Multi-spectral linear array imaging device

Abstract

The invention discloses a multi-spectral linear array imaging device, which comprises a plurality of light filtering elements and a plurality of light sensing chips, the light sensing elements of the light sensing chips are arranged in a linear array, the plurality of light sensing chips are sequentially arranged and have the same linear array direction, so that incident light enters the plurality of light sensing chips, and the light sensing chips receive the light through the light sensing elements and generate response. The light filtering elements and the light sensing chips are correspondingly arranged, the light filtering elements are used for enabling light, belonging to the working wave bands of the light filtering elements, in incident light to pass through and enabling the passing light to enter the corresponding light sensing chips, and the working wave bands of the multiple light filtering elements are different. According to the invention, the plurality of photosensitive chips are arranged, the filtering elements are arranged corresponding to the photosensitive chips, the filtering elements are utilized to enable the light of the corresponding wave bands in the incident light to pass through and enter the corresponding photosensitive chips, spectral imaging of the corresponding wave bands is realized, the working wave bands of the filtering elements are different, so that different spectral imaging can be realized, and a prism is not needed for light splitting; and the processing difficulty and the assembling and adjusting difficulty are reduced.

Description

Technical Field

[0001] The invention relates to the field of spectral imaging, and in particular to a multi-spectral linear array imaging device. Background Art

[0002] Linear scan cameras are mainly used in the fields of industry, medicine, scientific research and security. Linear scan cameras mainly use a single beam of light to scan objects. Its sensor has only one row of photosensitive elements, which makes high scanning frequency and high resolution possible. The typical application area of ​​linear scan cameras is to detect continuous materials such as metal, plastic, paper or fiber. The object to be detected moves at a constant speed, and one or more linear scan cameras are used to scan it line by line continuously to achieve uniform detection of its entire surface.

[0003] In industrial automatic sorting equipment, spectral imaging is particularly suitable for applications such as food inspection and impurity classification, and can non-destructively detect and determine the chemical and physical composition of products. At present, the acquisition of multiple spectral images mostly uses a spectroscopic prism, which refracts the incident composite light beam into a multi-spectral light beam through prism spectrometry, and obtains images of different spectra or dynamic ranges through multiple photosensitive chips. However, the optical path of the prism spectrometer system is complex, and high requirements are placed on the processing, production and assembly process of the prism. The overall structural volume of the prism spectrometer system is relatively large, and the installation benchmark requirements of the prism are strict. A slight deviation will cause the deflection of the optical path after spectrometry, affecting the acquisition of normal spectral images. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a multi-spectral linear array imaging device, which avoids the use of prism splitting and reduces the difficulty of processing and installation.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A multi-spectral linear array imaging device, comprising a plurality of filter elements and a plurality of photosensitive chips, wherein the photosensitive elements of the photosensitive chips are arranged in a linear array, the plurality of photosensitive chips are arranged in sequence and the linear array directions of the plurality of photosensitive chips are the same, so that incident light is incident on the plurality of photosensitive chips, and the photosensitive chips receive light through the photosensitive elements and generate responses;

[0007] The filter element is arranged corresponding to the photosensitive chip and is arranged on the light incident side of the photosensitive chip. The filter element is used to allow the light in the incident light that belongs to the working band of the filter element to pass through, so that the passed light is incident on the photosensitive chip corresponding to the filter element. The working bands of the multiple filter elements are different.

[0008] Optionally, the photosensitive chip includes photosensitive elements of at least two different channels, the photosensitive elements of different channels respond to light of different wavelength bands, and the photosensitive elements of any channel are arranged in a linear array.

[0009] Optionally, the photosensitive chip includes a full-color channel photosensitive element and at least one monochrome channel photosensitive element, different monochrome channel photosensitive elements respond to different monochromatic lights respectively, the response band of the full-color channel photosensitive element covers the response band of the at least one monochrome channel photosensitive element, and the photosensitive elements of any channel are arranged in a linear array.

[0010] Optionally, the photosensitive chip includes a first channel photosensitive element, a second channel photosensitive element, a third channel photosensitive element and a fourth channel photosensitive element, the photosensitive elements of any channel are arranged in a linear array, the first channel photosensitive element is used to respond to red light, the second channel photosensitive element is used to respond to green light, the third channel photosensitive element is used to respond to blue light, and the fourth channel photosensitive element is used to respond to infrared light;

[0011] Alternatively, the photosensitive chip includes a first channel photosensitive element, a second channel photosensitive element, a third channel photosensitive element and a fourth channel photosensitive element, and the photosensitive elements of any channel are arranged in a linear array, the first channel photosensitive element is used to respond to red light, the second channel photosensitive element is used to respond to green light, the third channel photosensitive element is used to respond to blue light, and the response band of the fourth channel photosensitive element covers the response band of the first channel photosensitive element, the response band of the second channel photosensitive element and the response band of the third channel photosensitive element.

[0012] Optionally, it also includes a shell, a mounting seat and a plurality of filter seats, the filter seat is used to install the filter element, the mounting seat is provided with a plurality of concave cavities for placing the filter seat, the shell is provided with an opening, and a guide rail is provided on the inner side surface of the shell, so that the mounting seat is inserted into the opening and moves along the guide rail to reach a limited position in the shell.

[0013] Optionally, a circuit board is further included, the multiple photosensitive chips are arranged on one side of the circuit board, and a heat dissipation layer with a thermal conductivity greater than a preset value is arranged on the other side of the circuit board.

[0014] Optionally, it also includes a circuit board and a shell, the multiple photosensitive chips are arranged on the circuit board, the circuit board is arranged in the shell, the shell is provided with a reference plane, the circuit board is arranged on the reference plane, a heat conducting layer is arranged between the circuit board and the reference plane, the circuit board is bonded to the heat conducting layer, and the heat conducting layer is bonded to the reference plane.

[0015] Optionally, it also includes a circuit board, a main control board and a shell, the multiple photosensitive chips are arranged on the circuit board, the circuit board and the main control board are arranged side by side in the shell, the shell is provided with a boss extending into the shell, and a heat-conducting medium is filled between the high-heat device of the main control board and the boss.

[0016] Optionally, it further comprises a housing and a fan, the plurality of filter elements and the plurality of photosensitive chips are arranged in the housing, and heat dissipation fins are arranged on the outer side of the housing;

[0017] The fan is arranged on a side of the heat dissipation fins away from the housing. The fan is an axial flow fan. The air outlet of the fan faces the heat dissipation fins, and the air inlet of the fan faces outwards.

[0018] Optionally, it also includes a shell, the shell is provided with an interface adapter ring, and the interface adapter ring is used to install a lens so that the incident light after passing through the lens is incident on the multiple filter elements and the multiple photosensitive chips.

[0019] It can be known from the above technical scheme that the multi-spectral linear array imaging device provided by the present invention includes a plurality of filter elements and a plurality of photosensitive chips, the photosensitive elements of the photosensitive chips are arranged in a linear array, the plurality of photosensitive chips are arranged in sequence and the linear array direction of the plurality of photosensitive chips is the same, so that the incident light is incident on the plurality of photosensitive chips, and the photosensitive chips receive the light through the photosensitive elements and generate a response. The filter elements are arranged corresponding to the photosensitive chips and the filter elements are arranged on the light incident side of the photosensitive chips, the filter elements are used to allow the light belonging to the working band of the filter elements in the incident light to pass through, so that the passing light is incident on the photosensitive chip corresponding to the filter elements, and the working bands of the plurality of filter elements are different.

[0020] The multi-spectral linear array imaging device of the present invention is provided with a plurality of photosensitive chips, and corresponding photosensitive chips are provided with filter elements. The filter elements are utilized to allow light of corresponding wavelength bands in the incident light to pass through and be incident on the corresponding photosensitive chips, thereby realizing spectral imaging of the corresponding wavelength bands. The working wavelength bands of each filter element are different, so different spectral imaging can be realized, and there is no need to use prism splitting, thereby reducing the difficulty of processing and assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] FIG1 is a schematic diagram of the composition of a multi-spectral linear array imaging device provided by an embodiment;

[0023] FIG2 is a schematic diagram of a multi-spectral linear array imaging device combined with a lens for push-scan imaging provided by an embodiment;

[0024] FIG3 is a spectral response curve of four monochromatic channel photosensitive elements of a multi-spectral linear array imaging device provided by an embodiment;

[0025] FIG4 is a spectral response curve of four channel photosensitive elements of a multi-spectral linear array imaging device provided by another embodiment;

[0026] FIG5 is a transmittance curve of a filter element of a multi-spectral linear array imaging device provided by an embodiment;

[0027] FIG6 is a schematic diagram of a multi-spectral linear array imaging device and a lens provided by an embodiment;

[0028] FIG7 is an exploded schematic diagram of the structure of a multi-spectral linear array imaging device and a lens provided by an embodiment;

[0029] FIG8 is a partial longitudinal cross-sectional view of a multi-spectral linear array imaging device provided by an embodiment;

[0030] FIG9 is a flow chart of the working principle of a multi-spectral linear array imaging device provided in this embodiment.

[0031] The reference numerals in the drawings of the specification include:

[0032] 1-multi-spectral linear array imaging device, 2-lens, 3-detected target, 21-lens adapter ring, 11-first photosensitive chip, 12-second photosensitive chip, 13-third photosensitive chip, 14-first filter element, 15-second filter element, 16-third filter element, 1101-first light beam, 1102-second light beam, 1103-third light beam, 1104-fourth light beam, 1201-fifth light beam, 1202-sixth light beam, 1203-seventh light beam, 1204-eighth light beam, 1301-ninth light beam, 1302-tenth light beam, 1303-eleventh light beam, 1304-twelfth light beam;

[0033] 101-circuit board, 102-interface adapter ring, 103-first sealing rubber ring, 104-front shell, 105-second sealing rubber ring, 106-thermal conductive pad, 107-middle shell, 108-third sealing rubber ring, 109-main control board, 110-power interface board, 111-rear shell, 112-heat dissipation fins, 113-fan, 114-cover, 115-pressing plate, 116-filter element, 117-filter seat, 118-mounting seat, 119-guide rail, 120-opening. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0035] This embodiment provides a multi-spectral linear array imaging device, comprising a plurality of filter elements and a plurality of photosensitive chips, wherein the photosensitive elements of the photosensitive chips are arranged in a linear array, the plurality of photosensitive chips are arranged in sequence and the linear array directions of the plurality of photosensitive chips are the same, so that incident light is incident on the plurality of photosensitive chips, and the photosensitive chips receive light through the photosensitive elements and generate responses;

[0036] The filter element is arranged corresponding to the photosensitive chip and is arranged on the light incident side of the photosensitive chip. The filter element is used to allow the light in the incident light that belongs to the working band of the filter element to pass through, so that the passed light is incident on the photosensitive chip corresponding to the filter element. The working bands of the multiple filter elements are different.

[0037] The linear array direction of the photosensitive chip refers to the direction in which the photosensitive elements of the photosensitive chip are arranged in a linear array. The filter element is set corresponding to the photosensitive chip. For any set of filter elements and photosensitive chips, when the incident light is incident on the filter element, the light belonging to the working band of the filter element passes through the filter element and then enters the corresponding photosensitive chip. The photosensitive element of the photosensitive chip receives the light and generates a response, thereby realizing spectral imaging of the corresponding band.

[0038] The multi-spectral linear array imaging device of this embodiment is provided with a plurality of photosensitive chips, and filter elements are provided corresponding to the photosensitive chips. The filter elements are used to allow the light of the corresponding wavelength band in the incident light to pass through and enter the corresponding photosensitive chip, so as to realize the spectral imaging of the corresponding wavelength band. The working wavelength bands of each filter element are different, so different spectral imaging can be realized. In addition, the multi-spectral linear array imaging device of this embodiment avoids the use of prism light splitting, and reduces the difficulty of processing and assembly.

[0039] For example, reference may be made to FIG1 , which is a schematic diagram of the composition of a multi-spectral linear array imaging device provided by an embodiment. As shown in the figure, the multi-spectral linear array imaging device 1 includes three groups of filter elements and photosensitive chips, including a first filter element 14 and a first photosensitive chip 11, a second filter element 15 and a second photosensitive chip 12, and a third filter element 16 and a third photosensitive chip 13. Light from the detected target 3 passes through the lens 2 and is incident on each group of filter elements and photosensitive chips.

[0040] In some embodiments, the photosensitive chip may include photosensitive elements of a channel, and the photosensitive elements of this channel are arranged in a linear array, and the photosensitive elements of this channel can respond to light of a corresponding band. The photosensitive elements of this channel may be monochrome channel photosensitive elements, and the monochrome channel photosensitive elements are used to respond to monochrome light. For example, the monochrome channel photosensitive elements may be photosensitive elements that respond to red light, or photosensitive elements that respond to green light, or photosensitive elements that respond to blue light. In this embodiment, the filter element may be a filter element including a single working band, such as a narrow-band filter element, thereby forming a combination of "narrow-band filter element + single linear array".

[0041] In some embodiments, the photosensitive chip may include photosensitive elements of a channel, and the photosensitive elements of this channel are arranged in a linear array. The photosensitive elements of this channel may be full-color channel photosensitive elements, and the response band of the full-color channel photosensitive elements covers at least two different monochromatic light bands. The response band of the photosensitive element refers to the wavelength range of light that can make the photosensitive element respond. In this embodiment, the filter element may be a filter element including multiple working bands, that is, the filter element can pass light of each working band, and the filter element may adopt a multi-bandpass filter element, thus forming a combination of "multi-bandpass filter element + single linear array".

[0042] In some embodiments, the photosensitive chip includes photosensitive elements of at least two different channels, and the photosensitive elements of different channels respond to light of different wavelength bands respectively, and the photosensitive elements of any channel are arranged in a linear array. In this way, for a single photosensitive chip, spectral imaging is performed using the multi-line array field of view spectroscopic principle, and the photosensitive elements of any channel can be considered as a spectral channel of the photosensitive chip. The photosensitive elements of any one of the channels can be monochrome channel photosensitive elements or full-color channel photosensitive elements. The photosensitive elements of the at least two different channels can be different monochrome channel photosensitive elements, and the monochrome channel photosensitive elements are used to respond to monochrome light. For example, the photosensitive chip may include photosensitive elements that respond to red light, photosensitive elements that respond to green light, and photosensitive elements that respond to blue light. For example, the photosensitive chip includes a row of red light photosensitive elements, a row of green light photosensitive elements, and a row of blue light photosensitive elements. In this embodiment, the filter element may be a filter element including multiple working bands, that is, the filter element can allow light of each working band to pass through, and the filter element may be a multi-bandpass filter element, thus forming a combination of "multi-bandpass filter element + multi-line array". In practical applications, the transmittance curve of the filter element is reasonably designed to be coupled and matched with the spectral response curve of the corresponding photosensitive chip.

[0043] For example, reference may be made to FIG2 , which is a schematic diagram of a multi-spectral linear array imaging device provided by an embodiment in combination with a lens for push-scanning imaging. As shown in the figure, the multi-spectral linear array imaging device 1 is provided with three groups of filter elements and photosensitive chips, including a first photosensitive chip 11 and a corresponding first filter element, a second photosensitive chip 12 and a corresponding second filter element, and a third photosensitive chip 13 and a corresponding third filter element. The three photosensitive chips are sequentially arranged on the circuit board 101, and the linear array directions of the three photosensitive chips are parallel.

[0044] Any photosensitive chip is provided with four different monochromatic channel photosensitive elements, and any monochromatic channel photosensitive elements are arranged in a linear array, specifically, a row of first monochromatic channel photosensitive elements, a row of second monochromatic channel photosensitive elements, a row of third monochromatic channel photosensitive elements, and a row of fourth monochromatic channel photosensitive elements. For example, the three rows of monochromatic channel photosensitive elements may be red light photosensitive elements, green light photosensitive elements, blue light photosensitive elements, and infrared light photosensitive elements, respectively.

[0045] The first light beam 1101, the second light beam 1102, the third light beam 1103 and the fourth light beam 1104 are light beams that are incident on the first monochrome channel photosensitive element, the second monochrome channel photosensitive element, the third monochrome channel photosensitive element and the fourth monochrome channel photosensitive element of the first photosensitive chip 11 after passing through the lens 2. The fifth light beam 1201, the sixth light beam 1202, the seventh light beam 1203 and the eighth light beam 1204 are light beams that are incident on the first monochrome channel photosensitive element, the second monochrome channel photosensitive element, the third monochrome channel photosensitive element and the fourth monochrome channel photosensitive element of the second photosensitive chip 12 after passing through the lens 2. The ninth light beam 1301, the tenth light beam 1302, the eleventh light beam 1303 and the twelfth light beam 1304 are light beams that are incident on the first monochrome channel photosensitive element, the second monochrome channel photosensitive element, the third monochrome channel photosensitive element and the fourth monochrome channel photosensitive element of the third photosensitive chip 13 after passing through the lens 2.

[0046] In some embodiments, the photosensitive chip may include a first channel photosensitive element, a second channel photosensitive element, a third channel photosensitive element, and a fourth channel photosensitive element. The photosensitive elements of any channel are arranged in a linear array. The first channel photosensitive element is used to respond to red light, the second channel photosensitive element is used to respond to green light, the third channel photosensitive element is used to respond to blue light, and the fourth channel photosensitive element is used to respond to infrared light. In this embodiment, the photosensitive chip includes four monochromatic channel photosensitive elements. For example, reference may be made to FIG3, which is a spectral response curve of four monochromatic channel photosensitive elements of a multi-spectral linear array imaging device provided in an embodiment. As shown in the figure, the four monochromatic channel photosensitive elements can respond to red light, green light, blue light, and near-infrared light, respectively. In the figure, the first channel indicates the spectral response curve of the first channel photosensitive element, the second channel indicates the spectral response curve of the second channel photosensitive element, the third channel indicates the spectral response curve of the third channel photosensitive element, and the fourth channel indicates the spectral response curve of the fourth channel photosensitive element.

[0047] In some embodiments, the photosensitive chip may include a first channel photosensitive element, a second channel photosensitive element, a third channel photosensitive element, and a fourth channel photosensitive element. The photosensitive elements of any channel are arranged in a linear array. The first channel photosensitive element is used to respond to red light, the second channel photosensitive element is used to respond to green light, and the third channel photosensitive element is used to respond to blue light. The response band of the fourth channel photosensitive element covers the response band of the first channel photosensitive element, the response band of the second channel photosensitive element, and the response band of the third channel photosensitive element. The fourth channel photosensitive element may be a full-color channel photosensitive element. In this embodiment, the photosensitive chip includes a full-color channel photosensitive element and three monochromatic channel photosensitive elements. For example, reference may be made to FIG. 4, which is a spectral response curve of four channel photosensitive elements of a multi-spectral linear array imaging device provided in another embodiment. As shown in the figure, the three monochromatic channel photosensitive elements can respond to red light, green light, and blue light respectively, and the response band of the fourth channel photosensitive element covers the response bands of the above three monochromatic channel photosensitive elements.

[0048] For example, reference may be made to FIG5 , which is a transmittance curve of a filter element of a multi-spectral linear array imaging device provided by an embodiment. The ordinate of the curve represents transmittance in %. It can be seen that the filter element includes four working bands, and the central wavelengths of the four working bands are 405nm, 530nm, 630nm and 940nm, respectively, and the average transmittance is ≥85%. The half-wave peak bandwidth of the central wavelength of 405nm is 30nm, the half-wave peak bandwidth of the central wavelength of 530nm is 20nm, the half-wave peak bandwidth of the central wavelength of 630nm is 20nm, and the half-wave peak bandwidth of the central wavelength of 940nm is 30nm.

[0049] In this embodiment, there is no limitation on the number of photosensitive chips included in the multi-spectral linear array imaging device 1. Any photosensitive chip will be provided with a corresponding filter element, which can be provided according to application requirements in actual applications.

[0050] In some embodiments, the multi-spectral linear array imaging device 1 may further include a housing, a mounting seat 118, and a plurality of filter seats 117. The filter seat 117 is used to mount the filter element 116. The mounting seat 118 is provided with a plurality of concave cavities for placing the filter seat 117. The housing is provided with an opening 120, so that the mounting seat 118 is inserted into the opening 120 to be installed in the housing. In this way, the mounting seat 118 is detachably connected to the housing, and the filter seat 117 is detachably connected to the mounting seat 118, which is convenient for installing the filter element 116 or replacing the filter element 116. In some embodiments, a guide rail 119 is provided on the inner side of the housing, so that the mounting seat 118 is inserted into the opening 120 and moves along the guide rail 119 to reach a limited position in the housing, so that the installation operation is convenient and the installation accuracy of the filter element can be improved.

[0051] In some embodiments, a pressing plate 115 is further included, and the pressing plate 115 is used to press the pressing plate 115 on the filter seat 117 when the filter seat 117 is placed in the concave cavity of the mounting seat 118. The filter seat 117 can be fixed by the pressing plate 115 and the mounting seat 118, and the mounting seat 118 with the filter seat 117 installed and the pressing plate 115 are further inserted into the housing. The pressing plate 115 is fixed together with the mounting seat 118 to combine with the filter element 116 installed thereon as a complete detachable filter module, and the filter module structure can be removed from the housing as a whole and replaced independently. For example, reference can be made to Figures 6, 7 and 8. Figure 6 is a schematic diagram of a multi-spectral linear array imaging device and a lens provided in an embodiment, Figure 7 is a structural explosion schematic diagram of a multi-spectral linear array imaging device and a lens provided in an embodiment, and Figure 8 is a partial longitudinal cross-sectional view of a multi-spectral linear array imaging device provided in an embodiment. As shown in FIG. 7 and FIG. 8 , the mounting seat 118 reserves three concave cavities, and the concave cavities are used to place the filter seat 117. The filter element 116 is mounted on the filter seat 117, and the filter element 116 and the filter seat 117 serve as a filter module. The filter seat 117 can be called a filter holder. The filter element 116 is bonded to the filter seat 117 by glue. According to different bands, spectra, etc., multiple filter modules can be included, such as 450nm, 555nm, 660nm, etc. spectra, to achieve the acquisition of different band spectra images, and the filter module of the required spectrum is installed in front of the corresponding photosensitive chip according to application requirements. An opening 120 is provided in the middle shell 107, and a guide rail 119 is provided on the inner side of the front shell 104. The detachable mounting seat 118 is inserted from the opening 120 specified by the middle shell 107 and is guided by the guide rail 119. After reaching the limited position, the mounting seat 118 can be fixed, and the mounting seat 118 can be fixed by screws. In response to different application scenario requirements, spectral images of different bands and spectra will be selected. In view of this, the multi-spectral linear array imaging device 1 is provided with a detachable mounting seat 118 and a detachable filter module, and adopts a detachable and replaceable filter element + a photosensitive chip free combination solution. Compared with the existing prism splitting solution, it supports flexible disassembly and replacement of filter elements, solves the problem of high processing precision and complex assembly and adjustment process of prisms, can reduce production difficulty and cost, and improve assembly production efficiency.

[0052] In the multi-spectral linear array imaging device 1 shown in FIG2 and FIG8 , three photosensitive chips, namely, a first photosensitive chip 11, a second photosensitive chip 12 and a third photosensitive chip 13, are packaged on the circuit board 101. Any photosensitive chip is matched with a corresponding filter element to form a photosensitive module. However, it should be noted that this is only an example. In other embodiments, the number of photosensitive modules matched with photosensitive chips and filter elements included in the multi-spectral linear array imaging device 1 is not limited to three groups, and two or more groups can be selected according to application requirements.

[0053] In some embodiments, the multiple photosensitive chips are arranged on the same circuit board 101. Compared with each photosensitive chip being arranged on an independent circuit board, the multiple photosensitive chips in the multi-spectral linear array imaging device 1 are arranged on the same circuit board 101, which can achieve high installation accuracy and small error. The multiple photosensitive chips can be compactly and evenly distributed. Under the premise that the installation process of the photosensitive chip and the circuit board 101 is satisfied, the gap between adjacent photosensitive chips can be reduced as much as possible to ensure the minimum gap distance between adjacent imaging surfaces. The filter element can be attached to the surface of the photosensitive chip to reduce the optical path difference generated after the light passes through the filter element, and correspondingly reduce the phase difference value of the light. For example, refer to Figure 8, multiple photosensitive chips are packaged on the same circuit board 101 with the same reference. Specifically, three photosensitive chips are welded and packaged on the top layer of the front side of the circuit board 101, and the photosensitive chips on both sides are compactly and symmetrically distributed relative to the center. The three photosensitive chips are distributed with the same reference relative to the circuit board 101, and the photosensitive signal processing is performed at the same time to realize three-channel spectral linear array imaging.

[0054] In some embodiments, the multi-spectral linear array imaging device 1 may further include a circuit board 101, and the plurality of photosensitive chips are arranged on the circuit board 101. The plurality of photosensitive chips are arranged on one side of the circuit board 101, and a heat dissipation layer having a thermal conductivity greater than a preset value is arranged on the other side of the circuit board 101. The plurality of photosensitive chips are assembled and packaged on the circuit board 101, and each photosensitive chip generates heat, which may cause heat accumulation. To prevent the circuit board 101 and the photosensitive chips from overheating, a heat dissipation layer is arranged on the other side of the circuit board 101 to improve the heat dissipation capacity of the circuit board 101. The heat dissipation layer may be, but is not limited to, a copper layer. A large area of ​​copper layer may be arranged on the bottom layer of the circuit board 101 to improve the heat dissipation capacity of the entire circuit board 101. The housing may be provided with a reference surface, and the heat dissipation layer of the circuit board 101 may be attached to the reference surface.

[0055] In some embodiments, a heat conductor is provided in the housing for conducting heat, and the heat in the housing is quickly conducted to the housing through the heat conductor, and dissipated outward through the housing, thereby enhancing the heat conduction and heat dissipation capabilities of the housing. The heat conductor may be, but is not limited to, a heat pipe or a temperature equalizer.

[0056] In some embodiments, the multi-spectral linear array imaging device 1 may also include a circuit board 101 and a shell, the plurality of photosensitive chips are arranged on the circuit board 101, the circuit board 101 is arranged in the shell, the shell is provided with a reference plane, the circuit board 101 is arranged on the reference plane, a heat-conducting layer is arranged between the circuit board 101 and the reference plane, the circuit board 101 is bonded to the heat-conducting layer, and the heat-conducting layer is bonded to the reference plane. The heat-conducting layer fills the air gap between the circuit board 101 and the reference plane, increases the effective contact area between the mating surfaces of the two, reduces the contact thermal resistance, and improves the heat conduction capacity and the heat dissipation capacity. The heat-conducting layer may adopt, but is not limited to, a heat-conducting pad 106. As shown in FIG. 7 , a heat-conducting pad 106 is arranged between the circuit board 101 and the reference plane of the middle shell 107.

[0057] In some embodiments, the multi-spectral linear array imaging device 1 further includes a housing, and the housing is provided with an interface adapter ring 102, and the interface adapter ring 102 is used to install the lens 2, so that the incident light after passing through the lens 2 is incident on the multiple filter elements 116 and the multiple photosensitive chips. The interface adapter ring 102 can be matched with lenses 2 of different specifications, and the interface adapter ring 102 can be a standard threaded interface. As shown in Figures 6 and 7, the housing includes a front housing 104, a middle housing 107, and a rear housing 111 connected in sequence, and the interface adapter ring 102 and the first sealing rubber ring 103 are installed on the limiting flange surface of the front housing 104. The lens 2 can be screwed on the interface adapter ring 102 through the matching lens adapter ring 21 to achieve the integrated installation of the lens 2. The image surface of the lens 2 needs to cover the multiple photosensitive chips to ensure that the incident light after passing through the lens 2 can be incident on each photosensitive chip. The lens 2 can be used but not limited to an industrial lens.

[0058] In some embodiments, the multi-spectral linear array imaging device 1 may further include a circuit board 101, a main control board 109, and a housing, wherein the plurality of photosensitive chips are disposed on the circuit board 101, the circuit board 101 and the main control board 109 are disposed in parallel in the housing, the housing is provided with a boss extending into the housing, and a heat-conducting medium is filled between the high-heat device of the main control board 109 and the boss. The main control board 109 is used for computing and processing spectral data and signal control, and is the main module for realizing the functions of the multi-spectral linear array imaging device 1. The main control board 109 is provided with high-power computing devices, such as a central processing unit (CPU), memory, etc., which will generate a large amount of heat during operation, so it is necessary to focus on heat dissipation optimization. As shown in FIG. 7 , a boss is provided in the rear housing 111, which can be called a heat dissipation boss. A heat conducting medium is filled between the high-heat device of the main control board 109 and the contact surface of the boss to increase the contact area, reduce the contact thermal resistance, and improve the efficiency of heat conduction, so that the heat generated by the high-power consumption components can be quickly transferred to the rear housing through the heat conducting medium and the boss. The heat conducting medium can be, but is not limited to, a heat conducting interface material such as thermal conductive silicone grease.

[0059] The rear housing 111 may have a thermal conductivity greater than a preset value, so that the thermal conductivity is strong and the heat dissipation is enhanced. For example, the rear housing 111 may be made of a metal material with a large thermal conductivity. In some embodiments, heat dissipation fins 112 may be provided on the outer side of the rear housing 111 to increase the heat dissipation area and improve the heat radiation heat dissipation capability.

[0060] In some embodiments, the multi-spectral linear array imaging device 1 may further include a housing and a fan, wherein the plurality of filter elements and the plurality of photosensitive chips are arranged in the housing, and a heat fin 112 is arranged on the outside of the housing; the fan 113 is arranged on the side of the heat dissipation fin 112 away from the housing, and the fan 113 is an axial flow fan, wherein the air outlet of the fan 113 faces the heat dissipation fin 112, and the air inlet of the fan 113 faces the outside. When the fan 113 is running, the fan 113 inhales the airflow with a lower temperature in the external environment, and blows it out from the air outlet end, and the low-temperature airflow flows to both sides along the heat dissipation fin 112, passes through the heat dissipation fin 112, and returns to the external environment. In this process, the low-temperature airflow passes through the high-temperature heat dissipation fin 112, and takes away part of the heat of the high-temperature fin 112, and the temperature of the rear housing 111 is quickly reduced by forced convection heat dissipation, thereby controlling the temperature of the high-power consumption components in the housing, and achieving stable and reliable operation. The fan 113 is arranged on the outside of the heat dissipation fin 112 of the rear housing 111, which can further enhance the heat dissipation. A cover 114 may be provided, mounted on the fan 113, to protect the fan 113 and to beautify the fan 113, and the cover 114 may be called a fan cover. The cover 114 may be fixed to the rear housing 111 by screws.

[0061] The main control board 109 and the circuit board 101 can be interconnected through an inter-board connector. The circuit board 101 can be arranged on the reference surface in the front concave cavity of the middle shell 107, and the main control board 109 is arranged in the rear concave cavity of the middle shell 107. The two are matched through end faces and fixed by screws. A heat conducting member, such as an integrated heat pipe or a temperature plate, can be arranged in the front concave cavity of the middle shell 107 to quickly conduct the heat in the shell to the shell and enhance the heat dissipation capacity.

[0062] The multi-spectral linear array imaging device 1 is also provided with a power interface board 110, which is located on the side of the main control board 109 away from the circuit board 101, that is, behind the main control board 109. The power interface board 110 is interconnected with the main control board 109 through an inter-board connector. The power interface board 110 is used to connect to an external power supply to realize the conversion input of the external power supply and power the various devices of the device. The power interface board 110 is also provided with a hardware interface, such as cameralink, aviation socket, etc., to realize internal and external data interaction such as data transmission and signal control.

[0063] The housing supports, installs and protects the circuit board 101, the main control board 109, etc. The middle housing 107 and the rear housing 111 can be made of metal, which has good heat dissipation performance.

[0064] In some embodiments, the stopper of the front shell 104 and the middle shell 107 cooperate, and the integrated installation of the front shell 104 and the middle shell 107 can be achieved by screws. In some embodiments, the stopper of the rear shell 111 cooperates with the stopper of the middle shell 107, and the integrated installation of the rear shell 111 and the middle shell 107 can be achieved by screws. The front shell 104 is installed on the front matching stopper end face of the middle shell 107 and is locked and fixed by four screws. A second sealing rubber ring 105 is provided at the matching stopper end face of the front shell 104 and the middle shell 107 to further enhance the protection effect. A third sealing rubber ring 108 is provided between the matching surfaces of the middle shell 107 and the rear shell 111.

[0065] For example, reference may be made to FIG9 , which is a flowchart of the working principle of a multi-spectral linear array imaging device provided in this embodiment. In the push-scanning detection process, the detected target 3 is placed on a moving platform and moves with the platform at a constant speed. When the detected target 3 enters the field of view of the multi-spectral linear array imaging device 1, the imaging device sequentially completes the acquisition of each spectral channel image of the detected target 3, sends the spectral data to a computer or other processing terminal in real time, and splices each spectral image to obtain complete high-resolution spectral image data. Further, the spectral images between different channels can be registered and processed based on feature points.

[0066] The multi-spectral linear array imaging device of this embodiment has the following advantages:

[0067] 1. The multi-spectral linear array imaging device has a prism-free beam splitting design, which reduces the processing difficulty and production cost of the prism; there is no need to install the prism, which reduces the production and use of external auxiliary assembly and adjustment tooling, simplifies the assembly and adjustment process, avoids the tedious operations caused by prism assembly and adjustment, saves debugging time, and improves assembly production efficiency.

[0068] 2. The multi-spectral linear array imaging device has small errors, high spectral imaging quality, high measurement accuracy, and a small structure size. It can meet the needs of miniaturized design, and the device is highly adaptable and can meet customized and multi-scenario applications. The device does not have a prism for spectroscopy, and the light will not be reflected or refracted by the prism in the device, resulting in less energy loss. It can acquire high-quality spectral images and achieve higher-precision measurement and monitoring. The internal space layout without a prism is more compact, and the device size is smaller, which can achieve miniaturized and lightweight design. Multiple linear array photosensitive chips are packaged on the same circuit board with the same reference, which has high accuracy and small errors compared to multiple independent photosensitive modules. The filter element can be replaced independently and combined with the photosensitive chip to meet personalized and customized application needs, with wider adaptability and applicability.

[0069] The above is a detailed introduction to the multi-spectral linear array imaging device provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A multi-spectral linear array imaging device, characterized in that: It comprises a plurality of filter elements and a plurality of photosensitive chips, wherein the photosensitive elements of the photosensitive chips are arranged in a linear array, the plurality of photosensitive chips are arranged in sequence and the linear array direction of the plurality of photosensitive chips is the same, so that incident light is incident on the plurality of photosensitive chips, and the photosensitive chips receive light through the photosensitive elements and generate a response; The filter element is arranged corresponding to the photosensitive chip and is arranged on the light incident side of the photosensitive chip. The filter element is used to allow the light in the incident light that belongs to the working band of the filter element to pass through, so that the passed light is incident on the photosensitive chip corresponding to the filter element. The working bands of the multiple filter elements are different.

2. The multi-spectral linear array imaging device according to claim 1, characterized in that: The photosensitive chip includes photosensitive elements of at least two different channels, and the photosensitive elements of different channels respond to light of different wavelength bands respectively. The photosensitive elements of any channel are arranged in a linear array.

3. The multi-spectral linear array imaging device according to claim 1, characterized in that: The photosensitive chip includes a full-color channel photosensitive element and at least one monochrome channel photosensitive element. Different monochrome channel photosensitive elements respond to different monochromatic lights respectively. The response band of the full-color channel photosensitive element covers the response band of the at least one monochrome channel photosensitive element. The photosensitive elements of any channel are arranged in a linear array.

4. The multi-spectral linear array imaging device according to claim 1, characterized in that: The photosensitive chip includes a first channel photosensitive element, a second channel photosensitive element, a third channel photosensitive element and a fourth channel photosensitive element, and the photosensitive elements of any channel are arranged in a linear array, the first channel photosensitive element is used to respond to red light, the second channel photosensitive element is used to respond to green light, the third channel photosensitive element is used to respond to blue light, and the fourth channel photosensitive element is used to respond to infrared light; Alternatively, the photosensitive chip includes a first channel photosensitive element, a second channel photosensitive element, a third channel photosensitive element and a fourth channel photosensitive element, and the photosensitive elements of any channel are arranged in a linear array, the first channel photosensitive element is used to respond to red light, the second channel photosensitive element is used to respond to green light, the third channel photosensitive element is used to respond to blue light, and the response band of the fourth channel photosensitive element covers the response band of the first channel photosensitive element, the response band of the second channel photosensitive element and the response band of the third channel photosensitive element.

5. The multi-spectral linear array imaging device according to any one of claims 1 to 4, characterized in that: It also includes a shell, a mounting seat and a plurality of filter seats, wherein the filter seat is used to install the filter element, the mounting seat is provided with a plurality of concave cavities for placing the filter seat, the shell is provided with an opening, and a guide rail is provided on the inner side surface of the shell, so that the mounting seat is inserted into the opening and moves along the guide rail to reach a limited position in the shell.

6. The multi-spectral linear array imaging device according to any one of claims 1 to 4, characterized in that: It also includes a circuit board, wherein the plurality of photosensitive chips are arranged on one side of the circuit board, and a heat dissipation layer with a thermal conductivity greater than a preset value is arranged on the other side of the circuit board.

7. The multi-spectral linear array imaging device according to any one of claims 1 to 4, characterized in that: It also includes a circuit board and a shell, the multiple photosensitive chips are arranged on the circuit board, the circuit board is arranged in the shell, the shell is provided with a reference plane, the circuit board is arranged on the reference plane, a heat conducting layer is arranged between the circuit board and the reference plane, the circuit board is bonded to the heat conducting layer, and the heat conducting layer is bonded to the reference plane.

8. The multi-spectral linear array imaging device according to any one of claims 1 to 4, characterized in that: It also includes a circuit board, a main control board and a shell, the multiple photosensitive chips are arranged on the circuit board, the circuit board and the main control board are arranged side by side in the shell, the shell is provided with a boss extending into the shell, and a heat-conducting medium is filled between the high-heat device of the main control board and the boss.

9. The multi-spectral linear array imaging device according to any one of claims 1 to 4, characterized in that: It also includes a housing and a fan, the plurality of filter elements and the plurality of photosensitive chips are arranged in the housing, and a heat dissipation fin is arranged on the outer side of the housing; The fan is arranged on a side of the heat dissipation fins away from the housing. The fan is an axial flow fan. The air outlet of the fan faces the heat dissipation fins, and the air inlet of the fan faces outwards.

10. The multi-spectral linear array imaging device according to any one of claims 1 to 4, characterized in that: It also includes a shell, which is provided with an interface adapter ring, and the interface adapter ring is used to install a lens so that the incident light after passing through the lens is incident on the multiple filter elements and the multiple photosensitive chips.

Images