Optical window with solder ball

Abstract

The invention relates to the technical field of airtight packaging, in particular to an optical window with solder balls. Comprising a substrate, an optical film, solder balls and a metal film, the optical film is plated in the middle of the substrate, the metal film is plated on the edge of the optical film, a non-plated film area is arranged between the metal film and the optical film, the solder balls are arranged on the metal film, and gas micro-circulation channels are formed among the solder balls. The optical film, the metal film and the solder balls are sequentially produced on the substrate, the solder balls are uneven, gas micro-circulation channels can be reserved for internal gas and external gas, the internal gas pressure and the external gas pressure can be kept stable when gas protection packaging is carried out, and the packaging yield is improved.

Description

Technical Field

[0001] The invention relates to the technical field of airtight packaging, and in particular to an optical window with solder balls. Background Art

[0002] At present, most of the airtight packages are packaged using a sandwich structure of a packaging tube shell-solder sheet-optical window. This packaging structure is commonly used in most fields.

[0003] However, in the above structure, when used in gas-protected packaging, the internal and external gases cannot flow, resulting in excessive internal pressure after packaging, which is prone to leakage or damage to the device. Summary of the invention

[0004] The purpose of the present invention is to provide an optical window with solder balls, which solves the problem that when gas protection packaging is performed, the internal and external gases cannot flow, causing the internal air pressure to be too high after packaging, which is easy to leak or damage the device.

[0005] To achieve the above-mentioned purpose, the present invention adopts an optical window with solder balls, which includes a substrate, an optical film, solder balls and a metal film. The middle part of the substrate is coated with the optical film, the edge of the optical film is coated with the metal film, and there is a non-coated area between the metal film and the optical film. A plurality of solder balls are arranged on the metal film, and gas micro-circulation channels are formed between the plurality of solder balls.

[0006] Wherein, the substrate is composed of one or more of a Ge substrate, a Si substrate, a sapphire, and an optical glass.

[0007] The material of the solder ball includes one or more of AuSn solder, In solder, Sn solder and AuGe solder.

[0008] Wherein, the diameter of the solder ball is 50-500 μm.

[0009] Wherein, the distance between the centers of each two adjacent solder balls is 50-1000 μm.

[0010] Wherein, the material of the metal film includes one or more of Ti, Cr, Ni, Cu, Pt, Sn, and Au.

[0011] The optical window with solder balls of the present invention is plated with the optical film in the middle of the substrate, the metal film is plated at the edge of the optical film, and a plurality of solder balls are arranged on the metal film; the optical film, the metal film and the plurality of solder balls are sequentially produced on the substrate, and the plurality of solder balls are uneven, so that the gas micro-circulation channels can be reserved for the internal and external gases. When gas-protected packaging is performed, the internal and external air pressures can be kept stable, thereby improving the packaging yield. At the same time, during packaging, it is only necessary to place the optical window with solder balls at the packaging position, and the packaging can be achieved by heating and pressurizing, without the need for alignment with the packaging object, so as to facilitate the packaging operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0013] Figure 1 It is a schematic structural diagram of an optical window with solder balls according to the present invention.

[0014] 100-optical film, 200-solder balls, 300-metal film, 400-substrate. DETAILED DESCRIPTION

[0015] See also Figure 1 ,in Figure 1 Schematic diagram of the structure of the optical window with solder balls.

[0016] The present invention provides an optical window with solder balls, comprising a substrate 400, an optical film 100, solder balls 200 and a metal film 300, wherein the middle portion of the substrate 400 is coated with the optical film 100, the edge of the optical film 100 is coated with the metal film 300, a non-coated area is provided between the metal film 300 and the optical film 100, a plurality of solder balls 200 are arranged on the metal film 300, and gas micro-circulation channels are formed between the plurality of solder balls 200.

[0017] In this embodiment, the optical film 100 is plated on the middle of the substrate 400, the metal film 300 is plated on the edge of the optical film 100, and a plurality of solder balls 200 are arranged on the metal film 300; the optical film 100, the metal film 300 and the plurality of solder balls 200 are produced on the substrate 400 in sequence, and the plurality of solder balls 200 are uneven, so that the gas micro-circulation channels can be reserved for the internal and external gases. When gas-protected packaging is performed, the internal and external air pressures can be kept stable, thereby improving the packaging yield.

[0018] Furthermore, the substrate 400 is composed of one or more of a Ge substrate, a Si substrate, sapphire, and optical glass.

[0019] In this embodiment, the substrate 400 is composed of one or more of a Ge substrate, a Si substrate, sapphire, and optical glass; the optical film 100 is plated on the substrate 400, and the metal film 300 is plated on the optical film 100. A plurality of solder balls 200 are arranged on the metal film 300, and the space between the plurality of solder balls 200 can form the gas micro-circulation channel. When gas-protected packaging is performed, the gas flows in the gas micro-circulation channel, which can keep the internal and external air pressure stable and improve the packaging yield.

[0020] Furthermore, the material of the solder ball 200 includes one or more of AuSn solder, In solder, Sn solder, and AuGe solder.

[0021] In this embodiment, the substrate 400 is composed of one or more of a Ge substrate, a Si substrate, sapphire, and optical glass; the optical film 100 is plated in the middle of the substrate 400, and the metal film 300 is plated at the edge of the optical film 100, and a plurality of solder balls 200 are arranged on the metal film 300, wherein the material of the solder balls 200 includes one or more of AuSn solder, In solder, Sn solder, and AuGe solder, and the space between the plurality of solder balls 200 can form the gas micro-circulation channel. When gas-protected packaging is performed, the gas flows in the gas micro-circulation channel, which can keep the internal and external air pressure stable and improve the packaging yield.

[0022] Furthermore, the solder ball 200 has a diameter of 50-500 μm.

[0023] Furthermore, the distance between the centers of any two adjacent solder balls 200 is 50-1000 μm.

[0024] In this embodiment, the substrate 400 is composed of one or more of a Ge substrate, a Si substrate, a sapphire, and an optical glass; the optical film 100 is plated on the substrate 400, and the metal film 300 is plated on the optical film 100, and a plurality of solder balls 200 are arranged on the metal film 300, wherein the material of the solder balls 200 includes one or more of AuSn solder, In solder, Sn solder, and AuGe solder; wherein the diameter of the solder balls 200 is 50 to 500 μm, and the distance between the ball centers of each adjacent two solder balls 200 is 50 to 1000 μm, so that the space between the multiple solder balls 200 can form the gas micro-circulation channel, and when gas-protected packaging is performed, the gas flows in the gas micro-circulation channel, which can keep the internal and external air pressure stable and improve the packaging yield.

[0025] Furthermore, the material of the metal film 300 includes one or more of Ti, Cr, Ni, Cu, Pt, Sn, and Au.

[0026] In this embodiment, the substrate 400 is composed of one or more of a Ge substrate, a Si substrate, a sapphire, and an optical glass; the optical film 100 is plated on the substrate 400, wherein the optical film 100 can be designed according to different transmittance requirements. For example, if an anti-reflection of 1064 is required, one or more combinations of SiO2, Ta2O5, HfO2, and Al2O3 are selected; the metal film 300 is plated on the optical film 100, and the material of the metal film 300 includes Ti, Cr, The metal film 300 is composed of one or more of Ni, Cu, Pt, Sn, and Au; a plurality of solder balls 200 are arranged on the metal film 300, wherein the diameter of the solder balls 200 is 50 to 500 μm, and the center distance between each two adjacent solder balls 200 is 50 to 1000 μm, so that the space between the plurality of solder balls 200 can form the gas micro-circulation channel. When gas-protected packaging is performed, the gas flows in the gas micro-circulation channel, which can keep the internal and external air pressure stable and improve the packaging yield.

[0027] In the present invention, the substrate 400, the optical film 100, the solder ball 200 and the metal film 300 are first designed according to the packaging structure to determine the required materials. Then, the optical window with solder balls is produced according to the following optical window steps:

[0028] Select a large piece of the substrate 400 → coat the optical film 100 on the side without the metal film 300 → perform the first photolithography → coat the optical film 100 on the side with the metal film 300 → perform the second photolithography → coat the metal film 300 .

[0029] The specific process is:

[0030] Select the large substrate 400: a 4-inch / 6-inch optical substrate can be used;

[0031] Coating the optical film 100 without the metal film 300: using vacuum coating equipment, first evacuate to less than 10 -2 Pa, and then SiO2 / Ta2O5 is evaporated in layers by an electron gun;

[0032] First photolithography: first evenly coat the photoresist, then expose and develop, leaving the area that needs to be coated exposed;

[0033] The optical film 100 coated with the metal film 300 is first vacuumized to less than 10 -2 Pa, and then SiO2 / Ta2O5 is evaporated in layers by an electron gun;

[0034] Photoresist stripping: using a wet process to remove photoresist;

[0035] Second photolithography: first evenly coat the photoresist, then expose and develop, leaving the area that needs to be coated exposed;

[0036] Plating the metal film 300: using vacuum coating equipment, first evacuate the vacuum to less than 10 -2 Pa, depositing the desired metal film 300 by electron gun;

[0037] Photoresist stripping: Use a wet process to remove photoresist.

[0038] By means of laser ball implantation equipment, the material of the solder ball 200 is melted and then sprayed onto the metal film 300 to form the solder ball 200. By controlling the spray trajectory and the spray speed, the solder ball 200 can be arranged in a designed shape. The space between the plurality of solder balls 200 can form the gas micro-circulation channel. When gas-protected packaging is performed, the gas flows in the gas micro-circulation channel, which can keep the internal and external air pressure stable and improve the packaging yield.

[0039] During packaging, it is only necessary to place the optical window with the solder balls at the packaging position, and packaging can be achieved by heating and pressurizing, without the need for alignment with the packaging object, so as to facilitate the packaging operation.

[0040] What is disclosed above is only one or more preferred embodiments of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and making equivalent changes according to the claims of the present invention still fall within the scope of the invention.

Claims

1. An optical window with solder balls, characterized in that: It includes a substrate, an optical film, solder balls and a metal film, wherein the optical film is coated on the middle part of the substrate, the metal film is coated on the edge of the optical film, there is a non-coated area between the metal film and the optical film, a plurality of solder balls are arranged on the metal film, and gas micro-circulation channels are formed between the plurality of solder balls.

2. The optical window with solder balls as claimed in claim 1, characterized in that: The substrate is composed of one or more of a Ge substrate, a Si substrate, a sapphire, and an optical glass.

3. The optical window with solder balls as claimed in claim 1, characterized in that: The material of the solder ball includes one or more of AuSn solder, In solder, Sn solder, and AuGe solder.

4. The optical window with solder balls according to claim 1, characterized in that: The solder ball has a diameter of 50 to 500 μm.

5. The optical window with solder balls according to claim 1, characterized in that: The distance between the centers of two adjacent solder balls is 50-1000 μm.

6. The optical window with solder balls according to claim 1, characterized in that: The material of the metal film includes one or more of Ti, Cr, Ni, Cu, Pt, Sn, and Au.

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