Inductor component

Abstract

Provided is an inductor component in which connectivity between a via wiring layer and a coil wiring layer is improved. The inductor component includes: a body; a coil provided inside the body and wound along a shaft; and first and second external electrodes provided on the body and electrically connected to the coil, the body including first and second end surfaces, first and second side surfaces, a bottom surface, and a top surface, the axis of the body being parallel to the bottom surface and intersecting the first and second side surfaces, the coil including first and second coil wiring layers stacked adjacent to each other in the axial direction, a first via wiring layer connecting the first and second coil wiring layers, and a second via wiring layer connecting the first and second via wiring layers in the axial direction. The first coil wiring layer has a first coil end portion, the first via hole wiring layer has a first via hole end portion, the first via hole end portion of the first via hole wiring layer is connected to the first coil end portion side of the first coil wiring layer, and the first coil end portion of the first coil wiring layer and the first via hole end portion of the first via hole wiring layer do not overlap but are separated from each other.

Description

Technical Field

[0001] The present disclosure relates to inductor components. Background Art

[0002] In the past, there was a component described in Japanese Patent Publication No. 2000-286125 (Patent Document 1) as an inductor component. The inductor component includes: a body, a coil disposed in the body and wound in a spiral shape along an axis, and a first external electrode and a second external electrode disposed in the body and electrically connected to the coil, and the coil includes: a plurality of coil wiring layers stacked adjacent to each other in the axial direction; and a plurality of via wiring layers located between adjacent coil wiring layers in the axial direction and connecting adjacent coil wiring layers in the axial direction. In such an existing inductor component, during manufacturing, a first insulating layer is disposed on a layer including a second coil wiring layer, and the first insulating layer is processed to provide a first opening for the first via wiring layer. Thereafter, a second insulating layer is also disposed on the first insulating layer, and the second insulating layer is processed to provide a second opening for the first coil wiring layer. A conductive material is filled in the first and second openings to form a first via wiring layer and a first coil wiring layer.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2000-286125

[0004] However, in the past, when the first opening and the second opening were filled with paste to simultaneously form the first via wiring layer and the first coil wiring layer connected to the first via wiring layer, the filling property of the magnetic paste in the first and second openings deteriorated, the volume of the first via wiring layer became smaller, and the first via wiring layer was poorly formed. As a result, the connectivity between the first via wiring layer and the second coil wiring layer deteriorated. Summary of the invention

[0005] Therefore, an object of the present disclosure is to provide an inductor component having improved connectivity between a via wiring layer and a coil wiring layer.

[0006] In order to solve the above-mentioned problems, an inductor component of one embodiment of the present disclosure includes: a body; a coil, which is arranged in the body and is spirally wound along an axis; and a first external electrode and a second external electrode, which are arranged in the body and are electrically connected to the coil, the body includes: a first end face and a second end face facing each other, a first side face and a second side face facing each other, and a bottom face connecting between the first end face and the second end face and between the first side face and the second side face, and a top face facing the bottom face, the axis is parallel to the bottom face and intersects with the first side face and the second side face, and the line The coil comprises: a first coil wiring layer and a second coil wiring layer which are adjacent and stacked in the above-mentioned axial direction, and a first via hole wiring layer which connects the above-mentioned first coil wiring layer and the above-mentioned second coil wiring layer, the above-mentioned first coil wiring layer has a first coil end, the above-mentioned first via hole wiring layer has a first via hole end, at least the above-mentioned first via hole end of the above-mentioned first via hole wiring layer is connected to a portion of the above-mentioned first coil wiring layer on the side of the above-mentioned first coil end, and when observed from the above-mentioned axial direction, the above-mentioned first coil end of the above-mentioned first coil wiring layer and the above-mentioned first via hole end of the above-mentioned first via hole wiring layer do not overlap but are separated.

[0007] When observed from the axial direction, the 1st coil end of the 1st coil wiring layer and the 1st via hole end of the 1st via hole wiring layer do not overlap but are separated. As a result, the filling property of the 1st via hole wiring layer is improved, the contact area between the 2nd coil wiring layer and the 1st via hole wiring layer can be ensured, and the connectivity between the 1st via hole wiring layer and the 2nd coil wiring layer becomes better.

[0008] In order to solve the above-mentioned problems, an inductor component of one embodiment of the present invention comprises: a body; a coil, which is arranged in the above-mentioned body and is spirally wound along an axis; and a first external electrode and a second external electrode, which are arranged in the above-mentioned body and are electrically connected to the above-mentioned coil, the above-mentioned body includes: a first end face and a second end face facing each other, a first side face and a second side face facing each other, and a bottom face connecting between the above-mentioned first end face and the above-mentioned second end face and between the above-mentioned first side face and the above-mentioned second side face, and a top face facing the above-mentioned bottom face, the above-mentioned axis is parallel to the above-mentioned bottom face and intersects with the above-mentioned first side face and the above-mentioned second side face, and the above-mentioned coil has: a first coil wiring layer and a second coil wiring layer stacked adjacent to each other in the above-mentioned axial direction, and the above-mentioned first coil is connected to the above-mentioned first coil. The wiring layer is connected to the first via wiring layer of the second coil wiring layer, the first coil wiring layer has a first coil end, the first coil end has a first coil outermost end located at the outermost end in the extension direction of the first coil wiring layer, the first via wiring layer has a first via end, the first via end has a first via outermost end located at the outermost end in the extension direction of the first via wiring layer, at least the first via end of the first via wiring layer is connected to a portion of the first coil wiring layer on the side of the first coil end, and the distance between the first coil outermost end of the first coil wiring layer and the first via outermost end of the first via wiring layer is greater than 10 μm.

[0009] Here, when viewed axially, the first coil end of the first coil wiring layer is an area surrounded by the end connecting the respective ends of the inner circumferential surface and the outer circumferential surface which are parallel to each other and the straight line passing through the end of the inner circumferential surface and the end of the outer circumferential surface. The portion of the first coil wiring layer on the first coil end side refers to the portion on the first coil end side of the first coil wiring layer that is closer to the center line passing through the center of the length in the extension direction of the first coil wiring layer and orthogonal to the extension direction of the first coil wiring layer. When viewed axially, the outermost end of the first coil of the first coil wiring layer is the point located at the outermost end in the extension direction of the first coil wiring layer. The first via end of the first via wiring layer and the outermost end of the first via of the first via wiring layer are also the same.

[0010] The distance between the outermost end of the first coil of the first coil wiring layer and the outermost end of the first via hole of the first via hole wiring layer is greater than 10 μm. As a result, the filling property of the first via hole wiring layer is improved, the contact area between the second coil wiring layer and the first via hole wiring layer can be ensured, and the connectivity between the first via hole wiring layer and the second coil wiring layer becomes better.

[0011] According to the inductor component of one aspect of the present disclosure, it is possible to provide an inductor component in which connectivity between a via wiring layer and a coil wiring layer is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a perspective view showing a first embodiment of the inductor component.

[0013] Figure 2 This is a perspective front view of the inductor component as viewed from the first side surface.

[0014] Figure 3 yes Figure 2 A partial enlarged view of .

[0015] Figure 4 It is an exploded top view of the inductor components.

[0016] Figure 5 is a cross-sectional view of an inductor component.

[0017] Figure 6 This is a perspective front view showing the inductor component according to the third embodiment of the inductor component as viewed from the first side surface.

[0018] Figure 7 It is an exploded top view of the inductor components.

[0019] Figure 8 is a cross-sectional view of an inductor component.

[0020] Fig. 9 This is an explanatory diagram for explaining the prior art.

[0021] Description of Reference Numerals

[0022] 1, 1A...inductor component; 10...body; 11, 11a~11c...insulating layer; 13...first side surface; 14...second side surface; 15...first end surface; 16...second end surface; 17...bottom surface; 18...top surface; 20, 20A...coil; 20a...winding portion; 20b...first lead portion; 20c...second lead portion; 20d...inner peripheral surface; 20e...outer peripheral surface; 30...first external electrode; 31...first end portion; 32...first bottom portion; 33...first external electrode conductor layer; 40...second external electrode; 41...second end portion; 42...second bottom portion; 43...second external electrode conductor layer; 501~502...coil wiring layer; 601...via wiring layer; AX...axis line; E11, E13...coil end; E21, E23...via end. DETAILED DESCRIPTION

[0023] Hereinafter, an inductor component according to one aspect of the present disclosure will be described in detail by way of the illustrated embodiments. In addition, some of the drawings include schematic configurations and may not reflect actual dimensions or ratios.

[0024] (First embodiment)

[0025] Figure 1 It is a perspective view showing a first embodiment of the inductor component. Figure 2 This is a perspective front view of the inductor component as viewed from the first side surface. Figure 3 yes Figure 2 A partial enlarged view of . Figure 4 It is an exploded top view of the inductor components. Figure 5 is a cross-sectional view of the inductor component at the center line along the extending direction of the via wiring layer. Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown in FIG. 1 , the inductor component 1 includes a body 10, a coil 20 disposed in the body 10 and spirally wound along the axis AX, and a first external electrode 30 and a second external electrode 40 disposed in the body 10 and electrically connected to the coil 20. Figure 2 and Figure 3 In the figure, in order to make the structure easy to understand, the main body and the coil are depicted as transparent, but they may also be depicted as translucent or opaque.

[0026] The inductor component 1 is electrically connected to wiring of a circuit substrate (not shown) via the first and second external electrodes 30 and 40. The inductor component 1 is used, for example, as an impedance matching coil (matching coil) for a high-frequency circuit, and is used in electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, automotive electronic equipment, and medical / industrial machinery. However, the use of the inductor component 1 is not limited thereto, and it can also be used, for example, in a tuning circuit, a filter circuit, a rectifier smoothing circuit, etc.

[0027] The main body 10 is formed in a substantially rectangular parallelepiped shape. The surface of the main body 10 includes a first end face 15 and a second end face 16 facing each other, a first side face 13 and a second side face 14 facing each other, a bottom face 17 connecting the first end face 15 and the second end face 16 and the first side face 13 and the second side face 14, and a top face 18 facing the bottom face 17. The bottom face 17 is a face facing the mounting substrate side when the inductor component 1 is mounted on a mounting substrate (not shown).

[0028] As shown in the figure, the X direction is a direction perpendicular to the first end face 15 and the second end face 16 and from the first end face 15 to the second end face 16. The Y direction is a direction perpendicular to the first side face 13 and the second side face 14 and from the second side face 14 to the first side face 13. The Z direction is a direction perpendicular to the bottom face 17 and the top face 18 and from the bottom face 17 to the top face 18. The X direction also refers to the length direction of the body 10, the Y direction also refers to the width direction of the body 10, and the Z direction also refers to the height direction of the body 10. The X direction, the Y direction, and the Z direction are directions perpendicular to each other, and when arranged in the order of X, Y, and Z, they form a left-handed system.

[0029] The X direction also refers to the length direction of the body 10, the Y direction also refers to the width direction of the body 10, and the Z direction also refers to the height direction of the body 10. The length direction is the direction in which the first end face 15 and the second end face 16 face each other, and is a direction parallel to the straight line connecting the first end face 15 and the second end face 16 at the shortest distance. The width direction is the direction in which the first side face 13 and the second side face 14 face each other, and is a direction parallel to the straight line connecting the first side face 13 and the second side face 14 at the shortest distance. The height direction is the direction in which the top face 18 and the bottom face 17 face each other, and is a direction parallel to the straight line connecting the top face 18 and the bottom face 17 at the shortest distance.

[0030] The main body 10 is composed of a plurality of stacked insulating layers 11. The insulating layer 11 is composed of, for example, a material having borosilicate glass as a main component, or a material such as ferrite or resin. The stacking direction of the insulating layer 11 is a direction (Y direction) parallel to the first and second end faces 15, 16 and the bottom face 17 of the main body 10. That is, the insulating layer 11 is a layered structure unfolded on the XZ plane. The "parallel" in the present application is not limited to a precise parallel relationship, but also includes a substantially parallel relationship in consideration of the range of actual deviations. In addition, there is a case where the interfaces between the plurality of insulating layers 11 of the main body 10 become unclear due to firing, etc. In addition, Figure 4 In the figure, the direction from the upper left to the lower right is taken as the stacking direction (Y direction).

[0031] The first external electrode 30 and the second external electrode 40 are made of a conductive material such as Ag, Cu, Au, or an alloy having Ag, Cu, Au as a main component. Alternatively, the surfaces of the first external electrode 30 and the second external electrode 40 exposed from the body 10 may be coated with Ni, Sn, or the like.

[0032] The first external electrode 30 is an L-shaped electrode extending from the first end surface 15 to the bottom surface 17. The first external electrode 30 is embedded in the body 10 and exposed from the first end surface 15 and the bottom surface 17. The first external electrode 30 includes a first end surface portion 31 extending along the first end surface 15 and a first bottom surface portion 32 connected to the first end surface portion 31 and extending along the bottom surface 17.

[0033] The second external electrode 40 is L-shaped and extends from the second end surface 16 to the bottom surface 17. The second external electrode 40 is embedded in the body 10 and exposed from the second end surface 16 and the bottom surface 17. The second external electrode 40 includes a second end surface portion 41 extending along the second end surface 16 and a second bottom surface portion 42 connected to the second end surface portion 41 and extending along the bottom surface 17.

[0034] The first external electrode 30 has a structure in which a plurality of first external electrode conductor layers 33 embedded in the body 10 (insulating layer 11) are stacked. The second external electrode 40 has a structure in which a plurality of second external electrode conductor layers 43 embedded in the body 10 (insulating layer 11) are stacked. The first external electrode conductor layer 33 extends along the first end surface 15 and the bottom surface 17, and the second external electrode conductor layer 43 extends along the second end surface 16 and the bottom surface 17.

[0035] Thus, the first and second external electrodes 30 and 40 can be embedded in the body 10, so that the inductor component can be miniaturized compared to a structure in which the external electrodes are attached to the body 10. In addition, the coil 20 and the first and second external electrodes 30 and 40 can be formed in the same process, and by reducing the inconsistency in the positional relationship between the coil 20 and the first and second external electrodes 30 and 40, the inconsistency in the electrical characteristics of the inductor component 1 can be reduced.

[0036] In addition, the first external electrode 30 may not have the first end surface portion 31 but may be composed of the first bottom surface portion 32, and similarly, the second external electrode 40 may not have the second end surface portion 41 but may be composed of the second bottom surface portion 42. In other words, the first external electrode 30 and the second external electrode 40 may be provided at least on the bottom surface 17 of the body 10.

[0037] The coil 20 is made of, for example, the same conductive material as the first and second external electrodes 30 and 40. The coil 20 is wound in a spiral shape along the stacking direction of the insulating layer 11. The first end of the coil 20 is connected to the first external electrode 30, and the second end of the coil 20 is connected to the second external electrode 40. In addition, in the present embodiment, the coil 20 is integrated with the first and second external electrodes 30 and 40, and there is no clear boundary, but it is not limited to this, and the coil and the external electrode may be formed by different types of materials and different types of processes, so that there is a boundary.

[0038] The coil 20 is wound along the axis AX so that the axis AX is parallel to the bottom surface 17 and intersects the first side surface 13 and the second side surface 14. The axis AX of the coil 20 is consistent with the stacking direction (Y direction) of the insulating layer 11. In other words, a plurality of insulating layers 11 are stacked along the axis AX. The axis AX of the coil 20 refers to the central axis of the spiral shape of the coil 20. Specifically, the axis AX refers to the center of the innermost circumference of the coil 20.

[0039] The coil 20 includes a winding portion 20a, a first lead portion 20b connected between a first end of the winding portion 20a and a first external electrode 30, and a second lead portion 20c connected between a second end of the winding portion 20a and a second external electrode 40. In the present embodiment, the winding portion 20a is integrated with the first and second lead portions 20b and 20c, and there is no clear boundary, but the present invention is not limited thereto, and the winding portion and the lead portion may be formed of different types of materials and different types of processes, so that there is a boundary.

[0040] The winding portion 20a is wound in a spiral shape along the axis AX. In other words, the winding portion 20a is a portion where the coils 20 are wound in a spiral shape overlapping each other when viewed from a direction parallel to the axis AX. The first and second lead portions 20b and 20c are portions offset from the overlapping portions.

[0041] When viewed from the axis AX direction of the coil 20 , the shape of the coil 20 is bilaterally symmetrical with respect to a straight line passing through the axis AX of the coil 20 and parallel to the Z direction. This can suppress variations in the characteristics of the inductor component 1 .

[0042] like Figure 4 As shown, the coil 20 has: two second coil wiring layers 502 stacked along the axis AX, the first coil wiring layer 501, and the first via wiring layer 601 located between the first and second coil wiring layers 501, 502 adjacent to each other in the direction of the axis AX and connecting the first and second coil wiring layers 501, 502 adjacent to each other in the direction of the axis AX. The second coil wiring layer 502 is provided on the first insulating layer 11a, the first via wiring layer 601 is provided on the second insulating layer 11b, and the first coil wiring layer 501 is provided on the third insulating layer 11c. In addition, the coil wiring layer is two in the present embodiment, but may be three or more. The number of turns of the coil wiring layer is less than one turn, but may be one turn or more.

[0043] The first and second coil wiring layers 501 and 502 are each wound along a plane, connected in series and electrically connected to form a spiral. The coil wiring layer is wound along an XZ plane (the main surface of the insulating layer 11) orthogonal to the axis AX direction (Y direction). Along the extension direction, each coil wiring layer 501 and 502 has a constant width.

[0044] The first coil wiring layer 501 has a first coil end E11 and a second coil end on the opposite side of the first coil end E11. When viewed from the axis AX direction, the first coil end E11 is an area surrounded by a coil end 20f connecting the ends of the inner peripheral surface 20d and the outer peripheral surface 20e which are parallel to each other, and an imaginary straight line 20g passing through the ends of the inner peripheral surface 20d and the ends of the outer peripheral surface 20e.

[0045] The second coil wiring layer 502 has a first coil end E13 and a second coil end opposite to the first coil end E13. The first coil end E13 is a region defined in the same manner as the first coil end E11 of the first coil wiring layer 501.

[0046] Specifically, the second coil wiring layer 502 and the first coil wiring layer 501 are stacked in sequence along the Y direction. The second coil end of the second coil wiring layer 502 is connected to the first external electrode conductor layer 33 of the first external electrode 30. The second coil end of the first coil wiring layer 501 is connected to the second external electrode conductor layer 43 of the second external electrode 40.

[0047] The first via wiring layer 601 penetrates the second insulating layer 11b in the thickness direction (Y direction). Furthermore, the coil wiring layers adjacent to each other in the stacking direction are connected in series and electrically connected via the via wiring layer. In this way, the first and second coil wiring layers 501 and 502 are connected in series and electrically connected to each other via the first via wiring layer 601, while forming the spiral of the coil 20.

[0048] The first via wiring layer 601 is located between the first coil wiring layer 501 and the second coil wiring layer 502 in the axis AX direction, and connects the first coil wiring layer 501 and the second coil wiring layer 502 .

[0049] The first via wiring layer 601 is a long via wiring layer extending along the spiral direction of the coil 20 when viewed from the axis AX direction. The first via wiring layer 601 has a constant width along the extending direction. According to the above structure, the contact area between the first and second coil wiring layers 501, 502 and the first via wiring layer 601 can be increased, and the DC resistance of the coil 20 can be reduced. Furthermore, even if stacking misalignment occurs between the first and second coil wiring layers 501 and 502 and the first via hole wiring layer 601 during the manufacture of the inductor component 1, the first and second coil wiring layers 501 and 502 have a larger surface area facing the first and second coil wiring layers 501 and 502, so the contact probability between the first and second coil wiring layers 501 and 502 and the first via hole wiring layer 601 increases, and the possibility of poor conduction between the first and second coil wiring layers 501 and 502 and the first via hole wiring layer 601 can be reduced. Furthermore, disconnection of the first via hole wiring layer 601 can be prevented.

[0050] The first via hole wiring layer 601 has a first via hole end E21 and a second via hole end E23. In the first via hole wiring layer 601, the direction from the first via hole end E21 to the second via hole end E23 is the same as the direction from the first coil end E11 of the first coil wiring layer 501 to the second coil end. Here, when viewed from the axis AX direction, the first via hole end E21 is a region surrounded by a via hole end connecting the ends of the inner peripheral surface 20d and the outer peripheral surface 20e, which are parallel to each other, and an imaginary straight line passing through the ends of the inner peripheral surface 20d and the ends of the outer peripheral surface 20e. The second via hole end E23 is a region defined in the same manner as the first via hole end E21.

[0051] The first via end E21 of the first via wiring layer 601 is connected to the portion of the first coil wiring layer 501 on the side of the first coil end E11. When viewed from the axis AX direction, the first coil end E11 of the first coil wiring layer 501 and the first via end E21 of the first via wiring layer 601 do not overlap but are separated. By having the above structure, the filling properties of the first coil wiring layer 501 and the first via wiring layer 601 are improved, the contact area between the first via wiring layer 601 and the second coil wiring layer 502 can be ensured, and the connectivity between the first via wiring layer 601 and the second coil wiring layer 502 is improved. Here, the portion of the first coil wiring layer 501 on the side of the first coil end E11 refers to a portion of the first coil wiring layer 501 that is biased toward the first coil end E11 side of the first coil wiring layer 501 relative to the center line that passes through the center of the length of the first coil wiring layer 501 in the extension direction and is orthogonal to the extension direction of the first coil wiring layer 501.

[0052] Conventionally, the inductor component 1P is formed as follows. Fig. 9 As shown, in the cross-sectional view, the second coil wiring layer 502P, the first via wiring layer 601P and the first coil wiring layer 501P are stacked in sequence. Specifically, the second insulating layer 11B is firstly provided on the layer having the first insulating layer 11A and the second coil wiring layer 502P, and the first opening is provided on the second insulating layer 11B. Furthermore, the third insulating layer 11C having the second opening is provided on the second insulating layer 11B. At this time, when viewed from the stacking direction (axis AX direction), the end of the third insulating layer 11C includes the position P, and the end of the second insulating layer 11B also includes the position P. That is, when viewed from the stacking direction, the position of the end of the third insulating layer 11C overlaps with the position of the end of the second insulating layer 11B. The conductive paste containing the conductive material is filled in the first opening and the second opening, and the first via wiring layer 601P and the first coil wiring layer 501P connected to the first via wiring layer 601P are formed at the same time. However, the third insulating layer 11C is a part that hinders the filling and is separated when viewed from the filling direction (axis AX direction), and sometimes the conductive paste is not filled in the part of the first via wiring layer 601P close to the second insulating layer 11B, but bubbles V are generated. As a result, the first via wiring layer 601P is not easily filled, and sometimes the connectivity between the second coil wiring layer 502P and the first via wiring layer 601P is deteriorated. In addition, the end of the second insulating layer 11B overlaps the end of the third insulating layer 11C, so that a large concave portion may be formed in the portion close to the third insulating layer 11C on the surface of the first coil wiring layer 501P on the opposite side to the first via wiring layer 601P above the bubble V, and a large convex portion of the conductive material may be formed on the third insulating layer 11C adjacent to the concave portion. When other materials or the like collide with the convex portion, the first coil wiring layer 501P may be peeled off from the third insulating layer 11C.

[0053] In contrast, in this embodiment, if Figure 5As shown, in the cross-sectional view along the center line of the extension direction of the first via wiring layer 601, the first insulating layer 11a and the second coil wiring layer 502 are provided, and the second insulating layer 11b is provided thereon, and the first opening is provided in the second insulating layer 11b. Furthermore, the third insulating layer 11c having the second opening is provided on the second insulating layer 11b. At this time, when viewed from the stacking direction (axis AX direction), the end of the third insulating layer 11c does not overlap with the end of the second insulating layer 11b, but is separated. If the first opening and the second opening are filled with conductive paste and the first via wiring layer 601 and the first coil wiring layer 501 are formed at the same time, the first coil end E11 of the first coil wiring layer 501 does not overlap with the first via end E21 of the first via wiring layer 601, but is separated. Unlike the conventional method, the third insulating layer 11c does not hinder the filling, so the generation of bubbles V can be suppressed in the first via hole wiring layer 601, and the filling property of the first via hole wiring layer 601 is improved. The filling property is improved, so the contact area between the second coil wiring layer 502 and the first via hole wiring layer 601 can be ensured, and the connectivity between the first via hole wiring layer 601 and the second coil wiring layer 502 becomes good. In addition, in the present embodiment, the first coil end portion of the first coil wiring layer 501 and the first via hole end portion of the first via hole wiring layer 601 do not overlap but are separated, thereby generating a smaller recessed portion or no recessed portion on the surface of the first coil wiring layer 501 on the opposite side of the first via hole wiring layer 601. As a result, no convex portion of the conductive material is formed on the third insulating layer 11c, or even if a convex portion of the conductive material is formed, it is a smaller convex portion. Therefore, it is not easy to collide with other materials, and the first coil wiring layer 501 is not easy to peel off from the third insulating layer 11c. In addition, although the case where the first coil wiring layer 501 and the first via wiring layer 601 are formed at the same time is described, the first via wiring layer 601 and the second coil wiring layer 502 can also be formed at the same time. During manufacturing, the first coil wiring layer 501 can also be on the second side 14 side or on the first side 13 side. In addition, in the case where the position of the end of the third insulating layer 11c is not moved and the position of the end of the second insulating layer 11b is separated from the end of the third insulating layer 11c without overlapping, the volume of the first via wiring layer 601 becomes smaller, and as a result, the difference in linear expansion coefficient between the first via wiring layer 601 and the second insulating layer 11b becomes smaller, and the thermal stress related to the first via wiring layer 601 becomes smaller. As a result, the generation of cracks in the first via wiring layer 601 can be suppressed.

[0054] Preferably, the second coil wiring layer 502 has a first coil end E13, and the first via hole wiring layer 601 has an end on the opposite side of the first via hole end E21, namely, the second via hole end E23, and at least the second via hole end E23 of the first via hole wiring layer 601 is connected to the part of the second coil wiring layer 502 close to the first coil end E13. When observed from the axis AX direction, the first coil end E13 of the second coil wiring layer 502 and the second via hole end E23 of the first via hole wiring layer 601 do not overlap but are separated. The first coil end E13 of the second coil wiring layer 502 and the second via hole end E23 of the first via hole wiring layer 601 do not overlap but are separated. Therefore, when manufacturing the inductor component 1, even if the first via hole wiring layer 601 is misaligned with respect to the second coil wiring layer 502, the contact between the second coil wiring layer 502 and the first via hole wiring layer 601 can be ensured.

[0055] Preferably, the first coil end E11 of the first coil wiring layer 501 has a first coil outermost end E12 located at the outermost end in the extension direction of the first coil wiring layer 501, and the first via hole end E21 of the first via hole wiring layer 601 has a first via hole outermost end E22 located at the outermost end in the extension direction of the first via hole wiring layer 601, and the distance between the first coil outermost end E12 of the first coil wiring layer 501 and the first via hole outermost end E22 of the first via hole wiring layer 601 is 10 μm or more. In addition, when viewed from the axis AX direction, the first coil outermost end E12 of the first coil wiring layer 501 is a point located at the outermost end in the extension direction of the first coil wiring layer 501. When viewed from the axis AX direction, the first via hole outermost end E22 of the first via hole wiring layer 601 is a point located at the outermost end in the extension direction of the first via hole wiring layer 601.

[0056] Preferably, the distance between the outermost end E12 of the first coil of the first coil wiring layer 501 and the outermost end E22 of the first via of the first via wiring layer 601 is greater than the width of the first coil wiring layer 501. The width of the first coil wiring layer 501 refers to the dimension in a direction that passes through the center of the direction in which the first coil wiring layer 501 extends and is orthogonal to the direction in which the first coil wiring layer 501 extends when viewed from the axis AX direction.

[0057] It is preferred that the distance between the first coil outermost end E12 of the first coil wiring layer 501 and the first via outermost end E22 of the first via wiring layer 601 is greater than the length of the first via wiring layer 601. Here, the length of the first via wiring layer 601 is the length L1 of the center line in the direction extending along the first via wiring layer 601.

[0058] Preferably, when observed from the axis AX direction, the first coil wiring layer 501 and the second coil wiring layer 502 have an overlapping portion that is at least partially overlapped, and the area S2 of the first via hole wiring layer 601 is less than 95% of the area S1 of the overlapping portion. The area S2 of the first via hole wiring layer 601 is not particularly limited, but can also be more than 2% of the area S1 of the overlapping portion. Here, the area S1 of the overlapping portion between the first coil wiring layer 501 and the second coil wiring layer 502 is the area of ​​the overlapping portion when observed from the axial direction. The area S2 of the first via hole wiring layer is the area when observed from the axis AX direction. By having the above-mentioned structure, the area of ​​the first via hole wiring layer can be reduced compared to the existing inductor components, and the inductance value (L value) can be adjusted.

[0059] Preferably, in the cross section at the center line along the extension direction of the first via wiring layer 601, the length L22 of the contact portion between the first via wiring layer 601 and the first coil wiring layer 501 is greater than the length L21 of the contact portion between the first via wiring layer 601 and the second coil wiring layer 502. That is, in the cross section at the center line along the extension direction of the first via wiring layer 601, the first via wiring layer 601 has an inverted tapered shape. The length L22 is greater than the length L21, so even if the second coil wiring layer 502 and the first via wiring layer 601 are slightly offset, it is easy to form the first via wiring layer 601 on the first coil wiring layer 501, and the connectivity between the first via wiring layer 601 and the second coil wiring layer 502 can be ensured.

[0060] In addition, the same structure can be adopted also in the first coil end E13 and the first coil outermost end E14 of the second coil wiring layer 502 .

[0061] For example, the first coil end E13 of the second coil wiring layer 502 may include the first coil outermost end E14 located at the outermost end in the extension direction of the second coil wiring layer 502, the second via hole end E23 of the first via hole wiring layer 601 may include the second via hole outermost end E24 located at the outermost end in the extension direction of the first via hole wiring layer 601, and the distance between the first coil outermost end E14 of the second coil wiring layer 502 and the second via hole outermost end E24 of the first via hole wiring layer 601 may be greater than 10 μm. The first coil outermost end E14 of the second coil wiring layer 502 and the second via hole outermost end E24 of the first via hole wiring layer 601 may be determined in the same manner as the first coil outermost end E12 of the first coil wiring layer 501.

[0062] Alternatively, the distance between the outermost end E14 of the first coil of the second coil wiring layer 502 and the outermost end E24 of the second via hole of the first via hole wiring layer 601 is greater than the width of the second coil wiring layer 502. The width of the second coil wiring layer 502 refers to the dimension in a direction that passes through the center of the direction in which the second coil wiring layer 502 extends and is orthogonal to the direction in which the first coil wiring layer 501 extends when viewed from the axis AX direction.

[0063] The distance between the first coil outermost end E14 of the second coil wiring layer 502 and the second via outermost end E24 of the first via wiring layer 601 may be equal to or greater than the length of the first via wiring layer 601 .

[0064] In addition, in the present embodiment, the number of via wiring layers is one, but there may be multiple via wiring layers. It may also be that, in the case of multiple via wiring layers, all via wiring layers are long strips of via wiring layers. In addition, in the case of multiple via wiring layers, it may also be that at least one via wiring layer is a long strip of via wiring layer, or it may be that, when observed from the direction of the axis AX, other via wiring layers are circular (or quadrilateral) via wiring layers. At this time, when observed from the axial direction, the coil end of the coil wiring layer connected to the circular via wiring layer constitutes a circular pad portion, and the diameter of the circular pad portion is greater than the line width of the middle portion of the coil wiring layer. In addition, it may also be that, in the case of having multiple via wiring layers, at least one via wiring layer of the via wiring layer has a separated structure.

[0065] (Manufacturing method)

[0066] Next, a method for manufacturing the inductor component 1 will be described.

[0067] like Figure 4 As shown in the figure, the inductor component 1 is manufactured by alternately stacking the second coil wiring layer 502, the first via hole wiring layer 601, and the first coil wiring layer 501 together with the insulating layer 11 from the upper left to the lower right in the figure. In addition, the first and second coil wiring layers 501 and 502 are provided on the insulating layer 11, for example, by screen printing. An opening is provided in the insulating layer 11, for example, by a photolithography process or a laser process, and then the first via hole wiring layer 601 is provided in the opening, for example, by screen printing.

[0068] (Second embodiment)

[0069] In the first embodiment, the first coil end of the first coil wiring layer and the first via end of the first via wiring layer do not overlap but are separated, but in the second embodiment, regardless of whether the first coil end of the first coil wiring layer and the first via end of the first via wiring layer are separated, as long as the outermost end of the coil of the first coil wiring layer and the outermost end of the via of the first via wiring layer are separated by more than 10 μm. The following describes this different structure. The other structures are the same as those of the first embodiment, and their description is omitted. In addition, the drawings use the same drawings as those of the first embodiment.

[0070] The distance between the outermost end E12 of the first coil of the first coil wiring layer 501 and the outermost end E22 of the first via hole of the first via hole wiring layer 601 is 10 μm or more. By having the above structure, the generation of bubbles V in the first via hole wiring layer 601 is suppressed, and the filling property of the first via hole wiring layer 601 is improved. Since the filling property is improved, the contact area between the second coil wiring layer 502 and the first via hole wiring layer 601 can be ensured, and the connectivity between the first via hole wiring layer 601 and the second coil wiring layer 502 becomes good. In addition, by having the above structure, a smaller recess is generated on the surface of the first coil wiring layer 501 on the opposite side of the first via hole wiring layer 601, or no recess is generated. As a result, no convex portion of the conductive material is formed on the third insulating layer 11c, or even if a convex portion of the conductive material is formed, a smaller convex portion is formed. Therefore, it is not easy to collide with other materials, etc., and the first coil wiring layer 501 is not easy to peel off from the third insulating layer 11c.

[0071] In addition, regardless of the case where the first coil end E11 of the first coil wiring layer 501 and the first via hole end E21 of the first via hole wiring layer 601 do not overlap but are separated, or the case where the first coil end E11 of the first coil wiring layer 501 and the first via hole end E21 of the first via hole wiring layer 601 overlap, as long as the distance between the first coil outermost end E12 of the first coil wiring layer 501 and the first via hole outermost end E22 of the first via hole wiring layer 601 is greater than 10 μm.

[0072] (Third embodiment)

[0073] In the first embodiment, when viewed from the axial direction, the via wiring layer overlaps with the coil wiring layer, but in the third embodiment, the via wiring layer has an area that does not overlap with the coil wiring layer. The following describes this different structure. The other structures are the same as those in the first embodiment, and are marked with the same figure marks as those in the first embodiment and their descriptions are omitted.

[0074] Figure 6This is a perspective front view of the third embodiment of the inductor component as viewed from the first side surface. Figure 7 It is an exploded top view of the inductor components. Figure 8 is a cross-sectional view of the inductor component at the center line along the extending direction of the via wiring layer. Figure 6 In the figure, in order to make the structure easy to understand, the main body and the coil are depicted as transparent, but they can also be depicted as translucent or opaque.

[0075] like Figure 6 , Figure 7 , Figure 8 As shown, in the inductor component 1A, a portion of the first coil wiring layer 501 has a first contact portion R1 that contacts the first via wiring layer 601. In this embodiment, the number of turns of the first coil wiring layer 501 is smaller than that of the first embodiment. The first coil end E11 of the first coil wiring layer 501 does not overlap with the second coil wiring layer 502.

[0076] The second coil wiring layer 502 has a second contact portion R3 that contacts the first via wiring layer 601. In this embodiment, the number of turns of the second coil wiring layer 502 is smaller than that of the first embodiment. When viewed from the axis AX direction, the first coil end E13 of the second coil wiring layer 502 does not overlap with the first coil wiring layer 501.

[0077] The first via wiring layer 601 has a first contact portion R1 in contact with the first coil wiring layer 501, a first non-contact portion R2 not in contact with the first coil wiring layer 501 and the second coil wiring layer 502, and a second contact portion R3 in contact with the second coil wiring layer 502. In the first via wiring layer 601, the direction from the first via end E21 toward the second via end E23 is the opposite direction to the direction from the first coil end E11 of the first coil wiring layer 501 toward the second coil end.

[0078] like Figure 8 As shown, in the cross section along the center line of the extension direction of the first via wiring layer 601, the height of the first via wiring layer 601 at the first non-contact portion R2 is smaller than the heights of the first coil wiring layer 501 and the first via wiring layer 601 at the first contact portion R1, and the heights of the first via wiring layer 601 and the second coil wiring layer 502 at the second contact portion R3. As a result, at the first non-contact portion R2, the difference in linear expansion coefficient between the first via wiring layer 601 and the first and third insulating layers 11a and 11c is reduced, and the thermal stress associated with the first via wiring layer 601 is reduced. As a result, the generation of cracks in the first via wiring layer 601 can be suppressed.

[0079] Preferably, the width of the first non-contact portion R2 is greater than the width of the first contact portion R1 in a cross section along the center line of the extending direction of the first via wiring layer 601. In the first non-contact portion R2, the difference in linear expansion coefficient between the first via wiring layer 601 and the first and third insulating layers 11a and 11c is reduced, and the thermal stress associated with the first via wiring layer 601 is further reduced. As a result, the generation of cracks in the first via wiring layer 601 can be further suppressed.

[0080] In addition, the length of the first via wiring layer 601 may be the same as that of the first embodiment, or may be smaller than that of the first embodiment. The number of turns of the first coil wiring layer 501 may be the same as that of the first embodiment, or may be larger than that of the first embodiment. The number of turns of the second coil wiring layer 502 may be the same as that of the first embodiment, or may be larger than that of the first embodiment.

[0081] In addition, the present disclosure is not limited to the above-mentioned embodiments, and design changes can be made within the scope of the main purpose of the present disclosure. For example, the characteristic points of each of the first to third embodiments can be combined in various ways. In addition, the number of layers of the coil wiring layer can be increased or decreased, and the number of layers of the via wiring layer can be increased or decreased. In addition, the top surface and the connecting portion of the coil wiring layer can also include a straight line portion, or can be formed in a curved shape.

[0082] The present disclosure includes the following aspects.

[0083] <1> An inductor component, comprising: a body; a coil, which is arranged in the body and is spirally wound along an axis; and a first external electrode and a second external electrode, which are arranged in the body and are electrically connected to the coil, the body comprising: a first end face and a second end face facing each other, a first side face and a second side face facing each other, and a bottom face connecting between the first end face and the second end face and between the first side face and the second side face, and a top face facing the bottom face, the axis being parallel to the bottom face and intersecting with the first side face and the second side face, the coil having: The first coil wiring layer and the second coil wiring layer which are adjacent and stacked in the axial direction, and the first via hole wiring layer which connects the first coil wiring layer with the second coil wiring layer, the first coil wiring layer having a first coil end, the first via hole wiring layer having a first via hole end, at least the first via hole end of the first via hole wiring layer is connected to the part of the first coil wiring layer close to the first coil end, when observed from the axial direction, the first coil end of the first coil wiring layer and the first via hole end of the first via hole wiring layer do not overlap but are separated.

[0084] <2> In the inductor component described in <1>, the second coil wiring layer has a first coil end, and the first via hole wiring layer has an end on the opposite side of the first via hole end, namely, the second via hole end, and at least the second via hole end of the first via hole wiring layer is connected to the part of the second coil wiring layer close to the first coil end. When observed from the axial direction, the first coil end of the second coil wiring layer and the second via hole end of the first via hole wiring layer do not overlap but are separated.

[0085] <3> In the inductor component described in <1> or <2>, the first coil end of the first coil wiring layer has a first coil outermost end located at the outermost end in the extension direction of the first coil wiring layer, the first via hole end of the first via hole wiring layer has a first via hole outermost end located at the outermost end in the extension direction of the first via hole wiring layer, and the distance between the first coil outermost end of the first coil wiring layer and the first via hole outermost end of the first via hole wiring layer is greater than 10μm.

[0086] <4> An inductor component, comprising: a body; a coil, which is arranged in the body and is spirally wound along an axis; and a first external electrode and a second external electrode, which are arranged in the body and are electrically connected to the coil, the body comprising: a first end face and a second end face facing each other, a first side face and a second side face facing each other, and a bottom face connecting between the first end face and the second end face and between the first side face and the second side face, and a top face facing the bottom face, the axis is parallel to the bottom face and intersects with the first side face and the second side face, the coil comprising: a first coil wiring layer and a second coil wiring layer stacked adjacent to each other in the axial direction, a first coil wiring layer connecting the first coil wiring layer to the top face The first via wiring layer connected to the second coil wiring layer, the first coil wiring layer having a first coil end, the first coil end having a first coil outermost end located at the outermost end in the extension direction of the first coil wiring layer, the first via wiring layer having a first via end, the first via end having a first via outermost end located at the outermost end in the extension direction of the first via wiring layer, at least the first via end of the first via wiring layer is connected to a portion of the first coil end side of the first coil wiring layer, and a distance between the first coil outermost end of the first coil wiring layer and the first via outermost end of the first via wiring layer is greater than 10 μm.

[0087] <5> In the inductor component described in <3> or <4>, a distance between an outermost end of the first coil of the first coil wiring layer and an outermost end of the first via of the first via wiring layer is greater than or equal to a width of the first coil wiring layer.

[0088] <6> In the inductor component according to any one of <3> to <5>, a distance between an outermost end of the first coil of the first coil wiring layer and an outermost end of the first via of the first via wiring layer is greater than or equal to a length of the first via wiring layer.

[0089] <7> In the inductor component described in any one of <1> to <6>, when observed from the above-mentioned axial direction, the above-mentioned first coil wiring layer and the above-mentioned second coil wiring layer have an overlapping portion that at least partially overlaps, and the area of ​​the above-mentioned first via wiring layer is less than 95% of the area of ​​the above-mentioned overlapping portion.

[0090] <8> In the inductor component described in any one of <1> to <7>, in the cross section in the extension direction of the above-mentioned first via hole wiring layer, the contact portion between the above-mentioned first via hole wiring layer and the above-mentioned first coil wiring layer is larger than the contact portion between the above-mentioned first via hole wiring layer and the above-mentioned second coil wiring layer.

[0091] <9> In the inductor component described in any one of <1> to <8>, when observed from the above-mentioned axial direction, the above-mentioned first conductive hole wiring layer has: a contact portion that contacts at least one of the above-mentioned first coil wiring layer and the above-mentioned second coil wiring layer, and a non-contact portion that contacts neither the above-mentioned first coil wiring layer nor the above-mentioned second coil wiring layer.

Claims

1. An inductor component, characterized in that: have: ontology; a coil disposed in the body and wound in a spiral shape along an axis; and a first external electrode and a second external electrode, which are disposed on the body and are electrically connected to the coil, The body includes: a first end face and a second end face facing each other, a first side face and a second side face facing each other, a bottom face connecting the first end face and the second end face and the first side face and the second side face, and a top face facing the bottom face. The axis is parallel to the bottom surface and intersects the first side surface and the second side surface, The coil includes: a first coil wiring layer and a second coil wiring layer stacked adjacent to each other in the axial direction, and a first via wiring layer connecting the first coil wiring layer and the second coil wiring layer. The first coil wiring layer has a first coil end portion. The first via hole wiring layer has a first via hole end portion. At least the first via end of the first via wiring layer is connected to a portion of the first coil wiring layer on the first coil end side. When viewed from the axial direction, the first coil end portion of the first coil wiring layer and the first via end portion of the first via wiring layer do not overlap but are separated from each other.

2. The inductor component according to claim 1, characterized in that The second coil wiring layer has a first coil end portion. The first via hole wiring layer has an end portion opposite to the first via hole end portion, namely, a second via hole end portion. At least the second via end of the first via wiring layer is connected to a portion of the second coil wiring layer on the first coil end side. When viewed from the axial direction, the first coil end portion of the second coil wiring layer and the second via end portion of the first via wiring layer do not overlap but are separated.

3. The inductor component according to claim 1, characterized in that The first coil end portion of the first coil wiring layer has a first coil outermost end portion located at the outermost end in the extending direction of the first coil wiring layer. The first via end portion of the first via wiring layer has a first via outermost end portion located at the outermost end in the extending direction of the first via wiring layer. A distance between an outermost end portion of the first coil of the first coil wiring layer and an outermost end portion of the first via hole of the first via hole wiring layer is 10 μm or more.

4. An inductor component, characterized in that: have: ontology; a coil disposed in the body and wound in a spiral shape along an axis; and a first external electrode and a second external electrode, which are disposed on the body and are electrically connected to the coil, The body includes: a first end face and a second end face facing each other, a first side face and a second side face facing each other, a bottom face connecting the first end face and the second end face and the first side face and the second side face, and a top face facing the bottom face. The axis is parallel to the bottom surface and intersects the first side surface and the second side surface, The coil includes: a first coil wiring layer and a second coil wiring layer stacked adjacent to each other in the axial direction, and a first via wiring layer connecting the first coil wiring layer and the second coil wiring layer. The first coil wiring layer has a first coil end portion, the first coil end portion having a first coil outermost end portion located at the outermost end in the extending direction of the first coil wiring layer. The first via wiring layer has a first via end portion, the first via end portion having a first via outermost end portion located at the outermost end in the extending direction of the first via wiring layer, At least the first via end of the first via wiring layer is connected to a portion of the first coil wiring layer on the first coil end side. A distance between an outermost end portion of the first coil of the first coil wiring layer and an outermost end portion of the first via hole of the first via hole wiring layer is 10 μm or more.

5. The inductor component according to claim 3 or 4, characterized in that: A distance between an outermost end portion of the first coil of the first coil wiring layer and an outermost end portion of the first via hole of the first via hole wiring layer is equal to or greater than a width of the first coil wiring layer.

6. The inductor component according to claim 3 or 4, characterized in that: A distance between an outermost end portion of the first coil of the first coil wiring layer and an outermost end portion of the first via hole of the first via hole wiring layer is equal to or greater than a length of the first via hole wiring layer.

7. The inductor component according to claim 1 or 4, characterized in that: When viewed from the axial direction, the first coil wiring layer and the second coil wiring layer have an overlapping portion that at least partially overlaps. The area of ​​the first via wiring layer is less than or equal to 95% of the area of ​​the overlapping portion.

8. The inductor component according to claim 1 or 4, characterized in that: In a cross section of the first via wiring layer in an extending direction, a contact portion between the first via wiring layer and the first coil wiring layer is larger than a contact portion between the first via wiring layer and the second coil wiring layer.

9. The inductor component according to claim 1 or 4, characterized in that: When viewed in the axial direction, the first via wiring layer has a contact portion that contacts at least one of the first coil wiring layer and the second coil wiring layer, and a non-contact portion that contacts neither the first coil wiring layer nor the second coil wiring layer.

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