Water drop linetype processing technology and device
Through the water droplet linear processing technology, combined with jet polishing and magnetic grinding electrolytic polishing technology, the problem of single core single ground wire positioning and insufficient smoothness of the inner wall of the hole groove is solved, the welding stability and wear resistance are improved, and more efficient Wire processing effect.
Patent Information
- Application Number
- CN202411476076.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2024-12-27
AI Technical Summary
The existing wire processing tools cannot effectively position and guide single core and single ground wire, resulting in the position of conductors and ground wires during welding, and the failure to horizontally attach the pads, causing welding problems, and the smoothness of the inner wall of the cut hole slot is insufficient. It can easily lead to wire damage.
The water droplet linear processing technology is adopted, including grinding materials on the grinder, cutting water droplet-shaped hole slots using a wire cutting machine, combining jet polishing, magnetic grinding and electrolytic polishing technology to remove impurities on the surface and inner walls and improve smoothness and hardness.
Through jet polishing and magnetic grinding electrolytic polishing technology, the smoothness and hardness of the inner wall of the hole groove are significantly improved, ensuring the stability and wear resistance of the wire during welding, avoiding wire damage, and achieving a more efficient welding effect.
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Figure CN119209170A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of wire processing technology, and specifically to a water drop wire processing technology and device. Background Art
[0002] MCIO 8X cable is a high-performance connector and cable assembly solution designed for high-speed data transmission. MCIO 8X cable has four structures, namely dual-core dual-ground cable, single-core single-ground cable, cable arrangement and single electronic cable. The single-core single-ground cable has only one conductor and a ground wire, and its appearance is very different from that of conventional cables. It looks like a water drop. At present, the fixture structure used in the cable arrangement process is mostly to open a rectangular groove in the fixture, and use the rectangular groove to clamp the dual-core dual-ground cable and the single-core single-ground cable, and then use the pressure plate to prevent the wire in the rectangular groove from moving out. This fixture can position and guide the dual-core dual-ground cable. Although the shape of the double-core double-ground wire of the conventional wire is relatively symmetrical, the conductor and the ground wire are not prone to positional variation during welding, but the conductor and the ground wire of the single-core single-ground wire must be horizontally attached to the pad during welding. Due to the special shape of the single-core single-ground wire, the existing fixture cannot effectively position the single-core single-ground wire. The position of the single-core single-ground wire in the rectangular groove is prone to variation. When welding the single-core single-ground wire, the conductor and the ground wire cannot be horizontally attached to the pad, resulting in problems in the back-end welding.
[0003] By cutting a teardrop groove in the same shape as the single-core single-ground wire inside the fixture, the single-core single-ground wire can be positioned and guided, and the wire can be prevented from being offset and unable to be horizontally attached to the pad. Currently, cutting holes inside the fixture is usually done by wire cutting, but the inner wall of the hole after wire cutting has poor smoothness, and the Mylar on the outer surface of the wire is easily cut when guiding the wire. Although the smoothness of the inner wall of the hole can be improved by fluid polishing and ultrasonic cleaning, there will still be a large number of small particles on the inner wall of the hole, and the roughness inside the hole still cannot meet the requirements. Summary of the invention
[0004] The purpose of this application is to provide a water drop line processing technology and device to solve the technical problems raised in the above background technology.
[0005] To achieve the above purpose, the present application provides the following technical solution: a water drop line processing technology, comprising the following steps:
[0006] Step 1: Place the material to be processed on the grinding machine and grind multiple surfaces of the material to make it smooth without burrs or impurities, and fix the polished material on the workbench of the wire cutting machine;
[0007] Step 2: Use a wire cutting machine to cut the material and cut a water drop-shaped hole groove inside the material. The cutting speed is 10-15mm / min, the current is 5-10A, and the voltage is 30-100V. During the cutting process, compressed coolant is sprayed to the cutting area to wash away the cutting residue at the cutting area.
[0008] Step 3: Use a cleaning agent to clean the cut material to remove impurities and grease on the outer surface of the material and inside the water drop hole, then fix the cleaned material in the grinding chamber of the magnetic polishing machine by a clamp, pour the magnetic abrasive and polishing liquid into the grinding chamber, start the magnetic polishing machine, and let the magnetic abrasive start to move along the inner hole wall under the action of the magnetic field for grinding and polishing;
[0009] Step 4, pre-connect the fixture to the anode, and set a cathode in the grinding chamber, the anode and the cathode are electrically connected to a DC power supply with adjustable voltage and current, and after the magnetic polishing machine grinds and polishes the material for 10-20 minutes, the DC power supply is controlled to work, and the material being grinded and polished is electrolytically polished for another 2-5 minutes;
[0010] Step 5: Take out the electropolished material and clean it thoroughly by ultrasonic cleaning or high-pressure water washing to ensure that there is no residual magnetic abrasive and polishing liquid on the outer surface of the material and the water droplet holes inside the material. Blow dry the outer surface and inner holes of the material with compressed air, and apply oil to the outer surface and inner water droplet holes of the material.
[0011] Preferably, in step 2, the coolant is ejected through a nozzle, and there are two nozzles, one of which sprays the coolant directly onto the outer surface of the upper end of the material, and the coolant flows into the cutting groove to take away the cutting residues and cool the cutting area at the same time. The water jet pressure is 10MPa-40MPa, and the angle between the other nozzle and the cutting metal wire is 1-45°, and the other nozzle is moved and adjusted by an XY axial moving mechanism. The other nozzle moves with the cutting metal wire and performs fluid polishing on the inner wall of the cutting groove that has been cut by the metal wire through the ejected high-speed fluid, and can also wash away the residues on the inner wall of the cutting groove.
[0012] Preferably, the water jet pressure of the nozzle used for fluid polishing the inner wall of the cutting groove is 200MPa-400MPa, the water jet flow rate is 10-20L / min, the high-speed fluid ejected from the nozzle for polishing the inner wall of the cutting groove contains corundum abrasive, and the particle size of the corundum abrasive is 30-120μm, and the abrasive concentration is 5%-20%.
[0013] Preferably, the moving speed of the nozzle used for fluid polishing the inner wall of the cutting groove is the same as the cutting speed, and the angle of the nozzle can be adjusted by an electric mechanism, first using an angle of 1°-10° for preliminary rough polishing, and then gradually adjusting to 15°-45° for fine polishing.
[0014] Preferably, in step 3, the magnetic abrasive is ferrite abrasive, with a particle size of 20-50 μm, a magnetic field strength of 0.2-0.5 T, a polishing time of 20-30 min, and the polishing liquid is composed of the following materials in parts by weight: 85% phosphoric acid and 15% water.
[0015] Preferably, the polishing liquid further contains aluminum oxide, and the concentration of aluminum oxide is 5-10 g / L.
[0016] Preferably, during electrolytic polishing in step 4, ammonia is introduced into the polishing liquid at the same time, the ammonia flow rate is 0.2-0.5 L / min, and the electrolytic current density is 5-10 A / dm 2 , voltage 15-20V, control the temperature of the polishing liquid to maintain at 45-55°, and stir the alumina and ferrite abrasives in the polishing liquid during the electrolysis process.
[0017] Preferably, the oil used for oiling the outer surface and the internal water droplet holes of the material in step 5 is rust-proof lubricating oil.
[0018] A water drop line processing device includes a clamp for clamping materials, a grinder for grinding multiple surfaces of materials, a wire cutting machine for cutting materials, a magnetic polishing machine for magnetic grinding of materials, an anode and a cathode for electrolyzing materials, and a DC power supply connected to the anode and the cathode.
[0019] Compared with the prior art, the beneficial effects of this application are:
[0020] 1) The present application first removes larger surface flaws and protrusions on the inner hole by jet polishing to produce a relatively smooth preliminary surface, and at the same time removes the oxide layer on the surface. The magnetic abrasive can then penetrate into the tiny depressions on the hole wall to further remove tiny surface defects and improve the surface finish. The tiny unevenness remaining after water jet polishing can be further smoothed to make the surface smoother. Finally, the tiny rough spots on the surface of the inner hole are evenly dissolved through an electrochemical reaction to further enhance the mirror effect of the surface and improve the finish. The abrasive particles that may be left over from magnetic grinding can also be effectively removed to ensure that there are no particles remaining on the surface of the inner hole. During the electrolytic polishing process, as the material dissolves, the atomic layer on the surface of the inner hole will be rearranged, which helps to improve the surface hardness and wear resistance.
[0021] 2) The present application realizes the polishing of the inner hole by simultaneously adopting magnetic grinding and electrolytic polishing. The magnetic abrasive mechanically grinds the workpiece surface under the action of the magnetic field. At the same time, the electrolyte will induce an electrochemical reaction to dissolve the workpiece surface, mechanically remove large particles and rough spots, and electrochemically remove tiny protrusions and passivate the surface to form a smooth surface, shorten the polishing time and improve the polishing efficiency, so that the surface finish of the inner hole is higher and close to the mirror effect.
[0022] 3) The present application adds aluminum oxide to the polishing liquid. Under the action of magnetic force, the inner hole can be polished and the materials can be deposited on the surface of the inner hole of the workpiece to form a coating with high hardness. At the same time, ammonia gas is introduced into the polishing liquid during the electrolysis process. After ammonia gas (NH3) is introduced into the electrolyte, it may be partially dissolved into ammonium ions (NH4 + ) and hydroxide ions (OH - ), which regulates the pH value of the electrolyte. Ammonia can also react with certain metals to make the dissolution and redeposition process of the metal surface more uniform and reduce corrosion. During the electrolysis process, the decomposition of ammonia may release active nitrogen atoms, which can react with the metal surface to form a nitride layer (such as FeN, CrN, etc.), thereby enhancing the hardness and wear resistance of the metal surface. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 This is a schematic diagram of the application process. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0025] Embodiment 1:
[0026] See also Figure 1 , this application provides a technical solution:
[0027] Step 1: Place the material to be processed on the grinding machine and grind multiple surfaces of the material to make it smooth without burrs or impurities, and fix the polished material on the workbench of the wire cutting machine;
[0028] Step 2, use the wire cutting machine to cut the material, cut a water drop-shaped hole groove inside the material, the cutting speed is 10mm / min, the current is 5A, the voltage is 30V, and during the cutting process, the compressed coolant is used to spray to the cutting position to wash away the cutting residue at the cutting position. The coolant is ejected through the nozzle, and the number of nozzles is two, one of the nozzles sprays the coolant directly on the outer surface of the upper end of the material, and the coolant flows and enters the cutting groove to take away the cutting residue and cool the cutting position at the same time. The water jet pressure is 10MPa, and the angle between the other nozzle and the cutting metal wire is 1-45°, and the other nozzle is moved and adjusted by the XY axial movement mechanism, and the other nozzle follows the cutting The cutting metal wire is moved, and the inner wall of the cutting groove that has been cut by the metal wire is fluid-polished by the ejected high-speed fluid, and the residue on the inner wall of the cutting groove can also be washed away. The water jet pressure of the nozzle for fluid-polishing the inner wall of the cutting groove is 200MPa, and the water jet flow rate is 10L / min. The high-speed fluid ejected from the nozzle for polishing the inner wall of the cutting groove contains corundum abrasive, and the particle size of the corundum abrasive is 30μm, and the abrasive concentration is 5%. The moving speed of the nozzle for fluid-polishing the inner wall of the cutting groove is the same as the cutting speed, and the angle of the nozzle can be adjusted by an electric mechanism, first use an angle of 2° for preliminary rough polishing, and then gradually adjust to 17° for fine polishing;
[0029] Step 3, use a cleaning agent to clean the cut material to remove impurities and grease on the outer surface of the material and inside the water drop hole, then fix the cleaned material in the grinding chamber of the magnetic polishing machine by a clamp, pour the magnetic abrasive and polishing liquid into the grinding chamber, start the magnetic polishing machine, and let the magnetic abrasive start to move along the inner hole wall under the action of the magnetic field for grinding and polishing. The magnetic abrasive is ferrite abrasive with a particle size of 20 μm, a magnetic field strength of 0.2 T, and a polishing time of 20 min. The polishing liquid is composed of the following materials by weight: 85% phosphoric acid and 15% water;
[0030] Step 4: pre-connect the fixture to the anode, and set a cathode in the grinding chamber. The anode and the cathode are electrically connected to a DC power supply with adjustable voltage and current. After the magnetic polisher grinds and polishes the material for 10 minutes, the DC power supply is controlled to work, and the material being grinded and polished is electrolytically polished for another 2 minutes. During the electrolytic polishing, ammonia is introduced into the polishing liquid at the same time. The ammonia flow rate is 0.2L / min, and the electrolytic current density is 5A / dm 2 , voltage 15V, control the temperature of the polishing liquid to be maintained at 45°, and stir the alumina and ferrite abrasives in the polishing liquid during the electrolysis process;
[0031] Step 5: Take out the electropolished material and clean it thoroughly by ultrasonic cleaning or high-pressure water washing to ensure that there is no residual magnetic abrasive and polishing liquid on the outer surface of the material and the water droplet holes inside the material. Blow dry the outer surface and inner holes of the material with compressed air, and apply anti-rust lubricating oil to the outer surface of the material and the internal water droplet holes.
[0032] Embodiment 2:
[0033] Step 1: Place the material to be processed on the grinding machine and grind multiple surfaces of the material to make it smooth without burrs or impurities, and fix the polished material on the workbench of the wire cutting machine;
[0034] Step 2, use the wire cutting machine to cut the material, cut a water drop-shaped hole groove inside the material, the cutting speed is 13mm / min, the current is 7A, the voltage is 70V, and during the cutting process, compressed coolant is used to spray to the cutting position to wash away the cutting residue at the cutting position. The coolant is ejected through the nozzle, and the number of nozzles is two, one of the nozzles sprays the coolant directly on the outer surface of the upper end of the material, and the coolant flows and enters the cutting groove to take away the cutting residue and cool the cutting position at the same time. The water jet pressure is 25MPa, and the angle between the other nozzle and the cutting metal wire is 1-45°, and the other nozzle is moved and adjusted by the XY axial moving mechanism, and the other nozzle follows the cutting The cutting metal wire is moved, and the inner wall of the cutting groove that has been cut by the metal wire is fluid-polished by the ejected high-speed fluid, and the residue on the inner wall of the cutting groove can also be washed away. The water jet pressure of the nozzle used for fluid-polishing the inner wall of the cutting groove is 300MPa, and the water jet flow rate is 15L / min. The high-speed fluid ejected from the nozzle for polishing the inner wall of the cutting groove contains corundum abrasive, and the particle size of the corundum abrasive is 60μm, and the abrasive concentration is 10%. The moving speed of the nozzle used for fluid-polishing the inner wall of the cutting groove is the same as the cutting speed, and the angle of the nozzle can be adjusted by an electric mechanism, first use an angle of 5° for preliminary rough polishing, and then gradually adjust to 25° for fine polishing;
[0035] Step 3, use a cleaning agent to clean the cut material to remove impurities and grease on the outer surface of the material and inside the water drop hole, then fix the cleaned material in the grinding chamber of the magnetic polishing machine by a clamp, pour the magnetic abrasive and polishing liquid into the grinding chamber, start the magnetic polishing machine, and let the magnetic abrasive start to move along the inner hole wall under the action of the magnetic field for grinding and polishing. The magnetic abrasive is ferrite abrasive with a particle size of 35μm, a magnetic field strength of 0.3T, and a polishing time of 25min. The polishing liquid is composed of the following materials by weight: 85% phosphoric acid and 15% water;
[0036] Step 4: pre-connect the fixture to the anode, and set a cathode in the grinding chamber. The anode and the cathode are electrically connected to a DC power supply with adjustable voltage and current. After the magnetic polisher grinds and polishes the material for 15 minutes, the DC power supply is controlled to work, and the material being grinded and polished is electrolytically polished for another 4 minutes. During the electrolytic polishing, ammonia is introduced into the polishing liquid at the same time. The ammonia flow rate is 0.3L / min, and the electrolytic current density is 7A / dm 2 , voltage 17V, control the temperature of the polishing liquid to be maintained at 50°, and stir the alumina and ferrite abrasives in the polishing liquid during the electrolysis process;
[0037] Step 5: Take out the electropolished material and clean it thoroughly by ultrasonic cleaning or high-pressure water washing to ensure that there is no residual magnetic abrasive and polishing liquid on the outer surface of the material and the water droplet holes inside the material. Blow dry the outer surface and inner holes of the material with compressed air, and apply anti-rust lubricating oil to the outer surface of the material and the internal water droplet holes.
[0038] Embodiment 3:
[0039] Step 1: Place the material to be processed on the grinding machine and grind multiple surfaces of the material to make it smooth without burrs or impurities, and fix the polished material on the workbench of the wire cutting machine;
[0040] Step 2, use the wire cutting machine to cut the material, cut a water drop-shaped hole groove inside the material, the cutting speed is 15mm / min, the current is 10A, the voltage is 100V, and during the cutting process, compressed coolant is used to spray to the cutting position to wash away the cutting residue at the cutting position. The coolant is ejected through the nozzle, and the number of nozzles is two, one of which sprays the coolant directly on the outer surface of the upper end of the material, and the coolant flows and enters the cutting groove to take away the cutting residue and cool the cutting position at the same time. The water jet pressure is 40MPa, and the angle between the other nozzle and the cutting metal wire is 1-45°, and the other nozzle is moved and adjusted by the XY axial movement mechanism, and the other nozzle follows the cutting The cutting metal wire is moved, and the inner wall of the cutting groove that has been cut by the metal wire is fluid-polished by the ejected high-speed fluid, and the residue on the inner wall of the cutting groove can also be washed away. The water jet pressure of the nozzle used for fluid-polishing the inner wall of the cutting groove is 400MPa, and the water jet flow rate is 20L / min. The high-speed fluid ejected from the nozzle for polishing the inner wall of the cutting groove contains corundum abrasive, and the particle size of the corundum abrasive is 120μm, and the abrasive concentration is 20%. The moving speed of the nozzle used for fluid-polishing the inner wall of the cutting groove is the same as the cutting speed, and the angle of the nozzle can be adjusted by an electric mechanism, first use an angle of 10° for preliminary rough polishing, and then gradually adjust to 45° for fine polishing;
[0041] Step 3, use a cleaning agent to clean the cut material to remove impurities and grease on the outer surface of the material and inside the water drop hole, then fix the cleaned material in the grinding chamber of the magnetic polishing machine by a clamp, pour the magnetic abrasive and polishing liquid into the grinding chamber, start the magnetic polishing machine, and let the magnetic abrasive start to move along the inner hole wall under the action of the magnetic field for grinding and polishing. The magnetic abrasive is ferrite abrasive with a particle size of 50 μm, a magnetic field strength of 0.5 T, and a polishing time of 30 min. The polishing liquid is composed of the following materials by weight: 85% phosphoric acid and 15% water;
[0042] Step 4: pre-connect the fixture to the anode, and set a cathode in the grinding chamber. The anode and the cathode are electrically connected to a DC power supply with adjustable voltage and current. After the magnetic polisher grinds and polishes the material for 20 minutes, the DC power supply is controlled to work, and the material being grinded and polished is electrolytically polished for another 5 minutes. During the electrolytic polishing, ammonia is introduced into the polishing liquid at the same time. The ammonia flow rate is 0.5L / min, and the electrolytic current density is 10A / dm 2 , voltage 20V, control the temperature of the polishing liquid to be maintained at 55°, and stir the alumina and ferrite abrasives in the polishing liquid during the electrolysis process;
[0043] Step 5: Take out the electropolished material and clean it thoroughly by ultrasonic cleaning or high-pressure water washing to ensure that there is no residual magnetic abrasive and polishing liquid on the outer surface of the material and the water droplet holes inside the material. Blow dry the outer surface and inner holes of the material with compressed air, and apply anti-rust lubricating oil to the outer surface of the material and the internal water droplet holes.
[0044] Comparative Example 1:
[0045] Step 1: Place the material to be processed on the grinding machine and grind multiple surfaces of the material to make it smooth without burrs or impurities, and fix the polished material on the workbench of the wire cutting machine;
[0046] Step 2: Use a wire cutting machine to cut the material and cut a water drop-shaped hole groove inside the material. The cutting speed is 10 mm / min, the current is 5 A, and the voltage is 30 V.
[0047] Step 3: After cutting, the cut material is cleaned with a cleaning agent to remove impurities and grease on the outer surface of the material and inside the water drop hole, and the inner wall of the cutting groove is polished by water jet polishing. The water jet pressure is 200 MPa, the water jet flow rate is 10 L / min, and the high-speed fluid ejected from the nozzle for polishing the inner wall of the cutting groove contains corundum abrasive, and the particle size of the corundum abrasive is 30 μm, and the abrasive concentration is 5%;
[0048] Step 4: After polishing, place the material in an ultrasonic cleaner for cleaning. After cleaning, use compressed air to dry the outer surface and inner holes of the material, and apply oil to the outer surface and inner water droplet holes of the material.
[0049] Comparative Example 2:
[0050] Step 1: Place the material to be processed on the grinding machine and grind multiple surfaces of the material to make it smooth without burrs or impurities, and fix the polished material on the workbench of the wire cutting machine;
[0051] Step 2: Use a wire cutting machine to cut the material and cut a water drop-shaped hole groove inside the material. The cutting speed is 10 mm / min, the current is 5 A, and the voltage is 30 V.
[0052] Step 3: After cutting, use a cleaning agent to clean the cut material to remove impurities and grease on the outer surface of the material and inside the water drop hole, and then fix the cleaned material in the grinding chamber of the magnetic polishing machine by a clamp, pour the magnetic abrasive and polishing liquid into the grinding chamber, start the magnetic polishing machine, and let the magnetic abrasive start to move along the inner hole wall under the action of the magnetic field for grinding and polishing. The magnetic abrasive is ferrite abrasive with a particle size of 20 μm, a magnetic field strength of 0.2 T, a polishing time of 20 min, and the polishing liquid is water;
[0053] Step 4: Take out the ground and polished material, and use ultrasonic cleaning or high-pressure water washing to thoroughly clean the material to ensure that there is no residual magnetic abrasive and polishing liquid on the outer surface of the material and the water droplet holes inside the material. Use compressed air to blow dry the outer surface and inner holes of the material, and apply oil to the outer surface and internal water droplet holes of the material.
[0054] Comparative Example 3:
[0055] Step 1: Place the material to be processed on the grinding machine and grind multiple surfaces of the material to make it smooth without burrs or impurities, and fix the polished material on the workbench of the wire cutting machine;
[0056] Step 2: Use a wire cutting machine to cut the material and cut a water drop-shaped hole groove inside the material. The cutting speed is 10 mm / min, the current is 5 A, and the voltage is 30 V.
[0057] Step 3: After cutting, use a cleaning agent to clean the cut material to remove impurities and grease on the outer surface of the material and inside the water drop hole, and then fix the cleaned material in the electrolysis equipment through a clamp, connect the clamp to the anode, and the anode and cathode are electrically connected to a DC power supply with adjustable voltage and current. The DC power supply is controlled to work, and the material being ground and polished is electrolytically polished for another 2 minutes. The electrolyte is composed of the following materials by weight: 85% phosphoric acid, 15% water, and the electrolysis current density is 5A / dm 2 , voltage 15V;
[0058] Step 4: Take out the electropolished material and clean it thoroughly by ultrasonic cleaning or high-pressure water washing to ensure that there is no residual magnetic abrasive and polishing liquid on the outer surface of the material and the water droplet holes inside the material. Blow dry the outer surface and inner holes of the material with compressed air, and apply oil to the outer surface and inner water droplet holes of the material.
[0059] Roughness of inner wall of water drop hole Water drop hole inner wall hardness Example 1 Ra 0.05μm HRC 71 Example 2 Ra 0.06μm HRC 70 Example 3 Ra 0.06μm HRC 71 Comparative Example 1 Ra 2.1μm HRC 45 Comparative Example 2 Ra 1.6μm HRC 50 Comparative Example 3 Ra 1.5μm HRC 48
[0060] By testing the roughness (ISO4287 / 4288: surface roughness test standard formulated by the International Organization for Standardization (ISO)) and hardness (ISO 6506-1: "Brinell hardness test for metal materials", which specifies the test method for Brinell hardness and is suitable for materials with medium hardness, such as steel, aluminum alloy, etc.) of the inner wall of the water drop hole processed by the processes of Examples 1-3 and Comparative Examples 1-3, the results are shown in the table above. The roughness and hardness of the inner wall of the water drop hole processed by Examples 1-3 of the present application are significantly better than those of Comparative Examples 1-3. It can be concluded that the inner wall of the water drop hole inside the material processed by the present application is smoother, and at the same time, the hardness is higher and the wear resistance is better.
[0061] The above shows and describes the basic principles and main features of the present application and the advantages of the present application. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or basic features of the present application; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present application is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present application, and any figure marks in the claims should not be regarded as limiting the claims involved.
[0062] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. Water drop line processing technology, characterized in that: The following steps are involved: Step 1: Place the material to be processed on the grinding machine and grind multiple surfaces of the material to make it smooth without burrs or impurities, and fix the polished material on the workbench of the wire cutting machine; Step 2: Use a wire cutting machine to cut the material and cut a water drop-shaped hole groove inside the material. The cutting speed is 10-15mm / min, the current is 5-10A, and the voltage is 30-100V. During the cutting process, compressed coolant is sprayed to the cutting area to wash away the cutting residue at the cutting area. Step 3: Use a cleaning agent to clean the cut material to remove impurities and grease on the outer surface of the material and inside the water drop hole, then fix the cleaned material in the grinding chamber of the magnetic polishing machine by a clamp, pour the magnetic abrasive and polishing liquid into the grinding chamber, start the magnetic polishing machine, and let the magnetic abrasive start to move along the inner hole wall under the action of the magnetic field for grinding and polishing; Step 4, pre-connect the fixture to the anode, and set a cathode in the grinding chamber, the anode and the cathode are electrically connected to a DC power supply with adjustable voltage and current, and after the magnetic polishing machine grinds and polishes the material for 10-20 minutes, the DC power supply is controlled to work, and the material being grinded and polished is electrolytically polished for another 2-5 minutes; Step 5: Take out the electropolished material and clean it thoroughly by ultrasonic cleaning or high-pressure water washing to ensure that there is no residual magnetic abrasive and polishing liquid on the outer surface of the material and the water droplet holes inside the material. Blow dry the outer surface and inner holes of the material with compressed air, and apply oil to the outer surface and inner water droplet holes of the material.
2. The water drop line processing technology according to claim 1, characterized in that: In the step 2, the coolant is ejected through a nozzle, and there are two nozzles, one of which sprays the coolant directly onto the outer surface of the upper end of the material, and the coolant flows into the cutting groove to take away the cutting residues and cool the cutting area at the same time. The water jet pressure is 10MPa-40MPa, and the angle between the other nozzle and the cutting metal wire is 1-45°, and the other nozzle is moved and adjusted by an XY axial moving mechanism. The other nozzle moves with the cutting metal wire and performs fluid polishing on the inner wall of the cutting groove that has been cut by the metal wire through the ejected high-speed fluid, and can also wash away the residues on the inner wall of the cutting groove.
3. The water drop line processing technology according to claim 2 is characterized in that: The water jet pressure of the nozzle used for fluid polishing the inner wall of the cutting groove is 200MPa-400MPa, the water jet flow rate is 10-20L / min, the high-speed fluid ejected from the nozzle for polishing the inner wall of the cutting groove contains corundum abrasive, and the particle size of the corundum abrasive is 30-120μm, and the abrasive concentration is 5%-20%.
4. The water drop line processing technology according to claim 3 is characterized in that: The moving speed of the nozzle used for fluid polishing the inner wall of the cutting groove is the same as the cutting speed, and the angle of the nozzle can be adjusted by an electric mechanism. First, an angle of 1°-10° is used for preliminary rough polishing, and then gradually adjusted to 15°-45° for fine polishing.
5. The water drop line processing technology according to claim 4, characterized in that: In step 3, the magnetic abrasive is ferrite abrasive, the particle size is 20-50 μm, the magnetic field strength is 0.2-0.5 T, the polishing time is 20-30 min, and the polishing liquid is composed of the following materials by weight: 85% phosphoric acid and 15% water.
6. The water drop line processing technology according to claim 5, characterized in that: The polishing liquid also contains aluminum oxide, and the concentration of aluminum oxide is 5-10g / L.
7. The water drop line processing technology according to claim 6, characterized in that: During the electrolytic polishing in step 4, ammonia gas is introduced into the polishing liquid at the same time, the ammonia gas flow rate is 0.2-0.5 L / min, and the electrolytic current density is 5-10 A / dm 2 , voltage 15-20V, control the temperature of the polishing liquid to maintain at 45-55°, and stir the alumina and ferrite abrasives in the polishing liquid during the electrolysis process.
8. The water drop line processing technology according to claim 7, characterized in that: The oil used for oiling the outer surface and the internal water droplet holes of the material in step 5 is rust-proof lubricating oil.
9. A water drop line processing device, characterized in that: It includes a clamp for clamping materials, a grinder for grinding multiple surfaces of materials, a wire cutting machine for cutting materials, a magnetic polishing machine for magnetic grinding of materials, an anode and a cathode for electrolyzing materials, and a DC power supply connected to the anode and the cathode.
