Glass substrate cutting device for light-emitting panel

Abstract

The invention relates to the technical field of light-emitting panel machining devices, and discloses a light-emitting panel glass substrate cutting device which comprises a machining table, one end of the interior of the machining table is fixedly connected with a first circular clamping sleeve, the interior of the first circular clamping sleeve is movably connected with a first disc in a sleeved mode, and the interior of the first disc is fixedly connected with a support. A sliding rod is movably connected into the support in a sleeved mode, and a positioning frame is installed on the upper portion of the side face of the machining table. According to the glass substrate cutting device of the light-emitting panel, a substrate is placed on the upper portion of the suction cup, meanwhile, the suction cup adsorbs the lower portion of the substrate, meanwhile, the inclined supporting columns face different directions, the inclined supporting columns control the suction cup to drive the substrate to be extruded and limited in different directions, and it is ensured that the substrate moves to the middle position; and when pressure is applied to the outside of the substrate in different directions, the stability of the substrate during positioning can be guaranteed, and the situation that the cutting precision of the substrate is affected after the position of the substrate deviates due to the fact that the pressure is generated during substrate cutting is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of light-emitting panel processing devices, and in particular to a glass substrate cutting device for a light-emitting panel. Background Art

[0002] The light-emitting panel is an organic light-emitting diode, which is a relatively new type of display suitable for televisions, smart phones and computer monitors. The conventional one is a glass substrate. In order to facilitate the installation and use of the glass substrate, the glass substrate needs to be cut. At the same time, in order to ensure the accuracy of cutting, a laser cutting device is used to cut the substrate.

[0003] Usually, in a cutting device, the outside of the substrate can be cut by placing the substrate on a cutting platform, adjusting the cutting position of the laser cutting device, and controlling the cutting trajectory of the cutting device. Common laser cutting devices use a robotic arm or a slide rail to drive the cutting device to move along a specific trajectory, resulting in a relatively simple adjustment process of the cutting position and cutting angle of the cutting device. During the substrate cutting process, it is necessary to cut at different angles on the side of the substrate, but the cutting device is affected by the robotic arm and can only cut from a single direction, resulting in the inability to cut the side of the substrate that is tilted and rotated at a certain angle. The substrate placement position needs to be re-planned before cutting can continue, which affects the cutting efficiency of the substrate. So far, we have proposed a glass substrate cutting device for a light-emitting panel. Summary of the invention

[0004] In view of the shortcomings of the existing glass substrate cutting device for light-emitting panels, the present invention provides a glass substrate cutting device for light-emitting panels, which has the advantages of changing the angle of the bracket and the laser cutting device and doubly adjusting the cutting inclination angle, that is, increasing the cutting direction of the cutting device, making it convenient for the cutting device to cut from different directions, thereby solving the problems raised in the above-mentioned background technology.

[0005] The present invention provides the following technical solution: a glass substrate cutting device for a light-emitting panel, comprising a processing table, a first circular sleeve fixedly connected to one end of the processing table, a first circular sleeve movably sleeved with a first disc inside, a bracket fixedly connected to the inside of the first disc, a sliding rod movably sleeved with the inside of the bracket, a positioning frame installed on the upper part of the side of the processing table, a second lead screw installed on the side of the positioning frame, a side mounting plate installed on the external thread of the second lead screw, a third lead screw installed on the inside of the side of the side mounting plate, and a first connecting plate sleeved with the external thread of the third lead screw.

[0006] Preferably, a collecting box is fixedly connected to the lower end of the processing table, a cavity is provided inside the collecting box, and a water outlet is provided at the lower part of one end of the collecting box.

[0007] Preferably, the first disc is circular, and the bracket remains parallel to the upper part of the processing table.

[0008] Preferably, a hole is provided inside the bracket, and a cooling liquid delivery device is installed outside the device.

[0009] Preferably, the sliding rod has an internal movable sleeve with a placement seat, a motor is installed at the lower end of the sliding rod, an upper end of the placement seat is fixedly connected to an oblique support column, a suction cup is fixedly connected to the top of the oblique support column, the oblique support column is in an inclined state, and a substrate is placed on the upper part of the suction cup.

[0010] Preferably, first screws are installed on both sides of the lower end of the bracket, a slide groove is opened in the middle of the bracket, the slide rod is movably sleeved inside the slide groove, and the first screw and the lower end of the slide rod are meshed and connected with each other.

[0011] Preferably, a motor is installed at one end of the second lead screw, and two sides of the side mounting plate are movably sleeved on the inner side of the positioning frame.

[0012] Preferably, a second circular sleeve is fixedly connected to the inner side of the first connecting plate, a second circular sleeve is movably sleeved with a second disc inside, a second connecting plate is fixedly connected to one side of the lower part of the second disc, a fourth lead screw is movably sleeved with the inner side of the second connecting plate, an external thread of the fourth lead screw is sleeved with a base, and the second disc is circular.

[0013] Preferably, a limit plate is installed in the middle of the base, a laser cutting device is arranged on the inner side of the limit plate, a cavity is opened inside the base, and the upper end of the laser cutting device extends into the cavity.

[0014] Compared with the existing glass substrate cutting device for light-emitting panels, the present invention has the following beneficial effects: 1. The glass substrate cutting device of the light-emitting panel places the substrate on the upper part of the suction cup, and the suction cup adsorbs the lower part of the substrate. At the same time, the oblique support columns are oriented in different directions. The oblique support columns control the suction cup to drive the substrate from different directions for extrusion and limitation, ensuring that the substrate moves to the center position. When the substrate is subjected to pressure in different directions outside, the stability of the substrate positioning can be guaranteed, avoiding pressure generated during substrate cutting, resulting in the displacement of the substrate position, and affecting the cutting accuracy of the substrate.

[0015] 2. The glass substrate cutting device of the light-emitting panel adjusts the cutting angle by flipping the angle of the first disk and adjusting the angle of the laser cutting device inside the limiting plate. This ensures that the outside of the substrate can be cut in different directions during the cutting process, avoiding a single cutting angle that affects the cutting accuracy.

[0016] 3. The glass substrate cutting device of the light-emitting panel can perform circular motion by rotating the second disc, and at the same time, after the position of the base outside the fourth screw is adjusted, that is, when cutting the outside of the substrate, cutting can be performed at different angles, thereby improving the convenience of adjusting the cutting position. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the main structure of the present invention; Figure 2 It is a schematic diagram of the cross-sectional structure of the main body of the present invention; Figure 3 It is a front view structural schematic diagram of the present invention; Figure 4 It is a side view structural schematic diagram of the present invention; Figure 5 It is a schematic diagram of the position adjustment structure of the cutting device of the present invention; Figure 6 It is a schematic diagram of the enlarged structure of point A of the present invention.

[0018] In the figure: 1. processing table; 2. collecting box; 3. first circular jacket; 4. first disc; 5. bracket; 6. first lead screw; 7. sliding rod; 8. placement seat; 9. motor 1; 10. oblique support column; 11. suction cup; 12. positioning frame; 13. second lead screw; 14. side mounting plate; 15. third lead screw; 16. first connecting plate; 17. second circular jacket; 18. second disc; 19. second connecting plate; 20. fourth lead screw; 21. base; 22. limit plate; 23. laser cutting device. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6A glass substrate cutting device for a light-emitting panel comprises a processing table 1, a first circular jacket 3 is fixedly connected to one end of the processing table 1, a first circular jacket 3 is movably sleeved with a first disc 4, a bracket 5 is fixedly connected to the inside of the first disc 4, a slide bar 7 is movably sleeved with the inside of the bracket 5, a positioning frame 12 is installed on the upper part of the side of the processing table 1, a second lead screw 13 is installed on the side of the positioning frame 12, a side mounting plate 14 is installed on the external thread of the second lead screw 13, a third lead screw 15 is installed on the inside of the side of the side mounting plate 14, and a first connecting plate 16 is sleeved on the external thread of the third lead screw 15.

[0021] See also Figure 1 A collecting box 2 is fixedly connected to the lower end of the processing table 1, and a cavity is opened inside the collecting box 2. At the same time, a water outlet is provided at the lower part of one end of the collecting box 2. The collecting box 2 is arranged at the lower end of the processing table 1, and a cavity is formed inside the collecting box 2. When the cutting equipment cuts the substrate, liquid is sprayed on the outside of the substrate, that is, the collecting box 2 can absorb and process the liquid.

[0022] See also Figure 2 The first disc 4 is circular, and the bracket 5 is kept parallel to the upper part of the processing table 1. The first disc 4 is movably sleeved inside the first circular clamping sleeve 3, and the angle of the first disc 4 is rotated to adjust, that is, the bracket 5 is arranged on the inner side of the first disc 4. By rotating and adjusting the bracket 5, the angle of the clamped substrate can be regulated to improve the convenience of adjusting the substrate angle.

[0023] See also Figure 1 The bracket 5 has holes inside, and a cooling liquid delivery device is installed outside the device. The bracket 5 has holes inside, and the condensed liquid can be sprayed on the substrate during the substrate cutting process, so as to cool the cutting position. At the same time, the bracket 5 has holes inside, and the liquid can be discharged through the holes during the circulation process.

[0024] See also Figure 6 The sliding rod 7 is movably sleeved with a placement seat 8, and a motor 9 is installed at the lower end of the sliding rod 7. The upper end of the placement seat 8 is fixedly connected with an oblique support column 10, and the top of the oblique support column 10 is fixedly connected with a suction cup 11. The oblique support column 10 is in an inclined state, and a substrate is placed on the upper part of the suction cup 11. By placing the substrate on the upper part of the oblique support column 10, and the suction cup 11 is installed on the upper part of the oblique support column 10, the suction cup 11 can attract the lower part of the substrate, and at the same time, the oblique support columns 10 are all facing the center area at the upper part of the placement seat 8, that is, after the substrate is placed on the upper part of the suction cup 11, the oblique support columns 10 are placed obliquely, that is, the oblique support columns 10 can squeeze and limit the position of the substrate to improve the stability of the substrate during positioning.

[0025] See also Figure 6 A first lead screw 6 is installed on both sides of the lower end of the bracket 5, a sliding groove is opened in the middle of the bracket 5, and the sliding rod 7 is movably sleeved inside the sliding groove. The first lead screw 6 and the lower end of the sliding rod 7 are meshed and connected with each other. The sliding groove is opened inside the bracket 5, and the sliding rod 7 is sleeved inside the sliding groove. The first lead screw 6 is rotated, and the first lead screw 6 and the sliding rod 7 move in a threaded manner with each other, that is, during the rotation of the first lead screw 6, the position of the sliding rod 7 inside the bracket 5 can be pushed to adjust.

[0026] See also Figure 4 A motor is installed at one end of the second lead screw 13, and both sides of the side mounting plate 14 are movably sleeved on the inner side of the positioning frame 12. By starting the motor installed at one end of the second lead screw 13, the motor controls the rotation of the second lead screw 13, that is, the second lead screw 13 and the side mounting plate 14 perform threaded movement. At this point, the height of the side mounting plate 14 at the upper end of the positioning frame 12 is adjusted, and the height of the cutting device can be adjusted.

[0027] See also Figure 5 A second circular jacket 17 is fixedly connected to the inner side of the first connecting plate 16, and a second disc 18 is movably sleeved inside the second circular jacket 17. A second connecting plate 19 is fixedly connected to one side of the lower part of the second disc 18. A fourth lead screw 20 is movably sleeved inside the second connecting plate 19, and a base 21 is sleeved on the outer thread of the fourth lead screw 20. The second disc 18 is circular. By rotating the third lead screw 15, the third lead screw 15 drives the first connecting plate 16 to adjust the position of the upper end of the processing table 1 left and right. By rotating the second disc 18 at the same time, the angle of the laser cutting device 23 can be adjusted. By adjusting the position of the base 21 outside the fourth lead screw 20 at the same time, the cutting device can be controlled to move to different areas on the substrate, so as to facilitate the control of the cutting device to cut different positions on the upper end of the substrate.

[0028] See also Figure 5 A limiting plate 22 is installed in the middle of the base 21, and a laser cutting device 23 is arranged on the inner side of the limiting plate 22. A cavity is opened inside the base 21, and the upper end of the laser cutting device 23 extends into the cavity. The angle of the laser cutting device 23 inside the limiting plate 22 is adjusted, that is, the cutting angle of the laser cutting device 23 can be adjusted to improve the laser cutting device 23 to cut the substrate at different inclination angles.

[0029] Working principle: When in use, the substrate is placed on the upper part of the suction cup 11, and the suction cup 11 limits the position of the substrate, and the oblique support column 10 extends inward from different directions at the bottom of the substrate, that is, to ensure that the substrate maintains stability when positioned at the upper end of the suction cup 11. At the same time, according to the different cutting directions and angles of the substrate, the first disc 4 can be flipped or the angle of the laser cutting device 23 inside the limiting plate 22 can be adjusted. By adjusting the angle in a double manner, the convenience of angle adjustment is improved. At the same time, the first lead screw 6 is started to drive the position of the substrate on the upper part of the bracket 5 to be adjusted, and the angle of the second circular jacket 17 and the position of the base 21 outside the fourth lead screw 20 are adjusted to ensure the convenience of adjusting the cutting orientation. The laser cutting device 23 is started, and the laser cutting device 23 emits a laser. At the same time, the second lead screw 13 is rotated, and the second lead screw 13 drives the height of the side mounting plate 14 to be adjusted. The laser cutting height is adjusted, and the laser is controlled to move in different trajectories to cut the outside of the substrate.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A glass substrate cutting device for a light-emitting panel, comprising a processing table (1), wherein one end of the processing table (1) is fixedly connected to a first circular jacket (3), and a first disc (4) is movably sleeved inside the first circular jacket (3), characterized in that: The first disc (4) is fixedly connected to a bracket (5) inside, and a slide rod (7) is movably sleeved inside the bracket (5). A positioning frame (12) is installed on the upper part of the side of the processing table (1), and a second screw (13) is installed on the side of the positioning frame (12). The external thread of the second screw (13) is installed with a side mounting plate (14), and the internal part of the side of the side mounting plate (14) is installed with a third screw (15), and the external thread of the third screw (15) is sleeved with a first connecting plate (16).

2. The glass substrate cutting device for a light emitting panel according to claim 1, characterized in that: The lower end of the processing table (1) is fixedly connected to a collecting box (2), a cavity is provided inside the collecting box (2), and a water outlet is provided at the lower part of one end of the collecting box (2).

3. The glass substrate cutting device for a light emitting panel according to claim 1, characterized in that: The first disc (4) is circular, and the bracket (5) remains parallel to the upper part of the processing table (1).

4. The glass substrate cutting device for a light emitting panel according to claim 1, characterized in that: The bracket (5) is provided with a hole inside, and a cooling liquid conveying device is installed outside the device.

5. The glass substrate cutting device for a light emitting panel according to claim 1, characterized in that: The slide bar (7) is internally movably sleeved with a placement seat (8), the lower end of the slide bar (7) is mounted with a motor 1 (9), the upper end of the placement seat (8) is fixedly connected with an oblique support column (10), the top end of the oblique support column (10) is fixedly connected with a suction cup (11), the oblique support column (10) is in an inclined state, and a substrate is placed on the upper part of the suction cup (11).

6. The glass substrate cutting device for a light emitting panel according to claim 1, characterized in that: First lead screws (6) are installed on both sides of the lower end of the bracket (5), a slide groove is opened in the middle of the bracket (5), the slide rod (7) is movably sleeved inside the slide groove, and the first lead screw (6) and the lower end of the slide rod (7) are meshed and connected with each other.

7. The glass substrate cutting device for a light emitting panel according to claim 1, characterized in that: A motor is mounted on one end of the second lead screw (13), and two sides of the side mounting plate (14) are movably sleeved on the inner side of the positioning frame (12).

8. The glass substrate cutting device for a light emitting panel according to claim 1, characterized in that: A second circular jacket (17) is fixedly connected to the inner side of the first connecting plate (16), a second circular jacket (17) is movably sleeved with a second circular disc (18) inside, a second connecting plate (19) is fixedly connected to one side of the lower part of the second circular disc (18), a fourth lead screw (20) is movably sleeved inside the second connecting plate (19), an external thread of the fourth lead screw (20) is sleeved with a base (21), and the second circular disc (18) is circular.

9. The glass substrate cutting device for a light emitting panel according to claim 1, characterized in that: A limit plate (22) is installed in the middle of the base (21), a laser cutting device (23) is arranged on the inner side of the limit plate (22), a cavity is opened inside the base (21), and the upper end of the laser cutting device (23) extends into the cavity.

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