Display panel, manufacturing method of display panel and display device

Abstract

The invention provides a display panel, a manufacturing method of the display panel and a display device, the display panel comprises a substrate layer, an insulating layer, a communication part, a metal wiring layer and a conductive part, the insulating layer is located at one side of the substrate layer; the communicating part at least penetrates through the substrate layer and the insulating layer, the metal wiring layer is located on the side, away from the substrate layer, of the insulating layer, and the orthographic projection of the communicating part on the substrate layer is located in the orthographic projection range of the metal wiring layer on the substrate layer; the conductive part is located in the communication part, one end of the conductive part is connected with the metal wiring layer, and the other end of the conductive part is an electrostatic output end. According to the display panel provided by the invention, the conductive part is filled in the communication part, so that a conductive path is formed in the display panel, charges in the display panel are led out, and the antistatic capability of the display panel is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] With the continuous development of display technology, display devices are widely used in people's daily life and work.

[0003] During the use of the display device, static electricity will inevitably be introduced into the display device, causing poor display or touch of the display device, thus affecting the service life of the display device. Summary of the invention

[0004] In view of this, the purpose of the present disclosure is to provide a display panel, a method for manufacturing a display panel and a display device. The display panel can.

[0005] Based on the above objectives, the present disclosure discloses a display panel in a first aspect, the display panel comprising:

[0006] Substrate layer,

[0007] an insulating layer, located on one side of the substrate layer;

[0008] The connecting portion at least penetrates the substrate layer and the insulating layer;

[0009] The metal wiring layer is located on the side of the insulating layer away from the substrate layer, and the orthographic projection of the connecting portion on the substrate layer is located within the orthographic projection range of the metal wiring layer on the substrate layer;

[0010] The conductive part is located in the connecting part, one end of the conductive part is connected to the metal wiring layer, and the other end is the electrostatic output end.

[0011] In a specific embodiment, the extending direction of the connecting portion is perpendicular to the substrate layer;

[0012] Preferably, the connecting portion includes at least one through hole, and the through hole sequentially penetrates the substrate layer and the insulating layer to the surface of the metal wiring layer;

[0013] Or the connecting portion includes at least one first via hole and at least one second via hole, the first via hole penetrates the substrate layer, the second via hole penetrates the insulating layer, and the first via hole and the second via hole are connected to each other in the thickness direction of the display panel.

[0014] In a specific embodiment, the connecting portion has a first opening and a second opening which are arranged opposite to each other along the thickness direction of the display panel, the first opening is located on a side surface of the substrate layer away from the insulating layer, the second opening is located on a side surface of the insulating layer away from the substrate layer, and the aperture of the first opening is larger than the aperture of the second opening;

[0015] Preferably, in a direction from the substrate layer to the insulating layer, the connecting portion has a tapered structure.

[0016] In a specific embodiment, the display panel includes a display area and a non-display area surrounding the display area, and the connecting portion is located in the non-display area.

[0017] In a specific embodiment, the conductive portion includes a conductive material;

[0018] Preferably, the conductive material includes silver paste or conductive glue.

[0019] In a specific embodiment, the display panel further includes a composite tape layer.

[0020] The composite tape layer is located on the side of the substrate layer away from the insulating layer, and the end of the conductive part away from the metal wiring layer is connected to the composite tape layer;

[0021] Preferably, the composite tape layer includes a metal layer, and one end of the conductive portion away from the metal wiring layer is connected to the metal layer.

[0022] In a specific implementation, the display panel further includes a barrier layer, a light shielding layer, a buffer layer and an active layer located on the substrate layer, and the insulating layer covers a side of the active layer away from the substrate layer.

[0023] A second aspect of the present disclosure provides a method for manufacturing the above display panel, the method comprising the following steps:

[0024] Prepare the substrate layer,

[0025] forming an insulating layer on the substrate layer;

[0026] forming a metal wiring layer on the insulating layer;

[0027] forming a connecting portion at least penetrating the substrate layer and the insulating layer;

[0028] The conductive part is filled in the connecting part, so that one end of the conductive part is connected to the metal wiring layer and the other end is the electrostatic output end.

[0029] In a specific embodiment, forming a connecting portion that at least penetrates the substrate layer and passes through the insulating layer specifically includes:

[0030] In a direction from the substrate layer to the insulating layer, at least one through hole penetrating the substrate layer and the insulating layer is formed based on a puncture process;

[0031] Or, based on an etching process, a first via hole and a second via hole are formed on the substrate layer and the insulating layer respectively, and the first via hole and the second via hole are connected to each other in the thickness direction of the display panel.

[0032] A third aspect of the present disclosure provides a display device, which is the display panel of any one of the above items.

[0033] Compared with the prior art, the display panel provided by the present invention forms a conductive path in the display panel by filling the connecting part with a conductive part, wherein one end of the conductive part is connected to the metal wiring layer and the other end is the electrostatic output end. The charge in the display panel is discharged through the conductive path, thereby improving the anti-static ability of the display panel. Regardless of whether the test is powered-on ESD, unpowered ESD, flat-panel ESD, or high-voltage excitation, the anti-static ability of the product can be greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the present disclosure or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 A cross-sectional schematic diagram of a display panel is provided for the first aspect of the present disclosure;

[0036] Figure 2 for Figure 1 A magnified schematic diagram of part A;

[0037] Figure 3 A schematic top view of a display panel provided in the first aspect of the present disclosure;

[0038] Figure 4 A schematic flow chart of a method for manufacturing a display panel provided in the second aspect of the present disclosure.

[0039] 100, substrate layer; 101, first PI substrate layer; 102, second PI substrate layer; 200, barrier layer; 201, first barrier layer; 202, second barrier layer; 203, third barrier layer; 300, light shielding layer; 400, buffer layer; 401, silicon nitride buffer layer; 402, silicon oxide buffer layer; 500, active layer; 501, channel region; 502, drain region; 503, source region; 600, insulating layer; 700, capacitor insulating layer; 10, connecting part; 11, first opening; 12, second opening; 20, conductive part; 30, metal routing layer; 40, drain layer; 50, source layer; 60, gate layer; AA, display area; NAA, non-display area; B, frame removal; C, bending area. DETAILED DESCRIPTION

[0040] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0041] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the embodiments of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0042] The inventor of the application found the following problems in the related technology during the long-term practical work process: the display panel of OLED (Organic Light-Emitting Diode) lacks silver paste points on the terminal part compared with LCD (Liquid Crystal Display), and its anti-static ability is worse than LCD. After the static electricity enters the display panel, it will damage the metal wiring inside the screen and cause failure. Most of the methods to improve the anti-static ability of related display panels are to widen the metal wiring, add BSM masks or invent new anti-static materials to buffer the damage of static electricity to the circuit. However, with the above methods, the generated charge is still retained in the display panel, and the damage to the metal wiring is only different in degree.

[0043] Based on the above reasons, the present disclosure provides a display panel, which increases a discharge path to guide charges out of the screen, thereby achieving the effect of improving the anti-static ability of the display panel.

[0044] See also Figure 1-Figure 3 , Figure 1 A cross-sectional schematic diagram of a display panel is provided for the first aspect of the present disclosure; Figure 2 for Figure 1 A magnified schematic diagram of part A; Figure 3 A schematic top view of a display panel provided in the first aspect of the present disclosure.

[0045] See also Figure 1-Figure 2In a first aspect, the present disclosure provides a display panel, which includes a substrate layer 100, an insulating layer, a connecting portion 10, a metal wiring layer 30 and a conductive portion 20, wherein the insulating layer 600 is located on one side of the substrate layer 100; the connecting portion 10 at least penetrates the substrate layer 100 and the insulating layer 600, the metal wiring layer 30 is located on the side of the insulating layer 600 away from the substrate layer 100, and the orthographic projection of the connecting portion 10 on the substrate layer 100 is located within the orthographic projection range of the metal wiring layer 30 on the substrate layer 100; the conductive portion 20 is located in the connecting portion 10, one end of the conductive portion 20 is connected to the metal wiring layer 30, and the other end is an electrostatic output end.

[0046] It should be noted that by filling the conductive part 20 into the connecting part 10, one end of the conductive part 20 is connected to the metal wiring layer 30, and the other end is the electrostatic output end, so that a conductive path is formed in the display panel. The charge in the display panel is discharged through the conductive path, thereby improving the anti-static ability of the display panel. Regardless of whether it is powered-on ESD, unpowered ESD, flat-panel ESD, or high-voltage excitation testing, the anti-static ability of the product can be greatly improved.

[0047] See also Figure 1 In a specific embodiment, in the thickness direction of the display panel, the display panel further includes a barrier layer (Barrier) 200 and a buffer layer (Buffer) 400 located on the substrate layer 100 .

[0048] Continue to see Figure 1 In some specific embodiments, the substrate layer 100 may include a first PI substrate layer 101, a first barrier layer 201, a second PI substrate layer 102, and a second barrier layer 202, which are stacked in sequence, wherein the first barrier layer 201 and the second barrier layer 202 are collectively referred to as a barrier layer (Barrier) 200. Exemplarily, the substrate layer 100 is a flexible material, so that the display panel can be bent, so that the display panel can achieve functions such as curved display, folding display or scrolling display. For example, the material of the flexible substrate layer 100 may be any one of polyimide (PI), polycarbonate (PC) or polyvinyl chloride (PVC). The substrate layer 100 may also be a hard material, such as the material of the hard substrate layer 100 may be any one of glass or plastic. The materials used for the first barrier layer 201 and the second barrier layer 202 include silicon nitride (SiOx)

[0049] Continue to see Figure 1In some specific embodiments, a buffer layer (Buffer) 400 is located on the barrier layer 200. Exemplarily, the buffer layer 400 includes an inorganic layer or an organic layer. For example, the buffer layer 400 can be formed of a material selected from inorganic materials such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide or aluminum nitride, or organic materials such as acrylic, polyimide or polyester. The buffer layer 400 may include a single layer or multiple layers. The buffer layer 400 is used to block oxygen and moisture, prevent moisture or impurities from diffusing through the substrate, and provide a flat surface on the upper surface of the substrate, thereby facilitating the preparation of the active layer 500. For example, the buffer layer 400 in this embodiment may include a silicon nitride buffer layer 401 and a silicon oxide buffer layer 402 arranged in sequence.

[0050] Continue to see Figure 1 For example, the insulating layer 600 in this embodiment specifically includes a gate insulating layer (Gate Insulator, GI), and the gate insulating layer (Gate Insulator, GI) is an inorganic layer containing an inorganic material. For example, the gate insulating layer (Gate Insulator, GI) can contain inorganic materials such as silicon dioxide or silicon nitride.

[0051] See also Figure 1-Figure 2In one embodiment, the connecting portion 10 includes at least one through hole, which sequentially penetrates the substrate layer 100 and the insulating layer to the surface of the metal routing layer 30, that is, the connecting portion 10 adopts a one-step molding process, which is specifically based on a puncture process: first, the substrate layer 100, the barrier layer (Barrier) 200, the buffer layer (Buffer) 400 and the insulating layer 600 are prepared, and then the substrate layer 100, the barrier layer (Barrier) 200, the buffer layer (Buffer) 400 and the insulating layer 600 are sequentially penetrated to form a through hole, and then the conductive material is filled into the through hole. In another embodiment, the connecting portion 10 includes at least one first via hole and at least one second via hole, the first via hole penetrates the substrate layer 100, the second via hole penetrates the insulating layer 600, and the first via hole and the second via hole are interconnected in the thickness direction (X direction) of the display panel. Specifically, the connecting portion 10 also includes at least one third via hole located on the barrier layer 200 and at least one fourth via hole located on the buffer layer 400, and the first via hole is interconnected with the third via hole, the fourth via hole and the second via hole in the thickness direction (X direction) of the display panel. After the display panel is manufactured, the conductive material is filled into the first via hole, the third via hole, the fourth via hole and the second via hole. Furthermore, the extension direction of the connecting portion 10 is perpendicular to the substrate layer 100, that is, the extension direction of the through hole is perpendicular to the substrate layer 100, or the extension directions of the first via hole, the second via hole, the third via hole and the fourth via hole are perpendicular to the substrate layer 100. This design can not only reduce the process difficulty of preparing the connecting portion 10 and improve the preparation efficiency, but also reduce the transmission path of the charge in the connecting portion 10, thereby reducing the time of charge transmission. In this embodiment, by filling the conductive material into the connecting portion 10 to form a conductive path in the display panel, the charge in the display panel is led out, and the antistatic ability of the display panel is improved.

[0052] See also Figure 1-Figure 2 In a specific embodiment, the connecting portion 10 has a first opening 11 and a second opening 12 which are arranged relatively along the thickness direction (X direction) of the display panel. The first opening 11 is located on a side surface of the substrate layer 100 away from the insulating layer 600, and the second opening 12 is located on a side surface of the insulating layer 600 away from the substrate layer 100. The aperture R1 of the first opening 11 is greater than or equal to the aperture R2 of the second opening 12. Preferably, the aperture R1 of the first opening 11 is greater than the aperture R2 of the second opening 12. Further, in the direction from the substrate layer 100 to the insulating layer 600, the connecting portion 10 has a tapered structure. The connecting portion 10 designed in this way is conducive to the subsequent filling of the conductive portion 20. Such a design makes it easy to fill the conductive material of the conductive portion 20 into the connecting portion 10, thereby simplifying the preparation process.

[0053] See also Figure 3 , Figure 3The present invention is a top view schematic diagram of a display panel provided in accordance with the first aspect of the present invention. In a specific embodiment, the display panel includes a display area AA and a non-display area NAA. The connecting portion 10 is located in the non-display area NAA. By setting the position of the connecting portion 10 in the non-display area NAA, the reliability of the display panel will not be affected in the subsequent process of manufacturing the connecting portion 10, and water vapor will not enter the display area AA of the display panel along the connecting portion 10. Specifically, the non-display NAA area includes a border area B arranged around the display area and a bending area C connected to the border area. The edge connecting portion 10 is located in the border area B, and the connecting portion 10 is provided on one side of the border area B close to the bending area C and on both sides of the display AA area.

[0054] In a specific embodiment, the conductive part 20 includes a conductive material. Further, the conductive material includes silver paste or conductive glue. As a preferred embodiment, the conductive material includes conductive silver paste, and the charges in the display panel are conducted out through the conductive silver paste.

[0055] In a specific embodiment, the display panel also includes a composite tape layer (not shown in the drawings), the composite tape layer is located on the side of the substrate layer 100 away from the insulating layer 600, and the end of the conductive part 20 away from the metal wiring layer 30 is connected to the composite tape layer; further, the composite tape layer includes a metal layer, the end of the conductive part 20 away from the metal wiring layer 30 is connected to the metal layer, the metal layer is connected to the grounding terminal of the wire on the flexible printed circuit (Flexible Printed Circuit, FPC) for conduction, and plays a certain shielding role and "static discharge" role. Therefore, by connecting the end of the conductive part 20 away from the metal wiring layer 30 to the metal layer, a grounding loop is formed between the conductive part 20 and the metal layer, which can lead to the charge in the display panel, thereby improving the anti-static ability of the display panel.

[0056] See also Figure 1 In some specific embodiments, the active layer 500 is located on the buffer layer 400, and the active layer 500 includes a source region 503, a drain region 502, and a channel region 501 located between the source region 503 and the drain region 502. The display panel also includes a gate layer 60, a drain layer 40, and a source layer 50. The gate layer 60 is arranged on a side of the active layer 500 away from the substrate layer 100, and the channel region 501 overlaps with the projection of the gate layer 60 on the substrate. The gate layer 60 is arranged on the same layer as the metal wiring layer 30. The array substrate also includes a source layer 50 and a drain layer 40 arranged on a side of the gate layer 60 away from the substrate layer 100, and the source layer 50 and the drain layer 40 are respectively connected to the active layer 500 through vias.

[0057] Continue to see Figure 1In some specific embodiments, the light-shielding layer 300 is stacked on the side of the barrier layer 200 away from the substrate layer 100, and the orthographic projection of the light-shielding portion on the substrate layer 100 at least partially overlaps with the orthographic projection of the channel region 501 on the substrate layer 100, so as to block the light emitted from the outside toward the substrate layer 100 and avoid the influence of the external light on the channel region 501. The light-shielding layer 300 can be composed of a black matrix, and its own material can block light. A third barrier layer 203 is also stacked on the light-shielding layer 300.

[0058] Continue to see Figure 1 In a specific embodiment, the display panel further includes a capacitor insulation layer 700 (Capacitance Insulator, CI), an interlayer dielectric layer (Interlayer Dielectric, ILD), a planarization layer (Planarization Layer, PLN), etc. located on the side of the metal wiring layer 30 away from the substrate layer 100.

[0059] See also Figure 4 , Figure 4 It is a schematic flow chart of a method for manufacturing a display panel provided in the second aspect of the present disclosure.

[0060] See also Figure 4 According to a second aspect of the present disclosure, there is provided a method for manufacturing the above-mentioned display panel, the method comprising:

[0061] Prepare a substrate layer 100. Specifically, the substrate layer 100 can be a hard substrate layer 100 made of glass or plastic, or a flexible substrate layer 100 made of polyimide (PI), polycarbonate (PC) or polyvinylchloride (PVC).

[0062] An insulating layer 600 is formed on the substrate layer 100 ; specifically, the insulating layer 600 is a gate insulating layer (Gate Insulator, GI), and the gate insulating layer can be made of materials such as silicon dioxide or silicon nitride.

[0063] forming a metal wiring layer 30 on the insulating layer;

[0064] forming a connecting portion 10 that at least penetrates the substrate layer 100 and the insulating layer;

[0065] The conductive part 20 is filled in the connecting part 10 , so that one end of the conductive part 20 is connected to the metal wiring layer 30 , and the other end is the electrostatic output end.

[0066] It should be noted that a barrier layer (Barrier) 200 and a buffer layer (Buffer) 400 are stacked on the side of the substrate layer 100 close to the insulating layer in this embodiment, and the connecting portion 10 passes through the substrate layer 100, the barrier layer (Barrier) 200, the buffer layer (Buffer) 400 and the insulating layer 600 (gate insulating layer, GI) in sequence, so that the conductive portion 20 in the connecting portion 10 is connected to the metal wiring layer 30 for grounding.

[0067] In a specific embodiment, the connecting portion 10 can be formed by a puncture process, that is, in the direction from the substrate layer 100 to the insulating layer, at least one through hole penetrating the substrate layer 100 and the insulating layer 600 is formed based on the puncture process, that is, the connecting portion 10 is made by one-step molding; in another embodiment, vias can be formed on each film layer by an etching process, that is, at least one first via and at least one second via are formed on the substrate layer 100 and the insulating layer respectively based on the etching process, and the first via and the second via are connected in the thickness direction (X direction) of the display panel. Specifically, at least one third via is formed on the barrier layer 200 and at least one fourth via is formed on the buffer layer 400, and the first via is connected to the third via, the fourth via and the second via in the thickness direction (X direction) of the display panel. After the connecting portion 10 is manufactured, the connecting portion 10 is filled with a conductive material. The conductive material in this embodiment is specifically silver paste. Such a design can form a conductive path in the display panel, extract the charge in the display panel, and improve the antistatic ability of the display panel.

[0068] A third aspect of the present disclosure provides a display device, which includes the above-mentioned display panel. The display device can specifically be a display device such as an OLED display, as well as any product or component with a display function, such as a television, a digital camera, a mobile phone, a tablet computer, a car central control screen, AR / VR and other OLED display products including the display device, and a wearable product with camera function.

[0069] It should be noted that the above describes some embodiments of the present disclosure. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0070] The embodiments of the present disclosure are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present disclosure should be included in the scope of protection of the present disclosure.

Claims

1. A display panel, It is characterized in that include: Substrate layer, an insulating layer, located on one side of the substrate layer; A connecting portion at least passing through the substrate layer and the insulating layer; A metal wiring layer is located on a side of the insulating layer away from the substrate layer, and the orthographic projection of the connecting portion on the substrate layer is located within the orthographic projection range of the metal wiring layer on the substrate layer; The conductive part is located in the connecting part, one end of the conductive part is connected to the metal wiring layer, and the other end is an electrostatic output end.

2. The display panel according to claim 1, It is characterized in that The extending direction of the connecting portion is perpendicular to the substrate layer; Preferably, the connecting portion includes at least one through hole, and the through hole sequentially penetrates the substrate layer and the insulating layer to the surface of the metal wiring layer; Or the connecting portion includes at least one first via hole and at least one second via hole, the first via hole penetrates the substrate layer, the second via hole penetrates the insulating layer, and the first via hole and the second via hole are connected to each other in the thickness direction of the display panel.

3. The display panel according to claim 1 or 2, It is characterized in that The connecting portion has a first opening and a second opening which are arranged opposite to each other along the thickness direction of the display panel, the first opening is located on a side surface of the substrate layer away from the insulating layer, the second opening is located on a side surface of the insulating layer away from the substrate layer, and the aperture of the first opening is larger than the aperture of the second opening; Preferably, in a direction from the substrate layer to the insulating layer, the connecting portion has a tapered structure.

4. The display panel according to claim 1, It is characterized in that The display panel includes a display area and a non-display area surrounding the display area, and the connecting portion is located in the non-display area.

5. The display panel according to claim 1, It is characterized in that The conductive part includes a conductive material; Preferably, the conductive material includes silver paste or conductive glue.

6. The display panel according to claim 1, It is characterized in that The display panel further includes a composite tape layer, The composite tape layer is located on a side of the substrate layer away from the insulating layer, and one end of the conductive portion away from the metal wiring layer is connected to the composite tape layer; Preferably, the composite tape layer includes a metal layer, and one end of the conductive portion away from the metal wiring layer is connected to the metal layer.

7. The display panel according to claim 1, It is characterized in that The display panel further comprises a blocking layer, a light shielding layer, a buffer layer and an active layer located on the substrate layer, and the insulating layer covers a side of the active layer away from the substrate layer.

8. A method for manufacturing a display panel, It is characterized in that The steps include: Prepare the substrate layer, forming an insulating layer on the substrate layer; forming a metal wiring layer on the insulating layer; forming a connecting portion at least penetrating the substrate layer and the insulating layer; A conductive part is filled in the connecting part, so that one end of the conductive part is connected to the metal wiring layer and the other end is an electrostatic output end.

9. The method for manufacturing a display panel according to claim 8, It is characterized in that The forming of the connecting portion at least penetrating the substrate layer and passing through the insulating layer specifically includes: In a direction from the substrate layer to the insulating layer, forming at least one through hole penetrating the substrate layer and passing through the insulating layer based on a puncture process; Or based on an etching process, a first via hole and a second via hole are formed on the substrate layer and the insulating layer respectively, and the first via hole and the second via hole are connected to each other in the thickness direction of the display panel.

10. A display device, It is characterized in that The invention comprises the display panel as claimed in any one of claims 1 to 7.

Images