Probe card structure

Abstract

The invention discloses a probe card structure. The probe card structure comprises an upper guide plate group, a lower guide plate group, a first probe group, a second probe group and at least one reinforcing piece, the upper guide plate set comprises a first upper guide plate and a second upper guide plate. The lower guide plate set is parallel to the upper guide plate set and comprises a first lower guide plate and a second lower guide plate. The first probe set comprises a plurality of first probes, each first probe is provided with a first contact end and a second contact end, the first contact ends penetrate through the upper guide plate holes, and the second contact ends penetrate through the lower guide plate holes. The second probe set comprises a plurality of second probes with the length different from that of the first probes, each second probe is provided with a third contact end and a fourth contact end, the third contact ends penetrate through the upper guide plate holes, and the fourth contact ends penetrate through the lower guide plate holes. The position of the second lower guide plate determines the length of the fourth contact end protruding out of the lower guide plate group.

Description

Technical Field

[0001] The invention relates to a probe card structure, in particular to a probe card structure used for testing objects to be tested at different heights. Background Art

[0002] When testing semiconductors, a probe card is used to contact the pads or bumps on the device under test (DUT) and analyze the electrical signals to obtain the test results of the DUT. In the chip-on-wafer-on-substrate (CoWoS) packaging process, different chips are first connected together through a wafer-level silicon interposer to form a CoW chip, and then the CoW chip is connected to the substrate.

[0003] In the prior art test, as long as the probes are kept at the same level, there will not be a big problem, because the objects to be tested on the same substrate are located at the same level each time. Figure 1 As shown, when objects to be tested T (for example, chips) of different heights are arranged on the silicon interposer S1, when a probe card test is performed after the chip-wafer-substrate packaging process is adopted, there will be a situation where the heights of multiple objects to be tested T are different, resulting in the probe P being unable to uniformly contact the corresponding pads or bumps on the object to be tested T, thereby affecting the accuracy of the test.

[0004] Therefore, how to improve the testing capability of the probe card by improving the structural design and to detect objects under test with different heights on the substrate to overcome the above-mentioned defects has become one of the important issues that the industry wants to solve. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a probe card structure in view of the deficiencies in the prior art.

[0006] In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a probe card structure, which includes: an upper guide plate group, a lower guide plate group, a first probe group, a second probe group and at least one reinforcing member. The upper guide plate group includes at least a first upper guide plate. The lower guide plate group is arranged in parallel with the upper guide plate group, and includes at least a first lower guide plate and a second lower guide plate, and the first lower guide plate and the second lower guide plate include a plurality of lower guide plate holes. The first probe group includes a plurality of first probes, each of which has a first contact end and a second contact end, the first contact end passes through the upper guide plate hole, and the second contact end passes through the lower guide plate hole. The second probe group includes a plurality of second probes having a length different from that of the plurality of first probes, each of which has a third contact end and a fourth contact end, the third contact end passes through the upper guide plate hole, and the fourth contact end passes through the lower guide plate hole. The length of the plurality of second probes is greater than the length of the plurality of first probes. At least one reinforcing member is arranged between the first lower guide plate and the second lower guide plate. The first probe and the second probe simultaneously pass through the first upper guide plate, and the first probe and the second probe simultaneously pass through at least one of the first lower guide plate and the second lower guide plate. The position of the first lower guide plate determines the length of the second contact end protruding from the lower guide plate group, and the position of the second lower guide plate determines the length of the fourth contact end protruding from the lower guide plate group. The first contact end is coplanar with the third contact end, and the second contact end is not coplanar with the fourth contact end.

[0007] One of the beneficial effects of the present invention is that the probe card structure and the manufacturing method thereof provided by the present invention can be achieved through "the upper guide plate group at least includes a first upper guide plate, and the first upper guide plate includes a plurality of upper guide plate holes. The lower guide plate group is arranged in parallel with the upper guide plate group, and at least includes a first lower guide plate and a second lower guide plate, and the first lower guide plate and the second lower guide plate include a plurality of lower guide plate holes", "the first probe group includes a plurality of first probes, each of the first probes has a first contact end and a second contact end, the first contact end passes through the upper guide plate hole, and the second contact end passes through the lower guide plate hole. The second probe group includes a plurality of second probes, each of the second probes has a third contact end and a fourth contact end, the third contact end passes through the upper guide plate hole, and the fourth contact end passes through the lower guide plate hole, and The technical schemes of "the length of the multiple second probes is greater than the length of the multiple first probes", "at least one of the reinforcement members is arranged between the first lower guide plate and the second lower guide plate", "the first probe and the second probe pass through the first upper guide plate at the same time, and the first probe and the second probe pass through at least one of the first lower guide plate and the second lower guide plate at the same time", "the position of the first lower guide plate determines the length of the second contact end protruding from the lower guide plate group, and the position of the second lower guide plate determines the length of the fourth contact end protruding from the lower guide plate group" and "the first contact end is coplanar with the third contact end, and the second contact end is not coplanar with the fourth contact end", so that the probes can evenly contact the corresponding pads or bumps on the object to be tested, thereby improving the testing capability of the probe card.

[0008] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the existing technical problem.

[0010] Figure 2A It is a side view schematic diagram of the first embodiment of the present invention.

[0011] Figure 2B It is a side view schematic diagram of another embodiment of the present invention.

[0012] Figure 3A FIG. 1 is a side view of a second embodiment of the present invention.

[0013] Figure 3B It is a side view schematic diagram of yet another embodiment of the present invention.

[0014] Figure 4 FIG. 4 is a side view of a third embodiment of the present invention.

[0015] Figure 5 FIG. 4 is a side view of a fourth embodiment of the present invention.

[0016] Figure 6 FIG. 5 is a side view of a fifth embodiment of the present invention.

[0017] Figure 7 FIG. 4 is a side view of a sixth embodiment of the present invention.

[0018] Figure 8 FIG. 4 is a side view of a seventh embodiment of the present invention.

[0019] Description of the accompanying drawings: 1: probe card structure; 10: upper guide plate unit; 101: first upper guide plate; 102: second upper guide plate; 20: lower guide plate unit; 201: first lower guide plate; 202: second lower guide plate; 203: third lower guide plate; 204: fourth lower guide plate; 30: first probe group; 30a, 30b, 30c, 40a, 40b, 40c, 60a, 60b, 60c: probes; 31: first contact terminal; 32: second contact terminal; 41: third contact terminal; 42: fourth contact terminal; 61: fifth contact terminal; 62: sixth contact terminal; 50: reinforcement; S: substrate; S1: silicon interposer; S2: packaging substrate; S3: circuit board; P: probe; T1, T2, T3: object to be tested. DETAILED DESCRIPTION

[0020] The following is an explanation of the implementation of the "probe card structure" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more units in the associated listed items depending on the actual situation.

[0021] [First embodiment]

[0022] See also Figure 2AAs shown, the first embodiment of the present invention provides a probe card structure 1 for simultaneously testing the electrical properties of a first object to be tested T1 and a second object to be tested T2, which includes: a first upper guide plate 101, a lower guide plate group 20, a first probe group 30, a second probe group 40 and at least one reinforcing member 50. The first upper guide plate 101 includes a plurality of upper guide plate holes (not shown). The lower guide plate group 20 includes at least a first lower guide plate 201 and a second lower guide plate 202, and the first lower guide plate 201 and the second lower guide plate 202 include a plurality of lower guide plate holes (not shown). The first upper guide plate 101 is arranged in parallel with the lower guide plate group 20, that is, the first upper guide plate 101, the first lower guide plate 201 and the second lower guide plate 202 are parallel to each other.

[0023] The first probe group 30 includes a plurality of first probes 30a, 30b, and 30c, each of which has a first contact end 31 and a second contact end 32. The first contact end 31 passes through the upper guide plate hole, and the second contact end 32 passes through the lower guide plate hole, so that the first contact end 31 protrudes from the upper guide plate hole to the upper guide plate group 10 and is connected to the conductive contact of the space transformer or the main circuit board, and the second contact end 32 protrudes from the lower guide plate hole to the lower guide plate group 20 to contact the first object to be tested T1. In one embodiment, the lengths of the plurality of first probes 30a, 30b, and 30c are the same.

[0024] The second probe group 40 includes a plurality of second probes 40a, 40b, 40c, each of which has a third contact end 41 and a fourth contact end 42. The third contact end 41 passes through the upper guide plate hole, and the fourth contact end 42 passes through the lower guide plate hole, so that the third contact end 41 protrudes from the upper guide plate hole to the upper guide plate group 10 and is connected to the conductive contact of the space converter or the main circuit board, and the fourth contact end 42 protrudes from the lower guide plate hole to the lower guide plate group 20 to contact the second object to be tested T2. In one embodiment, the lengths of the plurality of second probes 40a, 40b, 40c are the same. It should be noted that the lengths of the second probes 40a, 40b, 40c are different from the lengths of the first probes 30a, 30b, 30c. In one embodiment, the first contact end 31 of the first probe 30a, 30b, 30c and the third contact end 41 of the second probe 40a, 40b, 40c are coplanar at the conductive contact of the space converter or the main circuit board. In one embodiment, as Figure 2B As shown, the first upper guide plate 101 includes a first section 101 a and a second section 101 b that are separated, the first probe set 30 passes through the first section 101 a , and the second probe set 40 passes through the second section 101 b .

[0025] In one embodiment of the present invention, at least one of the first upper guide plate 101 and the first lower guide plate 201 is integrally formed. That is, the first probe set 30 and the second probe set 40 at least share the first upper guide plate 101 or the first lower guide plate 201 .

[0026] In addition, the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c are vertical probes, for example, vertical spring-type test pins (Pogo Pins). However, as long as the vertical probes can be mounted on the probe card to simultaneously test the objects T1 and T2 of different heights, the type of probes used in the present invention is not particularly limited. Specifically, the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c can be made of metals with good conductivity and good elasticity, such as copper, palladium, silver, gold and platinum. Preferably, the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c further include an insulating coating layer.

[0027] Since the first probe group 30 and the second probe group 40 may share different numbers of lower guide plates, for example, the first probes 30a, 30b, 30c only pass through the first lower guide plate 201, while the second probes 40a, 40b, 40c pass through both the first lower guide plate 201 and the second lower guide plate 202, that is, when viewed from the side, the lengths of the first lower guide plate 201 and the second lower guide plate 202 are different; in some embodiments, when viewed from the side, the thicknesses of the first lower guide plate 201 and the second lower guide plate 202 may be different. In order to provide the first probe group 30 and the second probe group 40 with sufficient stress to load the force when the probe is testing the DUT, the probe card of the vertical probe has a reinforcing member 50 (spacer), which is usually formed of a reinforcing material, such as iron, stainless steel, etc. In the application of the present invention, the reinforcing member 50 can be disposed between the first lower guide plate 201 and the second lower guide plate 202 to fix the spacing between the first lower guide plate 201 and the second lower guide plate 202 and provide sufficient stress.

[0028] In other words, the reinforcing member 50 can be used to connect the first lower guide plate 201 and the second lower guide plate 202 and to keep the first lower guide plate 201 and the second lower guide plate 202 at a predetermined distance in the longitudinal direction. It should be noted that the number and position of the reinforcing members 50 can be adjusted as required as long as the force generated when the probe contacts the objects T1 and T2 of different heights can be supported. In the probe card structure 1 of the present invention, the plurality of reinforcing members 50 can have different sizes.

[0029] In one embodiment, the first probe group 30 passes through the first lower guide plate 201, and the second probe group 40 passes through the first lower guide plate 201 and the second lower guide plate 202 at the same time. In other words, the second probes 40a, 40b, 40c are arranged to pass through the first lower guide plate 201 and the second lower guide plate 202 at the same time so that the lengths of the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c exposed from the lower guide plate group 20 are substantially the same. In other words, the position of the second lower guide plate 202 determines the length of the fourth contact end 42 protruding from the lower guide plate group 20. In this embodiment, the distance from the second lower guide plate 202 to the first upper guide plate 101 is greater than the distance from the first lower guide plate 201 to the first upper guide plate 101, and the length of the second lower guide plate 202 is less than the length of the first lower guide plate 201.

[0030] In addition to adjusting the length of the second contact end 32 and the fourth contact end 42 protruding from the lower guide plate 20, in order to make the tips of the first probe group 30 and the second probe group 40 have a very close balanced contact force, the first probe group 30 and the second probe group 40 can use probes with different tip thicknesses. In other words, the length of the fourth contact end 42 protruding from the lower guide plate 20 and the tip thickness of the second probe group 40 determine the elasticity of the second probe group and the contact force on the DUT.

[0031] During actual testing, the first object to be tested T1 and the second object to be tested T2 are disposed on a substrate S, and the substrate S may be sequentially composed of a silicon interposer S1, a packaging substrate S2, and a circuit board S3. When the first object to be tested T1 and the second object to be tested T2 have different heights on the same substrate S, the length of the second probes 40a, 40b, 40c may be increased corresponding to the second object to be tested T2 with a lower height, so as to contact the second object to be tested T2, and the length of the fourth contact end 42 of the second probes 40a, 40b, 40c protruding from the second lower guide plate 202 is determined by the second lower guide plate 202. Therefore, the probe card structure 1 of the present invention may be used to simultaneously test the first object to be tested T1 and the second object to be tested T2 of different heights, and is thus particularly suitable for chip-wafer-substrate packaging processes.

[0032] [Second embodiment]

[0033] See also Figure 3A As shown, it is the second embodiment of the present invention, which is substantially the same as the first embodiment, and the differences are described as follows. In the second embodiment of the present invention, the upper guide plate assembly 10 further includes a second upper guide plate 102, which is arranged parallel to the first upper guide plate 101, and the second upper guide plate 102 includes a plurality of upper guide plate holes corresponding to the first upper guide plate 101.

[0034] In one embodiment of the present invention, the first upper guide plate 101 is integrally formed, the second upper guide plate 102 includes a third section 102a and a fourth section 102b that are separated, the first probe set 30 passes through the third section 102a, and the second probe set 40 passes through the fourth section 102b.

[0035] In another embodiment of the present invention, Figure 3B As shown, the first upper guide plate 101 is integrally formed, the second upper guide plate 102 includes a third section 102a and a fourth section 102b, and the first lower guide plate 201 may also include a fifth section 201a and a sixth section 201b. The first probe set 30 passes through the first upper guide plate 101, the third section 102a and the fifth section 201a, and the second probe set 40 passes through the first upper guide plate 101, the fourth section 102b, the sixth section 201b and the second lower guide plate 202.

[0036] [Third embodiment]

[0037] See also Figure 4 , which is the third embodiment of the present invention. This embodiment is substantially the same as the second embodiment, and the differences are described as follows. In the probe card structure of the third embodiment of the present invention, the first lower guide plate 201 is integrally formed, the first upper guide plate 101 includes a separated first section 101a and a second section 101b, and the second upper guide plate 102 includes a separated third section 102a and a fourth section 102b. The first probe group 30 passes through the first section 101a, the third section 102a, i.e., the first lower guide plate 201, and the second probe group 40 passes through the second section 101b, the fourth section 102b, the first lower guide plate 201, and the second lower guide plate 202.

[0038] [Fourth embodiment]

[0039] See also Figure 5 , which is the fourth embodiment of the present invention. This embodiment is substantially the same as the third embodiment, and the differences are described as follows. In the probe card structure of the fourth embodiment of the present invention, the upper guide plate group 10 and the lower guide plate group 20 of the probe card structure 1 may include different numbers of guide plates. Specifically, the lower guide plate group 20 further includes a third lower guide plate 203, and the first lower guide plate 201 and the third lower guide plate 203 have different thicknesses.

[0040] In one embodiment, the length of the third lower guide plate 203 is less than the length of the first lower guide plate 201 and the second lower guide plate 202. Further, the third lower guide plate 203 includes a plurality of lower guide plate holes (not shown), and the distance from the third lower guide plate 203 to the first upper guide plate 101 is less than the distance from the first lower guide plate 201 to the first upper guide plate 101. In one embodiment, the first probe set 30 passes through the lower guide plate holes of the first lower guide plate 201 and the second lower guide plate 202, and the second probe set passes through the lower guide plate holes of the first lower guide plate 201, the second lower guide plate 202, and the third lower guide plate 203.

[0041] In one embodiment of the present invention, there may be no reinforcement member 50 between the second lower guide plate 202 and the third lower guide plate 203. Specifically, since the thickness of the third lower guide plate 203 is set to be greater than the thickness of the first lower guide plate 201 and the second lower guide plate 202, the height difference due to the lack of reinforcement member 50 can be compensated, and there is no reinforcement member 50 between the second lower guide plate 202 and the third lower guide plate 203. Therefore, even if there is no reinforcement member 50 between the second lower guide plate 202 and the third lower guide plate 203, the length of the fourth contact end 42 protruding from the lower guide plate 20 group can be determined by the thicker third lower guide plate 203. In one embodiment, the first lower guide plate 201 may include a fifth section 201a and a sixth section 201b that are separated, the first probe group 30 passes through the fifth section 201a, and the second probe group 4 passes through the sixth section 201b.

[0042] [Fifth embodiment]

[0043] See also Figure 6 , which is the fifth embodiment of the present invention. This embodiment is substantially the same as the fourth embodiment, and the differences are described as follows. In the probe card structure of the fifth embodiment of the present invention, the first probe group 30 passes through the lower guide plate holes of the first lower guide plate 201 and the second lower guide plate 202, and the second probe group 40 passes through the lower guide plate holes of the second lower guide plate 202 and the third lower guide plate 203. The length of the first lower guide plate 201 is less than the length of the second lower guide plate 202, and the length of the third lower guide plate 203 is less than the length of the second lower guide plate 202.

[0044] In one embodiment, the sizes of the first lower guide plate 201 and the third lower guide plate 203 are smaller than the size of the second lower guide plate 202. That is, when viewed from the side, the lengths of the first lower guide plate 201 and the third lower guide plate are smaller than the length of the second lower guide plate 202. In this embodiment, only the second lower guide plate 202 has the longest length, which can save manufacturing costs while extending the second probes 40a, 40b, 40c.

[0045] In addition, the first lower guide plate 201 and the third lower guide plate 203 do not overlap each other in the longitudinal direction, so as to respectively set the lengths of the first probes 30a, 30b, 30c and the second probes 40a, 40b, 40c protruding from the lower guide plate set 20 of different lengths. In other words, the first probes 30a, 30b, 30c pass through the first lower guide plate 201 and the second lower guide plate 202, and the second probes 40a, 40b, 40c pass through the second lower guide plate 202 and the third lower guide plate 203. In the portion where the first probes 30a, 30b, 30c pass through the first lower guide plate 201 and the second lower guide plate 202, the distance from the second lower guide plate 202 to the first object to be measured T1 is the first distance, and in the portion where the second probes 40a, 40b, 40c pass through the second lower guide plate 202 and the third lower guide plate 203, the distance from the third lower guide plate 203 to the second object to be measured T2 is the second distance, and the first distance is substantially equal to the second distance.

[0046] [Sixth embodiment]

[0047] See also Figure 7 As shown, it is the sixth embodiment of the present invention, which is substantially the same as the fifth embodiment, and the differences are described as follows. In the probe card structure of the sixth embodiment of the present invention, the probe card structure 1 can further include a third probe group 60, the third probe group 60 includes a plurality of third probes 60a, 60b, 60c, each of the third probes 60a, 60b, 60c has a fifth contact end 61 and a sixth contact end 62, the fifth contact end 61 passes through the upper guide plate hole, and the sixth contact end 62 passes through the lower guide plate hole, so that the fifth contact end 61 protrudes from the upper guide plate hole to the upper guide plate group 10 and is connected to the conductive contact of the space transformer or the main circuit board, and the sixth contact end 62 protrudes from the lower guide plate hole to the lower guide plate group 20 to contact the third object to be tested T3. In one embodiment, the first contact end 31 of the first probe 30a, 30b, 30c, the third contact end 41 of the second probe 40a, 40b, 40c, and the fifth contact end 61 of the third probe 60a, 60b, 60c are coplanar at the conductive contact of the space transformer or the main circuit board. The second contact end 32 of the first probe 30a, 30b, 30c, the fourth contact end 42 of the second probe 40a, 40b, 40c, and the sixth contact end 62 of the third probe 60a, 60b, 60c are not coplanar.

[0048] The length of the third probe 60a, 60b, 60c is different from the length of the first probe 30a, 30b, 30c and the second probe 40a, 40b, 40c, and the length of the first probe 30a, 30b, 30c is different from the length of the second probe 40a, 40b, 40c. In one embodiment, the length of the third probe 60a, 60b, 60c is greater than the length of the second probe 40a, 40b, 40c, and the length of the second probe 40a, 40b, 40c is greater than the length of the first probe 30a, 30b, 30c. In order to adjust the length of the sixth contact end 62 of the third probe 60a, 60b, 60c protruding from the lower guide plate group 20, the probe card structure 1 may further include a fourth lower guide plate 204, and the fourth lower guide plate 204 also includes a plurality of lower guide plate holes. The fourth lower guide plate 204 has a different size from the first lower guide plate 201, the second lower guide plate 202 and the third lower guide plate 203. For example, the size of the fourth lower guide plate 204 is the smallest. The position of the fourth lower guide plate 204 determines the length of the sixth contact end 62 protruding from the lower guide plate group 20. When viewed from the side, the length of the fourth lower guide plate 204 is different from that of the first lower guide plate 201, the second lower guide plate 202 and the third lower guide plate 203. In one embodiment, the length of the fourth lower guide plate 204 is the shortest. In this way, the probe card structure 1 of the present invention can be used in the case where the objects to be tested T1, T2, and T3 on the substrate S have three heights. The embodiments listed in the present invention are not intended to limit the length relationship between the lower guide plates. As long as the lengths of the contact ends of the first probes 30a, 30b, 30c, the second probes 40a, 40b, 40c, and the third probes 60a, 60b, 60c of different lengths protruding from the lower guide plate group 20 can be adjusted, the lengths of the lower guide plate groups can be combined using the embodiments disclosed in the present invention.

[0049] In one embodiment, the distance from the fourth lower guide plate 204 to the first upper guide plate 101 is greater than the distance from the second lower guide plate 202 to the first upper guide plate 101. In addition, the length of the fourth lower guide plate 204 is less than the length of the first lower guide plate 101, and the first probe set 30 and the second probe set 40 do not pass through the fourth lower guide plate 204. In one embodiment, the thickness of the first lower guide plate 201 and the fourth lower guide plate 204 may be different.

[0050] Specifically, the fourth lower guide plate 204 is disposed below the third lower guide plate 203, and the reinforcing member 50 may be disposed between the third lower guide plate 203 and the fourth lower guide plate 204. In the present embodiment, the fourth lower guide plate 204 is located between the third lower guide plate 203 and the third object to be tested T3, and is disposed close to the outer side of the probe structure 1 as a whole. The third probes 60a, 60b, 60c passing through the fourth lower guide plate 204 correspond to the third object to be tested T3 with the lowest height, so that the length of the sixth contact end 62 of the third probes 60a, 60b, 60c with the longest length protruding from the fourth lower guide plate 204 is set by the fourth lower guide plate 204. However, in another embodiment of the present invention, the reinforcing member 50 may not be disposed between the third lower guide plate 203 and the fourth lower guide plate 204, and the length of the sixth contact end 62 of the third probes 60a, 60b, 60c protruding from the fourth lower guide plate 204 is set by the fourth lower guide plate 204 with a thicker thickness.

[0051] [Seventh embodiment]

[0052] See also Figure 8 As shown, it is the seventh embodiment of the present invention, which is substantially the same as the sixth embodiment, and the differences are described as follows. In the probe card structure of the seventh embodiment of the present invention, in order to enable the probe card structure to measure the situation where the second object to be tested T2 with a lower height on the substrate S is located between the first object to be tested T1 and the third object to be tested T3 with relatively higher heights. The fourth lower guide plate 204 is set corresponding to the second object to be tested T2, and the fourth lower guide plate 204 has the smallest size, that is, when viewed from the side, the fourth lower guide plate 204 has the smallest length. In this embodiment, the fourth lower guide plate 204 is located between the third lower guide plate 203 and the second object to be tested T2, and is generally set close to the inner side of the probe structure 1.

[0053] That is, the fourth lower guide plate 204 can be disposed corresponding to the second object to be tested T2 with the lowest height, so as to provide longer third probes 60a, 60b, 60c corresponding to the second object to be tested T2 with the lowest height, so that the distance from the second lower guide plate 202 to the first object to be tested T1 is substantially equal to the distance from the fourth lower guide plate 204 to the second object to be tested T2 and the distance from the third lower guide plate 203 to the third object to be tested T3. In this way, the probe card structure 1 of the present invention can be used to test substrates S with various objects to be tested T with different heights.

[0054] In one embodiment of the present invention, the reinforcing member 50 may be disposed between the third lower guide plate 203 and the fourth lower guide plate 204 and located at one end of the fourth lower guide plate 204. However, in another embodiment of the present invention, the reinforcing member 50 may be disposed between the third lower guide plate 203 and the fourth lower guide plate 204 and located at both ends of the fourth lower guide plate 204 to more firmly fix the third lower guide plate 203 and the fourth lower guide plate 204. Therefore, as long as any two lower guide plates can be fixed and any two lower guide plates can be kept at a longitudinal distance from each other, the number and the arrangement position of the reinforcing member 50 are not particularly limited.

[0055] [Beneficial Effects of Embodiments]

[0056] One of the beneficial effects of the present invention is that the probe card structure and the manufacturing method thereof provided by the present invention can be achieved through "the upper guide plate group at least includes a first upper guide plate, and the first upper guide plate includes a plurality of upper guide plate holes. The lower guide plate group is arranged in parallel with the upper guide plate group, and at least includes a first lower guide plate and a second lower guide plate, and the first lower guide plate and the second lower guide plate include a plurality of lower guide plate holes", "the first probe group includes a plurality of first probes, each of the first probes has a first contact end and a second contact end, the first contact end passes through the upper guide plate hole, and the second contact end passes through the lower guide plate hole. The second probe group includes a plurality of second probes, each of the second probes has a third contact end and a fourth contact end, the third contact end passes through the upper guide plate hole, and the fourth contact end passes through the lower guide plate hole, and The technical schemes of "the length of the multiple second probes is greater than the length of the multiple first probes", "at least one of the reinforcement members is arranged between the first lower guide plate and the second lower guide plate", "the first probe and the second probe pass through the first upper guide plate at the same time, and the first probe and the second probe pass through at least one of the first lower guide plate and the second lower guide plate at the same time", "the position of the first lower guide plate determines the length of the second contact end protruding from the lower guide plate group, and the position of the second lower guide plate determines the length of the fourth contact end protruding from the lower guide plate group" and "the first contact end is coplanar with the third contact end, and the second contact end is not coplanar with the fourth contact end", so that the probes can evenly contact the corresponding pads or bumps on the object to be tested, thereby improving the testing capability of the probe card.

[0057] Furthermore, the third lower guide plate and / or the fourth lower guide plate of the present invention can be set corresponding to the object to be tested with the lowest height, so as to provide a longer probe corresponding to the object to be tested with the lowest height, so that when the probe card structure of the present invention is used to simultaneously test substrates with objects to be tested of different heights, the needle tip has a very close balance contact force (BCF), thereby improving the testing capability of the probe card.

[0058] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A probe card structure, characterized in that: The probe card structure comprises: an upper guide plate assembly, comprising at least a first upper guide plate, wherein the first upper guide plate comprises a plurality of upper guide plate holes; A lower guide plate group, which is arranged in parallel with the upper guide plate group and includes at least a first lower guide plate and a second lower guide plate, wherein the first lower guide plate and the second lower guide plate include a plurality of lower guide plate holes; A first probe group includes a plurality of first probes, each of which has a first contact end and a second contact end, wherein the first contact end passes through the upper guide plate hole, and the second contact end passes through the lower guide plate hole; A second probe group includes a plurality of second probes, each of the second probes has a third contact end and a fourth contact end, the third contact end passes through the upper guide plate hole, the fourth contact end passes through the lower guide plate hole, and the length of the plurality of second probes is greater than the length of the plurality of first probes; and at least one reinforcement member disposed between the first lower guide plate and the second lower guide plate; wherein the first probe and the second probe simultaneously pass through the first upper guide plate, and the first probe and the second probe simultaneously pass through at least one of the first lower guide plate and the second lower guide plate; Wherein, the position of the first lower guide plate determines the length of the second contact end protruding from the lower guide plate group, and the position of the second lower guide plate determines the length of the fourth contact end protruding from the lower guide plate group; The first contact end is coplanar with the third contact end, and the second contact end is not coplanar with the fourth contact end.

2. The probe card structure according to claim 1, characterized in that: The distance from the second lower guide plate to the first upper guide plate is greater than the distance from the first lower guide plate to the first upper guide plate; wherein the length of the second lower guide plate is less than the length of the first lower guide plate.

3. The probe card structure according to claim 2, characterized in that: The first probe group passes through the first lower guide plate, and the second probe group passes through the first lower guide plate and the second lower guide plate at the same time.

4. The probe card structure according to claim 1, characterized in that: The upper guide plate group further includes a second upper guide plate, which is arranged parallel to the first upper guide plate, and the second upper guide plate includes a plurality of upper guide plate holes corresponding to the first upper guide plate.

5. The probe card structure according to claim 1, characterized in that: The first upper guide plate further includes a first section and a second section that are separated; wherein the first probe set passes through the first section, and the second probe set passes through the second section.

6. The probe card structure according to claim 1, characterized in that: The first lower guide plate also includes a third section and a fourth section that are separated; wherein the first probe set passes through the third section, and the second probe set passes through the fourth section.

7. The probe card structure according to claim 2, characterized in that: The lower guide plate group further includes a third lower guide plate, the third lower guide plate includes a plurality of lower guide plate holes, and a distance from the third lower guide plate to the first upper guide plate is smaller than a distance from the first lower guide plate to the first upper guide plate.

8. The probe card structure according to claim 7, characterized in that: The first probe group passes through the lower guide plate holes of the first lower guide plate and the third lower guide plate, and the second probe group passes through the lower guide plate holes of the first lower guide plate, the second lower guide plate, and the third lower guide plate.

9. The probe card structure according to claim 7, characterized in that: The first probe group passes through the lower guide plate holes of the first lower guide plate and the third lower guide plate, and the second probe group passes through the lower guide plate holes of the first lower guide plate and the second lower guide plate; wherein the length of the third lower guide plate is shorter than that of the first lower guide plate.

10. The probe card structure according to claim 2 or 8, characterized in that: The first lower guide plate and the second lower guide plate have different thicknesses.

11. The probe card structure according to claim 1, characterized in that: The first probe group and the second probe group are vertical probes.

12. The probe card structure according to claim 1, characterized in that: The tips of the first probe group and the second probe group have different thicknesses.

13. The probe card structure according to claim 1, 2 or 8, characterized in that: The probe card structure further includes a third probe group, the third probe group includes a plurality of third probes, each of the third probes has a fifth contact end and a sixth contact end; wherein the lower guide plate group also includes a fourth lower guide plate, the fourth lower guide plate includes a plurality of lower guide plate holes, the fifth contact end passes through the upper guide plate hole, the sixth contact end passes through the lower guide plate hole, and the length of the plurality of third probes is greater than the length of the plurality of second probes; wherein the position of the fourth lower guide plate determines the length of the sixth contact end protruding from the lower guide plate group; wherein the first contact end, the third contact end and the fifth contact end are coplanar, and wherein the second contact end, the fourth contact end and the sixth contact end are not coplanar.

14. The probe card structure according to claim 13, characterized in that: The distance from the fourth lower guide plate to the first upper guide plate is greater than the distance from the second lower guide plate to the first upper guide plate.

15. The probe card structure according to claim 13, characterized in that: The first probe group and the second probe group do not pass through the fourth lower guide plate.

16. The probe card structure according to claim 13, characterized in that: The length of the fourth lower guide plate is smaller than that of the first lower guide plate.

17. The probe card structure according to claim 13, characterized in that: The first lower guide plate and the fourth lower guide plate have different thicknesses.

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