Electronic component wiring structure and electronic component connection method

Abstract

The purpose of the present invention is to reduce transmission loss and improve the heat dissipation of a substrate in a high-speed and large-capacity high-speed transmission system. A flexible wiring body (4), in which a conductive wiring part (411) is formed on a flexible insulating base material (40), is interposed between a substrate (2) and an electronic component (3) provided on the substrate (2), so that the wiring part (411) is electrically connected to the electronic component (3).

Description

Technical Field

[0001] The present invention relates to a wiring structure of electronic components used in electrical equipment, electronic equipment, computers, communication equipment, etc., and a method for connecting electronic components, and in particular to a wiring structure of electronic components and a method for connecting electronic components that are preferred for reducing transmission losses and improving heat dissipation of substrates in high-speed, large-capacity transmission systems. Background Art

[0002] Conventionally, electronic components such as semiconductor elements or devices, integrated circuits, etc. used in electrical equipment, electronic equipment, computers, communication equipment, etc., are mounted on printed wiring boards (hereinafter referred to as substrates). Conventionally, substrates made of copper-clad laminates using epoxy resins or E-glass fibers can be used.

[0003] However, in the case of the fifth generation mobile communication system (5G), which requires a higher speed, larger capacity, and lower latency of the transmission system, the above-mentioned existing substrates are difficult to meet the required transmission loss performance requirements. In addition, as a result of the further miniaturization of semiconductor circuit wiring, in 5G and beyond, the demand for heat dissipation of the substrate will increase. In particular, in 5G and beyond, due to the increase in heat generated by the large-scale, high-speed, and high-integration of electronic components, countermeasures for failures caused by thermal stress and heat dissipation become important. Conventional substrates cannot fully configure the GND (ground terminal) layer with good thermal conductivity on the outermost layer, so heat dissipation is difficult. In particular, due to the increase in heat generated by the large-scale, high-speed, and high-integration of electronic components, countermeasures for failures caused by thermal stress and heat dissipation become urgent issues.

[0004] Therefore, in recent years, in order to cope with the required characteristics of transmission loss and heat dissipation required in such high-speed transmission systems, the following improvements have been attempted.

[0005] In order to suppress transmission loss, improvements have been made to the semiconductor circuit design and the wiring circuit design of the substrate. In addition, various improvements have been made to the material of the substrate. In addition, in order to improve heat dissipation, in addition to the above-mentioned improvements to the material of the substrate, attempts have been made to install a blower fan, install a heat sink on the semiconductor package, and install an air cooling or water cooling mechanism.

[0006] However, in order to achieve further improvement in low dielectric properties and high heat dissipation, it is necessary to improve the substrate material and conduct reliability confirmation tests, which takes a long time to achieve. In particular, in order to achieve further improvement in low dielectric properties of substrate materials, the difficulty of product design is greatly increased, and the cost of substrate materials and the development cost of substrates are also increased.

[0007] Furthermore, the transmission loss in the high frequency band increases significantly, resulting in an increase in restrictions on the circuit design of the substrate. In addition, E glass cloth, which is generally used as a material for the substrate, is preferred from the viewpoint of preventing thermal expansion of the substrate and ensuring mechanical strength, but on the other hand, it may also become a major cause of the reduction in electrical properties represented by the dielectric constant and dielectric loss tangent required for the substrate and the smoothness of the surface.

[0008] Furthermore, in multilayer wiring boards, as the wiring density increases, XY wiring using vias is often used to switch wiring layers. However, there is a disadvantage that vias adversely affect transmission loss, and transmission loss increases as the wiring becomes longer.

[0009] Furthermore, in order to avoid the degradation of electrical characteristics and wiring density caused by vias, IVH (Interstitial Via Hole: local interlayer conductive hole) and back drilling are used in multi-layer substrates to connect only necessary layers without penetrating the holes. However, this increases the cost of the substrate and also limits the circuit design of the substrate.

[0010] On the other hand, a method of directly connecting the electronic components to each other via a connector rather than via a substrate is also considered, rather than improving the material or structure of the substrate itself. However, in such a method, a connector needs to be installed near the electronic component or the electronic component. In more miniaturized electronic components, it is often difficult to ensure an area for installing the connector, and transmission loss sometimes occurs in the connector.

[0011] Furthermore, since a general substrate and an electronic component are directly connected, there is a problem that when a part of the electronic component fails, the convenience of repair is reduced.

[0012] In order to solve the above-mentioned conventional problems, the following technologies are proposed in Patent Documents 1 and 2. Patent Document 1 discloses a technology that directly connects integrated circuit packages disposed on a substrate via a direct connection cable. Patent Document 2 discloses a technology that thermally connects circuit substrates provided with semiconductor elements via components.

[0013] Prior art literature

[0014] Patent Literature

[0015] Patent Document 1: Japanese Patent Application Publication No. 2010-192918

[0016] Patent Document 2: Japanese Patent Application Publication No. 2016-213361 Summary of the invention

[0017] Problems to be solved by the invention

[0018] However, the disclosed technologies of Patent Documents 1 and 2 are not intended to improve transmission loss and heat dissipation, and therefore do not specifically mention the point of electrically connecting electronic components provided on a substrate via a wiring body other than the substrate.

[0019] Therefore, the present invention is proposed in view of the above-mentioned problems, and its purpose is to provide a wiring structure of electronic components and a connection method of electronic components that are preferred in terms of reducing transmission losses and improving the heat dissipation of the substrate in a high-speed, large-capacity high-speed transmission system.

[0020] Means for solving problems

[0021] In order to solve the above-mentioned problems, the inventors have invented the following wiring structure of electronic components and method for connecting electronic components: a flexible wiring body having a conductive wiring portion formed on a flexible insulating substrate is clamped between a substrate and an electronic component arranged on the substrate, so that the wiring portion is electrically connected to the electronic component.

[0022] The wiring structure of the electronic component of the first invention is characterized in that a flexible wiring body having flexibility is interposed between a substrate and the electronic component arranged on the substrate, the flexible wiring body is formed with a conductive wiring portion, the wiring portion of the flexible wiring body is electrically connected to the electronic component and / or the substrate, the flexible wiring body, the substrate and the electronic component are directly electrically connected in a region where the flexible wiring body is interposed, the wiring portion of the flexible wiring body electrically connects two or more electronic components separated from each other and arranged on one substrate, and a region of the flexible wiring body spanning between the electronic components is separated from the substrate.

[0023] The wiring structure of the electronic component of the second invention is based on the first invention, and is characterized in that the wiring portion of the flexible wiring body arranged on any one end side or both end sides electrically connects two or more electronic components arranged on one substrate, or electrically connects electronic components respectively set on two or more substrates.

[0024] The wiring structure of an electronic component according to a third invention is characterized in that, in addition to the first invention or the second invention, a plurality of the flexible wiring bodies are stacked, and a wiring portion of each flexible wiring body is electrically connected to one of the electronic components.

[0025] The wiring structure of the electronic component of the fourth invention is based on the first invention or the second invention, and is characterized in that the wiring structure of the electronic component also has another substrate arranged at a lower side than the substrate, and another flexible wiring body is sandwiched between the substrate and the other substrate, and the wiring portion of the other flexible wiring body is electrically connected to the substrate.

[0026] The wiring structure of an electronic component according to a fifth invention is characterized in that, in the first invention or the second invention, the wiring portion of the flexible wiring body is provided in each layer of the conductor portion provided in two or more layers.

[0027] The wiring structure of the electronic component of the sixth invention is characterized in that a flexible wiring body with flexibility is sandwiched between a shell and an electronic component arranged on an inner wall surface of the shell that functions as a substrate, the flexible wiring body is formed with a conductive wiring portion, the wiring portion of the flexible wiring body is electrically connected to the electronic component and / or the wiring portion formed on the inner wall surface of the shell, the flexible wiring body, the inner wall surface of the shell and the electronic component are directly electrically connected in the area where the flexible wiring body is sandwiched, and the wiring portion of the flexible wiring body electrically connects two or more electronic components separated from each other and arranged separately on the inner wall surface and other substrates, thereby separating the electronic components on the flexible wiring body.

[0028] The method for connecting electronic components of the seventh invention is characterized in that a flexible wiring body having a conductive wiring portion and being flexible is clamped between a substrate and an electronic component arranged on the substrate so that the wiring portion is electrically connected to the electronic component and / or the substrate, the flexible wiring body, the substrate and the electronic component are directly electrically connected in a region where the flexible wiring body is clamped, the wiring portion of the flexible wiring body electrically connects two or more electronic components separated from each other and arranged on one substrate, and a region of the flexible wiring body spanning between the electronic components is separated from the substrate.

[0029] The electronic component connection method of the eighth invention is based on the seventh invention and is characterized in that the wiring parts of the flexible wiring body arranged on any one end side or both end sides are electrically connected to each other between two or more electronic components arranged on one substrate, or are electrically connected to each other between electronic components respectively set on two or more substrates.

[0030] A ninth invention provides a method for connecting electronic components according to the seventh or eighth invention, wherein when a plurality of the flexible wiring bodies are stacked, a wiring portion of each flexible wiring body is electrically connected to one of the electronic components.

[0031] Effects of the Invention

[0032] According to the present invention having the above structure, in particular, in 5G and later, when the transmission system is required to be high-speed, large-capacity, and low-latency, the transmission loss performance can be improved. In particular, the flexible wiring body can also make the wiring between electronic components straight, which is also effective in reducing the transmission loss caused by the wiring length. In addition, the material of the flexible wiring body can be optimized to increase the possibility of coping with the required transmission system. In addition, the material of the conductor part and the conductive part can be optimized to increase the possibility of coping with the required transmission system.

[0033] According to the present invention constituted by the above structure, especially in 5G and later, in the case of heat generation caused by the large-scale, high-speed, and high-integration of electronic components, the heat dissipation can be improved by separating the flexible wiring body from the substrate. In particular, the flexible wiring body is provided with a conductor portion, so that the heat from the electronic component can be effectively dissipated. In addition, by sandwiching the flexible wiring body between the electronic component and the substrate, the distance between the electronic component and the substrate can be increased, and the heat dissipation characteristics and cooling characteristics can be further improved. In particular, by spreading the wiring portion constituted by the conductor portion over a large area, the heat dissipation from the electronic component can be more efficiently conducted and diffused to the flexible wiring body. Although the heat transferred to the flexible wiring body is dissipated from the surface, since there is a space between it and the substrate, the efficiency of air cooling or liquid cooling can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a schematic cross-sectional view of a wiring structure of an electronic component to which the present invention is applied.

[0035] Figure 2 It is a plan view showing connection points provided at both ends of a wiring portion.

[0036] Figure 3 It is a plan view showing another example of the connection point provided in the wiring portion.

[0037] Figure 4 yes Figure 2 A sectional view of the first section.

[0038] Figure 5 It is a diagram showing the details of the conductive parts constituting each connection point.

[0039] Figure 6 It is used for Figure 5 A diagram illustrating a more detailed structure of the conductive portion shown.

[0040] Figure 7 It is a diagram showing an example of connection between an electronic component provided with a rod-shaped terminal and a flexible wiring body.

[0041] Figure 8This is a diagram showing an example in which a flexible wiring body is disposed between electronic components and then elastically deformed to straddle other electronic components.

[0042] Fig. 9 1 is a diagram showing an example of a planar arrangement of a flexible wiring body.

[0043] Fig.10 This is a diagram showing an example in which a plurality of electronic components are connected to one electronic component using a flexible wiring body.

[0044] Fig.11 This is a diagram showing an example in which two or more flexible wiring bodies are stacked.

[0045] Fig.12 (a) is an example of stacking two flexible wiring bodies. Fig.12 (b) is a diagram showing an example in which the flexible wiring body is composed of only one sheet.

[0046] Fig.13 This is a diagram showing a structure in which a region of a flexible wiring body interposed between a substrate and an electronic component is held at a predetermined gap by a gap retaining member.

[0047] Fig.14 It is used to set Fig.13 A diagram illustrating the method of using a gap maintaining body is shown.

[0048] Fig.15 This is a diagram showing an example in which a wiring structure is provided in a housing instead of a substrate.

[0049] Fig.16 This is a diagram for explaining a structure in which all the terminals of the electronic component are not electrically connected to the flexible wiring body.

[0050] Fig.17 This is a diagram showing an example in which another substrate is provided below the substrate.

[0051] Fig.18 This is a diagram showing an example in which a conductor portion is provided in multiple layers inside a flexible wiring body.

[0052] Fig.19 This is a diagram showing an example in which the above-mentioned wiring portion is provided on one end side of a flexible wiring body, and the other end side is configured with a connector. DETAILED DESCRIPTION

[0053] Hereinafter, a wiring structure of an electronic component to which the present invention is applied will be described in detail with reference to the drawings.

[0054] Figure 1(a) and (c) are schematic cross-sectional views of a wiring structure 1 to which the present invention is applied. The wiring structure 1 includes a substrate 2, two or more electronic components 3a and 3b provided on the substrate 2, and a flexible wiring body 4 sandwiched between the substrate 2 and the electronic components 3. The electronic components 3a and 3b are connected to the substrate 2 via a conductive portion 51. The flexible wiring body 4 is connected to the substrate 2 via a conductive portion 65. The wiring structure 1 to which the present invention is applied electrically connects the electronic component 3a and the electronic component 3b to each other via one or both of the substrate 2 and the flexible wiring body 4.

[0055] The substrate 2 is a so-called printed wiring board, and conductor wiring is implemented on or inside a board made of an insulator. The substrate 2 may also be composed of a board on which a plurality of printed wiring boards are mounted or connected. The substrate 2 may be any of a single-sided board (a wiring portion having one layer), a double-sided board (a wiring portion having two layers), and a multi-layer board (a wiring portion having three or more layers) in the printed wiring board.

[0056] The electronic components 3 include all components that can be mounted on the substrate 2, such as semiconductor elements or devices, integrated circuits, and modules. Among them, the electronic components 3 are particularly effective for components and modules with a large number of input and output signals such as high speed, low speed, and power. The electronic components 3 include electronic components that are directly electrically connected to the substrate 2 and electronic components that are electrically connected to the flexible wiring body 4.

[0057] The conductive parts 51 and 65 are made of so-called solder, but are not limited thereto, and any material may be used as long as it is made of conductive material.

[0058] Figure 2 , Figure 3 It is a plan view showing the correspondence relationship between the bottom surface of the electronic component 3a and the upper surface of the flexible wiring body 4 which are bonded to each other. Figure 4 (a) is the Figure 2 The sectional view of the first section. Figure 4 As shown, the flexible wiring body 4 has a conductor portion 41-1 formed on the upper surface of the substrate 40 and a conductor portion 41-2 formed on the lower surface of the substrate 40, and the upper surface of the conductor portion 41-1 and the lower surface of the conductor portion 41-2 are covered by a cover layer 43. In addition, the flexible wiring body 4 is provided with a conductive portion 63 for electrically connecting with the electronic component 3 at various locations.

[0059] The substrate 40 may be made of a flexible insulating material. The flexible insulating material may be, for example, an organic substrate, such as polyimide, modified polyimide, polyethylene terephthalate, liquid crystal polymer, polyethylene naphthalate, fluorine-based polymer, phenol, epoxy, polyphenylene oxide (PPO), polyphenylene oxide (PPE), polyetherimide, polyesterimide, etc. The organic material used for the organic substrate may be thermosetting or thermoplastic.

[0060] Furthermore, the base material 40 may also be formed of an inorganic substrate, and may be an insulating sheet formed of a glass sheet or other inorganic material, ceramic, or the like.

[0061] Furthermore, the substrate 40 may be an organic-inorganic composite substrate as long as it is flexible. The organic portion may be polyimide, modified polyimide, polyethylene terephthalate, liquid crystal polymer, polyethylene naphthalate, fluorine polymer, phenol, epoxy, PPO, PPE, polyetherimide, polyesterimide, etc., and the inorganic portion may be a glass material or other inorganic materials.

[0062] The glass material or other inorganic material constituting the substrate 40 may be in the form of sheets, fibers, short fibers, fillers (granules, powders, etc.), etc. Furthermore, they may be processed into the form of paper, mat, cloth, etc.

[0063] Furthermore, as long as the substrate 40 has flexibility, an organic material or an organic-inorganic composite material may be used instead of an inorganic material.

[0064] The base material 40 made of such a material is elastically deformable.

[0065] The conductor portions 41 - 1 and 41 - 2 are layers that constitute actual wiring. In practice, the conductor portion 41 is etched or the like to form a desired wiring shape. Figure 2 , Figure 3 The wiring portion 411 formed by etching the conductor portion 41 and connection points 412 , 413 , and 414 provided at both ends of the wiring portion 411 are shown.

[0066] The wiring portion 411 is formed in a linear shape so as to connect the connection points 412 and 413 to each other. The connection points 412 and 413 are electrically connected to the electronic component 3. Figure 3 In the embodiment, the wiring portion 411 is formed in a linear shape so as to electrically connect the connection points 412 , 413 , and 414 to each other. The connection points 412 , 413 , and 414 are electrically connected to the electronic component 3 .

[0067] The cover layer 43 is formed so as to cover the upper and lower surfaces of the flexible wiring body 4. However, the cover layer may not be provided.

[0068] The covering layer 43 is, for example, a film type using a polyimide base, a PET base or other materials, a printing type using an epoxy resin system, a polyurethane resin system or other materials, etc. Furthermore, the covering layer 43 may also be a photosensitive type using a photosensitive film or photosensitive ink, etc. The covering layer 43 is not particularly limited as long as it can cover the conductor part 41. By covering the surface of the conductor part 41 with the covering layer 43, it is possible to configure the conductor part 41 not to be directly exposed. As a result, the conductor part 41 can be prevented from rusting, scratching and breaking. The wiring part 411 of the flexible wiring body 4 can electrically connect two or more electronic components 3 arranged on the substrate 2 to each other. Figure 2 In the embodiment, the conductive portion 51a of one electronic component 3a is electrically connected to the connection point 412 of the wiring portion 411. Furthermore, the conductive portion 51a of another electronic component 3b is electrically connected to the connection point 413 of the wiring portion 411. As a result, the conductive portion 51a of the one electronic component 3a and the conductive portion 51a of the other electronic component 3b are electrically connected to each other via the wiring portion 411.

[0069] exist Figure 3 In the case of , the conductive portion 51a of one electronic component 3a is electrically connected to the connection point 412 of the wiring portion 411. Furthermore, the conductive portion 51a of another electronic component 3b is connected to the connection point 413 of the wiring portion 411. Furthermore, the conductive portion 51c of another electronic component 3c is connected to the connection point 414 of the wiring portion 411. As a result, the conductive portion 51a of the one electronic component 3a, the conductive portion 51a of another electronic component 3b, and the conductive portion 51c of another other electronic component 3c are electrically connected to each other via the wiring portion 411.

[0070] In addition, the wiring portion 411 may be made by pasting the conductor portion 41 and then forming a circuit, or may be made by depositing a conductor by plating, etc. Also, there are printing electronics technology, etc., or methods that use them together, but any method may be applied as long as at least the wiring portion 411 can be formed.

[0071] In this case, electrical connection between a part of the terminal 31 a of one electronic component 3 a and a part of the terminal 31 b of another electronic component 3 b can be performed by the flexible wiring body 4 without passing through the substrate 2 .

[0072] In addition, regarding the flexible wiring body 4, as Figure 4 The structure shown in (a) is based on the premise that the conductor portion 41-1 formed on the upper surface of the substrate 40 and the conductor portion 41-2 formed on the lower surface of the substrate 40 are two-layer structures, but it is not limited to this. Figure 4As shown in (b), it is composed of a single-layer structure of the conductor part 41 formed on the upper surface of the substrate 40. In this case, it is possible to omit the formation of the cover layer 43 on the lower surface of the substrate 40. In addition, it is not necessary to form the cover layer 43 for both the single-layer structure and the two-layer structure, and it is also possible to omit the formation of the cover layer 43 on the upper and lower surfaces of the flexible wiring body 4. In addition, the conductor part 41 may of course be composed of three or more layers.

[0073] In the flexible wiring body 4, the base material 40 is configured to be elastically deformable, and the conductor portion 41 and the cover layer 43 stacked on the base material 40 are also configured to be elastically deformable following the base material 40. Figure 1 As shown, even if the flexible wiring body 4 is not elastically deformed, the flexible wiring body 4 can be elastically deformed freely and fixed in a bent state. That is, when two or more electronic components 3 provided on one substrate 2 are electrically connected to each other via the flexible wiring body 4, the region of the flexible wiring body 4 spanning between the electronic components 3 is separated from the substrate 2. As a result, especially in 5G and later, heat is sometimes generated due to the large-scale, high-speed, and high-integration of the electronic components 3, but by separating the flexible wiring body 4 from the substrate 2, the heat dissipation can be improved. In particular, the flexible wiring body 4 is provided with the conductor part 41, so that the heat from the electronic component 3 can be effectively dissipated. In addition, by sandwiching the flexible wiring body 4 between the electronic component 3 and the substrate 2, the interval between the electronic component 3 and the substrate 2 can be increased, and the heat dissipation characteristics and cooling characteristics can be further improved. In particular, by spreading the wiring part 411 composed of the conductor part 41 over a large area, the heat dissipated from the electronic component 3 can be efficiently conducted and diffused to the flexible wiring body 4 by utilizing the high thermal conductivity of copper. Although the heat transferred to the flexible wiring body 4 is dissipated from the surface, since there is a space between the flexible wiring body 4 and the substrate 2, the efficiency of air cooling or liquid cooling can be improved.

[0074] In the flexible wiring body 4, as Figure 2 , Figure 3 As shown, the conductive portion 51 provided on the electronic component 3 is connected to the connection points 412 , 413 , and 414 of the flexible wiring body 4 .

[0075] Here, the conductive portions 51a-1, 51b-1, and 51c-1 are terminals or bumps for electrically connecting only to the conductive portion 21 of the substrate 2 and not to the conductive portion 41 of the flexible wiring body 4. Furthermore, the conductive portions 51a-2, 51b-2, and 51c-2 are terminals or bumps for electrically connecting to both the conductive portion 41 of the flexible wiring body 4 and the conductive portion 21 of the substrate 2. Furthermore, the conductive portions 51a-3, 51b-3, and 51c-3 are terminals or bumps for electrically connecting only to the conductive portion 41 of the flexible wiring body 4. Each of these conductive portions 51a and 51b is continuous with the flexible wiring body 4 via the conductive portion 51a described above.

[0076] Taking the first section as an example, if Figure 4 As shown, the portions corresponding to the connection points 412 and 413 of the flexible wiring body 4 are composed of conductive portions 63 provided vertically.

[0077] Figure 5 The details of the conductive part are shown. Figure 5 (a) is a structural example in which the conductive parts 51a-1, 51b-1, etc. are electrically connected only to the conductor part 21 of the substrate 2 and are not connected to the conductor part 41 of the flexible wiring body 4. The conductive part 63 can become the above-mentioned connection points 412, 413. The conductive part 63 is formed by embedding a conductor in a hole formed in the substrate 40. The cover layer 43 is removed from the portion where the conductive part 63 is formed, and the cover layer 43 is not formed. As a result, the conductive part 63 becomes a structure directly exposed to the outside.

[0078] By melting the conductive portion 51 interposed between the conductive portion 63 and the electronic component 3, they can be electrically connected. Figure 5 In the example shown in (a), the conductive portion 63 and the conductor portions 41-1 and 41-2 can be separated from each other so that the current flowing in the conductive portion 63 does not flow to the conductor portions 41-1 and 41-2. The conductive portion 63 is connected to the conductive portion 65 formed between the substrate 2 and the flexible wiring body 4. Therefore, the current flowing in the conductive portion 63 can flow to the conductor portion 21 of the substrate 2 via the conductive portion 65.

[0079] Figure 5 (b) is a structural example in which the conductive parts 51a-2, 51b-2, etc. are electrically connected to both the conductive part 41 of the flexible wiring body 4 and the conductive part 21 of the substrate 2. Figure 5 In the example shown in (b), the conductive portion 63 is separated from the conductor portion 41-1. On the other hand, the conductive portion 63 is connected to the conductor portion 41-2. Thus, it is possible to configure so that the current flowing in the conductive portion 63 does not flow to the conductor portion 41-1 but flows to the conductor portion 41-2. The conductive portion 63 is connected to the conductive portion 65 formed between the substrate 2 and the flexible wiring body 4. Therefore, the current flowing in the conductive portion 63 can flow to the conductor portion 21 of the substrate 2 via the conductive portion 65.

[0080] In addition, in this Figure 5In the structure shown in (b), by further configuring the conductive portion 63 to be connected to the conductive portion 41-1, in addition to being able to electrically connect the electronic component 3 to both the conductive portions 41-1 and 41-2, it is also possible to electrically connect the electronic component 3 to the conductive portion 21 of the substrate 2. Furthermore, by connecting the conductive portion 63 to the conductive portion 41-1 and separating the conductive portion 63 from the conductive portion 41-2, it is possible to electrically connect the electronic component 3 to the conductive portion 41-1 and the conductive portion 21 of the substrate 2, but not to electrically connect to the conductive portion 41-2.

[0081] Figure 5 (c) is a structural example in which the conductive parts 51a-3, 51b-3, etc. are electrically connected only to the conductor part 41 of the flexible wiring body 4. Figure 5 In the example shown in (c), the electronic component 3 and the conductor portion 41-1 can be electrically connected to each other by connecting the electronic component 3 to the exposed area of ​​the conductor portion 41-1 via the conductive portion 51. The conductor portion 41-1 is insulated from the conductor portion 41-2 and the conductive portion 65 via the substrate 40, so that the electronic component 3 can be electrically connected only to the conductor portion 41-1, and not to the conductor portion 41-2 and the conductive portion 65.

[0082] Figure 6 (a) shows that Figure 5 In the structure where the conductive part 63 is separated from the conductive parts 41-1 and 41-2 as shown in (a), the conductive part 63 is formed of the same material as the conductive part 41. The conductive part 63 is separated from the conductive parts 41-1 and 41-2 and is not electrically connected to the conductive parts 41-1 and 41-2.

[0083] Figure 6 (b) is an example in which the conductive portion 63 is formed of a conductive film formed on the side end surface of the substrate 40. The film-shaped conductive portion 63 is formed to cover the side end surface and the upper and lower surfaces of the substrate 40, but is separated from the conductor portions 41-1 and 41-2, so as to be not electrically connected to the conductor portions 41-1 and 41-2. By forming such a film-shaped conductive portion 63, the conductive portion 63 is formed with a hole 61 that passes through it from top to bottom in the center. In the case where the electronic component 3 is composed of a pin-shaped terminal, the electronic component 3 can also be inserted through the hole 61 formed in the conductive portion 63.

[0084] Figure 7 FIG. 4 shows an example of connection between an electronic component 3 provided with a rod-shaped terminal 31 and a flexible wiring body 4. Figure 7 In the example of FIG. 1 , the structure of the cover layer 43 provided on the flexible wiring body 4 is omitted.

[0085] The rod-shaped terminal 31 can be directly connected to the substrate 2. In order to further achieve electrical connection between the terminal 31 and the conductor parts 41-1 and 41-2 in the flexible wiring body 4, a conductive part 65 is provided that is conductive to either or both of the conductor parts 41-1 and 41-2 to be electrically connected. The conductive part 65 can be configured not to be connected to the substrate 2. By electrically connecting such a conductive part 65 to the terminal 31, an electrical connection can be made between the conductor parts 41-1 and 41-2. In addition, Figure 7 (a) is an example of a structure consisting of a single flexible wiring body 4. Figure 7 (b) is an example consisting of two flexible wiring bodies, but both are embodied in the same structure.

[0086] In the wiring structure 1 of the electronic component to which the present invention is applied, in addition to the connection based on the conductive portion 51, the connection between the substrate 2 and the flexible wiring body 4 can be made as follows: Figure 1 As shown in (b) and (d) of FIG. 3 , the conductive portion 51 can be conducted from the electronic component 3 to the substrate 2 or the flexible wiring body 4. As an example, a crimping process of an ACF (anisotropic conductive film) 52 may be performed. In this case, the ACF 52 can be pre-installed between the substrate 2 and the flexible wiring body 4, and they can be connected to each other by crimping.

[0087] And, if Figure 8 As shown, in the case where other electronic components 3' are already mounted on the substrate 2, the flexible wiring body 4 may be elastically deformed so as to straddle the other electronic components 3' after the flexible wiring body 4 is arranged from the electronic component 3a to the electronic component 3b. Thus, the flexible wiring body 4 can be arranged while maintaining the arrangement of the other electronic components 3' already mounted on the substrate 2. In this way, the elastically deformable flexible wiring body 4 is elastically deformed to separate the area straddling the electronic components 3a and the electronic components 3b from the substrate 2, thereby maintaining the arrangement of the electronic components 3'.

[0088] Furthermore, even when a heat sink is mounted on the electronic component 3, the heat dissipation can be improved as described above, so even if the height of the heat sink to be mounted is reduced, the same degree of heat dissipation can be ensured. Thus, the heat sink can be miniaturized or removed, thereby reducing costs. Furthermore, by reducing the size of the heat sink or removing the heat sink, convenience can be improved in mounting on a small device.

[0089] And, you can also Fig. 9 As shown in the plan views of the wiring structure 1 in (a), (b), (c), (d), and (e), the flexible wiring body 4 can be freely connected according to the planar arrangement of the electronic components 3a and 3b to be electrically connected. In particular, it can be as follows Fig. 9In the case where the electronic components 3a and 3b are arranged in a plane in a straight line in the horizontal direction as shown in (a), it is also possible to Fig. 9 As shown in (b), (c), and (d), the electronic components 3a and 3b are arranged in a planar manner in an inclined direction relative to each other. Fig. 9 As shown in (e), the electronic components 3a, 3b and 3h are arranged in a plane. In this case, any number of electronic components 3 can be arranged as long as two or more are connected. Furthermore, they can be connected by elastically deforming the flexible wiring body 4 in an inclined direction or elastically twisting the flexible wiring body 4 itself.

[0090] And, you can also Fig.10 As shown, a plurality of electronic components 3a, 3c, 3d are connected to one electronic component 3b by using a flexible wiring body 4. At this time, the electronic component 3b can be connected to the electronic component 3c provided on the same substrate 2 by using the flexible wiring body 4, and the electronic component 3b can also be connected to the electronic component 3d provided on a different substrate 2 by using the flexible wiring body 4.

[0091] In this way, by using the flexible wiring body 4 , whether the electronic components 3 are provided on one substrate 2 or on two or more substrates 2 , they can be electrically connected to each other.

[0092] And, if Fig.11 As shown in FIG. 1 , when two or more electronic components 3e and 3f are connected to one electronic component 3g, a plurality of flexible wiring bodies 4 may be stacked on the electronic component 3g side. Fig.12 As shown in (a), the flexible wiring body 4a connected to the electronic component 3e and the flexible wiring body 4b connected to the electronic component 3f are stacked on each other and electrically connected to the conductive portion 63 of the electronic component 3g via the wiring portion 411. The flexible wiring body 4a and the flexible wiring body 4b are connected to each other via the conductive portion 65. Furthermore, the flexible wiring body 4b and the substrate 2 are also connected via the conductive portion 65.

[0093] The result is, if Fig.12 As shown in (a), in addition to the electrical connection between the electronic component 3 and the flexible wiring body 4a, the electronic component 3 and the flexible wiring body 4b, the electronic component 3 and the substrate 2 can also be electrically connected. In addition to the electronic component 3, the flexible wiring body 4a, the flexible wiring body 4b and the substrate 2 can also be electrically connected.

[0094] Such parallel / series connection of current can be realized by adjusting the position of the conductive portion 63 in the flexible wiring body 4a, 4b. That is, when the flexible wiring bodies 4a, 4b are connected by passing electricity up and down, the conductive portion 63 is formed by providing a through hole and plating or embedding a conductive material therein, thereby forming the connection points 412, 413. On the other hand, when the flexible wiring bodies 4a, 4b are not connected by not passing electricity up and down, the through hole is not provided and remains as it is. In this way, by appropriately selecting the position where the connection points 412, 413 are formed, the above-mentioned desired parallel / series connection can be realized.

[0095] In terms of achieving such a desired parallel / series connection, Fig.12 Even when the flexible wiring body 4 is composed of only one sheet as shown in (b) of FIG. 1 , a desired parallel / series connection can be realized in the same manner.

[0096] Thus, the flexible wiring bodies 4a and 4b can be connected to the common conductive portion 63 of one electronic component 3. That is, the common conductive portion 63 of one electronic component 3g can be electrically connected to different electronic components 3e and 3f via the flexible wiring bodies 4a and 4b, respectively.

[0097] In addition, Fig.13 1 shows an example of implementing the present invention. The region of the flexible wiring body 4 sandwiched between the substrate 2 and the electronic component 3 can be maintained at a predetermined gap by a gap retainer 55. The gap retainer 55 includes a base portion 56, a pin 57 protruding upward from the base portion 56, and a pin 58 protruding downward from the base portion 56. The gap retainer 55 can be made of any material such as resin, metal, ceramic, etc.

[0098] The electronic component 3 is placed on the upper end of the pin 57. The pin 58 is inserted into the substrate 2 and fixed. The base portion 56 is placed on the substrate 2, and the flexible wiring body 4 is placed on the upper end surface of the base portion 56. Thus, the flexible wiring body 4 can be kept at a predetermined gap relative to the substrate 2 by the base portion 56. Furthermore, the electronic component 3 itself can be kept at a predetermined gap relative to the flexible wiring body 4 by the pin 57 protruding upward from the base portion 56.

[0099] When such a gap retaining body 55 is provided, Fig.14 As shown in (a), first, the pin 58 of the gap holding body 55 is inserted into the substrate 2. Then, as shown in Fig.14 As shown in (b), the inserted pin 58 and the pin 57 protruding upward from the base portion 56 are cut to a desired length. Fig.14As shown in (c), the flexible wiring body 4 is placed on the base body 56. Before placing the flexible wiring body 4, the conductive portion 65 may be formed on the substrate 2. Fig.14 As shown in (d) of FIG. 5 , the electronic component 3 is placed on the pins 57. Before the electronic component 3 is placed, the conductive portion 51 may be formed between the electronic component 3 and the flexible wiring body 4.

[0100] exist Fig.14 In the example of FIG. 5 , the base portion 56 is designed so that the interval between the substrate 2 and the flexible wiring body 4 is 0.4 mm, and the pin 57 is designed so that the interval between the flexible wiring body 4 and the electronic component 3 is 0.4 mm to 0.6 mm, but the dimensions are not limited to these. However, the mounting method is not limited to this.

[0101] By maintaining the gap between the substrate 2 and the flexible wiring body 4 or the gap between the flexible wiring body 4 and the electronic component 3 at a predetermined amount using the gap retaining body 55 , contact between the flexible wiring body 4 and the substrate 2 or the electronic component 3 can be avoided, thereby improving heat dissipation.

[0102] According to the present invention having the above-described structure, wiring can be realized via the flexible wiring body 4 , so that a general-purpose product can also be used as the substrate 2 .

[0103] Furthermore, in a multilayer wiring board, due to the increased wiring density, XY wiring using vias is often used to switch wiring layers. However, according to the present invention in which electronic components 3 are connected via a flexible wiring body 4, wiring without vias can be achieved using the flexible wiring body 4, and the wiring density can be increased without affecting the transmission loss.

[0104] Since the flexible wiring body 4 can be provided without contacting the substrate 2, wiring can be provided between the electronic components 3 at any angle and in the shortest possible distance. Figure 8 By arranging other electronic components 3' between the substrate 2 and the flexible wiring body 4 as shown, it is possible to increase the density of component arrangement and, in turn, to increase the degree of freedom in the circuit design of the substrate.

[0105] Furthermore, according to the present invention, the electronic components 3 are directly electrically connected via the flexible wiring body 4, so when the signal is led out from the electronic component 3, there is no need to provide a connector on the electronic component 3 or near the electronic component 3, and there is no need to provide a lead-out wiring of the connector from the electronic component 3. Therefore, according to the present invention, the area for providing the connector can be reduced. The increase in transmission loss caused by providing the connector can be reduced. Therefore, according to the present invention, the restrictions on circuit design are reduced and the degree of freedom is increased.

[0106] Furthermore, according to the present invention, since such a flexible wiring body 4 is interposed between the electronic component 3 and the substrate 2, the electronic component 3 is not directly connected to the substrate 2, and thus convenience can be improved in terms of repairing a failure in a part of the electronic component 3.

[0107] In addition, according to the present invention, it is also possible to Fig.15 As shown in FIG. 1 , a wiring structure 1 is provided on the housing 7 instead of the substrate 2. In this case, the wiring structure 1 provided on the housing 7 side includes the housing 7, two or more electronic components 3b provided on the housing 7, and a flexible wiring body 4 interposed between the housing 7 and the electronic components 3. Fig.15 The detailed structure of the illustrated embodiment is that the substrate 2 described above is replaced with a housing 7, and thus description thereof will be omitted below.

[0108] Furthermore, with regard to the present invention, Fig.16 As shown in (a) to (c) of FIG. 1 , it is possible that, for the electronic component 3, all of the conductive portions 51, 63, and 65 are not electrically connected to the flexible wiring body 4, and a portion of the conductive portions 51, 63, and 65 can be directly electrically connected to the substrate 2 as in the conventional case. In this case, the flexible wiring body 4 does not need to be extended to the region of the conductive portions 51, 63, and 65 that are directly electrically connected to the substrate 2.

[0109] Fig.17 The example in which another substrate 2' is provided below the substrate 2 is shown. Another flexible wiring body 4' is interposed between the substrate 2 and the other substrate 2'. The wiring portion 411 of the flexible wiring body 4' is electrically connected to the substrate 2 via the conductive portion 65. In this case, the wiring portion 411 of the flexible wiring body 4' may be electrically connected not only to the substrate 2 but also to the other substrate 2' via the conductive portion 65. Fig.17 (a) is an example formed on another substrate 2'. Fig.17 (b) is an example formed on a substrate 2' constituted by separate parts.

[0110] Fig.18 (a) shows an example of a so-called single-sided board structure consisting of a single-layer conductor portion 41 with respect to the flexible wiring body 4. Only the conductor portion 41 is electrically connected via the conductive portion 51.

[0111] Fig.18(b) shows an example of a so-called double-sided board structure composed of two layers of conductor parts 41-1 and 41-2 with respect to the flexible wiring body 4. The conductor parts 41-1 and 41-2 are composed of two layers in a manner of sandwiching the substrate 40. It is possible to directly electrically connect only to the conductor part 41-1 via the conductive part 51, and it is possible to adopt a structure in which the conductive part 63 is connected only to the conductor part 41-2 and separated from the conductor part 41-1, so as to directly electrically connect only to the conductor part 41-2 via the conductive part 51a. In addition, it is possible to adopt a structure in which the conductive part 63 is separated from the conductor parts 41-1 and 41-2 and is electrically connected only to the substrate 2.

[0112] Fig.18 (c) shows an example of a so-called multilayer board composed of three layers of conductor parts 41-1, 41-2, and 41-3 with respect to the flexible wiring body 4. A substrate 40-1 is sandwiched between the conductor part 41-1 and the conductor part 41-2. Also, a substrate 40-2 is sandwiched between the conductor part 41-2 and the conductor part 41-3.

[0113] In this case, the currents to be flowed to the conductor parts 41-1, 41-2, 41-3 can be connected in parallel / series by the conductive part 63 reaching the conductor part 41-1, or the conductive part 63 reaching the conductor part 41-2 or the conductor part 41-3. Of course, the conductor parts 41-1, 41-2, 41-3 through which the currents should not flow can be separated appropriately. In addition, the conductor part 41 (wiring part 411) can be composed of a single-sided board with a wiring part of 1 layer, a double-sided board with a wiring part of 2 layers, or a multi-layer board with a wiring part of 3 layers or more. However, compared with a single-sided board with a wiring part of 1 layer, a double-sided board with a wiring part of 2 layers or a multi-layer board with a wiring part of 3 layers or more is easy to reduce transmission loss and improve heat dissipation.

[0114] Fig.19 The example in which the wiring portion 411 (connection points 412, 413, 414) is provided on one end of the flexible wiring body 4 and the other end is connected to the connector 60 is shown. Of course, such a structure can also achieve the above-mentioned effect. However, the present invention is not limited to this structure. Fig.19 The structure shown is also included in the present invention, and therefore the connection points 412 , 413 , and 414 only need to be provided on the flexible wiring body 4 .

[0115] Description of symbols

[0116] 1: Wiring structure; 2: Substrate (printed wiring board); 3: Electronic component; 4: Flexible wiring body; 7: Shell; 21: Conductor portion of substrate 2; 31: Terminal; 40: Base material; 41: Conductor portion of flexible wiring body 4; 43: Covering layer; 51: Conductive portion; 55: Gap retaining body; 56: Base portion; 57, 58: Pin; 60: Connector; 61: Hole; 63, 65: Conductive portion; 411: Wiring portion; 412, 413, 414: Connection point.

Claims

1. A wiring structure of an electronic component, characterized in that: A flexible wiring body having flexibility is interposed between a substrate and an electronic component provided on the substrate, and the flexible wiring body has a conductive wiring portion. The wiring portion of the flexible wiring body is electrically connected to the electronic component and / or the substrate. The flexible wiring body, the substrate, and the electronic component are directly electrically connected in a region where the flexible wiring body is sandwiched. The wiring portion of the flexible wiring body electrically connects two or more electronic components that are separated from each other and are provided on one substrate, and a region of the flexible wiring body that spans between the electronic components is separated from the substrate.

2. The wiring structure of an electronic component according to claim 1, characterized in that: The wiring portion provided at one end or both ends of the flexible wiring body electrically connects two or more electronic components provided on one substrate, or electrically connects electronic components provided on two or more substrates.

3. The wiring structure of an electronic component according to claim 1 or 2, characterized in that: The flexible wiring body is stacked in multiple layers. The wiring portion of each flexible wiring body is electrically connected to one of the electronic components.

4. The wiring structure of an electronic component according to claim 1 or 2, characterized in that: The wiring structure of the electronic component further includes another substrate provided below the substrate. Another flexible wiring body is interposed between the substrate and the other substrate, and a wiring portion of the other flexible wiring body is electrically connected to the substrate.

5. The wiring structure of an electronic component according to claim 1 or 2, characterized in that: The wiring portion of the flexible wiring body is provided on each layer of the conductor portion provided in two or more layers.

6. A wiring structure of an electronic component, characterized in that: A flexible wiring body having flexibility is interposed between the housing and the electronic component provided on the inner wall surface of the housing functioning as a substrate. The flexible wiring body has a conductive wiring portion. The wiring portion of the flexible wiring body is electrically connected to the electronic component and / or the wiring portion formed on the inner wall surface of the housing. The flexible wiring body, the inner wall surface of the housing, and the electronic component are directly electrically connected in a region where the flexible wiring body is sandwiched. The wiring portion of the flexible wiring body electrically connects two or more electronic components that are separated from each other and are separately provided on the inner wall surface and another substrate, thereby isolating the electronic components on the flexible wiring body.

7. A method for connecting electronic components, characterized in that: A flexible wiring body having a conductive wiring portion and having flexibility is sandwiched between a substrate and an electronic component provided on the substrate so that the wiring portion is electrically connected to the electronic component and / or the substrate. The flexible wiring body, the substrate, and the electronic component are directly electrically connected in a region where the flexible wiring body is sandwiched. The wiring portion of the flexible wiring body electrically connects two or more electronic components that are separated from each other and are provided on one substrate, and a region of the flexible wiring body that spans between the electronic components is separated from the substrate.

8. The method for connecting electronic components according to claim 7, characterized in that: The wiring portions of the flexible wiring body provided at one end or both ends are electrically connected to two or more electronic components provided on one substrate, or to electronic components respectively provided on two or more substrates.

9. The method for connecting electronic components according to claim 7 or 8, characterized in that: When a plurality of the flexible wiring bodies are stacked, the wiring portion of each flexible wiring body is electrically connected to one of the electronic components.

Images