Device for testing performance of GPU (Graphics Processing Unit) chip

Abstract

The invention discloses a device for GPU chip performance testing, and the device comprises a rack which comprises a lower supporting plate and an upper supporting plate which are fixedly connected through a longitudinal guide shaft, and a middle supporting plate which is slidably connected to the longitudinal guide shaft; the lifting driving mechanism is connected between the lower supporting plate and the middle supporting plate and used for driving the middle supporting plate to do lifting motion; the drawer type carrying table is connected to the middle supporting plate in a sliding mode, the drawer type carrying table is connected with a testing carrying plate, and the testing carrying plate is provided with a chip testing groove used for containing a GPU chip; the water-cooling temperature control assembly comprises a pressing water-cooling head in which cooling liquid flows, the pressing water-cooling head is connected to the upper supporting plate and is arranged opposite to the chip testing groove, and a heat exchange plate is arranged on the side, facing the chip testing groove, of the pressing water-cooling head. According to the device, the temperature of the GPU chip is controlled in a liquid cooling mode through the pressing water cooling head, the temperature control precision is high, quick response can be achieved, the accuracy of a test result and the test efficiency are improved, and the cost is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic device detection, and in particular relates to a device for GPU chip performance testing. Background Art

[0002] GPU (Graphics Processing Unit) testing plays an important role in performance evaluation, hardware verification, optimization and tuning, compatibility testing, and R&D debugging. It can help users understand and utilize the performance potential of GPU chips, and provide reliable hardware and optimization solutions. Therefore, in the production process of GPU chips, performance testing of GPU chips is required.

[0003] When conducting GPU chip performance testing, chip temperature is an important factor that needs to be controlled, as it directly affects the stability of the GPU chip and the accuracy of the test results. At present, the industry mainly uses air cooling to control temperature when conducting GPU chip performance testing. However, due to the rapid improvement in the power and performance of GPU chips in recent years, two or three cooling fans are generally required to control the temperature of a chip. The air-cooled temperature control method: on the one hand, the temperature control accuracy is low and the noise is high, which cannot ensure that the performance test process of the GPU chip is carried out in a stable temperature environment, affecting the accuracy of the test results; on the other hand, due to the limited space around the GPU chip test slot in the test device, it is difficult to install more cooling fans, and multiple GPU chips cannot be tested in parallel at the same time, resulting in low test efficiency. Summary of the invention

[0004] In view of the problems existing in the prior art, the present invention provides a device for GPU chip performance testing to solve the problem of how to improve the accuracy of temperature control and the test efficiency during the GPU chip testing process.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A device for GPU chip performance testing, comprising:

[0007] The frame comprises a lower support plate and an upper support plate fixedly connected by a longitudinal guide shaft and an intermediate support plate slidably connected to the longitudinal guide shaft;

[0008] A lifting drive mechanism, connected between the lower support plate and the middle support plate, and used for driving the middle support plate to perform lifting motion along the longitudinal guide shaft;

[0009] A drawer-type carrier is slidably connected to the middle support plate, a test carrier is connected to the drawer-type carrier, and the test carrier is provided with a chip test slot for placing a GPU chip;

[0010] A water-cooled temperature control component, comprising a pressed water-cooled head with a coolant flowing therethrough, the pressed water-cooled head being connected to the upper support plate and arranged opposite to the chip test slot;

[0011] A heat exchange plate is provided on one side of the press-fit water cooling head facing the chip test slot, and the surface shape of the heat exchange plate is adapted to the surface shape of the GPU chip;

[0012] When the GPU chip is tested, the drawer-type carrier is driven to rise, and the heat exchange plate is pressed against the surface of the GPU chip to exchange heat, thereby controlling the test temperature of the GPU chip.

[0013] Preferably, the pressed water cooling head comprises a first connecting plate, a second connecting plate, a guide column, a spring and the heat exchange plate; wherein, the upper support plate is provided with an installation hole, the first connecting plate is assembled in the installation hole and is fixedly connected to the upper support plate, the guide column is movably passed through the first connecting plate, the second connecting plate is located above the first connecting plate and is connected to the first end of the guide column, the heat exchange plate is located below the first connecting plate and is connected to the second end of the guide column, the spring is located between the heat exchange plate and the first connecting plate and is sleeved on the guide column; a coolant flow cavity is provided in the heat exchange plate, and a liquid inlet connector and a liquid outlet connector connected to the coolant flow cavity are provided on a side of the heat exchange plate facing the first connecting plate.

[0014] Preferably, the heat exchange plate is divided into an intermediate heat exchange portion and a peripheral heat exchange portion which are isolated from each other, the peripheral heat exchange portion surrounds the intermediate heat exchange portion, and the intermediate heat exchange portion and the peripheral heat exchange portion are respectively provided with corresponding coolant flow cavities and liquid inlet connectors and liquid outlet connectors; the intermediate heat exchange portion is used to exchange heat with the chip body of the GPU chip, and the peripheral heat exchange portion is used to exchange heat with the wiring area of ​​the GPU chip located around the chip body.

[0015] Preferably, a metal heat conductive sheet is provided on a surface of the middle heat exchange portion facing the chip test slot, and a carbon fiber heat conductive pad is provided on a surface of the peripheral heat exchange portion facing the chip test slot.

[0016] Preferably, a first alignment component is provided between the upper support plate and the drawer-type carrier, and a second alignment component is provided between the pressed water cooling head and the test carrier.

[0017] Preferably, the water-cooled temperature control component includes a circulation pipeline, a heat sink, a pump, a flow meter, a temperature sensor and the pressed water cooling head; the circulation pipeline includes a water pipe and a leakage detection rope covering the water pipe, and the leakage detection rope is connected to the leakage detection sensor; the circulation pipeline is connected to the heat sink and the pressed water cooling head, and is used for circulating the coolant between the heat sink and the pressed water cooling head; the pump and the flow meter are respectively connected to the circulation pipeline, the pump is used to drive the coolant to flow in the circulation pipeline and control its flow rate, and the flow meter is used to detect the flow rate of the coolant; the temperature sensor is connected to the heat exchange plate, and is used to detect the temperature of the heat exchange plate;

[0018] Wherein, the pump, the flow meter, the temperature sensor and the liquid leakage detection sensor are respectively connected to the microcontroller chip via electrical signals.

[0019] Preferably, the water-cooled temperature control component comprises M pressed water cooling heads, and the M pressed water cooling heads are connected to the circulation pipeline in parallel through pipeline branches; in the water-cooled temperature control component, one heat sink and one pump drive the M pressed water cooling heads to realize the circulation of the coolant;

[0020] In the device, N chip test slots are arranged on the test carrier; the device comprises K groups of water-cooling temperature control components, the total number of the pressed water cooling heads included in the K groups of water-cooling temperature control components is N, the N pressed water cooling heads are respectively connected to the upper support plate and correspond one-to-one with the N chip test slots, so that the device can test N GPU chips at the same time;

[0021] Here, M is an integer of 2 to 4, N is an integer greater than or equal to M, and K is an integer greater than or equal to 1.

[0022] Preferably, N is an integer multiple of M and N=K×M, K≥2.

[0023] Preferably, the device further comprises a supporting base, the frame is connected to the supporting base, a plurality of first cooling fans are arranged on the side wall of the supporting base, and the cooling box is accommodated in the supporting base.

[0024] Preferably, the heat dissipation box is provided with a second heat dissipation fan, a heat sink, a copper water pipe and a liquid storage mechanism.

[0025] The device for GPU chip performance testing provided by the embodiment of the present invention has a corresponding pressed water cooling head arranged above the chip test slot. When testing the GPU chip, the pressed water cooling head is pressed against the surface of the GPU chip for heat exchange, and the temperature of the GPU chip is controlled by liquid cooling. The temperature control has high precision and can respond quickly, which can ensure that the performance test process of the GPU chip is carried out in an optimal and stable temperature environment, improve the accuracy of the test results, reduce the test cycle of a single chip, improve the test efficiency, and reduce costs. In addition, based on the high efficiency and high precision temperature control of the pressed water cooling head, multiple chip test slots can be arranged on the test carrier in the device and configured with one-to-one corresponding pressed water cooling heads, so that multiple GPU chips can be tested in parallel at the same time, further improving the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of the structure of a device for GPU chip performance testing in an embodiment of the present invention;

[0027] Figure 2 It is a diagram of the assembly structure inside the frame in the embodiment of the present invention;

[0028] Figure 3 Schematic diagram of the structure of the drawer-type carrier in an embodiment of the present invention;

[0029] Figure 4 It is a structural block diagram of a water-cooling temperature control component in an embodiment of the present invention;

[0030] Figure 5 It is a diagram of the assembly structure of the press-fit water cooling head on the upper support plate in an embodiment of the present invention;

[0031] Figure 6 is a three-dimensional diagram of a press-fit water cooling head in an embodiment of the present invention;

[0032] Figure 7 is a top view of a press-fit water cooling head in an embodiment of the present invention;

[0033] Figure 8 It is a bottom view of the pressed water cooling head in the embodiment of the present invention. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical scheme and advantages of the present invention clearer, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the present invention shown in the accompanying drawings and described according to the accompanying drawings are merely exemplary, and the present invention is not limited to these embodiments.

[0035] It should be noted that the same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0036] It should also be noted that, in order to avoid obscuring the present invention due to unnecessary details, only structures and / or processing steps closely related to the solutions according to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0037] The present invention provides a device for testing the performance of a GPU chip. Figure 1 and Figure 2 As shown, the device mainly includes a support base 1, a frame 2, a lifting drive mechanism 3, a drawer-type carrier 4 and a water-cooled temperature control component 5. The frame 2 is connected to the support base 1, the lifting drive mechanism 3, the drawer-type carrier 4 and the water-cooled temperature control component 5 are assembled in the frame 2, and the frame 2 is also equipped with a frame shell 6.

[0038] Among them, see Figure 2 The frame 2 is a frame structure, and the frame 2 includes a lower support plate 21, an intermediate support plate 22 and an upper support plate 23 from bottom to top. The lower support plate 21 and the upper support plate 23 are fixedly connected by a longitudinal guide shaft 24, and the intermediate support plate 22 is slidably connected to the longitudinal guide shaft 24.

[0039] Among them, see Figure 2, the lifting drive mechanism 3 is connected between the lower support plate 21 and the middle support plate 22, and is used to drive the middle support plate 22 to perform lifting movement along the longitudinal guide shaft 24, thereby driving the drawer-type carrier 4 to rise or fall. Specifically, in this embodiment, the lifting drive mechanism 3 mainly includes a rotating wheel 31 with a handle, a transmission gear 32 and a rotating shaft 33 that are sequentially connected in transmission, and a driven gear 34 is provided on the rotating shaft 33. The driven gear 34 is connected to a lifting assembly 35, and the lifting assembly 35 connects the lower support plate 21 and the middle support plate 22. By rotating the rotating wheel 31 clockwise or counterclockwise, the power is output to the lifting assembly 35 via the transmission gear 32, the rotating shaft 33 and the driven gear 34, and the lifting assembly 35 drives the middle support plate 22 to rise or fall relative to the lower support plate 21.

[0040] Among them, see Figure 2 and Figure 3 The drawer-type carrier 4 is slidably connected to the middle support plate 22 , and a test carrier 41 is connected to the drawer-type carrier 4 , and the test carrier 41 is provided with a chip test slot 42 for placing a GPU chip.

[0041] Specifically, a slide rail 43 is provided on the intermediate support plate 22, and a slide groove 44 is provided at the bottom of the drawer-type platform 4. The slide groove 44 is slidably assembled on the slide rail 43, and the drawer-type platform 4 and the intermediate support plate 22 can slide relative to each other, thereby allowing the drawer-type platform 4 to be pulled out of the rack 2 to load the GPU chip, and then the drawer-type platform 4 can be pushed into the rack 2. Furthermore, a nylon drag chain 45 can be connected between the drawer-type platform 4 and the intermediate support plate 22 to improve the stability of the drawer-type platform 4 sliding on the intermediate support plate 22.

[0042] Specifically, the test carrier 41 is provided with a chip test slot 42 for placing a GPU chip, and a connector 46 is arranged around the chip test slot 42. When testing the GPU chip, the connector 46 is used to connect the GPU chip to other chips for matching testing, such as a GPU, a graphics card, etc. In this embodiment, the drawer-type carrier 4 has an accommodating space inside, and related chips such as a GPU and a graphics card can be assembled inside the drawer-type carrier 4.

[0043] Among them, see Figure 1 , Figure 2 and Figure 5The water-cooling temperature control component 5 mainly includes a press-fit water cooling head 51 through which coolant flows, and the press-fit water cooling head 51 is connected to the upper support plate 23 and arranged opposite to the chip test slot 42. A heat exchange plate 511 is arranged on one side of the press-fit water cooling head 51 facing the chip test slot 42, and the surface shape of the heat exchange plate 511 is adapted to the surface shape of the GPU chip.

[0044] As described above, in the device for testing the performance of a GPU chip, when testing the GPU chip, the lifting drive mechanism 3 drives the drawer-type carrier 4 to rise toward the upper support plate 23, so that the heat exchange plate 511 of the pressed water cooling head 51 is pressed against the surface of the GPU chip for heat exchange, thereby controlling the test temperature of the GPU chip. Thus, the temperature of the GPU chip is controlled by liquid cooling, and the temperature control is highly accurate and can respond quickly, which can ensure that the performance test process of the GPU chip is carried out in an optimal and stable temperature environment, improve the accuracy of the test results, reduce the test cycle of a single chip, improve the test efficiency, and reduce costs.

[0045] In this embodiment, refer to Figure 4 The water-cooling temperature control assembly 5 includes a circulation pipeline 52, a heat sink 53, a pump 54, a flow meter 55, a temperature sensor 56 and the pressed water cooling head 51. The circulation pipeline 52 includes a water pipe and a leakage detection rope (not shown in the drawings) covering the water pipe, and the leakage detection rope is connected to the leakage detection sensor 57.

[0046] Among them, the circulation pipeline 52 connects the heat sink 53 and the pressed water cooling head 51, and is used for circulating the coolant between the heat sink 53 and the pressed water cooling head 51. Specifically, the coolant is transported from the heat sink 53 to the pressed water cooling head 51 to exchange heat with the GPU chip under test, and then the coolant after heat exchange is transported to the heat sink 53 for heat dissipation and cooling.

[0047] The pump 54 and the flow meter 55 are respectively connected to the circulation pipeline 52, the pump 54 is used to drive the coolant to flow in the circulation pipeline 52 and control its flow rate, and the flow meter 54 is used to detect the flow rate of the coolant. The temperature sensor 56 is connected to the heat exchange plate 511, and is used to detect the temperature of the heat exchange plate 511, and determine the temperature of the GPU chip under test based on the temperature of the heat exchange plate 511.

[0048] The pump 54, the flow meter 55, the temperature sensor 56 and the liquid leakage detection sensor 57 are respectively connected to the microcontroller chip 58 by electrical signals (such as Figure 4The temperature sensor 56 transmits the temperature data to the microcontroller chip 58 in real time. The microcontroller chip 58 forms a control instruction based on the comparison between the set temperature and the real-time temperature, controls the rotation speed of the pump 54, and further controls the flow rate of the coolant. The function of the flowmeter 55 is to detect the flow rate of the coolant and feed it back to the microcontroller chip 58 in real time. More specifically, through the functional relationship between the temperature sensor 56 and the flowmeter 55, different temperatures correspond to different flow count values, allowing the microcontroller chip 58 to control the rotation speed of the water pump, thereby achieving rapid temperature control of the GPU chip and meeting the conditions required for the test. Under the action of the leakage detection rope and the leakage detection sensor 57, it is detected in real time whether there is leakage, so as to protect the product from the harm of leakage in time and improve the safety and stability of the test.

[0049] In this embodiment, refer to Figure 1 A plurality of first cooling fans 11 are arranged on the side wall of the support base 1, and the cooling box 53 is accommodated in the support base 1. The cooling box 53 is connected to the circulation pipe 52 (in Figure 1 The support base 1 is connected to the press-fit water cooling head 51 located on the rack 2 (not shown). The bottom of the support base 1 is connected to the universal wheel 12 and the height-adjustable support pad 13. The device can be easily moved by the universal wheel 12. After moving to the specified position, the device can be fixed by the support pad 13, and the height can be fine-tuned so that the test carrier 41 on the drawer-type carrier 4 remains on the horizontal plane. Furthermore, a wire pipe fixing frame 25 is provided on the rack 2, and the wire pipe fixing frame 25 is used to fix the circulation pipeline 52 connected to the press-fit water cooling head 51.

[0050] The heat dissipation box 53 is provided with a second heat dissipation fan, a heat sink, a copper water pipe, and a liquid storage mechanism (not shown in the drawings). Furthermore, the pump 54 and the flow meter 55 are respectively connected to the circulation pipeline 52 and can be placed in the heat dissipation box 53, so that the structure of the entire device is more compact.

[0051] In this embodiment, refer to Figure 2 as well as Figures 5 to 8The press-fit water cooling head 51 includes a first connecting plate 512, a second connecting plate 513, a guide column 514, a spring 515 and the heat exchange plate 511. The upper support plate 23 is provided with a mounting hole 231, the mounting hole 231 is located directly above the chip test slot 42, the first connecting plate 512 is assembled in the mounting hole 231 and is fixedly connected to the upper support plate 23, the guide column 514 is movably arranged on the first connecting plate 512, the second connecting plate 513 is located above the first connecting plate 512 and connected to the first end of the guide column 514, the heat exchange plate 511 is located below the first connecting plate 512 and connected to the second end of the guide column 514, and the spring 515 is located between the heat exchange plate 511 and the first connecting plate 512 and is sleeved on the guide column 514. The heat exchange plate 511 is provided with a cooling liquid flow cavity (not shown in the drawings), and a liquid inlet connector 516 and a liquid outlet connector 517 communicating with the cooling liquid flow cavity are provided on one side of the heat exchange plate 511 facing the first connecting plate 512 .

[0052] Furthermore, if Figure 7 As shown, the first connecting plate 512 and the second connecting plate 513 are provided with avoidance holes 518 and 519 at positions corresponding to the liquid inlet connector 516 and the liquid outlet connector 517, and the circulation pipeline 52 passes through the avoidance holes 518 and 519 to be connected to the liquid inlet connector 516 and the liquid outlet connector 517 below.

[0053] As described above, the pressed water cooling head 51, based on the matching structure of the movable guide column 514 and the spring 515, the heat exchange plate 511 can be pressed toward the first connecting plate 512 and has a certain movement stroke, and the spring 515 is compressed and provides a reverse force. Therefore, when the drawer-type carrier 4 is driven to rise toward the upper support plate 23, the GPU chip placed on the test carrier 41 presses the heat exchange plate 511 toward the first connecting plate 512, and the reverse force provided by the spring 515 presses the heat exchange plate 511 toward the GPU chip. The lower surface of the heat exchange plate 511 can fit closely with the upper surface of the GPU chip for heat exchange, which can better control the test temperature of the GPU chip. Furthermore, since the heat exchange plate 511 and the GPU chip are pressed against each other based on elastic force, it can be avoided that excessive pressure affects the performance test results of the GPU chip, or even causes damage to the GPU chip.

[0054] As a preferred solution, in this embodiment, refer to Figure 6 and Figure 8The heat exchange plate 511 is divided into an isolated intermediate heat exchange portion 511a and an outer heat exchange portion 511b. The outer heat exchange portion 511b surrounds the intermediate heat exchange portion 511a. The intermediate heat exchange portion 511a and the outer heat exchange portion 511b are respectively provided with corresponding cooling liquid flow chambers and liquid inlet connectors 516 and liquid outlet connectors 517. Generally, a GPU chip includes a chip body located in the middle and a wiring area located around the chip body. When the GPU chip is working, the heat generation of these two parts is different, and the heat generation of the chip body is relatively high. Therefore, in the embodiment of the present invention, the heat exchange plate 511 is divided into an isolated and independent intermediate heat exchange portion 511a and an outer heat exchange portion 511b. The intermediate heat exchange portion 511a is used to exchange heat with the chip body of the GPU chip, and the outer heat exchange portion 511b is used to exchange heat with the wiring area of ​​the GPU chip. This can better control the temperature of the GPU chip, making the temperature of the GPU chip more balanced and stable.

[0055] Further, see Figure 8 A metal heat conductive sheet 58 is provided on the surface of the middle heat exchange portion 511a facing the chip test slot 42, and a carbon fiber heat conductive pad 59 is provided on the surface of the outer heat exchange portion 511b facing the chip test slot 42, thereby improving the heat exchange efficiency of the heat exchange plate 511.

[0056] Furthermore, a first alignment component is provided between the upper support plate 23 and the drawer-type carrier 4, and a second alignment component is provided between the pressed water cooling head 51 and the test carrier 41. By providing the alignment component, it is avoided that the pressed water cooling head 51 and the GPU chip are pressed against each other in a misaligned state, thereby damaging the GPU chip. The first alignment component and the second alignment component may be alignment components including positioning columns and positioning holes that cooperate with each other, for example, positioning columns are provided at the bottom of the upper support plate 23 and the pressed water cooling head 51, and corresponding positioning holes are provided on the surfaces of the drawer-type carrier 4 and the test carrier 41.

[0057] As a preferred solution, the water-cooled temperature control component 5 includes M pressed water cooling heads 51, and the M pressed water cooling heads 51 are connected to the circulation pipeline 52 in parallel through pipeline branches. Therefore, in the water-cooled temperature control component 5, one heat sink 53 and one pump 54 drive the M pressed water cooling heads 51 to realize the circulation of the coolant, and M is an integer of 2 to 4. Therefore, refer to Figure 1-Figure 3In the device, N chip test slots 42 are arranged on the test carrier 41; the device includes K groups of water-cooled temperature control components 5, and the total number of the pressed water cooling heads 51 included in the K groups of water-cooled temperature control components 5 is N, and the N pressed water cooling heads 51 are respectively connected to the upper support plate 23 and correspond one-to-one with the N chip test slots 42, so that the device can test N GPU chips at the same time. Wherein, N is an integer greater than M, and K is an integer greater than 1. Thus, the device can test multiple GPU chips in parallel at the same time, further improving the test efficiency.

[0058] In the most preferred solution, the N chip test slots 42 provided on the test carrier 41 are arranged in an array, N is an integer multiple of M and N=K×M, K≥2. Figure 3 and Figure 5 , 8 (i.e. N=8) chip test slots 42 are arranged on the test carrier 41, and each group of the water-cooled temperature control components 5 includes 2 (i.e. M=2) pressed water cooling heads 51. The device is provided with 4 (i.e. K=4) groups of the water-cooled temperature control components 5, which can perform parallel testing on 8 GPU chips at the same time. Usually, multiple GPU chips are tested at the same time in the same batch, and the test items are the same. The heat generation of each GPU chip is roughly the same and the temperature to be controlled is also the same. Therefore, the N chip test slots 42 are arranged in an array, and each group of water-cooled temperature control components 5 includes the same number of pressed water cooling heads 51. The temperature control procedure is simpler, the temperature control is more stable, and the overall structure of the device is compact, which effectively utilizes the space of the equipment. It needs to be explained that, Figure 5 In order to illustrate the mounting holes 231 and the chip test slots 42 therebelow, one of the mounting holes 231 is not equipped with a press-fit water cooling head 51 .

[0059] In summary, the device for GPU chip performance testing provided by the embodiment of the present invention controls the temperature of the GPU chip in a liquid cooling manner, and the temperature control has high precision and can respond quickly, which can ensure that the performance test process of the GPU chip is carried out in an optimal and stable temperature environment, improve the accuracy of the test results, reduce the test cycle of a single chip, improve the test efficiency, and reduce the cost. In addition, the device can perform parallel testing on multiple GPU chips at the same time, further improving the test efficiency.

[0060] The above is only a specific implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A device for GPU chip performance testing, characterized in that: include: The frame comprises a lower support plate and an upper support plate fixedly connected by a longitudinal guide shaft and an intermediate support plate slidably connected to the longitudinal guide shaft; A lifting drive mechanism, connected between the lower support plate and the middle support plate, and used for driving the middle support plate to perform lifting motion along the longitudinal guide shaft; A drawer-type carrier is slidably connected to the middle support plate, a test carrier is connected to the drawer-type carrier, and the test carrier is provided with a chip test slot for placing a GPU chip; A water-cooled temperature control component, comprising a pressed water-cooled head with a coolant flowing therethrough, the pressed water-cooled head being connected to the upper support plate and arranged opposite to the chip test slot; A heat exchange plate is provided on one side of the press-fit water cooling head facing the chip test slot, and the surface shape of the heat exchange plate is adapted to the surface shape of the GPU chip; When the GPU chip is tested, the drawer-type carrier is driven to rise, and the heat exchange plate is pressed against the surface of the GPU chip to exchange heat, thereby controlling the test temperature of the GPU chip.

2. The device for GPU chip performance testing according to claim 1, characterized in that: The pressed water cooling head comprises a first connecting plate, a second connecting plate, a guide column, a spring and the heat exchange plate; wherein, the upper support plate is provided with an installation hole, the first connecting plate is assembled in the installation hole and is fixedly connected to the upper support plate, the guide column can be movably passed through the first connecting plate, the second connecting plate is located above the first connecting plate and is connected to the first end of the guide column, the heat exchange plate is located below the first connecting plate and is connected to the second end of the guide column, the spring is located between the heat exchange plate and the first connecting plate and is sleeved on the guide column; a coolant flow cavity is provided in the heat exchange plate, and a liquid inlet connector and a liquid outlet connector connected to the coolant flow cavity are provided on a side of the heat exchange plate facing the first connecting plate.

3. The device for GPU chip performance testing according to claim 2, characterized in that: The heat exchange plate is divided into an intermediate heat exchange portion and a peripheral heat exchange portion which are isolated from each other. The peripheral heat exchange portion surrounds the intermediate heat exchange portion. The intermediate heat exchange portion and the peripheral heat exchange portion are respectively provided with corresponding coolant flow cavities and liquid inlet connectors and liquid outlet connectors; the intermediate heat exchange portion is used for exchanging heat with the chip body of the GPU chip, and the peripheral heat exchange portion is used for exchanging heat with the wiring area of ​​the GPU chip located around the chip body.

4. The device for GPU chip performance testing according to claim 3, characterized in that: A metal heat conducting sheet is arranged on a surface of the middle heat exchange portion facing the chip test slot, and a carbon fiber heat conducting pad is arranged on a surface of the peripheral heat exchange portion facing the chip test slot.

5. The device for GPU chip performance testing according to claim 2, characterized in that: A first alignment component is arranged between the upper support plate and the drawer-type carrier, and a second alignment component is arranged between the pressed water cooling head and the test carrier.

6. The device for GPU chip performance testing according to any one of claims 1 to 5, characterized in that: The water-cooled temperature control assembly includes a circulation pipeline, a heat sink, a pump, a flow meter, a temperature sensor and the pressed water cooling head; the circulation pipeline includes a water pipe and a leakage detection rope covering the water pipe, and the leakage detection rope is connected to the leakage detection sensor; the circulation pipeline is connected to the heat sink and the pressed water cooling head, and is used to circulate and transmit the coolant between the heat sink and the pressed water cooling head; the pump and the flow meter are respectively connected to the circulation pipeline, the pump is used to drive the coolant to flow in the circulation pipeline and control its flow rate, and the flow meter is used to detect the flow rate of the coolant; the temperature sensor is connected to the heat exchange plate to detect the temperature of the heat exchange plate; Wherein, the pump, the flow meter, the temperature sensor and the liquid leakage detection sensor are respectively connected to the microcontroller chip via electrical signals.

7. The device for GPU chip performance testing according to claim 6, characterized in that: The water-cooled temperature control component includes M pressed water cooling heads, and the M pressed water cooling heads are connected to the circulation pipeline in parallel through pipeline branches; in the water-cooled temperature control component, one heat sink and one pump drive the M pressed water cooling heads to realize the circulation of the coolant; In the device, N chip test slots are arranged on the test carrier; the device comprises K groups of water-cooling temperature control components, the total number of the pressed water cooling heads included in the K groups of water-cooling temperature control components is N, the N pressed water cooling heads are respectively connected to the upper support plate and correspond one-to-one with the N chip test slots, so that the device can test N GPU chips at the same time; Here, M is an integer of 2 to 4, N is an integer greater than or equal to M, and K is an integer greater than or equal to 1.

8. The device for GPU chip performance testing according to claim 7, characterized in that: N is an integer multiple of M and N=K×M, K≥2.

9. The device for GPU chip performance testing according to claim 6, characterized in that: The device also includes a support base, the frame is connected to the support base, a plurality of first cooling fans are arranged on the side wall of the support base, and the heat dissipation box is accommodated in the support base.

10. The device for GPU chip performance testing according to claim 9, characterized in that: The heat dissipation box is provided with a second heat dissipation fan, a heat sink, a copper water pipe and a liquid storage mechanism.

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