Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a mainboard, a shell, a light-transmitting part, a light-emitting device and a circuit wire, the mainboard is accommodated in the accommodating space of the shell, and at least part of the light-transmitting part is exposed out of the outer surface of the shell; the light-transmitting part comprises a first surface, the first surface is the surface, facing the main board, of the light-transmitting part, and the light-emitting device is fixed to the first surface and electrically connected with the main board through the circuit wire.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and in particular, relates to an electronic equipment. Background Art

[0002] In the related art, breathing lights and flash lights are set on electronic devices such as mobile phones. These lights are usually set by attaching a surface-mounted light emitting diode (LED) lamp to a bracket on the mainboard, and then opening a through hole on the back cover of the electronic device, and setting a diffusion film, a plastic lampshade and other appearance parts to guide the light source of the LED lamp out of the through hole.

[0003] Among them, the above-mentioned SMD LED lamp needs to be implemented based on an LED lamp circuit board. The LED lamp circuit board can be a printed circuit board (Printed Circuit Board, PCB) or a flexible circuit board attached to a reinforcement plate. The LED lamp circuit board also needs to occupy the size of the electronic device in the thickness direction.

[0004] Limited by factors such as structural space, the current lighting structure will take up more space in the thickness direction of the entire machine stack; at the same time, due to the limitation of the thickness of the whole machine, it is often impossible to leave effective space for heat dissipation or heat insulation design, so that the heat generated by the LED lamp is transferred to the motherboard, affecting the heat dissipation performance of the entire electronic equipment. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide an electronic device. By plating circuit traces on a transparent light-transmitting component, the circuit board of the light-emitting device can be omitted by utilizing the circuit traces on the transparent light-transmitting component. In addition, the light and heat emitted by the light-emitting device can penetrate the light-transmitting component and be directly transmitted to the outside of the electronic device, which can increase the distance between the light-emitting device and the main board in the electronic device and improve the heat dissipation performance of the entire electronic device.

[0006] An embodiment of the present application provides an electronic device, which includes: a mainboard, a housing, a light-transmitting member, a light-emitting device, and a circuit wiring;

[0007] The mainboard is accommodated in the accommodating space of the shell, and the light-transmitting member is at least partially exposed on the outer surface of the shell;

[0008] The light-transmitting member includes a first surface, which is a surface of the light-transmitting member facing the main board. The light-emitting device is fixed on the first surface and is electrically connected to the main board through the circuit wiring.

[0009] In an embodiment of the present application, the light-transmitting member is at least partially exposed from the outer surface of the shell. By arranging the light-emitting device on the first surface of the light-transmitting member, the light emitted by the light-emitting device can pass through the light-transmitting member and irradiate the outside of the electronic device, thereby realizing the combination of the light-transmitting member and the mounting plate of the light-emitting device. The space occupied by the mounting plate of the light-emitting device in the thickness direction of the electronic device can be omitted. Therefore, on the basis of a certain thickness of the electronic device, compared with the solution in the related art of attaching the LED lamp to the bracket of the main board through the LED lamp circuit board, the distance between the light-emitting device and the main board can be increased; in addition, the light and heat emitted by the light-emitting device can pass through the light-transmitting member and be directly transmitted to the outside of the electronic device, thereby improving the heat dissipation performance of the entire electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of the structure of an LED lamp solution in an electronic device in the related art;

[0011] Figure 2 This is one of the structural schematic diagrams of the lighting solution in the electronic device provided in the embodiment of the present application;

[0012] Figure 3a It is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0013] Figure 3b It is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0014] Figure 4 yes Figure 3b a perspective view of the electronic device shown;

[0015] Figure 5 yes Figure 3b A schematic diagram of the disassembled structure of the electronic device shown;

[0016] Figure 6 is along Figure 4 Cross-section view in the AA direction;

[0017] Figure 7 is along Figure 4 Cross-section along the middle BB direction;

[0018] Figure 8 This is the second structural schematic diagram of the lighting solution in the electronic device provided in the embodiment of the present application. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0020] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0021] In related technologies, such as Figure 1 As shown, the LED lamp 01 needs to be attached to the bracket 03 of the main board 04 through the LED lamp circuit board 02, and then a through hole 051 is opened on the back cover 05 of the electronic device, and a diffusion film, a plastic lampshade 06, a decorative ring 07 and other appearance parts are set to guide the light source of the LED lamp 01 out of the through hole 051. The propagation path of the light emitted by the LED lamp 01 to the outside of the electronic device is as follows: Figure 1 Shown by the blue line.

[0022] Due to factors such as structural space, the current LED lamp solution will occupy more space in the thickness direction of the stacked electronic equipment; at the same time, the LED lamp circuit board and LED lamp are inside the electronic equipment, and the thickness of the electronic equipment is limited, often unable to leave effective space for heat dissipation or heat insulation design, such as Figure 1 As shown by the red curve in the middle, the heat generated by the LED lamp will be transferred to the main board 04 through the LED lamp circuit board 02 and the bracket 03, which directly affects the lighting effect and power consumption performance of the LED lamp 01.

[0023] In the embodiment of the present application, by combining the light-transmitting member with the mounting plate of the light-emitting device, the space occupied by the mounting plate of the light-emitting device in the thickness direction of the electronic device can be omitted. Therefore, on the basis of a certain thickness of the electronic device, compared with the solution in the related art of attaching the LED lamp to the bracket of the main board through the LED lamp circuit board, the distance between the light-emitting device and the main board can be increased; in addition, the light and heat emitted by the light-emitting device can penetrate the light-transmitting member and be directly transmitted to the outside of the electronic device, thereby improving the heat dissipation performance of the entire electronic device.

[0024] The electronic device provided in the embodiment of the present application is described in detail below through specific embodiments and application scenarios in conjunction with the accompanying drawings.

[0025] See also Figure 2 , the electronic device provided in the embodiment of the present application includes: a mainboard 1, a housing 2, a light-transmitting member 3, a light-emitting device 4 and a circuit trace 311;

[0026] The mainboard 1 is received in the receiving space of the housing 2, and the light-transmitting member 3 is at least partially exposed on the outer surface of the housing 2;

[0027] The light-transmitting member 3 includes a first surface 31 . The first surface 31 is a surface of the light-transmitting member 3 facing the main board 1 . The light-emitting device 4 is fixed on the first surface 31 and is electrically connected to the main board 1 via a circuit trace 311 .

[0028] It should be noted that the electronic device provided in the embodiment of the present application may be a terminal, or may be other devices other than a terminal. Exemplarily, the electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a mobile Internet device (Mobile Internet Device, MID), an augmented reality (augmented reality, AR) / virtual reality (virtual reality, VR) device, a robot, a wearable device, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a netbook or a personal digital assistant (personal digital assistant, PDA), etc., and may also be a server, a network attached storage (Network Attached Storage, NAS), a personal computer (personal computer, PC), a television (television, TV), a teller machine or a self-service machine, etc., which is not specifically limited in the embodiment of the present application. And for the sake of convenience of explanation, the electronic device is an example of a mobile phone in the embodiment of the present application for example.

[0029] In some embodiments, the light-transmitting component 3 can be any transparent or translucent material layer, such as a glass light-transmitting component, a plastic light-transmitting component, a resin light-transmitting component, etc., which is not specifically limited here. For the sake of ease of explanation, the following embodiments of this application generally use glass light-transmitting components as an example for illustration.

[0030] In some embodiments, the circuit traces 311 may be plated on the first surface 31 of the light-transmitting member 3 by using any plating process such as vacuum plating, chemical plating, laser induced plasma etching metal deposition, etc.

[0031] Among them, vacuum plating includes vacuum evaporation, sputtering and ion plating. Vacuum evaporation is to heat the coating material to vaporize it and deposit it on the first surface 31 of the light-transmitting member 3; sputtering is to generate plasma by ionizing inert gas in vacuum, accelerate the positive ions in the plasma by electric field and bombard the target material so that it sputters on the first surface 31 of the light-transmitting member 3 to form a thin film; ion plating is to generate plasma by ionizing the vaporized target material, and accelerate the positively charged target metal ions to bombard the first surface 31 of the light-transmitting member 3. At this time, the deposition speed of the target particles needs to be greater than the stripping speed of bombarding the light-transmitting member 3 to form a metal film on the first surface 31 of the light-transmitting member 3.

[0032] In addition, chemical plating is to immerse the surface-activated light-transmitting member 3 in a metal solution, and deposit a metal thin film on the first surface 31 of the light-transmitting member 3 through chemical reduction of the metal; laser induced plasma etching metal deposition is to penetrate the transparent light-transmitting member 3 with a laser and act on the target material under the light-transmitting member 3, and the generated plasma etches the first surface 31 of the light-transmitting member 3 and causes the target material to be sputtered and deposited on the first surface 31 of the light-transmitting member 3 to form a metal thin film.

[0033] It should be noted that if Figure 3a As shown, when the circuit trace 311 is plated on the first surface 31 of the light-transmitting member 3 , the electronic device may further include a connector 5 to electrically connect the circuit trace 311 plated on the first surface 31 of the light-transmitting member 3 to the mainboard 1 via the connector 5 .

[0034] In some embodiments, the connector 5 may include at least one of a flexible printed circuit (FPC), a wire, a spring, a contact, and other connecting structures, which are not specifically limited here.

[0035] In some embodiments, the number of the connecting members 5 may be one or more, which is not specifically limited herein.

[0036] In some embodiments, the circuit trace 311 is electrically connected to the mainboard 1, and the power supply on the mainboard 1 can supply power to the circuit trace 311 through the connector 5, and / or the controller on the mainboard 1 provides a control signal to the circuit trace 311 through the connector 5, etc.

[0037] Of course, in other embodiments, the circuit trace 311 can be directly electrically connected to the mainboard 1 by any means such as wire welding, metal springs, flexible printed circuit (FPC) connection, etc., so that the mainboard 1 can supply power to or control the light-emitting device 4 through the circuit trace 311.

[0038] It is worth mentioning that compared with the circuit trace 311 in the form of wire welding, setting metal springs or flexible circuit boards, the circuit trace 311 plated on the first surface 31 can simultaneously fix the light-emitting device 4 on the first surface 31 and electrically connect the light-emitting device 4 to the circuit trace 311 by welding, which can improve the connection reliability between the light-emitting device 4 and the circuit trace 311.

[0039] For ease of explanation, in the following embodiments of the present application, an example is given in which the circuit trace 311 is plated on the first surface 31 of the light-transmitting member 3, and the electrical connection between the circuit trace 311 and the mainboard 1 is achieved through the connecting member 5, which does not constitute a specific limitation.

[0040] In some embodiments, the light emitting device 4 may be an LED lamp or other light emitting devices other than an LED lamp. For ease of description, in the embodiments of the present application, an example is given in which the light emitting device 4 is an LED lamp.

[0041] In some embodiments, the light emitting device 4 can be fixed on the first surface 31 of the light-transmitting member 3 by welding, and the light emitting device 4 can be electrically connected to the circuit trace 311 .

[0042] In order to realize functions such as control and power supply of the light-emitting device 4, it is necessary to set up a circuit structure corresponding to the control and power supply functions so that the mainboard 1 can control the light-emitting device 4 through the connector 5 and the circuit wiring 311 to realize the preset lighting effect.

[0043] In the embodiment of the present application, due to saving Figure 1 The thickness of the LED lamp circuit board 02 in the related art is equivalent to that when the space for lighting layout in the electronic device is limited, the distance between the light emitting device 4 and the main board 04 can be increased by at least 0.33 mm; in addition, the light emitting device 4 is arranged on the first surface 31 of the light-transmitting member 3 exposed on the surface of the electronic device, compared with Figure 1 In the related art, the LED lamp 01 is attached to the bracket 03 through the LED lamp circuit board 02, so there is no need to reserve a gap between the LED lamp 01 and the plastic lampshade 06. Therefore, when the space for lighting layout in the electronic device is limited, the distance between the light emitting device 4 and the main board 04 in the embodiment of the present application can be further increased. Figure 2 As shown by the red curve in the middle, when the distance between the light-emitting device 4 and the main board 04 is increased, when the heat generated by the light-emitting device 4 is transferred to the main board 04, a better heat-insulating effect can be produced based on the larger gap between the light-emitting device 4 and the main board 04, and even a heat-insulating structure can be added in the gap.

[0044] On the other hand, Figure 2As shown by the middle blue straight line, in the embodiment of the present application, the light emitting device 4 is arranged on the first surface 31 of the light-transmitting member 3 exposed on the surface of the electronic device, and the light emitted by the light emitting device 4 can directly pass through the light-transmitting member 3 to the outside of the electronic device, thereby improving the lighting effect of the electronic device. In addition, the light-transmitting member 3 directly contacts the external air of the electronic device, so that the heat generated by the light emitting device 4 can pass through the light-transmitting member 3 and directly pass to the outside of the electronic device, thereby increasing the heat dissipation performance of the light emitting device 4.

[0045] As an optional implementation, Figure 3a and Figure 3b As shown, the housing 2 includes a rear cover 21 , a first through hole 211 is formed on the rear cover 21 , and the light-transmitting member 3 closes a side of the first through hole 211 facing away from the main board 1 .

[0046] In some embodiments, when the circuit trace 311 is electrically connected to the mainboard 1 through the connector 5 , the connector 5 passes through the first through hole 211 , and one end of the connector is electrically connected to the circuit trace 311 , and the other end of the connector is electrically connected to the mainboard 1 .

[0047] In this embodiment, the light-transmitting member 3 is an appearance member located on the back cover 21 of the electronic device.

[0048] For example: Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, the mainboard 1 is fixed to the upper area of ​​the middle frame assembly 10 of the electronic device, and the rear camera assembly 20 is fixed to the bracket 6 and the mainboard bracket, and the mainboard 1, the bracket 6, the back cover 21, the decorative ring 7, and the camera lens 8 are stacked along the thickness direction of the electronic device, and the bracket 6 is provided with a third through hole 61, the back cover 21 is provided with a first through hole 211, and the decorative ring 7 is provided with a fourth through hole 72, so that the rear camera assembly 20 can collect external light penetrating the camera lens 8 through the third through hole 61, the first through hole 211 and the fourth through hole 72 to realize the camera function. At this time, a fifth through hole 71 is further opened on the decorative ring 7, and a sixth through hole 81 is opened on the camera lens 8, and the light-transmitting member 3 can be a glass light-transmitting member embedded in the sixth through hole 81. In this way, by attaching the light-emitting device 4 to the inner surface of the light-transmitting member 3, the light emitted by the light-emitting device 4 can directly penetrate the light-transmitting member 3 to the outside of the electronic device, and the connecting member 5 penetrates the fifth through hole 71, the sixth through hole 81 and the first through hole 211 to connect the circuit trace 311 on the inner surface of the light-transmitting member 3 with the relevant circuit on the main board 1.

[0049] Of course, the light-transmitting member 3 and the camera lens 8 may also be configured as an integral structure, which is not specifically limited here.

[0050] In some embodiments, the camera lens 8 can be used as a substrate layer, and an antenna can be made on the camera lens 8 by coating a radiator on the camera lens 8. In this way, the layout space of the antenna on the electronic device can be increased, and compared with the method of setting the antenna inside the electronic device, the problem of the antenna being blocked can be optimized.

[0051] In the above solution, the bracket 6 can be used to support, position and protect the mainboard 1, and can also be used to fix the camera.

[0052] In some embodiments, Figure 6 and Figure 7 As described above, the main board 1, the light emitting device 4 and the light-transmitting member 3 are stacked along the thickness direction of the electronic device.

[0053] It is worth mentioning that in the related art, in order to realize the circuit structure of control, power supply, etc. of LED lamps, the circuit structure is set on a circuit board, such as a PCB hard board or a flexible circuit board with a reinforcement plate, and then the PCB hard board or the flexible circuit board with a reinforcement plate is fixed to a bracket on the main board, so as to use the bracket to separate the chip LED lamp and the main board by a certain distance. However, this structure occupies more space in the thickness direction of the electronic device. For example, the LED lamp circuit board needs to occupy an additional thickness of approximately 0.33mm, and the chip LED lamp and the main board are both housed inside the electronic device. Due to the limited thickness of the electronic device, the distance between the chip LED lamp and the main board will be smaller, making it difficult to leave effective space for heat dissipation or heat insulation design.

[0054] In the embodiment of the present application, Figure 6 and Figure 7As shown, in order to realize the circuit structure of control and power supply of the light-emitting device 4, the circuit structure corresponding to the control and power supply functions is plated on the first surface 31 of the light-transmitting member 3 in the form of circuit routing. Compared with the related art, it can be seen that in the embodiment of the present application, the first aspect can save the space occupied by the LED lamp circuit board in the thickness direction of the electronic device, and the space can be used to increase the distance between the light-emitting device 4 and the main board 1, so that effective space can be reserved for heat dissipation or heat insulation design. On the second aspect, in the embodiment of the present application, the light-emitting device 4 is directly arranged on the first surface 31 of the light-transmitting member 3, so that the gap originally located between the lampshade and the LED lamp can also be used to increase the distance between the light-emitting device 4 and the main board 1, so that more effective space can be reserved for heat dissipation or heat insulation design. On the third aspect, in the embodiment of the present application, the light-emitting device 4 is directly arranged on the first surface 31 of the light-transmitting member 3, so that the light emitted by the light-emitting device 4 can directly penetrate the light-transmitting member 3 and be transmitted to the outside of the electronic device. Compared with the method of setting the appearance parts such as the diffusion film and the plastic lampshade above the LED lamp in the related art, the efficiency of the light emitted by the light-emitting device 4 penetrating the light-transmitting member 3 can be improved, thereby improving the lighting effect of the electronic device.

[0055] In some embodiments, Figure 3a As shown, the decorative ring 7 includes a first annular structure 74 and a second annular structure 75;

[0056] The first annular structure 74 is fixed on the outer surface of the rear cover 21 , and the first annular structure 74 surrounds the outer circumference of the first through hole 211 ;

[0057] The first annular structure 74 and the second annular structure 75 are fixedly arranged, and the second annular structure 75 extends from the outer circumference of the first annular structure 74 in a direction away from the main board 1;

[0058] The outer circumference of the light-transmitting member 3 is fixed to a surface of the first annular structure 74 facing away from the main board 1 , and the second annular structure 75 surrounds the outer circumference of the light-transmitting member 3 .

[0059] In this embodiment, the cross section of the decorative ring 7 is an L-shaped structure. Thus, when the light-transmitting member 3 is assembled in the decorative ring 7, on the one hand, the light-transmitting member 3 can be more firmly limited in the decorative ring 7; on the other hand, since the light-transmitting member 3 is fixed to the side of the first annular structure 74 that faces away from the main board 1, and the first annular structure 74 is fixed to the outer surface of the back cover 21, and the first annular structure 74 has a certain thickness, the distance between the plane where the light-transmitting member 3 is located and the main board 1 is greater than the distance between the plane where the back cover 21 is located and the main board 1, thereby increasing the distance between the light-emitting device 4 and the main board 1, forming a larger heat-insulating space between the main board 1 and the light-emitting device 4, and reducing the heat dissipation effect between the main board 1 and the light-emitting device 4. Moreover, the light-transmitting member 3 is in direct contact with the external air of the electronic device, and the heat emitted by the light-emitting device 4 and even the main board 1 can be diffused to the outside of the electronic device through the light-transmitting member 3.

[0060] In the above embodiments, the light-transmitting member 3 is disposed on the back cover 21 of the electronic device as an example for illustration. In addition, the light-transmitting member 3 may also be disposed on other parts of the electronic device, such as a frame or even a peripheral area of ​​a display screen.

[0061] In other embodiments, the light emitting device 4 and the light-transmitting member 3 may be stacked along the length or width direction of the electronic device.

[0062] As an optional implementation, Figure 8 As shown, the housing 2 includes a first frame 22 , a second through hole 221 is formed on the first frame 22 , and the light-transmitting member 3 is embedded in the second through hole 221 .

[0063] In some embodiments, when the electronic device further includes a connector 5 , one end of the connector 5 extends into the second through hole 221 to be electrically connected to the circuit trace 311 , and the other end of the connector 5 extends outside the second through hole 221 to be electrically connected to the mainboard 1 .

[0064] Among them, the light-transmitting member 3 is embedded in the second through hole 221, and the second through hole 221 passes through the first frame 22, so that the third surface 32 of the light-transmitting member 3 can be exposed through the opening end of the second through hole 221 facing the outside of the electronic device, wherein the third surface 32 is the outer surface of the light-transmitting member 3 opposite to the first surface 31.

[0065] In some implementations, the first frame 22 is located at the top of the electronic device.

[0066] In this way, light can be emitted from the top of the electronic device.

[0067] Of course, in addition to the top frame of the electronic device, the first frame 22 may also be a frame at other locations such as a side frame of the electronic device, which is not specifically limited here.

[0068] In this embodiment, the space occupied by the LED circuit board can be saved by plating the circuit trace 311 on the inner surface of the exposed light-transmitting member 3 to increase the distance between the light-emitting device 4 and the main board 1, thereby leaving more space for heat insulation / heat dissipation design, and the lighting effect of the electronic device can also be improved. In addition, when the light-emitting device 4 and the light-transmitting member 3 are stacked along the length or width direction of the electronic device, the light-emitting device 4 and the light-transmitting member 3 are located on one side of the main board 1. At this time, the area on the main board 1 that can absorb the heat generated by the light-emitting device 4 is extremely small, thereby improving the heat dissipation performance of the main board.

[0069] In some embodiments, Figure 8 As shown, the first frame 22 includes: a non-metallic portion 222 and a metal portion 223, the metal portion 223 is at least partially embedded in the non-metallic portion 222, and the second through hole 221 passes through the non-metallic portion 222 and the metal portion 223;

[0070] The light-transmitting member 3 is embedded in a first area of ​​the second through hole 221 , and the first area is the area where the non-metallic portion 222 is located.

[0071] It should be noted that the metal part 223 is at least partially embedded in the non-metal part 222, and the light-transmitting member 3 is embedded in the area where the non-metal part 222 of the second through hole 221 is located. At this time, there is a gap 30 between the light-transmitting member 3 and the metal part 223 to arrange the light-emitting device 4 in the gap.

[0072] In addition, the back cover 21 and the display screen 40 of the electronic device are respectively arranged on two opposite sides of the first frame 22 .

[0073] In some embodiments, when the connector 5 passes through the second through hole 221 , it needs to be spaced apart from the metal portion 223 to prevent the metal portion 223 from affecting the electrical signal transmitted on the connector 5 .

[0074] Of course, when the metal part 223 has no other electrical functions and is suspended, the metal part 223 has little effect on the electrical signal transmitted on the connector 5 . In this case, the connector 5 and the metal part 223 are not restricted to be spaced apart from each other.

[0075] In this embodiment, the periphery of the light-transmitting member 3 can be fixedly connected to the inner wall of the second through hole 221 on the non-metallic portion 222, and the insulating properties of the non-metallic portion 222 can be used to isolate the electrical connection between the circuit trace 311 on the light-transmitting member 3 and the metal portion 223.

[0076] In some embodiments, Figure 8As shown, the non-metallic part 222 can be used to facilitate shaping and fixed connection with the light-transmitting member 3, and a limiting groove 2221 can be opened on the inner wall of the second through hole 221 located on the non-metallic part 222, and the peripheral edge of the light-transmitting member 3 can be fixed in the limiting groove 2221 to increase the assembly firmness of the light-transmitting member 3.

[0077] In some embodiments, Figure 8 As shown, the connecting member 5 includes a gold-plated sheet 51 and a metal spring sheet 52;

[0078] The gold-plated sheet 51 includes a first connection portion 511 and a second connection portion 512. The first end of the first connection portion 511 passes through the second through hole 221 and is electrically connected to the circuit trace 311. The second connection portion 512 is located on a side of the metal portion 223 that faces away from the light-transmitting member 3, and the second end of the first connection portion 511 is electrically connected to the second connection portion 512.

[0079] The first end of the metal spring 52 is fixed on the mainboard 1 and electrically connected to the mainboard 1 , and the second end of the metal spring 52 abuts against the second connection portion 512 .

[0080] In some embodiments, the first connection portion 511 and the second connection portion 512 are spaced apart from the metal portion 223 to prevent the metal portion 223 from affecting the electrical signals transmitted on the first connection portion 511 and the second connection portion 512 .

[0081] Of course, when the metal part 223 has no other electrical functions and is suspended, the metal part 223 has little effect on the electrical signals transmitted on the first connection part 511 and the second connection part 512. At this time, it is not limited to setting the first connection part 511 and the second connection part 512 spaced apart from the metal part 223.

[0082] In this embodiment, the first connecting portion 511 is first electrically connected to the circuit trace 311 located on the side of the metal portion 223 facing away from the mainboard 1, and the first connecting portion 511 passes through the second through hole 221 to be electrically connected to the second connecting portion 512 located on the side of the metal portion 223 facing the mainboard. In this way, the metal spring sheet 52 fixed on the mainboard 1 can be abutted against the second connecting portion 512 on the gold-plated sheet 51 located on the side of the metal portion 223 facing the mainboard, so as to finally realize the electrical connection relationship between the circuit trace 311 and the mainboard 1.

[0083] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0084] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: include: Mainboard, housing, light-transmitting parts, light-emitting devices and circuit wiring; The mainboard is accommodated in the accommodating space of the shell, and the light-transmitting member is at least partially exposed on the outer surface of the shell; The light-transmitting member includes a first surface, which is a surface of the light-transmitting member facing the main board. The light-emitting device is fixed on the first surface and is electrically connected to the main board through the circuit wiring.

2. The electronic device according to claim 1, characterized in that: The circuit traces are plated on the first surface of the light-transmitting element; The electronic device further comprises a connector, wherein the connector is electrically connected between the circuit trace and the mainboard.

3. The electronic device according to claim 1 or 2, characterized in that: The housing comprises a rear cover, a first through hole is formed on the rear cover, and the light-transmitting member seals a side of the first through hole which faces away from the main board.

4. The electronic device according to claim 3, characterized in that: The main board, the light emitting device and the light transmitting member are stacked along the thickness direction of the electronic device.

5. The electronic device according to claim 3, characterized in that: Also includes: Decorative ring; The decorative ring is fixed on the outer periphery of the first through hole and surrounds the light-transmitting member.

6. The electronic device according to claim 5, characterized in that: The decorative ring includes a first annular structure and a second annular structure; The first annular structure is fixed on the outer surface of the rear cover, and the first annular structure surrounds the outer circumference of the first through hole; The first annular structure and the second annular structure are fixedly arranged, and the second annular structure extends from the outer circumference of the first annular structure in a direction away from the main board; The outer periphery of the light-transmitting element is fixed to a surface of the first annular structure which faces away from the main board, and the second annular structure surrounds the outer periphery of the light-transmitting element.

7. The electronic device according to claim 1 or 2, characterized in that: The housing comprises a first frame, a second through hole is formed on the first frame, and the light-transmitting member is embedded in the second through hole.

8. The electronic device according to claim 7, characterized in that: In the case where the electronic device further includes a connector, one end of the connector extends into the second through hole to be electrically connected to the circuit trace, and the other end of the connector extends out of the second through hole to be electrically connected to the mainboard.

9. The electronic device according to claim 7, characterized in that: The first frame includes: a non-metallic part and a metal part, the metal part is at least partially embedded in the non-metallic part, and the second through hole passes through the non-metallic part and the metal part; The light-transmitting member is embedded in a first area of ​​the second through hole, and the first area is an area where the non-metallic part is located.

10. The electronic device according to claim 8, characterized in that: The connecting piece includes a gold-plated sheet and a metal spring; The gold-plated sheet includes a first connecting portion and a second connecting portion, wherein a first end of the first connecting portion passes through the second through hole and is electrically connected to the circuit trace, the second connecting portion is located on a side of the metal portion facing away from the light-transmitting member, and a second end of the first connecting portion is electrically connected to the second connecting portion; The first end of the metal spring is fixed on the mainboard and electrically connected to the mainboard, and the second end of the metal spring is in contact with the second connecting portion.

11. The electronic device according to claim 7, characterized in that: The first frame is located at the top of the electronic device.

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