Packaging structure of discrete semiconductor device

Abstract

The invention discloses a packaging structure of a discrete semiconductor device, and relates to the technical field of semiconductor packaging, the packaging structure comprises an outer packaging shell, the two sides of the outer packaging shell are provided with exhaust holes, and exhaust fans are rotatably arranged in the exhaust holes; positioning cavities are formed in the two faces of the outer packaging shell, and inner packaging bodies are arranged in the positioning cavities. Ratchet wheel structures are arranged on the two sides of the inner packaging body, motors of the ratchet wheel structures are connected with transmission ratchet wheels, and the output ends of the motors on the two sides are fixedly connected with the exhaust fan; the ratchet wheel structure is arranged, motors on the two sides of the ratchet wheel structure can rotate respectively, when the motor on one side drives a ratchet wheel to be in transmission with the transmission structure, the motor closed on the other side can idle and slip through the transmission ratchet wheel, and the transmission structure can move smoothly; the cooling structure is indirectly controlled to absorb heat and cool; and by arranging the exhaust fan, the motor rotates to drive the exhaust fan to rotate, so that cold air of the cold transfer blocks on the upper and lower surfaces of the inner packaging body is driven to flow, and comprehensive cooling is performed.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a packaging structure of a discrete semiconductor device. Background Art

[0002] Semiconductor components are divided into "discrete" and "integrated" according to their packaging form. Discrete devices refer to electronic devices that have separate functions and cannot be separated. Depending on the chip structure and function, they can be divided into semiconductor diodes, triodes, bridge rectifiers, optoelectronic devices, etc., as well as devices formed by connecting them in a certain way.

[0003] In order to improve stability and practicality, a packaging structure is constructed outside the semiconductor discrete device. The existing packaging structure can cool and dissipate heat for the semiconductor discrete device during the packaging process. For example, a packaging structure of a semiconductor discrete device with a publication number of CN117116879B includes an outer packaging shell, an inner packaging body and connecting pins, the inner packaging body is arranged on the lower inner wall of the outer packaging shell, the connecting pins are arranged on the lower outer wall of the outer packaging shell, the connecting pins penetrate the bottom wall of the outer packaging shell and are connected to the inner packaging body, and an alternating magnetic cooling mechanism is arranged inside the outer packaging shell, and the alternating magnetic cooling mechanism includes an alternating cooling transmission component, an automatic steering transmission component and a fixed partition.

[0004] This packaging structure drives the temperature conduction plate to flip by the forward and reverse rotation of the motor on one side. The motor is set on one side, and one end of the temperature conduction plate is too far away from the motor, resulting in a large torque of the temperature conduction plate, which requires the motor to generate a large power to drive the flip. At the same time, the motor needs to rotate forward and reverse, which places many restrictions on the motor requirements. At the same time, this packaging structure mainly cools down the upper and lower surfaces of the inner package body by directly contacting the cold air, and the cold air can directly overflow from the notches and heat dissipation holes on the side, so the cooling efficiency of the side of the inner package body is low. As a result, the temperature difference that may occur on the surface during the packaging process leads to uneven packaging. Summary of the invention

[0005] The purpose of the present invention is to solve the problem that the transmission motor on one side of the above-mentioned background technology needs to have high power and be able to perform forward and reverse rotation at the same time, which brings many requirements and restrictions, and the low cooling efficiency of the side of the inner package body leads to large surface temperature difference and uneven packaging, and proposes a packaging structure for semiconductor discrete devices.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A packaging structure for a semiconductor discrete device, characterized in that it comprises an outer packaging shell, exhaust holes are arranged on both sides of the outer packaging shell, and an exhaust fan is rotatably arranged in the exhaust hole; positioning cavities are arranged on both sides of the outer packaging shell, and an inner packaging body is detachably arranged inside the positioning cavity; ratchet structures are arranged on both sides of the inner packaging body near the exhaust hole, and the ratchet structure comprises:

[0008] The motors are arranged on both sides of the inner package body near the exhaust hole, the output end surfaces of the motors on both sides are coaxially fixedly connected with transmission ratchets, and one end of the output ends of the motors on both sides is coaxially fixedly connected with the corresponding exhaust fans;

[0009] A transmission gear ring is sleeved on the outer surface of each transmission ratchet, and a plurality of clamping blocks are arranged inside the transmission gear ring, and the plurality of clamping blocks are in close contact with the surface of the transmission ratchet;

[0010] The surface of the transmission gear ring is provided with a transmission structure, and a transmission frame of the transmission structure is sleeved on the surface of each transmission gear ring, and connecting vertical plates are provided on both sides of the transmission frame; a rotating shaft is rotatably provided between the corresponding connecting vertical plates on both sides of the inner packaging body, and the rotating shaft is transmission-connected with the transmission frame;

[0011] A cooling structure is provided on the surface of the rotating shaft, a rotating plate of the cooling structure is provided on the surface of each rotating shaft, and a plurality of cold transfer blocks are provided on one side of the rotating plate; two fixed partitions are provided on the side of each rotating plate away from the inner packaging body, a spacing is provided between the two fixed partitions, and the spacing is adapted to the corresponding rotating plate, and a refrigeration plate is provided on one side of the two fixed partitions.

[0012] As a further solution of the present invention: handles and connecting pins are respectively provided on two sides of the outer packaging shell where the exhaust hole is provided, and the exhaust hole is located below the handles and the connecting pins.

[0013] As a further solution of the present invention: the exhaust holes on both sides are located at the center of the two sides of the outer packaging shell, and the exhaust holes on both sides are located on the same horizontal line.

[0014] As a further solution of the present invention: a plurality of clamping blocks are arranged in a circular array at equal distances in the transmission gear ring, and a compression spring is arranged between each clamping block and the inner ring of the transmission gear ring.

[0015] As a further solution of the present invention: a transmission rack is arranged on one side of the transmission frame, and the transmission rack is meshedly connected with the surface of the transmission gear ring.

[0016] As a further solution of the present invention: both ends of the rotating shaft extend from the connecting vertical plates on both sides, and transmission gears are fixedly arranged on the surfaces of the two extended ends of the rotating shaft; a fixed rack is arranged inside the positioning cavity, and the fixed rack is meshed and connected with two transmission gears in the vertical direction.

[0017] As a further solution of the present invention, the fixed rack is meshed with only one corresponding transmission gear at the same time.

[0018] As a further solution of the present invention: a plurality of heat dissipation holes are arranged on both sides of the outer packaging shell.

[0019] As a further solution of the present invention: connecting transverse plates are arranged on both sides of each transmission frame, and a connecting vertical plate is arranged at one end of the connecting transverse plate away from the transmission frame.

[0020] Beneficial effects of the present invention:

[0021] (1) A semiconductor discrete device packaging structure of the present invention is provided with a ratchet structure, and the motors on both sides of the ratchet structure can rotate respectively, so that when the motor on one side drives the ratchet to transmit to the transmission structure, the motor on the other side that is turned off can slip through the transmission ratchet, so that the transmission structure can move smoothly; driving the transmission mechanism to control the cooling structure to absorb heat and cool down;

[0022] (2) A packaging structure of a semiconductor discrete device of the present invention is provided with an exhaust fan. The output ends of the motors on both sides are coaxially fixedly connected with the exhaust fans. The motors can drive the exhaust fans to rotate during rotation, thereby driving the flow of cold air through the cold transfer blocks on the upper and lower sides of the inner packaging body, guiding the cold air to be discharged from the exhaust ports on both sides, thereby improving the cooling and heat dissipation efficiency of the cold air on the sides of the inner packaging body; preventing the cold air from directly overflowing from the heat dissipation holes and the positioning cavity, thereby improving the cooling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] Figure 1 It is a structural schematic diagram of a packaging structure of a semiconductor discrete device of the present invention;

[0025] Figure 2 It is a front view of the internal structure of a packaging structure of a semiconductor discrete device of the present invention;

[0026] Figure 3 It is a schematic diagram of the internal structure of a packaging structure of a semiconductor discrete device of the present invention;

[0027] Figure 4 It is a structural schematic diagram of the ratchet structure of the present invention;

[0028] Figure 5 It is a front schematic diagram of a packaging structure of a semiconductor discrete device of the present invention;

[0029] Figure 6 It is a schematic back view of a packaging structure of a semiconductor discrete device of the present invention.

[0030] In the figure: 1. outer packaging shell; 11. positioning cavity; 12. handle; 13. connecting pin; 14. exhaust hole; 15. exhaust fan; 16. heat dissipation hole; 2. inner packaging body; 3. ratchet structure; 31. motor; 32. transmission ratchet; 33. block; 34. extrusion spring; 35. transmission gear ring; 4. transmission structure; 41. transmission frame; 42. transmission rack; 43. connecting horizontal plate; 44. connecting vertical plate; 45. rotating shaft; 46. transmission gear; 47. reset spring; 48. fixed rack; 5. cooling structure; 51. rotating plate; 52. cold transfer block; 53. fixed partition; 54. refrigeration plate. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] See also Figure 1-6 As shown, the present invention is a packaging structure of a semiconductor discrete device, including an outer packaging shell 1, positioning cavities 11 are provided on both sides of the outer packaging shell 1, and a plurality of heat dissipation holes 16 are opened on the upper and lower surfaces of the outer packaging shell 1. A handle 12 is provided on one side of the outer packaging shell 1, and a connecting pin 13 is provided on the side of the outer packaging shell 1 away from the handle 12. Exhaust holes 14 are provided on both sides of the outer packaging shell 1 where the handle 12 and the connecting pin 13 are provided, and the exhaust holes 14 are respectively located below the handle 12 and the connecting pin 13, and the exhaust holes 14 on both sides are located at the center of the outer packaging shell 1 and are located on the same horizontal line. An exhaust fan 15 is rotatably provided in each exhaust hole 14.

[0033] An inner package body 2 is detachably provided inside the positioning cavity 11, and the positioning cavity 11 is detachably connected to the inner package body 2. The inner package body 2 is located in the central horizontal plane of the positioning cavity 11. A ratchet structure 3 is provided near both sides of the inner package body 2 close to the exhaust hole 14, and two motors 31 of the ratchet structure 3 are provided on both sides of the inner package body 2 close to the exhaust hole 14, and the output end of the motor 31 is coaxially fixedly connected to the exhaust fan 15. A transmission ratchet 32 ​​is fixedly provided on the circumferential surface of the output end of the motor 31, and a transmission gear ring 35 is sleeved on the surface of each transmission ratchet 32, and a plurality of clamping blocks 33 are rotatably provided on the inner ring of the transmission gear ring 35, and a plurality of clamping blocks 33 are arranged in an equidistant circumferential array in the inner ring of the transmission gear ring 35, and a compression spring 34 is provided between each clamping block 33 and the inner ring of the transmission gear ring 35.

[0034] The transmission gear rings 35 on both sides are provided with transmission structures 4 on the outside, and the transmission frames 41 of the transmission structures 4 are sleeved on the surface of the transmission gear rings 35. Transmission racks 42 are provided on one side of the inside of the transmission frames 41 on both sides, and the transmission racks 42 are connected with the surface of the transmission gear rings 35 by teeth meshing. Both sides of each transmission frame 41 are provided with connecting horizontal plates 43, and the end of the connecting horizontal plates 43 away from the transmission frame 41 is provided with connecting vertical plates 44. A rotating shaft 45 is provided between the corresponding connecting plates on both sides of the inner package 2, and the two ends of the rotating shaft 45 are rotatably connected with different connecting vertical plates 44. The two ends of the rotating shaft 45 extend out from the connecting plates, and the two ends of the rotating shaft 45 are coaxially fixed with transmission gears 46. Two fixed racks 48 are provided on both sides of the interior of the positioning cavity 11, respectively, and each fixed rack 48 is meshed with two transmission gears 46 in the same vertical direction, and each fixed rack 48 can only mesh with the teeth of one transmission gear 46 at the same time.

[0035] A cooling structure 5 is arranged inside the positioning cavity 11, and the rotating plates 51 of the cooling structure 5 are arranged on the circumferential surface of the rotating shaft 45. Reset springs 47 are arranged on both sides of each rotating plate 51, and the other end of the reset spring 47 is connected to the nearby connecting vertical plate 44, and the reset spring 47 is sleeved on the rotating shaft 45. A cooling block 52 is arranged on one side of each rotating plate 51, and the cooling block 52 is made of a material with large specific heat capacity and good heat absorption and heat release effect. Eight fixed partitions 53 are arranged inside the positioning cavity 11, and two fixed partitions 53 are fixedly arranged above each rotating plate 51, and a gap is arranged between the two fixed partitions 53, and the gap is adapted to the corresponding rotating plate 51. A plurality of cooling fins 54 are arranged on the side of each fixed partition 53 away from the inner packaging body 2.

[0036] When using this semiconductor discrete device packaging structure, the inner package body 2 is installed inside the positioning groove for positioning, and the connecting pin 13 of the outer package shell 1 is driven by the handle 12 to be inserted into the semiconductor circuit board. Then the discrete device formed by the plastic packaging of the inner package body 2 is connected with other devices for operation. At this time, the discrete device dissipates heat. When the temperature of the outer package shell 1 exceeds the specified temperature, the internal temperature sensor receives the temperature, thereby transmitting an electrical signal to the motors 31 on both sides of the inner package body 2, and the motor 31 on one side is started, and the output end of the motor 31 drives the transmission ratchet 32 ​​to rotate. At this time, the rotation direction of the output end of the starting motor 31 can drive the ratchet to engage with the block 33 on the surface, so that the ratchet drives the transmission gear ring 35 to rotate. During the rotation of the transmission gear ring 35, the transmission frame 41 is driven to move in the vertical direction through the transmission rack 42 on the surface. At this time, the transmission gear ring 35 on the other side rotates synchronously, and the ratchet on the output end surface of the motor 31 that has not been started on the other side slips with the transmission gear ring 35, so that the transmission frame 41 on the other side can move synchronously. During the movement of the transmission frame 41, the transmission gears 46 on the top of both sides are indirectly driven to move upward. Until the tooth surface of the transmission gear 46 contacts the fixed rack 48 and meshes with it, the transmission gear 46 will be rotated by the force of the fixed rack 48 when it continues to move upward, so that the transmission gears 46 on both sides drive the rotating shaft 45 to rotate. The rotating plate 51 set on the surface of the rotating shaft 45 is turned over, and the rotating plate 51 moves upward to the gap between the two corresponding fixed partitions 53. At the same time, the cold transfer block 52 on the surface of the rotating plate 51 turns over to the cooling plates 54 on both sides to absorb heat. After a period of time, the motor 31 on the other side is started, and the output end of the motor 31 on the other side rotates to drive the moving frame to move in the opposite direction, so that the rotating plate 51 after absorbing heat drives the cold transfer block 52 to turn over again under the force of the reset spring 47 and approach the inner package 2 below, so as to cool the top surface of the inner package 2. At this time, the rotating plate 51 and the cold transfer block 52 below absorb heat. The motors 31 on both sides rotate in sequence under the control of the temperature sensor, and drive the ratchet structure 3 and the driving structure to control the cooling and heat dissipation of the cold transfer block 52. During the rotation process, the output ends of the motors 31 on both sides drive the exhaust fan 15 fixedly connected coaxially to rotate, thereby guiding the cold air of the cold transfer block 52 to flow from the upper and lower surfaces of the inner package 2 to both sides, thereby allowing the cold air to effectively cool the side of the inner package 2, avoiding the cold air from directly flowing out from the heat dissipation holes 16 or the sides of the positioning grooves, thereby reducing the cooling efficiency of the inner package 2.

[0037] Working principle of the present invention: A packaging structure of a semiconductor discrete device of the present invention is provided with a ratchet structure 3, and the motors 31 on both sides of the ratchet structure 3 can rotate respectively, so that when the motor 31 on one side drives the transmission ratchet 32 ​​to transmit with the transmission structure 4, the motor 31 closed on the other side can slip through the transmission ratchet 32 ​​to allow the transmission structure 4 to move smoothly; drive the transmission mechanism to control the cooling structure to absorb heat and cool down; by providing an exhaust fan 15, the output ends of the motors 31 on both sides are coaxially fixedly connected with the exhaust fan 15, and the motor 31 can drive the exhaust fan 15 to rotate during the rotation process, thereby driving the flow of cold air from the cold transfer blocks 52 on the upper and lower sides of the inner packaging body 2, guiding the cold air to be discharged from the exhaust ports on both sides, thereby improving the cooling and heat dissipation efficiency of the cold air on the side of the inner packaging body 2; preventing the cold air from directly overflowing from the heat dissipation holes 16 and the positioning cavity 11, thereby improving the cooling efficiency.

[0038] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A packaging structure of a semiconductor discrete device, characterized in that: The invention comprises an outer packaging shell (1), exhaust holes (14) are arranged on both sides of the outer packaging shell (1), and an exhaust fan (15) is rotatably arranged in the exhaust hole (14); positioning cavities (11) are arranged on both sides of the outer packaging shell (1), and an inner packaging body (2) is detachably arranged inside the positioning cavity (11); ratchet structures (3) are arranged on both sides of the inner packaging body (2) close to the exhaust holes (14), and the ratchet structure (3) comprises: The motors (31) are arranged on both sides of the inner package body (2) near the exhaust hole (14), the output end surfaces of the motors (31) on both sides are coaxially fixedly connected with the transmission ratchet (32), and one end of the output end of the motors (31) on both sides is coaxially fixedly connected with the corresponding exhaust fan (15); A transmission toothed ring (35) is sleeved on the outer surface of each transmission ratchet (32), and a plurality of clamping blocks (33) are arranged inside the transmission toothed ring (35), and the plurality of clamping blocks (33) are in close contact with the surface of the transmission ratchet (32); A transmission structure (4) is provided on the surface of the transmission gear ring (35); a transmission frame (41) of the transmission structure (4) is sleeved on the surface of each transmission gear ring (35); connecting vertical plates (44) are provided on both sides of the transmission frame (41); a rotating shaft (45) is rotatably provided between the corresponding connecting vertical plates (44) on both sides of the inner packaging body (2); and the rotating shaft (45) is transmission-connected to the transmission frame (41); The surface of the rotating shaft (45) is provided with a cooling structure (5), and a rotating plate (51) of the cooling structure (5) is provided on the surface of each rotating shaft (45), and a plurality of cold transfer blocks (52) are provided on one side of the rotating plate (51); each rotating plate (51) is provided with two fixed partitions (53) on the side away from the inner packaging body (2), and a spacing is provided between the two fixed partitions (53), and the spacing is adapted to the corresponding rotating plate (51), and a cooling plate (54) is provided on one side of the two fixed partitions (53).

2. A packaging structure for a discrete semiconductor device according to claim 1, characterized in that: The two sides of the outer packaging shell (1) where the exhaust hole (14) is arranged are respectively provided with a handle (12) and a connecting pin (13), and the exhaust hole (14) is located below the handle (12) and the connecting pin (13).

3. The packaging structure of a discrete semiconductor device according to claim 1, characterized in that: The exhaust holes (14) on both sides are located at the center positions of the two sides of the outer packaging shell (1), and the exhaust holes (14) on both sides are located on the same horizontal line.

4. The packaging structure of a semiconductor discrete device according to claim 1, characterized in that: A plurality of clamping blocks (33) are arranged in a circular array at equal distances in the transmission gear ring (35), and a compression spring (34) is arranged between each clamping block (33) and the inner ring of the transmission gear ring (35).

5. The packaging structure of a semiconductor discrete device according to claim 1, characterized in that: A transmission rack (42) is arranged on one side of the transmission frame (41), and the transmission rack (42) is meshedly connected with the surface of the transmission gear ring (35).

6. The packaging structure of a semiconductor discrete device according to claim 1, characterized in that: The two ends of the rotating shaft (45) extend out from the connecting vertical plates (44) on both sides, and transmission gears (46) are fixedly arranged on the surfaces of the two extended ends of the rotating shaft (45); a fixed rack (48) is arranged inside the positioning cavity (11), and the fixed rack (48) is meshed and connected with two transmission gears (46) in the vertical direction.

7. The packaging structure of a discrete semiconductor device according to claim 6, characterized in that: The fixed rack (48) meshes with only one corresponding transmission gear (46) at the same time.

8. The packaging structure of a semiconductor discrete device according to claim 1, characterized in that: A plurality of heat dissipation holes (16) are arranged on two sides of the outer packaging shell (1).

9. The packaging structure of a discrete semiconductor device according to claim 1, characterized in that: Both sides of each transmission frame (41) are provided with connecting transverse plates (43), and one end of the connecting transverse plate (43) away from the transmission frame (41) is provided with a connecting vertical plate (44).

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