Display panel manufacturing system and method and display panel

Abstract

The embodiment of the invention provides a manufacturing system and method of a display panel and the display panel, relates to the technical field of display equipment, and aims to solve the technical problem of relatively low manufacturing efficiency of the display panel in the prior art. The system comprises a temporary substrate, a transfer unit, a transfer substrate, a laser separation unit, a driving substrate, an alignment unit, a laser welding unit and a device separation unit. Through laser irradiation, at least part of the light-emitting devices can be separated from the first adhesive layer on the temporary substrate in batches, so that the at least part of the light-emitting devices are transferred to the second adhesive layer on the transfer substrate; through laser irradiation, the electrodes of the light-emitting device on the transfer substrate and the electrodes on the driving substrate can be welded in batches. In this way, the efficiency of transferring a large number of light-emitting devices to the driving substrate is greatly improved, and therefore the manufacturing efficiency of the display panel is greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular, to a manufacturing system and method for a display panel and a display panel. Background Art

[0002] With the development of display technology, Micro-LED technology is mentioned more and more. Micro-LED display panels generally include multiple pixels, each pixel includes a red sub-pixel, a blue sub-pixel and a green sub-pixel. During the preparation of the display panel, the three sub-pixels need to be transferred from their respective chips to the driving substrate, and the electrodes of each LED sub-pixel need to be welded to the electrodes on the driving substrate.

[0003] Currently, the light-emitting devices on the growth substrate are transferred to the driving substrate mainly by means of a mass transfer method. However, the efficiency of transferring the light-emitting devices on the growth substrate to the driving substrate is currently low, thereby reducing the manufacturing efficiency of the display panel. Summary of the invention

[0004] In order to overcome the technical problems mentioned in the above technical background, an embodiment of the present application provides a manufacturing system for a display panel, the system comprising:

[0005] A temporary substrate, wherein a first adhesive layer is provided on the temporary substrate;

[0006] A transfer unit, used for transferring the light-emitting device to the first adhesive layer on the temporary substrate;

[0007] A transfer substrate, wherein a second adhesive layer is provided on the transfer substrate;

[0008] a laser separation unit, configured to separate at least part of the light emitting device from the first adhesive layer on the temporary substrate by laser irradiation, so as to transfer at least part of the light emitting device to the second adhesive layer on the transfer substrate;

[0009] A driving substrate, wherein the driving substrate comprises a plurality of electrodes;

[0010] an alignment unit, the alignment unit being used to align the transfer substrate with the drive substrate;

[0011] A laser welding unit, used for welding the electrodes of the light emitting device on the transfer substrate and the electrodes on the drive substrate by laser irradiation;

[0012] The device separation unit is used to separate the light emitting device on the transfer substrate from the second adhesive layer so as to transfer the light emitting device to the drive substrate.

[0013] In a possible implementation, the device separation unit includes a robot arm, and a suction element is provided on the robot arm. The suction element is used to suction the driving substrate so as to separate the light-emitting device on the transfer substrate from the second adhesive layer.

[0014] In a possible implementation, the mechanical arm includes a connecting plate and a suction arm connected to each other, the suction element includes a plurality of suction holes provided on the suction arm, and the plurality of suction holes are used to suction the driving substrate;

[0015] Preferably, a rotating unit is installed on a side of the connecting plate away from the adsorption arm;

[0016] Preferably, a suction cup is installed on the adsorption hole;

[0017] Preferably, the suction cup is made of rubber;

[0018] Preferably, a plurality of folds are provided on the suction cup along the axial direction of the suction cup.

[0019] In a possible implementation, the viscosity of the second adhesive layer is greater than that of the first adhesive layer. In a possible implementation, the system further includes a detection unit; the detection unit is used to detect the firmness of welding between the electrode of the light-emitting device and the electrode on the driving substrate based on the viscosity of the second adhesive layer.

[0020] In a possible implementation, the system further includes a first platform, the first platform is used to carry and fix the temporary substrate, a first hollow hole is opened on the first platform, and the light-emitting device on the temporary substrate corresponds to the first hollow hole;

[0021] The laser separation unit emits a laser that passes through the first hollow hole on the first platform to separate at least part of the light-emitting device from the first glue layer on the temporary substrate;

[0022] Preferably, the wavelength range of the infrared laser emitted by the laser separation unit is 266nm to 248nm.

[0023] In a possible implementation, the system further includes a mask located between the laser separation unit and the first platform;

[0024] The laser emitted by the laser separation unit passes through the mask and the first hollow hole on the first platform in sequence, so that at least part of the light-emitting device is separated from the first glue layer on the temporary substrate.

[0025] In a possible implementation, the system further includes a second platform, the second platform is used to carry and fix the transfer substrate, a second hollow hole is opened on the second platform, and the second hollow hole corresponds to the light-emitting device on the transfer substrate;

[0026] The laser welding unit welds the electrodes of the light emitting device on the transfer substrate with the electrodes on the driving substrate by emitting laser light that passes through the second hollow hole on the second platform;

[0027] Preferably, a vacuum hole is opened on the second platform, a vacuum foot is connected to the vacuum hole, and the vacuum foot is used to adsorb the driving substrate;

[0028] Preferably, the wavelength range of the infrared laser emitted by the laser welding unit is 960nm to 1040nm.

[0029] In a possible implementation, the system further includes a moving unit, which simultaneously moves the transfer substrate and the drive substrate to a welding station;

[0030] Preferably, the moving unit simultaneously transfers a single group of the transfer substrates and a single group of the drive substrates to the welding station.

[0031] In a possible implementation, the present application further provides a method for manufacturing a display panel, characterized in that, based on the display panel manufacturing system described in the present application, the method comprises:

[0032] transferring the light emitting device on the growth substrate to the first glue layer on the temporary substrate;

[0033] Separating at least part of the light-emitting device from the first glue layer on the temporary substrate by laser irradiation, so as to transfer at least part of the light-emitting device to the second glue layer on the transfer substrate;

[0034] Aligning the transfer substrate with the drive substrate by an alignment unit;

[0035] welding the electrodes of the light emitting device on the transfer substrate and the electrodes on the driving substrate by laser irradiation;

[0036] The light emitting device on the transfer substrate is separated from the second adhesive layer by a device separation unit, so as to transfer the light emitting device to the drive substrate.

[0037] In a possible implementation, the present application also provides a display panel, which is prepared by the method for manufacturing a display panel described in the present application.

[0038] Compared with the prior art, this application has the following beneficial effects:

[0039] The present application provides a display panel manufacturing system, method and display panel, which can separate at least part of the light-emitting devices from the first glue layer on the temporary substrate in batches through laser irradiation, so as to transfer at least part of the light-emitting devices to the second glue layer on the transfer substrate; and can weld the electrodes of the light-emitting devices on the transfer substrate to the electrodes on the drive substrate in batches through laser irradiation. In this way, the efficiency of transferring a large number of light-emitting devices to the drive substrate is greatly improved, thereby greatly improving the efficiency of display panel manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 A schematic diagram of transferring the light-emitting device on the growth substrate to the temporary substrate by laser provided in this embodiment;

[0042] Figure 2 A schematic top view of a temporary substrate provided in this embodiment after a light emitting device is mounted on the first adhesive layer;

[0043] Figure 3 A schematic diagram of selectively transferring the light-emitting device on the temporary substrate to the transfer substrate by laser irradiation provided in this embodiment;

[0044] Figure 4 A schematic diagram of welding the electrodes of the light-emitting device on the transfer substrate and the electrodes on the driving substrate by laser irradiation provided in this embodiment;

[0045] Figure 5 A schematic diagram showing a temporary substrate provided in this embodiment installed on a first platform;

[0046] Figure 6 A schematic diagram of setting a mask between the laser separation unit and the first platform provided in this embodiment;

[0047] Figure 7 A schematic diagram showing the transfer substrate provided in this embodiment being installed on the second platform;

[0048] Figure 8 A schematic diagram of positioning a driving substrate through an image acquisition unit provided in this embodiment;

[0049] Fig. 9 A schematic diagram showing that the driving substrate provided in this embodiment is installed on the third platform;

[0050] Fig.10 A front view schematic diagram of the robotic arm provided in this embodiment;

[0051] Fig.11 A schematic diagram of a suction cup provided on a mechanical arm provided in this embodiment;

[0052] Fig.12 A schematic flow chart of a method for manufacturing a display panel provided in this embodiment.

[0053] Figure numerals: 10, temporary substrate; 11, first adhesive layer; 12, light-emitting device; 13, growth substrate; 14, laser; 15, transfer substrate; 151, second adhesive layer; 16, laser separation unit; 17, laser welding unit; 18, driving substrate; 19, first platform; 191, first hollow hole; 20, mask; 21, second platform; 211, second hollow hole; 22, vacuum foot; 23, CCD camera; 24, third platform; 241, long hole; 25, rotating unit; 26, connecting plate; 27, adsorption arm; 271, adsorption hole; 28, suction cup; 281, wrinkle. DETAILED DESCRIPTION

[0054] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0055] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0056] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0057] In the description of this application, it should be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0058] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0059] At present, the electrodes of the light-emitting device and the electrodes of the driving substrate are mainly connected through ACF (Anisotropic Conductive Film) or silver paste, but this connection method is inefficient, costly and has poor reliability. Efficiency, cost and reliability are the key factors that restrict whether the connection between the electrodes of the light-emitting device and the electrodes of the driving substrate can meet the needs of mass production. Low-cost and high-reliability metals have high melting points, so the traditional soldering and reflow soldering processes take a long time, and the long-term high-temperature process of the reflow process will bring more reliability risks, which cannot meet the needs of mass production.

[0060] In view of this, the present embodiment provides a display panel manufacturing system that can improve the mass transfer efficiency of light-emitting devices. The system includes a temporary substrate, a transfer unit, a transfer substrate, a laser separation unit, a drive substrate, an alignment unit, a laser welding unit and a device separation unit.

[0061] See also Figure 1 , a first glue layer 11 is provided on the temporary substrate 10 ; and the transfer unit is used to transfer the light-emitting device 12 on the growth substrate 13 to the first glue layer 11 on the temporary substrate 10 .

[0062] Three types of chips are arranged on one side of the growth substrate 13, and each chip is provided with a light emitting device 12 of one color. Figure 1 A red light emitting device, a green light emitting device and a blue light emitting device are arranged on the chip of the growth substrate 13, and the light emitting device 12 may be an LED.

[0063] Preferably, the first adhesive layer 11 may be silicone, such as polydimethylsiloxane (PDMS). The first adhesive layer 11 is evenly attached to the temporary substrate 10 by ultra-flat silicon wafer imprinting, so that the thickness of the first adhesive layer 11 attached to the temporary substrate 10 is more uniform.

[0064] Will Figure 1 At least two of the red light emitting device, the green light emitting device or the blue light emitting device are transferred to the first adhesive layer 11 of the temporary substrate 10. For example, the Figure 1 The red light emitting device, the green light emitting device and the blue light emitting device are all transferred to the temporary substrate 10, and the light emitting devices 12 of one color are transferred each time, and the electrodes of the light emitting devices 12 transferred to the temporary substrate 10 face one side of the temporary substrate 10, such as Figure 2 shown.

[0065] Preferably, see again Figure 1 , the light emitting devices 12 of at least two colors on the growth substrate 13 can be transferred to the first adhesive layer 11 on the temporary substrate 10 through the 248nm laser emitted by the laser 14. In this way, the light emitting devices 12 of three colors are attached to the first adhesive layer 11 of the temporary substrate 10 by using the laser spaced technology, and the light emitting devices 12 on the growth substrate 13 can be transferred to the temporary substrate 10 more efficiently.

[0066] See also Figure 3 , a second glue layer 151 is provided on the transfer substrate 15; the laser separation unit 16 is used to separate at least part of the light-emitting device 12 from the first glue layer 11 on the temporary substrate 10 by laser irradiation, so as to transfer at least part of the light-emitting device 12 to the second glue layer 151 of the transfer substrate 15.

[0067] Preferably, the second adhesive layer 151 may be silicone, such as polydimethylsiloxane (PDMS). The second adhesive layer 151 is uniformly attached to the transfer substrate 15 by ultra-flat silicon wafer imprinting, so that the thickness of the second adhesive layer 151 attached to the transfer substrate 15 is more uniform, and the second adhesive layer 151 is used to receive at least part of the light-emitting device 12 separated from the first adhesive layer 11.

[0068] Please see again Figure 3 The laser separation unit selectively separates the light emitting device 12 from the first adhesive layer 11 on the temporary substrate 10 at one time by irradiating laser light, and the second adhesive layer 151 on the transfer substrate 15 receives the light emitting device 12 separated from the first adhesive layer 11. In this way, the light emitting device 12 can be laser-detached from the first adhesive layer 11, and the second adhesive layer 151 can receive the light emitting device 12.

[0069] Through the laser transfer space technology, the light-emitting devices 12 can be efficiently and closely arranged on the second glue layer 151 of the transfer substrate 15 at one time, so as to increase the number of the light-emitting devices 12 and expand the coverage area of ​​the light-emitting devices 12; the light-emitting devices 12 can be flipped to the second glue layer 151 for a second time, so as to improve the transfer efficiency of the light-emitting devices 12. And the light-emitting devices 12 on the temporary substrate 10 can be selectively transferred to the transfer substrate 15 according to actual needs. For example, if some light-emitting devices 12 on a driving substrate need to be repaired after being damaged, the light-emitting devices 12 on the temporary substrate 10 can be selectively transferred to the driving substrate to be repaired according to the light-emitting devices 12 that need to be repaired, so that a large number of the light-emitting devices 12 can be repaired.

[0070] See also Figure 4 , the driving substrate 18 includes a plurality of electrodes; the laser welding unit 17 is used to weld the electrodes of the light-emitting device on the transfer substrate 15 with the electrodes on the driving substrate 18 by laser irradiation.

[0071] The driving substrate 18 includes a backplane and a bonding electrode located on one side of the backplane. The backplane may include multiple metal traces and / or multiple driving units for transmitting signals or electrical energy. The metal traces and / or the driving units are electrically connected to the bonding electrodes, and the bonding electrodes are electrically connected to the light-emitting device 12. The metal traces and the driving units can be used to drive the light-emitting device 12.

[0072] The transfer substrate 15 and the driving substrate 18 are aligned by the alignment unit so that the electrodes on the driving substrate 18 correspond one to one with the electrodes of the light emitting device 12 on the second adhesive layer 151 .

[0073] Please see again Figure 4 The laser welding unit 17 batch welds the electrodes of the light-emitting device 12 on the transfer substrate 15 with the electrodes on the drive substrate 18 , so that the bonding electrodes on the drive substrate 18 are electrically connected with the electrodes on the light-emitting device 12 .

[0074] The device separation unit is used to separate the light emitting device 12 on the transfer substrate 15 from the second adhesive layer 151 , so as to transfer the light emitting device 12 to the driving substrate 18 .

[0075] After the electrodes on the driving substrate 18 are welded together with the electrodes of the light-emitting device 12, opposite forces can be applied to the transfer substrate 15 and the driving substrate 18, so that the light-emitting device 12 on the transfer substrate 15 can be separated from the second adhesive layer 151, and then the light-emitting device can be transferred to the driving substrate in large quantities.

[0076] Based on the above design, this embodiment can separate at least part of the light emitting devices 12 from the first adhesive layer 11 on the temporary substrate 10 in batches through laser irradiation, so as to transfer at least part of the light emitting devices 12 to the second adhesive layer 151 on the transfer substrate 15; through laser irradiation, the electrodes of the light emitting devices on the transfer substrate 15 can be welded in batches with the electrodes on the drive substrate 18. In this way, the efficiency of transferring a large number of light emitting devices to the drive substrate 18 is greatly improved, thereby greatly improving the manufacturing efficiency of the display panel.

[0077] In a possible implementation, the viscosity of the second adhesive layer 151 is greater than the viscosity of the first adhesive layer 11 ; the system further includes a detection unit; the detection unit is used to detect the firmness of welding between the electrode of the light emitter 7 and the electrode on the driving substrate 18 based on the viscosity of the second adhesive layer 151 .

[0078] The second adhesive layer 151 and the first adhesive layer 11 can replace the photosensitive adhesive for laser stripping process. The second adhesive layer 151 and the first adhesive layer 11 have the characteristics of high light transmittance, high temperature resistance, good elasticity, high flatness and certain thickness. Therefore, the second adhesive layer 151 and the first adhesive layer 11 can be reused and can meet the precision requirements of connection and stripping. In particular, the second adhesive layer 151 is not within the laser focal depth range because the second adhesive layer 151 is separated from the laser by air, so the second adhesive layer 151 is not easily damaged, so the second adhesive layer 151 can be reused.

[0079] After welding the electrodes of the light-emitting device 12 and the electrodes on the driving substrate 18 together, the light-emitting device 12 is also bonded to the second adhesive layer 151. If the bonding force between the light-emitting device 12 and the second adhesive layer 151 is less than the bonding force between the electrodes of the light-emitting device 12 and the electrodes of the driving substrate 18, when the transfer substrate 15 is removed, the light-emitting device 12 will be successfully transferred from the second adhesive layer 151 to the driving substrate 18. If the bonding force between the light-emitting device 12 and the second adhesive layer 151 is greater than the bonding force between the electrodes of the light-emitting device 12 and the electrodes of the driving substrate 18, when the transfer substrate 15 is removed, the light-emitting device 12 will remain on the second adhesive layer 151, and the light-emitting device 12 will not be transferred to the driving substrate 18. According to whether the light-emitting device 12 is transferred to the driving substrate 18, the firmness of the welding between the electrodes of the light-emitting device 12 and the electrodes on the driving substrate 18 can be detected. In addition, by changing the viscosity of the second adhesive layer 151 , the firmness of welding between the electrodes of the light emitting device 12 and the electrodes on the driving substrate 18 with different requirements can also be tested.

[0080] In one possible implementation, see Figure 5 The system also includes a first platform 19, which is used to support and fix the temporary substrate 10. A first hollow hole 191 is opened on the first platform 19, and the light-emitting device 12 on the temporary substrate 10 corresponds to the first hollow hole 191; the laser emitted by the laser separation unit 16 passes through the first hollow hole 191 on the first platform 19 to separate at least part of the light-emitting device 12 from the first adhesive layer 11 on the temporary substrate 10.

[0081] The wavelength range of the infrared laser emitted by the laser separation unit 16 can be 266nm to 248nm. A vacuum hole can be opened on the first platform 19, and the vacuum hole is connected to a vacuum source, so the first platform 19 and the temporary substrate 10 can be connected by vacuum adsorption. Installing the temporary substrate 10 on the first platform 19 can make the temporary substrate 10 more stable and facilitate positioning of the temporary substrate 10, thereby being more conducive to transferring the light-emitting device 12 on the temporary substrate 10 to the transfer substrate 15.

[0082] Since the first platform 19 is light-proof, in order to allow the laser emitted by the laser separation unit 16 to pass through the first platform 19 , a first hollow hole 191 needs to be opened at a position of the first platform 19 corresponding to the light-emitting device 12 on the temporary substrate 10 .

[0083] In practical applications, the first platform 19 can be fixed, that is, after the first platform 19 is positioned once, it usually does not need to be positioned again subsequently, thereby reducing the time used for positioning the first platform 19 and further improving the transfer efficiency of the light-emitting device 12.

[0084] In one possible implementation, see Figure 6 The system also includes a mask plate 20 located between the laser separation unit 16 and the first platform 19; the laser emitted by the laser separation unit 16 passes through the mask plate 20 and the first hollow hole 111 on the first platform 19 in sequence, so as to separate at least part of the light-emitting device 12 from the first glue layer 11 on the temporary substrate 10.

[0085] The working condition of the light emitting device 12 on the driving substrate 18 can be detected by lighting it up. If a certain part on the driving substrate 18 is not lit up, the light emitting device 12 may be missing at that place, or the light emitting device 12 at that place may be defective and needs to be repaired.

[0086] When the light emitting device 12 on the driving substrate 18 needs to be repaired, a corresponding mask 20 can be designed according to the position of the light emitting device 12 to be repaired on the driving substrate 18, and the mask 20 is arranged between the laser separation unit 16 and the first platform 19. Then, the laser emitted by the laser separation unit 16 passes through the mask 20 and the first hollow hole 191 on the first platform 19 in sequence, and finally the laser emitted by the laser separation unit 16 passes through the first hollow hole 191 and acts on the first adhesive layer 11, and finally the light emitting device 12 is separated from the first adhesive layer 11.

[0087] Since the mask 20 is designed based on the position of the light-emitting device 12 to be repaired, the laser passing through the mask 20 will selectively hit the light-emitting device 12 of the temporary substrate 10, and selectively separate the light-emitting device 12 from the first adhesive layer 11, and finally selectively transfer the light-emitting device 12 on the temporary substrate 10 to the transfer substrate 15, and transfer the light-emitting device 12 on the transfer substrate 15 to the position to be repaired on the driving substrate 18 to be repaired, so that the light-emitting device 12 can be repaired in large quantities.

[0088] In one possible implementation, see Figure 7The system also includes a second platform 21, which is used to support and fix the transfer substrate 15. A second hollow hole 211 is opened on the second platform 21, and the second hollow hole 211 corresponds to the light-emitting device 12 on the transfer substrate 15; the laser emitted by the laser welding unit 17 passes through the second hollow hole 211 on the second platform 21 to weld the electrode of the light-emitting device 12 on the transfer substrate 15 with the electrode on the driving substrate 18.

[0089] Please see again Figure 7 The laser emitted by the laser welding unit 17 can be an infrared laser of 960nm~1040nm. The laser welding unit 17 is arranged below the transfer substrate 15. In this way, the laser welding unit 17 is flipped, which can reduce the number of times the light-emitting device 12 is flipped, and the flipping precision error is reduced. Only one alignment is required for multiple uses, thereby maximizing the alignment accuracy of the light-emitting device 12 and the driving substrate 18.

[0090] Please see again Figure 7 , a vacuum hole may be provided on the second platform 21, and the vacuum hole is connected to a vacuum source. The vacuum hole of the second platform 21 is connected to a vacuum foot 22. When the transfer substrate 15 is moved onto the second platform 21, the vacuum foot 22 generates a vacuum to adsorb the transfer substrate 15, so the second platform 21 and the transfer substrate 15 can be connected by vacuum adsorption. Installing the transfer substrate 15 on the second platform 21 can make the transfer substrate 15 more stable, and at the same time, it can be easier to position the transfer substrate 15, so that it is more conducive to transferring the light-emitting device 12 on the temporary substrate 10 to the transfer substrate 15, and it is more convenient to weld the electrodes of the light-emitting device 12 on the transfer substrate 15 and the electrodes of the driving substrate 18.

[0091] Since the second platform 21 is opaque, in order to allow the laser emitted by the laser welding unit to pass through the second platform 21, a second hollow hole 211 needs to be opened at a position of the second platform 21 corresponding to the light emitting device 12 on the temporary substrate 10. By providing the second hollow hole 211 on the second platform 21, not only the weight of the second platform 21 can be reduced, but also the welding of the electrodes of the light emitting device 12 on the transfer substrate 15 and the electrodes of the drive substrate 18 by the laser generated by the laser welding unit is not affected.

[0092] In a possible implementation, the system further includes a moving unit, which simultaneously transfers the transfer base 3 and the driving substrate 18 to a welding station.

[0093] The transfer substrate 15 and the drive substrate 18 can be transferred to the welding station at the same time by a linear motor. In this way, there is no need to transfer the transfer substrate 15 and the drive substrate 18 to the welding station separately, thereby saving time for transferring the transfer substrate 15 and the drive substrate 18, thereby further improving the efficiency of mass transfer of the light-emitting devices 12.

[0094] Preferably, the moving unit simultaneously transfers a single group of the transfer substrates 15 and a single group of the drive substrates 18 to the welding station.

[0095] A single group of transfer substrates 15 refers to a single transfer substrate, and a single group of drive substrates 18 refers to a single drive substrate, that is, a single transfer substrate 15 and a single drive substrate 18 are simultaneously transferred to the welding station, and the electrodes of the light-emitting devices 12 on the single transfer substrate 15 are welded to the electrodes on the single drive substrate 18. If the electrodes of the light-emitting devices 12 on multiple groups of transfer substrates 15 are welded to the electrodes on multiple groups of drive substrates 18 at the same time, it is possible that the warpage of the multiple groups of transfer substrates 15 and the multiple groups of drive substrates 18 are inconsistent, resulting in poor welding of the electrodes of the light-emitting devices 12 on the transfer substrate 15 and the electrodes on the drive substrate 18. Therefore, by means of single-group welding, the warpage compatibility between the transfer substrate 15 and the drive substrate 18 is improved, and it is easier to weld the electrodes of the light-emitting devices 12 on the single group of transfer substrates 15 to the electrodes on the single group of drive substrates 18.

[0096] While welding the electrodes of the light emitting devices 12 on the transfer substrate 15 and the electrodes on the drive substrate 18, the light emitting devices 12 on the temporary substrate 10 are transferred to another group of the transfer substrates 15, and the other group of the transfer substrates 15 and the other group of the drive substrates 18 are simultaneously transferred to the welding position. In this way, while welding the electrodes of the light emitting devices 12 on one group of the transfer substrates 15 and the electrodes on the drive substrate 18, the other group of the transfer substrates 15 and the other group of the drive substrates 18 can be moved to the welding position, thereby improving the consistency of the loading and unloading efficiency of the light emitting devices 12, shortening the time difference of the incoming materials of the drive substrate 18 and the transfer substrate 15 before welding, and thus greatly improving the mass transfer efficiency of the light emitting devices 12.

[0097] In one possible implementation, see Figure 8 The alignment unit includes an image acquisition unit, and the image acquisition unit is used to position the driving substrate 18.

[0098] Based on the image acquisition unit, the driving substrate 18 is positioned, and based on the positioned driving substrate 18, the transfer substrate 15 and the driving substrate 18 are simultaneously transferred to the welding station. The image acquisition unit includes a CCD (Charge Coupled Device) camera 23, and the CCD camera 23 positions the driving substrate 18 based on the position of the temporary substrate 10. After the driving substrate 18 is positioned, the transfer substrate 15 and the driving substrate 18 are simultaneously transferred to the welding station. By positioning the driving substrate 18 with the CCD camera 23, the alignment accuracy between the electrodes of the light-emitting device 12 on the transfer substrate 15 and the electrodes on the driving substrate 18 can be greatly improved.

[0099] In one possible implementation, see Fig. 9 The system also includes a third platform 24, which is used to receive and fix the driving substrate 18. The device separation unit includes a robotic arm, on which is provided an adsorption element, which is used to adsorb the driving substrate 18 so as to separate the light-emitting device 12 on the transfer substrate 15 from the second adhesive layer 151. The robotic arm is also used to install the driving substrate 18 on the third platform 24.

[0100] Please see again Fig. 9 The third platform 24 may have a vacuum hole, and the vacuum hole is connected to a vacuum source, so that the third platform 24 and the drive substrate 18 may be connected by vacuum adsorption. Mounting the drive substrate 18 on the third platform 24 can make the drive substrate 18 more stable and facilitate positioning of the drive substrate 18, thereby facilitating welding of the electrodes of the light-emitting device 12 on the transfer substrate 15 and the electrodes on the drive substrate 18.

[0101] The adsorption element on the robot arm can generate an adsorption force on the driving substrate 18 to adsorb the driving substrate 18. When the light-emitting device 12 needs to be transferred to the driving substrate 18, the driving substrate 18 is adsorbed by the adsorption unit on the robot arm, and then the robot arm is controlled to move away from the transfer substrate 15 in a conventional manner. Since the electrodes of the driving substrate 18 and the electrodes of the light-emitting device 12 are welded together, when the pulling force applied by the robot arm to the driving substrate 18 is greater than the bonding force between the light-emitting device 12 and the second adhesive layer 151, the robot arm will separate the light-emitting device 12 from the second adhesive layer 151 to the driving substrate 18. In this way, it is easier to separate the light-emitting device from the driving substrate 18 by the robot arm.

[0102] The robot arm can also drive the driving substrate 18 to change position. Therefore, by providing the robot arm, the efficiency of installing the driving substrate 18 on the third platform 24 can be improved, and the corresponding labor intensity can be reduced.

[0103] Preferably, see Fig.10 The robot arm includes a connecting plate 26 and an adsorption arm 27 connected to each other, the adsorption element includes a plurality of adsorption holes 271 arranged on the adsorption arm, and a rotating unit 25 is installed on the side of the connecting plate 26 away from the adsorption arm 27; please refer to Fig. 9 The third platform 24 is provided with a long hole 241 .

[0104] Please see again Fig.10 The rotating unit 25 may include a conventional rotating motor, the adsorption hole 271 is connected to a vacuum source, the adsorption arm 27 adsorbs the driving substrate 18 through the vacuum generated by the adsorption hole 271, and then the rotating unit 25 is powered on. After the rotating unit 25 is powered on, it rotates and drives the adsorption arm 27 to rotate, and finally drives the driving substrate 18 to rotate, and rotates the electrodes of the light-emitting device 12 on the driving substrate 18 to face the transfer substrate 15, and then the driving substrate 18 is sent to the inner side of the third platform 24 (towards the side of the transfer substrate 15) by the robot arm. Then, the third platform 24 is vacuumed, the driving substrate 18 is adsorbed to the inner side of the third platform 24, and then the robot arm is broken to break the vacuum, and the adsorption arm 27 of the robot arm is pulled out from the long hole 241.

[0105] See also Fig.11 A suction cup 28 is installed on the adsorption hole 271 ; the suction cup 28 is made of rubber; and a plurality of wrinkles 281 are provided on the suction cup along the axial direction of the suction cup 28 .

[0106] The plurality of folds 281 and the rubber material can make the suction cup 28 contractible. In this way, when the suction arm 27 adsorbs the drive substrate 18, the suction cup 28 and the drive substrate 18 can be flexibly connected, and the suction cup 28 can generate a more balanced suction force on different positions on the drive substrate 18, which can better accommodate the warping of the drive substrate 18, so that the drive substrate 18 can be adsorbed more stably.

[0107] The robot arm can also drive the temporary substrate 10 to move and install the temporary substrate 10 on the first platform 19, and can drive the transfer substrate 15 to move and install the transfer substrate 15 on the second platform 21. In this way, the robot arm can further shorten the time for mass transfer of the light-emitting devices 12. By designing the robot arm, the first platform 19, the second platform 21 and the third platform 24, etc., the accuracy and reliability of the process can be improved, the consistency of the process conditions of the processing unit can be ensured, and the optimal performance of the equipment for manufacturing display panels can be improved.

[0108] After the electrodes of the light-emitting device 12 on the transfer substrate 15 are welded with the electrodes on the drive substrate 18, the robot arm descends and passes through the long hole 241. When the robot arm contacts the drive substrate 18, the robot arm generates a vacuum and adsorbs the drive substrate 18. At this time, the third platform 24 breaks the vacuum hole, and the robot arm drives the drive substrate 18 to move away from the transfer substrate 15, and uses the force generated by the robot arm to pull the light-emitting device 12 away from the second glue layer 151 on the transfer substrate 15. After the robot arm is away from the second glue layer 151, it rotates 180° driven by the rotating unit 25, and then places the drive substrate 18 with the light-emitting device 12 in a suitable area. In this way, the light-emitting device 12 can be separated from the second glue layer 151 more easily by the robot arm, thereby shortening the time for placing the drive substrate 18 with the light-emitting device 12 in a suitable area.

[0109] In summary, the present application can separate at least part of the light emitting devices 12 from the first adhesive layer 11 on the temporary substrate 10 in batches through the laser separation unit 16, so as to transfer at least part of the light emitting devices 12 to the second adhesive layer 151 on the transfer substrate 15; and can weld the electrodes of the light emitting devices 12 on the transfer substrate 15 and the electrodes on the drive substrate 18 in batches through the laser welding unit 17. In this way, the efficiency of transferring a large number of light emitting devices 12 to the drive substrate 18 is greatly improved, thereby greatly improving the efficiency of display panel manufacturing.

[0110] In one possible implementation, see Fig.12 The present application also provides a method for manufacturing a display panel, based on the display panel manufacturing system described in the present application; the method comprises:

[0111] S10 : transferring the light emitting device 12 on the growth substrate 13 to the first glue layer 11 on the temporary substrate 10 .

[0112] In this embodiment, the light emitting devices 12 of three colors are mounted on the first adhesive layer 11 of the temporary substrate 10 using laser spacing technology, so that the light emitting devices 12 on the growth substrate 13 can be transferred to the temporary substrate 10 more efficiently.

[0113] S11 : separating at least part of the light emitting device 12 from the first glue layer 11 on the temporary substrate 10 by laser irradiation, so as to transfer at least part of the light emitting device 12 to the second glue layer 151 on the transfer substrate 15 .

[0114] In this embodiment, through the laser transfer space technology, the light-emitting devices 12 can be efficiently and closely arranged on the second glue layer 151 of the transfer substrate 15 at one time, so as to increase the number of the light-emitting devices 12 and expand the coverage area of ​​the light-emitting devices 12; the light-emitting devices 12 can be flipped to the second glue layer 151 for a second time, so as to improve the transfer efficiency of the light-emitting devices 12. And according to actual needs, the light-emitting devices 12 on the temporary substrate 10 can be selectively transferred to the transfer substrate 15. For example, if some light-emitting devices 12 on a certain driving substrate 18 need to be repaired after being damaged, the light-emitting devices 12 on the temporary substrate 10 can be selectively transferred to the driving substrate 18 to be repaired according to the light-emitting devices 12 that need to be repaired, so that a large number of the light-emitting devices 12 can be repaired.

[0115] S12: Aligning the transfer substrate 15 and the drive substrate 18 by an alignment unit.

[0116] In this embodiment, the transfer substrate 15 is aligned with the drive substrate 18 by the alignment unit, so that the electrodes on the drive substrate 18 correspond one-to-one with the electrodes of the light-emitting device 12 on the second adhesive layer 151 .

[0117] S13: welding the electrodes of the light emitting device 12 on the transfer substrate 15 and the electrodes on the driving substrate 18 by laser irradiation.

[0118] In this embodiment, the electrodes of the light-emitting device 12 on the transfer substrate 15 and the electrodes on the driving substrate 18 are batch welded by laser irradiation of the laser welding unit 17, so that the bonding electrodes on the driving substrate 18 and the electrodes on the light-emitting device 12 are electrically connected.

[0119] S14 : separating the light emitting device 12 on the transfer substrate 15 from the second adhesive layer 151 by a device separation unit, so as to transfer the light emitting device 12 to the driving substrate 18 .

[0120] In this embodiment, after the electrodes on the driving substrate 18 are welded together with the electrodes of the light-emitting device 12, opposite forces can be applied to the transfer substrate 15 and the driving substrate 18, so that the light-emitting device 12 on the transfer substrate 15 can be separated from the second adhesive layer 151, and then the light-emitting device 12 can be transferred to the driving substrate 18 in large quantities.

[0121] In this embodiment, by laser irradiation, at least part of the light-emitting devices 12 can be separated from the first glue layer 11 on the temporary substrate 10 in batches, so as to transfer at least part of the light-emitting devices 12 to the second glue layer 151 on the transfer substrate 15. By laser irradiation, the electrodes of the light-emitting devices 12 on the transfer substrate 15 can be welded in batches with the electrodes on the drive substrate 18. In this way, by combining low-cost mass transfer and efficient mass welding processes, and being compatible with selective mass repair, the mechanism design is optimized, the process is reduced, and the cost is reduced, which greatly improves the efficiency of mass transferring the light-emitting devices 12 on the growth substrate 13 to the drive substrate 18, thereby greatly improving the manufacturing efficiency of the display panel.

[0122] In a possible implementation, the present application further provides a display panel, which is prepared by the display panel manufacturing method described in the present application. Since the display panel manufacturing method described in the present application can improve the efficiency of mass transfer of the light-emitting device and can perform mass repair on the light-emitting device, the display panel has higher quality and lower cost.

[0123] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0124] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel manufacturing system, characterized in that: The system comprises: A temporary substrate, wherein a first adhesive layer is provided on the temporary substrate; A transfer unit, used for transferring the light-emitting device to the first adhesive layer on the temporary substrate; A transfer substrate, wherein a second adhesive layer is provided on the transfer substrate; a laser separation unit, configured to separate at least part of the light emitting device from the first adhesive layer on the temporary substrate by laser irradiation, so as to transfer at least part of the light emitting device to the second adhesive layer on the transfer substrate; a driving substrate, wherein the driving substrate comprises at least one electrode; An alignment unit, used for aligning the transfer substrate with the drive substrate; A laser welding unit, used for welding the electrodes of the light emitting device on the transfer substrate and the electrodes on the driving substrate by laser irradiation; The device separation unit is used to separate the light emitting device on the transfer substrate from the second adhesive layer so as to transfer the light emitting device to the drive substrate.

2. The display panel manufacturing system according to claim 1, characterized in that: The device separation unit comprises a mechanical arm, on which an adsorption element is provided, and the adsorption element is used to adsorb the driving substrate so as to separate the light-emitting device on the transfer substrate from the second adhesive layer.

3. The manufacturing system of the display panel according to claim 2, wherein the robot arm comprises a connecting plate and an adsorption arm connected to each other, the adsorption element comprises a plurality of adsorption holes arranged on the adsorption arm, and the plurality of adsorption holes are used to adsorb the driving substrate; Preferably, a rotating unit is installed on a side of the connecting plate away from the adsorption arm; Preferably, a suction cup is installed on the adsorption hole; Preferably, the suction cup is made of rubber; Preferably, a plurality of folds are provided on the suction cup along the axial direction of the suction cup.

4. The display panel manufacturing system according to claim 1, further comprising a detection unit; The detection unit is used to detect the firmness of welding between the electrode of the light emitting device and the electrode on the driving substrate.

5. The display panel manufacturing system according to claim 1, characterized in that: The system further includes a first platform, the first platform is used to carry and fix the temporary substrate, a first hollow hole is opened on the first platform, and the light-emitting device on the temporary substrate corresponds to the first hollow hole; The laser separation unit emits a laser that passes through the first hollow hole on the first platform to separate at least part of the light-emitting device from the first glue layer on the temporary substrate; Preferably, the wavelength range of the infrared laser emitted by the laser separation unit is 266nm to 248nm.

6. The display panel manufacturing system according to claim 5, characterized in that: The system further includes a mask located between the laser separation unit and the first platform; The laser emitted by the laser separation unit passes through the mask and the first hollow hole on the first platform in sequence, so that at least part of the light-emitting device is separated from the first glue layer on the temporary substrate.

7. The display panel manufacturing system according to claim 1, characterized in that: The system further includes a second platform, the second platform is used to carry and fix the transfer substrate, a second hollow hole is opened on the second platform, and the second hollow hole corresponds to the light-emitting device on the transfer substrate; The laser welding unit welds the electrodes of the light emitting device on the transfer substrate with the electrodes on the driving substrate by emitting laser light that passes through the second hollow hole on the second platform; Preferably, a vacuum hole is opened on the second platform, a vacuum foot is connected to the vacuum hole, and the vacuum foot is used to adsorb the driving substrate; Preferably, the wavelength range of the infrared laser emitted by the laser welding unit is 960nm to 1040nm.

8. The display panel manufacturing system according to claim 1, characterized in that: The system further comprises a moving unit, which simultaneously moves the transfer substrate and the drive substrate to a welding station; Preferably, the moving unit simultaneously transfers a single group of the transfer substrates and a single group of the drive substrates to the welding station.

9. A method for manufacturing a display panel, characterized in that: A manufacturing system for a display panel according to any one of claims 1 to 8; the method comprising: transferring the light emitting device on the growth substrate to the first glue layer on the temporary substrate; Separating at least part of the light-emitting device from the first glue layer on the temporary substrate by laser irradiation, so as to transfer at least part of the light-emitting device to the second glue layer on the transfer substrate; Aligning the transfer substrate with the drive substrate by an alignment unit; welding the electrodes of the light emitting device on the transfer substrate and the electrodes on the driving substrate by laser irradiation; The light emitting device on the transfer substrate is separated from the second adhesive layer by a device separation unit, so as to transfer the light emitting device to the drive substrate.

10. A display panel, characterized in that: The display panel is prepared by the method for manufacturing the display panel according to claim 9.

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