Water cooling seat

By designing a heat dissipation assembly in the water cooling seat that gradually increases the number of fins and reduces the spacing of fins, the problem of reducing the water flow rate in the prior art is solved, and the heat dissipation performance and effect are significantly improved.

CN119200774APending Publication Date: 2024-12-27SHENZHEN NINGDONG TIMES TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202411197954.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-08-29
Publication Date
2024-12-27

AI Technical Summary

Technical Problem

The unreasonable arrangement of existing heat dissipation fins leads to a decrease in the water flow rate, which reduces the heat dissipation performance and leads to poor heat dissipation effect.

Method used

A water cooling seat is designed, including a temperature equalization base, a temperature equalization plate, a heat dissipation assembly and a temperature equalization cover plate. The heat dissipation assembly is composed of multiple sets of heat dissipation fins. The number of fins in each group is incremented in sequence, and the fin spacing is reduced in sequence to form Gradually narrow the passage to increase the flow rate of the water.

Benefits of technology

By increasing the water flow rate, the heat dissipation performance is improved, the temperature rise is avoided, and the heat dissipation effect is significantly improved.

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Abstract

The invention belongs to the technical field of computer heat dissipation, and particularly relates to a water cooling seat which comprises a temperature equalizing base, a temperature equalizing plate, a heat dissipation assembly, a temperature equalizing cover plate and a water cooling connector. The uniform-temperature plate is connected to the top side of the uniform-temperature base and arranged between the uniform-temperature base and the uniform-temperature cover plate, the heat dissipation assembly is arranged on the uniform-temperature plate, the uniform-temperature cover plate is connected to the uniform-temperature base, and the water cooling connector is connected to the uniform-temperature cover plate. The heat dissipation assembly comprises a plurality of sets of heat dissipation fins, the distances between the heat dissipation fins in each set of heat dissipation fins are sequentially reduced, every two adjacent sets of heat dissipation fins are arranged in a spaced mode, and the heat dissipation fins are arranged in a spaced mode. According to the water-cooling base and the water-cooling connector, after water enters the water-cooling base and the water-cooling connector, water sequentially flows through each group of heat dissipation fins, as the distances among the heat dissipation fins in each group of heat dissipation fins are sequentially reduced, the flow area is reduced, and water flow needs to pass through a narrower channel, the flow speed is increased, the flow speed of water reaching the water outlet from the water inlet is basically unchanged, the heat dissipation performance is improved, and the service life of the water-cooling base is prolonged. Temperature rise is avoided, and the heat dissipation effect is better.
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Description

Technical Field

[0001] The invention belongs to the technical field of computer heat dissipation, and in particular relates to a water cooling seat. Background Art

[0002] With the improvement of the performance of various communication and industrial electronic products, the chip power is getting bigger and bigger, and the heat flux density is getting higher and higher, which requires heat dissipation to ensure the release of chip performance. As the performance of the chip increases, the heat generated is more and more, so the heat dissipation device is extremely important for electronic products. The existing heat dissipation device takes away the heat through the water cooling pipe and the heat dissipation fins. The heat is dissipated to the heat dissipation fins for heat conduction. The cold water in the water cooling pipe takes away the heat on the heat dissipation fins. After the cold water passes through the fins, it enters the temperature equalization base and is discharged. Due to the unreasonable arrangement of the existing heat dissipation fins, the water flow will be greatly reduced after passing through the heat dissipation fins, resulting in a significant reduction in the flow rate of water from the water inlet to the water outlet, which reduces the heat dissipation performance and leads to poor heat dissipation effect. Summary of the invention

[0003] The purpose of the present invention is to provide a water cooling seat, aiming to solve the technical problem that the heat dissipation fins in the prior art are irrational in arrangement, the flow rate of water will be greatly reduced after passing through the heat dissipation fins, the heat dissipation performance will be reduced, and the heat dissipation effect will be poor.

[0004] To achieve the above-mentioned purpose, the water cooling seat provided in the embodiment of the present invention comprises a temperature balancing base, a temperature balancing plate, a heat dissipation component, a temperature balancing cover plate and a water cooling joint, wherein the temperature balancing plate is connected to the top side of the temperature balancing base and is arranged between the temperature balancing base and the temperature balancing cover plate, the heat dissipation component is arranged on the temperature balancing plate, the temperature balancing cover plate is connected to the temperature balancing base, and the water cooling joint is connected to the temperature balancing cover plate;

[0005] The heat dissipation assembly includes a plurality of groups of heat dissipation fins, the number of heat dissipation fins in each group increases successively, and the spacing between heat dissipation fins in each group decreases successively, adjacent heat dissipation fins in each group are spaced apart, and each heat dissipation fin is spaced apart.

[0006] As an optional solution of the present invention, the cooling fins are provided with five groups, namely a first group of cooling fins, a second group of cooling fins, a third group of cooling fins and a fourth group of cooling fins. The number of cooling fins of the first group of cooling fins, the second group of cooling fins, the third group of cooling fins and the fourth group of cooling fins increases successively, and the spacing between the cooling fins in each group of cooling fins decreases successively. The first group of cooling fins, the second group of cooling fins, the third group of cooling fins and the fourth group of cooling fins are fixedly connected to the temperature equalizing plate in sequence.

[0007] As an optional solution of the present invention, a receiving cavity is provided at the bottom of the temperature-averaging cover plate, the heat dissipation fins are arranged in the receiving cavity, and the temperature-averaging cover plate matches the temperature-averaging base and is fixedly connected to the temperature-averaging base.

[0008] As an optional solution of the present invention, the water cooling joint includes a water inlet joint and a water outlet joint, the water inlet joint includes a water inlet head and a water inlet pipe, the water inlet head is fixedly connected to the water inlet pipe, one end of the water inlet head is fixedly passed through the temperature equalizing cover plate, and is arranged above the cooling fins.

[0009] As an optional solution of the present invention, the water outlet joint includes a water outlet head and a water outlet pipe, the water outlet head is fixedly connected to the water outlet pipe, one end of the water outlet head is fixedly passed through the temperature equalizing cover plate, and is arranged above the heat dissipation fins.

[0010] As an optional solution of the present invention, a water inlet hole and a water outlet hole are provided on the temperature equalizing cover plate, the water inlet joint is fixedly connected to the temperature equalizing cover plate and connected to the water inlet hole, and the water outlet joint is fixedly connected to the temperature equalizing cover plate and connected to the water outlet hole.

[0011] As an optional solution of the present invention, a temperature-averaging heat dissipation pipe is provided in the temperature-averaging base, and a plurality of the temperature-averaging heat dissipation pipes are provided and are evenly fixedly connected to the temperature-averaging base.

[0012] As an optional solution of the present invention, a positioning column is provided on the side of the temperature-averaging base, and a plurality of the positioning columns are provided and are evenly fixedly connected to the temperature-averaging base.

[0013] The above one or more technical solutions in the water cooling seat provided by the embodiment of the present invention have at least one of the following technical effects:

[0014] The water cooling seat provided by the present application includes a temperature equalizing base, a temperature equalizing plate, a heat dissipation component, a temperature equalizing cover and a water cooling joint. The heat dissipation component includes multiple groups of cooling fins. The number of cooling fins in each group increases successively, and the spacing between cooling fins in each group of cooling fins decreases successively. Adjacent groups of cooling fins are separated and each cooling fin is separated. After water enters the water cooling joint, the cooling water flows through each group of cooling fins in turn. Since the spacing between cooling fins in each group of cooling fins decreases successively and the flow area becomes smaller, the water flow needs to pass through a narrower channel, thereby increasing the flow rate. The flow rate of water from the water inlet to the water outlet remains basically unchanged, thereby improving the heat dissipation performance, avoiding temperature increase, and achieving better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1A schematic diagram of the structure of a water cooling seat provided in an embodiment of the present invention.

[0017] Figure 2 An exploded view of a water cooling seat provided in an embodiment of the present invention.

[0018] Figure 3 An exploded view of a water cooling seat provided in an embodiment of the present invention.

[0019] Figure 4 A schematic diagram of the structure of a temperature homogenizer and a heat dissipation assembly provided in an embodiment of the present invention.

[0020] Among them, the reference numerals in the figure are:

[0021] 1. Temperature balancing base; 2. Temperature balancing board; 3. Heat dissipation assembly; 4. Temperature balancing cover; 5. Water cooling joint;

[0022] 11. Uniform temperature heat dissipation pipe; 12. Positioning column;

[0023] 31. The first group of heat sink fins; 32. The second group of heat sink fins; 33. The third group of heat sink fins; 34. The fourth group of heat sink fins; 35. Welding groove;

[0024] 41. Accommodating cavity; 42. Water inlet hole; 43. Water outlet hole; 44. Welding strip;

[0025] 51. Water inlet connector; 52. Water outlet connector;

[0026] 511, water inlet head; 512, water inlet pipe;

[0027] 521. Water outlet; 522. Water outlet pipe. DETAILED DESCRIPTION

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0029] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0032] In one embodiment of the present invention, Figures 1 to 4 As shown, a water cooling seat is provided, including a temperature balancing base 1, a temperature balancing plate 2, a heat dissipation component 3, a temperature balancing cover plate 4 and a water cooling joint 5. The temperature balancing plate 2 is fixedly connected to the top side of the temperature balancing base 1 and is arranged between the temperature balancing base 1 and the temperature balancing cover plate 4, the heat dissipation component 3 is arranged on the temperature balancing plate 2, the temperature balancing cover plate 4 is fixedly connected to the temperature balancing base 1, and the water cooling joint 5 is fixedly connected to the temperature balancing cover plate 4.

[0033] The heat dissipation assembly 3 includes multiple groups of heat dissipation fins, the number of heat dissipation fins in each group increases successively, and the spacing between the heat dissipation fins in each group decreases successively, and each adjacent group of heat dissipation fins is spaced apart, and each heat dissipation fin is spaced apart.

[0034] The water cooling seat provided in the present application, the heat dissipation component 3 includes a plurality of groups of heat dissipation fins, the number of heat dissipation fins in each group increases successively, adjacent groups of heat dissipation fins are separated, and each heat dissipation fin is separated. After water enters the water cooling joint 5, the water flows through each group of heat dissipation fins in turn. Since the number of heat dissipation fins in each group increases successively, and the spacing between the heat dissipation fins in each group of heat dissipation fins decreases successively, and the flow area becomes smaller, the water flow needs to pass through a narrower channel, thereby increasing the flow rate, and the flow rate of water from the water inlet to the water outlet remains basically unchanged, thereby improving the heat dissipation performance, avoiding temperature increase, and achieving better heat dissipation effect.

[0035] In another embodiment of the present invention, the water cooling seat is provided with five groups of heat sink fins, namely, the first group of heat sink fins 31, the second group of heat sink fins 32, the third group of heat sink fins 33 and the fourth group of heat sink fins 34. The number of heat sink fins of the first group of heat sink fins 31, the second group of heat sink fins 32, the third group of heat sink fins 33 and the fourth group of heat sink fins 34 increases in sequence and is fixedly connected to the temperature averaging plate 2 in sequence. Specifically, the first group of heat sink fins 31 and the fourth group of heat sink fins 34 are arranged in a straight or figure eight shape. The first group of heat sink fins 31, the second group of heat sink fins 32, the third group of heat sink fins 33 and the fourth group of heat sink fins 34 can be arranged horizontally or vertically on the temperature averaging plate 2, and the welding strips 44 and the welding grooves 35 can also be arranged horizontally or vertically accordingly. Specifically, a welding strip 44 is fixedly connected to the bottom side of the temperature-averaging cover plate 4, and two welding strips 44 are provided. Two welding grooves 35 are provided correspondingly for the first group of heat sink fins 31, the second group of heat sink fins 32, the third group of heat sink fins 33, and the fourth group of heat sink fins 34. The welding strip 44 is pressure-welded in the welding groove 35. By providing the welding strip 44 and the welding groove 35, it is convenient for the temperature-averaging plate 2 to be pressure-welded with the temperature-averaging cover plate 4. Specifically, the number of the first group of heat sink fins 31 is 10, the number of the second group of heat sink fins 32 is 12, the number of the third group of heat sink fins 33 is 14, and the number of the fourth group of heat sink fins 34 is 16. The spacing of the heat sink fins in the first group of heat sink fins 31 is 10 mm, the spacing of the heat sink fins in the second group of heat sink fins 32 is 8 mm, the spacing of the heat sink fins in the third group of heat sink fins 33 is 6 mm, and the spacing of the heat sink fins in the fourth group of heat sink fins 34 is 4 mm. As the number of cooling fins in each group increases successively and the spacing between cooling fins in each group decreases successively, the flow area becomes smaller and the water needs to pass through a narrower channel, thereby increasing the flow rate. The flow rate of water from the water inlet to the water outlet remains basically unchanged, thereby improving the heat dissipation performance.

[0036] In another embodiment of the present invention, a receiving cavity 41 is provided at the bottom of the temperature-averaging cover plate 4 of the water cooling seat, and the heat dissipation fins are arranged in the receiving cavity 41 . The temperature-averaging cover plate 4 matches the temperature-averaging base 1 and is fixedly connected to the temperature-averaging base 1 .

[0037] In another embodiment of the present invention, the water cooling joint 5 of the water cooling seat includes a water inlet joint 51 and a water outlet joint 52, the water inlet joint 51 includes a water inlet head 511 and a water inlet pipe 512, the water inlet head 511 is fixedly connected to the water inlet pipe 512, one end of the water inlet head 511 is fixedly passed through the temperature equalizing cover plate 4, and is arranged above the cooling fins.

[0038] In another embodiment of the present invention, the water outlet connector 52 of the water cooling seat includes a water outlet head 521 and a water outlet pipe 522, the water outlet head 521 is fixedly connected to the water outlet pipe 522, one end of the water outlet head 521 is fixedly passed through the temperature equalization cover plate 4, and is arranged above the heat dissipation fins. Water enters the water inlet head 511 from the water inlet pipe 512, then flows through multiple groups of heat dissipation fins in sequence, and is discharged through the water outlet head 521 and the water outlet pipe 522.

[0039] In another embodiment of the present invention, the water cooling seat is provided with a water inlet hole 42 and a water outlet hole 43 on the temperature-averaging cover plate 4, a water inlet joint 51 is fixedly connected to the temperature-averaging cover plate 4 and communicated with the water inlet hole 42, and a water outlet joint 52 is fixedly connected to the temperature-averaging cover plate 4 and communicated with the water outlet hole 43. Water passes through the water inlet joint 51 and the water inlet hole 42, and sequentially flows through the plurality of heat dissipation fins, and is discharged through the water outlet hole 43 and the water outlet joint 52.

[0040] In another embodiment of the present invention, a temperature balancing heat dissipation pipe 11 is provided in the temperature balancing base 1 of the water cooling seat, and a plurality of temperature balancing heat dissipation pipes 11 are provided and are evenly fixedly connected to the temperature balancing base 1. After the temperature balancing base 1 is evacuated, the heat on the chip is quickly transferred to the temperature balancing heat dissipation pipe 11 for heat dissipation through the siphon effect.

[0041] In another embodiment of the present invention, a positioning column 12 is provided on the side of the temperature-averaging base 1 of the water cooling seat, and a plurality of positioning columns 12 are provided and evenly fixedly connected to the temperature-averaging base 1. The temperature-averaging base 1 is fixedly connected to the temperature-averaging cover plate 4 through the positioning columns 12.

[0042] The water cooling seat provided in the present application has the following working process: water flows in from the water inlet joint 51 and flows through multiple groups of cooling fins in sequence. Since the number of cooling fins in each group increases successively, and the spacing between the cooling fins in each group decreases successively, and the flow area becomes smaller, the water flow needs to pass through a narrower channel, thereby increasing the flow rate, taking away the heat on the chip and improving the heat dissipation performance. Then the water flows out through the water outlet joint 52, discharging the water that has heated up after absorbing heat to avoid temperature increase.

[0043] The water cooling seat provided in the present application, the heat dissipation component 3 includes multiple groups of heat dissipation fins, the number of heat dissipation fins in each group increases successively, and the spacing between the heat dissipation fins in each group of heat dissipation fins decreases successively, adjacent groups of heat dissipation fins are separated, and each heat dissipation fin is separated. After water enters the water cooling joint 5, the water flows through each group of heat dissipation fins in turn. Since the number of heat dissipation fins in each group increases successively and the flow area becomes smaller, the water flow needs to pass through a narrower channel, thereby increasing the flow rate. The flow rate of water from the water inlet to the water outlet remains basically unchanged, thereby improving the heat dissipation performance, avoiding temperature increase, and achieving better heat dissipation effect.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A water cooling seat, characterized in that: It includes a temperature balancing base, a temperature balancing plate, a heat dissipation component, a temperature balancing cover plate and a water cooling joint, wherein the temperature balancing plate is connected to the top side of the temperature balancing base and is arranged between the temperature balancing base and the temperature balancing cover plate, the heat dissipation component is arranged on the temperature balancing plate, the temperature balancing cover plate is connected to the temperature balancing base, and the water cooling joint is connected to the temperature balancing cover plate; The heat dissipation assembly includes a plurality of groups of heat dissipation fins, the number of heat dissipation fins in each group increases successively, and the spacing between heat dissipation fins in each group decreases successively, adjacent heat dissipation fins in each group are spaced apart, and each heat dissipation fin is spaced apart.

2. A water cooling seat according to claim 1, characterized in that: The cooling fins are provided with five groups, namely a first group of cooling fins, a second group of cooling fins, a third group of cooling fins and a fourth group of cooling fins. The number of cooling fins in the first group of cooling fins, the second group of cooling fins, the third group of cooling fins and the fourth group of cooling fins increases successively, and the spacing between the cooling fins in each group of cooling fins decreases successively. The first group of cooling fins, the second group of cooling fins, the third group of cooling fins and the fourth group of cooling fins are fixedly connected to the temperature equalizing plate in sequence.

3. The water cooling seat according to claim 1, characterized in that: The bottom of the temperature-averaging cover plate is provided with an accommodating cavity, the heat dissipation fins are arranged in the accommodating cavity, and the temperature-averaging cover plate matches the temperature-averaging base and is fixedly connected to the temperature-averaging base.

4. The water cooling seat according to claim 1, characterized in that: The water cooling joint includes a water inlet joint and a water outlet joint. The water inlet joint includes a water inlet head and a water inlet pipe. The water inlet head is fixedly connected to the water inlet pipe. One end of the water inlet head is fixedly passed through the temperature equalizing cover plate and is arranged above the heat dissipation fins.

5. The water cooling seat according to claim 4, characterized in that: The water outlet joint comprises a water outlet head and a water outlet pipe, wherein the water outlet head is fixedly connected to the water outlet pipe, and one end of the water outlet head is fixedly passed through the temperature-averaging cover plate and is arranged above the heat dissipation fins.

6. The water cooling seat according to claim 4, characterized in that: The temperature-average cover plate is provided with a water inlet hole and a water outlet hole. The water inlet joint is fixedly connected to the temperature-average cover plate and communicated with the water inlet hole. The water outlet joint is fixedly connected to the temperature-average cover plate and communicated with the water outlet hole.

7. The water cooling seat according to claim 1, characterized in that: The temperature-averaging base is provided with a temperature-averaging heat dissipation pipe, and a plurality of the temperature-averaging heat dissipation pipes are provided and are evenly and fixedly connected to the temperature-averaging base.

8. The water cooling seat according to claim 1, characterized in that: A positioning column is provided on the side of the temperature-averaging base, and a plurality of the positioning columns are provided and are evenly fixedly connected to the temperature-averaging base.