Semiconductor packaging testing device

Abstract

The present invention relates to a semiconductor package testing apparatus, and provides a semiconductor package testing apparatus in which a pick-up placement region of a lower package is expanded to the overall size of the lower package by using a floating plate, the floating plate being movably coupled to a pusher, and a silica gel pad being disposed between the floating plate and the pusher. Therefore, the floating plate can move through the elasticity of the silica gel pad.

Description

Technical Field

[0001] The present invention relates to a semiconductor package testing device, and more particularly, to a semiconductor package testing device for detecting whether a package-on-package (POP) semiconductor package formed by stacking a lower package and an upper package up and down works normally. Background Art

[0002] Generally, semiconductor packages are made of microscopic electronic circuits integrated at a high density. During the manufacturing process, a test process is performed to determine whether each electronic circuit is normal. The test process is a process of screening out qualified and defective products by testing whether the semiconductor package is working properly.

[0003] When testing a semiconductor package, a test device is used to electrically connect the terminals of the semiconductor package and a tester for applying a test signal. The test device has various structures depending on the type of semiconductor package to be tested.

[0004] Recently, as the use of semiconductor packages in a package-on-package (POP) form that can minimize part size and quickly achieve signal transmission has increased, the demand for test equipment for testing such semiconductor packages has also gradually increased.

[0005] The package stacking method is a method in which packages with other functions are stacked one on top of another (stacked form).

[0006] The package stacking method can minimize the length of the connection wiring, thereby minimizing the losses such as signal delay and impedance mismatch generated in the two-dimensional arrangement, and spatially utilizes the vertical direction to maximize the mounting area per unit area, which has the advantage of being able to realize large-capacity and ultra-small parts.

[0007] Figure 1 1 is a diagram showing a conventional test apparatus for testing a package stacked type semiconductor package. Figure 2 It is a diagram showing the operation of a conventional test device.

[0008] like Figure 1 as well as Figure 2As shown, the existing test device 1 for testing the package stacked semiconductor package is composed of a pusher 50, an upper package 40, an upper socket 70, a vacuum pickup 80, a lower socket 60 and a lower package 10, wherein the pusher 50 is configured to receive power from a driving part (DP) 90 to be able to move up and down, and has a vacuum hole 51, the upper package 40 is arranged in a chamber 52 of the pusher 50, the upper socket 70 is combined with the lower part of the upper package 40 and has a socket hole 72 formed in the center, the vacuum pickup 80 is made of an elastic material of silicone or rubber series, and is connected to the bottom of the upper socket 70 to surround the socket hole 72, the lower socket 60 is installed on the tester 30, and the lower package 10 is arranged between the upper socket 70 and the lower socket 60. The upper socket 70 is combined with a support frame 73, and the support frame 73 is combined with the pusher 50 in a vacuum-tight manner, so that the upper socket 70 is installed on the pusher 50.

[0009] The portion including the pusher 50 , the upper package 40 , the upper socket 70 and the vacuum pickup 80 is referred to as an upper socket assembly TSA.

[0010] The upper package 40 has a terminal 41 at the bottom and is composed of a so-called golden device, which is composed of a package that has been pre-screened as a qualified product, so that it can be used to detect whether the lower package 10 is working normally. The lower package 10 can be a device to be tested with a lower terminal 11 and an upper terminal 12.

[0011] The upper socket 70 and the lower socket 60 respectively include a second conductive portion 71 and a first conductive portion 61 in a form in which a plurality of conductive particles are arranged in a thickness direction within an elastic insulating material.

[0012] In the existing test device 1 for testing the stacked semiconductor package, the pusher 50 descends, and the vacuum pickup 80 uses the vacuum pressure generated by the vacuum generating device VG to absorb (Pick) the lower package 10 that is the test object. In this state, after the lower package 10 is placed on the upper part of the lower socket 60, the upper socket 70 pressurizes (Pushing) the lower package 10 through the pusher 50, so that the second conductive part 71 of the upper socket 70 and the upper terminal 12 of the lower package 10 are connected, so that the tester 30, the lower socket 60, the lower package 10, the upper socket 70 and the upper package 40 are electrically connected, thereby performing electrical testing. Figure 1 , 2 In the figure, reference numeral 65 is a guide housing, and the guide housing 65 performs a guiding function so that the lower package 10 adsorbed by the pusher 50 is arranged in position on the lower socket 60.

[0013] However, the existing testing device for testing the package stacked type semiconductor package is Figure 2 As shown in (b), the vacuum pickup 80 contacts the central portion of the lower package 10 to perform a pick & place operation, and thus the adsorption area aa of the lower package adsorbed by the vacuum pressure is approximately 3% of the overall area of ​​the lower package. Since it is very narrow, the picking cannot be completed smoothly, and when contact is made with the lower package and the vacuum pressure is released, the desorption area ea of ​​the lower package pushed away for desorption is only approximately 4% of the overall area of ​​the lower package, resulting in a problem that the placement cannot be completed smoothly.

[0014] In addition, in order to protect the semiconductor package and improve the vacuum adsorption performance, the vacuum pickup 80 is made of silicone. However, due to the heat generated during the test, silicone oil is dissolved from the silicone, resulting in the so-called sticky phenomenon in which the lower package sticks to the vacuum pickup. In addition, there is also a situation where static electricity is generated between the upper socket and the lower package due to repeated friction and contact between the upper socket and the lower package, causing the sticky phenomenon. Due to this sticky phenomenon, pick-up and placement errors occur, which has the problem of reducing the detection yield and increasing the shutdown time of the equipment.

[0015] In addition, in the existing test device for testing the package stacked semiconductor package, the vacuum pickup 80 is integrally connected to the upper socket 70. Therefore, even if a defect occurs in either the upper socket 70 or the vacuum pickup 80, the upper socket and the vacuum pickup must be replaced, which increases the replacement cost.

[0016] [Prior art literature]

[0017] [Patent Literature]

[0018] (Patent Document 1) Korean Patent Publication No. 2015-0106848 (published on September 22, 2015) Summary of the invention

[0019] Technical issues to be solved

[0020] The present invention is proposed to solve the above-mentioned problem. The purpose of the present invention is to provide a semiconductor packaging testing device. In a package stacking type semiconductor testing device, the pick-up and placement area is enlarged to the overall size of the lower package, while the lower package can be stably picked up and placed without sticking.

[0021] Solution to the problem

[0022] In order to achieve the above object, a semiconductor package testing device of the present invention may include: a lower socket, which is installed on a tester that provides a test signal and has a first conductive part, wherein the first conductive part is respectively connected to the lower terminal of the lower package, thereby electrically connecting the lower package to the tester; a pusher, which is composed of a main body in the shape of a quadrangular prism, a protrusion protruding from the center of the main body, a mounting groove provided between the upper side of the protrusion and the main body, and a vacuum channel for transmitting the vacuum pressure of a vacuum generating device, wherein the pusher receives power from the driving part and can move so as to be able to approach or move away from the lower package. A packaging side; an upper socket, connected to the bottom of the protrusion with the upper packaging interposed therebetween, and having a second conductive portion, the upper end of the second conductive portion being able to be connected to the lower terminal of the upper packaging and the lower end being connected to the upper terminal of the lower packaging; a silicone pad, in an annular shape, disposed in the mounting groove; and a floating plate, movably coupled to the pusher, capable of elastically moving through the silicone pad, wherein the floating plate is constructed to include a side wall portion surrounding the protrusion and a contact portion having an open groove exposing the bottom of the upper socket, and the vacuum pressure of the vacuum generating device is applied to the open groove through the vacuum channel.

[0023] The vacuum passage may be composed of a vacuum hole penetrating through the center of the protrusion in the vertical direction and at least one vacuum groove crossing the bottom surface of the protrusion to be connected to the vacuum hole.

[0024] Alternatively, the floating plate is coupled to the pusher in a vacuum-tight manner via the silicone pad.

[0025] The floating plate may have an expansion portion on an upper side of the side wall portion so that the floating plate can move up and down along the mounting groove.

[0026] It may be that the bottom of the floating plate is located below the bottom of the upper socket, and when the silicone pad is compressed, the bottom of the floating plate is located at the same height as the bottom of the upper socket.

[0027] It may be that the mounting groove further has a pad mounting groove to accommodate a portion of the thickness of the silicone pad.

[0028] The floating plate may be made of a metal material, and the bottom surface of the contact portion may be anodized or DLC (diamond-like carbon) coated.

[0029] The floating plate may be made of a metal material, and an antistatic film made of any one of polyimide, FR4 or engineering plastics may be attached to the bottom of the contact portion.

[0030] The upper socket may include the second conductive portion formed on an insulating pad made of a non-elastic insulating material.

[0031] The non-elastic insulating material may be any one of polyimide, FR4 or engineering plastics.

[0032] Effects of the Invention

[0033] According to the semiconductor package testing device of the present invention, the adsorption area and desorption area are expanded to be equivalent to the overall area of ​​the lower package for picking and placing operations, thereby reducing the picking errors generated when adsorbing the lower package and smoothly completing the desorption of the lower package, so that the lower package can be picked up and placed more stably.

[0034] In addition, according to the semiconductor packaging testing device of the present invention, a simple vacuum route can be established in which the vacuum pressure supplied from the vacuum generating device is applied to the wide open groove of the floating plate through the vacuum channel of the pusher and the space between the pusher and the floating plate, thereby being able to stably transmit the vacuum pressure to the lower package without loss.

[0035] In addition, according to the semiconductor packaging testing device of the present invention, the floating plate contacts the lower package as the silicone pad made of elastic material contracts, so the silicone pad absorbs the impact applied to the lower package when the floating plate and the lower package contact, so that the floating plate and the lower package can be softly connected, thereby preventing the lower package from being damaged.

[0036] In addition, according to the semiconductor package testing device of the present invention, the silicone pad is arranged between the pusher and the floating plate without being exposed to the outside and without contacting the lower package, so the problem of stickiness caused by the dissolution of silicone oil can be fundamentally prevented.

[0037] In addition, according to the semiconductor package testing device of the present invention, by performing antistatic treatment on the bottom of the floating plate in contact with the lower package or sticking an antistatic film, static electricity that may occur during repeated contact with the lower package is suppressed, thereby preventing stickiness caused by static electricity.

[0038] In addition, according to the semiconductor packaging test device of the present invention, the silicone pad and the floating plate replace the function of the existing vacuum pickup, and an upper socket is provided independently of the silicone pad and the floating plate. Therefore, once the silicone pad or the upper socket fails, it is only necessary to replace the defective silicone pad or the upper socket, thereby saving replacement costs.

[0039] In addition, according to the semiconductor package testing device of the present invention, even if there is a terminal in the center of the lower package, detection can be performed without restriction, and adsorption is performed using the open groove of the floating plate, so there is an advantage that even if there is a terminal in the center of the lower package, it can be easily picked up without difficulty. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 FIG. 1 is a diagram showing a conventional test apparatus for testing a package stacked type semiconductor package.

[0041] Figure 2 It is a diagram showing the operation of a conventional test device.

[0042] Figure 3 FIG. 4 is a cross-sectional view showing an upper socket assembly TSA of a test device according to an embodiment of the present invention.

[0043] Figure 4 FIG. 1 is an exploded perspective view showing an upper socket assembly of a test device according to an embodiment of the present invention.

[0044] Figure 5 is a diagram showing a test device according to an embodiment of the present invention.

[0045] Figure 6 FIG. 1 is a diagram showing a state in which an upper socket assembly absorbs a lower package for testing according to an embodiment of the present invention.

[0046] Figure 7 is a diagram illustrating the operation of a test apparatus according to an embodiment of the present invention.

[0047] Figure 8 FIG. 1 is a diagram schematically showing the transmission of vacuum pressure in an upper socket assembly according to an embodiment of the present invention.

[0048] Description of reference numerals:

[0049] 10: lower package, 11: lower terminal of lower package, 12: upper terminal of lower package, 30: tester, 40: upper package, 41: lower terminal of upper package, 60: lower socket, 61: first conductive part, 62: insulating part, 100: testing device, 110: pusher, 111: main body, 112: protrusion, 113: mounting groove, 114: vacuum hole, 115: vacuum groove, 11 6: vacuum channel, 117: support protrusion, 118: placement groove, 119: connecting screw, 120: silicone pad, 121: pad installation groove, 130: floating plate, 131: side wall part, 132: expansion part, 133: contact part, 134: open groove, 135: bottom of contact part, 140: antistatic film, 170: upper socket, 171: second conductive part, 172: insulation pad, 173: support frame DETAILED DESCRIPTION

[0050] Hereinafter, a testing device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0051] In the present invention, the upper socket is located on the upper side of the test device, and the tester is located on the lower side, so the "upper side", "upper end", "lower side", "lower end", etc. of a certain component are described based on this. In addition, the same symbols are used for the same components, and the description is omitted.

[0052] Figure 3 is a cross-sectional view showing an upper socket assembly TSA of a test device according to an embodiment of the present invention, Figure 4 is an exploded perspective view showing an upper socket assembly of a test device according to an embodiment of the present invention, Figure 5 is a diagram showing a test device according to an embodiment of the present invention, Figure 6 1 is a diagram showing a state in which an upper socket assembly absorbs a lower package for testing according to an embodiment of the present invention, Figure 7 is a diagram showing the operation of a test device according to an embodiment of the present invention, Figure 8 FIG. 1 is a diagram schematically showing the transmission of vacuum pressure in an upper socket assembly according to an embodiment of the present invention.

[0053] As shown in the above figure, a test device 100 according to an embodiment of the present invention is a device for testing a package stack type (POP) semiconductor package by using an upper package 40 that has been pre-screened as a qualified product to detect the lower package 10 or to detect the upper package and the lower package at the same time. The device can connect a tester 30 that generates a test signal and a package stack type (POP) semiconductor package through electricity.

[0054] The test device 100 according to an embodiment of the present invention is characterized in that it includes: a lower socket 60, which is installed on a tester 30 that provides a test signal and has a first conductive portion 61, and the first conductive portion 61 is respectively connected to the lower terminal 11 of the lower package 10, so as to electrically connect the lower package 10 with the tester 30; a pusher 110, which is composed of a main body 111 in the shape of a quadrangular prism, a protrusion 112 protruding from the center of the main body, a mounting groove 113 provided between the upper side of the protrusion and the main body, and a vacuum channel 116 for transmitting the vacuum pressure of the vacuum generating device VG, wherein the pusher 110 receives power from the driving portion and can move so as to be able to approach or move away from the lower package 10 side; an upper socket 170, which is connected to the lower side of the protrusion 112 with the upper package 40 interposed therebetween, and has a second conductive portion 171, the upper end of the second conductive portion 171 can be connected to the lower terminal 41 of the upper package and the lower end is connected to the upper terminal 12 of the lower package; a silicone pad 120, which is annular and arranged in the mounting groove 113 of the pusher; and a floating plate 130, which is movably combined with the pusher and can swim through the elasticity of the silicone pad, the floating plate is constructed to include a side wall portion 131 surrounding the protrusion and a contact portion 133 having an open groove 134 that exposes the lower side of the upper socket, and the vacuum pressure of the vacuum generating device is applied to the open groove through the vacuum channel of the pusher.

[0055] In the present invention, the upper socket assembly TSA is configured to include: a pusher 110 ; an upper package 40 mounted on the pusher 110 ; an upper socket 70 coupled to the lower portion of the upper package 40 ; a silicone pad 120 ; and a floating plate 130 .

[0056] Specifically looking at the components of the test device 100 according to an embodiment of the present invention, first, the lower socket 60 is installed above the tester 30 , thereby electrically connecting the tester 30 and the lower package 10 .

[0057] The lower socket 60 may be configured to include a first conductive portion 61 and an insulating portion 62. The first conductive portion 61 may be formed by a plurality of conductive particles arranged neatly in the thickness direction in an elastic insulating material. The plurality of first conductive portions 61 are spaced apart and arranged inside the insulating portion 62 to correspond to the lower terminals 11 of the lower package 10 to be connected.

[0058] One end of the first conductive portion 61 contacts a signal electrode (not shown) of the tester 30, and the other end of the first conductive portion 61 is connected to the lower terminal 11 of the lower package 10. The first conductive portion 61 may be configured to protrude below the insulating portion 62. The first conductive portion 61 protruding below the insulating portion is pressed against the signal electrode of the tester 30 when testing the device, thereby achieving more stable contact.

[0059] As the elastic insulating material constituting the first conductive part 61, a heat-resistant polymer material having a cross-linked structure, such as silicone rubber, can be used, and as the conductive particles constituting the first conductive part 61, a material having magnetism that can react by a magnetic field can be used. For example, as the conductive particles, magnetic metal particles such as iron, nickel, and cobalt, or alloy particles thereof, or particles containing these metals, or particles of these metals can be used as core particles and the surfaces of these core particles can be coated with particles of metals having excellent conductivity such as gold, silver, palladium, and radium.

[0060] The insulating portion 62 is used to insulate the first conductive portions 61, constitutes the appearance of the lower socket 60, and plays a supporting role when the first conductive portion 61 is subjected to contact gravity. The insulating portion 62 can be formed of the same elastic material as the first conductive portion 61. Of course, the material of the insulating portion 62 can be composed of a non-elastic insulating material or various insulating materials that can insulate the first conductive portions 61 in addition to the elastic insulating material.

[0061] The lower socket 60 may also be a spring socket using pogo pins as the conductive portion instead of a rubber socket in which the first conductive portion is a form in which conductive particles are contained in an elastic insulating material.

[0062] The pusher 110 is configured to load the upper package 40 and the upper socket 170, and after sucking the lower package 10 so that the lower package is located above the lower socket 60, receive power from the driving part (DP) 90, so that it can move toward or away from the lower socket side.

[0063] like Figure 3 as well as Figure 4 As shown, the pusher 110 is composed of: a main body 111 in a quadrangular prism shape; a protrusion 112 protruding from the center of the main body; a mounting groove 113 provided between the upper side of the protrusion and the main body; and a vacuum channel 116 for transmitting the vacuum pressure of the vacuum generating device.

[0064] The vacuum channel 116 is composed of a vacuum hole 114 formed by penetrating the center of the protrusion 112 in the vertical direction and at least one vacuum groove 115 that crosses the bottom of the protrusion. The vacuum hole 114 is connected to the vacuum generating device, and the vacuum groove 115 is connected to the vacuum hole 114. As shown in the figure, it is preferred that the vacuum groove 115 is formed into a cross shape by two vacuum grooves to fully transmit the vacuum pressure passing through the vacuum hole 114. Of course, more than three vacuum grooves 115 can also be formed.

[0065] The upper package 40 may be disposed in the placement groove 118 formed by the support protrusion 117 below the protrusion 112 of the pusher, and the support frame 173 of the upper socket 170 may be fixedly coupled to the support protrusion 117 of the protrusion 112 with the upper package 40 interposed therebetween. Even if the upper package 40 is closely disposed below the protrusion 112, the vacuum pressure is transmitted to the outer side of the upper package or the upper socket through the vacuum groove 115, so that the formation of the vacuum channel is not hindered.

[0066] The pusher 110 is moved by the driving unit 90 when the upper socket 170 and the upper package 40 are combined, so that the upper socket 170 can be connected to the lower package 10 placed above the lower socket 60, or the upper socket 170 can be separated from the lower package 10. In addition, the pusher 110 approaches or moves away from the lower socket 60 side, so that the lower package 10 can be loaded onto the lower socket 60 or unloaded from the lower socket 60.

[0067] The upper socket 170 is connected to the lower part of the pusher 110 and is electrically connected to the upper package 40 disposed in the placement groove 118 of the protruding part of the pusher. The upper package 40 can use a so-called golden device, which is composed of a package that has been pre-screened as a qualified product, so that it can be used to detect whether the lower package 10 is working properly.

[0068] like Figure 3 As shown, the upper socket 170 is configured to include: an insulating pad 172 ; a support frame 173 combined with the insulating pad; and a plurality of second conductive parts 171 supported by the insulating pad 172 .

[0069] The insulating pad 172 can be made of an elastic insulating material or a non-elastic insulating material. The insulating pad 172 of the non-elastic insulating material is more preferred because it is beneficial to pressurize the lower package 10 toward the lower socket 60 when the upper socket 170 is connected to the lower package 10. When the insulating pad 172 stably pressurizes the lower package 10, the lower terminal 11 of the lower package 10 can be stably connected to the first conductive portion 61 of the lower socket 60.

[0070] Preferably, the insulating pad 172 of the non-elastic insulating material is not as easy to deform elastically as the elastic insulating part of the existing rubber socket, but has the characteristic of being bendable and deformable. This characteristic has high resistance to the detected equipment with various forms of warpage deformation, which is conducive to increasing durability and life. The insulating pad 172 can be made of polyimide (PI), FR4, engineering plastics or various other non-elastic insulating materials.

[0071] The second conductive portion 171 is formed to penetrate the insulating pad 172 in the thickness direction and is supported by the insulating pad 172. One end of the second conductive portion 171 can contact the lower terminal 41 of the upper package 40, and the other end can be connected to the upper terminal 12 of the lower package 10.

[0072] The second conductive portion 171 may also be configured to protrude from the lower surface of the insulating pad 172, or to protrude from the upper surface of the insulating pad 172. The second conductive portion 171 protruding from the lower surface of the insulating pad 172 also stably contacts the upper terminal 12 of the lower package that can be formed by extending into the upper surface of the lower package 10. In addition, when the upper socket 170 approaches the lower socket 60 side, it is crimped onto the upper terminal 12 of the lower package 10, thereby being able to stably contact the upper terminal 12. The second conductive portion 171 protruding from the upper surface of the insulating pad 172 can be combined with the lower terminal 41 of the upper package in a crimped state, thereby being able to be in more stable contact.

[0073] The second conductive part 171 may be formed by a plurality of conductive particles contained in an elastic insulating material. The elastic insulating material and conductive particles constituting the second conductive part 171 may be the same as those constituting the first conductive part 61 or conductive particles.

[0074] The upper socket 170 may be a support frame 173 that is screwed to a support protrusion 117 provided on the protrusion 112 of the pusher or may be bonded and installed by an adhesive.

[0075] An annular silicone pad 120 is disposed in the mounting groove 113 of the pusher 110. The silicone pad 120 is elastic, so that it can be compressed or expanded from a compressed state to an original state. A pad mounting groove 121 for configuring the silicone pad 120 is further provided on the upper side of the mounting groove 113 adjacent to the protrusion 112, so that the silicone pad can be placed more firmly through the pad mounting groove 121. The pad mounting groove has a depth that accommodates a portion of the thickness of the silicone pad, and a portion equivalent to the thickness that needs to be compressed during the test has a depth exposed to the mounting groove 113. Therefore, the degree of compression of the silicone pad can be adjusted by adjusting the depth of the pad mounting groove.

[0076] The floating plate 130 is configured to be movable through the elasticity of the silicone pad 120, thereby receiving vacuum pressure from the vacuum generator VG and the vacuum channel 116, and adsorbing or desorbing the lower package 10. The floating plate 130 replaces the vacuum pickup of the prior art.

[0077] The floating plate 130 is combined to be movable relative to the pusher 110, and a silicone pad 120 is arranged between the pusher 110 and the floating plate 130, so that the floating plate can move upward when the silicone pad is compressed, and move downward when the silicone pad expands in the compressed state.

[0078] As the adhesive used for bonding between the support frame 173 of the upper socket and the support protrusion 117 provided on the protrusion 112 of the pusher, various adhesives such as double-sided tape and liquid instant adhesive can be used. The adhesive strength of the adhesive is preferably sufficient to withstand the vacuum pressure even when the vacuum pressure is transmitted to the vacuum pickup. It is usually preferred to use an adhesive with an adhesive strength in the range of 300-2000gf / in.

[0079] like Figure 3 as well as Figure 4 As shown, the floating plate 130 is configured to include: a side wall portion 131 in the form of surrounding the protruding portion 112 of the pusher and the side surface of the upper socket 170; and a contact portion 133 having an open groove 134 for exposing the lower surface of the upper socket 170. A silicone pad 120 is disposed on one side of the upper surface of the floating plate 130, that is, a portion adjacent to the protruding portion of the pusher, and a coupling screw 119 penetrating through the pusher and coupled to the floating plate is disposed on the other side of the upper surface of the floating plate 130 so as to be movably coupled to the pusher 110. Therefore, the silicone pad 120 is fixedly disposed between the pusher 110 and the floating plate 130 by the coupling of the pusher 110 and the floating plate 130, and the floating plate 130 can be movably coupled to the pusher 110 while being vacuum-sealed by the silicone pad.

[0080] The upper side of the side wall of the floating plate has an expansion portion 132. The expansion portion 132 is formed to be the same as or slightly smaller than the diameter of the installation groove 113 of the pusher, so as to move the floating plate 130 in the up-down direction along the installation groove 113, so that the floating plate can stably move up and down without shaking left and right.

[0081] In order to absorb the lower package 10, the upper socket assembly is moved so that the contact portion 133 of the floating plate contacts the upper surface of the lower package, and a vacuum pressure is applied by the vacuum generating device VG. Figure 8 As shown in (a), the vacuum pressure is transmitted to the vacuum groove 115 through the vacuum hole 114, and the vacuum pressure through the vacuum groove 115 is applied to the open groove 134 of the floating plate through the space between the upper package, the side of the upper socket and the side wall portion 131 of the floating plate 130. The vacuum pressure applied to the open groove 134 of the floating plate acts on the lower package, so that the upper socket assembly can absorb the lower package.

[0082] When the upper socket assembly is provided with vacuum pressure and the upper socket assembly absorbs the lower package, the silicone pad 120 is set to be slightly compressed to prevent vacuum pressure loss, but the whole is in an expanded state, so the bottom of the floating plate, that is, the bottom 135 of the contact part is located below the bottom of the upper socket 170. For electrical testing, when the pusher 110 presses the lower package toward the lower socket 60 side while the lower package is absorbed, the silicone pad 120 is compressed, and the floating plate 130 moves upward to the connection position where the upper terminal of the lower package and the second conductive part of the upper socket are connected. Assuming that the second conductive part is in a form that does not protrude to the lower side of the insulating pad, the bottom 135 of the floating plate rises to the same position as the bottom of the upper socket 170. When the second conductive part becomes a form that protrudes a part to the lower side of the insulating pad, the second conductive part rises slightly less to reach a position where it is stably pressed on the upper terminal of the lower package.

[0083] The floating plate 130 may be made of a metal material such as aluminum. The contact portion 133 of the floating plate 130 generates static electricity between the contact portion of the floating plate and the lower package through repeated friction and contact with the lower package 10, which may cause the lower package to stick to the floating plate, so measures need to be taken.

[0084] In the present invention, the lower surface 135 of the contact portion 133 of the floating plate in contact with the lower package is subjected to antistatic treatment such as anodizing or DLC (diamond-like carbon) coating to prevent sticking.

[0085] In addition to the surface treatment method, an antistatic film 140 made of any one of polyimide, RF4 or functional plastic may be attached below the contact portion of the floating plate. Figure 4 2 shows, as an example, a case where the antistatic film 140 is disposed below the contact portion of the floating plate.

[0086] As described above, the impedance of the bottom surface of the floating plate or the surface of the antistatic film in contact with the lower package is set to 10 5 -10 12 ohm range, thereby alleviating the stickiness problem of the lower package caused by static electricity.

[0087] The operation of the semiconductor package testing device 100 according to an embodiment of the present invention is described below.

[0088] like Figures 5 to 7 As shown, the pusher 110 is moved by the driving portion (DP) 90 , and the floating plate 130 can absorb the lower package 10 .

[0089] The suction of the lower package 10 by the floating plate 130 is completed through the vacuum line formed by the vacuum pressure generated by the vacuum generating device VG. When the vacuum pressure of the vacuum generating device is transmitted to the vacuum groove 115 through the vacuum hole 114 in a state where the contact portion of the floating plate 130 is in contact with the lower package 10, and the vacuum pressure of the vacuum generating device is applied to the open groove 134 of the floating plate through the space between the upper package, the side surface of the upper socket and the side wall portion 131 of the floating plate 130, the floating plate 130 suctions the lower package 10 by the vacuum pressure.

[0090] Next, the floating plate 130 can carry the absorbed lower package 10 to the upper part of the lower socket 60. That is, the pusher 110 approaches the upper part of the lower package 10 located at the standby position, and after the floating plate 130 absorbs the lower package 10, the pusher 110 moves to the upper part of the lower socket 60, so that the lower package 10 can be located above the lower socket 60. At this time, the lower terminal 11 of the lower package 10 is configured to contact the first conductive portion 61 of the lower socket 60.

[0091] Then, when the pusher 110 presses the lower package 10 toward the lower socket 60, the lower terminal 11 of the lower package 10 is connected to the first conductive portion 61 of the lower socket 60, and while the silicone pad 120 is compressed, the second conductive portion 171 of the upper socket 170 is connected to the upper terminal 12 of the lower package 10. At this time, the pressing force of the pusher 110 is transmitted to the lower package 10 through the upper socket 170, so that the tester 30, the lower socket 60, the lower package 10, the upper socket 170 and the upper package 40 are electrically connected.

[0092] At this time, the test signal generated by the tester 30 is transmitted to the upper package 40 through the lower socket 60 , the lower package 10 , and the upper socket 170 , thereby completing the electrical test of the upper package 40 and the lower package 10 .

[0093] Moreover, when the upper package 40 is composed of a gold device, it is not only helpful to detect whether the lower package 10 is working properly, but also helpful to detect whether it is accurately matched with the upper package when stacked in a package stacking type. In addition, when the upper package 40 is composed of a gold device, it has the advantage of being able to immediately confirm that the lower package 10 is a defective product if a defect occurs during testing. Of course, the upper package 40 can also be used as a detection object without being composed of a gold device, so that the upper package 40 and the lower package 10 can be detected at the same time.

[0094] After the test is completed, the pusher 110 rises, and the lower package 10 adsorbed on the floating plate combined with the pusher is unloaded from the lower socket 60 and transferred to the loading device (not shown) as the pusher moves. When the vacuum pressure of the vacuum generating device is released, the compressed silicone pad 120 expands and the contact part 133 of the floating plate pushes the lower package 10 downward, thereby desorbing the lower package 10 so that the lower package can be placed on the loading device.

[0095] As described above, according to the semiconductor package testing device 100 of the present invention, the contact portion 133 of the floating plate contacts the peripheral area of ​​the lower package, and the open groove 134 of the floating plate is located in the inner whole area of ​​the lower package excluding the peripheral area, so that the lower package is vacuum adsorbed, and thus the area for picking up and placing the lower package is expanded to the adsorption area AA and the desorption area EA reaching the whole area of ​​the lower package, so that the pick-up and placement operation is performed. Figure 8 (b) shows an adsorption region and a desorption region which are smaller than the entire area of ​​the lower package as an example to illustrate the lower package 10. Figure 7 As shown, the contact portion of the floating plate may be formed to contact the entire periphery of the lower package, thereby having an adsorption region and a desorption region equivalent to the entire area of ​​the lower package.

[0096] Therefore, compared with the case where the existing vacuum pickup contacts the central part of the lower package and has a narrow adsorption area aa and desorption area ea, the area of ​​the adsorption area AA of the test device according to the present invention is increased by more than 15 times compared with the prior art, and the area of ​​the desorption area EA is increased by more than 7 times, thereby reducing the picking errors generated when adsorbing the lower package and smoothly completing the desorption of the lower package, so that the lower package can be picked up and placed more stably.

[0097] In addition, according to the semiconductor packaging testing device 100 of the present invention, a simple vacuum route can be established in which the vacuum pressure supplied from the vacuum generating device is applied to the wide open groove of the floating plate through the vacuum channel of the pusher and the space between the pusher and the floating plate, thereby being able to stably transmit the vacuum pressure to the lower package without loss.

[0098] In addition, according to the semiconductor packaging testing device 100 of the present invention, the floating plate contacts the lower package as the silicone pad made of elastic material contracts, so the silicone pad absorbs the impact applied to the lower package when the floating plate and the lower package contact, so that the floating plate and the lower package can be softly connected, thereby preventing the lower package from being damaged.

[0099] In addition, according to the semiconductor packaging test device 100 of the present invention, the vacuum pickup made of elastic material such as silicone or rubber series was previously in direct contact with the lower package. Therefore, silicone oil dissolved from the vacuum pickup may accumulate on the lower package and the lower package may stick to the vacuum pickup, causing a sticky phenomenon. However, according to the test device of the present invention, the silicone pad is arranged between the pusher and the floating plate without being exposed to the outside and without contacting the lower package. Therefore, the problem of stickiness caused by the dissolution of silicone oil can be fundamentally prevented.

[0100] In addition, according to the semiconductor packaging testing device 100 of the present invention, by performing antistatic treatment on the bottom of the floating plate in contact with the lower package or sticking an antistatic film, static electricity that may occur during repeated contact with the lower package is suppressed, thereby preventing the desorption error of the lower package caused by the stickiness caused by static electricity.

[0101] In addition, according to the semiconductor packaging testing device 100 of the present invention, the silicone pad and the floating plate replace the function of the existing vacuum pickup, and an upper socket is provided independently of the silicone pad and the floating plate. Therefore, once the silicone pad or the upper socket fails, it is sufficient to replace the defective silicone pad or the upper socket, thereby saving replacement costs.

[0102] In addition, according to the semiconductor packaging testing device 100 of the present invention, in the prior art, the vacuum pickup is connected to the upper socket, and the socket hole for transmitting the vacuum pressure is a necessary component. Therefore, for the lower package in contact with the upper socket, only the lower package without the upper terminal at the position corresponding to the socket hole can be detected. However, the testing device of the present invention does not require a socket hole, so it has the advantage of being able to perform detection without restriction even if there is a terminal in the center of the lower package.

[0103] Furthermore, the semiconductor package testing device 100 according to the present invention has an advantage that even if there is a terminal in the center of the lower package, it can be easily picked up without difficulty in the method of suction using the open groove of the floating plate.

[0104] As mentioned above, although the preferred example of the present invention was described by way of example, the scope of the present invention is not limited to the above-described and illustrated embodiments.

Claims

1. A semiconductor packaging test device, characterized in that: include: A lower socket is mounted on a tester providing a test signal and has a first conductive portion, wherein the first conductive portion is respectively connected to the lower terminals of the lower package, thereby electrically connecting the lower package to the tester; A pusher, comprising a main body in a quadrangular prism shape, a protrusion protruding from the center of the main body, a mounting groove provided between the upper side of the protrusion and the main body, and a vacuum channel for transmitting the vacuum pressure of the vacuum generating device, wherein the pusher receives power from the driving part and can move so as to be able to approach or move away from the lower packaging side; An upper socket is connected to the lower side of the protruding portion with the upper package interposed therebetween, and has a second conductive portion, the upper end of the second conductive portion can be connected to the lower terminal of the upper package and the lower end of the second conductive portion can be connected to the upper terminal of the lower package; A silicone pad, in a ring shape, is disposed in the installation groove; as well as The floating plate is movably coupled to the pusher and can move through the elasticity of the silicone pad. The floating plate is configured to include a side wall portion surrounding the protruding portion and a contact portion having an open groove that exposes the lower surface of the upper socket. The vacuum pressure of the vacuum generating device is applied to the open groove through the vacuum passage.

2. The semiconductor packaging test device according to claim 1, characterized in that: The vacuum passage is composed of a vacuum hole penetrating the center of the protrusion in the vertical direction and at least one vacuum groove crossing the lower surface of the protrusion to be connected to the vacuum hole.

3. The semiconductor packaging test device according to claim 1, characterized in that: The floating plate is coupled to the pusher in a vacuum-tight manner via the silicone pad.

4. The semiconductor packaging test device according to claim 1, characterized in that: An expansion portion is provided on the upper side of the side wall portion of the floating plate, so that the floating plate can move up and down along the mounting groove.

5. The semiconductor packaging test device according to claim 1, characterized in that: The bottom surface of the floating plate is located at a lower side than the bottom surface of the upper socket, and when the silicone pad is compressed, the bottom surface of the floating plate is located at the same height as the bottom surface of the upper socket.

6. The semiconductor packaging test device according to claim 1, characterized in that: The mounting groove further has a pad mounting groove to accommodate a portion of the thickness of the silicone pad.

7. The semiconductor packaging test device according to claim 1, characterized in that: The floating plate is made of metal material. The lower surface of the contact portion is subjected to anodization or DLC coating treatment.

8. The semiconductor packaging test device according to claim 1, characterized in that: The floating plate is made of metal material. An antistatic film made of any one of polyimide, FR4 or engineering plastics is pasted under the contact portion.

9. The semiconductor packaging test device according to claim 1, characterized in that: The upper socket has the second conductive portion formed on an insulating pad made of a non-elastic insulating material.

10. The semiconductor package testing device according to claim 9, characterized in that: The non-elastic insulating material is any one of polyimide, FR4 or engineering plastics.

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