, and the second motor drives the spray pipe 113 to rotate around the round rod through the round rod, so that the spray pipe 113 can drive the spray head 114 to adjust the spray direction, thereby facilitating the spraying of the target material in the second coating box 111 through the spray head 114, and then contacting the wafer surface, so that the target material can form a thin film on the wafer surface.

[0045] The upper end of the second coating box 111 is provided with a target material inlet, and a plug cover 115 is installed at the target material inlet. The plug cover 115 can be removed to facilitate adding the target material into the second coating box 111.

[0046] The lnk spin coating mechanism 12 includes a U-shaped seat 121 and a liquid adding mechanism installed on the U-shaped seat 121, the upper end of the U-shaped seat 121 is fixed to the inner top of the hood 1 through a third electric push rod 122, and the U-shaped seat 121 located on both sides of the third electric push rod 122 is connected to the inner top of the hood 1 through a telescopic rod 123, a drum 124 is rotatably installed inside the U-shaped seat 121, and a plurality of coating rollers 125 with a sponge surface are equidistantly arranged around the drum 124, and a mounting groove 1211 for mounting a plurality of coating rollers 125 is arranged around the drum 124, and the coating rollers 124 are provided with a plurality of mounting grooves 1211 for mounting the coating rollers 125. 125 is detachably mounted inside the mounting groove 1211 through a connecting mechanism 126, and one end of the drum 124 is driven by a stepper motor 128, which drives the drum 124 to rotate inside the U-shaped seat 121, so that the drum 124 drives the coating rollers 125 at different positions to contact the material loading barrel, and the paint on the coating roller 125 passes through the grid holes into the interior of the material loading barrel and contacts the wafer in the material loading barrel to perform lnk spin coating on the wafer, and at the same time, liquid is added to the coating roller 125 opposite to the coated coating roller 125 through a liquid adding mechanism, so that the coating operation can be carried out continuously, thereby improving the operation efficiency.

[0047] The connecting mechanism 126 includes a rotating block 1261 rotatably mounted at both ends of the mounting groove 1211, a T-shaped square rod 1263 is slidably inserted inside the rotating block 1261, a mounting seat 1264 is fixed at one end of the T-shaped square rod 1263, and rectangular rods 1266 are fixed at both ends of the coating roller 125. The mounting seat 1264 is provided with a mounting hole 1265 for the rectangular rod 1266 to be movably inserted, and a return spring 1262 is sleeved on the T-shaped square rod 1263 located between the mounting seat 1264 and the rotating block 1261. During installation, the rectangular rod 1266 at one end of the coating roller 125 is inserted into the mounting hole 1265, and then the mounting seat 1264 is pushed to make the mounting seat 1264 push the return spring 1262 to be compressed, and then the rectangular rod 1266 at the other end of the coating roller 125 is inserted into the mounting hole 1265 at the other end, and the coating roller 125 is loosened. The resilience of the return spring 1262 is used to drive the mounting seats 1264 at both ends to provide clamping force relative to each other, so that the coating roller 125 can be detachably clamped and fixed in the mounting groove 1211, which is convenient for regular replacement of the coating roller 125 and improves the coating quality;

[0048] A rotating shaft 127 is fixed at both ends of the drum 124, one end of the rotating shaft 127 is rotatably connected to the U-shaped seat 121, and one end of one of the rotating shafts 127 passes through one side of the U-shaped seat 121 and is connected to the output shaft of the stepper motor 128, so that the drum 124 can be driven to rotate by the stepper motor 128.

[0049] The liquid adding mechanism includes a main pipe 129, to which a plurality of drippers 1210 are connected. The plurality of drippers 1210 are fixed at equal intervals on the top of a U-shaped seat 121, and the liquid outlet end of the dripper 1210 is in conflict with a coating roller 125 close to the dripper 1210. A limiting groove for installing the main pipe 129 is provided on the U-shaped seat 121. One end of the main pipe 129 is connected to a storage barrel for storing lnk material through a pump, so as to facilitate adding the lnk material to the coating roller 125.

[0050] By performing IR coating and AR surface primer coating before AR coating, better adhesion can be provided for ink spin coating, thereby improving the adhesion of the final coating layer. Lower surface roughness helps to improve the uniformity and optical performance of the coating layer, so polishing is usually required before coating. AR coating deposits one or more layers of thin film materials with specific optical properties on the surface of the optical element to reduce the reflection loss of light and improve the transmittance and optical performance. The main goal of AR coating is to reduce the reflection of light at the interface, thereby increasing the light intensity passing through the optical element. Performing IR coating on the wafer first and then AR surface primer coating on the wafer can help further optimize the transmittance and imaging quality of the final product. The process of first performing IR coating on the wafer, then AR surface primer coating, then lnk spin coating, and finally AR coating can not only improve optical performance, enhance coating adhesion, optimize process flow, and improve product performance, but also improve production efficiency and reduce costs, enhance product reliability, and reduce the probability of dispersion and high temperature resistance during baking.

[0051] Based on the above-described spin coating device for glass coating, the present invention also provides a spin coating method for glass coating, comprising the following steps:

[0052] S1, placing the wafer to be spin-coated on the loading assembly 8, and fixing the wafer inside the hood 1 through the loading assembly 8;

[0053] S2, close the sealing door 7, and evacuate the inside of the machine cover 1 to make the inside of the machine cover 1 in a vacuum state, start the IR coating mechanism 10, and perform IR coating on the wafer;

[0054] S3, after the wafer IR coating is completed, the wafer is cooled to room temperature, and then the wafer is clamped by the clamping assembly 9, and the wafer is driven to rotate;

[0055] S3, starting the AR coating mechanism 11, bombarding the target material with high-energy argon ions, and sputtering the target material atoms onto the wafer surface to form an AR bottom layer;

[0056] S4, after the AR base layer is prepared and the wafer cools to room temperature, the lnk coating mechanism is started to perform spin coating to solidify the lnk material to form a stable film;

[0057] S5. When the stabilization film treatment is completed and the wafer cools to room temperature, the AR coating mechanism 11 is started to perform AR coating on the wafer again. After the coating is completed, the wafer is cooled to room temperature and then taken out.

[0058] During AR coating and lnk coating, the wafer needs to be rotated by the clamping mechanism to improve the uniformity of wafer spin coating. The process of first IR coating, then AR surface primer coating, then lnk spin coating, and finally AR coating can not only improve optical performance, enhance coating adhesion, optimize process flow, and improve product performance, but also improve production efficiency and reduce costs, enhance product reliability, and expand product application range. These advantages work together to make this process flow have significant comprehensive advantages in wafer spin coating, providing a solid process foundation for the manufacture of high-performance optical devices.

[0059] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A spin coating device for glass coating, Features: The invention comprises a control base (4), a hood (1) is fixed above the control base (4), a vacuum pipe (2) for vacuuming the hood (1) and an exhaust pipe (3) for exhausting the vacuum in the hood (1) are arranged on one side of the hood (1), a sealing door (7) is installed on the other side of the hood (1), a loading assembly (8) for loading wafers is installed inside the hood (1), wafers are movably placed inside the loading assembly (8), rotating clamping assemblies (9) are installed at both ends of the loading assembly (8), an IR coating mechanism (10) for IR coating the wafers and an AR coating mechanism (11) for AR coating the wafers are installed below the loading assembly (8), and an lnk spin coating mechanism (12) for lnk spin coating the wafers is installed above the loading assembly (8).

2. A spin coating device for glass coating according to claim 1, Features: The loading assembly (8) comprises two semicircular grid seats (81), the two grid seats (81) can be combined into a hollow cylindrical structure, and the opening of the grid seat (81) is inclined, and the arc surface of the grid seat (81) is installed with a first electric push rod (82), and the seat body of the first electric push rod (82) is inclinedly installed with the inner wall of the machine cover (1) through a triangular block (84), and the grid seat (81) is provided with a clearance hole (83) on the opposite sides for the clamping assembly (9) to clamp the wafer.

3. A spin coating device for glass coating according to claim 2, Features: The clamping assembly (9) includes two second electric push rods (91) symmetrically fixed on the inner wall of the hood (1), and the piston rod end of the second electric push rod (91) is installed with a connecting seat (92), one end of one of the connecting seats (92) is rotatably connected to an insert block (93), and a rotary motor is installed inside the other connecting seat (92), the output shaft of the rotary motor passes through one side of the connecting seat (92) and is rotatably connected to the connecting seat (92), and an insert block (93) is also installed on the output shaft of the rotary motor, and a rubber gasket for contacting the wafer is fixed at one end of the insert block (93).

4. A spin coating device for glass coating according to claim 3, Features: The IR coating mechanism (10) comprises a first coating box (101) which adopts electron beam heating or resistance heating, the upper end of the first coating box (101) is connected with a connecting pipe (105), one end of the connecting pipe (105) is installed with an atomizing nozzle (106), the connecting pipe (105) is installed on the upper end of the first coating box (101) through an angle adjustment mechanism, the other side of the first coating box (101) is connected with a feeding pipe (102), and the feeding pipe (102) is located directly below the loading assembly (8).

5. A spin coating device for glass coating according to claim 4, Features: The AR coating mechanism (11) comprises a second coating box (111) for storing bombardment target materials, a spray pipe (113) with an adjustable spray angle is installed at the upper end of the second coating box (111), a spray head (114) is installed at one end of the spray pipe (113), two second support blocks (112) are fixed at the upper end of the second coating box (111), two sides of the spray pipe (113) are rotatably connected to the second support blocks (112) through round rods, and one of the round rods is installed with a second motor.

6. A spin coating device for glass coating according to claim 5, Features: The lnk spin coating mechanism (12) comprises a U-shaped seat (121) and a liquid adding mechanism installed on the U-shaped seat (121); the upper end of the U-shaped seat (121) is fixed to the inner top of the hood (1) through a third electric push rod (122); and the U-shaped seat (121) located on both sides of the third electric push rod (122) is connected to the inner top of the hood (1) through a telescopic rod (123); a roller (124) is rotatably installed inside the U-shaped seat (121); a plurality of coating rollers (125) whose surfaces are made of sponge material are equidistantly arranged around the roller (124); a mounting groove (1211) for mounting the plurality of coating rollers (125) is arranged around the roller (124); the coating roller (125) is detachably mounted inside the mounting groove (1211) through a connecting mechanism (126); and one end of the roller (124) is driven by a stepping motor (128).

7. A spin coating device for glass coating according to claim 6, Features: The connecting mechanism (126) comprises a rotating block (1261) rotatably mounted at both ends of the mounting groove (1211); a T-shaped square rod (1263) is slidably inserted inside the rotating block (1261); a mounting seat (1264) is fixed at one end of the T-shaped square rod (1263); rectangular rods (1266) are fixed at both ends of the coating roller (125); a mounting hole (1265) for movably inserting the rectangular rod (1266) is provided on the mounting seat (1264); and a return spring (1262) is sleeved on the T-shaped square rod (1263) located between the mounting seat (1264) and the rotating block (1261).

8. A spin coating device for glass coating according to claim 7, Features: A rotating shaft (127) is fixed at both ends of the drum (124), one end of the rotating shaft (127) is rotatably connected to the U-shaped seat (121), and one end of one of the rotating shafts (127) passes through one side of the U-shaped seat (121) and is connected to the output shaft of the stepping motor (128).

9. A spin coating device for glass coating according to claim 8, Features: The liquid adding mechanism comprises a main pipe (129), the main pipe (129) is connected to a plurality of drippers (1210), the plurality of drippers (1210) are fixed at equal intervals on the top of a U-shaped seat (121), and the liquid outlet ends of the drippers (1210) are in contact with a coating roller (125) close to the drippers (1210), the U-shaped seat (121) is provided with a limiting groove for installing the main pipe (129), and one end of the main pipe (129) is connected to a storage barrel storing lnk material through a pump.

10. A spin coating method for glass coating, based on a spin coating device for glass coating according to any one of claims 1 to 9, Features: The steps include: S1, placing the wafer to be spin-coated on the loading assembly, and fixing the wafer inside the machine cover through the loading assembly; S2, close the sealing door, evacuate the inside of the machine cover to make it in a vacuum state, start the IR coating mechanism, and perform IR coating on the wafer; S3, after the IR coating of the wafer is completed, the wafer is cooled to room temperature, and then the wafer is clamped by a clamping assembly and driven to rotate; S3, start the AR coating mechanism, bombard the target material with high-energy argon ions, and sputter the target atoms onto the wafer surface to form an AR base layer; S4, after the AR base layer is prepared and the wafer cools to room temperature, the lnk coating mechanism is started to perform spin coating to solidify the lnk material to form a stable film; S5. When the stabilization film treatment is completed and the wafer cools to room temperature, the AR coating mechanism is started to perform AR coating on the wafer again. After the coating is completed, the wafer is cooled to room temperature and then taken out.

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