Packaging structure and packaging method of silicon carbide power module

Abstract

The invention discloses a packaging structure and a packaging method of a silicon carbide power module, and the packaging structure comprises a first packaging structure which is used for stripping a DTS single assembly from a DTS bearing film and transferring the DTS single assembly; the first packaging structure comprises a positioning mechanism and a first transferring mechanism, the positioning mechanism is used for positioning and supporting the DTS single assembly, and the first transferring mechanism is used for stripping and transferring the DTS single assembly from the DTS bearing film; the positioning mechanism comprises a first shell with a containing cavity and a first top cap arranged on the top of the first shell, and the top face of the first top cap is a plane without a hole structure. According to the packaging structure of the silicon carbide power module, under the condition that the bottom surface of the DTS bearing film is not adsorbed, the DTS single assembly is stripped from the DTS bearing film, and deformation or falling of the DTS single assembly caused by vacuum adsorption in the packaging process of the silicon carbide power module is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a packaging structure and a packaging method of a silicon carbide power module. Background Art

[0002] DTS (Die Top System) pre-sintered silver solder is a welding material used for electronic component packaging, made using pre-sintered silver technology. DTS is a packaging mode of pre-sintering slurry and glue points in the process of automotive-grade module packaging, which is used to protect chips, ensure high-yield copper wire bonding, and simplify module packaging. The current carrying capacity of DTS chips is more than 50% higher than that of bonding aluminum wires, the service life of power electronic systems is more than 50 times higher than that of solder and aluminum wire processes, and the chip junction temperature is supported to be as high as 200°C. Compared with other solutions such as clip welding, it has more outstanding stability. The DTS product as a whole includes a DTS carrier film and several DTS single components arranged and distributed on the DTS carrier film. During the packaging operation, the packaging structure is required to peel the DTS single component from the DTS carrier film and transfer it to the assembly station with the chip.

[0003] However, since the DTS single component includes a copper foil with a multifunctional surface, a sintered nano-silver layer and a solid crystal adhesive, and since the sintered nano-silver layer is formed on the copper foil by pressing sintered silver powder, the packaging structure in the prior art uses the vacuum adsorption principle to adsorb the DTS carrier film, and then uses a transfer mechanism to peel the DTS single component from the DTS carrier film and then transfer it. In the process of vacuum adsorption of the DTS carrier film, the sintered nano-silver layer will deform with the DTS carrier film, thereby causing the sintered nano-silver layer to deform or even fall off, resulting in a high defective rate of the silicon carbide power module and reducing the reliability of the silicon carbide power module.

[0004] Therefore, it is very necessary to provide a packaging structure and a packaging method for a silicon carbide power module that can peel off a DTS single component from a carrier film and prevent the DTS single component from being deformed or falling off during the packaging process of the silicon carbide power module. Summary of the invention

[0005] The object of the present invention is to solve the above-mentioned problem and to provide a packaging structure and a packaging method for a silicon carbide power module.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is as follows:

[0007] In a first aspect, the present invention provides a packaging structure of a silicon carbide power module, including a first packaging structure, wherein the first packaging structure is used to peel and transfer a DTS single component from a DTS carrier film; the first packaging structure includes a positioning mechanism and a first transfer mechanism, wherein the positioning mechanism is used to position and support the DTS single component, and the first transfer mechanism is used to peel and transfer the DTS single component from the DTS carrier film; the positioning mechanism includes a first shell having an accommodating chamber and a first top cap arranged on the top of the first shell, wherein the top surface of the first top cap is a plane without a hole structure.

[0008] Optionally, the first transfer mechanism includes a first drive assembly and a first suction nozzle driven by the first drive assembly.

[0009] Optionally, the packaging structure also includes a second packaging structure for peeling and transferring the silicon carbide chip from the chip carrier film; the second packaging structure includes a ejector mechanism and a second transfer mechanism, the ejector mechanism includes a second shell having an accommodating chamber, an ejector assembly, and a second top cap arranged on the top of the second shell, and the second shell is connected to a vacuum generating device for adsorbing the chip carrier film.

[0010] Optionally, the ejector assembly includes a driving member externally arranged on the second shell, a guide rod transmission-connected to the driving member, an elastic reset member connected to the guide rod, an ejector base arranged on the top of the guide rod, and an ejector arranged on the top surface of the ejector base; a first hole for the ejector to pass through is formed on the top surface of the second top cap, and a second hole is formed on the bottom of the second shell.

[0011] Optionally, the second shell includes a first part and a second part arranged in sequence from bottom to top, the diameter of the first part is larger than the diameter of the second part, the elastic reset member is arranged in the first part, the telescopic direction of the elastic reset member is arranged parallel to the vertical direction, the top end of the elastic reset member is connected to the top wall of the first part, and the bottom end of the elastic reset member is connected to the guide rod.

[0012] Optionally, the first top cap is detachably connected to the top of the first shell, the second top cap is detachably connected to the top of the second shell, the first shell and the second shell have the same structure, and the first packaging structure also includes the ejector mechanism.

[0013] Optionally, the first top cap is fixedly connected to the top of the first shell.

[0014] In a second aspect, the present invention provides a packaging method for a silicon carbide power module, wherein the packaging method is performed using the packaging structure of the silicon carbide power module as described above, and comprises the steps of:

[0015] S1, using a second packaging structure to peel the silicon carbide chip from the chip carrier film and transfer it to a packaging station;

[0016] S2, using the first packaging structure to peel the DTS single component from the DTS carrier film and transfer it to a packaging station, and then attach the DTS single component to the silicon carbide chip;

[0017] The first packaging structure includes a positioning mechanism and a first transfer mechanism, the positioning mechanism includes a first shell having an accommodating chamber and a first top cap arranged on the top of the first shell, the top surface of the first top cap is a plane without a hole structure;

[0018] Step S2 specifically includes: setting the positioning mechanism at the position corresponding to the DTS single component, so that the DTS carrier film is set on the top surface of the first top cap, and the positioning mechanism positions and supports the DTS single component; the first transfer mechanism moves to the position corresponding to the DTS single component, sucks the DTS single component to peel the DTS single component from the DTS carrier film, and transfers the DTS single component to the packaging station.

[0019] Optionally, the second packaging structure includes an ejector mechanism and a second transfer mechanism, the ejector mechanism includes a second shell having an accommodating chamber, an ejector assembly, and a second top cap arranged on the top of the second shell, the second shell is connected to a vacuum generating device for adsorbing the chip carrier film; the ejector assembly includes a driving member externally arranged on the second shell, a guide rod transmission-connected to the driving member, an elastic reset member connected to the guide rod, an ejector base arranged on the top of the guide rod, and an ejector arranged on the top surface of the ejector base; the top surface of the second top cap is provided with a first hole for the ejector to pass through, and the bottom of the second shell is provided with a second hole.

[0020] Optionally, step S1 specifically includes: the ejector pin mechanism is arranged corresponding to the silicon carbide chip and the chip carrier film is arranged on the top surface of the second top cap, and the second top cap vacuum adsorbs the chip carrier film through the first hole; the ejector pin passes through the first hole in a vertical direction under the drive of the driving member to lift the chip carrier film, and the second transfer mechanism peels and transfers the silicon carbide chip from the chip carrier film.

[0021] The beneficial effects produced by the present invention include at least:

[0022] The first packaging structure of the present invention includes a positioning mechanism, and the positioning mechanism includes a first top cap. The top surface structure of the first top cap is set to a plane without a hole structure. In the process of peeling and transferring the DTS single component, the DTS carrier film contacts the top surface of the first top cap. The first top cap positions and supports the DTS carrier film and the DTS single component arranged on the DTS carrier film. Then, the first transfer mechanism is used to apply a force to the top surface of the DTS single component to peel and transfer the DTS single component from the DTS carrier film. Since the bonding force between the sintered nanosilver layer in the DTS single component and the DTS carrier film is relatively small, when the DTS carrier film is not peeled, the DTS single component is peeled and transferred. Under the condition of adsorption on the bottom surface of the DTS single component, the DTS single component can be peeled off from the DTS carrier film by the force between the first transfer mechanism and the top of the DTS single component; compared with the prior art, the first packaging structure in the present invention adopts a flat first top cap with no hole structure on the top surface, and there is no need to apply vacuum adsorption force to the DTS carrier film. The DTS single component can be peeled off from the DTS carrier film through the cooperation between the positioning mechanism and the first transfer mechanism, and the deformation or falling off of the DTS single component caused by vacuum adsorption during the packaging process of the silicon carbide power module is avoided, thereby improving the yield rate of the silicon carbide power module packaging and ensuring the reliability of the silicon carbide power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a structural schematic diagram of a first packaging structure of the present invention;

[0024] Figure 2 is a schematic structural diagram of a first cap body;

[0025] Figure 3 It is a schematic diagram of a state where the first packaging structure of the present invention is in contact with the DTS;

[0026] Figure 4 is a schematic diagram of the state of the second packaging structure when the elastic reset member is in an extended state;

[0027] Figure 5 is a schematic structural diagram of the second cap body;

[0028] Figure 6 is a schematic diagram of the state of the second packaging structure when the elastic reset member is in a compressed state;

[0029] Figure 7 It is a schematic diagram of a state where the second packaging structure of the present invention is in contact with a silicon carbide chip;

[0030] Figure 8 It is a schematic diagram of the surface structure of a DTS single component after being peeled off using the first packaging structure of the present invention;

[0031] Fig. 9 It is a schematic diagram of the surface structure of a DTS single component after the packaging structure in the prior art is peeled off;

[0032] Fig.10 It is a schematic diagram of the state when a DTS single component is peeled off from a DTS carrier film in the prior art;

[0033] Fig.11 for Figure 1 An enlarged schematic diagram of point A is shown.

[0034] Among them, 1-positioning mechanism, 111-first shell, 112-first top cap, 121-first suction nozzle, 21-throw pin mechanism, 211-second shell, 2111-second hole, 2112-first part, 2113-second part, 212-throw pin assembly, 2121-driving member, 2122-guide rod, 2123-elastic reset member, 2124-throw pin base, 2125-throw pin, 213-second top cap, 2131-first hole, 221-second suction nozzle, 31-DTS single component, 311-sintered nanosilver layer, 312-copper foil, 32-DTS carrier film, 41-silicon carbide chip, 42-chip carrier film. DETAILED DESCRIPTION

[0035] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0036] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0038] In the present invention, descriptions such as “first”, “second”, etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features.

[0039] In the description of the present invention, the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that in the present invention, the direction top refers to the direction away from the mounting plane of the packaging structure, and the direction bottom refers to the direction close to the mounting plane of the packaging structure. The direction vertical refers to the direction perpendicular to the mounting plane of the packaging structure.

[0040] Example:

[0041] See also Figures 1 to 3 As shown, an embodiment of the present invention provides a packaging structure of a silicon carbide power module, which includes a first packaging structure, wherein the first packaging structure is used to peel and transfer a DTS single component 31 from a DTS carrier film 32; the first packaging structure includes a positioning mechanism 11 and a first transfer mechanism, wherein the positioning mechanism 11 is used to position and support the DTS single component 31, and the first transfer mechanism is used to peel and transfer the DTS single component 31 from the DTS carrier film 32; the positioning mechanism 11 includes a first shell 111 having an accommodating chamber and a first top cap 112 arranged on the top of the first shell 111, and the top surface of the first top cap 112 is a plane without a hole structure.

[0042] The first packaging structure of the present invention includes a positioning mechanism 11, and the positioning mechanism 11 includes a first top cap 112. The top surface structure of the first top cap 112 is set to a plane without a hole structure. In the process of peeling and transferring the DTS single component 31, the DTS carrier film 32 contacts the top surface of the first top cap 112. The first top cap 112 positions and supports the DTS carrier film 32 and the DTS single component 31 arranged on the DTS carrier film 32. Then, the first transfer mechanism is used to apply a force to the top surface of the DTS single component 31 to peel and transfer the DTS single component 31 from the DTS carrier film 32. Since the bonding force between the sintered nanosilver layer in the DTS single component 31 and the DTS carrier film 32 is small, without Under the condition that the bottom surface of the DTS carrier film 32 is adsorbed, the DTS single component 31 can be peeled off from the DTS carrier film 32 by the force between the first transfer mechanism and the top of the DTS single component 31. Compared with the prior art, the first packaging structure in the present invention adopts a flat first top cap 112 with no hole structure on the top surface, and there is no need to apply vacuum adsorption force to the DTS carrier film 32. The DTS single component 31 can be peeled off from the DTS carrier film 32 through the cooperation between the positioning mechanism 11 and the first transfer mechanism, and the deformation or falling off of the DTS single component 31 caused by vacuum adsorption during the packaging process of the silicon carbide power module is avoided, thereby improving the yield rate of the silicon carbide power module packaging and ensuring the reliability of the silicon carbide power module.

[0043] Optionally, the first packaging structure includes at least one positioning mechanism 11. For example:

[0044] In some embodiments, when the first packaging structure includes a positioning mechanism 11, the positioning mechanism 11 also includes a second driving component for driving the first shell 111 to move so that the first top cap 112 is aligned with the DTS single component 31 to be stripped; the positioning mechanism 11 is driven by the second driving component to move to align with the DTS single component 31 to be stripped, so as to position and support the DTS single component 31 to be stripped.

[0045] In some embodiments, the first packaging structure includes more than one positioning mechanism 11, and the number of the positioning mechanisms 11 is equal to or less than the total number of DTS single components 31 arranged on the DTS carrier film 32. Specifically, in some embodiments, the number of the positioning mechanisms 11 is equal to the number of columns or rows of the DTS single components 31 arranged on the DTS carrier film 32; in other embodiments, the number of the positioning mechanisms 11 is equal to the number of DTS single components 31 arranged on the DTS carrier film 32.

[0046] The first transfer mechanism includes a first drive assembly and a first suction nozzle 121 driven by the first drive assembly. When in use, the first drive assembly drives the first suction nozzle 121 to move to a position corresponding to the DTS single component 31 to be peeled off, and the first suction nozzle 121 applies force to the top of the DTS single component 31, so that the DTS single component 31 is peeled off and transferred from the DTS carrier film 32. It can be understood that the first transfer mechanism also includes a vacuum generating device connected to the first suction nozzle 121.

[0047] See also Figures 4 to 6 As shown, the packaging structure also includes a second packaging structure for peeling and transferring the silicon carbide chip 41 from the chip carrier film 42; the second packaging structure includes a pin mechanism 21 and a second transfer mechanism, the pin mechanism 21 includes a second shell 211 with an accommodating chamber, a pin assembly 212, and a second top cap 213 arranged on the top of the second shell 211, the second shell 211 is connected to a vacuum generating device for adsorbing the chip carrier film 42, and the pin assembly 212 is used to lift the silicon carbide chip 41 to separate the silicon carbide chip 41 from the chip carrier film 42. The second transfer mechanism includes a second suction nozzle 221 and a third drive assembly for driving the second suction nozzle 221 to move, and the second suction nozzle 221 is connected to the vacuum generating device.

[0048] See also Figure 4 As shown, the ejector assembly 212 includes a driving member 2121 externally arranged on the second housing 211, a guide rod 2122 transmission-connected to the driving member 2121, an elastic reset member 2123 connected to the guide rod 2122, an ejector base 2124 arranged on the top of the guide rod 2122, and an ejector 2125 arranged on the top surface of the ejector base 2124; see Figure 5 As shown, a first hole 2131 for the ejector pin 2125 to pass through is formed on the top surface of the second top cap 213 , and a second hole 2111 is formed on the bottom of the second shell 211 .

[0049] Optionally, the driving member 2121 is a cam. It is understandable that the rotation of the cam is driven by the cam driving member 2121.

[0050] Optionally, in some embodiments, the guide rod 2122 is in direct contact with the driving member 2121, and the guide rod 2122 is arranged through the second hole 2111. The guide rod 2122 moves back and forth in the vertical direction under the drive of the driving member 2121, thereby driving the ejector base 2124 and the ejector pin 2125 arranged on the ejector base 2124 to move back and forth in the vertical direction. In the initial state, the ejector pin 2125 is located below the top surface of the second top cap 213; when peeling the silicon carbide chip 41, the ejector pin 2125 passes through the first hole 2131 and protrudes from the top surface of the second top cap 213 to lift the silicon carbide chip 41 and promote the separation of the silicon carbide chip 41 and the chip carrier film 42.

[0051] In some other embodiments, a first transmission member is provided between the guide rod 2122 and the driving member 2121, the first transmission member is arranged through the second hole 2111, the driving member 2121 drives the first transmission member to reciprocate in the vertical direction, the first transmission member drives the guide rod 2122 to reciprocate in the vertical direction, and then drives the ejector base 2124 and the ejector 2125 provided on the ejector base 2124 to reciprocate in the vertical direction. The ejector 2125 protrudes from the top surface of the second top cap 213 to lift the silicon carbide chip 41, so as to facilitate the peeling of the silicon carbide chip 41 from the chip carrier film 42. When the ejector 2125 passes through the first hole 2131, the maximum vertical distance between the top of the ejector 2125 and the top surface of the second top cap 213 is 1 mm.

[0052] The second shell 211 includes a first part 2112 and a second part 2113 arranged in sequence from bottom to top, the diameter of the first part 2112 is larger than the diameter of the second part 2113, the elastic return member 2123 is arranged on the first part 2112, the extension direction of the elastic return member 2123 is arranged parallel to the vertical direction, the top end of the elastic return member 2123 is connected to the top wall of the first part 2112, and the bottom end of the elastic return member 2123 is connected to the guide rod 2122.

[0053] When in use, when the driving member 2121 drives the guide rod 2122 to move upward in the vertical direction, the guide rod 2122 drives the bottom end of the elastic return member 2123 to move toward its top end and applies a force to the elastic return member 2123, so that the elastic return member 2123 is in a compressed state; after the silicon carbide chip 41 is peeled off from the chip carrier film 42, the driving member 2121 no longer applies a lifting force to the guide rod 2122, and the elastic return member 2123 stretches, exerting a reaction force on the guide rod 2122 to drive the guide rod 2122 to move downward in the vertical direction.

[0054] In some embodiments, the first top cap 112 is detachably connected to the top of the first shell 111, the second top cap 213 is detachably connected to the top of the second shell 211, the first shell 111 and the second shell 211 have the same structure, and the first packaging structure also includes the ejector mechanism 21. That is, the first top cap 112 can match both the first shell 111 and the second shell 211, and the difference between the first packaging structure and the second packaging structure is that the first top cap 112 does not have the first hole 2131, and the second top cap 213 has the first hole 2131; after the second top cap 213 of the second packaging structure is replaced by the first top cap 112, the second packaging structure can be applied to the stripping operation of the DTS single component 31. In actual operation, depending on the object to be transferred, the first top cap 112 or the second top cap 213 can be replaced on the second shell 211. The first packaging structure can be obtained by making minor changes to the second packaging structure, thereby reducing the production cost of the equipment under the condition of avoiding damage to the DTS single component. The first packaging structure avoids structural damage to the DTS single component 31 during the packaging process, makes structural adjustments based on the original equipment, ensures the yield rate of the final power module, and improves production efficiency. At the same time, the overall modification of the equipment is relatively small, reducing the equipment production cost of the packaging structure. In addition, the structural difference between the first packaging structure and the second packaging structure is relatively small. In actual operation, they can be switched back and forth according to actual usage needs, thereby improving the utilization rate of the device and avoiding waste of production resources due to idle equipment.

[0055] Optionally, the first top cap 112 and the top of the first shell 111 are connected to each other via a threaded connection or a snap-fit ​​structure, which can be selected according to actual needs during actual production; the second top cap 213 and the top of the second shell 211 are connected to each other via a threaded connection or a snap-fit ​​structure, which can be selected according to actual needs during actual production.

[0056] In other embodiments, the first top cap 112 is fixedly connected to the top of the first shell 111. The structural arrangement of the first top cap 112 and the first shell 111 improves the production efficiency of the positioning mechanism 11 during the production process of the positioning mechanism 11, thereby improving the production efficiency of the first packaging structure.

[0057] An embodiment of the present invention further provides a packaging method for a silicon carbide power module. The packaging method is performed using the packaging structure of the silicon carbide power module as described above, and comprises the following steps:

[0058] S1, using a second packaging structure to peel the silicon carbide chip 41 from the chip carrier film 42 and transfer it to a packaging station;

[0059] S2, using the first packaging structure to peel the DTS single component 31 from the DTS carrier film 32 and transfer it to a packaging station, and then attach the DTS single component 31 to the silicon carbide chip 41;

[0060] The first packaging structure includes a positioning mechanism 11 and a first transfer mechanism. The positioning mechanism 11 includes a first shell 111 having an accommodating chamber and a first top cap 112 disposed on the top of the first shell 111. The top surface of the first top cap 112 is a plane without a hole structure.

[0061] Step S2 specifically includes: arranging the positioning mechanism 11 at the position corresponding to the DTS single component 31, so that the DTS carrier film 32 is arranged on the top surface of the first top cap 112, and the positioning mechanism 11 positions and supports the DTS single component. Figure 3 As shown, the DTS carrier film 32 is arranged on the top surface of the first top cap 112, the first suction nozzle 121 is arranged close to the copper foil 312, and the sintered nanosilver layer 311 is arranged between the copper foil 312 and the DTS carrier film 32; the first transfer mechanism moves to the position corresponding to the DTS monomer component, sucks the DTS single component 31 to peel the DTS single component 31 from the DTS carrier film 32, and transfers the DTS single component 31 to the packaging station.

[0062] The second packaging structure includes a pin mechanism 21 and a second transfer mechanism, wherein the pin mechanism 21 includes a second shell 211 having an accommodating chamber, a pin assembly 212, and a second top cap 213 arranged on the top of the second shell 211, the second shell 211 is connected to a vacuum generating device for adsorbing the chip carrier film 42; the pin assembly 212 includes a driving member 2121 externally arranged on the second shell 211, a guide rod 2122 transmission-connected to the driving member 2121, an elastic reset member 2123 connected to the guide rod 2122, a pin base 2124 arranged on the top of the guide rod 2122, and a pin 2125 arranged on the top surface of the pin base 2124; a first hole 2131 is opened on the top surface of the second top cap 213 for the pin 2125 to pass through, and a second hole 2111 is opened on the bottom of the second shell 211. The first holes 2131 are evenly distributed on the top surface of the second top cap 213 , and the number of the ejector pins 2125 is less than or equal to the number of the first holes 2131 .

[0063] Step S1 specifically includes: the ejector mechanism 21 is arranged corresponding to the silicon carbide chip 41 and the chip carrier film 42 is arranged on the top surface of the second top cap 213, and the second top cap 213 vacuum adsorbs the chip carrier film through the first hole 2131. See the schematic diagram of the state. Figure 7 As shown; the ejector pin 2125 is driven by the driving member 2121 to pass through the first hole 2131 in the vertical direction to lift up the chip carrier film 42, and the second transfer mechanism peels and transfers the silicon carbide chip 41 from the chip carrier film 42. The overall structure of the silicon carbide chip 41 includes a silicon carbide chip 41 and a chip carrier film 42 for carrying the silicon carbide chip 41. The action force between the silicon carbide chip 41 and the chip carrier film 42 is relatively large. The second packaging structure adsorbs and lifts up the chip carrier film 42 through the ejector pin mechanism 21, so that the chip carrier film 42 is deformed, thereby reducing the difficulty of peeling between the chip carrier film 42 and the silicon carbide chip 41, thereby facilitating the peeling operation of the silicon carbide chip 41.

[0064] In some other embodiments, the step of providing an AMB ceramic substrate may be included before step S1, and the provided AMB ceramic substrate is placed in a packaging station. In step S1, the silicon carbide chip 41 is placed on the AMB ceramic substrate using the second packaging structure, and then in step S2, the DTS single component 31 is peeled off from the DTS carrier film 32 and transferred to the packaging station using the first packaging structure, and then the DTS single component 31 is bonded to the silicon carbide chip 41.

[0065] See also Figures 8 to 11 As shown, compared with the prior art, the surface morphology of the silicon carbide power module obtained by the packaging method of the silicon carbide power module of the present invention is complete and undamaged.

[0066] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above embodiments only express the preferred implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A packaging structure for a silicon carbide power module, characterized in that: It includes a first packaging structure, which is used to peel and transfer the DTS single component from the DTS carrier film; the first packaging structure includes a positioning mechanism and a first transfer mechanism, the positioning mechanism is used to position and support the DTS single component, and the first transfer mechanism is used to peel and transfer the DTS single component from the DTS carrier film; the positioning mechanism includes a first shell with an accommodating chamber and a first top cap provided on the top of the first shell, and the top surface of the first top cap is a plane without a hole structure.

2. The packaging structure of the silicon carbide power module according to claim 1, characterized in that: The first transfer mechanism includes a first driving assembly and a first suction nozzle driven by the first driving assembly.

3. The packaging structure of the silicon carbide power module according to claim 1, characterized in that: The packaging structure also includes a second packaging structure for peeling and transferring the silicon carbide chip from the chip carrier film; the second packaging structure includes a ejector mechanism and a second transfer mechanism, the ejector mechanism includes a second shell having an accommodating chamber, an ejector assembly, and a second top cap provided on the top of the second shell, and the second shell is connected to a vacuum generating device for adsorbing the chip carrier film.

4. The packaging structure of the silicon carbide power module according to claim 3, characterized in that: The ejector assembly includes a driving member externally arranged on the second shell, a guide rod transmission-connected to the driving member, an elastic reset member connected to the guide rod, an ejector base arranged on the top of the guide rod, and an ejector arranged on the top surface of the ejector base; the top surface of the second top cap is provided with a first hole for the ejector to pass through, and the bottom of the second shell is provided with a second hole.

5. The packaging structure of the silicon carbide power module according to claim 4, characterized in that: The second shell includes a first part and a second part arranged in sequence from bottom to top, the diameter of the first part is larger than the diameter of the second part, the elastic return member is arranged in the first part, the extension and contraction direction of the elastic return member is arranged parallel to the vertical direction, the top end of the elastic return member is connected to the top wall of the first part, and the bottom end of the elastic return member is connected to the guide rod.

6. The packaging structure of the silicon carbide power module according to claim 5, characterized in that: The first top cap is detachably connected to the top of the first shell, and the second top cap is detachably connected to the top of the second shell. The first shell and the second shell have the same structure, and the first packaging structure also includes the ejector mechanism.

7. The packaging structure of the silicon carbide power module according to claim 1, characterized in that: The first top cap is fixedly connected to the top of the first shell.

8. A method for packaging a silicon carbide power module, characterized in that: The packaging method is performed using the packaging structure of the silicon carbide power module according to any one of claims 1 to 7, comprising the steps of: S1, using the second packaging structure to peel the silicon carbide chip from the chip carrier film and transfer it to the packaging station; S2, using the first packaging structure to peel the DTS single component from the DTS carrier film and transfer it to the packaging station, and then attach the DTS single component to the silicon carbide chip; The first packaging structure includes a positioning mechanism and a first transfer mechanism, the positioning mechanism includes a first shell having an accommodating chamber and a first top cap provided on the top of the first shell, the top surface of the first top cap being a plane without a hole structure; Step S2 specifically includes: setting the positioning mechanism at the position corresponding to the DTS single component, so that the DTS carrier film is set on the top surface of the first top cap, and the positioning mechanism positions and supports the DTS single component; the first transfer mechanism moves to the position corresponding to the DTS single component, sucks the DTS single component to peel the DTS single component from the DTS carrier film, and transfers the DTS single component to the packaging station.

9. The packaging method of the silicon carbide power module according to claim 8, characterized in that: The second packaging structure includes a pin mechanism and a second transfer mechanism. The pin mechanism includes a second shell having an accommodating chamber, a pin assembly, and a second top cap provided on the top of the second shell. The second shell is connected to a vacuum generating device for adsorbing the chip carrier film. The pin assembly includes a driving member externally arranged on the second shell, a guide rod transmission-connected to the driving member, an elastic reset member connected to the guide rod, an pin base provided on the top of the guide rod, and a pin provided on the top surface of the pin base. The top surface of the second top cap is provided with a first hole for the pin to pass through, and the bottom of the second shell is provided with a second hole.

10. The method for packaging a silicon carbide power module according to claim 9, wherein: Step S1 specifically includes: the ejector mechanism is arranged corresponding to the silicon carbide chip and the chip carrier film is arranged on the top surface of the second top cap, and the second top cap vacuum adsorbs the chip carrier film through the first hole; the ejector is driven by the driving member to pass through the first hole in a vertical direction to lift the chip carrier film, and the second transfer mechanism peels and transfers the silicon carbide chip from the chip carrier film.

Images