Circuit board with embedded electronic component and preparation method thereof

Abstract

The invention provides a circuit board with an embedded electronic component and a preparation method of the circuit board. The preparation method comprises the following steps: providing an inner-layer circuit substrate; an electronic component is arranged in the through hole, the electronic component comprises an electrode terminal, and the electrode terminal comprises a bonding pad and a bridging part connected with the bonding pad; the copper-clad plate is pressed, a copper foil layer of the copper-clad plate is made into an outer circuit layer, and the outer circuit layer is electrically connected with the electrode terminal. According to the electronic component, the bridging part connected with the bonding pad of the electronic component is arranged, the effective electric connection area of the electronic component is equivalently increased through the bridging part, the alignment tolerance caused by the position deviation of the electronic component can be effectively absorbed, the error-tolerant rate of the deviation is larger, the problems of open circuit, virtual connection and the like caused by the alignment deviation can be solved, and the service life of the electronic component is prolonged. And the reject ratio of electric connection is reduced. And moreover, when the electronic component is embedded, the resin layer can be filled in the groove between the bridging part and the bonding pad, so that the support of the embedded electronic component is enhanced, and the structural stability is improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board with embedded electronic components and a preparation method thereof. Background Art

[0002] Embedded technology usually refers to placing electronic components (such as resistors, capacitors, etc.) assembled on the outside of a printed circuit board (PCB) inside the circuit board to reduce the space occupied by the electronic components and make the product thin and short. However, the existing embedded technology usually easily causes the position of the electronic components to shift. This shift will cause the holes in the next layer to not be accurately punched on the pads of the electronic components, which will lead to problems such as open circuits and virtual connections, affecting the electrical connection between the electronic components and the circuit board. Summary of the invention

[0003] In view of this, the present application proposes a method for preparing a circuit board with embedded electronic components to solve at least one of the above problems.

[0004] An embodiment of the present application provides a method for preparing a circuit board with embedded electronic components, comprising the following steps:

[0005] Providing an inner circuit substrate, the inner circuit substrate comprising at least one inner circuit layer and at least one dielectric layer, the inner circuit substrate having a through hole, the through hole penetrating the inner circuit substrate along a thickness direction;

[0006] An electronic component is arranged in the through hole, wherein the electronic component includes an electrode terminal, the electrode terminal includes a pad and a bridge portion connected to the pad, and the electrode terminal is arranged facing a side wall of the through hole;

[0007] Providing a copper-clad laminate, the copper-clad laminate comprising a resin layer and a copper foil layer disposed on a surface of the resin layer, and laminating the copper-clad laminate on at least one side of the inner circuit substrate so that the resin layer fills the through hole and covers the electronic component;

[0008] The copper foil layer is made into an outer circuit layer, and the outer circuit layer is electrically connected to the electrode terminal.

[0009] In one embodiment, the preparation method of the electronic component includes the following steps: forming a first through hole on a core board, the core board including a substrate layer and a metal layer, the first through hole penetrating the substrate layer and the metal layer; arranging a component in the first through hole, the component including the solder pad, the solder pad being arranged facing the side wall of the first through hole; forming a second through hole on the core board, the second through hole penetrating the core board along the thickness direction, the second through hole being arranged close to the solder pad; arranging a conductive layer in the second through hole, the conductive layer filling the second through hole and extending out of the opening of the second through hole and connected to the solder pad; removing the metal layer and the conductive layer between the second through hole and the solder pad; removing the substrate layer between the second through hole and the solder pad; removing the core board on the side of the second through hole away from the solder pad and the conductive layer on the surface of the core board, the remaining conductive layer and the metal layer form the bridging portion, and the bridging portion and the component form the electronic component.

[0010] In one embodiment, after the base material layer between the second through hole and the pad is removed, a groove is formed between the bridge portion and the pad.

[0011] In one embodiment, the resin layer also fills the groove.

[0012] In one embodiment, the step of arranging the electronic component in the through hole includes: arranging a peelable film layer on one side of the inner circuit substrate so that the peelable film layer covers the through hole; placing the electronic component in the through hole and using the peelable film layer to support the electronic component.

[0013] In one embodiment, the preparation method further includes the following step: providing a protective layer on a side of the outer circuit layer away from the resin layer.

[0014] One embodiment of the present application provides a circuit board with embedded electronic components, which includes an inner circuit substrate, electronic components and an outer circuit substrate. The inner circuit substrate includes at least one inner circuit layer and at least one dielectric layer, and the inner circuit substrate has a through hole, and the through hole penetrates the inner circuit substrate along the thickness direction. The electronic component is accommodated in the through hole, and the electronic component includes an electrode terminal. The electrode terminal includes a pad and a bridge portion connected to the pad, and the electrode terminal is arranged facing the side wall of the through hole. The outer circuit substrate includes a resin layer and an outer circuit layer arranged on the surface of the resin layer, the resin layer fills the through hole and covers the electronic component, and the outer circuit layer is electrically connected to the electrode terminal.

[0015] In one embodiment, a groove is formed between the bridge portion and the pad, and the resin layer also fills the groove.

[0016] In one embodiment, along the thickness direction of the circuit board, the cross-section of the bridging portion is L-shaped.

[0017] In one embodiment, the circuit board further includes a protective layer, and the protective layer is arranged on the outside of the outer circuit layer.

[0018] The present application sets a bridge portion connected to the pad of the electronic component. This bridge portion is equivalent to increasing the area where the electronic component can be effectively electrically connected, and can effectively absorb the alignment tolerance caused by the position deviation of the electronic component, making the tolerance rate of the deviation greater. Therefore, it can improve the problems of open circuit and virtual connection caused by the alignment deviation, and reduce the defective rate of electrical connection. In addition, when the electronic component is embedded, the resin layer can also be filled between the bridge portion and the pad, which strengthens the support for the embedded electronic component and improves the structural stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A cross-sectional view of an inner circuit substrate provided in one embodiment of the present application.

[0020] Figure 2 For Figure 1 A cross-sectional view of a through hole formed on an inner circuit substrate is shown.

[0021] Figures 3 to 9 A cross-sectional view of preparing an electronic component according to an embodiment of the present application.

[0022] Fig.10 For Figure 2 A cross-sectional view of an inner circuit substrate with a peelable film layer disposed on one side thereof is shown.

[0023] Fig.11 For Fig.10 The structure shown is set Fig. 9 A cross-sectional view of an electronic component is shown.

[0024] Fig.12 For Fig.11 A cross-sectional view of the copper clad laminate laminated on one side of the structure.

[0025] Fig.13 To remove Fig.12 A cross-sectional view of the structure shown after the film layer can be peeled off and then the copper clad laminate is pressed together.

[0026] Fig.14 For the general Fig.13 A cross-sectional view of a circuit board obtained after the copper foil layer of the structure shown is manufactured to form an outer circuit layer in one embodiment.

[0027] Main component symbols

[0028] Circuit board 100

[0029] Electronic components 200

[0030] Inner circuit substrate 10

[0031] Inner circuit layer 11

[0032] Dielectric layer 12

[0033] Via 101

[0034] Core board 20

[0035] First through hole 21

[0036] Base material layer 22

[0037] Metal layer 23

[0038] The second through hole 24

[0039] Conductive layer 25

[0040] Groove 26

[0041] Bridge 27

[0042] Element 201

[0043] Pad 202

[0044] Electrode terminal 203

[0045] Peelable film 30

[0046] Copper Clad Laminate 40

[0047] Resin layer 41

[0048] Copper foil layer 42

[0049] Outer circuit layer 43

[0050] Conductive structure 44

[0051] Outer circuit substrate 50

[0052] The following specific implementation manner will further illustrate the embodiments of the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the technical field of the present application. The terms used herein are only for the purpose of describing specific implementation methods and are not intended to limit the present application embodiments.

[0054] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0055] It will be understood that when a layer is referred to as being “on” another layer, it can be directly on the other layer or intervening layers may be present therebetween. On the contrary, when a layer is referred to as being “directly on” another layer, there are no intervening layers.

[0056] Here, the embodiments of the present application are described with reference to the cross-sectional views, which are schematic diagrams of the idealized embodiments (and intermediate configurations) of the present application. Thus, it is foreseeable that the shapes of the diagrams are different due to manufacturing processes and / or tolerances. Therefore, the embodiments of the present application should not be interpreted as being limited to the specific shapes of the regions illustrated here, but should include deviations in shapes such as those produced due to manufacturing. The regions shown in the figures are themselves only schematic, and their shapes are not intended to illustrate the actual shapes of the devices, and are not intended to limit the scope of the present application.

[0057] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0058] See also Figures 1 to 14 In a first aspect, the present application provides a method for preparing a circuit board 100 with embedded electronic components 200, which includes steps S10 to S40.

[0059] Step S10, see Figure 1 and Figure 2 , an inner circuit substrate 10 is provided, and the inner circuit substrate 10 includes at least one inner circuit layer 11 and at least one dielectric layer 12.

[0060] like Figure 1 As shown, the inner circuit substrate 10 includes two inner circuit layers 11 and a dielectric layer 12, the two inner circuit layers 11 are formed on the upper and lower surfaces of the dielectric layer 12 respectively, and the two inner circuit layers 11 can be electrically connected through a conductive structure (not shown). In other embodiments, the inner circuit substrate 10 can include only one inner circuit layer 11 and one dielectric layer 12. In other embodiments, the inner circuit substrate 10 can include three or more (≥3) inner circuit layers 11 and multiple (≥2) dielectric layers 12, each dielectric layer 12 is arranged between two adjacent inner circuit layers 11, and a conductive structure (not shown) can be formed in each dielectric layer 12, and the two adjacent inner circuit layers 11 can be electrically connected to each other through the conductive structure.

[0061] The material of the dielectric layer 12 may be, but is not limited to, polyimide, polypropylene, liquid crystal polymer, polyetheretherketone, polyethylene terephthalate, and polyethylene naphthalate. The material of the inner circuit layer 11 may be, but is not limited to, copper, gold, silver, and the like. The inner circuit substrate 10 may be made by the method for making a circuit board in the prior art. For example, the core layer substrate is first made, and then, by adding layers, layers are added on both sides of the core layer substrate to obtain the inner circuit substrate 10.

[0062] like Figure 2 As shown, a through hole 101 can be formed on the inner circuit substrate 10 by, but not limited to, laser drilling, mechanical drilling, etc. The through hole 101 penetrates the inner circuit substrate 10 along the thickness direction.

[0063] Step S20, see Figures 3 to 11 , an electronic component 200 is arranged in the through hole 101 of the inner circuit substrate 10. This step may include step S21 "preparing the electronic component 200" and step S22 "placing the electronic component 200 in the through hole 101 and using the peelable film layer 30 to carry the electronic component 200". Please refer to Figures 3 to 9 , step S21 may include steps S211 to S217. Fig.10 and Fig.11 , step S22 may include steps S221 to S222.

[0064] like Figure 3 As shown, in step S211, a first through hole 21 may be formed on the core board 20 by means of, but not limited to, laser, mechanical drilling, etc., and the first through hole 21 penetrates the core board 20 along the thickness direction of the core board 20. The core board 20 includes a substrate layer 22 and a metal layer 23 formed on at least one surface of the substrate layer 22, and the first through hole 21 penetrates the substrate layer 22 and the metal layer 23 along the thickness direction of the core board 20. In this embodiment, the metal layer 23 is formed on both the upper and lower surfaces of the substrate layer 22. In other embodiments, the metal layer 23 may be formed only on one surface (upper surface or lower surface) of the substrate layer 22. The metal layer 23 may be, but not limited to, a copper layer. The material of the substrate layer 22 may be, but not limited to, polyimide, polyurethane glue, acrylic resin glue, etc.

[0065] like Figure 4As shown, step S212, component 201 is set in the first through hole 21. Component 201 includes a pad 202, which is a metal contact point on component 201 for connecting to an external device. Pad 202 is arranged facing the side wall of the first through hole 21. Component 201 can be an active component or a passive component, such as a resistor, an inductor, a capacitor, etc., and the present application does not limit it. In the present embodiment, component 201 is a chip-type capacitor, which is roughly flat and has a pad 202 on each of the opposite sides. Pad 202 is arranged facing the side wall of the first through hole 21, and pad 202 can contact the side wall of the first through hole 21.

[0066] like Figure 5 As shown, in step S213, a second through hole 24 may be formed on the core board 20 by, but not limited to, laser, mechanical drilling, etc., and the second through hole 24 penetrates the core board 20 along the thickness direction. Along the extension direction of the core board 20 (i.e., the arrangement direction of the two pads 202 of the component 201), the second through hole 24 is arranged near the pad 202. In this embodiment, there are two pads 202, and the number of the second through holes 24 is also two, and there is a second through hole 24 near each pad 202 corresponding to it.

[0067] like Figure 6 As shown, in step S214, a conductive layer 25 may be provided in the second through hole 24 by, but not limited to, a PTH (chemical copper plating or plated through hole) process. The material of the conductive layer 25 may be, but not limited to, copper. In this embodiment, the material of the conductive layer 25 is copper. It is understandable that, in addition to filling the second through hole 24, the conductive layer 25 will also extend out of the opening of the second through hole 24 during copper plating, covering the metal layer 23 on the surface of the core board 20 and part of the surface of the pad 202, and the conductive layer 25 forms an electrical connection with the pad 202. Figure 6 As shown, the conductive layer 25 with the upper opening of the second through hole 24 covers the upper surface of the pad 202, and the conductive layer 25 with the lower opening of the second through hole 24 is flush with the lower surface of the pad 202 (ie, does not cover the lower surface of the pad 202).

[0068] like Figure 7 As shown, in step S215, the metal layer 23 on the upper surface between the second through hole 24 and the pad 202 can be removed by chemical mechanical polishing (CMP, also known as chemical mechanical polishing), and the conductive layer 25 covered by the surface of the metal layer 23 in this area will also be removed. The metal layer 23 and the conductive layer 25 on the lower surface between the second through hole 24 and the pad 202 are retained.

[0069] like Figure 8As shown, in step S216, the substrate layer 22 between the second through hole 24 and the pad 202 can be removed by a commonly used debonding method in the art. Since the substrate layer 22, the metal layer 23 and the conductive layer 25 between the second through hole 24 and the pad 202 are removed, a groove 26 is formed between the second through hole 24 and the pad 202, and the bottom wall of the groove 26 is the metal layer 23.

[0070] like Fig. 9 As shown, in step S217, the core board 20 and the conductive layer 25 on the surface of the core board 20 on the side of the second through hole 24 away from the pad 202 can be removed by mechanical cutting or the like. Figure 8 The portion on the left side of the second through hole 24 on the left side (including the core plate 20 and the conductive layer 25 covering the surface thereof) is completely removed along the thickness direction. Figure 8 The portion on the right side of the second through hole 24 on the right side (including the core board 20 and the conductive layer 25 covering its surface) is completely removed along the thickness direction. The remaining conductive layer 25 and the metal layer 23 covered by the conductive layer 25 (part of the metal layer 23 on the lower surface is not removed) form a bridge portion 27. The cross-section of the bridge portion 27 is roughly L-shaped, and the bridge portion 27 is connected to the pad 202 with a groove 26 between the two. By providing the bridge portion 27 on the basis of the component 201, an electronic component 200 is formed. The bridge portion 27 and the pad 202 form an electrode terminal 203, and the cross-section of the electrode terminal 203 is roughly U-shaped.

[0071] like Fig.10 As shown, in step S221, a peelable film layer 30 is disposed on one side of the inner circuit substrate 10, so that the peelable film layer 30 at least covers the through hole 101. In this embodiment, the peelable film layer 30 is attached to the lower surface of the inner circuit substrate 10 and completely covers the lower surface of the inner circuit substrate 10. The peelable film layer 30 can be, but is not limited to, a polyimide (PI) film.

[0072] like Fig.11 As shown, in step S222 , the electronic component 200 is placed in the through hole 101 , and the strippable film layer 30 carries the electronic component 200 . The bottom wall of the groove 26 of the electrode terminal 203 is close to the strippable film layer 30 , and the opening of the groove 26 is away from the strippable film layer 30 .

[0073] Step S30, see Fig.12 and Fig.13 , a copper clad plate 40 is pressed onto at least one side of the inner circuit substrate 10 .

[0074] like Fig.12As shown, the copper clad laminate 40 can be firstly pressed on the side of the inner circuit substrate 10 away from the peelable film layer 30. The copper clad laminate 40 includes a resin layer 41 and a copper foil layer 42 disposed on the surface of the resin layer 41. During pressing, the resin layer 41 is located between the copper foil layer 42 and the inner circuit substrate 10. The resin layer 41 is heated and melted to fill the gap between the through hole 101 and the electronic component 200, and covers the electronic component 200. The groove 26 of the electronic component 200 will also be filled by the resin layer 41.

[0075] like Fig.13 As shown, after the peelable film layer 30 is removed, a copper clad plate 40 is pressed on the other side of the inner circuit substrate 10. During the pressing, the resin layer 41 is located between the copper foil layer 42 and the inner circuit substrate 10, and the resin layer 41 is heated and melted to fill the remaining gap between the through hole 101 and the electronic component 200, and covers the electronic component 200. The cured resin layer 41 fixes the electronic component 200 in the through hole 101.

[0076] Step S40, see Fig.14 , the copper foil layer 42 is made into an outer circuit layer 43. In this embodiment, the outer circuit layer 43 is formed on both the upper and lower sides of the inner circuit substrate 10. The outer circuit layer 43 ( Fig.14 The outer circuit layer 43 on the lower side can be electrically connected to the electrode terminal 203 through the conductive structure 44, that is, the circuit board 100 with the embedded electronic components 200 is obtained. The outer circuit layer 43 can be formed by an image transfer process and an etching process. The inner circuit layer 11 of the inner circuit substrate 10 can be electrically connected to the outer circuit layer 43 through a conductive structure (not shown).

[0077] In some embodiments, a protective layer (not shown) may be provided on the side of the outer circuit layer 43 away from the resin layer 41. The protective layer may be a cover-lay (CVL) or a solder mask, which is not limited in the present application. The protective layer is used to protect the outer circuit layer 43 from being invaded by external water vapor or scratched by foreign objects.

[0078] It is understandable that the step numbers are intended to clearly describe the specific preparation method, and are not intended to limit the order of the steps. For example, step S10 and step S21 (including S211 to S217) of preparing the electronic component 200 in step S20 can be performed simultaneously, or step S10 can be performed first and then step S21, or step S21 can be performed first and then step S10.

[0079] See also Fig.14 In a second aspect of the present application, there is provided a circuit board 100 with embedded electronic components 200 , which includes an inner circuit substrate 10 , the electronic components 200 and an outer circuit substrate 50 .

[0080] The inner circuit substrate 10 includes at least one inner circuit layer 11 and at least one dielectric layer 12. In this embodiment, the inner circuit substrate 10 includes two inner circuit layers 11 and one dielectric layer 12, and the two inner circuit layers 11 are formed on the upper and lower surfaces of the dielectric layer 12 respectively, and the two inner circuit layers 11 can be electrically connected through a conductive structure (not shown). In other embodiments, the inner circuit substrate 10 can include only one inner circuit layer 11 and one dielectric layer 12. In other embodiments, the inner circuit substrate 10 can include three or more (≥3) inner circuit layers 11 and multiple (≥2) dielectric layers 12, each dielectric layer 12 is arranged between two adjacent inner circuit layers 11, and the two adjacent inner circuit layers 11 can be electrically conductive. The inner circuit substrate 10 has a through hole 101, and the through hole 101 penetrates the inner circuit substrate 10 along the thickness direction.

[0081] The electronic component 200 is received in the through hole 101. The electronic component 200 includes an electrode terminal 203, and the electrode terminal 203 is arranged facing the side wall of the through hole 101. The electrode terminal 203 includes a pad 202 and a bridge portion 27 connected to the pad 202. Along the thickness direction of the circuit board 100, the cross section of the bridge portion 27 is roughly "L"-shaped, and the pad 202 and the bridge portion 27 roughly form a "U"-shaped structure.

[0082] The outer circuit substrate 50 includes a resin layer 41 and an outer circuit layer 43 disposed on the surface of the resin layer 41 . The resin layer 41 fills the through hole 101 and covers the electronic component 200 . The outer circuit layer 43 can be electrically connected to the electrode terminal 203 through the conductive structure 44 .

[0083] like Fig.14 As shown, a groove 26 is formed between the bridge portion 27 and the pad 202 , and the resin layer 41 also fills the groove 26 .

[0084] In some embodiments, a protective layer (not shown) is further provided on the side of the outer circuit layer 43 facing away from the resin layer 41. The protective layer is used to protect the outer circuit layer 43 from being invaded by external water vapor or scratched by foreign objects.

[0085] The present application sets a bridge portion 27 connected to the pad 202 of the electronic component 200. This bridge portion 27 is equivalent to increasing the area where the electronic component 200 can be effectively electrically connected, and can effectively absorb the alignment tolerance caused by the position offset of the electronic component 200, making the tolerance rate of the deviation greater. Therefore, it can improve the problems of open circuit and virtual connection caused by the alignment offset, and reduce the defective rate of electrical connection. In addition, when the electronic component 200 is embedded, the resin layer 41 can also be filled between the bridge portion 27 and the pad 202, which strengthens the support for the embedded electronic component 200 and improves the structural stability.

[0086] The above descriptions are some specific implementations of the present application, but they are not limited to these implementations in actual application. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.

Claims

1. A method for preparing a circuit board with embedded electronic components, characterized in that: The steps include: Providing an inner circuit substrate, the inner circuit substrate comprising at least one inner circuit layer and at least one dielectric layer, the inner circuit substrate having a through hole, the through hole penetrating the inner circuit substrate along a thickness direction; An electronic component is arranged in the through hole, wherein the electronic component includes an electrode terminal, the electrode terminal includes a pad and a bridge portion connected to the pad, and the electrode terminal is arranged facing a side wall of the through hole; Providing a copper-clad laminate, the copper-clad laminate comprising a resin layer and a copper foil layer disposed on a surface of the resin layer, and laminating the copper-clad laminate on at least one side of the inner circuit substrate so that the resin layer fills the through hole and covers the electronic component; The copper foil layer is made into an outer circuit layer, and the outer circuit layer is electrically connected to the electrode terminal.

2. The preparation method according to claim 1, characterized in that The method for preparing the electronic component comprises the following steps: forming a first through hole on the core plate, the core plate comprising a substrate layer and a metal layer, the first through hole penetrating the substrate layer and the metal layer; Arranging a component in the first through hole, wherein the component includes the pad, and the pad is arranged facing the side wall of the first through hole; A second through hole is formed on the core plate, the second through hole penetrates the core plate along the thickness direction, and the second through hole is arranged close to the pad; Disposing a conductive layer in the second through hole, wherein the conductive layer fills the second through hole and extends out of the opening of the second through hole and is connected to the pad; removing the metal layer and the conductive layer between the second through hole and the pad; removing the substrate layer between the second through hole and the pad; The core board on the side of the second through hole away from the pad and the conductive layer on the surface of the core board are removed, and the remaining conductive layer and the metal layer form the bridge portion, and the bridge portion and the element form the electronic element.

3. The preparation method according to claim 2, characterized in that: After the base material layer between the second through hole and the pad is removed, a groove is formed between the bridge portion and the pad.

4. The preparation method according to claim 3, characterized in that: The resin layer also fills the groove.

5. The preparation method according to claim 1, characterized in that: The step of arranging the electronic component in the through hole includes: arranging a peelable film layer on one side of the inner circuit substrate so that the peelable film layer covers the through hole; placing the electronic component in the through hole and using the peelable film layer to carry the electronic component.

6. The preparation method according to claim 1, characterized in that: The preparation method further comprises the following step: a protective layer is arranged on the side of the outer circuit layer away from the resin layer.

7. A circuit board with embedded electronic components, characterized in that: include: An inner circuit substrate, the inner circuit substrate comprising at least one inner circuit layer and at least one dielectric layer, the inner circuit substrate having a through hole, the through hole penetrating the inner circuit substrate along a thickness direction; An electronic component, the electronic component is received in the through hole, the electronic component comprises an electrode terminal, the electrode terminal comprises a pad and a bridge portion connected to the pad, and the electrode terminal is arranged facing a side wall of the through hole; and The outer circuit substrate comprises a resin layer and an outer circuit layer arranged on the surface of the resin layer, the resin layer fills the through hole and covers the electronic component, and the outer circuit layer is electrically connected to the electrode terminal.

8. The circuit board according to claim 7, characterized in that: A groove is formed between the bridge portion and the pad, and the resin layer also fills the groove.

9. The circuit board according to claim 7, characterized in that: Along the thickness direction of the circuit board, the cross section of the bridge portion is L-shaped.

10. The circuit board according to claim 7, characterized in that: The circuit board also includes a protective layer, which is arranged on the outer side of the outer circuit layer.

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