Flexible circuit board film pasting windowing method
By using a drilling machine and a load-bearing membrane to assist laser cutting during the window opening process of the flexible circuit board, the problem of pad position size shift is solved, the product pass rate and production efficiency are improved, and the quality and delivery of customers are met. Require.
Patent Information
- Application Number
- CN202411668223.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2024-12-27
AI Technical Summary
The problem of the offset of the pad position and dimensions of the existing flexible circuit board during the window opening process leads to a low pass rate and a high scrap rate, which cannot meet customers' needs for product quality and delivery time.
Use a drilling machine to drill positioning holes on the protective film, and use a load-bearing membrane and heating tools to assist laser cutting equipment to accurately open the windows to ensure the alignment accuracy of the pad position, and improve the load-bearing membrane through high-precision drilling machines and rectangular structures. Cutting accuracy.
It effectively improves the problem of pad deviation of small windows and thin line products, improves production progress and product yield rate, and meets customer quality and delivery needs.
Smart Images
Figure CN119212247A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of flexible circuit board processing, and in particular to a film-sticking and window-opening method for a flexible circuit board. Background Art
[0002] With the changes of the times, the continuous development and progress of science and technology, the design requirements of equipment in different fields are constantly upgraded, the requirements for flexible circuit boards are getting higher and higher, the circuit design is getting finer and finer, the window design is getting smaller and smaller, the use space is constantly compressed, and the convenience of products in use is improved. At present, the normal laser window opening of the protective film is: directly laser the protective film window, clean and stick it to the etched circuit. The large window opening does not have such high requirements for the window position, and it can be directly aligned manually. Now the products are getting longer and longer, and the circuits are getting thinner and thinner. The product size is currently about 1.4mm, the circuit is about 0.05mm, and the minimum pad window requirement has reached 0.25mm±0.1mm. There are many manual alignment deviations after laser, the pad position size offset is unstable, and it is difficult to check. The qualified rate is very low and the scrap rate is very high. If the deviation is not discovered in time, it will also lead to poor welding of customers. This kind of product is usually used in medical products. Poor welding is likely to cause medical accidents, etc. The low qualified rate seriously affects the production cost, delays the delivery time of customers, and cannot meet the needs of customers, which brings great quality risks to customers. Summary of the invention
[0003] In order to solve the problem of dimensional deviation between the pad position and the window position of the protective film after the flexible board is pasted with the protective film in the prior art, the present invention provides a film pasting and window opening method for a flexible circuit board with accurate alignment.
[0004] The present invention provides a method for laminating a film and opening a window of a flexible circuit board, comprising the following steps: Step S1: using a drilling machine to drill positioning holes on the protective film corresponding to the positioning points on the flexible circuit board; Step S2: attaching the protective film with the positioning holes drilled on the flexible circuit board; Step S3: using a heating tool to falsely stick the two end edges of the protective film to the two end edge waste positions of the flexible circuit board; Step S4: inserting a carrier film between the protective film and the flexible circuit board and at a position where a window needs to be opened on the protective film; Step S5: placing the flexible circuit board and the protective film on a laser cutting device, and cutting windows corresponding to the pad positions on the flexible circuit board; Step S6: After the laser cutting is completed, the waste material after the window opening is removed by using a dust-sticking roller; Step S7: Pull out the carrier film and completely adhere the protective film to the flexible circuit board.
[0005] As a further improvement of the present invention, the carrier film is a rectangular structure.
[0006] As a further improvement of the present invention, the thickness of the carrier film is 0.1 mm-0.2 mm.
[0007] As a further improvement of the present invention, in step S5, the laser cutting equipment performs window cutting according to the positioning points etched on the flexible circuit board.
[0008] As a further improvement of the present invention, when the flexible circuit board is provided with a double-sided pad, after one side of the flexible circuit board is adhered to the protective film, steps S1 to S7 are repeated to adhere the other side of the flexible circuit board to another protective film.
[0009] As a further improvement of the present invention, the protective film includes a PI layer and an AD adhesive layer.
[0010] As a further improvement of the present invention, the heating tool is an electric soldering iron.
[0011] As a further improvement of the present invention, the drilling machine is a high-precision drilling machine.
[0012] The beneficial effects of the present invention are as follows: the present invention can effectively improve the problem of manual alignment pad deviation of small window openings, thin circuits, and large-size products, can effectively improve production progress, improve product yield, and meet customer needs at the same time. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a process flow chart of a film-sticking and window-opening method for a flexible circuit board of the present invention; Figure 2 It is a structural schematic diagram of a carrier film in a film-laminating and window-opening method for a flexible circuit board of the present invention; Figure 3 It is a plan view of an embodiment of a protective film window opening method in a film-applying and window opening method for a flexible circuit board of the present invention; Figure 4 It is a plan view of another embodiment of protective film window opening in a film-laminating and window opening method for a flexible circuit board of the present invention.
[0014] Figure numerals: 1-protective film; 11-opening window; 12-positioning hole; 2-carrying film. DETAILED DESCRIPTION
[0015] In the description of the present invention, it is necessary to understand that if there are descriptions involving orientation, such as orientations or positional relationships indicated by up, down, front, back, left, and right, the orientation description may be based on the orientation or positional relationships shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.
[0016] In the description of the present invention, if there is a description of quantity, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of first or second, it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0017] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.
[0018] like Figures 1 to 4 As shown, the present invention discloses a film-laminating and window-opening method for a flexible circuit board, comprising the following steps: Step S1: using a drilling machine to drill positioning holes 12 on the protective film 1 corresponding to the positioning points on the flexible circuit board; Step S2: attaching the protective film 1 with the positioning holes 12 drilled therein to the flexible circuit board; Step S3: Use a heating tool to stick the two end edges of the protective film 1 to the two end edge waste positions of the flexible circuit board together, and only fix the two ends to prevent movement. At this time, the protective film 1 and the circuit are separated; Step S4: inserting a carrier film 2 between the protective film 1 and the flexible circuit board and at a position where the window 11 is required to be opened on the protective film; Step S5: placing the flexible circuit board and the protective film 1 on a laser cutting device, and cutting a window 11 corresponding to the pad position on the flexible circuit board. The laser cutting device cuts the window 11 according to the positioning points etched on the flexible circuit board, so as to ensure that the window 11 is accurately aligned with the pad position; Step S6: After the laser cutting is completed, the waste material after the window 11 is removed by using masking paper and a dust-sticking roller; Step S7: Pull out the carrier film 2, and completely stick the protective film 1 and the flexible circuit board together through a subsequent film sticking process.
[0019] In the present invention, the carrier film 2 is a rectangular structure, and the thickness of the carrier film 2 is 0.1mm-0.2mm. The carrier film 2 can prevent the laser cutting equipment from cutting the circuit and substrate of the flexible circuit board during cutting, thereby avoiding damage to the finished circuit board.
[0020] In the present invention, when the flexible circuit board is provided with double-sided pads, after one side of the flexible circuit board is attached to the protective film 1 , steps S1 to S7 are repeated to attach the other side of the flexible circuit board to another protective film 1 .
[0021] In the present invention, the protective film 1 includes a PI layer and an AD adhesive layer.
[0022] In the present invention, the heating tool is an electric soldering iron, which is easy to operate and can quickly attach the two ends of the protective film to the flexible circuit board.
[0023] In the present invention, the drilling machine is a high-precision drilling machine to ensure the accuracy of the positioning hole 12.
[0024] The present invention can effectively improve the problem of manual alignment pad deviation of small openings 11, thin circuits, and large-size products, and can effectively improve production progress, improve product yield, and meet customer needs.
[0025] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.
Claims
1. A method for laminating and opening windows of a flexible circuit board, characterized in that: The following steps are involved: Step S1: using a drilling machine to drill positioning holes on the protective film corresponding to the positioning points on the flexible circuit board; Step S2: attaching the protective film with the positioning holes drilled on the flexible circuit board; Step S3: using a heating tool to falsely stick the two end edges of the protective film to the two end edge waste positions of the flexible circuit board; Step S4: inserting a carrier film between the protective film and the flexible circuit board and at a position where a window needs to be opened on the protective film; Step S5: placing the flexible circuit board and the protective film on a laser cutting device, and cutting windows corresponding to the pad positions on the flexible circuit board; Step S6: After the laser cutting is completed, the waste material after the window opening is removed by using a dust-sticking roller; Step S7: Pull out the carrier film and completely adhere the protective film to the flexible circuit board.
2. The method for laminating and opening windows of a flexible circuit board according to claim 1, characterized in that: The carrier film is a rectangular structure.
3. The method for laminating and opening windows of a flexible circuit board according to claim 2, characterized in that: The thickness of the carrier film is 0.1 mm-0.2 mm.
4. The method for laminating and opening windows of a flexible circuit board according to claim 1, characterized in that: In step S5, the laser cutting device performs window cutting according to the positioning points etched on the flexible circuit board.
5. The method for laminating and opening windows of a flexible circuit board according to claim 1, characterized in that: When the flexible circuit board is provided with double-sided pads, after one side of the flexible circuit board is bonded to the protective film, steps S1 to S7 are repeated to bond the other side of the flexible circuit board to another protective film.
6. The method for laminating and opening windows of a flexible circuit board according to claim 1, characterized in that: The protective film includes a PI layer and an AD adhesive layer.
7. The method for laminating and opening windows of a flexible circuit board according to claim 1, characterized in that: The heating tool is an electric soldering iron.
8. The method for laminating and opening windows of a flexible circuit board according to claim 1, characterized in that: The drilling machine is a high-precision drilling machine.