Wafer lens automatic assembling machine and assembling method thereof

Abstract

The invention relates to the technical field of lens assembly, in particular to a wafer lens automatic assembly machine and an assembly method thereof. A front linear module and a rear linear module are arranged on a movement mechanism; a front taking and placing mechanism is fixed on the front linear module; a rear taking and placing mechanism is arranged on the rear linear module; the tray transplanting mechanism is used for taking out the full trays from the stock bin and putting the empty trays into the stock bin; the front pick-and-place mechanism comprises a pick-and-place material fixing plate; the material taking clamping jaw module is used for conveying the shell Y on the material disc transplanting mechanism to an assembling station; the suction pen is used for loading the wafer lens X of the glue disc displacement mechanism into the shell Y; and the rotary suction pen is used for tightening the locking ring Z on the shell Y. When the lens assembling device is used, the lens assembling efficiency can be improved, the labor intensity can be reduced, and the lens assembling quality can be more stable.

Description

Technical Field

[0001] The present invention relates to the technical field of lens assembly, and in particular to an automatic wafer lens assembly machine and an assembly method thereof. Background Art

[0002] The lens assembly consists of a wafer lens X, a housing Y, and a locking ring Z. During the lens assembly process, the housing Y is first placed on the fixture and fixed manually; then a wafer lens X is taken out with tweezers and placed into the housing Y for positioning; the glue gun is moved to the top of the lens for glue dispensing, and finally the locking ring Z is tightened on the housing Y. This lens assembly method is labor-intensive and inefficient. In addition, the lens assembly quality is unstable. Summary of the invention

[0003] The purpose of the present invention is to provide a wafer lens automatic assembly machine and an assembly method thereof in view of the defects and shortcomings of the prior art.

[0004] To achieve the above object, the technical solution adopted by the present invention is: The present invention discloses an automatic wafer lens assembly machine, comprising a chassis; a material tray transfer mechanism, a material bin, an assembly station, a motion mechanism, a lens ejection mechanism and a rubber tray displacement mechanism are fixed on the chassis; The motion mechanism is provided with a front linear module and a rear linear module; the front linear module is fixed with a front pick-and-place mechanism; the rear linear module is provided with a rear pick-and-place mechanism; the tray transplanting mechanism is used to take out a full tray from the silo and put an empty tray into the silo; The front pick-and-place mechanism includes a pick-and-place fixing plate; a dispensing head, a material picking claw module, a suction pen and a rotating suction pen are arranged on the pick-and-place fixing plate; The material picking claw module is used to transport the shell Y on the material tray transfer mechanism to the assembly station; the suction pen is used to load the wafer lens X of the rubber tray displacement mechanism into the shell Y; the rotating suction pen is used to tighten the locking ring Z on the shell Y.

[0005] Furthermore, a lens flipping mechanism is provided between the assembly station and the rubber disc displacement mechanism; The lens flipping mechanism comprises a swing rod and a sliding plate; a rotating assembly and a nozzle fixing plate are fixed on the sliding plate; the swing rod is connected to the rotating assembly; The rotating assembly is used to drive the swing arm to swing; the swing arm and the nozzle fixing plate are both fixed with lens nozzles; the lens nozzle on the swing arm is the first nozzle; the lens nozzle on the nozzle fixing plate is the second nozzle; the second nozzle is arranged on the movement path of the first nozzle.

[0006] Furthermore, a flip fixing seat is fixed on the chassis; the sliding plate is slidably connected to the flip fixing seat; and a micrometer head is connected between the sliding plate and the flip fixing seat.

[0007] Furthermore, the assembly station includes an assembly sliding frame and an assembly linear module for driving the assembly sliding frame to slide; the assembly sliding frame is provided with an assembly rotating component; the assembly rotating component is connected to a clamping component; the clamping toe of the clamping component is connected to a shell clamping block; the dispensing head is arranged above the movement path of the clamping component.

[0008] Furthermore, the rubber disc displacement mechanism includes a rubber disc moving linear module and a rubber disc moving seat connected to the rubber disc moving linear module; a rubber disc is fixed on the rubber disc moving seat; A lens ejection mechanism is provided below the front pick-up and placement mechanism; the rubber disc displacement mechanism is provided between the lens ejection mechanism and the front pick-up and placement mechanism; The lens ejection mechanism includes an ejector pin moving linear module, an ejector pin fixing seat connected to the ejector pin moving linear module, and an ejector pin lifting cylinder connected to the ejector pin fixing seat at one end; an ejector pin is fixed to the other end of the ejector pin lifting cylinder; the movement direction of the rubber disc moving linear module and the movement direction of the ejector pin moving linear module are arranged perpendicular to each other.

[0009] Furthermore, a slide is provided on the ejector moving linear module; the ejector fixing seat is slidably connected to the slide; and a differential head is provided between the slide and the ejector fixing seat.

[0010] Furthermore, a UV irradiation lamp is fixed on the chassis.

[0011] An assembly method for a wafer lens automatic assembly machine comprises the following steps: 1. Put a lens cut into multiple wafer lenses X by laser into a plastic tray and send it under the UV irradiation lamp through the rear pick-and-place mechanism for illumination, and then send the plastic tray into the plastic tray moving seat for fixation; 2. The material picking claw module and the rotary suction pen on the front pick-and-place mechanism take out a shell Y and a locking ring Z from the tray transfer mechanism respectively; 3. The suction pen on the front pick-and-place mechanism sucks a wafer lens X from the plastic tray to the lower visual mechanism for inspection. If the direction of the wafer lens X is detected to be inconsistent with the setting, the suction pen is placed in the lens flipping mechanism for flipping, and the suction pen then re-adsorbs and fixes the flipped wafer lens X to complete the positioning of the wafer lens X on the suction pen; 4. The material picking claw module first puts the shell Y into the assembly station, and then puts the wafer lens X positioned on the suction pen in the step into the inside of the shell Y; 5. The dispensing head discharges glue, and at the same time, the assembly station drives the housing Y and the wafer lens X inside the housing Y to rotate synchronously, so that the dispensing head discharges glue to form an annular sealing line inside the housing Y; 6. The assembly station transports the shell Y and wafer lens X that have been glued to the bottom of the UV lamp for light curing; 7. Rotate the suction pen to screw the threaded locking ring Z into the outer shell Y after the glue is light-cured in step 1; 8. The material picking claw module places the lens assembled in the step into the empty tray of the tray transfer mechanism.

[0012] After adopting the above structure, the beneficial effects of the present invention are as follows: the front linear module drives the front pick-and-place mechanism to move, the material picking claw module clamps and fixes the shell Y, and then the suction pen is rotated to adsorb and fix the locking ring Z; first, the shell Y is placed in the assembly station for clamping and positioning; the suction pen takes out a wafer lens X from the glue plate displacement mechanism and puts it on the shell Y in the assembly station, and the glue dispensing head dispenses glue to the gap between the wafer lens X and the shell Y; finally, the suction pen is rotated to screw the locking ring Z to the outside of the shell Y; the structure can assemble and dispense glue to the wafer lens X, the shell Y and the locking ring Z, which can not only improve the lens assembly efficiency and reduce the labor intensity, but also make the lens assembly quality more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a structural diagram of the front pick-and-place mechanism; Figure 3 It is a structural diagram of the lens flipping mechanism; Figure 4 It is a structural diagram of the assembly station; Figure 5 yes Figure 4 A magnified view of the M part; Figure 6 It is a structural diagram of the rear pick-and-place mechanism; Figure 7 It is the front view after the front pick-and-place mechanism, the rubber plate displacement mechanism and the lens ejection mechanism are combined; Figure 8 yes Figure 7 Magnified view of the O part in the figure; Fig. 9 It is a top view of the front pick-and-place mechanism, the rubber disc displacement mechanism and the lens ejection mechanism after being combined; Fig.10 It is a structural diagram of the lens ejection mechanism; Fig.11 It is the structural diagram of the rubber disc displacement mechanism; Fig.12 is a cross-sectional view of the lens assembly; Description of reference numerals: A, front pick-and-place mechanism; A1, dispensing head; A2, material picking claw module; A3, suction pen; A4, rotating suction pen; A5, material loading and unloading fixed plate; B, lens flipping mechanism; B1, lens suction nozzle; B2, flipping fixing seat; B3, swing rod; B4, rotating assembly; B5, micrometer head; B6, nozzle fixing plate; B601, strip hole; B7, sliding plate; C, lower vision mechanism; D, lens positioning mechanism; E, tray transplanting mechanism; F, silo; G, chassis; H, UV irradiation lamp; I, ​​assembly station; I1, assembly linear module; I2, assemble the rotating assembly; I3, assemble the sliding frame; I4, U-shaped photoelectric sensor; I5, sensor sheet; I6, clamping assembly; I7, housing clamping block; J, lens ejection mechanism; J1, ejector moving linear module; J101, slide table; J2, micrometer head; J3, ejector fixing seat; J4, ejector; J5, ejector lifting cylinder; K, rubber disc displacement mechanism; K1, rubber disc moving linear module; K2, rubber disc moving seat; K201, countersunk hole of movable seat; K3, forward push cylinder; K4, rubber plate; K5, rubber plate fixing frame; K6, glue plate cylinder; L, rear pick-and-place mechanism; N, motion mechanism; X, wafer lens; Y, housing; Z, locking ring. DETAILED DESCRIPTION

[0014] The present invention will be further described below in conjunction with the accompanying drawings.

[0015] like Figure 1 As shown, the wafer lens automatic assembly machine described in the present invention comprises a chassis G; the chassis G is fixed with a material tray transfer mechanism E, a material bin F, an assembly station I, a motion mechanism N, a lens ejection mechanism J and a rubber tray displacement mechanism K; The motion mechanism N is provided with a front linear module and a rear linear module; the front linear module is fixed with a front pick-and-place mechanism A; the rear linear module is provided with a rear pick-and-place mechanism L; the tray transplanting mechanism E is used to take out a full tray from the bin F and put an empty tray into the bin F; The front pick-and-place mechanism A includes a pick-and-place fixing plate A5; the pick-and-place fixing plate A5 is provided with a dispensing head A1, a pick-and-place clamping module A2, a suction pen A3 and a rotating suction pen A4; The material taking gripper module A2 is used to transport the housing Y on the tray transfer mechanism E to the assembly station I; the suction pen A3 is used to load the wafer lens X of the rubber tray displacement mechanism K into the housing Y; the rotating suction pen A4 is used to tighten the locking ring Z on the housing Y; The silo F can automatically stack the trays; the tray transfer mechanism E can take and place the trays inside the silo F. The silo F and the tray transfer mechanism E are essentially the same as those in the prior art, so they will not be described in detail. The motion mechanism N is composed of a crossbeam and a front linear module and a rear linear module fixed on the crossbeam; A lower visual mechanism C is provided on the chassis G. The lower visual mechanism C is a photographing device for acquiring images on the dispensing head A1, the material taking gripper module A2, the suction pen A3 and the rotating suction pen A4, detecting whether there is material and whether the direction of the material is consistent with the setting; The front linear module and the rear linear module are both linear modules that can move independently of each other. The rear pick-and-place mechanism L is a suction cup manipulator, which is used to transport the rubber disc to the rubber disc displacement mechanism K; the material picking claw module A2 is a pneumatic claw mechanism, which is used to clamp and fix the shell Y; the rotating suction pen A4 has no essential difference from the prior art, so it is not described in detail, and can absorb the workpiece and drive the workpiece to rotate; The front linear module drives the front pick-and-place mechanism A to move, the material picking claw module A2 clamps and fixes the shell Y, and then the suction pen A4 is rotated to absorb and fix the locking ring Z; first, the shell Y is placed in the assembly station I for clamping and positioning; the suction pen A3 takes out a wafer lens X from the glue plate displacement mechanism K and puts it on the shell Y in the assembly station I, and the glue head A1 glues the gap between the wafer lens X and the shell Y; finally, the suction pen A4 is rotated to screw the locking ring Z to the outside of the shell Y; this structure can assemble and glue the wafer lens X, the shell Y and the locking ring Z, which can not only improve the lens assembly efficiency and reduce labor intensity, but also make the lens assembly quality more stable.

[0016] As a preferred embodiment of the present invention, a lens flipping mechanism B is provided between the assembly station I and the rubber plate displacement mechanism K; The lens flipping mechanism B includes a swing rod B3 and a sliding plate B7; a rotating assembly B4 and a nozzle fixing plate B6 are fixed on the sliding plate B7; the swing rod B3 is connected to the rotating assembly B4; The rotating assembly B4 is used to drive the swing rod B3 to swing; the swing rod B3 and the nozzle fixing plate B6 are both fixed with a lens nozzle B1; the lens nozzle B1 on the swing rod B3 is a first nozzle; the lens nozzle B1 on the nozzle fixing plate B6 is a second nozzle; the second nozzle is arranged on the movement path of the first nozzle; The lens suction nozzle B1 is essentially the same as the existing suction nozzle mechanism, so it is not described in detail. The position for sucking the product in the lens suction nozzle B1 is made of a cylindrical silicone material, which can reduce the impact of the wafer lens X. After the wafer lens X is turned over, it is centered by the lens positioning mechanism D. The lens positioning mechanism D is a clamping claw cylinder, and a fixture is provided on the clamping toe of the clamping claw cylinder. The wafer lens X is clamped by the fixture so that the wafer lens X is centered. After the wafer lens X waiting to be flipped is placed on the first suction nozzle on the swing bar B3, the wafer lens X is adsorbed and fixed by the first suction nozzle, and then the rotating component B4 drives the swing bar B3 to rotate, so that the first suction nozzle and the wafer lens X are flipped 180 degrees together; after the end of the wafer lens X away from the first suction nozzle is attached to the second suction nozzle, the second suction nozzle adsorbs the wafer lens X, and the first suction nozzle releases the wafer lens X, waiting for the material placement and fetching mechanism to fetch the material; in this structure, the flipping structure and the two suction nozzles cooperate in adsorption and placement, which can reduce the damage on the surface of the wafer lens X and ensure the yield of the product.

[0017] The rotating assembly B4 is any one of a rotating cylinder and a motor. The nozzle fixing plate B6 is provided with a plurality of strip holes B601; the strip holes B601 are arranged parallel to each other; the sliding plate B7 is provided with a plurality of threaded holes; each of the strip holes B601 is provided with a head bolt; the head bolt passes through the strip hole B601 and is threadedly connected with the threaded hole; the head of the head bolt fixes the nozzle fixing plate B6 on the sliding plate B7; after loosening the head bolt, the nozzle fixing plate B6 can slide along the length direction of the strip hole B601 to adjust the position of the nozzle fixing plate B6 and the second nozzle; so that after the first nozzle is flipped into place, the first nozzle, the second nozzle and the wafer lens X are coaxial; to prevent the wafer lens X from falling when the first nozzle is handed over to the second nozzle.

[0018] As a preferred embodiment of the present invention, a flip fixing seat B2 is fixed on the chassis G; the sliding plate B7 is slidably connected to the flip fixing seat B2; a differential head B5 is connected between the sliding plate B7 and the flip fixing seat B2; the differential head B5 is essentially no different from the prior art, so it is not described in detail; the two ends of the differential head B5 are respectively connected to the flip fixing seat B2 and the sliding plate B7; the differential head B5 can perform telescopic movement, and the overall position of the sliding plate B7 on the flip fixing seat B2 can be adjusted by rotating the differential head B5, so that the positions of the two lens suction nozzles B1 can be aligned with the material placing and taking mechanism simultaneously.

[0019] As a preferred embodiment of the present invention, the assembly station I includes an assembly slide frame I3 and an assembly linear module I1 for driving the assembly slide frame I3 to slide; the assembly slide frame I3 is provided with an assembly rotating assembly I2; the assembly rotating assembly I2 is connected with a clamping assembly I6; the clamping toe of the clamping assembly I6 is connected with a shell clamping block I7; the dispensing head A1 is arranged above the movement path of the clamping assembly I6; The dispensing head A1 is essentially the same as the prior art, so it is not described in detail. The dispensing head A1 can dispense glue; the assembled linear module I1 is a linear module, which is essentially the same as the prior art, so it is not described in detail; After the clamping component I6 is actuated, the housing with the wafer lens is clamped and positioned in the center by the housing clamping block I7; then the assembled linear module I1 drives the assembled sliding frame I3 to move to the bottom of the dispensing head A1; while the dispensing head A1 is dispensing glue, the installed rotating component I2 drives the housing on the clamping component I6 to rotate, so that the dispensing head A1 pours a circle of glue on the wafer lens; in this structure, a circle of uniform glue can be wrapped around the wafer lens, which can not only enhance the bonding force between the wafer lens and the housing, but also form an annular sealing structure to enhance the waterproof effect of the product; the clamping component I6 is a three-claw cylinder; the number of the housing clamping blocks I7 is three; the three housing clamping blocks I7 are respectively fixed on the three clamping toes of the three-claw cylinder; the installed rotating component I2 is a motor and a rotary Any one of the rotating cylinders; a U-shaped photoelectric sensor I4 is fixed on the rotating component I2; a sensor sheet I5 is fixed on the clamping component I6; the sensor sheet I5 is a shielding sheet, which is essentially the same as the prior art, so it is not described in detail; when the clamping component I6 rotates, the sensor sheet I5 will trigger the U-shaped photoelectric sensor I4. When the U-shaped photoelectric sensor I4 generates an electrical signal, it is immediately transmitted to the control circuit, causing the dispensing head A1 and the rotating component I2 to stop moving; and the current stop position is the initial position of the next dispensing product. This structure can make each product rotate exactly one circle, and the glue dispensing head A1's glue discharge demand is fed back according to the electrical signal of the U-shaped photoelectric sensor I4, so that the thickness of the glue of each product in a whole circle is more uniform.

[0020] As a preferred embodiment of the present invention, the adhesive plate displacement mechanism K comprises an adhesive plate moving linear module K1, and an adhesive plate moving seat K2 connected to the adhesive plate moving linear module K1; an adhesive plate K4 is fixed on the adhesive plate moving seat K2; A lens ejection mechanism J is provided below the front pick-up and placement mechanism A; the rubber plate displacement mechanism K is provided between the lens ejection mechanism J and the front pick-up and placement mechanism A; The lens ejection mechanism J includes an ejector pin moving linear module J1, an ejector pin fixing seat J3 connected to the ejector pin moving linear module J1, and an ejector pin lifting cylinder J5 having one end connected to the ejector pin fixing seat J3; an ejector pin J4 is fixed to the other end of the ejector pin lifting cylinder J5; the movement direction of the rubber disc moving linear module K1 and the movement direction of the ejector pin moving linear module J1 are arranged perpendicular to each other.

[0021] The ejector moving linear module J1 and the rubber plate moving linear module K1 are both linear modules, which are essentially the same as the prior art, so they are not described in detail; the ejector moving linear module J1 and the rubber plate moving linear module K1 can move horizontally and vertically respectively; The large wafer lens is cut into multiple wafer lenses X and loaded onto the rubber tray K4; then the rubber tray moving linear module K1 drives the rubber tray moving seat K2 to transport the large wafer lens to the bottom of the suction pen A3 of the front pick-and-place mechanism A; the ejector pin moving linear module J1 on the lens ejection mechanism J adjusts the position of the ejector pin J4 so that the ejector pin J4 is aligned with the wafer lens X to be taken out; the ejector pin lifting cylinder J5 drives the ejector pin J4 to push up the corresponding wafer lens X, so that the wafer lens X overcomes the resistance of the adjacent lenses and rises. When the wafer lens X and the adjacent lenses are displaced to a certain extent in the height direction, the friction between the wafer lens X to be taken and the adjacent lenses is reduced, making it easier to take out the target wafer lens X, reducing the probability of the suction pen A3 being empty. Improve the feeding efficiency; at least one moving seat countersunk hole K201 is provided on the rubber disc moving seat K2; a rubber disc fixing frame K5 is fixed on the outside of the rubber disc K4; the rubber disc fixing frame K5 is embedded in the countersunk hole of the moving seat countersunk hole K201; a rubber disc pressing mechanism for pressing the rubber disc fixing frame K5 in the moving seat countersunk hole K201 is provided on the rubber disc moving seat K2; the soft rubber disc K4 is fixedly positioned in the moving seat countersunk hole K201 by the rubber disc fixing frame K5, so that the wafer lens is positioned on the rubber disc displacement mechanism K; the rubber disc K4 is a UV anti-viscosity protective film, and when the UV anti-viscosity protective film is lifted and squeezed, the position in contact with the ejector pin J4 can undergo plastic deformation, and be lifted to a certain height together with the ejector pin J4. The rubber disc pressing mechanism is composed of multiple pressing modules; the pressing modules are distributed in a circle on the countersunk hole K201 of the moving seat; the pressing module is composed of a forward push cylinder K3 and a rubber disc pressing cylinder K6; one end of the forward push cylinder K3 is fixed on the rubber disc moving seat K2; the other end of the forward push cylinder K3 is fixed on one end of the rubber disc pressing cylinder K6; the forward push cylinder K3 is used to drive the rubber disc pressing cylinder K6 to perform translational movement, so that before the rubber disc K4 is placed in, the rubber disc pressing cylinder K6 moves to a position where it does not hinder the rubber disc K4 from being placed in the countersunk hole K201 of the moving seat; after the rubber disc K4 is placed in the countersunk hole K201 of the moving seat, the forward push cylinder K3 drives the rubber disc pressing cylinder K6 to move above the rubber disc fixing frame K5, and then the rubber disc pressing cylinder K6 descends to press the rubber disc K4 on the countersunk hole K201 of the moving seat.

[0022] As a preferred embodiment of the present invention, a slide J101 is arranged on the ejector moving linear module J1; the ejector fixing seat J3 is slidably connected to the slide J101; a differential head J2 is arranged between the slide J101 and the ejector fixing seat J3; the differential head J2 has no essential difference from the prior art, so it is not described in detail; the movement direction of the ejector fixing seat J3 adjusted by the differential head J2 is perpendicular to the movement direction of the ejector moving linear module J1; the ejector moving linear module J1 can drive the slide J101 to perform translational movement; after the differential head J2 rotates, it can drive the ejector fixing seat J3 to move relative to the slide J101, and the center position of the ejector J4 can be fine-tuned to be coaxial with the target lens through the differential head J2.

[0023] As a preferred embodiment of the present invention, a UV irradiation lamp H is fixed on the chassis G; after the gap between the wafer lens X and the housing Y is glued, the UV irradiation lamp H is irradiated to enable the glue to be quickly cured; in addition, since the wafer lens X is glued to the surface of the glue disc K4, the glue disc K4 is a UV anti-adhesive protective film, and a UV adhesive film is applied on the surface of the film to dissolve the glue; after the UV anti-adhesive protective film is illuminated by the UV irradiation lamp H, the adhesion between the glue and the wafer lens X is reduced, and the UV anti-adhesive protective film is essentially no different from the prior art, so it is not described in detail.

[0024] Before placing the adhesive disc fixing frame K into the adhesive disc moving seat K2, the rear pick-and-place mechanism L moves the adhesive disc moving seat K2 to the UV irradiation lamp H for irradiation, which can weaken the adhesive force of the adhesive disc K4 surface on the wafer lens X, making the wafer lens X easier to be grasped by the suction pen A3.

[0025] An assembly method for a wafer lens automatic assembly machine comprises the following steps: 1. Put a lens cut into multiple wafer lenses X by laser into the plastic tray K4 and send it under the UV irradiation lamp H through the rear pick-and-place mechanism L for illumination, and then send the plastic tray K4 into the plastic tray moving seat K2 for fixation; 2. The material picking claw module A2 and the rotary suction pen A4 on the front pick-and-place mechanism take out a shell Y and a locking ring Z from the tray transfer mechanism E respectively; 3. The suction pen A3 on the front pick-and-place mechanism sucks a wafer lens X from the rubber plate K4 to the lower visual mechanism C for inspection. If the direction of the wafer lens X is inconsistent with the setting, the suction pen A3 is placed in the lens flipping mechanism B for flipping. The suction pen A3 then adsorbs and fixes the flipped wafer lens X again, completing the positioning of the wafer lens X on the suction pen A3. 4. The material picking claw module A2 first places the housing Y on the assembly station I, and then places the wafer lens X positioned on the suction pen A3 in step 3 into the housing Y; 5. The dispensing head A1 dispenses glue, and at the same time, the assembly station I drives the housing Y and the wafer lens X in the housing Y to rotate synchronously, so that the dispensing head A1 dispenses glue to form an annular sealing line inside the housing Y; 6. Assembly station I transports the shell Y and wafer lens X that have been glued in step 5 to the bottom of the UV lamp H for light curing; 7. Rotate the suction pen A4 to screw the threaded locking ring Z into the outer shell Y after the glue is light-cured in step 6; 8. The material picking claw module A2 places the lens assembled in step 7 into the empty tray of the tray transfer mechanism E.

[0026] The above description is only a preferred embodiment of the present invention, so all equivalent changes or modifications made according to the structure, characteristics and principles described in the scope of the patent application of the present invention are included in the scope of the patent application of the present invention.

Claims

1. A wafer lens automatic assembly machine, characterized in that: It comprises a chassis (G); a material tray transfer mechanism (E), a material bin (F), an assembly station (I), a movement mechanism (N), a lens ejection mechanism (J) and a rubber tray displacement mechanism (K) are fixed on the chassis (G); The motion mechanism (N) is provided with a front linear module and a rear linear module; the front linear module is fixed with a front pick-up and placement mechanism (A); the rear linear module is provided with a rear pick-up and placement mechanism (L); the tray transplanting mechanism (E) is used to take out a full tray from the silo (F) and put an empty tray into the silo (F); The front pick-and-place mechanism (A) comprises a pick-and-place fixing plate (A5); a glue dispensing head (A1), a pick-and-place clamping claw module (A2), a suction pen (A3) and a rotating suction pen (A4) are arranged on the pick-and-place fixing plate (A5); The material picking claw module (A2) is used to transport the outer shell (Y) on the material tray transfer mechanism (E) to the assembly station (I); the suction pen (A3) is used to load the wafer lens (X) of the rubber tray displacement mechanism (K) into the outer shell (Y); the rotating suction pen (A4) is used to tighten the locking ring (Z) on the outer shell (Y).

2. The wafer lens automatic assembly machine according to claim 1, characterized in that: A lens flipping mechanism (B) is provided between the assembly station (I) and the rubber plate displacement mechanism (K); The lens flipping mechanism (B) comprises a swing rod (B3) and a sliding plate (B7); a rotating assembly (B4) and a suction nozzle fixing plate (B6) are fixed on the sliding plate (B7); the swing rod (B3) is connected to the rotating assembly (B4); The rotating assembly (B4) is used to drive the swing rod (B3) to swing; a lens suction nozzle (B1) is fixed on both the swing rod (B3) and the suction nozzle fixing plate (B6); the lens suction nozzle (B1) on the swing rod (B3) is a first suction nozzle; the lens suction nozzle (B1) on the suction nozzle fixing plate (B6) is a second suction nozzle; and the second suction nozzle is arranged on the movement path of the first suction nozzle.

3. The wafer lens automatic assembly machine according to claim 2, characterized in that: A flip fixing seat (B2) is fixed on the chassis (G); the sliding plate (B7) is slidably connected to the flip fixing seat (B2); and a differential head (B5) is connected between the sliding plate (B7) and the flip fixing seat (B2).

4. The wafer lens automatic assembly machine according to claim 1, characterized in that: The assembly station (I) comprises an assembly sliding frame (I3) and an assembly linear module (I1) for driving the assembly sliding frame (I3) to slide; an assembly rotating component (I2) is arranged on the assembly sliding frame (I3); a clamping component (I6) is connected to the assembly rotating component (I2); a housing clamping block (I7) is connected to the clamping toe of the clamping component (I6); and the dispensing head (A1) is arranged above the movement path of the clamping component (I6).

5. The wafer lens automatic assembly machine according to claim 1, characterized in that: The glue plate displacement mechanism (K) comprises a glue plate moving linear module (K1) and a glue plate moving seat (K2) connected to the glue plate moving linear module (K1); a glue plate (K4) is fixed on the glue plate moving seat (K2); A lens ejection mechanism (J) is provided below the front pick-up and placement mechanism (A); the rubber plate displacement mechanism (K) is provided between the lens ejection mechanism (J) and the front pick-up and placement mechanism (A); The lens ejection mechanism (J) comprises an ejector pin moving linear module (J1), an ejector pin fixing seat (J3) connected to the ejector pin moving linear module (J1), and an ejector pin lifting cylinder (J5) having one end connected to the ejector pin fixing seat (J3); an ejector pin (J4) is fixed to the other end of the ejector pin lifting cylinder (J5); and the movement direction of the rubber plate moving linear module (K1) and the movement direction of the ejector pin moving linear module (J1) are arranged perpendicular to each other.

6. The wafer lens automatic assembly machine according to claim 5, characterized in that: A slide table (J101) is arranged on the ejector moving linear module (J1); the ejector fixing seat (J3) is slidably connected to the slide table (J101); and a differential head (J2) is arranged between the slide table (J101) and the ejector fixing seat (J3).

7. The wafer lens automatic assembly machine according to claim 1, characterized in that: A UV irradiation lamp (H) is fixed on the chassis (G).

8. The assembly method of the wafer lens automatic assembly machine according to any one of claims 1 to 7, characterized in that: The steps include: (1) A lens cut into multiple wafer lenses (X) by laser is placed on a plastic tray (K4) and then sent to the bottom of a UV irradiation lamp (H) for illumination by a rear pick-and-place mechanism (L), and then the plastic tray (K4) is sent to the plastic tray moving seat (K2) for fixation; (2) The material picking claw module (A2) and the rotary suction pen (A4) on the front pick-and-place mechanism respectively take out a shell (Y) and a locking ring (Z) from the tray transfer mechanism (E); (3) The suction pen (A3) on the front pick-and-place mechanism sucks a wafer lens (X) from the rubber tray (K4) to the lower visual mechanism (C) for inspection. If the direction of the wafer lens (X) is detected to be inconsistent with the set direction, the suction pen (A3) is placed in the lens flipping mechanism (B) for flipping. The suction pen (A3) then re-adsorbs and fixes the flipped wafer lens (X) to complete the positioning of the wafer lens (X) on the suction pen (A3); (4) The material picking claw module (A2) first places the housing (Y) on the assembly station (I), and then places the wafer lens (X) positioned on the suction pen (A3) in step 3 into the housing (Y); (5) The dispensing head (A1) dispenses glue, and at the same time, the assembly station (I) drives the housing (Y) and the wafer lens (X) inside the housing (Y) to rotate synchronously, so that the glue dispensed by the dispensing head (A1) forms an annular sealing line inside the housing (Y); (6) The assembly station (I) transports the housing (Y) and the wafer lens (X) that have been glued in step 5 to the bottom of the UV irradiation lamp (H) for light curing; (7) Rotate the suction pen (A4) to screw the threaded locking ring (Z) into the housing (Y) after the glue is light-cured in step 6; (8) The material picking claw module (A2) places the lens assembled in step 7 into the empty tray of the tray transfer mechanism (E).

Images