Double-layer manufacturing process and equipment for FDC flexible die cutting circuit board

Abstract

The invention discloses a double-layer manufacturing process and equipment for an FDC flexible die-cutting circuit board, and relates to the technical field of flexible circuit boards, and the double-layer manufacturing process for the FDC flexible die-cutting circuit board comprises the steps: S1, processing a first copper foil layer: pasting a first recovery film on the first copper foil layer, and carrying out the first circular knife cutting of the first copper foil layer; s2, pasting a first PI film: pasting the first PI film on one side of the first copper foil layer; s3, processing a second PI film: pasting a second recovery film on the second PI film, performing secondary circular knife cutting on the second PI film, and pasting the second PI film on one side, deviating from the first PI film, of the first copper foil layer; s4, processing a second copper foil layer: pasting a third recovery film on the second copper foil layer, and carrying out third circular knife cutting on the second copper foil layer; and S5, processing a third PI film: pasting a fourth recovery film on the third PI film, carrying out fourth circular knife cutting on the third PI film, and pasting the third PI film on one side, deviating from the second PI film, of the second copper foil layer. According to the technical scheme provided by the invention, the production and manufacturing cost of the FPC flexible circuit board is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible circuit boards, and in particular to a double-layer manufacturing process and equipment for an FDC flexible die-cut circuit board. Background Art

[0002] Traditional flexible circuit boards are first etched with an etching solution in the designated area of ​​the flexible circuit board. During etching, the copper foil in the FPC will react chemically with the etching solution, thereby generating chemical waste. If it is discharged directly, it will cause heavy metal pollution and cause the metal in the chemical waste to be wasted. However, if the metal in the chemical waste is recovered, it will cost a high cost to recover and treat the pollution emissions, thereby increasing the production cost of the FPC. Summary of the invention

[0003] The main purpose of the present invention is to propose a double-layer manufacturing process and equipment for FDC flexible die-cut circuit boards, aiming to reduce the production cost of FPC.

[0004] To achieve the above object, the double-layer manufacturing process of the FDC flexible die-cut circuit board proposed in the present invention comprises the following steps:

[0005] S1: processing the first copper foil layer: pasting a first recycling film onto the first copper foil layer, performing a first circular knife cutting on the first copper foil layer, and tearing off the first recycling film to recover waste generated by the first circular knife cutting;

[0006] S2: Pasting the first PI film: pasting the first PI film on one side of the first copper foil layer;

[0007] S3: processing the second PI film: pasting a second recycling film onto the second PI film, performing a second round knife cutting on the second PI film, tearing off the second recycling film to recover waste generated by the second round knife cutting, and pasting the second PI film on the side of the first copper foil layer away from the first PI film;

[0008] S4: processing the second copper foil layer: pasting a third recycling film onto the second copper foil layer, performing a third circular knife cutting on the second copper foil layer, tearing off the third recycling film to recover waste generated by the third circular knife cutting, and pasting the second copper foil layer to the side of the second PI film away from the first copper foil layer;

[0009] S5: Processing the third PI film: pasting a fourth recycling film onto the third PI film, performing a fourth circular knife cutting on the third PI film, tearing off the fourth recycling film to recover waste generated by the fourth circular knife cutting, and pasting the third PI film to the side of the second copper foil layer away from the second PI film to process it into a flexible circuit board.

[0010] In one embodiment, the step S1 comprises:

[0011] S11 first protective film: attaching a first protective film to one side of the first copper foil layer;

[0012] S12 first round knife cutting: performing a first round knife cutting on the first copper foil layer;

[0013] S13 pasting a first recovery film: pasting the first recovery film to a side of the first copper foil layer away from the first protective film;

[0014] S14: first waste recycling: tearing off the first recycling film to recycle the waste generated by the first circular knife cutting;

[0015] The step S2 further comprises: after pasting the first PI film on one side of the first copper foil layer, tearing off the first protective film;

[0016] The step S4 comprises:

[0017] S41 pasting a third recycling film: pasting the third recycling film to a side of the second copper foil layer facing the second PI film;

[0018] S42 third round knife cutting: performing a third round knife cutting on the second copper foil layer;

[0019] S43 pasting the second protective film: pasting the second protective film to the side of the second copper foil layer away from the third recycling film:

[0020] S44: third waste recycling: tearing off the third recycling film to recycle the waste generated by the third circular knife cutting;

[0021] S45 pasting the second copper foil layer: first pasting the second copper foil layer on the side of the second PI film away from the first copper foil layer, and then tearing off the second protective film.

[0022] In one embodiment, the step S13 includes: firstly pasting a fifth recycling film to one side of the first recycling film, performing a fifth round knife cutting on the first recycling film, and tearing off the fifth recycling film to recover the waste generated by the fifth round knife cutting; and then pasting the first recycling film to the side of the first copper foil layer away from the first protective film; and / or

[0023] The step 41 includes: pasting a sixth recycling film to one side of the third recycling film, performing a sixth circular knife cutting on the third recycling film, tearing off the sixth recycling film to recover waste generated by the sixth circular knife cutting; and then pasting the third recycling film to the side of the second copper foil layer facing the second PI film.

[0024] In one embodiment, the step S14 further includes: after the first recycling film is torn off, leveling the first copper foil layer by a leveling roller.

[0025] In one embodiment, the step S2 further comprises: when the first PI film is attached to the side of the first copper foil layer away from the first protective film, heating the first PI film; and / or

[0026] The step S3 further comprises: when the processed second recycling film and the second PI film are pasted to the side of the first copper foil layer away from the first PI film, heating the second PI film; and / or

[0027] The step S5 further includes: when the processed third PI film is pasted to the side of the second copper foil layer away from the second PI film, heating the third PI film.

[0028] In one embodiment, the step S2 further includes: a first release film is also provided on the first PI film, the first release film is firstly torn off, and then the first PI film is adhered to the side of the first copper foil layer away from the first protective film; and / or

[0029] The step S3 further includes: a second release film is also provided on the second PI film, the second release film is firstly torn off, and then the processed second recycling film and the second PI film are pasted on the side of the first copper foil layer away from the first PI film;

[0030] The step S5 further includes: a third release film is also provided on the third PI film, the third release film is firstly torn off, and then the processed third PI film is adhered to the side of the second copper foil layer away from the second PI film.

[0031] In one embodiment, the step S2 further includes: when the first PI film is pasted to the side of the first copper foil layer away from the first protective film, a third protective film is pasted to the side away from the first PI film.

[0032] The present invention also provides a double-layer manufacturing device for FDC flexible die-cutting circuit boards, comprising:

[0033] frame;

[0034] A recovery membrane assembly, wherein the recovery membrane assembly comprises a first recovery membrane assembly, a second recovery membrane assembly, a third recovery membrane assembly and a fourth recovery membrane assembly, all of which are installed on the frame;

[0035] A PI film assembly, wherein the PI film assembly comprises a first PI film assembly, a second PI film assembly and a third PI film assembly, all of which are installed on the frame;

[0036] A circular knife assembly, comprising a first circular knife assembly, a second circular knife assembly, a third circular knife assembly and a fourth circular knife assembly, all of which are mounted on the frame; and

[0037] A film tearing assembly, the film tearing assembly comprising a first recycling film tearing assembly, a second recycling film tearing assembly, a third recycling film tearing assembly and a fourth recycling film tearing assembly, all of which are installed on the frame;

[0038] A transport assembly is used to transport the first copper foil layer to the first recovery film assembly, the first circular knife assembly, the first recovery film tearing assembly, the first PI film assembly and the second PI film assembly in sequence, and to transport the second copper foil layer to the third recovery film assembly, the third circular knife assembly, the third film tearing assembly and the second PI film assembly in sequence.

[0039] The double-layer manufacturing equipment of the FDC flexible die-cut circuit board also includes a leveling drive and a leveling roller both installed on the frame, the leveling drive is transmission-connected to the leveling roller, and the leveling roller is used to level the first copper foil layer and / or the second copper foil layer after cutting.

[0040] In one embodiment, the double-layer manufacturing equipment of the FDC flexible die-cut circuit board also includes a first heating roller, a second heating roller and a third heating roller, all of which are installed on the frame, the first heating roller is used to heat the first copper foil layer and the first PI film, the second heating roller is used to heat the first PI film, the first copper foil layer and the second PI film, and the third heating roller is used to heat the first PI film, the first copper foil layer, the second PI film, the second copper foil layer and the third PI film.

[0041] In the double-layer manufacturing process of the FDC flexible die-cut circuit board in the technical solution of the present invention, a first copper foil layer, a second PI film, a second copper foil layer and a third PI film are cut by a circular knife, and then the waste generated after the circular knife cutting is recovered by a first recovery film, a second recovery film, a third recovery film and a fourth recovery film. Compared with the chemical etching method in the prior art, the circular knife cutting method in the technical solution of the present application reduces the copper recovery cost, reduces the pollution to the environment, realizes the green and environmental protection of the FDC preparation process, and also reduces the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0043] Figure 1 A flow chart of a double-layer manufacturing process of an FDC flexible die-cut circuit board provided by the present invention;

[0044] Figure 2 It is the structural diagram of FDC;

[0045] Figure 3 A schematic diagram of the structure of a double-layer manufacturing device for an FDC flexible die-cut circuit board provided by the present invention;

[0046] Figure 4 for Figure 3 A partial enlarged view of the middle A;

[0047] Figure 5 for Figure 3 A partial enlarged view of point B in the middle;

[0048] Figure 6 for Figure 3 A partial enlarged view of point C in the middle;

[0049] Figure 7 for Figure 3 A partial enlarged view of point D in the middle.

[0050] Description of Figure Numbers:

[0051] 11. first copper foil layer; 12. second copper foil layer;

[0052] 211, first recovery film; 212, first recovery roller; 213, first recovery film tearing roller; 221, second recovery film; 222, second recovery roller; 223, second recovery film tearing roller; 231, third recovery film; 232, third recovery roller; 233, third recovery film tearing roller; 241, fourth recovery film; 242, fourth recovery roller; 243, fourth recovery film tearing roller; 251, fifth recovery film; 252, fifth recovery roller; 253, fifth recovery film tearing roller; 261, sixth recovery film; 262, sixth recovery roller; 263, sixth recovery film tearing roller;

[0053] 31. first circular knife roller; 32. second circular knife roller; 33. third circular knife roller; 34. fourth circular knife roller; 35. fifth circular knife roller; 36. sixth circular knife roller; 37. seventh circular knife roller;

[0054] 411, first PI film; 412, first PI roller; 413, first release film; 414, first release roller; 421, second PI film; 422, second PI roller; 423, second release film; 424, second release roller; 431, third PI film; 432, third PI roller; 433, third release film; 434, third release roller;

[0055] 511, first protective film; 512, first protective roller; 513, first protective film tearing roller; 521, second protective film; 522, second protective roller; 523, second protective film tearing roller; 531, third protective film; 532, third protective roller; 533, third protective film tearing roller;

[0056] 61. First leveling roller; 62. Second leveling roller; 63. First heating roller; 64. Second heating roller; 65. Third heating roller.

[0057] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0058] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0059] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0060] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0061] Reference Figures 1 to 7 The present invention proposes a double-layer manufacturing process of an FDC flexible die-cut circuit board, comprising the following steps:

[0062] S1: processing the first copper foil layer 11: pasting a first recycling film 211 onto the first copper foil layer 11, performing a first circular knife cutting on the first copper foil layer 11, and tearing off the first recycling film 211 to recover waste generated by the first circular knife cutting;

[0063] S2: Pasting the first PI film 411: Pasting the first PI film 411 on one side of the first copper foil layer 11;

[0064] S3: Processing the second PI film 421: pasting the second recycling film 221 onto the second PI film 421, performing a second round knife cutting on the second PI film 421, tearing off the second recycling film 221 to recover the waste generated by the second round knife cutting, and pasting the second PI film 421 on the side of the first copper foil layer 11 away from the first PI film 411;

[0065] S4: Processing the second copper foil layer 12: Pasting the third recovery film 231 onto the second copper foil layer 12, performing a third round knife cutting on the second copper foil layer 12, tearing off the third recovery film 231 to recover the waste generated by the third round knife cutting, and pasting the second copper foil layer 12 to the side of the second PI film 421 away from the first copper foil layer 11;

[0066] S5: Processing the third PI film 431: Pasting the fourth recovery film 241 onto the third PI film 431, performing a fourth circular knife cutting on the third PI film 431, tearing off the fourth recovery film 241 to recover the waste generated by the fourth circular knife cutting, and pasting the third PI film 431 on the side of the second copper foil layer 12 away from the second PI film 421 to process it into a flexible circuit board.

[0067] In the double-layer manufacturing process of the FDC flexible die-cut circuit board in the technical solution of the present invention, the first copper foil layer 11, the second PI film 421, the second copper foil layer 12 and the third PI film 431 are cut by a circular knife, and then the waste generated after the circular knife cutting is recovered by the first recycling film 211, the second recycling film 221, the third recycling film 231 and the fourth recycling film 241. Compared with the chemical etching method in the prior art, the circular knife cutting method in the technical solution of the present application reduces the copper recovery cost, reduces the pollution to the environment, realizes the green environmental protection of the FDC preparation process, and also reduces the production cost. Among them, FDC is called Flexible Die-cutted Cable.

[0068] The present invention also provides a double-layer manufacturing device for FDC flexible die-cutting circuit boards, comprising:

[0069] frame;

[0070] A recovery membrane assembly, wherein the recovery membrane assembly comprises a first recovery membrane assembly 211, a second recovery membrane assembly 221, a third recovery membrane assembly 231 and a fourth recovery membrane assembly 241, all of which are installed on the frame;

[0071] PI film assembly, the PI film assembly comprising a first PI film 411 assembly, a second PI film 421 assembly and a third PI film 431 assembly, all of which are installed on the frame;

[0072] A circular knife assembly, comprising a first circular knife assembly, a second circular knife assembly, a third circular knife assembly and a fourth circular knife assembly, all of which are mounted on the frame; and

[0073] A film tearing assembly, the film tearing assembly comprising a first recycling film tearing assembly, a second recycling film tearing assembly, a third recycling film tearing assembly and a fourth recycling film tearing assembly, all of which are installed on the frame;

[0074] A transport component is used to transport the first copper foil layer 11 to the first recovery film 211 component, the first circular knife component, the first recovery film tearing component, the first PI film 411 component and the second PI film 421 component in sequence, and to transport the second copper foil layer 12 to the third recovery film 231 component, the third circular knife component, the third film tearing component and the second PI film 421 component in sequence.

[0075] The first film recovery 211 assembly includes a first recovery drive and a first recovery roller 212, the first film recovery tearing assembly includes a first recovery film tearing drive and a first recovery film tearing roller 213, the first recovery drive and the first recovery film tearing drive are both mounted on the frame, the first recovery roller 212 and the first recovery film tearing roller 213 are rotatably mounted on the frame, the output shaft of the first recovery drive is connected to the first recovery roller 212, the output shaft of the first recovery film tearing drive is connected to the first recovery film tearing roller 213, and the two ends of the first recovery film 211 are respectively wound around the first recovery roller 2 12 and the first recycling film tearing roller 213, and then the first recycling driving member drives the first recycling roller 212 to rotate, and the first recycling film tearing driving member drives the first recycling film tearing roller 213 to rotate, thereby driving the first recycling film 211 to be continuously adhered to the first copper foil layer 11, and then continuously torn off from the first copper foil layer 11, thereby realizing the first circular knife cutting waste recovery; of course, in other embodiments, only the first recycling film tearing recycling driving member can be provided, and the first recycling roller 212 can be driven to rotate by the first recycling film tearing recycling roller, that is, the first recycling driving member is not provided at this time.

[0076] Similarly, the second recycling film 221 assembly includes a second recycling drive member and a second recycling roller 222, the second recycling film tearing drive member includes a second recycling film tearing drive member and a second recycling film tearing roller 223, the two ends of the second recycling film 221 are respectively wound around the second recycling roller 222 and the second recycling film tearing roller 223, the second recycling roller 222 and the second recycling film tearing roller 223 rotate, thereby continuously sticking the second recycling film 221 to the second PI film 421, and then the second recycling film 221 is torn off after the second circular knife cutting of the second PI film 421, thereby recovering the waste generated by the second circular knife cutting.

[0077] The third recovery film 231 component includes a third recovery driving member and a third recovery roller 232, and the third recovery film tearing driving member includes a third recovery film tearing driving member and a third recovery film tearing roller 233. The two ends of the third recovery film 231 are respectively wound around the third recovery roller 232 and the third recovery film tearing roller 233. The third recovery roller 232 and the third recovery film tearing roller 233 rotate, thereby continuously sticking the third recovery film 231 to the second copper foil layer 12, and then the third recovery film 231 is torn off after the third circular knife cutting of the second copper foil layer 12, thereby recovering the waste generated by the third circular knife cutting.

[0078] The fourth recycling film 241 assembly includes a fourth recycling drive member and a fourth recycling roller 242, the fourth recycling film tearing drive member includes a fourth recycling film tearing drive member and a fourth recycling film tearing roller 243, the two ends of the fourth recycling film 241 are respectively wound around the fourth recycling roller 242 and the fourth recycling film tearing roller 243, the fourth recycling roller 242 and the fourth recycling film tearing roller 243 rotate, thereby continuously sticking the fourth recycling film 241 to the third PI film 431, and then tearing off the fourth recycling film 241 after the fourth circular knife cutting of the third PI film 431, thereby recovering the waste generated by the fourth circular knife cutting.

[0079] The first circular knife assembly includes a first circular knife driving member, a first circular knife roller 31 and a first circular knife, the second circular knife assembly includes a second circular knife driving member, a second circular knife roller 32 and a second circular knife, the third circular knife assembly includes a third circular knife driving member, a third circular knife roller 33 and a third circular knife, and the fourth circular knife assembly includes a fourth circular knife driving member, a fourth circular knife roller 34 and a fourth circular knife; the first circular knife driving member, the second circular knife driving member, the third circular knife driving member and the fourth circular knife driving member are all installed on the frame and connected to the corresponding first circular knife roller 31, the second circular knife roller 32, the third circular knife roller 33 and the third circular knife. The round knife roller 33 and the fourth round knife roller 34 are transmission connected, and the first round knife, the second round knife, the third round knife and the fourth round knife are respectively arranged on the outer circumferential surfaces of the first round knife roller 31, the second round knife roller 32, the third round knife roller 33 and the fourth round knife roller 34, wherein the first round knife is used to perform the first round knife cutting on the first copper foil layer 11, the second round knife is used to perform the second round knife cutting on the second PI film 421, the third round knife is used to perform the third round knife cutting on the second copper foil layer 12, and the fourth round knife is used to perform the fourth round knife cutting on the third PI film 431.

[0080] It should be noted that circular knife cutting can be used for cutting strips, digging holes, digging grooves, etc., and can be designed according to the production and processing requirements of FDC.

[0081] In one embodiment, the first PI film 411 component includes a first PI driving member, a first release roller 414 and a first PI roller 412, the first release film 413 is adhered to the first PI film 411, one end of the first PI film 411 is wound around the first PI roller 412, one end of the first release film 413 is adhered to the first PI film 411, and the other end of the first release film 413 is wound around the first release roller 414, and the first PI driving member drives the first release roller 414 and the first PI roller 412 to rotate, so that the first release film 413 is continuously detached from the first PI film 411, and the first PI film 411 is continuously adhered to the first copper foil layer 11.

[0082] Similarly, the second PI film 421 component includes a second PI driving member, a second release roller 424 and a second PI roller 422. The second release film 423 is adhered to the second PI film 421. The two ends of the second PI film 421 are wound around the second PI roller 422. The two ends of the second release film 423 are adhered to the second PI film 421. The other two ends of the second release film 423 are wound around the second release roller 424. The second PI driving member drives the second release roller 424 and the second PI roller 422 to rotate, so that the second release film 423 is continuously detached from the second PI film 421, and the second PI film 421 is continuously adhered to the first copper foil layer 11.

[0083] The third PI film 431 component includes a third PI driving component, a third release roller 434 and a third PI roller 432. The third release film 433 is adhered to the third PI film 431. The three ends of the third PI film 431 are wound around the third PI roller 432. The three ends of the third release film 433 are adhered to the third PI film 431. The other three ends of the third release film 433 are wound around the third release roller 434. The third PI driving component drives the third release roller 434 and the third PI roller 432 to rotate, so that the third release film 433 is continuously detached from the third PI film 431, and the third PI film 431 is continuously adhered to the second copper foil layer 12.

[0084] Further, the step S1 includes: S11 first protective film 511: pasting the first protective film 511 to one side of the first copper foil layer 11; S12 first round knife cutting: performing the first round knife cutting on the first copper foil layer 11; S13 pasting the first recovery film 211: pasting the first recovery film 211 to the side of the first copper foil layer 11 away from the first protective film 511; S14 first waste recovery: tearing off the first recovery film 211 to recover the waste generated by the first round knife cutting; the purpose of setting the first protective film 511 is to ensure that the non-waste area of ​​the first copper foil layer 11 can always be pasted to the predetermined position of the first protective film 511 during the transportation, round knife cutting or the first waste recovery process of the first copper foil layer 11, and will not be shifted, thereby improving the stability and reliability of the first copper foil layer 11 during the production process, and then improving the yield rate of FDC. Furthermore, the viscosity of the first recycling film 211 should be greater than or equal to the viscosity of the first protective film 511, because only in this way can the waste material stuck between the first recycling film 211 and the first protective film 511 be stuck on the first recycling film 211 for recycling when the first recycling film 211 is torn off.

[0085] Specifically, the step S4 includes: S41 pasting the third recycling film 231: pasting the third recycling film 231 to the side of the second copper foil layer 12 facing the second PI film 421; S42 third round knife cutting: performing a third round knife cutting on the second copper foil layer 12; S43 pasting the second protective film 521: pasting the second protective film 521 to the side of the second copper foil layer 12 away from the third recycling film 231: S44 third waste recovery: tearing off the third recycling film 231 to recover the waste generated by the third round knife cutting; S4 5 Paste the second copper foil layer 12: first paste the second copper foil layer 12 on the side of the second PI film 421 away from the first copper foil layer 11, and then tear off the second protective film 521; the purpose of setting the second protective film 521 is to ensure that the non-waste area of ​​the second copper foil layer 12 can always be pasted on the predetermined position of the second protective film 521 during transportation, circular knife cutting or the third waste recycling process, and will not shift, thereby improving the stability and reliability of the second copper foil layer 12 during production, and further improving the FDC yield rate. Furthermore, the viscosity of the third recycling film 231 should be greater than or equal to the viscosity of the second protective film 521, because only in this way can the waste between the third recycling film 231 and the second protective film 521 be pasted on the third recycling film 231 for recycling when the third recycling film 231 is torn off.

[0086] Specifically, the step S2 further includes: after the first PI film 411 is pasted on one side of the first copper foil layer 11, the first protective film 511 is torn off; the first protective film 511 is torn off at this time because the first PI film 411 is pasted on the side of the first copper foil layer 11 away from the first protective film 511, and the first PI film 411 can ensure that the non-waste area of ​​the first copper foil layer 11 is always pasted on the first PI film 411 to prevent displacement, so the first protective film 511 can be torn off; similarly. Similarly, the second protective film 521 is torn off for the same reason, which will not be elaborated in detail here.

[0087] Furthermore, the double-layer manufacturing equipment of the FDC flexible die-cut circuit board also includes a protective film assembly, the protective film assembly includes a first protective film 511 assembly and a second protective film 521 assembly, the first protective film 511 assembly includes at least one first protective driving member, a first protective film 511 roller and a first protective film tearing roller 513, the first protective driving member is transmission-connected to the first protective film 511 roller and / or the first protective film tearing roller 513, the two ends of the first protective film 511 are respectively wound around the first protective film 511 roller and the first protective film tearing roller 513, the first protective driving member drives the first protective film 511 roller and the first protective film tearing roller 513 to rotate, thereby driving the first protective film 511 to continuously adhere to the first copper foil layer 11, and continuously tear off from the first copper foil layer 11.

[0088] The second protective film 521 component includes at least one second protective driving member, a second protective film 521 roller and a second protective film tearing roller 523. The second protective driving member is transmission-connected to the second protective film 521 roller and / or the second protective film tearing roller 523. The two ends of the second protective film 521 are respectively wound around the second protective film 521 roller and the second protective film tearing roller 523. The second protective driving member drives the second protective film 521 roller and the second protective film tearing roller 523 to rotate, thereby driving the second protective film 521 to continuously adhere to the second copper foil layer 12 and continuously tear off from the second copper foil layer 12.

[0089] Furthermore, when the first copper foil layer 11 is cut with a circular knife for the first time, the area of ​​the first copper foil layer 11 being cut is large or small. If the waste area being cut is large, the copper foil in the waste area will have strong adhesion to both the first recovery film 211 and the first protective film 511, which will cause a large pull on the copper foil in the waste area when the first recovery film 211 is torn off, thereby causing a large deformation of the first copper foil layer 11, and then the production and processing of the first copper foil layer 11 and the first waste recycling; therefore, in one embodiment, the step S13 includes: firstly pasting the fifth recovery film 251 to one side of the first recovery film 211, performing a fifth circular knife cutting on the first recovery film 211, tearing off the fifth recovery film 251 to recover the waste generated by the fifth circular knife cutting, and then pasting the first recovery film 211 to the side of the first copper foil layer 11 away from the first protective film 511.

[0090] By setting the fifth round knife cutting of the first recycling film 211, the first recycling film 211 is cut first to avoid the large waste area on the first copper foil layer 11, so that no large pulling will be generated when the first recycling film 211 is torn off, thereby ensuring the stability of the first copper foil layer 11 during processing, thereby improving the FDC yield rate. It can be understood that after the first recycling film 211 is torn off, the copper foil in the large waste area is still adhered to the first protective film 511, and these copper wastes will be recycled together when the first protective film 511 is torn off in subsequent operations.

[0091] Furthermore, the circular knife assembly also includes a fifth circular knife assembly, the recycling film assembly also includes a fifth recycling film 251 assembly, the film tearing assembly also includes a fifth recycling film tearing assembly, the fifth circular knife assembly includes a fifth circular knife drive, a fifth circular knife roller 35 and a fifth circular knife, the fifth recycling film 251 assembly includes a fifth recycling drive and a fifth recycling roller 252, the fifth recycling film tearing assembly includes a fifth recycling film tearing drive and a fifth recycling film tearing roller 253, the fifth circular knife drive, the fifth recycling drive and the fifth recycling film tearing drive are all installed on the frame, and are respectively connected to the fifth circular knife roller 35, the fifth recycling roller 252 and the fifth recycling film tearing roller 253, the fifth circular knife is arranged on the outer peripheral surface of the fifth circular knife roller 35, and the fifth circular knife is used to perform a fifth circular knife cutting on the first recycling film 211. The two ends of the fifth recycling film 251 are respectively wound around the fifth recycling roller 252 and the fifth recycling film tearing roller 253, which rotate to drive the fifth recycling film 251 to continuously stick to the first recycling film 211, and after the first recycling film 211 is cut by the circular knife for the fifth time, the fifth recycling film 251 is continuously torn off to recover the waste generated by the fifth circular knife cutting.

[0092] Similarly, step 41 includes: pasting the sixth recycling film 261 to one side of the third recycling film 231, performing the sixth round knife cutting on the third recycling film 231, tearing off the sixth recycling film 261 to recover the waste generated by the sixth round knife cutting, and then pasting the third recycling film 231 to the side of the second copper foil layer 12 facing the second PI film 421. By setting the third recycling film 231 to perform the sixth round knife cutting, the third recycling film 231 is cut first to avoid the waste area with a large area on the second copper foil layer 12, so that when the third recycling film 231 is torn off, no large pulling will be generated, thereby ensuring the stability of the second copper foil layer 12 during processing, thereby improving the FDC yield rate. It can be understood that after the third recycling film 231 is torn off, the copper foil in the waste area with a large area is still adhered to the second protective film 521, and these copper wastes will be recovered together when the second protective film 521 is torn off in subsequent operations.

[0093] Furthermore, the circular knife assembly also includes a sixth circular knife assembly, the recycling film assembly also includes a sixth recycling film 261 assembly, the film tearing assembly also includes a sixth recycling film tearing assembly, the sixth circular knife assembly includes a sixth circular knife drive, a sixth circular knife roller 36 and a sixth circular knife, the sixth recycling film 261 assembly includes a sixth recycling drive and a sixth recycling roller 262, the sixth recycling film tearing assembly includes a sixth recycling film tearing drive and a sixth recycling film tearing roller 263, the sixth circular knife drive, the sixth recycling drive and the sixth recycling film tearing drive are all installed on the frame, and are respectively connected to the sixth circular knife roller 36, the sixth recycling roller 262 and the sixth recycling film tearing roller 263, the sixth circular knife is arranged on the outer peripheral surface of the sixth circular knife roller 36, and the sixth circular knife is used to perform a sixth circular knife cutting on the first recycling film 211. The two ends of the sixth recycling film 261 are respectively wound around the sixth recycling roller 262 and the sixth recycling film tearing roller 263, which rotate to drive the sixth recycling film 261 to continuously stick to the third recycling film 231, and after the third recycling film 231 is cut by the circular knife for the sixth time, the sixth recycling film 261 is continuously torn off to recover the waste generated by the sixth circular knife cutting.

[0094] It is understandable that when the first copper foil layer 11 is cut with a circular knife for the first time, there will be barbs at the cut, and these barbs may pierce or cut the second PI film 421, thereby reducing the yield rate of FDC; therefore, in one embodiment, the step S14 also includes: after tearing off the first recycling film 211, the first copper foil layer 11 is flattened by a flattening roller. By flattening the first copper foil layer 11, the barbs at the cut of the first copper foil layer 11 during the first circular knife cutting are flattened, thereby reducing the possibility of the barbs piercing or cutting the second PI film 421, thereby improving the yield rate of FDC. Of course, after the second copper foil layer 12 is cut with a circular knife for the third time, the second copper foil layer 12 can also be flattened, which will not be elaborated in detail here.

[0095] In one embodiment, the double-layer manufacturing equipment of the FDC flexible die-cut circuit board further includes a leveling drive and a leveling roller both mounted on the frame, the leveling drive is in driving connection with the leveling roller, and the leveling roller is used to level the first copper foil layer 11 and / or the second copper foil layer 12 after cutting. The leveling roller includes a first leveling roller 61 and a second leveling roller 62, and the first leveling roller 61 and the second leveling roller 62 respectively perform rolling processing on the first copper foil layer 11 and the second copper foil layer 12, thereby leveling the barbs at the cuts of the first copper foil layer 11 and the second copper foil layer 12, thereby improving the yield rate in the FDC production process.

[0096] In one embodiment, the step S2 further includes: when the first PI film 411 is pasted to the side of the first copper foil layer 11 away from the first protective film 511, the first PI film 411 is subjected to a heating treatment; and / or the step S3 further includes: when the processed second recycling film 221 and the second PI film 421 are pasted to the side of the first copper foil layer 11 away from the first PI film 411, the second PI film 421 is subjected to a heating treatment; and / or the step S5 further includes: when the processed third PI film 431 is pasted to the side of the second copper foil layer 12 away from the second PI film 421, the third PI film 431 is subjected to a heating treatment. Through the heating treatment, the bonding strength between the first PI film 411, the first copper foil layer 11, the second PI film 421, the second copper foil layer 12 and the third PI film 431 is increased, so that the bonding between them is more stable, thereby improving the quality of the FDC product.

[0097] In one embodiment, the double-layer manufacturing equipment of the FDC flexible die-cut circuit board further includes a first heating roller 63, a second heating roller 64 and a third heating roller 65, all of which are installed on the frame, wherein the first heating roller 63 is used to heat the first copper foil layer 11 and the first PI film 411, the second heating roller 64 is used to heat the first PI film 411, the first copper foil layer 11 and the second PI film 421, and the third heating roller 65 is used to heat the first PI film 411, the first copper foil layer 11, the second PI film 421, the second copper foil layer 12 and the third PI film 431. The first heating roller 63, the second heating roller 64 and the third heating roller 65 increase the bonding strength between the first PI film 411, the first copper foil layer 11, the second PI film 421, the second copper foil layer 12 and the third PI film 431, thereby improving the stability and reliability between the FDC.

[0098] In one embodiment, the step S2 also includes: a first release film 413 is also provided on the first PI film 411, the first release film 413 is first torn off, and then the first PI film 411 is pasted to the side of the first copper foil layer 11 away from the first protective film 511; and / or the step S3 also includes: a second release film 423 is also provided on the second PI film 421, the second release film 423 is first torn off, and then the processed second recycling film 221 and the second PI film 421 are pasted to the side of the first copper foil layer 11 away from the first PI film 411; the step S5 also includes: a third release film 433 is also provided on the third PI film 431, the third release film 433 is first torn off, and then the processed third PI film 431 is pasted to the side of the second copper foil layer 12 away from the second PI film 421. By providing the first release film 413, the second release film 423 and the third release film 433, the first PI film 411, the second PI film 421 and the third PI film 431 are protected, thereby improving the bonding strength between the first PI film 411, the first copper foil layer 11, the second PI film 421, the second copper foil layer 12 and the third PI film 431, thereby improving the stability and reliability of the FDC, and thereby improving the yield rate of the FDC.

[0099] Furthermore, when the first PI film 411 is pasted onto the first copper foil layer 11, the third protective film 531 is pasted away from the first PI film 411. The third protective film 531 mainly plays a role in protecting the first PI film 411, preventing the first PI film 411 from being scratched and worn during the processing, thereby improving the product quality and yield rate of FDC.

[0100] The protective film assembly also includes a third protective film 531 assembly, and the third protective film 531 assembly includes at least one third protective driving member, a third protective film 531 roller and a third protective film tearing roller 533. The third protective driving member is transmission-connected to the third protective film 531 roller and / or the third protective film tearing roller 533. The two ends of the third protective film 531 are respectively wound around the third protective film 531 roller and the third protective film tearing roller 533. The third protective driving member drives the third protective film 531 roller and the third protective film tearing roller 533 to rotate, thereby driving the third protective film 531 to continuously adhere to the side of the first PI film 411 away from the first copper foil layer 11, and continuously tear off from the first PI film 411.

[0101] Furthermore, the double-layer manufacturing process of the FDC flexible die-cut circuit board also includes step S6: seventh round knife cutting: performing the seventh round knife cutting on the flexible circuit board to cut the flexible circuit board into a plurality of small FDCs.

[0102] The circular knife assembly also includes a seventh circular knife assembly, which includes a seventh circular knife driving member, a seventh circular knife roller 37 and a seventh circular knife. The seventh circular knife driving member is installed on the frame, the seventh circular knife roller 37 is rotatably installed on the frame, and is transmission-connected to the seventh circular knife driving member. The seventh circular knife is arranged on the outer circumferential surface of the seventh circular knife roller 37, and the seventh circular knife driving member drives the seventh circular knife roller 37 to rotate, so that the seventh circular knife performs the seventh circular knife cutting on the flexible circuit board.

[0103] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A double-layer manufacturing process for FDC flexible die-cut circuit boards, characterized in that: The following steps are involved: S1: processing the first copper foil layer (11): pasting a first recovery film (211) onto the first copper foil layer (11), performing a first circular knife cutting on the first copper foil layer (11), and tearing off the first recovery film (211) to recover waste generated by the first circular knife cutting; S2: pasting the first PI film (411): pasting the first PI film (411) on one side of the first copper foil layer (11); S3: processing the second PI film (421): pasting the second recovery film (221) onto the second PI film (421), performing a second round knife cutting on the second PI film (421), tearing off the second recovery film (221) to recover waste generated by the second round knife cutting, and pasting the second PI film (421) on the side of the first copper foil layer (11) away from the first PI film (411); S4: processing the second copper foil layer (12): pasting a third recovery film (231) onto the second copper foil layer (12), performing a third round knife cutting on the second copper foil layer (12), tearing off the third recovery film (231) to recover waste generated by the third round knife cutting, and pasting the second copper foil layer (12) to the side of the second PI film (421) facing away from the first copper foil layer (11); S5: Processing the third PI film (431): pasting the fourth recycling film (241) onto the third PI film (431), performing a fourth circular knife cutting on the third PI film (431), tearing off the fourth recycling film (241) to recover waste generated by the fourth circular knife cutting, and pasting the third PI film (431) on the side of the second copper foil layer (12) away from the second PI film (421) to process it into a flexible circuit board.

2. The double-layer manufacturing process of the FDC flexible die-cut circuit board according to claim 1, characterized in that: The step S1 comprises: S11: first protective film (511): attaching a first protective film (511) to one side of the first copper foil layer (11); S12: first round knife cutting: performing a first round knife cutting on the first copper foil layer (11); S13 pasting a first recovery film (211): pasting the first recovery film (211) to a side of the first copper foil layer (11) away from the first protective film (511); S14: first waste recycling: tearing off the first recycling film (211) to recycle the waste generated by the first circular knife cutting; The step S2 further comprises: after pasting the first PI film (411) on one side of the first copper foil layer (11), tearing off the first protective film (511); The step S4 comprises: S41: pasting the third recycling film (231): pasting the third recycling film (231) to the side of the second copper foil layer (12) facing the second PI film (421); S42: performing a third round knife cutting on the second copper foil layer (12); S43 pasting the second protective film (521): pasting the second protective film (521) to the side of the second copper foil layer (12) away from the third recycling film (231): S44: third waste recovery: tearing off the third recovery film (231) to recover the waste generated by the third round knife cutting; S45: pasting the second copper foil layer (12): first pasting the second copper foil layer (12) on the side of the second PI film (421) facing away from the first copper foil layer (11), and then tearing off the second protective film (521).

3. The double-layer manufacturing process of the FDC flexible die-cut circuit board according to claim 2, characterized in that: The step S13 comprises: firstly pasting a fifth recycling film (251) to one side of the first recycling film (211), performing a fifth round knife cutting on the first recycling film (211), and tearing off the fifth recycling film (251) to recover waste generated by the fifth round knife cutting; and then pasting the first recycling film (211) to a side of the first copper foil layer (11) away from the first protective film (511); and / or The step 41 comprises: pasting a sixth recycling film (261) to one side of the third recycling film (231), performing a sixth round knife cutting on the third recycling film (231), tearing off the sixth recycling film (261) to recover waste generated by the sixth round knife cutting; and then pasting the third recycling film (231) to the side of the second copper foil layer (12) facing the second PI film (421).

4. The double-layer manufacturing process of the FDC flexible die-cut circuit board according to claim 2, characterized in that: The step S14 further comprises: after tearing off the first recycling film (211), leveling the first copper foil layer (11) by means of a leveling roller.

5. The double-layer manufacturing process of the FDC flexible die-cut circuit board according to claim 2, characterized in that: The step S2 further comprises: when the first PI film (411) is attached to the side of the first copper foil layer (11) away from the first protective film (511), heating the first PI film (411); and / or The step S3 further comprises: when the processed second recycling film (221) and the second PI film (421) are pasted on the side of the first copper foil layer (11) away from the first PI film (411), heating the second PI film (421); and / or The step S5 further comprises: when the processed third PI film (431) is pasted to the side of the second copper foil layer (12) away from the second PI film (421), heating the third PI film (431).

6. The double-layer manufacturing process of the FDC flexible die-cut circuit board according to claim 2, characterized in that: The step S2 further comprises: a first release film (413) is also provided on the first PI film (411), the first release film (413) is firstly torn off, and then the first PI film (411) is adhered to the side of the first copper foil layer (11) away from the first protective film (511); and / or The step S3 further comprises: a second release film (423) is also provided on the second PI film (421), the second release film (423) is firstly torn off, and then the processed second recycling film (221) and the second PI film (421) are adhered to the side of the first copper foil layer (11) away from the first PI film (411); The step S5 further comprises: a third release film (433) is also provided on the third PI film (431), the third release film (433) is firstly torn off, and then the processed third PI film (431) is adhered to the side of the second copper foil layer (12) facing away from the second PI film (421).

7. The double-layer manufacturing process of the FDC flexible die-cut circuit board according to claim 2, characterized in that: The step S2 further comprises: when the first PI film (411) is pasted to the side of the first copper foil layer (11) away from the first protective film (511), a third protective film (531) is pasted to the side away from the first PI film (411).

8. A double-layer manufacturing device for FDC flexible die-cutting circuit boards, characterized in that: include: frame; A recovery membrane assembly, the recovery membrane assembly comprising a first recovery membrane (211) assembly, a second recovery membrane (221) assembly, a third recovery membrane (231) assembly and a fourth recovery membrane (241) assembly, all of which are installed on the frame; A PI film assembly, wherein the PI film assembly comprises a first PI film (411) assembly, a second PI film (421) assembly, and a third PI film (431) assembly, all of which are installed on the frame; A circular knife assembly, comprising a first circular knife assembly, a second circular knife assembly, a third circular knife assembly and a fourth circular knife assembly, all of which are mounted on the frame; and A film tearing assembly, the film tearing assembly comprising a first recycling film tearing assembly, a second recycling film tearing assembly, a third recycling film tearing assembly and a fourth recycling film tearing assembly, all of which are installed on the frame; A transport component, wherein the transport component is used to transport the first copper foil layer (11) in sequence to the first recovery film (211) component, the first circular knife component, the first recovery film tearing component, the first PI film (411) component and the second PI film (421) component, and to transport the second copper foil layer (12) in sequence to the third recovery film (231) component, the third circular knife component, the third film tearing component and the second PI film (421) component.

9. The double-layer manufacturing equipment for FDC flexible die-cutting circuit boards according to claim 8, characterized in that: The double-layer manufacturing equipment for the FDC flexible die-cut circuit board also includes a flattening drive member and a flattening roller both mounted on the frame, the flattening drive member being in driving connection with the flattening roller, and the flattening roller being used for flattening the first copper foil layer (11) and / or the second copper foil layer (12) after cutting.

10. The double-layer manufacturing equipment for FDC flexible die-cutting circuit boards according to claim 8, characterized in that: The double-layer manufacturing equipment of the FDC flexible die-cut circuit board also includes a first heating roller (63), a second heating roller (64) and a third heating roller (65) all installed on the frame, the first heating roller (63) is used to heat the first copper foil layer (11) and the first PI film (411), the second heating roller (64) is used to heat the first PI film (411), the first copper foil layer (11) and the second PI film (421), and the third heating roller (65) is used to heat the first PI film (411), the first copper foil layer (11), the second PI film (421), the second copper foil layer (12) and the third PI film (431).

Images